JPWO2020159730A5 - - Google Patents
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- JPWO2020159730A5 JPWO2020159730A5 JP2021544540A JP2021544540A JPWO2020159730A5 JP WO2020159730 A5 JPWO2020159730 A5 JP WO2020159730A5 JP 2021544540 A JP2021544540 A JP 2021544540A JP 2021544540 A JP2021544540 A JP 2021544540A JP WO2020159730 A5 JPWO2020159730 A5 JP WO2020159730A5
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- window
- failure
- sensor data
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- components
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- 238000000034 method Methods 0.000 claims 18
- 238000005468 ion implantation Methods 0.000 claims 13
- 238000010801 machine learning Methods 0.000 claims 11
- 239000011159 matrix material Substances 0.000 claims 6
- 238000012935 Averaging Methods 0.000 claims 3
- 230000007423 decrease Effects 0.000 claims 3
- 239000007943 implant Substances 0.000 claims 2
- 230000015654 memory Effects 0.000 claims 2
- 230000004044 response Effects 0.000 claims 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 230000006403 short-term memory Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023030851A JP7472344B2 (ja) | 2019-01-31 | 2023-03-01 | イオン注入半導体製造ツールにおける構成要素の故障の是正 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/264,034 US11348813B2 (en) | 2019-01-31 | 2019-01-31 | Correcting component failures in ion implant semiconductor manufacturing tool |
| US16/264,034 | 2019-01-31 | ||
| PCT/US2020/014197 WO2020159730A1 (en) | 2019-01-31 | 2020-01-17 | Correcting component failures in ion implant semiconductor manufacturing tool |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023030851A Division JP7472344B2 (ja) | 2019-01-31 | 2023-03-01 | イオン注入半導体製造ツールにおける構成要素の故障の是正 |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2022523101A JP2022523101A (ja) | 2022-04-21 |
| JPWO2020159730A5 true JPWO2020159730A5 (https=) | 2022-08-04 |
| JP2022523101A5 JP2022523101A5 (https=) | 2022-08-04 |
| JP7238146B2 JP7238146B2 (ja) | 2023-03-13 |
Family
ID=71836669
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021544540A Active JP7238146B2 (ja) | 2019-01-31 | 2020-01-17 | イオン注入半導体製造ツールにおける構成要素の故障の是正 |
| JP2023030851A Active JP7472344B2 (ja) | 2019-01-31 | 2023-03-01 | イオン注入半導体製造ツールにおける構成要素の故障の是正 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023030851A Active JP7472344B2 (ja) | 2019-01-31 | 2023-03-01 | イオン注入半導体製造ツールにおける構成要素の故障の是正 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11348813B2 (https=) |
| JP (2) | JP7238146B2 (https=) |
| KR (2) | KR102539586B1 (https=) |
| CN (2) | CN113383282B (https=) |
| TW (2) | TWI797418B (https=) |
| WO (1) | WO2020159730A1 (https=) |
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| US20210133213A1 (en) * | 2019-10-31 | 2021-05-06 | Vettd, Inc. | Method and system for performing hierarchical classification of data |
| DE112020001944T5 (de) * | 2019-04-11 | 2022-01-13 | Aktiebolaget Skf | System und Verfahren zur automatischen Erkennung und Vorhersage von Maschinenausfällen mittels Online-Machine-Learning |
| US11226805B2 (en) * | 2019-07-31 | 2022-01-18 | Dell Products L.P. | Method and system for predicting upgrade completion times in hyper-converged infrastructure environments |
| JP7414589B2 (ja) * | 2020-03-04 | 2024-01-16 | 住友重機械イオンテクノロジー株式会社 | イオン注入装置およびモデル生成方法 |
| WO2022093271A1 (en) * | 2020-10-30 | 2022-05-05 | Hitachi Vantara Llc | Automated real-time detection, prediction and prevention of rare failures in industrial system with unlabeled sensor data |
| CN112560327B (zh) * | 2020-11-13 | 2024-03-12 | 盐城工学院 | 一种基于深度梯度下降森林的轴承剩余寿命预测方法 |
| WO2022117218A1 (en) * | 2020-12-02 | 2022-06-09 | Hitachi Energy Switzerland Ag | Prognosis of high voltage equipment |
| WO2022224693A1 (ja) * | 2021-04-19 | 2022-10-27 | パナソニック インテレクチュアル プロパティ コーポレーション オブ アメリカ | 製造方法、生成装置、推定装置、識別情報付与方法、及び付与装置 |
| EP4242904B1 (en) * | 2021-07-02 | 2026-04-01 | Comet AG | Method for machine learning a detection of at least one irregularity in a plasma system |
| US12506024B2 (en) * | 2021-07-08 | 2025-12-23 | Applied Materials, Inc. | Method and mechanism for contact-free process chamber characterization |
| US12247283B2 (en) * | 2021-07-09 | 2025-03-11 | Applied Materials, Inc. | Method and apparatus for controlled ion implantation |
| WO2023030807A1 (en) * | 2021-09-02 | 2023-03-09 | Asml Netherlands B.V. | Method of evaluating selected set of patterns |
| US20230113095A1 (en) * | 2021-10-13 | 2023-04-13 | Applied Materials, Inc. | Verification for improving quality of maintenance of manufacturing equipment |
| US12517479B2 (en) * | 2021-12-21 | 2026-01-06 | Applied Materials, Inc. | Manufacturing equipment parts quality management system |
| CN114492184A (zh) * | 2022-01-21 | 2022-05-13 | 北京科技大学 | 一种时频域分析航空发动机剩余使用寿命预测方法及装置 |
| US11892821B2 (en) * | 2022-03-15 | 2024-02-06 | Applied Materials, Inc. | Communication node to interface between evaluation systems and a manufacturing system |
| JP7564334B2 (ja) * | 2022-03-24 | 2024-10-08 | 株式会社日立ハイテク | 装置診断システム、装置診断装置、半導体装置製造システムおよび装置診断方法 |
| US12259719B2 (en) * | 2022-05-25 | 2025-03-25 | Applied Materials, Inc. | Methods and mechanisms for preventing fluctuation in machine-learning model performance |
| JP7759298B2 (ja) * | 2022-06-10 | 2025-10-23 | 株式会社日立製作所 | 施設運用支援装置、方法およびプログラム |
| US20240086597A1 (en) * | 2022-09-14 | 2024-03-14 | Applied Materials, Inc. | Generation and utilization of virtual features for process modeling |
| CN116046078A (zh) * | 2023-03-31 | 2023-05-02 | 东莞市楷德精密机械有限公司 | 一种半导体清洗设备的故障监测预警方法及系统 |
| US20240355592A1 (en) * | 2023-04-24 | 2024-10-24 | Applied Materials, Inc. | Uniform plasma processing with a linear plasma source |
| US11995401B1 (en) | 2023-04-30 | 2024-05-28 | The Strategic Coach Inc. | Systems and methods for identifying a name |
| WO2025064622A1 (en) * | 2023-09-19 | 2025-03-27 | Eli Lilly And Company | Downtime prediction for management of machines in manufacturing network |
| CN117421679B (zh) * | 2023-10-08 | 2024-06-18 | 宁波创基机械股份有限公司 | 一种注塑机周期管控方法、装置、电子设备及存储介质 |
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| JPH0613015A (ja) * | 1992-06-25 | 1994-01-21 | Nissin Electric Co Ltd | イオン注入装置 |
| JPH08153486A (ja) * | 1994-11-29 | 1996-06-11 | Nec Yamagata Ltd | イオン注入装置 |
| JP3265969B2 (ja) * | 1995-07-07 | 2002-03-18 | 日新電機株式会社 | イオン注入制御装置 |
| JPH1012180A (ja) * | 1996-06-17 | 1998-01-16 | Nissin Electric Co Ltd | イオン注入装置のファラディ |
| US6055460A (en) * | 1997-08-06 | 2000-04-25 | Advanced Micro Devices, Inc. | Semiconductor process compensation utilizing non-uniform ion implantation methodology |
| US6895293B2 (en) * | 2000-09-14 | 2005-05-17 | Applied Materials, Inc. | Fault detection and virtual sensor methods for tool fault monitoring |
| JP2003077907A (ja) * | 2001-08-31 | 2003-03-14 | Toshiba Corp | 生産装置の異常停止回避方法及び異常停止回避システム |
| US6960774B2 (en) * | 2003-11-03 | 2005-11-01 | Advanced Micro Devices, Inc. | Fault detection and control methodologies for ion implantation processes, and system for performing same |
| CA2882796A1 (en) * | 2007-05-16 | 2009-02-12 | Power Analytics Corporation | Real-time predictive systems for intelligent energy monitoring and management of electrical power networks |
| US8078552B2 (en) * | 2008-03-08 | 2011-12-13 | Tokyo Electron Limited | Autonomous adaptive system and method for improving semiconductor manufacturing quality |
| US7755066B2 (en) * | 2008-03-28 | 2010-07-13 | Varian Semiconductor Equipment Associates, Inc. | Techniques for improved uniformity tuning in an ion implanter system |
| US8501631B2 (en) * | 2009-11-19 | 2013-08-06 | Lam Research Corporation | Plasma processing system control based on RF voltage |
| KR101939288B1 (ko) * | 2014-02-12 | 2019-01-16 | 에이에스엠엘 네델란즈 비.브이. | 프로세스 윈도우를 최적화하는 방법 |
| JP6151227B2 (ja) * | 2014-08-25 | 2017-06-21 | 株式会社東芝 | 異常検知システム及び半導体デバイスの製造方法 |
| US9508529B2 (en) * | 2014-10-23 | 2016-11-29 | Lam Research Corporation | System, method and apparatus for RF power compensation in a plasma processing system |
| US10430719B2 (en) | 2014-11-25 | 2019-10-01 | Stream Mosaic, Inc. | Process control techniques for semiconductor manufacturing processes |
| US10984338B2 (en) * | 2015-05-28 | 2021-04-20 | Raytheon Technologies Corporation | Dynamically updated predictive modeling to predict operational outcomes of interest |
| CN105353702B (zh) * | 2015-11-17 | 2020-12-04 | 国家电网公司 | 高压设备智能监控系统 |
| FR3046265B1 (fr) * | 2015-12-29 | 2018-08-10 | Thales | Systeme de surveillance d'une installation industrielle ; procedes de configuration et de surveillance associes |
| US20170364818A1 (en) * | 2016-06-17 | 2017-12-21 | Business Objects Software Ltd. | Automatic condition monitoring and anomaly detection for predictive maintenance |
| US10490116B2 (en) * | 2016-07-06 | 2019-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, memory device, and display system |
| KR101744194B1 (ko) | 2016-08-19 | 2017-06-09 | 인하대학교 산학협력단 | 반도체 fab 제조공정에서 유클리드 거리를 활용한 웨이퍼 자동 불량 검사 분류 예측 장치 및 방법 |
| US11003518B2 (en) * | 2016-09-29 | 2021-05-11 | Hewlett-Packard Development Company, L.P. | Component failure prediction |
| CN106354123A (zh) * | 2016-11-01 | 2017-01-25 | 武汉理工大学 | 基于物联网的大型机械设备故障自动检测系统 |
| JP6896432B2 (ja) * | 2017-01-11 | 2021-06-30 | 株式会社Ye Digital | 故障予知方法、故障予知装置および故障予知プログラム |
| TWI632441B (zh) | 2017-01-20 | 2018-08-11 | 財團法人工業技術研究院 | 機台的預診斷方法及預診斷裝置 |
| JP6860406B2 (ja) * | 2017-04-05 | 2021-04-14 | 株式会社荏原製作所 | 半導体製造装置、半導体製造装置の故障予知方法、および半導体製造装置の故障予知プログラム |
| CN107024267A (zh) * | 2017-04-12 | 2017-08-08 | 无锡研测技术有限公司 | 基于径向基神经网络的称重设备传感器故障检测方法 |
| CN107238507B (zh) * | 2017-06-20 | 2019-12-31 | 佛山市南海区广工大数控装备协同创新研究院 | 一种基于深度学习的工业设备故障预测方法 |
| CN108304941A (zh) * | 2017-12-18 | 2018-07-20 | 中国软件与技术服务股份有限公司 | 一种基于机器学习的故障预测方法 |
| CN108829933B (zh) * | 2018-05-22 | 2023-04-07 | 北京天泽智云科技有限公司 | 一种半导体制造设备的预测性维护与健康管理的方法 |
| CN109102189B (zh) * | 2018-08-10 | 2022-02-11 | 杨璇 | 一种电气设备健康管理系统和方法 |
| JP7233201B2 (ja) | 2018-11-20 | 2023-03-06 | 東京エレクトロン株式会社 | 搬送ユニットの監視方法及び監視装置並びに監視用モデル |
-
2019
- 2019-01-31 US US16/264,034 patent/US11348813B2/en active Active
-
2020
- 2020-01-17 JP JP2021544540A patent/JP7238146B2/ja active Active
- 2020-01-17 KR KR1020217027568A patent/KR102539586B1/ko active Active
- 2020-01-17 CN CN202080012043.5A patent/CN113383282B/zh active Active
- 2020-01-17 CN CN202411344601.4A patent/CN119398192B/zh active Active
- 2020-01-17 WO PCT/US2020/014197 patent/WO2020159730A1/en not_active Ceased
- 2020-01-17 KR KR1020237018033A patent/KR102731064B1/ko active Active
- 2020-01-31 TW TW109102990A patent/TWI797418B/zh active
- 2020-01-31 TW TW112108684A patent/TWI851071B/zh active
-
2022
- 2022-05-27 US US17/827,408 patent/US11862493B2/en active Active
-
2023
- 2023-03-01 JP JP2023030851A patent/JP7472344B2/ja active Active
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