JPWO2018151131A1 - 接着剤フィルム - Google Patents
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- JPWO2018151131A1 JPWO2018151131A1 JP2018568551A JP2018568551A JPWO2018151131A1 JP WO2018151131 A1 JPWO2018151131 A1 JP WO2018151131A1 JP 2018568551 A JP2018568551 A JP 2018568551A JP 2018568551 A JP2018568551 A JP 2018568551A JP WO2018151131 A1 JPWO2018151131 A1 JP WO2018151131A1
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0831—Gold
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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Abstract
Description
フェノキシ樹脂(ユニオンカーバイド株式会社製、製品名:PKHC、重量平均分子量:45000)50gを、トルエン(沸点:110.6℃)と酢酸エチル(沸点:77.1℃)との混合溶剤(質量比でトルエン:酢酸エチル=1:1)に溶解して、固形分40質量%のフェノキシ樹脂溶液を得た。このフェノキシ樹脂溶液に、ラジカル重合性物質として、ウレタンアクリレート(根上工業株式会社製、製品名:UN7700)及びリン酸エステルジメタクリレート(共栄社化学株式会社製、製品名:ライトエステルP−2M)と、硬化剤として1,1−ビス(t−ヘキシルパーオキシ)−3,3,5−トリメチルシクロヘキサン(日本油脂株式会社製、製品名:パーヘキサTMH)とを、フェノキシ樹脂:ウレタンアクリレート:リン酸エステルジメタクリレート:硬化剤=10:10:3:2の固形質量比で配合し溶液A1を得た。
ジビニルベンゼン、スチレンモノマー及びブチルメタクリレートの混合溶液に、重合開始剤としてベンゾイルパーオキサイドを投入して、高速で均一撹拌しながら加熱して重合反応を行うことで微粒子分散液を得た。この微粒子分散液を濾過し減圧乾燥することで、微粒子の凝集体であるブロック体を得た。さらに、このブロック体を粉砕することで、それぞれ架橋密度の異なる平均粒子径20μmの核体(樹脂粒子)を作製した。
上記の核体の表面に、パラジウム触媒(ムロマチテクノス株式会社製、製品名:MK−2605)を担持させて、促進剤(ムロマチテクノス株式会社製、製品名:MK−370)を用いて核体を活性化させた。この核体を、60℃に加温された、硫酸ニッケル水溶液、次亜燐酸ナトリウム水溶液及び酒石酸ナトリウム水溶液の混合液中に投入して、無電解メッキ前工程を行った。この混合物を20分間撹拌し、水素の発泡が停止するのを確認した。次に、硫酸ニッケル、次亜リン酸ナトリウム、クエン酸ナトリウム及びメッキ安定剤の混合溶液を添加し、pHが安定するまで撹拌し、水素の発泡が停止するまで無電解メッキ後工程を行った。続いて、メッキ液を濾過し、濾過物を水で洗浄した後、80℃の真空乾燥機で乾燥してニッケルメッキされた導電粒子C1(第2の導電粒子)を作製した。
<接着剤組成物のフィルム化>
100体積部の溶液A1に対して、45体積部の導電粒子B1を分散させて、混合溶液を得た。得られた混合溶液を、厚み80μmのフッ素樹脂フィルム上に塗布し、70℃で10分間熱風乾燥することにより溶剤を除去して、フッ素樹脂フィルム上に形成された厚み10μmのフィルム状の接着剤組成物(第1の接着剤層)を得た。
実施例1と同様にして、第1の接着剤層及び第2の接着剤層を作製した。また、第3の接着剤層として、第1の接着剤層と同一の接着剤層を作製した。実施例1と同様にして、第2の接着剤層に第1の接着剤層をラミネートした後、第2の接着剤層上のフッ素樹脂フィルムを剥がしてから、第2の接着剤層の第1の接着剤層とは反対側の面上に第3の接着剤層をラミネートし、フッ素樹脂フィルムを剥がして、厚み40μmの接着剤フィルムを得た。
100体積部の溶液A1に対して、15体積部の導電粒子C1を分散させて、混合溶液を得た。得られた混合溶液を、厚み80μmのフッ素樹脂フィルム上に塗布し、70℃で10分間熱風乾燥することにより溶剤を除去して、フッ素樹脂フィルム上に形成された厚み40μmのフィルム状の接着剤組成物を得た。
100体積部の溶液A1に対して、30体積部の導電粒子C1を分散させて、混合溶液を得た。得られた混合溶液を、厚み80μmのフッ素樹脂フィルム上に塗布し、70℃で10分間熱風乾燥することにより溶剤を除去して、フッ素樹脂フィルム上に形成された厚み40μmのフィルム状の接着剤組成物を得た。
100体積部の溶液A1に対して、45体積部の導電粒子B1と15体積部の導電粒子C1を分散させて、混合溶液を得た。得られた混合溶液を、厚み80μmのフッ素樹脂フィルム上に塗布し、70℃で10分間熱風乾燥することにより溶剤を除去して、フッ素樹脂フィルム上に形成された厚み30μmのフィルム状の接着剤組成物を得た。
図5(a),(b)に示すように、6mm×6mmに切り出した接着剤フィルム21を、6mm×50mmの銅箔22の略中央に配置し、株式会社大橋製作所製BD−07を用いて加熱加圧(50℃、0.5MPa、2秒間)を行って貼り付けた。続いて、図5(c),(d)に示すように、50mm×6mmのアルミ箔23を用意し、銅箔22と接着剤フィルム21との積層体に対して接着剤フィルム21を覆うように重ねて、株式会社大橋製作所製BD−07で加熱加圧(150℃、0.5MPa、10秒間)を行って、信頼性試験用の実装体を得た。
得られた実装体に対して、図6に示すように電流計、電圧計を接続し、4端子法で接続抵抗(初期)を測定した。また、エスペック株式会社製TSA−43ELを使用して、−20℃で30分間保持、10分間かけて100℃まで昇温、100℃で30分間保持、10分間かけて−20℃まで降温、というヒートサイクルを500回繰り返すヒートサイクル試験を実装体に対して行った後に、上記と同様にして接続抵抗(ヒートサイクル試験後)を測定した。
Claims (7)
- デンドライト状の導電粒子である第1の導電粒子を含有する第1の接着剤層と、
前記第1の導電粒子以外の導電粒子であって、非導電性の核体及び該核体上に設けられた導電層を有する導電粒子である第2の導電粒子を含有する第2の接着剤層と、を備える接着剤フィルム。 - 前記第1の接着剤層が前記第2の導電粒子を更に含有し、
前記第1の接着剤層に占める前記第2の導電粒子の体積割合が、前記第2の接着剤層に占める前記第2の導電粒子の体積割合より小さい、請求項1に記載の接着剤フィルム。 - 前記第1の接着剤層が前記第2の導電粒子を含有しない、請求項1に記載の接着剤フィルム。
- 前記第1の接着剤層と、前記第2の接着剤層と、第3の接着剤層と、をこの順に備え、
前記第3の接着剤層が、デンドライト状の導電粒子である第3の導電粒子を含有する、請求項1〜3のいずれか一項に記載の接着剤フィルム。 - 前記第3の接着剤層が前記第2の導電粒子を更に含有し、
前記第3の接着剤層に占める前記第2の導電粒子の体積割合が、前記第2の接着剤層に占める前記第2の導電粒子の体積割合より小さい、請求項4に記載の接着剤フィルム。 - 前記第3の接着剤層が前記第2の導電粒子を含有しない、請求項4に記載の接着剤フィルム。
- 前記導電層が、金、ニッケル及びパラジウムからなる群より選ばれる少なくとも1種を含有する、請求項1〜6のいずれか一項に記載の接着剤フィルム。
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US (1) | US11242472B2 (ja) |
JP (2) | JPWO2018151131A1 (ja) |
KR (1) | KR102457667B1 (ja) |
CN (1) | CN110312770A (ja) |
TW (1) | TWI795388B (ja) |
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CN110312770A (zh) | 2019-10-08 |
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WO2018151131A1 (ja) | 2018-08-23 |
TW201833941A (zh) | 2018-09-16 |
US11242472B2 (en) | 2022-02-08 |
US20190367782A1 (en) | 2019-12-05 |
KR20190113956A (ko) | 2019-10-08 |
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