JPWO2020090031A1 - - Google Patents

Info

Publication number
JPWO2020090031A1
JPWO2020090031A1 JP2020554664A JP2020554664A JPWO2020090031A1 JP WO2020090031 A1 JPWO2020090031 A1 JP WO2020090031A1 JP 2020554664 A JP2020554664 A JP 2020554664A JP 2020554664 A JP2020554664 A JP 2020554664A JP WO2020090031 A1 JPWO2020090031 A1 JP WO2020090031A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020554664A
Other versions
JPWO2020090031A5 (ja
JP7116798B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020090031A1 publication Critical patent/JPWO2020090031A1/ja
Publication of JPWO2020090031A5 publication Critical patent/JPWO2020090031A5/ja
Application granted granted Critical
Publication of JP7116798B2 publication Critical patent/JP7116798B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2020554664A 2018-10-31 2018-10-31 検査ソケット Active JP7116798B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/040501 WO2020090031A1 (ja) 2018-10-31 2018-10-31 検査ソケット

Publications (3)

Publication Number Publication Date
JPWO2020090031A1 true JPWO2020090031A1 (ja) 2020-05-07
JPWO2020090031A5 JPWO2020090031A5 (ja) 2022-03-22
JP7116798B2 JP7116798B2 (ja) 2022-08-10

Family

ID=70462033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020554664A Active JP7116798B2 (ja) 2018-10-31 2018-10-31 検査ソケット

Country Status (3)

Country Link
US (1) US11619652B2 (ja)
JP (1) JP7116798B2 (ja)
WO (1) WO2020090031A1 (ja)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1197139A (ja) * 1997-09-19 1999-04-09 Nec Corp 半導体装置用ソケット及びハンドリング装置並びに半導体装置の測定方法
JP2001281300A (ja) * 2000-03-31 2001-10-10 Nec Corp 半導体チップ又はパッケージ検査装置及びその検査方法
JP2002181887A (ja) * 2000-12-12 2002-06-26 Advantest Corp 電子部品試験装置
JP2002372567A (ja) * 2001-06-14 2002-12-26 Sharp Corp 半導体検査装置
JP2006220627A (ja) * 2005-02-14 2006-08-24 Sony Corp プローブピン、プローブピンユニット及びこれを用いた被検査物の検査方法
JP2008304254A (ja) * 2007-06-06 2008-12-18 Panasonic Corp 検査用ソケットおよび半導体装置の製造方法
JP2011112552A (ja) * 2009-11-27 2011-06-09 Renesas Electronics Corp 半導体パッケージのソケット装置、及び半導体パッケージのテスト装置
JP2013002953A (ja) * 2011-06-16 2013-01-07 Renesas Electronics Corp 検査装置およびその制御方法
JP2013254812A (ja) * 2012-06-06 2013-12-19 Tokyo Electron Ltd ウエハ検査用インターフェース及びウエハ検査装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4789125B2 (ja) * 2000-12-07 2011-10-12 株式会社アドバンテスト 電子部品試験用ソケットおよびこれを用いた電子部品試験装置
JP5083430B2 (ja) 2011-03-29 2012-11-28 山一電機株式会社 コンタクトプローブ及びそれを備えた半導体素子用ソケット
US11061069B2 (en) * 2016-06-02 2021-07-13 Kes Systems, Inc. Burn-in test apparatus for semiconductor devices

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1197139A (ja) * 1997-09-19 1999-04-09 Nec Corp 半導体装置用ソケット及びハンドリング装置並びに半導体装置の測定方法
JP2001281300A (ja) * 2000-03-31 2001-10-10 Nec Corp 半導体チップ又はパッケージ検査装置及びその検査方法
JP2002181887A (ja) * 2000-12-12 2002-06-26 Advantest Corp 電子部品試験装置
JP2002372567A (ja) * 2001-06-14 2002-12-26 Sharp Corp 半導体検査装置
JP2006220627A (ja) * 2005-02-14 2006-08-24 Sony Corp プローブピン、プローブピンユニット及びこれを用いた被検査物の検査方法
JP2008304254A (ja) * 2007-06-06 2008-12-18 Panasonic Corp 検査用ソケットおよび半導体装置の製造方法
JP2011112552A (ja) * 2009-11-27 2011-06-09 Renesas Electronics Corp 半導体パッケージのソケット装置、及び半導体パッケージのテスト装置
JP2013002953A (ja) * 2011-06-16 2013-01-07 Renesas Electronics Corp 検査装置およびその制御方法
JP2013254812A (ja) * 2012-06-06 2013-12-19 Tokyo Electron Ltd ウエハ検査用インターフェース及びウエハ検査装置

Also Published As

Publication number Publication date
US20210405087A1 (en) 2021-12-30
WO2020090031A1 (ja) 2020-05-07
US11619652B2 (en) 2023-04-04
JP7116798B2 (ja) 2022-08-10

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