JPWO2020195018A1 - - Google Patents

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Publication number
JPWO2020195018A1
JPWO2020195018A1 JP2021508104A JP2021508104A JPWO2020195018A1 JP WO2020195018 A1 JPWO2020195018 A1 JP WO2020195018A1 JP 2021508104 A JP2021508104 A JP 2021508104A JP 2021508104 A JP2021508104 A JP 2021508104A JP WO2020195018 A1 JPWO2020195018 A1 JP WO2020195018A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021508104A
Other versions
JP7242832B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020195018A1 publication Critical patent/JPWO2020195018A1/ja
Application granted granted Critical
Publication of JP7242832B2 publication Critical patent/JP7242832B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H01G2/106—Fixing the capacitor in a housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2021508104A 2019-03-25 2020-01-11 電気素子収納用パッケージおよび電気装置 Active JP7242832B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019056842 2019-03-25
JP2019056842 2019-03-25
PCT/JP2020/000775 WO2020195018A1 (ja) 2019-03-25 2020-01-11 電気素子収納用パッケージおよび電気装置

Publications (2)

Publication Number Publication Date
JPWO2020195018A1 true JPWO2020195018A1 (ja) 2020-10-01
JP7242832B2 JP7242832B2 (ja) 2023-03-20

Family

ID=72609730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021508104A Active JP7242832B2 (ja) 2019-03-25 2020-01-11 電気素子収納用パッケージおよび電気装置

Country Status (5)

Country Link
US (1) US20240213108A1 (ja)
EP (1) EP3951850A4 (ja)
JP (1) JP7242832B2 (ja)
CN (1) CN113597670A (ja)
WO (1) WO2020195018A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009194725A (ja) * 2008-02-15 2009-08-27 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP2011222662A (ja) * 2010-04-07 2011-11-04 Mitsubishi Electric Corp セラミック多層基板の製造方法、及びセラミック多層基板
JP2013073994A (ja) * 2011-09-27 2013-04-22 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
JP2014175791A (ja) * 2013-03-07 2014-09-22 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP2017123408A (ja) * 2016-01-07 2017-07-13 日本特殊陶業株式会社 配線基板およびその製造方法
JP2017174944A (ja) * 2016-03-23 2017-09-28 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール
JP2019192825A (ja) * 2018-04-26 2019-10-31 京セラ株式会社 電子部品収納用パッケージ、電子装置、および電子モジュール

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5061987A (en) * 1990-01-09 1991-10-29 Northrop Corporation Silicon substrate multichip assembly
JP3423855B2 (ja) * 1996-04-26 2003-07-07 株式会社デンソー 電子部品搭載用構造体および電子部品の実装方法
JP5078441B2 (ja) * 2006-11-29 2012-11-21 京セラ株式会社 電子部品収納用パッケージ、複数個取り電子部品収納用パッケージ及び電子装置、並びにこれらの判別方法
JP5848174B2 (ja) * 2012-03-16 2016-01-27 京セラ株式会社 電子部品収納用セラミック基板およびそれを用いた電子部品実装パッケージ
CN104412381B (zh) * 2013-01-31 2018-01-09 京瓷株式会社 电子元件搭载用基板、电子装置以及摄像模块
US10453785B2 (en) * 2014-08-07 2019-10-22 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming double-sided fan-out wafer level package
JP6313235B2 (ja) * 2015-01-22 2018-04-18 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子部品収納用パッケージの製造方法
JP6556030B2 (ja) 2015-11-24 2019-08-07 京セラ株式会社 電子部品収納用基板およびそれを用いた電子部品実装パッケージ
US20190322572A1 (en) * 2016-11-18 2019-10-24 Samtec Inc. Filling materials and methods of filling through holes of a substrate

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009194725A (ja) * 2008-02-15 2009-08-27 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP2011222662A (ja) * 2010-04-07 2011-11-04 Mitsubishi Electric Corp セラミック多層基板の製造方法、及びセラミック多層基板
JP2013073994A (ja) * 2011-09-27 2013-04-22 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
JP2014175791A (ja) * 2013-03-07 2014-09-22 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP2017123408A (ja) * 2016-01-07 2017-07-13 日本特殊陶業株式会社 配線基板およびその製造方法
JP2017174944A (ja) * 2016-03-23 2017-09-28 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール
JP2019192825A (ja) * 2018-04-26 2019-10-31 京セラ株式会社 電子部品収納用パッケージ、電子装置、および電子モジュール

Also Published As

Publication number Publication date
EP3951850A4 (en) 2023-05-03
EP3951850A1 (en) 2022-02-09
CN113597670A (zh) 2021-11-02
US20240213108A1 (en) 2024-06-27
JP7242832B2 (ja) 2023-03-20
WO2020195018A1 (ja) 2020-10-01

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