JPWO2018101233A1 - Resistance measuring device and resistance measuring method - Google Patents

Abstract

The current supply part CS for supplying the supply current Io to the supply side conductive part which is one of the conductive parts P, and the pull-in current Ii is drawn from the lead side conductive part which is one of the conductive parts. Supply side for detecting a supply side voltage V1 which is a voltage between a current measurement unit CM for supply and a voltage measurement conductive unit which is a conductive unit different from the supply side conductive unit and the lead side conductive unit and the supply side conductive unit Based on the voltage detection unit VM1, the pull-in side voltage detection unit VM2 that detects the pull-in side voltage V2, which is the voltage between the voltage measurement conductive unit and the pull-in side conductive unit, and the supply current Io and the supply side voltage V1 A resistance calculation unit 22 that calculates a resistance value of a connection part that is paired with the supply-side conductive part, and calculates a resistance value of the connection part that is paired with the lead-side conductive part based on the pull-in current Ii and the pull-in side voltage V2. Equipped with.

Description

  The present invention relates to a resistance measuring apparatus and a resistance measuring method for measuring the resistance of a substrate.

  Conventionally, when a measurement object that penetrates from one surface of the circuit board to the other surface, such as a via formed in the circuit board, is used, a measurement current is supplied to the measurement object, and the measurement object There is known a substrate inspection apparatus that measures a resistance value of a measurement target from a current value and a voltage value by measuring a voltage generated in (see, for example, Patent Document 1).

JP 2012-117991 A

  By the way, in a substrate provided with a conductor that expands in a planar shape (hereinafter referred to as a planar conductor), conductive portions such as pads, bumps, and wiring on the substrate surface and the planar conductor are electrically connected in the thickness direction of the substrate. There is a substrate with a connected structure. 7 and 8 are conceptual schematic diagrams showing an example of such a substrate.

  FIG. 7 is a conceptual schematic diagram showing a multilayer substrate WB, which is an example of a substrate having a planar inner layer pattern IP on the substrate inner layer. The multilayer substrate WB shown in FIG. 7 has conductive portions PA and PB such as pads and wiring patterns formed on the substrate surface BS. The conductive portions PA and PB are electrically connected to the inner layer pattern IP by connection portions RA and RB such as vias and wiring patterns. In the example of the multilayer substrate WB, the inner layer pattern IP corresponds to a planar conductor.

  Also, as a substrate manufacturing method, a printed metal board is laminated on both sides of a conductive metal plate as a base, and the two printed wirings are peeled off from the base metal plate. There is a method of forming a substrate. In such a substrate manufacturing method, the substrate (hereinafter referred to as an intermediate substrate) in a state before the substrate is peeled off from the base metal plate has an aspect in which the metal plate is sandwiched between two substrates. .

  FIG. 8 is a conceptual schematic diagram showing an example of such an intermediate substrate B. As shown in FIG. In the intermediate substrate B shown in FIG. 8, the substrate WB1 is formed on one surface of the metal plate MP, and the substrate WB2 is formed on the other surface of the metal plate MP. Conductive portions PA1, PB1,..., PZ1 such as pads and wiring patterns are formed on the substrate surface BS1 of the substrate WB1. Conductive portions PA2, PB2,..., PZ2 such as pads and wiring patterns are formed on the contact surface BS2 of the substrate WB1 with the metal plate MP. The metal plate MP is a conductive metal plate having a thickness of about 1 mm to 10 mm, for example.

  The conductive portions PA1 to PZ1 are electrically connected to the conductive portions PA2 to PZ2 through connection portions RA to RZ such as vias and wiring patterns. Since the conductive portions PA2 to PZ2 are in close contact with and conductive with the metal plate MP, the conductive portions PA1 to PZ1 are electrically connected to the metal plate MP through the connection portions RA to RZ. The conductive portion PA1 and the connection portion RA are paired, the conductive portion PB1 and the connection portion RB are paired, and the conductive portion and the connection portion are respectively paired. Since the substrate WB2 is configured in the same manner as the substrate WB1, its description is omitted. In the example of the intermediate substrate B, the metal plate MP corresponds to a planar conductor.

  As an inspection of the multilayer substrate WB, the intermediate substrate B, etc., the resistance values Ra to Rz of the connection portions RA to RZ may be measured.

  FIG. 9 is an explanatory diagram for explaining a measurement method for measuring the resistance values Ra and Rb of the connection portions RA and RB of the intermediate substrate B shown in FIG. In order to measure the resistance values Ra and Rb of the connection parts RA and RB, a current I for measurement is passed between the conductive part PA1 and the conductive part PB1, and a voltage generated between the conductive part PA1 and the conductive part PB1. It is conceivable to measure V and calculate the resistance value as V / I. In this case, the resistance value calculated by V / I is Ra + Rb.

  However, there is a need to individually measure the resistance value of each connection portion, not the total resistance value of the two connection portions.

  An object of the present invention is to electrically connect a conductive planar conductor extending in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion to the planar conductor. Another object of the present invention is to provide a resistance measuring device and a resistance measuring method capable of individually measuring the resistance of each connecting portion of a substrate to be measured having a pair with the connecting portion.

  A resistance measuring device according to one aspect of the present invention includes a conductive planar conductor that extends in a planar shape, a substrate surface that faces the planar conductor, a conductive portion provided on the substrate surface, and a conductive portion provided on the surface. A resistance measuring device for measuring the resistance of the connection portion of the substrate to be measured, which has a pair of connection portions electrically connected to the conductor and has three or more pairs. A current supply unit for supplying a preset supply current to a supply-side conductive unit that is one of the conductive units, and one of the conductive units that is different from the supply-side conductive unit A current drawing unit for drawing a preset drawing current from the drawing side conductive unit, and a voltage measuring conductive unit which is a conductive unit different from the supply side conductive unit and the drawing side conductive unit among the conductive units. The supply side voltage, which is the voltage between the supply part and the supply side conductive part Supply side voltage detection unit, a pull-in side voltage detection unit that detects a pull-in side voltage that is a voltage between the voltage measurement conductive unit and the pull-in side conductive unit, and the supply current and the supply side voltage. A resistance for calculating a resistance value of a connection part paired with the supply side conductive part on the basis of, and a resistance value of a connection part paired with the lead side conductive part on the basis of the pull-in current and the pull-in side voltage A calculation unit.

  Moreover, the resistance measuring method according to one aspect of the present invention includes a conductive planar conductor extending in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion. A resistance measuring method for measuring the resistance of the connection portion of a substrate to be measured that has a pair of connection portions electrically connected to the planar conductor and includes three or more pairs. A current supply step of supplying a preset supply current to a supply-side conductive portion that is one of the conductive portions, and one of the conductive portions that is different from the supply-side conductive portion A current drawing step for drawing a preset drawing current from the drawing-side conductive unit, and a voltage-measuring conductive unit that is different from the supply-side conductive unit and the drawing-side conductive unit among the conductive units; Detect a supply side voltage that is a voltage between the supply side conductive unit Based on a supply-side voltage detection step, a pull-in side voltage detection step of detecting a pull-in side voltage that is a voltage between the voltage measuring conductive portion and the pull-in side conductive portion, the supply current, and the supply-side voltage Calculating a resistance value of the connection part paired with the supply-side conductive part and calculating a resistance value of the connection part paired with the lead-side conductive part based on the pull-in current and the pull-in voltage. Process.

It is a schematic diagram which shows notionally the structure of the resistance measuring apparatus using the resistance measuring method which concerns on one Embodiment of this invention. FIG. 2 is a block diagram illustrating an example of an electrical configuration of a measurement unit illustrated in FIG. 1. It is a flowchart which shows an example of operation | movement of the resistance measuring apparatus shown in FIG. It is a flowchart which shows an example of operation | movement of the resistance measuring apparatus shown in FIG. It is explanatory drawing for demonstrating operation | movement of the resistance measuring apparatus shown in FIG. It is explanatory drawing for demonstrating operation | movement of the resistance measuring apparatus shown in FIG. It is a notional schematic diagram showing a multilayer substrate which is an example of a substrate having a planar inner layer pattern on the substrate inner layer. It is a notional schematic diagram showing an example of an intermediate substrate. It is explanatory drawing for demonstrating the measuring method which measures the resistance value of the intermediate | middle board | substrate shown in FIG.

  Embodiments according to the present invention will be described below with reference to the drawings. In addition, the structure which attached | subjected the same code | symbol in each figure shows that it is the same structure, The description is abbreviate | omitted. FIG. 1 is a schematic diagram conceptually showing the configuration of a resistance measuring apparatus 1 using a resistance measuring method according to an embodiment of the present invention. A resistance measuring apparatus 1 shown in FIG. 1 is an apparatus for measuring the resistance of a measurement target substrate to be measured. The resistance measuring device 1 may be a substrate inspection device that determines the quality of a measured substrate based on the measured resistance value.

  The substrate to be measured is, for example, an intermediate substrate or a multilayer substrate, a package substrate for a semiconductor package, a film carrier, a printed wiring substrate, a flexible substrate, a ceramic multilayer wiring substrate, an electrode plate for a liquid crystal display or a plasma display, and these substrates. It may be an intermediate substrate in the process of manufacturing. The multilayer substrate WB shown in FIG. 7 and the intermediate substrate B shown in FIG. 8 correspond to an example of the substrate to be measured. FIG. 1 shows an example in which an intermediate substrate B is attached to the resistance measuring apparatus 1 as a substrate to be measured. An arbitrary number of conductive portions PA1, PB1,..., PZ1 are provided. Hereinafter, the conductive portions PA1, PB1,..., PZ1 are collectively referred to as a conductive portion P.

  A resistance measuring device 1 shown in FIG. In the internal space of the housing 112, a substrate fixing device 110, a measurement unit 121, a measurement unit 122, a measurement unit moving mechanism 125, and a control unit 20 are mainly provided. The substrate fixing device 110 is configured to fix the intermediate substrate B to be measured at a predetermined position.

  The measurement unit 121 is located above the intermediate substrate B fixed to the substrate fixing device 110. The measurement unit 122 is located below the intermediate substrate B fixed to the substrate fixing device 110. The measurement parts 121 and 122 include measurement jigs 4U and 4L for bringing the probe into contact with the conductive part P formed on the intermediate substrate B.

  A plurality of probes Pr are attached to the measurement jigs 4U and 4L. The measurement jigs 4U and 4L arrange and hold a plurality of probes Pr so as to correspond to the arrangement of the conductive parts P to be measured formed on the surface of the intermediate substrate B. The measurement unit moving mechanism 125 appropriately moves the measurement units 121 and 122 within the housing 112 in accordance with a control signal from the control unit 20, and the probes Pr of the measurement jigs 4U and 4L are moved to the respective conductive units P of the intermediate substrate B. Contact.

  Note that the resistance measurement apparatus 1 may include only one of the measurement units 121 and 122. And the resistance measuring apparatus 1 may be made to invert the board | substrate to be measured, and to measure the both surfaces sequentially by any one measurement part.

  The control unit 20 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, and a ROM (Read Only Memory) that stores predetermined control programs. And a storage unit such as an HDD (Hard Disk Drive) and these peripheral circuits. And the control part 20 functions as the electroconductive part selection part 21 and the resistance calculation part 22, for example by running the control program memorize | stored in the memory | storage part.

  FIG. 2 is a block diagram illustrating an example of an electrical configuration of the measurement unit 121 illustrated in FIG. Note that the measurement unit 122 is configured in the same manner as the measurement unit 121, and thus the description thereof is omitted. The measurement unit 121 illustrated in FIG. 2 includes a plurality of measurement blocks M1 to Mn (n is a natural number), a scanner unit 31, and a plurality of probes Pr. The measurement blocks M1 to Mn correspond to an example of a set. Each of the measurement blocks M1 to Mn includes a current supply unit CS, a current drawing unit CM, a supply side voltage detection unit VM1, and a drawing side voltage detection unit VM2.

  The scanner unit 31 is a switching circuit configured using switching elements such as transistors and relay switches. The scanner unit 31 detects the voltage generated between the current terminals + F and −F for supplying the resistance measurement current I to the intermediate substrate B and the conductive portion P of the intermediate substrate B by the current I. There are n sets of terminals + S1, -S1, + S2, and -S2, and an arbitrary number of ground terminals G connected to the circuit ground. A plurality of probes Pr are electrically connected to the scanner unit 31. In response to a control signal from the control unit 20, the scanner unit 31 includes current terminals + F and -F, voltage detection terminals + S1, -S1, + S2, and -S2, a ground terminal G, and a plurality of probes Pr. Switch the connection relationship.

  The current supply unit CS has one end of the output terminal connected to the circuit ground and the other end connected to the current terminal + F. The current supply unit CS is a constant current circuit that supplies a preset supply current Io to the current terminal + F in accordance with a control signal from the control unit 20.

  The current drawing unit CM has one end connected to the current terminal -F and the other end connected to the circuit ground. The current drawing unit CM is a constant current circuit that draws a preset drawing current Ii from the current terminal -F to the circuit ground in accordance with a control signal from the control unit 20.

  An oxide film may be formed on the surface of each conductive portion P due to oxidation. When an oxide film is formed on the surface of the conductive portion P, the contact resistance with the probe Pr increases, and the accuracy of resistance measurement decreases. Such an oxide film can be removed by flowing a current equal to or higher than a predetermined oxide film removal current value. The oxide film removal current value is, for example, 20 mA. For the probe Pr, a rated current value is defined as an upper limit value of a current value that can flow without damaging the probe. The rated current value of the probe Pr is a current value less than 40 mA, for example, and is 30 mA, for example.

  The drawing current Ii and the supply current Io are set to, for example, 20 mA or more and 30 mA or less. This improves the accuracy of resistance measurement by removing the oxide film on the surface of the conductive portion P without damaging the probe Pr.

  It is preferable that the total of the supply currents Io supplied from the current supply units CS of the measurement blocks M1 to Mn and the total of the draw currents Ii drawn by the current drawing units CM of the measurement blocks M1 to Mn are substantially equal. If the sum of the supply currents Io and the sum of the pull-in currents Ii are substantially equal, substantially all of the current supplied from the n current supply units CS to the intermediate substrate B is transferred to the intermediate substrate B by the n current pull-in units CM. As a result, the leakage current is prevented from flowing from the intermediate substrate B to the outside.

  More preferably, each supply current Io and each drawing current Ii are substantially equal to each other. When the supply currents Io and the pull-in currents Ii are substantially equal to each other, the current flowing between the connection parts at each part of the intermediate substrate B is equalized, so that the potential of the metal plate MP is stabilized. As a result, resistance measurement accuracy is improved.

  One end of the supply-side voltage detection unit VM1 is connected to the voltage detection terminal + S1, and the other end is connected to the voltage detection terminal -S1. The supply side voltage detection unit VM1 is a voltage detection circuit that measures the voltage between the voltage detection terminals + S1 and −S1, and transmits the voltage value to the control unit 20 as the supply side voltage V1.

  The drawing-side voltage detection unit VM2 has one end connected to the voltage detection terminal + S2 and the other end connected to the voltage detection terminal -S2. The pull-in side voltage detection unit VM2 is a voltage detection circuit that measures the voltage between the voltage detection terminals + S2 and -S2 and transmits the voltage value to the control unit 20 as the pull-in side voltage V2.

  The scanner unit 31 arbitrarily selects the ground terminal G, the current terminals + F and -F and the voltage detection terminals + S1, -S1, + S2, and -S2 of the measurement blocks M1 to Mn according to a control signal from the control unit 20. The probe Pr can be conductively connected. As a result, the scanner unit 31 causes a current to flow between the arbitrary conductor portions in contact with the probe Pr in accordance with the control signal from the control unit 20, and detects the voltage generated between the arbitrary conductor portions. Measurement is performed by the part VM1 and the pull-in side voltage detection part VM2, and any conductor part can be connected to the circuit ground. The scanner unit 31 corresponds to an example of a grounding unit.

  The conductive part selector 21 includes n supply-side conductive parts corresponding to the measurement blocks M1 to Mn, n lead-side conductive parts, and n ( Or 2n) voltage measuring conductive parts and an arbitrary number of grounding conductive parts. The resistance calculation unit 22 calculates the resistance value of the connection part paired with the conductive part P selected as the supply side conductive part and the lead side conductive part. Therefore, the conductive part selection unit 21 finally selects a new conductive part P that is paired with a connection part for which a resistance value has not yet been calculated as a supply side conductive part and a lead side conductive part, so that a resistance is finally obtained. It is designed to measure the resistance values of all the connection parts whose values are to be measured.

  The conductive part selection unit 21 connects the probe Pr that is in contact with the supply-side conductive part and the current supply part CS (current terminal + F) by the scanner unit 31, and the probe Pr that is in contact with the lead-side conductive part. The current lead-in part CM (current terminal -F) is connected, the probe Pr in contact with the supply-side conductive part is connected to one end (voltage detection terminal + S1) of the supply-side voltage detection part VM1, and the voltage measurement conductive The probe Pr that is in contact with the contact portion and the other end (voltage detection terminal -S1) of the supply side voltage detection unit VM1 are connected, and the probe Pr that is in contact with the voltage measurement conductive portion and the pull-in side voltage detection unit VM2 One end (voltage detection terminal + S2) is connected, and the probe Pr that is in contact with the drawing-side conductive portion and the other end (voltage detection terminal -S2) of the drawing-side voltage detection portion VM2 are connected.

  As a result, the conductive part selector 21 causes the current supply part CS and the current lead-in part CM to cause a current to flow between the supply-side conductive part and the lead-in side conductive part via the metal plate MP, thereby supplying the supply-side voltage detection part VM1. Is used to detect the supply-side voltage V1 between the supply-side conductive part and the voltage-measuring conductive part, and the pull-in-side voltage detection part VM2 is used to detect the pull-in-side voltage V2 between the lead-side conductive part and the voltage-measuring conductive part. Let

  The resistance calculation unit 22 corresponds to the measurement blocks M1 to Mn, and based on the supply current Io and the supply-side voltage V1 of each measurement block, calculates the resistance value of the connection part paired with the supply-side conductive unit of each measurement block. calculate. Moreover, the resistance calculation part 22 respond | corresponds to the measurement blocks M1-Mn, and is resistance of the connection part which makes a pair with the drawing-in side electroconductive part of each measurement block based on the drawing-in current Ii and the drawing-in side voltage V2 of each measurement block. Calculate the value.

  Next, the operation of the above resistance measuring apparatus 1 will be described. A resistance measurement method for measuring the resistance of the substrate WB1 using the measurement unit 121 will be described by taking the case where the substrate to be measured is the intermediate substrate B as an example. Since the measurement of the resistance of the substrate WB2 using the measurement unit 122 is the same as the measurement of the resistance of the substrate WB1 using the measurement unit 121, the description thereof is omitted.

  3 and 4 are flowcharts showing an example of the operation of the resistance measuring apparatus 1 using the resistance measuring method according to the embodiment of the present invention. 5 and 6 are explanatory diagrams for explaining the operation of the resistance measuring apparatus 1 shown in FIG. The explanatory views shown in FIGS. 5 and 6 exemplify the case where the intermediate substrate B is measured. 5 and 6, the description of the scanner unit 31 is omitted for the sake of simplicity.

  First, the control unit 20 moves the measurement unit 121 by the measurement unit moving mechanism 125 to bring the probe Pr of the measurement jig 4U into contact with the intermediate substrate B fixed to the substrate fixing device 110 (step S1). In the example shown in FIGS. 5 and 6, a case where resistance is measured by a so-called four-terminal measurement method is illustrated, and two probes Pr are in contact with each conductive portion P.

  The resistance measuring apparatus 1 is not limited to the example of performing resistance measurement by the four-terminal measurement method, and a configuration in which the probe Pr is brought into contact with each conductive portion one by one and the current supply and the voltage measurement are combined with one probe Pr. It is good.

  Next, the conductive part selection unit 21 selects a conductive part for grounding from among the conductive parts P with which the probe Pr is in contact, and further, n supply-side conductive parts corresponding to the measurement blocks M1 to Mn, The n lead-side conductive parts and the n voltage measuring conductive parts are selected (step S2: conductive part selecting step).

  Since the resistance value of two connection parts can be measured corresponding to one measurement block, if the number of connection parts to be measured is less than 2n, the supply-side conductivity depends on the number of connection parts to be measured. Section, the lead-in conductive part, and the voltage measuring conductive part may be selected. At least one grounding conductive portion may be selected, and a plurality of grounding conductive portions may be selected.

  The conductive part selection unit 21 supplies the supply side conductive part, the pull-in side conductive part, and the voltage measurement conductive part selected by the scanner unit 31 to the current supply part CS, the current pull-in part CM, and supply of the measurement blocks M1 to Mn. The side voltage detection unit VM1 and the lead-in side voltage detection unit VM2 are connected, and the grounding conductive unit and the circuit ground are connected.

  FIG. 5 shows the selected supply side conductive part, lead-in side conductive part, voltage measurement conductive part, grounding conductive part, current supply part CS, current lead-in part CM, supply-side voltage detection part VM1, pull-in side voltage It is explanatory drawing which shows an example of connection relation with detection part VM2 and circuit ground.

  In the example shown in FIG. 5, the conductive part PA1 is selected as the supply-side conductive part, the conductive part PC1 is selected as the lead-in conductive part, and the conductive part PB1 is selected as the voltage measurement conductive part corresponding to the measurement block M1. ing. Corresponding to the measurement block M2, the conductive part PD1 is selected as the supply side conductive part, the conductive part PF1 is selected as the lead-in side conductive part, and the conductive part PE1 is selected as the voltage measurement conductive part. Hereinafter, also for the other conductive parts P, the supply side conductive part, the lead-in side conductive part, the voltage measuring conductive part, and the grounding conductive part are appropriately selected. The conductive portion PZ1 is selected as the grounding conductive portion.

  Next, the control unit 20 causes the supply current Io to be supplied from the current supply unit CS of the measurement blocks M1 to Mn to each supply-side conductive unit (step S3: current supply process). In the current supply step, for example, an ammeter is connected in series with the current supply unit CS, and the current actually supplied from the current supply unit CS to the supply-side conductive unit is measured as the supply current Io and is measured by this ammeter. The supplied current Io may be used in a resistance calculation step in step S7 described later.

  Next, the control unit 20 causes the current drawing unit CM of the measurement blocks M1 to Mn to draw the drawing current Ii from each drawing-side conductive unit (step S4: current drawing step). In the current drawing process, for example, an ammeter is connected in series with the current drawing unit CM, and the current actually drawn from the drawing-side conductive unit by the current drawing unit CM is measured as the drawing current Ii and measured by this ammeter. The drawn current Ii may be used in the resistance calculation step in step S7 described later.

  Next, in the measurement blocks M1 to Mn, the supply-side voltage detection unit VM1 detects the supply-side voltage V1 between the supply-side conductive unit and the voltage measurement conductive unit (step S5: supply-side voltage detection step). .

  In this case, as is apparent from the current path shown by the broken line in FIG. 5, the connection parts paired with the conductive parts PB1, PE1,..., PW1 which are voltage measurement conductive parts corresponding to the measurement blocks M1 to Mn. No current flows through RB, RE,..., RW, and therefore no voltage is generated at this point. As a result, each supply-side voltage V1 measured by each supply-side voltage detection unit VM1 does not include the voltage generated at the connection units RB, RE,. Therefore, each supply-side voltage V1 is supplied with the supply current Io at the connection portions RA, RD,..., RV that are paired with the supply-side conductive portions PA1, PD1,. It is approximately equal to the voltage generated by flowing.

  Next, in the measurement blocks M1 to Mn, the pull-in side voltage detection unit VM2 detects the pull-in side voltage V2 between the pull-in side conductive unit and the voltage measurement conductive unit (step S6: pull-in side voltage detection step). .

  In this case, as is apparent from the current path shown by the broken line in FIG. 5, the connection parts paired with the conductive parts PB1, PE1,..., PW1 which are voltage measurement conductive parts corresponding to the measurement blocks M1 to Mn. No current flows through RB, RE,..., RW, and therefore no voltage is generated at this point. As a result, each pull-in side voltage V2 measured by each pull-in side voltage detection unit VM2 does not include a voltage generated at the connection units RB, RE,. Accordingly, each pull-in side voltage V2 is caused by the pull-in current Ii at the connection parts RC, RF,..., RX paired with the lead-side conductive parts PC1, PF1,. It is approximately equal to the voltage generated by flowing.

Next, based on the supply side voltage V1 and the pull-in side voltage V2 detected corresponding to the measurement blocks M1 to Mn, and the pull-in current Ii and the supply current Io, the resistance calculation unit 22 performs the following expression (1), Based on (2), the resistance value Ro of the connection part paired with the supply-side conductive part corresponding to the measurement blocks M1 to Mn and the resistance value Ri of the connection part paired with the lead-side conductive part are calculated ( Step S7: Resistance calculation step).
Resistance value Ro = V1 / Io of the connection part paired with the supply side conductive part (1)
Resistance value Ri = V2 / Ii of the connection part paired with the lead-side conductive part (2)

  In the example shown in FIG. 5, the resistance values Ra, Rd,..., Rv of the connection portions RA, RD,..., RV are calculated as the resistance values Ro, and the connection portions RC, RF,. Resistance values Rc, Rf,..., Rx are calculated as resistance values Ri.

  Thereby, the resistance values Ra, Rc, Rd, Rf,..., Rv, Rx of the connection portions RA, RC, RD, RF,..., RV, RX can be individually measured. In this case, each of the measurement blocks M1 to Mn can perform voltage detection at two locations. Therefore, voltage detection for resistance measurement can be performed in parallel for the connection portion twice as many as the number n of measurement blocks, so that the resistance measurement time can be shortened.

  Further, since the supply current Io and the drawing current Ii are current values not less than the oxide film removal current value and not more than the rated current value of the probe Pr, the surface of each conductive portion P is oxidized without damaging the probe Pr. The film can be removed. As a result, the resistance measurement accuracy of each connection portion can be improved.

  In FIG. 5, if the current lead-in part CM is not provided and the lead-side conductive parts PC1, PF1,..., PX1 are directly connected to the circuit ground, the measurement blocks M1 to Mn The current supply part CS is connected in parallel to the metal plate MP, and the lead-side conductive parts PC1, PF1,..., PX1 are also connected in parallel to the metal plate MP.

  Therefore, the current supplied from the current supply part CS of the measurement blocks M1 to Mn is the resistance value of the current path from each current supply part CS to the circuit ground via the lead-side conductive parts PC1, PF1,. And the current flowing through the lead-side conductive portions PC1, PF1,..., PX1 varies.

  As a result, the current flowing through the lead-side conductive portions PC1, PF1,..., PX1 may exceed the rated current value of the probe Pr or may not satisfy the oxide film removal current value. The probe Pr that contacts the lead-side conductive part whose current exceeds the rated current value is damaged, and the oxide film is not removed at the lead-side conductive part where the flowing current does not satisfy the oxide film removal current value. The accuracy of calculation of the resistance value of the connecting portion paired with is reduced.

  On the other hand, according to the resistance measuring apparatus 1, the currents flowing through the lead-side conductive portions PC1, PF1,..., PX1 are not less than the oxide film removal current value and not more than the rated current value of the probe Pr by each current supply portion CS. Therefore, the resistance measurement accuracy of each connection portion can be improved without damaging the probe Pr.

  Also, if the grounding conductive part PZ1 is not connected to the circuit ground, the metal plate MP is connected to the circuit ground via the internal impedance of the current supply part CS or the current drawing part CM. The potential of the metal plate MP becomes unstable. When the potential of the metal plate MP becomes unstable, voltage measurement by the supply-side voltage detection unit VM1 and the pull-in side voltage detection unit VM2 becomes unstable, and the measurement accuracy of the supply-side voltage V1 and the pull-in side voltage V2 decreases. There is a possibility that the calculation accuracy of the resistance value of each connection portion is lowered.

  On the other hand, according to the resistance measuring apparatus 1, the conductive portion PZ1 for grounding is connected to the circuit ground by the scanner unit 31 (grounding portion), and the metal plate MP is connected to the circuit ground via the low resistance connecting portion RZ. The potential of the metal plate MP is stabilized. As a result, the measurement accuracy of the supply side voltage V1 and the pull-in side voltage V2 is improved, and the calculation accuracy of the resistance value of each connection portion is improved.

  Next, the conductive portion selection unit 21 checks whether or not the resistance values of all the connection portions RA to RZ to be measured have been calculated (step S11). If the resistance values of all the connection portions RA to RZ to be measured have been calculated (YES in step S11), the conductive portion selection unit 21 ends the process.

  On the other hand, if there remains a connection portion for which the resistance value has not yet been calculated (NO in step S11), the conductive portion selection unit 21 makes a pair with the connection portion in which the probe Pr is in contact and the resistance value has not been calculated. N supply-side conductive parts corresponding to the measurement blocks M1 to Mn and n lead-in side conductive parts are newly selected from among the conductive parts to be formed, and the conductive parts other than the newly selected conductive parts are selected. A grounding conductive part and n voltage measuring conductive parts corresponding to the measurement blocks M1 to Mn are newly selected from among them (step S12).

  Then, the conductive part selection unit 21 sets the supply side conductive part, the lead side conductive part, and the voltage measurement conductive part newly selected by the scanner unit 31 to the current supply part CS of the measurement blocks M1 to Mn, the current draw. The unit CM, the supply side voltage detection unit VM1, and the pull-in side voltage detection unit VM2 are connected, the newly selected grounding conductive unit is connected to the circuit ground, and the processing from step S3 is repeated again.

  FIG. 6 shows the newly selected supply side conductive part, lead-in side conductive part, voltage measurement conductive part, grounding conductive part, current supply part CS, current lead-in part CM, supply-side voltage detection part VM1, lead-in It is explanatory drawing which shows an example of the connection relationship with the side voltage detection part VM2 and circuit ground.

  In the example shown in FIG. 6, corresponding to the measurement block M1, the conductive part PB1 is selected as the supply-side conductive part, the conductive part PE1 is selected as the lead-side conductive part, and the conductive part PC1 and the conductive part are used as the voltage measurement conductive part. PD1 is selected. As described above, the plurality of conductive portions may be voltage measurement conductive portions.

  Corresponding to the measurement block Mn, the conductive part PW1 is selected as the supply-side conductive part, the conductive part PZ1 is selected as the lead-in conductive part, and the conductive part PX1 is selected as the voltage-measuring conductive part. Hereinafter, also for the other conductive parts P, the supply side conductive part, the lead-in side conductive part, the voltage measuring conductive part, and the grounding conductive part are appropriately selected. The conductive portion PA1 is selected as the ground conductive portion.

  In the example shown in FIG. 6, in step S2, the voltage measurement conductive part or the ground conductive part is used, and the conductive parts PB1, PE1, PW1, and PZ1 that have not been measured for resistance are the supply side conductive parts or the lead side conductive parts. The resistance values of the connecting portions paired with the conductive portions PB1, PE1, PW1, and PZ1 are measured.

  Hereinafter, the processing of steps S3 to S11 is repeated based on the newly selected supply side conductive part, lead-in side conductive part, and voltage measurement conductive part, and finally the resistance values of all connection parts to be measured. Is measured.

  As described above, according to the processing of steps S1 to S12, a planar conductor such as the conductive intermediate substrate B spreading in a planar shape, the substrate surface BS1 facing the planar conductor, and the conductive portion PA1 provided on the substrate surface BS1. Resistance values Ra to Rz of connecting portions RA to RZ of a substrate to be measured such as an intermediate substrate B having a pair of connecting portions RA to RZ that electrically connect the conductive portions PA1 to PZ1 to the planar conductors Can be measured individually.

  Note that the number of measurement blocks may be one. Even if the number of measurement blocks is one, it is possible to individually measure the resistance of the two connection portions corresponding to the measurement block. Further, the grounding conductive portion may not be provided, and the scanner unit 31 may not connect the grounding conductive portion to the circuit ground.

  Moreover, although the example in which the plurality of probes Pr are arranged so as to correspond to the arrangement of the conductive parts of the substrate to be inspected is shown, the current supply unit CS, the current drawing unit CM, The supply-side voltage detection unit VM1, the pull-in side voltage detection unit VM2, and the circuit ground may be electrically connected to the conductive unit.

  A resistance measuring device according to one aspect of the present invention includes a conductive planar conductor that extends in a planar shape, a substrate surface that faces the planar conductor, a conductive portion provided on the substrate surface, and a conductive portion provided on the surface. A resistance measuring device for measuring the resistance of the connection portion of the substrate to be measured, which has a pair of connection portions electrically connected to the conductor and has three or more pairs. A current supply unit for supplying a preset supply current to a supply-side conductive unit that is one of the conductive units, and one of the conductive units that is different from the supply-side conductive unit A current drawing unit for drawing a preset drawing current from the drawing side conductive unit, and a voltage measuring conductive unit which is a conductive unit different from the supply side conductive unit and the drawing side conductive unit among the conductive units. The supply side voltage, which is the voltage between the supply part and the supply side conductive part Supply side voltage detection unit, a pull-in side voltage detection unit that detects a pull-in side voltage that is a voltage between the voltage measurement conductive unit and the pull-in side conductive unit, and the supply current and the supply side voltage. A resistance for calculating a resistance value of a connection part paired with the supply side conductive part on the basis of, and a resistance value of a connection part paired with the lead side conductive part on the basis of the pull-in current and the pull-in side voltage A calculation unit.

  According to this configuration, the supply current is supplied to the supply-side conductive unit by the current supply unit, and the current draw-in is drawn from the draw-side conductive unit by the current drawing unit. As a result, the supply-side conductive unit and the supply-side conductive unit are paired. A current flows through the connection part, the planar conductor, the connection part paired with the lead-side conductive part, and the lead-side conductive part. However, since no current flows through the connecting portion that is paired with the voltage measuring conductive portion, and no voltage is generated at this connecting portion, the supply side that is the voltage between the voltage measuring conductive portion and the supply-side conductive portion. The voltage includes a voltage generated at a connection portion paired with the supply-side conductive portion, and does not include a voltage generated at other connection portions. As a result, the resistance value calculated by the resistance calculation unit based on the supply current and the supply-side voltage is substantially equal to the resistance value of the connection part paired with the supply-side conductive unit. Similarly, the pull-in side voltage, which is the voltage between the voltage measuring conductive part and the lead-side conductive part, includes the voltage generated at the connection part paired with the lead-side conductive part, and is generated at the other connection part. Voltage is not included. As a result, the resistance value calculated by the resistance calculation unit based on the pull-in current and the pull-in side voltage is substantially equal to the resistance value of the connection part paired with the pull-in side conductive part. Thereby, the resistance value of the connection part paired with the supply side conductive part and the resistance value of the connection part paired with the lead-side conductive part can be individually measured.

  In addition, a plurality of sets including the current supply unit, the current drawing unit, the supply side voltage detection unit, and the drawing side voltage detection unit, and corresponding to each of the set, the supply side conductive unit, The lead-side conductive unit and the voltage measurement conductive unit are set, and the resistance calculation unit corresponds to each set based on the supply current and the supply side voltage detected corresponding to each set. The resistance value of the connection part paired with the supply side conductive part is calculated, and the lead side conductivity corresponding to each set is calculated based on the draw current and the draw side voltage detected corresponding to each set. It is preferable to calculate the resistance value of the connection part paired with the part.

  According to this configuration, the resistance value measurement of the connection part paired with the supply-side conductive part and the resistance value measurement of the connection part paired with the drawing-side conductive part can be performed in parallel for each set. As a result, the resistance measurement time can be shortened.

  Moreover, it is preferable that the sum of the supply currents corresponding to the respective groups is substantially equal to the sum of the drawn currents corresponding to the respective groups.

  According to this configuration, since substantially all of the current supplied from each set of current supply units to the measured substrate is drawn from the measured substrate by each set of current drawing units, leakage current flows from the measured substrate to the outside. It is suppressed.

  The supply current and the pull-in current are preferably substantially equal to each other.

  According to this configuration, as a result of equalizing the current flowing between the connecting portions at each portion of the substrate to be measured, the potential of the planar conductor is stabilized. As a result, resistance measurement accuracy is improved.

  In order to contact each conductive part to perform current supply by the current supply unit, current draw by the current draw unit, voltage detection by the supply side voltage detection unit, and voltage detection by the draw side voltage detection unit The supply current and the lead-in current are set to be not less than the oxide film removal current value for removing the oxide film generated on the surface of each conductive portion and not more than the rated current value of the probe. Is preferred.

  According to this configuration, each probe flows a current not less than the oxide film removal current value for removing the oxide film and not more than the rated current value of the probe. The accuracy of resistance measurement can be improved by removing the oxide film on the surface of the portion.

  Moreover, it is preferable to further include a grounding part that connects a grounding conductive part different from the supply-side conductive part, the lead-in conductive part, and the voltage measurement conductive part among the conductive parts to the circuit ground. .

  According to this configuration, since the grounding conductive portion is connected to the circuit ground by the grounding portion, and the planar conductor is connected to the circuit ground via the connecting portion, the potential of the planar conductor is stabilized. As a result, the measurement accuracy of the supply side voltage and the pull-in side voltage is improved, and the calculation accuracy of the resistance value of each connection portion is improved.

  Moreover, the resistance measuring method according to one aspect of the present invention includes a conductive planar conductor extending in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion. A resistance measuring method for measuring the resistance of the connection portion of a substrate to be measured that has a pair of connection portions electrically connected to the planar conductor and includes three or more pairs. A current supply step of supplying a preset supply current to a supply-side conductive portion that is one of the conductive portions, and one of the conductive portions that is different from the supply-side conductive portion A current drawing step for drawing a preset drawing current from the drawing-side conductive unit, and a voltage-measuring conductive unit that is different from the supply-side conductive unit and the drawing-side conductive unit among the conductive units; Detect a supply-side voltage that is a voltage between the supply-side conductive unit Based on a supply-side voltage detection step, a pull-in side voltage detection step of detecting a pull-in side voltage that is a voltage between the voltage measuring conductive portion and the pull-in side conductive portion, the supply current, and the supply-side voltage Calculating a resistance value of the connection part paired with the supply-side conductive part and calculating a resistance value of the connection part paired with the lead-side conductive part based on the pull-in current and the pull-in voltage. Process.

  According to this configuration, the supply current is supplied to the supply-side conductive unit in the current supply step, and the draw-in current is drawn from the draw-side conductive unit in the current drawing step. As a result, the supply-side conductive unit and the supply-side conductive unit are paired. A current flows through the connection part, the planar conductor, the connection part paired with the lead-side conductive part, and the lead-side conductive part. However, since no current flows through the connecting portion that is paired with the voltage measuring conductive portion, and thus no voltage is generated at this connecting portion, the supply that is the voltage between the voltage measuring conductive portion and the supply-side conductive portion. The side voltage includes a voltage generated at a connection portion paired with the supply-side conductive portion, and does not include a voltage generated at other connection portions. As a result, the resistance value calculated based on the supply current and the supply-side voltage in the resistance calculation step is substantially equal to the resistance value of the connection portion paired with the supply-side conductive portion. Similarly, the pull-in side voltage, which is the voltage between the voltage measuring conductive part and the lead-side conductive part, includes the voltage generated at the connection part paired with the lead-side conductive part and is generated at the other connection part. Voltage is not included. As a result, the resistance value calculated based on the pull-in current and the pull-in side voltage in the resistance calculating step is substantially equal to the resistance value of the connection part paired with the lead-in conductive part. Thereby, the resistance value of the connection part paired with the supply-side conductive part and the resistance value of the connection part paired with the lead-side conductive part can be individually measured.

  The resistance measuring device and the resistance measuring method having such a configuration include a conductive planar conductor extending in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion facing the conductive surface conductor. It is possible to individually measure the resistance of the connection portion of the substrate to be measured that has a pair with the connection portion that is electrically connected to the conductor.

  This application is based on Japanese Patent Application No. 2006-233892 filed on Dec. 1, 2016, the contents of which are included in the present application. It should be noted that the specific embodiments or examples made in the section for carrying out the invention are merely to clarify the technical contents of the present invention, and the present invention is not limited to such specific examples. It should not be interpreted in a narrow sense only as a limitation.

DESCRIPTION OF SYMBOLS 1 Resistance measuring apparatus 4U, 4L Measuring jig 20 Control part 21 Conductive part selection part 22 Resistance calculation part 31 Scanner part 110 Board | substrate fixing device 112 Case 121,122 Measuring part 125 Measuring part moving mechanism B Intermediate board (measuring board)
BS, BS1 Substrate surface BS2 Contact surface CM Current draw-in portion CS Current supply portion G Ground terminal Ii Pull-in current Io Supply current IP Inner layer pattern (planar conductor)
M1-Mn measurement block (set)
MP metal plate (planar conductor)
P, PA1 to PZ1 Conductive part Pr Probes RA to RZ Connection parts Ra to Rz Resistance value V1 Supply side voltage V2 Pull side voltage VM1 Supply side voltage detection part VM2 Lead side voltage detection part WB Multilayer board (measurement board)
WB1, WB2 substrate

Claims (7)

A conductive planar conductor extending in a planar shape; a substrate surface facing the planar conductor; a conductive portion provided on the substrate surface; and a connecting portion for electrically connecting the conductive portion to the planar conductor. A resistance measuring device for measuring the resistance of the connection portion of the substrate to be measured that includes three or more pairs.
A current supply unit for supplying a preset supply current to a supply-side conductive unit that is one of the three or more conductive units;
A current drawing unit for drawing a preset drawing current from a drawing side conductive unit that is one of the conductive units and is different from the supply side conductive unit;
Supply that detects a supply-side voltage that is a voltage between a voltage-measuring conductive part that is different from the supply-side conductive part and the drawing-side conductive part and the supply-side conductive part among the conductive parts. A side voltage detector;
A pull-in side voltage detection unit for detecting a pull-in side voltage that is a voltage between the voltage measuring conductive unit and the pull-in side conductive unit;
Based on the supply current and the supply-side voltage, a resistance value of a connection part paired with the supply-side conductive part is calculated, and based on the pull-in current and the pull-in side voltage, paired with the pull-in side conductive part. A resistance measuring device comprising: a resistance calculating unit that calculates a resistance value of the connecting unit. A plurality of sets including the current supply unit, the current drawing unit, the supply side voltage detection unit, and the drawing side voltage detection unit,
Corresponding to each of the set, the supply side conductive portion, the lead-in side conductive portion, and the voltage measurement conductive portion is set,
The resistance calculation unit calculates a resistance value of a connection portion paired with the supply-side conductive unit corresponding to each set based on the supply current and the supply-side voltage detected corresponding to each set. And calculating a resistance value of a connection portion paired with the drawing-side conductive portion corresponding to each set based on the drawing current and the drawing-side voltage detected corresponding to each set. The resistance measuring apparatus as described.   The resistance measurement apparatus according to claim 2, wherein a total of the supply currents corresponding to the respective groups is substantially equal to a total of the drawn currents corresponding to the respective groups.   The resistance measuring apparatus according to claim 1, wherein the supply current and the drawn current are substantially equal to each other. Probes for contacting the conductive parts to perform current supply by the current supply unit, current draw by the current draw unit, voltage detection by the supply side voltage detection unit, and voltage detection by the draw side voltage detection unit With
The said supply current and the said drawing current are set to the oxide film removal current value for removing the oxide film which arises on the surface of each said electroconductive part, and below the rated current value of the said probe. The resistance measuring device according to any one of the above.   The said electrically conductive part is further equipped with the grounding part which connects the electrically conductive part for grounding different from the said electrically conductive part for supply side, the said electrically conductive part for drawing-in, and the electrically conductive part for voltage measurement to a circuit ground. The resistance measuring device according to any one of the above. A conductive planar conductor extending in a planar shape; a substrate surface facing the planar conductor; a conductive portion provided on the substrate surface; and a connecting portion for electrically connecting the conductive portion to the planar conductor. A resistance measuring method for measuring the resistance of the connection portion of the substrate to be measured having three or more pairs.
A current supply step of supplying a preset supply current to a supply-side conductive portion that is one of the three or more conductive portions;
A current drawing step of drawing a preset drawing current from a drawing-side conductive part that is one of the conductive parts and is different from the supply-side conductive part;
Supply that detects a supply-side voltage that is a voltage between a voltage-measuring conductive part that is different from the supply-side conductive part and the drawing-side conductive part and the supply-side conductive part among the conductive parts. Side voltage detection step;
A pull-in side voltage detection step for detecting a pull-in side voltage that is a voltage between the voltage measuring conductive unit and the pull-in side conductive unit;
Based on the supply current and the supply-side voltage, a resistance value of a connection part paired with the supply-side conductive part is calculated, and based on the pull-in current and the pull-in side voltage, paired with the lead-side conductive part. And a resistance calculating step of calculating a resistance value of the connecting portion.

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