JPWO2019066056A1 - Image sensor and image sensor - Google Patents

Abstract

The image pickup element has a plurality of first photoelectric conversion units arranged in the first direction and the second direction by photoelectrically converting the light transmitted through the first transmission unit that transmits light in the first wavelength region to generate a charge. , A plurality of second photoelectric conversion units arranged in the first direction and the second direction by photoelectric conversion of the light transmitted through the second transmission unit that transmits light in the second wavelength region to generate a charge. A plurality of first signal lines having point-symmetrical or line-symmetrical wiring and outputting signals based on charges generated by the plurality of first photoelectric conversion units, and a plurality of point-symmetrical or line-symmetrical wirings It includes a second signal line from which a signal based on the charge generated by the second photoelectric conversion unit is output.

Description

The present invention relates to an image sensor and an image pickup device.

An image pickup device is known in which a plurality of pixels are grouped into blocks and signals are read out in parallel in block units (see Patent Document 1). With such an image sensor, it has been difficult to perform binning processing between signals of the same color.

According to the first aspect of the invention, the image pickup element is arranged in the first direction and the second direction by photoelectrically converting the light transmitted through the first transmitting portion that transmits the light in the first wavelength region to generate a charge. The light transmitted through the plurality of first photoelectric conversion units and the second transmission unit that transmits light in the second wavelength region is photoelectrically converted to generate a charge, which is arranged in the first direction and the second direction. A first signal line having a plurality of second photoelectric conversion units and a point-symmetrical or line-symmetrical wiring and outputting a signal based on the charge generated by the plurality of first photoelectric conversion units, and a point-symmetrical or line-symmetrical line. It has a symmetric wiring, and includes a second signal line from which a signal based on the charges generated by the plurality of second photoelectric conversion units is output.
According to the second aspect of the invention, the image pickup device is arranged in the first direction and the second direction by photoelectrically converting the light transmitted through the first transmitting portion that transmits the light in the first wavelength region to generate a charge. The light transmitted through the plurality of first photoelectric conversion units and the second transmission unit that transmits light in the second wavelength region is photoelectrically converted to generate a charge, which is arranged in the first direction and the second direction. Based on a plurality of second photoelectric conversion units, a first signal line for which signals based on charges generated by the plurality of first photoelectric conversion units are output, and charges generated by the plurality of second photoelectric conversion units. It includes a second signal line from which a signal is output, and a wiring layer in which the first signal line and the second signal line are arranged.
According to the third aspect of the invention, the image pickup apparatus includes an image pickup device according to the first or second aspect, and a generation unit that generates image data based on a signal output from the image pickup device.

It is a figure which shows the configuration example of a digital camera. It is a figure explaining the outline of an image pickup device. It is a figure explaining the cross section of an image sensor. It is a figure which illustrates the Bayer arrangement. It is a circuit diagram explaining the structure of the block of an image sensor. It is a schematic diagram explaining a block. 7 (a) is a diagram for explaining the wiring of the R pixel, FIG. 7 (b) is a diagram for explaining the wiring of the B pixel, and FIG. 7 (c) is a diagram for explaining the wiring of the G pixel. FIG. 3D is a diagram illustrating wiring of G pixels. 8 (a) and 8 (b) are diagrams for explaining the wiring according to the first modification. It is a figure explaining the wiring by the modification 2. FIG. It is a figure explaining the wiring by the modification 3.

The image sensor according to the present embodiment is configured to be capable of grouping a plurality of pixels into blocks and reading signals generated by the pixels in parallel in block units. Hereinafter, a detailed description will be given with reference to the drawings.
FIG. 1 is a diagram schematically showing a configuration example of a digital camera including an image sensor 101 according to an embodiment. The digital camera is composed of an interchangeable lens 110 and a camera body 100, and the interchangeable lens 110 is attached to the camera body 100 via a lens mounting portion 105.
The digital camera may be configured as a camera with an integrated lens instead of an interchangeable lens type.

In FIG. 1, xyz axes constituting a coordinate system orthogonal to each other are defined. It is assumed that the light from the subject is incident in the positive direction of the z-axis of FIG. Further, as shown in the coordinate axes, the front direction of the paper surface orthogonal to the z-axis is defined as the x-axis plus direction, and the upward direction orthogonal to the z-axis and the x-axis is defined as the y-axis plus direction. In some subsequent figures, the coordinate axes are displayed so that the orientation of each figure can be understood with reference to the coordinate axes of FIG.

The interchangeable lens 110 includes, for example, a lens control unit 111, a zoom lens 112, a focus lens 113, an anti-vibration lens 114, an aperture 115, a lens operation unit 116, and the like.
The lens control unit 111 includes a CPU and peripheral components such as a memory. The lens control unit 111 performs drive control of the focus lens 113 and the aperture 115, position detection of the zoom lens 112 and the focus lens 113, transmission of lens information to the camera body 100, reception of camera information from the camera body 100, and the like.

The camera body 100 includes, for example, an image sensor 101, a body control unit 102, a body operation unit 103, a display unit 104, and the like. The image sensor 101 is arranged on the planned image plane (planned focal plane) of the interchangeable lens 110, and photoelectrically converts the subject image imaged by the interchangeable lens 110. The body operation unit 103 includes a shutter button, an operation member for various settings, and the like. The display unit 104 is composed of, for example, a liquid crystal monitor (also referred to as a rear monitor) mounted on the back surface of the camera body 100.

The body control unit 102 includes a CPU and peripheral parts such as a memory. The body control unit 102 controls the operation of the digital camera, such as drive control of the image sensor 101, reading of an image signal from the image sensor 101, focus detection calculation and focus adjustment of the interchangeable lens 110, processing and recording of the image signal. Further, the body control unit 102 communicates with the lens control unit 111 via an electric contact 106 provided in the lens mounting unit 105 to receive lens information and transmit camera information (defocus amount, aperture value, etc.). Do.

The light flux passing through the interchangeable lens 110 forms a subject image on the light receiving surface of the image sensor 101. This subject image is photoelectrically converted by the image pickup element 101, and the signal after the photoelectric conversion is sent to the body control unit 102.

The body control unit 102 detects the focus adjustment state (defocus amount) of the interchangeable lens 110 by performing a known focus detection calculation based on the signal from the image sensor 101. The defocus amount detected by the body control unit 102 is sent to the lens control unit 111.
The lens control unit 111 calculates the drive amount of the focus lens 113 based on the received defocus amount. Then, the focus lens 113 is moved to the in-focus position by driving a motor or the like (not shown) based on the calculated drive amount.

Further, the body control unit 102 processes a signal from the image sensor 101 to generate image data, and stores the image data in a memory card (not shown). The body control unit 102 further causes the display unit 104 to display a monitor image (also referred to as a through image) based on the signal from the image sensor 101.

<Structure of image sensor>
FIG. 2 is a schematic diagram illustrating an outline of the image sensor 101. The image sensor 101 is composed of a CMOS image sensor. The image sensor 101 has a pixel area 201, a vertical control unit 202, a horizontal control unit 203, an output unit 204, and a control unit 205. In FIG. 2, the power supply unit and the detailed circuit are omitted.

The pixel area 201 has, for example, a plurality of pixels arranged two-dimensionally in a horizontal direction (row direction) parallel to the x-axis and a vertical direction (column direction) parallel to the y-axis. Each pixel has a photodiode (photoelectric conversion unit) that generates an electric charge according to the amount of incident light. Each of the plurality of pixels is driven by the vertical control unit 202 and the horizontal control unit 203, and a signal based on the charge generated by the photodiode of each pixel is read out via the signal line 210.

The output unit 204 performs correlated double sampling (CDS) on the signal read from each pixel, and applies a gain as necessary. The signal processed by the output unit 204 is output to a signal processing unit (not shown) in the subsequent stage.

In the above description, an example in which the output unit 204 outputs an analog signal to the signal processing unit in the subsequent stage has been described, but the output unit 204 is provided with an A / D converter and digitally outputs the signal after the A / D conversion. It may be configured.

In the present embodiment, as described above, a plurality of pixels are grouped together to form a block, and the signal generated by the pixels in the block is read out via the same signal line 210. Therefore, the number of signal lines 210 is equal to the number of blocks. With this configuration, the output unit 204 inputs signals from a plurality of blocks in parallel, processes the signals from the input multiple blocks in parallel, and signals processing units in the subsequent stage (not shown). Can be output in parallel to.

The control unit 205 controls each unit of the image sensor 101 described above. That is, the operation of the image sensor 101 described below is performed based on the control of the control unit 205 that receives the command from the body control unit 102.
In the present embodiment, the photodiode and the reading unit that reads a signal based on the electric charge generated by the photodiode are referred to as "pixels". An example in which the reading unit includes each transfer transistor, a floating diffusion (FD) region, an amplification transistor, and a selection transistor described later will be described, but the range of the reading unit does not necessarily have to be as in this example.

FIG. 3 is a diagram illustrating a cross section of the image sensor 101. Note that FIG. 3 shows only a part of the cross section of the entire image sensor 101. The image sensor 101 is a so-called back-illuminated image sensor. The image sensor 101 photoelectrically converts the incident light toward the plus direction of the z-axis. The image sensor 101 is configured by, for example, laminating a first semiconductor substrate 70 and a second semiconductor substrate 80.

The first semiconductor substrate 70 includes at least a PD layer 71 and a wiring layer 72. The PD layer 71 is arranged on the back surface side (z-axis minus side) of the wiring layer 72. A plurality of photodiode PDs are arranged two-dimensionally on the PD layer 71. A signal line 210 or the like is formed in the wiring layer 72 by the wiring 61, the wiring 62, the wiring 63, and the wiring 64. The wiring 61 to 64 are formed in different layers of the wiring layer 72, respectively. Although the wiring of four layers is illustrated in FIG. 3, the number of layers may be changed as appropriate. The layers of the wiring layer 72 can be connected by, for example, vias (not shown). Various circuits such as the output unit 204 are arranged on the second semiconductor substrate 80, for example. The second semiconductor substrate 80 may also be configured in multiple layers.

A plurality of color filters 73 corresponding to each of the plurality of photodiode PDs are provided on the incident side (z-axis minus side) of the incident light in the PD layer 71. There are a plurality of types of color filters 73 that transmit light in a wavelength region corresponding to, for example, red (R), green (G), and blue (B). Three types of color filters 73, for example, corresponding to red (R), green (G), and blue (B), are arranged so as to form the Bayer arrangement illustrated in FIG.
Although the Bayer array will be described as an example in the present embodiment, the color filter 73 may have an array other than the Bayer array. In the Bayer arrangement, photodiode PDs provided with color filters 73 that transmit light in different wavelength regions are adjacent to each other, whereas in arrangements other than the Bayer arrangement, color filters that transmit light in the same wavelength region are adjacent. Photodiode PDs provided with 73 may be adjacent.

A plurality of microlenses 74 corresponding to each of the plurality of color filters 73 are provided on the incident side (z-axis minus side) of the incident light in the color filter 73. The microlens 74 collects incident light toward the corresponding photodiode PD. The incident light that has passed through the microlens 74 is transmitted by the color filter 73 only in a part of the wavelength region and is incident on the photodiode PD. The photodiode PD photoelectrically converts the incident light to generate an electric charge.

A plurality of joining pads 75 are arranged on the surface (z-axis plus side) of the wiring layer 72. A plurality of bonding pads 76 facing the plurality of bonding pads 75 are arranged on the surface (z-axis minus side) of the second semiconductor substrate 80 facing the wiring layer 72. The plurality of joining pads 75 and the plurality of joining pads 76 are joined to each other. The first semiconductor substrate 70 and the second semiconductor substrate 80 are electrically connected via the plurality of bonding pads 75 and the plurality of bonding pads 76.
The number of the joining pads 75 and the plurality of joining pads 76 can be equal to the number of blocks described above, respectively. That is, a set of joining pads 75 and 76 is provided corresponding to one block. With the above configuration, the lengths of the signal lines for each block can be configured to be substantially equal, so that there is an advantage that the impedance of the wiring can be suppressed from fluctuating between the blocks.

In the present embodiment, one pixel portion 30 of the image sensor 101 is composed of a first pixel portion 30x provided on the first semiconductor substrate 70 and a second pixel portion 30y provided on the second semiconductor substrate 80. Will be done. In addition to the microlens 74, the color filter 73, and the photodiode PD, the first pixel unit 30x includes a transistor to be described in detail later, wiring 61 to wiring 64 connecting the pixel units 30, and the like. The second pixel unit 30y includes a circuit such as the output unit 204.

<Explanation of blocks>
FIG. 5 is a circuit diagram illustrating a block configuration of the image sensor 101. One block includes a plurality of (for example, N) first pixel units 30x-1 to 30x-N. One first pixel unit 30x has a photodiode PD, four transistors (transfer transistor Tx, reset transistor RST, amplification transistor SF, selection transistor SEL), and an FD region. Each part of the first pixel part 30x is connected as shown in FIG. In FIG. 5, reference numeral VDD indicates a power supply voltage.

The transfer transistor Tx transfers the electric charge generated by the photodiode PD to the FD region. The transfer transistor Tx turns on when the control signal φTx reaches the High level to transfer charges, and turns off when the control signal φTx reaches the Low level.

The FD region converts the transferred charge into a voltage. The amplification transistor SF forms a source follower circuit and amplifies a signal corresponding to the potential in the FD region. The reset transistor RST resets the electric charge in the FD region and the photodiode PD. The reset transistor RST turns on when the control signal φRST reaches the High level, and turns off when the control signal φRST reaches the Low level.

The selection transistor SEL outputs the signal amplified by the amplification transistor SF to the block signal line 60. The block signal line 60 connects the first pixel units 30x-1 to 30x-N in the block to each other. The block signal line 60 is connected to the signal line 210 corresponding to the block. The selection transistor SEL is turned on when the control signal φSEL reaches the High level to output a signal, and turns off when the control signal φSEL reaches the Low level.

Independent control signals φSEL-1 to φSEL-N are supplied to the selection transistors SEL of the first pixel portions 30x-1 to 30x-N in the block. Therefore, for example, when the high level control signals φSEL-1 to φSEL-N are sequentially supplied by the control unit 205, the selection transistors SEL-1 to SEL-N are turned on in order to block the signal line. A signal is output to the signal line 210 via 60.

Further, when the high level control signals φSEL-1 to φSEL-N are supplied all at once by the control unit 205, the selection transistors SEL-1 to SEL-N are turned on all at once via the block signal line 60. Outputs a signal to the signal line 210. When the selection transistors SEL-1 to SEL-N output signals all at once, the signals output from the first pixel units 30x-1 to 30x-N are added to the signal line 210, so that the first pixel in the block Binning can be performed by the portions 30x-1 to 30x-N.
A signal may be output to the signal line 210 via the block signal line 60 by any combination of the selection transistors SEL-1 to SEL-N. In this case, since the signal output from a part of the first pixel units 30x-1 to 30x-N is added to the signal line 210, the signals of the first pixel units 30x-1 to 30x-N in the block are added. Binning can be performed in any combination.

With the above configuration, signals can be individually read from any of the first pixel units 30x-1 to 30x-N in the block, and binning is performed between at least two of the first pixel units 30x-1 to 30x-N. Can be done.

In the present embodiment, one block is composed of a plurality of pixels of the same color. That is, the pixel portions 30 having the same wavelength range of the light transmitted through the color filter 73 described above are combined into one block. FIG. 6 is a schematic diagram illustrating a block. In the range surrounded by a solid line around the pixel portion 30 (referred to as R pixel) having the color filter 73 that transmits light in the wavelength region corresponding to red (R), the R pixel and eight R pixels surrounding the R pixel. The R color block 301 is composed of nine R pixels. Further, in a range surrounded by a broken line around a pixel portion 30 (referred to as a B pixel) having a color filter 73 that transmits light in a wavelength region corresponding to blue (B), the B pixel and eight surrounding the B pixel. The B color block 302 is composed of nine B pixels composed of B pixels.

Further, the G pixel is located in a range surrounded by a one-point chain line around a pixel portion 30 (referred to as G pixel) having a color filter 73 located on the GR column and transmitting light in a wavelength region corresponding to green (G). The first G color block 303 is composed of nine G pixels including the eight G pixels surrounding the G pixel and the eight G pixels. Furthermore, in a range surrounded by a two-point chain line around a pixel portion 30 (referred to as a G pixel) having a color filter 73 located on the GB row and transmitting light in a wavelength region corresponding to green (G). The second G color block 304 is composed of nine G pixels including the G pixel and eight G pixels surrounding the G pixel.

According to FIG. 6, the upper and lower portions of the R color block 301 and the first G color block 303 overlap each other. Further, the left and right portions of the B color block 302 and the first G color block 303 overlap each other.

Further, the B color block 302 and the second G color block 304 overlap each other in the upper and lower portions of the blocks. Furthermore, the left and right portions of the R color block 301 and the second G color block 304 overlap each other.

On the other hand, to explain with reference to the circuit diagram of FIG. 5, each of the N pixel portions 30 in the block of the same color is connected to the block signal line 60 corresponding to the block in the wiring layer 72 (FIG. 3). .. Therefore, the output terminals of the selection transistors SEL of the N pixel units 30 in the block of the same color are connected to each other. As a matter of course, it is not connected to the block signal line 60 of the block of another color. As described above, the wiring connected to the block signal line 60 in the block of the same color is formed from the wiring 61 to the wiring 64 in the wiring layer 72.
In the present embodiment, wiring is performed in different layers of the wiring layer 72 depending on the color of the block so that the wiring in the block does not come into contact with the blocks of other colors that spatially overlap in the pixel area 201 (FIG. 2). ..
The first G color block 303 and the second G color block 304 are treated as different colors for convenience. Further, "spatial overlap" means a relationship in which upper and lower parts or left and right parts overlap with blocks of different colors in FIG.

7 (a) to 7 (d) are schematic views illustrating wiring of each color. FIG. 7A is a diagram illustrating the wiring 61 of the block signal line 60 connecting the outputs of the selection transistors SEL of the R pixels of the R color block 301 to each other. The wiring 61 is shaded. FIG. 7B is a diagram illustrating wiring 62 of the block signal line 60 connecting the outputs of the B pixel selection transistors SEL of the B color block 302 to each other. The wiring 62 is indicated by vertical stripes.

FIG. 7C is a diagram illustrating wiring 63 of the block signal line 60 connecting the outputs of the selection transistors SEL of the G pixel of the first G color block 303 to each other. The wiring 63 is indicated by dots. FIG. 7D is a diagram illustrating the wiring 64 of the block signal line 60 that connects the outputs of the selection transistors SEL of the G pixels of the second G color block 304. The wiring 64 is indicated by horizontal stripes.

The wirings 61 to 64 are formed in different layers in the wiring layer 72. In this way, the wiring layers 72 form different wirings 61 to 64 for each color, and the pixel portions 30 in the blocks of each color are connected by wiring by the wirings 61 to 64. Therefore, the blocks in the pixel area 201 are connected to the blocks of other colors. In the case of spatial overlap, only the pixel portions 30 in the blocks of the same color can be appropriately connected in each block. The wiring in FIG. 7 has a "day" shape.
As shown in FIGS. 7 (a) to 7 (d), the wirings 61 to 64 are point-symmetric with respect to the pixel portion 30 located at the center of the blocks 301 to 304 of each color. Further, the wirings 61 to 64 are line-symmetric with respect to a straight line in the horizontal direction (row direction) or the vertical direction (column direction) passing through the pixel portion 30 located at the center of the blocks 301 to 304 of each color.

In the blocks 301 to 304 described above, the centroids of the N pixel portions 30 in the blocks 301 to 304 of each color are referred to as color centroids. In the present embodiment, the position of the pixel unit 30 located at the center of the nine pixel units 30 constituting the blocks 301 to 304 of each color is the color center of gravity of the blocks 301 to 304. In FIGS. 6 and 7, the pixel portion 30 corresponding to the color center of gravity of this example is displayed in a different manner. That is, the color center of gravity of the R color block 301 is shaded, the color center of gravity of the B color block 302 is indicated by vertical stripes, the color center of gravity of the first G color block 303 is indicated by dots, and the color center of gravity of the second G color block 304 is indicated by dots. The color center of gravity is indicated by horizontal stripes. Focusing on the color center of gravity of each block 301 to 304 in FIG. 6, it can be seen that the array is Bayer. This means that when binning is performed by the first pixel portions 30x-1 to 30x-N in the blocks 301 to 304 of each color, the signals after binning maintain the Bayer arrangement. According to the present embodiment, the color centers of gravity of the blocks 301 to 304 of each color are arranged at equal intervals, and the color centers of gravity are not biased.

The positions where the bonding pads 75 are provided in the blocks 301 to 304 of each color are preferably provided in the vicinity of the N pixel portions 30, but are not necessarily provided at the positions of the color centers of gravity.

According to the above-described embodiment, the following effects can be obtained.
(1) In the image sensor 101, the pixel area 201 in which a plurality of pixels 30 for photoelectric conversion of light are arranged in the row direction (x-axis direction) and the column direction (y-axis) and the pixel area 201 have a common wavelength range. A plurality of blocks 301 to 304 subdivided into a plurality of pixels 30 for photoelectric conversion of light, a plurality of signal lines 210 provided in each of the plurality of blocks 301 to 304, and a plurality of blocks 301 to 304, respectively. A block signal line 60 for connecting a plurality of pixels 30 for each block 301 to 304 is provided.
Since each block 301 to 304 is composed of a plurality of pixels 30 that photoelectrically convert light in a common wavelength range, signal binning of the same color can be easily performed simply by adding the signals in each block 301 to 304. .. For example, the signal binning process of the same color becomes overwhelmingly simpler than the conventional technique in which pixels for photoelectric conversion of light in different wavelength ranges are mixed in the block.
Further, since the signal lines 210 are provided for each block 301 to 304, signals for each color can be output in parallel. For example, when pixels that photoelectrically convert light in different wavelength ranges coexist in the block, the signal for each color can be output in a short time as compared with the case where the signal is output in a time division manner.

(2) In the image sensor 101, the block signal line 60 is connected to the signal line 210 corresponding to the blocks 301 to 304, and each of the plurality of pixels 30 in the blocks 301 to 304 is an output terminal of the amplification transistor SF of the pixel 30. It is provided with a selection transistor SEL that connects or disconnects between the block signal line 60 and the block signal line 60. With this configuration, it is possible to output the signals of all the pixels 30 in the blocks 301 to 304 to the signal line 210, or to output only the signals of any pixel 30 in each block to the signal line 210.

(3) In the image sensor 101, in the pixel area 201, a plurality of pixels 30 that photoelectrically convert light in different wavelength regions are repeatedly arranged in the row direction and the column direction. Then, the blocks 301 to 304 are within a range of 2 pixels (5 pixels) from the pixel portion 30 (referred to as a pixel of interest) that photoelectrically converts light in the wavelength region corresponding to red (R) in FIG. 6, for example, in the pixel area 201. It is composed of pixels 30 that photoelectrically convert light in the same wavelength range as the pixel of interest at (x5 pixels). Since it is configured in this way, for example, the R pixel and the vicinity of the R pixel are centered on the pixel portion 30 (referred to as a pixel of interest) that photoelectrically converts light in the wavelength region corresponding to red (R) in FIG. The R color block 301 can be configured by using the located R pixels. The same applies to the B color block 302, the first G color block 303, and the second G color block 304.

(4) In the image sensor 101, the blocks 301 to 304 are centered in the pixel area 201, for example, the pixel portion 30 (referred to as a pixel of interest) that photoelectrically converts light in the wavelength region corresponding to red (R) in FIG. The R color block 301 is composed of nine R pixels including the R pixel and eight R pixels surrounding the R pixel. The same applies to the B color block 302, the first G color block 303, and the second G color block 304.
With this configuration, when the R pixels, G pixels, and B pixels are Bayer-arranged, the color center of gravity of blocks 301 to 304 also keeps the Bayer arrangement. Therefore, the Bayer arrangement can be arranged regardless of the presence or absence of binning. The assumed image processing engine can be used as it is.

(5) In the image sensor 101, the plurality of blocks 301 to 304 are spatially overlapped in the pixel area 201. The density of the center of gravity of the blocks can be increased as compared with the case where the blocks do not overlap spatially.

(6) The image pickup device 101 includes a wiring layer 72 for connecting the block signal line 60. Then, among the plurality of blocks 301 to 304, the block signal line 60 of the R color block 301 having the plurality of pixels 30 that photoelectrically convert light in the wavelength region of red (R), for example, is the first layer of the wiring layer 72. The block signal line 60 of the B color block 302, which is connected by the wiring 61 (FIG. 7A) and has a plurality of pixels 30 that photoelectrically convert light in the wavelength region of blue (B), is the second wiring layer 72. Layers are connected by wiring 62 (FIG. 7 (b)). Further, the block signal line 60 of the first G color block 303 having a plurality of pixels 30 that photoelectrically convert light in the green (G) wavelength region is the wiring 63 of the third layer of the wiring layer 72 (FIG. 7 (FIG. 7). The block signal line 60 of the second G color block 304, which is connected by c)) and has a plurality of pixels 30 that photoelectrically convert light in the green (G) wavelength region, is the wiring of the fourth layer of the wiring layer 72. It is connected by 64 (FIG. 7 (d)).
With this configuration, the block signal lines 60 in each of the blocks 301 to 304 can be appropriately connected so as not to come into contact with the block signal lines 60 of blocks of other colors that overlap spatially.

The following modifications are also within the scope of the present invention, and one or more of the modifications can be combined with the above-described embodiment.
(Modification example 1)
In the first modification, the wiring in the block is divided so that the wiring in the block does not come into contact with the wiring in the blocks of other colors that overlap spatially in the pixel area 201, and wiring for two colors is performed in one layer of the wiring layer. As in the above embodiment, the first block of G color and the second block of G color are treated as different colors for convenience.

8 (a) and 8 (b) are schematic views illustrating wiring of each color according to the first modification. In the first modification, for example, as illustrated in FIG. 8A, the wiring 61-1 connecting the R pixels of the R color block and the wiring 61-2 connecting the B pixels of the B color block are in the same layer. Form. Wiring 61-1 is shaded. Wiring 61-2 is indicated by vertical stripes.
Further, as illustrated in FIG. 8B, the wiring 62-1 connecting the G pixels of the first block of G color and the wiring 62-2 connecting the G pixels of the second block of G color are the same. Form in layers.
Wiring 62-1 is indicated by dots. Wiring 62-2 is indicated by horizontal stripes.
Wiring 61-1 and 61-2 and wiring 62-1 and 62-2 are formed in different layers in the wiring layer 72.

By wiring in this way, the number of layers formed in the wiring layer 72 for wiring connection of the pixel portion 30 in the block is reduced from 4 to 2, and the cost is reduced, as compared with the wiring of the above embodiment (FIG. 7). Can be suppressed.
Further, even if the number of layers formed in the wiring layer 72 is reduced in this way, when the blocks spatially overlap with the blocks of other colors in the pixel area 201, only the pixel portion 30 in the blocks of the same color is appropriate in each block. Can be connected to.
As shown in FIGS. 8 (a) and 8 (b), the wirings 61-1, 2 to 62-1 and 2 are point-symmetric with respect to the pixel portion 30 located at the center of the blocks 301 to 304 of each color. Is. Further, the wirings 61-1, 2 to 62-1, and 2 are for straight lines in the horizontal direction (row direction) or the vertical direction (column direction) passing through the pixel portion 30 located at the center of the blocks 301 to 304 of each color. It is line symmetric.

According to the above-mentioned modification 1, the following effects can be obtained. That is, the image sensor 101 includes a wiring layer 72 for connecting the block signal line 60. Then, among the plurality of blocks 301 to 304, for example, the block signal line 60 of the R color block 301 having the plurality of pixels 30 for photoelectric conversion of light in the red (R) wavelength region and the blue (B) wavelength region. The block signal line 60 of the B color block 302 having a plurality of pixels 30 for photoelectric conversion of light is connected by wiring 61-1 and wiring 61-2 of the same layer of the wiring layer 72, respectively (FIG. 8A). ). By wiring in this way, the number of layers used can be reduced from 2 to 1 and the cost can be suppressed as compared with the case where two wiring layers 72 are used to connect the block signal lines 60 by wiring in the blocks 301 and 302. be able to.

Further, the block signal line 60 of the first G color block 303 having a plurality of pixels 30 for photoelectric conversion of light in the green (G) wavelength region, and a plurality of light in the green (G) wavelength region by photoelectric conversion. The block signal line 60 of the second G color block 304 having the pixel 30 is connected by the wiring 62-1 and the wiring 62-2 of the same layer of the wiring layer 72, respectively (FIG. 8B). By wiring in this way, the number of layers used can be reduced from 2 to 1 and the cost can be suppressed as compared with the case where two wiring layers 72 are used for wiring and connecting the block signal lines 60 in the blocks 303 and 304. be able to.

Further, reducing the number of layers using the wiring layer 72 also leads to a reduction in the number of vias for connecting the layers, so that it is possible to obtain an advantage of suppressing variation in the impedance of the wiring. The wiring in FIG. 8 has a "king" shape.

(Modification 2)
In the second modification, the wiring in the block is divided so that the wiring in the block does not come into contact with the wiring between blocks of other colors that are spatially overlapped in the pixel area 201, and wiring for four colors is performed in one layer of the wiring layer. As in the above embodiment and the first modification, the first block of the G color and the second block of the G color are treated as different colors for convenience.

FIG. 9 is a schematic diagram illustrating wiring of each color according to the second modification. In the second modification, starting from the pixel portion 30 located at the center of the block, the pixel portions 30 are connected and wired in a spiral shape. For example, the R pixel located at the center of the R color block 301 is connected by wiring 61-1 from the R pixel located at the center of the R color block 301 to the R pixel separated by 2 pixel pitches in the upward direction, and further connected to the R pixel separated by 2 pixel pitches in the right direction by wiring 61-1. .. Subsequently, the R pixel located at the center of the R color block 301 is connected by wiring 61-1 from the R pixel located at the center of the R color block 301 to the R pixel having a pitch of 2 pixels to the right, and further to the R pixel having a pitch of 2 pixels to the downward. Connect with 1.

Similarly, the R pixel located at the center of the R color block 301 is connected by wiring 61-1 from the R pixel located at the center of the R color block 301 to the R pixel having a pitch of 2 pixels downward, and further to the R pixel having a pitch of 2 pixels to the left. Connect with 1. Further, the R pixel located at the center of the R color block 301 is connected by wiring 61-1 from the R pixel located at the center of the R color block 301 to the R pixel separated by 2 pixel pitches to the left, and further wired to the R pixel separated by 2 pixel pitches upward. Connect with -1. Wiring 61-1 in the R color block is shaded.

Similarly, for the first G color block 303, the second G color block 304, and the B color block 302, the pixel portions 30 of the same color are connected from the pixel portion 30 located at the center of each block. Wire. In FIG. 9, the wiring 61-2 in the B color block is indicated by vertical stripes. Further, the wiring 61-3 in the first G color block is indicated by a dot. Further, the wirings 61-4 in the second G color block are indicated by horizontal stripes. The wirings 61-1 to 61-4 of each color are formed in the same layer of the wiring layer 72. As shown in FIG. 9, the wirings 61-1 to 61-4 are point-symmetric with respect to the pixel portion 30 located at the center of the block of each color.

By wiring in this way, the number of layers formed in the wiring layer 72 for wiring connection of the pixel portion 30 in the block can be reduced from 2 to 1, and the cost can be suppressed as compared with the above-mentioned modification 1.
Further, even if the number of layers formed in the wiring layer 72 is reduced in this way, when the blocks spatially overlap with the blocks of other colors in the pixel area 201, only the pixel portion 30 in the blocks of the same color is appropriate in each block. Can be connected to.

According to the above-mentioned modification 2, the following effects can be obtained. That is, the block signal line 60 of the image pickup element 101 is the first pixel area 201, which is separated from the attention pixel (for example, R pixel) of the R color block 301 by two pixel pitches in the row direction by the wiring 61-1. A pixel (R pixel) and a second pixel (R pixel) separated by two pixel pitches in the column direction from the first pixel (R pixel) are connected to each other, and a noteworthy pixel (R pixel) and a noteworthy pixel (R pixel) are connected. The third pixel (R pixel), which is two pixel pitches away from the pixel) in the column direction, and the fourth pixel (R pixel), which is two pixel pitches apart from the third pixel (R pixel) in the row direction, are connected to each other. By making such a connection, the pixel of interest and the R pixel surrounding the pixel of interest are connected to each other in the R color block 301.

The B color block 302, the first G color block 303, and the second G color block 304 are also connected in the same manner. That is, the B color block 302 is connected by the wiring 61-2, the first G color block 303 is connected by the wiring 61-3, and the second G color block 304 is connected by the wiring 61-4. With this configuration, it is only necessary to use one wiring layer 72 for wiring and connecting the block signal line 60, and the cost can be further reduced as compared with the case of the first modification.
In addition, since the number of vias for connecting the layers can be reduced, it is possible to obtain the merit of suppressing the variation in the impedance of the wiring.

(Modification 3)
In the first modification and the second modification, the blocks 301 to 304 are in the range of 2 pixels from the pixel of interest in the pixel area 201 (the size of the block is 5 pixels in the row direction x 5 pixels in the column direction) and have the same wavelength range as the pixel of interest. Although it is composed of pixels 30 that photoelectrically convert the light of the above, the size of the block may be further increased.

FIG. 10 is a schematic diagram illustrating wiring of each color according to the modified example 3. In FIG. 10, for example, the pixel unit 30 (referred to as a pixel of interest) that photoelectrically converts light in the wavelength region corresponding to red (R) is centered on the R pixel and 24 R pixels surrounding the R pixel. The R color block 301 is composed of 25 R pixels. That is, the pixel area 201 is composed of pixels 30 that photoelectrically convert light in the same wavelength range as the pixel of interest within a range of 4 pixels from the pixel of interest (the size of the block is 9 pixels in the row direction x 9 pixels in the column direction). In this way, even when the block size is increased, wiring can be performed by connecting the pixel portions 30 in a spiral shape starting from the pixel portion 30 located at the center of the block. As shown in FIG. 10, the wirings 61-1 to 61-4 are point-symmetric with respect to the pixel portion 30 located at the center of the block of each color.

(Modification example 4)
When the size of the block is further increased, it becomes difficult to connect the pixel portions 30 in the block to each other only by using one wiring layer 72. In such a case, the wiring layer 72 may be used for two layers. For example, a small block of 9 pixels in the row direction × 9 pixels in the column direction as illustrated in FIG. 10 is combined with three in the row direction and three in the column direction to form a large block. In this case, one wiring layer 72 is used for the wiring (referred to as local wiring) connecting the pixel portions 30 in each small block. Then, another layer of the wiring layer 72 is used for the wiring (referred to as global wiring) connecting the nine pixel portions 30 located at the center of the nine small blocks. Similar to the local wiring, the global wiring starts from the pixel portion 30 located at the center of the large block and connects the pixel portions 30 located at the center of the small block in a spiral shape.

According to the fourth modification, even if the wiring layout of the block signal line 60 becomes complicated due to the increase in the size of the block, different layers of the wiring layer 72 are used for the local wiring and the global wiring. Therefore, the pixel portion 30 in the block can be appropriately connected while suppressing the number of layers used in the wiring layer 72.

In the above description, an example in which the image sensor 101 is mounted on a digital camera has been described, but the image sensor 101 may be mounted on an electronic device such as a smartphone, a tablet terminal, or a wearable terminal in addition to the digital camera.

Although various embodiments and modifications have been described above, the present invention is not limited to these contents. Other aspects conceivable within the scope of the technical idea of the present invention are also included within the scope of the present invention.
For example, as the shape of the wiring point-symmetrical to the pixel portion 30 located at the center of the block of each color, the above-mentioned "day" -shaped, "king" -shaped, and spiral-shaped wiring are illustrated, but the "N" shape is illustrated. The wiring may be in a shape, a "Z" shape, or an "H" shape. Further, as the shape of the wiring line-symmetrical with respect to the pixel portion 30 located at the center of the block of each color, the above-mentioned "day" -shaped or "king" -shaped wiring is illustrated, but the wiring is "H" -shaped. You may.

The disclosure content of the next priority basic application is incorporated here as a quotation.
Japanese Patent Application No. 192212, 2017 (filed on September 29, 2017)

30 ... Pixel unit 30x-1 to 30x-N ... First pixel unit 60 ... Block signal line 61-64 ... Wiring 71 ... PD layer 72 ... Wiring layer 73 ... Color filter 100 ... Camera body 101 ... Image sensor 102 ... Body control Unit 201 ... Pixel area 204 ... Output unit 205 ... Control unit 210 ... Signal line 301-304 ... Block PD ... Photodiode SEL ... Selective transistor SF ... Amplification transistor Tx ... Transfer transistor

Claims (15)

A plurality of first photoelectric conversion units arranged in the first direction and the second direction by photoelectric conversion of the light transmitted through the first transmission unit that transmits light in the first wavelength region to generate an electric charge.
A plurality of second photoelectric conversion units arranged in the first direction and the second direction by photoelectric conversion of the light transmitted through the second transmission unit that transmits light in the second wavelength region to generate an electric charge.
A first signal line having point-symmetrical or line-symmetrical wiring and outputting a signal based on the charges generated by the plurality of first photoelectric conversion units, and
A second signal line having point-symmetrical or line-symmetrical wiring and outputting a signal based on the charges generated by the plurality of second photoelectric conversion units, and
An image sensor comprising. In the image pickup device according to claim 1,
An image pickup device including a wiring layer in which the first signal line and the second signal line are arranged. A plurality of first photoelectric conversion units arranged in the first direction and the second direction by photoelectric conversion of the light transmitted through the first transmission unit that transmits light in the first wavelength region to generate an electric charge.
A plurality of second photoelectric conversion units arranged in the first direction and the second direction by photoelectric conversion of the light transmitted through the second transmission unit that transmits light in the second wavelength region to generate an electric charge.
A first signal line to which a signal based on the electric charge generated by the plurality of first photoelectric conversion units is output, and
A second signal line that outputs a signal based on the electric charges generated by the plurality of second photoelectric conversion units, and
A wiring layer in which the first signal line and the second signal line are arranged, and
An image sensor comprising. In the image pickup device according to claim 3,
The first signal line and the second signal line are image pickup devices having point-symmetrical or line-symmetrical wiring. In the image pickup device according to any one of claims 2 to 4.
With a plurality of the wiring layers,
The first signal line and the second signal line are image pickup devices arranged in the first wiring layer among the plurality of wiring layers. In the image pickup device according to claim 5,
The first signal line is an image pickup device arranged in a region where the second signal line is not provided in the first wiring layer. In the image pickup device according to any one of claims 1 to 6.
As the first signal line, a signal obtained by adding signals based on charges generated by the plurality of first photoelectric conversion units is output.
The second signal line is an image pickup device that outputs a signal obtained by adding signals based on charges generated by a plurality of the second photoelectric conversion units. In the image pickup device according to any one of claims 1 to 7.
A plurality of first pixel groups each having a plurality of the first photoelectric conversion units, and
A plurality of second pixel groups each having a plurality of the second photoelectric conversion units are provided.
An image pickup device in which the center of gravity of each of the plurality of first pixel groups and the center of gravity of each of the plurality of second pixel groups are arranged at equal intervals. In the image pickup device according to any one of claims 1 to 8.
A first substrate having a plurality of the first photoelectric conversion units, a plurality of the second photoelectric conversion units, the first signal line, and the second signal line.
A first processing unit that processes a signal output by the first signal line and a second processing unit that processes a signal output by the second signal line, and is laminated with the first substrate. An image sensor including two substrates. In the image pickup device according to any one of claims 1 to 8.
A first substrate having a plurality of the first photoelectric conversion units and a plurality of the second photoelectric conversion units,
It has a plurality of wiring layers, a first processing unit that processes a signal output by the first signal line, and a second processing unit that processes a signal output by the second signal line. The second substrate laminated with the substrate and
An image sensor comprising. In the image pickup device according to claim 9 or 10.
A first connection line including the first signal line and connecting the first photoelectric conversion unit and the first processing unit, and
A second connection line including the second signal line and connecting the second photoelectric conversion unit and the second processing unit is provided.
An image sensor in which the length of the first connecting line and the length of the second connecting line are substantially the same. In the image pickup device according to any one of claims 1 to 11.
A plurality of third photoelectric conversion units arranged in the first direction and the second direction by photoelectric conversion of the light transmitted through the third transmission unit that transmits light in the third wavelength region to generate an electric charge.
A third signal line that outputs a signal based on the electric charge generated by the plurality of third photoelectric conversion units and is arranged in a wiring layer in which the first signal line and the second signal line are arranged, and
An image sensor comprising. In the image pickup device according to claim 12,
The third signal line is an image sensor having point-symmetrical or line-symmetrical wiring. In the image pickup device according to claim 12 or 13.
The first photoelectric conversion unit, the second photoelectric conversion unit, and the third photoelectric conversion unit are image pickup devices arranged based on a Bayer arrangement. The image sensor according to any one of claims 1 to 14.
A generator that generates image data based on the signal output from the image sensor,
An imaging device comprising.

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