JPWO2019136396A5 - - Google Patents

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Publication number
JPWO2019136396A5
JPWO2019136396A5 JP2020536864A JP2020536864A JPWO2019136396A5 JP WO2019136396 A5 JPWO2019136396 A5 JP WO2019136396A5 JP 2020536864 A JP2020536864 A JP 2020536864A JP 2020536864 A JP2020536864 A JP 2020536864A JP WO2019136396 A5 JPWO2019136396 A5 JP WO2019136396A5
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JP
Japan
Prior art keywords
plasma processing
processing chamber
application example
component
ring structure
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JP2020536864A
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English (en)
Japanese (ja)
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JP7333780B2 (ja
JP2021509770A (ja
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Priority claimed from PCT/US2019/012570 external-priority patent/WO2019136396A2/en
Publication of JP2021509770A publication Critical patent/JP2021509770A/ja
Publication of JPWO2019136396A5 publication Critical patent/JPWO2019136396A5/ja
Priority to JP2023132188A priority Critical patent/JP2023159242A/ja
Application granted granted Critical
Publication of JP7333780B2 publication Critical patent/JP7333780B2/ja
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JP2020536864A 2018-01-08 2019-01-07 プラズマ処理副生成物を管理するための構成要素および処理 Active JP7333780B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023132188A JP2023159242A (ja) 2018-01-08 2023-08-15 プラズマ処理副生成物を管理するための構成要素および処理

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862614974P 2018-01-08 2018-01-08
US62/614,974 2018-01-08
PCT/US2019/012570 WO2019136396A2 (en) 2018-01-08 2019-01-07 Components and processes for managing plasma process byproduct materials

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023132188A Division JP2023159242A (ja) 2018-01-08 2023-08-15 プラズマ処理副生成物を管理するための構成要素および処理

Publications (3)

Publication Number Publication Date
JP2021509770A JP2021509770A (ja) 2021-04-01
JPWO2019136396A5 true JPWO2019136396A5 (zh) 2022-01-17
JP7333780B2 JP7333780B2 (ja) 2023-08-25

Family

ID=67144280

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020536864A Active JP7333780B2 (ja) 2018-01-08 2019-01-07 プラズマ処理副生成物を管理するための構成要素および処理
JP2023132188A Pending JP2023159242A (ja) 2018-01-08 2023-08-15 プラズマ処理副生成物を管理するための構成要素および処理

Family Applications After (1)

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JP2023132188A Pending JP2023159242A (ja) 2018-01-08 2023-08-15 プラズマ処理副生成物を管理するための構成要素および処理

Country Status (7)

Country Link
US (1) US20210225616A1 (zh)
EP (1) EP3738136A4 (zh)
JP (2) JP7333780B2 (zh)
KR (1) KR20200099203A (zh)
CN (1) CN111566778A (zh)
SG (1) SG11202005688TA (zh)
WO (1) WO2019136396A2 (zh)

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KR20210121275A (ko) * 2019-02-21 2021-10-07 램 리써치 코포레이션 양극 산화되고 코팅된 표면을 위한 거시적 텍스처링 (macroscopic texturing)
US20210265137A1 (en) * 2020-02-26 2021-08-26 Intel Corporation Reconditioning of reactive process chamber components for reduced surface oxidation
EP4189731A4 (en) * 2020-07-31 2024-09-04 Lam Res Corp THIN PROTECTION RING FOR LOW INCLINATION TRENCH ENGRAVING
US12060637B2 (en) * 2020-12-01 2024-08-13 Applied Materials, Inc. Actively cooled foreline trap to reduce throttle valve drift
CN117897794A (zh) * 2021-08-19 2024-04-16 朗姆研究公司 经处理的陶瓷室部件
CN113953981B (zh) * 2021-10-29 2023-05-09 山东工业陶瓷研究设计院有限公司 一种金属连接环预处理方法及粗化系统

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US6007673A (en) * 1996-10-02 1999-12-28 Matsushita Electronics Corporation Apparatus and method of producing an electronic device
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KR100315088B1 (ko) 1999-09-29 2001-11-24 윤종용 포커스 링을 갖는 반도체 웨이퍼 제조 장치
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US6797639B2 (en) * 2000-11-01 2004-09-28 Applied Materials Inc. Dielectric etch chamber with expanded process window
US6777045B2 (en) * 2001-06-27 2004-08-17 Applied Materials Inc. Chamber components having textured surfaces and method of manufacture
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