JPWO2020032021A1 - 温度センサ及び温度センサを備えた装置 - Google Patents
温度センサ及び温度センサを備えた装置 Download PDFInfo
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- JPWO2020032021A1 JPWO2020032021A1 JP2020510145A JP2020510145A JPWO2020032021A1 JP WO2020032021 A1 JPWO2020032021 A1 JP WO2020032021A1 JP 2020510145 A JP2020510145 A JP 2020510145A JP 2020510145 A JP2020510145 A JP 2020510145A JP WO2020032021 A1 JPWO2020032021 A1 JP WO2020032021A1
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Images
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/20—Compensating for effects of temperature changes other than those to be measured, e.g. changes in ambient temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Abstract
Description
近時、このような電子機器において、電子機器の小型化が要望されており、この要望に伴い温度センサの薄型化のための開発が行われている。
前記電極層と溶接による接合で電気的に接続される接合部と、前記接合部から一体的に延出されるリード部と、を有するリード部材と、
少なくとも前記感熱素子及びリード部材の接合部を両面から挟んで封止する一対の絶縁性フィルムと、を具備する。
[第1の実施形態]
本実施形態の温度センサは、図1に示すように感熱素子10、リード部材20及び絶縁性フィルム30を備えている。
本実施例によれば、薄型化して感熱素子10を確実に封止して絶縁被覆することができる。
(実施形態1)
(実施形態2)
[第2の実施形態]
なお、第1の実施形態で説明した変形例や感熱素子の別の実施形態等は、この第2の実施形態においても適用できるのは勿論のことである。
10a・・・・・・・・・赤外線検知用感熱素子
10b・・・・・・・・・温度補償用感熱素子
11・・・・・・・・・・絶縁性基板
12a、12b・・・・・電極部(電極層)
12c、12d・・・・・外電極部、電極部
13・・・・・・・・・・感熱膜
14・・・・・・・・・・保護膜
15・・・・・・・・・・活性層
16・・・・・・・・・・バリア層
17・・・・・・・・・・接合層
20(20a、20b)・・・リード部材
30(30a、30b)・・・絶縁性フィルム
21a、21b・・・・・接合部
22a、22b・・・・・リード部
31・・・・・・・・・・基材層
32・・・・・・・・・・熱融着層
40・・・・・・・・・・温度センサ(近接非接触温度センサ)
50・・・・・・・・・・温度センサ(赤外線温度センサ)
41・・・・・・・・・・ホルダ
41a・・・・・・・・・開口部
52・・・・・・・・・・ケース
55・・・・・・・・・・導光部
56・・・・・・・・・・遮蔽部
Claims (16)
- 絶縁性基板と、前記絶縁性基板上に形成された感熱膜と、前記絶縁性基板上に形成され前記感熱膜と電気的に接続された電極層と、を有する感熱素子と、
前記電極層と溶接による接合で電気的に接続される接合部と、前記接合部から一体的に延出されるリード部と、を有するリード部材と、
少なくとも前記感熱素子及びリード部材の接合部を両面から挟んで封止する一対の絶縁性フィルムと、
を具備することを特徴とする温度センサ。 - 前記感熱素子及びリード部材の接合部を一対の絶縁性フィルムで両面から挟んで封止した状態での総厚寸法は、230μm以下あることを特徴とする請求項1に記載の温度センサ。
- 前記絶縁性基板の厚み寸法は100μm以下であり、曲げ強度は690MPa以上であることを特徴とする請求項1又は請求項2に記載の温度センサ。
- 前記感熱素子における電極層の厚み寸法は1μm以下であることを特徴とする請求項1乃至請求項3のいずれか一項に記載の温度センサ。
- 前記リード部材の厚さ寸法又は外径寸法は100μm以下であることを特徴とする請求項1乃至請求項4のいずれか一項に記載の温度センサ。
- 前記絶縁性フィルムの少なくとも一表面に熱融着層を有することを特徴とする請求項1乃至請求項5のいずれか一項にに記載の温度センサ。
- 前記一対の絶縁性フィルムの間には、熱硬化層が介在していることを特徴とする請求項1乃至請求項5のいずれか一項に記載の温度センサ。
- 前記熱硬化層は、赤外線放射率の高いフィルムであることを特徴とする請求項7に記載の温度センサ。
- 前記一対の絶縁性フィルムの少なくとも一方の外表面には、金属箔が設けられていることを特徴とする請求項1乃至請求項8のいずれか一項に記載の温度センサ
- 前記感熱素子は、薄膜サーミスタであることを特徴とする請求項1乃至請求項9のいずれか一項に記載の温度センサ
- 前記感熱素子における電極層は、高融点金属を主成分とする活性層と、この活性層上に形成された高融点金属を主成分とするバリア層と、このバリア層上に形成された低融点金属を主成分とする接合層とから構成されることを特徴とする請求項1乃至請求項10のいずれか一項に記載の温度センサ。
- 前記リード部材の熱伝導率は、25W/(m・K)以下であることを特徴とする請求項1乃至請求項11のいずれか一項に記載の温度センサ。
- 前記リード部材は、融点が1300℃以下の金属材料によって形成されていることを特徴とする請求項1乃至請求項12のいずれか一項に記載の温度センサ。
- 前記絶縁性基板は、セラミック材料で形成されていることを特徴とする請求項1乃至請求項13のいずれか一項に記載の温度センサ。
- 前記絶縁性フィルムは、生体適合性を有する材料で構成されていることを特徴とする請求項1乃至請求項14のいずれか一項に記載の温度センサ。
- 請求項1乃至請求項15のいずれか一項に記載された温度センサが備えられていることを特徴とする温度センサを備えた装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018152022 | 2018-08-10 | ||
JP2018152022 | 2018-08-10 | ||
PCT/JP2019/030893 WO2020032021A1 (ja) | 2018-08-10 | 2019-08-06 | 温度センサ及び温度センサを備えた装置 |
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JPWO2020032021A1 true JPWO2020032021A1 (ja) | 2020-08-20 |
JP6842600B2 JP6842600B2 (ja) | 2021-03-17 |
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JP2022178388A (ja) * | 2021-05-20 | 2022-12-02 | Koa株式会社 | センサ素子 |
JP7201767B1 (ja) | 2021-10-08 | 2023-01-10 | 株式会社芝浦電子 | 温度センサおよび温度センサの製造方法 |
CN117606623B (zh) * | 2023-11-08 | 2024-07-09 | 日照旭日电子有限公司 | 一种同轴热释电传感器基座及基座组装方法 |
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- 2019-08-06 JP JP2020510145A patent/JP6842600B2/ja active Active
- 2019-08-06 WO PCT/JP2019/030893 patent/WO2020032021A1/ja active Application Filing
- 2019-08-06 CN CN201980051295.6A patent/CN112513599A/zh active Pending
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CN112513599A (zh) | 2021-03-16 |
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