JPWO2020196156A1 - - Google Patents

Info

Publication number
JPWO2020196156A1
JPWO2020196156A1 JP2021509254A JP2021509254A JPWO2020196156A1 JP WO2020196156 A1 JPWO2020196156 A1 JP WO2020196156A1 JP 2021509254 A JP2021509254 A JP 2021509254A JP 2021509254 A JP2021509254 A JP 2021509254A JP WO2020196156 A1 JPWO2020196156 A1 JP WO2020196156A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021509254A
Other languages
Japanese (ja)
Other versions
JP7413356B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020196156A1 publication Critical patent/JPWO2020196156A1/ja
Application granted granted Critical
Publication of JP7413356B2 publication Critical patent/JP7413356B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
JP2021509254A 2019-03-22 2020-03-18 フィルム状接着剤及び半導体加工用シート Active JP7413356B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019054995 2019-03-22
JP2019054995 2019-03-22
PCT/JP2020/011975 WO2020196156A1 (ja) 2019-03-22 2020-03-18 フィルム状接着剤及び半導体加工用シート

Publications (2)

Publication Number Publication Date
JPWO2020196156A1 true JPWO2020196156A1 (zh) 2020-10-01
JP7413356B2 JP7413356B2 (ja) 2024-01-15

Family

ID=72610160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509254A Active JP7413356B2 (ja) 2019-03-22 2020-03-18 フィルム状接着剤及び半導体加工用シート

Country Status (5)

Country Link
JP (1) JP7413356B2 (zh)
KR (1) KR20210143155A (zh)
CN (1) CN112930380B (zh)
TW (1) TWI845643B (zh)
WO (1) WO2020196156A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7387400B2 (ja) * 2019-11-15 2023-11-28 ヘンケルジャパン株式会社 Ｕｖ熱硬化型接着剤組成物

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004327623A (ja) * 2003-04-23 2004-11-18 Three M Innovative Properties Co 封止用フィルム接着剤、封止用フィルム積層体及び封止方法
JP2008231366A (ja) * 2007-03-23 2008-10-02 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2012167174A (ja) * 2011-02-14 2012-09-06 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
WO2015037631A1 (ja) * 2013-09-11 2015-03-19 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
WO2016121488A1 (ja) * 2015-01-30 2016-08-04 リンテック株式会社 半導体加工用粘着シート
JP2016216562A (ja) * 2015-05-18 2016-12-22 日東電工株式会社 接着フィルム、ダイシングテープ一体型接着フィルム、複層フィルム、半導体装置の製造方法および半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4174366B2 (ja) * 2003-04-23 2008-10-29 京セラ株式会社 発光素子収納用パッケージおよび発光装置
JP2012222002A (ja) 2011-04-04 2012-11-12 Nitto Denko Corp ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004327623A (ja) * 2003-04-23 2004-11-18 Three M Innovative Properties Co 封止用フィルム接着剤、封止用フィルム積層体及び封止方法
JP2008231366A (ja) * 2007-03-23 2008-10-02 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2012167174A (ja) * 2011-02-14 2012-09-06 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
WO2015037631A1 (ja) * 2013-09-11 2015-03-19 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
WO2016121488A1 (ja) * 2015-01-30 2016-08-04 リンテック株式会社 半導体加工用粘着シート
JP2016216562A (ja) * 2015-05-18 2016-12-22 日東電工株式会社 接着フィルム、ダイシングテープ一体型接着フィルム、複層フィルム、半導体装置の製造方法および半導体装置

Also Published As

Publication number Publication date
WO2020196156A1 (ja) 2020-10-01
TWI845643B (zh) 2024-06-21
CN112930380A (zh) 2021-06-08
CN112930380B (zh) 2022-10-28
KR20210143155A (ko) 2021-11-26
JP7413356B2 (ja) 2024-01-15
TW202100694A (zh) 2021-01-01

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