JPWO2019201603A5 - - Google Patents

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Publication number
JPWO2019201603A5
JPWO2019201603A5 JP2020555869A JP2020555869A JPWO2019201603A5 JP WO2019201603 A5 JPWO2019201603 A5 JP WO2019201603A5 JP 2020555869 A JP2020555869 A JP 2020555869A JP 2020555869 A JP2020555869 A JP 2020555869A JP WO2019201603 A5 JPWO2019201603 A5 JP WO2019201603A5
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JP
Japan
Prior art keywords
semiconductor wafer
temperature
measuring device
mass
mass measuring
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JP2020555869A
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English (en)
Japanese (ja)
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JP7335896B2 (ja
JP2021521441A (ja
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Priority claimed from GBGB1806377.6A external-priority patent/GB201806377D0/en
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Publication of JP2021521441A publication Critical patent/JP2021521441A/ja
Publication of JPWO2019201603A5 publication Critical patent/JPWO2019201603A5/ja
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Publication of JP7335896B2 publication Critical patent/JP7335896B2/ja
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JP2020555869A 2018-04-19 2019-04-03 半導体ウエハ質量計測装置および半導体ウエハ質量計測方法 Active JP7335896B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1806377.6A GB201806377D0 (en) 2018-04-19 2018-04-19 Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method
GB1806377.6 2018-04-19
PCT/EP2019/058388 WO2019201603A1 (en) 2018-04-19 2019-04-03 Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method

Publications (3)

Publication Number Publication Date
JP2021521441A JP2021521441A (ja) 2021-08-26
JPWO2019201603A5 true JPWO2019201603A5 (enExample) 2022-04-11
JP7335896B2 JP7335896B2 (ja) 2023-08-30

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ID=62236133

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JP2020555869A Active JP7335896B2 (ja) 2018-04-19 2019-04-03 半導体ウエハ質量計測装置および半導体ウエハ質量計測方法

Country Status (9)

Country Link
US (1) US12288702B2 (enExample)
EP (1) EP3782188B1 (enExample)
JP (1) JP7335896B2 (enExample)
KR (1) KR102547839B1 (enExample)
CN (1) CN112368814B (enExample)
GB (1) GB201806377D0 (enExample)
SG (1) SG11202010143VA (enExample)
TW (1) TWI822759B (enExample)
WO (1) WO2019201603A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201815815D0 (en) * 2018-09-28 2018-11-14 Metryx Ltd Method and apparatus for controlling the temperature of a semiconductor wafer
CN113496912B (zh) * 2020-04-02 2023-10-17 长鑫存储技术有限公司 监测晶圆及监测系统
CN113819985A (zh) * 2020-06-18 2021-12-21 拓荆科技股份有限公司 晶圆防干扰称重装置及其应用
CN116417319A (zh) * 2021-12-30 2023-07-11 中微半导体设备(上海)股份有限公司 一种控温装置及相应的等离子体处理器
KR102706137B1 (ko) * 2022-06-14 2024-09-13 주식회사 코비스테크놀로지 병렬구조의 질량측정장치를 이용한 질량측정방법

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
US6072163A (en) * 1998-03-05 2000-06-06 Fsi International Inc. Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate
KR100342754B1 (ko) 1999-11-10 2002-07-04 황인길 무게 측정을 통한 반도체 웨이퍼의 정렬 시스템
GB0016562D0 (en) 2000-07-05 2000-08-23 Metryx Limited Apparatus and method for investigating semiconductor wafers
US6790376B1 (en) 2001-07-23 2004-09-14 Advanced Micro Devices, Inc. Process control based upon weight or mass measurements, and systems for accomplishing same
CN1702849A (zh) * 2004-05-26 2005-11-30 松下电器产业株式会社 温度异常检测方法及半导体制造装置
US20060004493A1 (en) * 2004-06-30 2006-01-05 Jack Hwang Use of active temperature control to provide emmisivity independent wafer temperature
US20060286807A1 (en) 2005-06-16 2006-12-21 Jack Hwang Use of active temperature control to provide emmisivity independent wafer temperature
KR20060118747A (ko) * 2005-05-17 2006-11-24 삼성전자주식회사 온도 조절 어셈블리 및 이를 갖는 이온 주입 장치
US7534627B2 (en) * 2006-08-07 2009-05-19 Sokudo Co., Ltd. Methods and systems for controlling critical dimensions in track lithography tools
US7935942B2 (en) * 2006-08-15 2011-05-03 Varian Semiconductor Equipment Associates, Inc. Technique for low-temperature ion implantation
GB0719469D0 (en) 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0719460D0 (en) 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
DE102008041250A1 (de) 2008-08-13 2010-02-25 Ers Electronic Gmbh Verfahren und Vorrichtung zum thermischen Bearbeiten von Kunststoffscheiben, insbesondere Moldwafern
US9111971B2 (en) * 2012-07-30 2015-08-18 Applied Materials Israel, Ltd. System and method for temperature control of a semiconductor wafer
GB201315715D0 (en) * 2013-09-04 2013-10-16 Metryx Ltd Method and device for determining information relating to the mass of a semiconductor wafer
GB201321423D0 (en) * 2013-12-04 2014-01-15 Metryx Ltd Semiconductor wafer processing methods and apparatus
NL2014697A (en) * 2014-05-06 2016-03-31 Asml Netherlands Bv Substrate support, method for loading a substrate on a substrate support location, lithographic apparatus and device manufacturing method.
US20150332942A1 (en) 2014-05-16 2015-11-19 Eng Sheng Peh Pedestal fluid-based thermal control
US10430719B2 (en) * 2014-11-25 2019-10-01 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
US10269682B2 (en) 2015-10-09 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
GB201815815D0 (en) * 2018-09-28 2018-11-14 Metryx Ltd Method and apparatus for controlling the temperature of a semiconductor wafer

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