JPWO2020009091A5 - - Google Patents
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- Publication number
- JPWO2020009091A5 JPWO2020009091A5 JP2020528999A JP2020528999A JPWO2020009091A5 JP WO2020009091 A5 JPWO2020009091 A5 JP WO2020009091A5 JP 2020528999 A JP2020528999 A JP 2020528999A JP 2020528999 A JP2020528999 A JP 2020528999A JP WO2020009091 A5 JPWO2020009091 A5 JP WO2020009091A5
- Authority
- JP
- Japan
- Prior art keywords
- case
- pressure sensor
- pedestal
- semiconductor pressure
- sensor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 60
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 57
- 239000012530 fluid Substances 0.000 claims description 44
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018129527 | 2018-07-06 | ||
| JP2018129527 | 2018-07-06 | ||
| PCT/JP2019/026232 WO2020009091A1 (fr) | 2018-07-06 | 2019-07-02 | Dispositif de capteur de pression |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020009091A1 JPWO2020009091A1 (ja) | 2021-07-08 |
| JPWO2020009091A5 true JPWO2020009091A5 (fr) | 2022-05-17 |
| JP7252956B2 JP7252956B2 (ja) | 2023-04-05 |
Family
ID=69060399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020528999A Active JP7252956B2 (ja) | 2018-07-06 | 2019-07-02 | 圧力センサ装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7252956B2 (fr) |
| WO (1) | WO2020009091A1 (fr) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283713A (ja) * | 1992-03-31 | 1993-10-29 | Mitsubishi Electric Corp | 半導体センサ |
| JP3331782B2 (ja) * | 1994-10-24 | 2002-10-07 | 松下電工株式会社 | 半導体圧力センサの製造方法 |
| JPH09138175A (ja) * | 1995-11-14 | 1997-05-27 | Omron Corp | 圧力センサ装置およびそれを用いた圧力測定装置 |
| JP4414746B2 (ja) | 2002-12-19 | 2010-02-10 | キヤノンアネルバ株式会社 | 静電容量型圧力センサ |
| US8516897B1 (en) | 2012-02-21 | 2013-08-27 | Honeywell International Inc. | Pressure sensor |
-
2019
- 2019-07-02 JP JP2020528999A patent/JP7252956B2/ja active Active
- 2019-07-02 WO PCT/JP2019/026232 patent/WO2020009091A1/fr active Application Filing
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