TWI797418B - 用於校正離子注入半導體製造工具中的部件故障的方法及系統 - Google Patents

用於校正離子注入半導體製造工具中的部件故障的方法及系統 Download PDF

Info

Publication number
TWI797418B
TWI797418B TW109102990A TW109102990A TWI797418B TW I797418 B TWI797418 B TW I797418B TW 109102990 A TW109102990 A TW 109102990A TW 109102990 A TW109102990 A TW 109102990A TW I797418 B TWI797418 B TW I797418B
Authority
TW
Taiwan
Prior art keywords
window
failure
sensor data
components
additional features
Prior art date
Application number
TW109102990A
Other languages
English (en)
Chinese (zh)
Other versions
TW202044314A (zh
Inventor
田青 廖
席瑪 迪達瑞
哈瑞克瑞席南 拉札高帕
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW202044314A publication Critical patent/TW202044314A/zh
Application granted granted Critical
Publication of TWI797418B publication Critical patent/TWI797418B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0471—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
    • G05B23/024—Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0243—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
    • G05B23/0254—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model based on a quantitative model, e.g. mathematical relationships between inputs and outputs; functions: observer, Kalman filter, residual calculation, Neural Networks
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0283—Predictive maintenance, e.g. involving the monitoring of a system and, based on the monitoring results, taking decisions on the maintenance schedule of the monitored system; Estimating remaining useful life [RUL]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/243—Classification techniques relating to the number of classes
    • G06F18/2433—Single-class perspective, e.g. one-against-all classification; Novelty detection; Outlier detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/044—Recurrent networks, e.g. Hopfield networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/044—Recurrent networks, e.g. Hopfield networks
    • G06N3/0442—Recurrent networks, e.g. Hopfield networks characterised by memory or gating, e.g. long short-term memory [LSTM] or gated recurrent units [GRU]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/0464—Convolutional networks [CNN, ConvNet]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/084—Backpropagation, e.g. using gradient descent
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/0985—Hyperparameter optimisation; Meta-learning; Learning-to-learn
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G06F16/20—Information retrieval; Database structures therefor; File system structures therefor of structured data, e.g. relational data
    • G06F16/28—Databases characterised by their database models, e.g. relational or object models
    • G06F16/284—Relational databases
    • G06F16/285—Clustering or classification
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G06N20/20—Ensemble learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/048—Activation functions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N5/00—Computing arrangements using knowledge-based models
    • G06N5/01—Dynamic search techniques; Heuristics; Dynamic trees; Branch-and-bound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/304—Controlling tubes
    • H01J2237/30405—Details
    • H01J2237/30427—Details using neural networks or fuzzy logic

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Artificial Intelligence (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Computational Linguistics (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Medical Informatics (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Physical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW109102990A 2019-01-31 2020-01-31 用於校正離子注入半導體製造工具中的部件故障的方法及系統 TWI797418B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/264,034 US11348813B2 (en) 2019-01-31 2019-01-31 Correcting component failures in ion implant semiconductor manufacturing tool
US16/264,034 2019-01-31

Publications (2)

Publication Number Publication Date
TW202044314A TW202044314A (zh) 2020-12-01
TWI797418B true TWI797418B (zh) 2023-04-01

Family

ID=71836669

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109102990A TWI797418B (zh) 2019-01-31 2020-01-31 用於校正離子注入半導體製造工具中的部件故障的方法及系統
TW112108684A TWI851071B (zh) 2019-01-31 2020-01-31 用於校正離子注入半導體製造工具中的部件故障的方法及系統

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW112108684A TWI851071B (zh) 2019-01-31 2020-01-31 用於校正離子注入半導體製造工具中的部件故障的方法及系統

Country Status (6)

Country Link
US (2) US11348813B2 (https=)
JP (2) JP7238146B2 (https=)
KR (2) KR102539586B1 (https=)
CN (2) CN113383282B (https=)
TW (2) TWI797418B (https=)
WO (1) WO2020159730A1 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210133213A1 (en) * 2019-10-31 2021-05-06 Vettd, Inc. Method and system for performing hierarchical classification of data
DE112020001944T5 (de) * 2019-04-11 2022-01-13 Aktiebolaget Skf System und Verfahren zur automatischen Erkennung und Vorhersage von Maschinenausfällen mittels Online-Machine-Learning
US11226805B2 (en) * 2019-07-31 2022-01-18 Dell Products L.P. Method and system for predicting upgrade completion times in hyper-converged infrastructure environments
JP7414589B2 (ja) * 2020-03-04 2024-01-16 住友重機械イオンテクノロジー株式会社 イオン注入装置およびモデル生成方法
WO2022093271A1 (en) * 2020-10-30 2022-05-05 Hitachi Vantara Llc Automated real-time detection, prediction and prevention of rare failures in industrial system with unlabeled sensor data
CN112560327B (zh) * 2020-11-13 2024-03-12 盐城工学院 一种基于深度梯度下降森林的轴承剩余寿命预测方法
WO2022117218A1 (en) * 2020-12-02 2022-06-09 Hitachi Energy Switzerland Ag Prognosis of high voltage equipment
WO2022224693A1 (ja) * 2021-04-19 2022-10-27 パナソニック インテレクチュアル プロパティ コーポレーション オブ アメリカ 製造方法、生成装置、推定装置、識別情報付与方法、及び付与装置
EP4242904B1 (en) * 2021-07-02 2026-04-01 Comet AG Method for machine learning a detection of at least one irregularity in a plasma system
US12506024B2 (en) * 2021-07-08 2025-12-23 Applied Materials, Inc. Method and mechanism for contact-free process chamber characterization
US12247283B2 (en) * 2021-07-09 2025-03-11 Applied Materials, Inc. Method and apparatus for controlled ion implantation
WO2023030807A1 (en) * 2021-09-02 2023-03-09 Asml Netherlands B.V. Method of evaluating selected set of patterns
US20230113095A1 (en) * 2021-10-13 2023-04-13 Applied Materials, Inc. Verification for improving quality of maintenance of manufacturing equipment
US12517479B2 (en) * 2021-12-21 2026-01-06 Applied Materials, Inc. Manufacturing equipment parts quality management system
CN114492184A (zh) * 2022-01-21 2022-05-13 北京科技大学 一种时频域分析航空发动机剩余使用寿命预测方法及装置
US11892821B2 (en) * 2022-03-15 2024-02-06 Applied Materials, Inc. Communication node to interface between evaluation systems and a manufacturing system
JP7564334B2 (ja) * 2022-03-24 2024-10-08 株式会社日立ハイテク 装置診断システム、装置診断装置、半導体装置製造システムおよび装置診断方法
US12259719B2 (en) * 2022-05-25 2025-03-25 Applied Materials, Inc. Methods and mechanisms for preventing fluctuation in machine-learning model performance
JP7759298B2 (ja) * 2022-06-10 2025-10-23 株式会社日立製作所 施設運用支援装置、方法およびプログラム
US20240086597A1 (en) * 2022-09-14 2024-03-14 Applied Materials, Inc. Generation and utilization of virtual features for process modeling
CN116046078A (zh) * 2023-03-31 2023-05-02 东莞市楷德精密机械有限公司 一种半导体清洗设备的故障监测预警方法及系统
US20240355592A1 (en) * 2023-04-24 2024-10-24 Applied Materials, Inc. Uniform plasma processing with a linear plasma source
US11995401B1 (en) 2023-04-30 2024-05-28 The Strategic Coach Inc. Systems and methods for identifying a name
WO2025064622A1 (en) * 2023-09-19 2025-03-27 Eli Lilly And Company Downtime prediction for management of machines in manufacturing network
CN117421679B (zh) * 2023-10-08 2024-06-18 宁波创基机械股份有限公司 一种注塑机周期管控方法、装置、电子设备及存储介质

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170364818A1 (en) * 2016-06-17 2017-12-21 Business Objects Software Ltd. Automatic condition monitoring and anomaly detection for predictive maintenance
TW201804471A (zh) * 2016-07-06 2018-02-01 半導體能源研究所股份有限公司 半導體裝置、記憶體裝置及顯示系統
US20180294174A1 (en) * 2017-04-05 2018-10-11 Ebara Corporation Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus
CN109283800A (zh) * 2014-02-12 2019-01-29 Asml荷兰有限公司 过程窗口的优化方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613015A (ja) * 1992-06-25 1994-01-21 Nissin Electric Co Ltd イオン注入装置
JPH08153486A (ja) * 1994-11-29 1996-06-11 Nec Yamagata Ltd イオン注入装置
JP3265969B2 (ja) * 1995-07-07 2002-03-18 日新電機株式会社 イオン注入制御装置
JPH1012180A (ja) * 1996-06-17 1998-01-16 Nissin Electric Co Ltd イオン注入装置のファラディ
US6055460A (en) * 1997-08-06 2000-04-25 Advanced Micro Devices, Inc. Semiconductor process compensation utilizing non-uniform ion implantation methodology
US6895293B2 (en) * 2000-09-14 2005-05-17 Applied Materials, Inc. Fault detection and virtual sensor methods for tool fault monitoring
JP2003077907A (ja) * 2001-08-31 2003-03-14 Toshiba Corp 生産装置の異常停止回避方法及び異常停止回避システム
US6960774B2 (en) * 2003-11-03 2005-11-01 Advanced Micro Devices, Inc. Fault detection and control methodologies for ion implantation processes, and system for performing same
CA2882796A1 (en) * 2007-05-16 2009-02-12 Power Analytics Corporation Real-time predictive systems for intelligent energy monitoring and management of electrical power networks
US8078552B2 (en) * 2008-03-08 2011-12-13 Tokyo Electron Limited Autonomous adaptive system and method for improving semiconductor manufacturing quality
US7755066B2 (en) * 2008-03-28 2010-07-13 Varian Semiconductor Equipment Associates, Inc. Techniques for improved uniformity tuning in an ion implanter system
US8501631B2 (en) * 2009-11-19 2013-08-06 Lam Research Corporation Plasma processing system control based on RF voltage
JP6151227B2 (ja) * 2014-08-25 2017-06-21 株式会社東芝 異常検知システム及び半導体デバイスの製造方法
US9508529B2 (en) * 2014-10-23 2016-11-29 Lam Research Corporation System, method and apparatus for RF power compensation in a plasma processing system
US10430719B2 (en) 2014-11-25 2019-10-01 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
US10984338B2 (en) * 2015-05-28 2021-04-20 Raytheon Technologies Corporation Dynamically updated predictive modeling to predict operational outcomes of interest
CN105353702B (zh) * 2015-11-17 2020-12-04 国家电网公司 高压设备智能监控系统
FR3046265B1 (fr) * 2015-12-29 2018-08-10 Thales Systeme de surveillance d'une installation industrielle ; procedes de configuration et de surveillance associes
KR101744194B1 (ko) 2016-08-19 2017-06-09 인하대학교 산학협력단 반도체 fab 제조공정에서 유클리드 거리를 활용한 웨이퍼 자동 불량 검사 분류 예측 장치 및 방법
US11003518B2 (en) * 2016-09-29 2021-05-11 Hewlett-Packard Development Company, L.P. Component failure prediction
CN106354123A (zh) * 2016-11-01 2017-01-25 武汉理工大学 基于物联网的大型机械设备故障自动检测系统
JP6896432B2 (ja) * 2017-01-11 2021-06-30 株式会社Ｙｅ Ｄｉｇｉｔａｌ 故障予知方法、故障予知装置および故障予知プログラム
TWI632441B (zh) 2017-01-20 2018-08-11 財團法人工業技術研究院 機台的預診斷方法及預診斷裝置
CN107024267A (zh) * 2017-04-12 2017-08-08 无锡研测技术有限公司 基于径向基神经网络的称重设备传感器故障检测方法
CN107238507B (zh) * 2017-06-20 2019-12-31 佛山市南海区广工大数控装备协同创新研究院 一种基于深度学习的工业设备故障预测方法
CN108304941A (zh) * 2017-12-18 2018-07-20 中国软件与技术服务股份有限公司 一种基于机器学习的故障预测方法
CN108829933B (zh) * 2018-05-22 2023-04-07 北京天泽智云科技有限公司 一种半导体制造设备的预测性维护与健康管理的方法
CN109102189B (zh) * 2018-08-10 2022-02-11 杨璇 一种电气设备健康管理系统和方法
JP7233201B2 (ja) 2018-11-20 2023-03-06 東京エレクトロン株式会社 搬送ユニットの監視方法及び監視装置並びに監視用モデル

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109283800A (zh) * 2014-02-12 2019-01-29 Asml荷兰有限公司 过程窗口的优化方法
US20170364818A1 (en) * 2016-06-17 2017-12-21 Business Objects Software Ltd. Automatic condition monitoring and anomaly detection for predictive maintenance
TW201804471A (zh) * 2016-07-06 2018-02-01 半導體能源研究所股份有限公司 半導體裝置、記憶體裝置及顯示系統
US20180294174A1 (en) * 2017-04-05 2018-10-11 Ebara Corporation Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus
JP2018178157A (ja) * 2017-04-05 2018-11-15 株式会社荏原製作所 半導体製造装置、半導体製造装置の故障予知方法、および半導体製造装置の故障予知プログラム

Also Published As

Publication number Publication date
US20220301903A1 (en) 2022-09-22
US11862493B2 (en) 2024-01-02
JP2023085255A (ja) 2023-06-20
CN113383282B (zh) 2024-10-18
TW202329188A (zh) 2023-07-16
JP7472344B2 (ja) 2024-04-22
KR20210109673A (ko) 2021-09-06
KR102731064B1 (ko) 2024-11-14
KR102539586B1 (ko) 2023-06-01
CN113383282A (zh) 2021-09-10
KR20230084317A (ko) 2023-06-12
JP2022523101A (ja) 2022-04-21
CN119398192B (zh) 2025-12-12
US11348813B2 (en) 2022-05-31
CN119398192A (zh) 2025-02-07
TWI851071B (zh) 2024-08-01
WO2020159730A1 (en) 2020-08-06
JP7238146B2 (ja) 2023-03-13
US20200251360A1 (en) 2020-08-06
TW202044314A (zh) 2020-12-01

Similar Documents

Publication Publication Date Title
TWI797418B (zh) 用於校正離子注入半導體製造工具中的部件故障的方法及系統
US20240403642A1 (en) Long short-term memory anomaly detection for multi-sensor equipment monitoring
US12147212B2 (en) Diagnostic methods for substrate manufacturing chambers using physics-based models
JP7668420B2 (ja) 製造機器の保守の質を向上させるための検証
US12579444B2 (en) Machine learning model generation and updating for manufacturing equipment
TW202349275A (zh) 與處理裝備相關聯的合成時間序列資料
TW202309791A (zh) 晶圓上的降維
CN118511264A (zh) 处理腔室校准
TW202424831A (zh) 在使用機器學習的製造系統處的裝備參數管理
TWI917732B (zh) 用於使用物理為基模型的基板製造腔室的診斷方法及非暫時性電腦可讀儲存媒體
US20250155883A1 (en) Process modeling platform for substrate manufacturing systems