JPWO2020151932A5 - - Google Patents

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Publication number
JPWO2020151932A5
JPWO2020151932A5 JP2021542331A JP2021542331A JPWO2020151932A5 JP WO2020151932 A5 JPWO2020151932 A5 JP WO2020151932A5 JP 2021542331 A JP2021542331 A JP 2021542331A JP 2021542331 A JP2021542331 A JP 2021542331A JP WO2020151932 A5 JPWO2020151932 A5 JP WO2020151932A5
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JP
Japan
Prior art keywords
heating elements
array
luminescent
light
light emitting
Prior art date
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Granted
Application number
JP2021542331A
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English (en)
Japanese (ja)
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JP2022518490A (ja
JP7545392B2 (ja
Publication date
Priority claimed from GBGB1900912.5A external-priority patent/GB201900912D0/en
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Publication of JP2022518490A publication Critical patent/JP2022518490A/ja
Publication of JPWO2020151932A5 publication Critical patent/JPWO2020151932A5/ja
Application granted granted Critical
Publication of JP7545392B2 publication Critical patent/JP7545392B2/ja
Active legal-status Critical Current
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JP2021542331A 2019-01-23 2020-01-03 ウエハを処理するための装置およびかかる装置を制御する方法 Active JP7545392B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1900912.5A GB201900912D0 (en) 2019-01-23 2019-01-23 Apparatus for processing a wafer, and method of controlling such an apparatus
GB1900912.5 2019-01-23
PCT/EP2020/050076 WO2020151932A1 (en) 2019-01-23 2020-01-03 Apparatus for processing a wafer, and method of controlling such an apparatus

Publications (3)

Publication Number Publication Date
JP2022518490A JP2022518490A (ja) 2022-03-15
JPWO2020151932A5 true JPWO2020151932A5 (zh) 2023-01-11
JP7545392B2 JP7545392B2 (ja) 2024-09-04

Family

ID=65655937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021542331A Active JP7545392B2 (ja) 2019-01-23 2020-01-03 ウエハを処理するための装置およびかかる装置を制御する方法

Country Status (8)

Country Link
US (1) US12217980B2 (zh)
EP (1) EP3915141A1 (zh)
JP (1) JP7545392B2 (zh)
KR (1) KR20210112387A (zh)
CN (1) CN113330546A (zh)
GB (1) GB201900912D0 (zh)
TW (1) TWI835975B (zh)
WO (1) WO2020151932A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210103956A (ko) * 2020-02-13 2021-08-24 에이에스엠 아이피 홀딩 비.브이. 수광 장치를 포함하는 기판 처리 장치 및 수광 장치의 교정 방법
KR102406087B1 (ko) * 2020-03-23 2022-06-10 엘에스이 주식회사 회전 척에 내장된 광원을 이용한 기판 처리 장치

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03259511A (ja) 1990-03-09 1991-11-19 Nec Yamagata Ltd 半導体製造用フォトレジスト現像装置
US6479801B1 (en) * 1999-10-22 2002-11-12 Tokyo Electron Limited Temperature measuring method, temperature control method and processing apparatus
US6970644B2 (en) * 2000-12-21 2005-11-29 Mattson Technology, Inc. Heating configuration for use in thermal processing chambers
US7734439B2 (en) * 2002-06-24 2010-06-08 Mattson Technology, Inc. System and process for calibrating pyrometers in thermal processing chambers
US7543981B2 (en) 2006-06-29 2009-06-09 Mattson Technology, Inc. Methods for determining wafer temperature
US8404499B2 (en) * 2009-04-20 2013-03-26 Applied Materials, Inc. LED substrate processing
JP5606852B2 (ja) 2010-09-27 2014-10-15 大日本スクリーン製造株式会社 熱処理装置および熱処理方法
JP5964626B2 (ja) 2012-03-22 2016-08-03 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
CN105144355B (zh) * 2013-05-01 2018-02-06 应用材料公司 用于在晶片处理系统内进行低温测量的设备与方法
KR102317055B1 (ko) 2013-09-30 2021-10-26 어플라이드 머티어리얼스, 인코포레이티드 캡슐화된 광 배리어를 갖는 지지체 링
JP2016054242A (ja) 2014-09-04 2016-04-14 東京エレクトロン株式会社 熱処理方法及び熱処理装置
KR102233925B1 (ko) * 2014-11-20 2021-03-30 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
US20170316963A1 (en) 2016-04-28 2017-11-02 Applied Materials, Inc. Direct optical heating of substrates
US10720343B2 (en) 2016-05-31 2020-07-21 Lam Research Ag Method and apparatus for processing wafer-shaped articles
JP6984228B2 (ja) 2016-11-17 2021-12-17 東京エレクトロン株式会社 露光装置、露光装置の調整方法及び記憶媒体
US20180337069A1 (en) 2017-05-17 2018-11-22 Lam Research Ag Systems and methods for detecting undesirable dynamic behavior of liquid dispensed onto a rotating substrate

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