JPWO2019244136A5 - - Google Patents

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Publication number
JPWO2019244136A5
JPWO2019244136A5 JP2021520478A JP2021520478A JPWO2019244136A5 JP WO2019244136 A5 JPWO2019244136 A5 JP WO2019244136A5 JP 2021520478 A JP2021520478 A JP 2021520478A JP 2021520478 A JP2021520478 A JP 2021520478A JP WO2019244136 A5 JPWO2019244136 A5 JP WO2019244136A5
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Japan
Prior art keywords
moving axis
axis
moving
head
contact surface
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JP2021520478A
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English (en)
Japanese (ja)
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JP2021529441A (ja
JP7333391B2 (ja
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Priority claimed from DE102018115144.6A external-priority patent/DE102018115144A1/de
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Publication of JPWO2019244136A5 publication Critical patent/JPWO2019244136A5/ja
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JP2021520478A 2018-06-23 2019-06-23 接合ヘッドのためのアクチュエータ Active JP7333391B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018115144.6A DE102018115144A1 (de) 2018-06-23 2018-06-23 Stellantrieb für einen Bondkopf
DE102018115144.6 2018-06-23
PCT/IB2019/055284 WO2019244136A2 (de) 2018-06-23 2019-06-23 Stellantrieb für einen bondkopf

Publications (3)

Publication Number Publication Date
JP2021529441A JP2021529441A (ja) 2021-10-28
JPWO2019244136A5 true JPWO2019244136A5 (de) 2022-07-19
JP7333391B2 JP7333391B2 (ja) 2023-08-24

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Family Applications (1)

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JP2021520478A Active JP7333391B2 (ja) 2018-06-23 2019-06-23 接合ヘッドのためのアクチュエータ

Country Status (7)

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US (1) US20210272925A1 (de)
JP (1) JP7333391B2 (de)
KR (1) KR20210022050A (de)
CN (1) CN113169091A (de)
DE (1) DE102018115144A1 (de)
SG (1) SG11202012866TA (de)
WO (1) WO2019244136A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114005777B (zh) * 2021-12-24 2022-03-29 湖北三维半导体集成创新中心有限责任公司 键合装置和键合方法
CN113990790B (zh) * 2021-12-24 2022-03-18 湖北三维半导体集成创新中心有限责任公司 键合系统和键合方法
CN114005778B (zh) * 2021-12-24 2022-03-22 湖北三维半导体集成创新中心有限责任公司 键合系统和键合补偿方法
CN116417389B (zh) * 2023-06-08 2023-08-15 上海果纳半导体技术有限公司 晶圆盒搬运装置及方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107495A (ja) * 1996-09-26 1998-04-24 Matsushita Electric Ind Co Ltd 部品装着装置
JP3303705B2 (ja) * 1997-01-22 2002-07-22 松下電器産業株式会社 バンプ付電子部品の熱圧着装置
JP2000101294A (ja) * 1998-09-18 2000-04-07 Sony Corp 部品装着装置
US6146912A (en) * 1999-05-11 2000-11-14 Trw Inc. Method for parallel alignment of a chip to substrate
JP2000340585A (ja) * 1999-05-31 2000-12-08 Sony Corp 平面平行度調整装置を備えた加工装置
JP2002280397A (ja) * 2001-03-19 2002-09-27 Furukawa Electric Co Ltd:The 面合わせ機構および面合わせ方法
ATE499703T1 (de) * 2006-10-31 2011-03-15 Kulicke & Soffa Die Bonding Gmbh Vorrichtung zum positionieren und/oder anpressen eines flächigen bauteils relativ zu einem substrat und verfahren zum positionieren eines aufnahmewerkzeugs relativ zu einem substrat
JP5065969B2 (ja) * 2008-03-31 2012-11-07 株式会社日立ハイテクインスツルメンツ 部品実装装置
KR101233221B1 (ko) * 2008-12-17 2013-02-15 세메스 주식회사 다이 본더용 피커 헤드
US8016010B2 (en) * 2009-09-02 2011-09-13 Asm Assembly Automation Ltd Rotary bonding tool which provides a large bond force
US8387851B1 (en) 2012-05-04 2013-03-05 Asm Technology Singapore Pte. Ltd. Apparatus for aligning a bonding tool of a die bonder
DE102012014558B4 (de) * 2012-07-24 2014-02-20 Datacon Technology Gmbh Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung
WO2016024364A1 (ja) * 2014-08-13 2016-02-18 株式会社新川 実装装置および測定方法
CN104966687B (zh) * 2015-06-30 2017-08-25 北京中电科电子装备有限公司 一种键合头装置

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