JPWO2020129171A1 - - Google Patents

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Publication number
JPWO2020129171A1
JPWO2020129171A1 JP2020560693A JP2020560693A JPWO2020129171A1 JP WO2020129171 A1 JPWO2020129171 A1 JP WO2020129171A1 JP 2020560693 A JP2020560693 A JP 2020560693A JP 2020560693 A JP2020560693 A JP 2020560693A JP WO2020129171 A1 JPWO2020129171 A1 JP WO2020129171A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020560693A
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JP7207424B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2020129171A1 publication Critical patent/JPWO2020129171A1/ja
Application granted granted Critical
Publication of JP7207424B2 publication Critical patent/JP7207424B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38—Impedance-matching networks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09636—Details of adjacent, not connected vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2020560693A 2018-12-19 2018-12-19 基板及び電子機器 Active JP7207424B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/046726 WO2020129171A1 (ja) 2018-12-19 2018-12-19 基板及び電子機器

Publications (2)

Publication Number Publication Date
JPWO2020129171A1 true JPWO2020129171A1 (ja) 2020-06-25
JP7207424B2 JP7207424B2 (ja) 2023-01-18

Family

ID=71101130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020560693A Active JP7207424B2 (ja) 2018-12-19 2018-12-19 基板及び電子機器

Country Status (5)

Country Link
US (1) US20220015221A1 (ja)
EP (1) EP3914052A4 (ja)
JP (1) JP7207424B2 (ja)
CN (1) CN113170577A (ja)
WO (1) WO2020129171A1 (ja)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040118605A1 (en) * 2002-12-20 2004-06-24 Van Der Laan Ruud Circuit board having a multi-functional hole
WO2004107830A1 (ja) * 2003-06-02 2004-12-09 Nec Corporation プリント回路基板用コンパクトビア伝送路およびその設計方法
JP2007250885A (ja) * 2006-03-16 2007-09-27 Aica Kogyo Co Ltd 多層プリント配線板
JP2008205099A (ja) * 2007-02-19 2008-09-04 Nec Corp 多層配線基板
US20100044096A1 (en) * 2008-08-19 2010-02-25 International Business Machines Corporation Horizontally Split Vias
CN102946695A (zh) * 2012-10-31 2013-02-27 华为技术有限公司 一种通孔结构、印刷电路基板及通孔结构的制作方法
US20140001150A1 (en) * 2012-06-29 2014-01-02 Roy J. Lecesse Circuit board multi-functional hole system and method
JP2015185735A (ja) * 2014-03-25 2015-10-22 日立化成株式会社 多層配線板及びその製造方法
JP2016517173A (ja) * 2013-03-15 2016-06-09 サンミナ コーポレーションＳａｎｍｉｎａ Ｃｏｒｐｏｒａｔｉｏｎ めっきレジストを用いたビア構造の同時で選択的なワイドギャップ分割

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6133805A (en) * 1996-10-31 2000-10-17 The Whitaker Corporation Isolation in multi-layer structures
JP3411960B2 (ja) * 1998-03-05 2003-06-03 三菱電機株式会社 マイクロ波受動素子
US7030712B2 (en) * 2004-03-01 2006-04-18 Belair Networks Inc. Radio frequency (RF) circuit board topology
CN100463584C (zh) * 2004-11-05 2009-02-18 财团法人工业技术研究院 孔柱分割式连通孔结构与其制造方法
JP2012129350A (ja) * 2010-12-15 2012-07-05 Hitachi Ltd 多層プリント基板
JPWO2013099286A1 (ja) * 2011-12-28 2015-04-30 パナソニックＩｐマネジメント株式会社 多層配線基板
CN203120286U (zh) * 2013-02-21 2013-08-07 广州兴森快捷电路科技有限公司 阻抗受控、低损耗的单端过孔结构
CN104378912A (zh) * 2014-12-05 2015-02-25 浪潮集团有限公司 一种pcb阻抗可控的通孔设计方法
CN105891740B (zh) * 2016-04-08 2018-08-31 北京航空航天大学 一种宽频带近场磁场探头的阻抗补偿结构及其构建方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040118605A1 (en) * 2002-12-20 2004-06-24 Van Der Laan Ruud Circuit board having a multi-functional hole
WO2004107830A1 (ja) * 2003-06-02 2004-12-09 Nec Corporation プリント回路基板用コンパクトビア伝送路およびその設計方法
JP2007250885A (ja) * 2006-03-16 2007-09-27 Aica Kogyo Co Ltd 多層プリント配線板
JP2008205099A (ja) * 2007-02-19 2008-09-04 Nec Corp 多層配線基板
US20100044096A1 (en) * 2008-08-19 2010-02-25 International Business Machines Corporation Horizontally Split Vias
US20140001150A1 (en) * 2012-06-29 2014-01-02 Roy J. Lecesse Circuit board multi-functional hole system and method
CN102946695A (zh) * 2012-10-31 2013-02-27 华为技术有限公司 一种通孔结构、印刷电路基板及通孔结构的制作方法
JP2016517173A (ja) * 2013-03-15 2016-06-09 サンミナ コーポレーションＳａｎｍｉｎａ Ｃｏｒｐｏｒａｔｉｏｎ めっきレジストを用いたビア構造の同時で選択的なワイドギャップ分割
JP2015185735A (ja) * 2014-03-25 2015-10-22 日立化成株式会社 多層配線板及びその製造方法

Also Published As

Publication number Publication date
US20220015221A1 (en) 2022-01-13
WO2020129171A1 (ja) 2020-06-25
CN113170577A (zh) 2021-07-23
EP3914052A1 (en) 2021-11-24
EP3914052A4 (en) 2022-03-23
JP7207424B2 (ja) 2023-01-18

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