JPWO2020195932A1 - - Google Patents
Info
- Publication number
- JPWO2020195932A1 JPWO2020195932A1 JP2021509045A JP2021509045A JPWO2020195932A1 JP WO2020195932 A1 JPWO2020195932 A1 JP WO2020195932A1 JP 2021509045 A JP2021509045 A JP 2021509045A JP 2021509045 A JP2021509045 A JP 2021509045A JP WO2020195932 A1 JPWO2020195932 A1 JP WO2020195932A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019054441 | 2019-03-22 | ||
JP2019054441 | 2019-03-22 | ||
PCT/JP2020/011046 WO2020195932A1 (ja) | 2019-03-22 | 2020-03-13 | 仮固定基板、複合基板および電子部品の剥離方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020195932A1 true JPWO2020195932A1 (zh) | 2020-10-01 |
JP7430704B2 JP7430704B2 (ja) | 2024-02-13 |
Family
ID=72610531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021509045A Active JP7430704B2 (ja) | 2019-03-22 | 2020-03-13 | 仮固定基板、複合基板および電子部品の剥離方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7430704B2 (zh) |
CN (1) | CN113544819B (zh) |
TW (1) | TWI815002B (zh) |
WO (1) | WO2020195932A1 (zh) |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3769584B2 (ja) * | 2004-07-09 | 2006-04-26 | 積水化学工業株式会社 | 基材処理装置及び方法 |
JP2007251080A (ja) | 2006-03-20 | 2007-09-27 | Fujifilm Corp | プラスチック基板の固定方法、回路基板およびその製造方法 |
JP2009290206A (ja) * | 2008-05-01 | 2009-12-10 | Dainippon Printing Co Ltd | 露光装置用瞳フィルタ、回折光学素子及びそれを備えた露光装置 |
JP5304112B2 (ja) * | 2008-09-01 | 2013-10-02 | 日本電気硝子株式会社 | 薄膜付きガラス基板の製造方法 |
JP2012015150A (ja) * | 2010-06-29 | 2012-01-19 | Ushio Inc | レーザリフトオフ方法及びレーザリフトオフ装置 |
JP5869960B2 (ja) | 2012-05-28 | 2016-02-24 | 東京エレクトロン株式会社 | 接合システム、接合方法、プログラム及びコンピュータ記憶媒体 |
JPWO2013187410A1 (ja) * | 2012-06-13 | 2016-02-04 | 日本碍子株式会社 | 複合基板 |
JP6007688B2 (ja) * | 2012-09-11 | 2016-10-12 | 富士電機株式会社 | 半導体装置の製造方法 |
JP6190671B2 (ja) * | 2013-09-05 | 2017-08-30 | 古河電気工業株式会社 | ダイシング用粘着テープおよび半導体装置の製造方法 |
JP6196859B2 (ja) * | 2013-09-18 | 2017-09-13 | クアーズテック株式会社 | ウエハ搭載用部材 |
JP5781254B1 (ja) * | 2013-12-25 | 2015-09-16 | 日本碍子株式会社 | ハンドル基板、半導体用複合基板、半導体回路基板およびその製造方法 |
JP6216727B2 (ja) * | 2014-05-08 | 2017-10-18 | 東京応化工業株式会社 | 支持体分離方法 |
JP6425606B2 (ja) * | 2015-04-06 | 2018-11-21 | 株式会社ディスコ | ウエーハの生成方法 |
JP6450634B2 (ja) * | 2015-04-13 | 2019-01-09 | 株式会社ディスコ | テープ剥離装置 |
JP2017041391A (ja) * | 2015-08-21 | 2017-02-23 | 旭硝子株式会社 | 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法 |
JP6202696B2 (ja) * | 2016-08-30 | 2017-09-27 | 国立大学法人埼玉大学 | 単結晶基板製造方法 |
JP2018117060A (ja) * | 2017-01-19 | 2018-07-26 | 株式会社ブイ・テクノロジー | 剥離基板及びレーザリフトオフ方法 |
-
2020
- 2020-03-13 JP JP2021509045A patent/JP7430704B2/ja active Active
- 2020-03-13 CN CN202080019256.0A patent/CN113544819B/zh active Active
- 2020-03-13 WO PCT/JP2020/011046 patent/WO2020195932A1/ja active Application Filing
- 2020-03-17 TW TW109108738A patent/TWI815002B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2020195932A1 (ja) | 2020-10-01 |
JP7430704B2 (ja) | 2024-02-13 |
CN113544819B (zh) | 2024-01-05 |
TWI815002B (zh) | 2023-09-11 |
TW202103217A (zh) | 2021-01-16 |
CN113544819A (zh) | 2021-10-22 |
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