JPWO2020195808A1 - - Google Patents

Info

Publication number
JPWO2020195808A1
JPWO2020195808A1 JP2021508991A JP2021508991A JPWO2020195808A1 JP WO2020195808 A1 JPWO2020195808 A1 JP WO2020195808A1 JP 2021508991 A JP2021508991 A JP 2021508991A JP 2021508991 A JP2021508991 A JP 2021508991A JP WO2020195808 A1 JPWO2020195808 A1 JP WO2020195808A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021508991A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020195808A1 publication Critical patent/JPWO2020195808A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
JP2021508991A 2019-03-26 2020-03-11 Pending JPWO2020195808A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019058591 2019-03-26
PCT/JP2020/010413 WO2020195808A1 (en) 2019-03-26 2020-03-11 Semiconductor device production method and laminated body

Publications (1)

Publication Number Publication Date
JPWO2020195808A1 true JPWO2020195808A1 (en) 2020-10-01

Family

ID=72608689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021508991A Pending JPWO2020195808A1 (en) 2019-03-26 2020-03-11

Country Status (5)

Country Link
JP (1) JPWO2020195808A1 (en)
KR (1) KR20210142584A (en)
CN (1) CN113165121B (en)
TW (1) TW202101551A (en)
WO (1) WO2020195808A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7366435B2 (en) 2021-01-15 2023-10-23 古河電気工業株式会社 Adhesive tape for wafer grinding and wafer processing method

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH028014A (en) * 1988-06-28 1990-01-11 Toshiba Corp Breaking device of semiconductor substrate
JPH04252036A (en) * 1991-01-10 1992-09-08 Fujitsu Ltd Semiconductor device
KR19980063858A (en) * 1996-12-06 1998-10-07 윌리엄비.켐플러 Integrated circuit chip with high aspect ratio and manufacturing method thereof
JPH10242084A (en) * 1997-02-24 1998-09-11 Lintec Corp Wafer pasting adhesive sheet and manufacturing method of electronic components
JP2000061785A (en) * 1998-08-24 2000-02-29 Nitto Denko Corp Semiconductor wafer with protective sheet attached thereto and grinding method of semiconductor wafer
JP2004165570A (en) * 2002-11-15 2004-06-10 Nitto Denko Corp Method and device for removing protection tape from semiconductor wafer
JP2005175384A (en) * 2003-12-15 2005-06-30 Nitto Denko Corp Sticking method and peeling method of masking tape
JP4689972B2 (en) * 2004-05-26 2011-06-01 リンテック株式会社 Wafer processing apparatus and wafer processing method
JP2006100413A (en) * 2004-09-28 2006-04-13 Tokyo Seimitsu Co Ltd Film pasting method and film pasting device
US7662699B2 (en) * 2005-11-24 2010-02-16 Renesas Technology Corp. Method for fabricating semiconductor device
JP4791843B2 (en) * 2006-02-14 2011-10-12 株式会社ディスコ Method for manufacturing device with adhesive film
JP5196838B2 (en) * 2007-04-17 2013-05-15 リンテック株式会社 Manufacturing method of chip with adhesive
JP2009176977A (en) * 2008-01-25 2009-08-06 Seiko Epson Corp Semiconductor chip, and manufacturing method thereof
JP2009200140A (en) * 2008-02-20 2009-09-03 Disco Abrasive Syst Ltd Method of manufacturing semiconductor chip
US8043940B2 (en) * 2008-06-02 2011-10-25 Renesas Electronics Corporation Method for manufacturing semiconductor chip and semiconductor device
JP5158896B2 (en) * 2010-08-09 2013-03-06 古河電気工業株式会社 Manufacturing method of semiconductor chip
JP6033116B2 (en) * 2013-02-22 2016-11-30 株式会社ディスコ Laminated wafer processing method and adhesive sheet
WO2016189986A1 (en) * 2015-05-25 2016-12-01 リンテック株式会社 Semiconductor device manufacturing method
JP6614865B2 (en) * 2015-09-01 2019-12-04 リンテック株式会社 Sheet sticking device and sheet sticking method
JP6713212B2 (en) 2016-07-06 2020-06-24 株式会社ディスコ Method for manufacturing semiconductor device chip
JP6775880B2 (en) * 2016-09-21 2020-10-28 株式会社ディスコ Wafer processing method
JP2018133496A (en) * 2017-02-16 2018-08-23 パナソニックＩｐマネジメント株式会社 Method for manufacturing device chip

Also Published As

Publication number Publication date
CN113165121A (en) 2021-07-23
WO2020195808A1 (en) 2020-10-01
CN113165121B (en) 2023-12-05
TW202101551A (en) 2021-01-01
KR20210142584A (en) 2021-11-25

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