JPWO2017179562A1 - Rfidタグおよびrfidシステム - Google Patents
Rfidタグおよびrfidシステム Download PDFInfo
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- JPWO2017179562A1 JPWO2017179562A1 JP2018512014A JP2018512014A JPWO2017179562A1 JP WO2017179562 A1 JPWO2017179562 A1 JP WO2017179562A1 JP 2018512014 A JP2018512014 A JP 2018512014A JP 2018512014 A JP2018512014 A JP 2018512014A JP WO2017179562 A1 JPWO2017179562 A1 JP WO2017179562A1
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- Prior art keywords
- magnetic particles
- mold resin
- insulating substrate
- rfid tag
- coil conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
- G06K7/10316—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves using at least one antenna particularly designed for interrogating the wireless record carriers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Health & Medical Sciences (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Near-Field Transmission Systems (AREA)
- Details Of Aerials (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
1a・・・上面
2・・・コイル導体
3・・・半導体素子
4・・・モールド樹脂
5・・・磁性体粒子
5a・・・磁性体粒子(球状のもの)
5b・・・磁性体粒子(扁平状のもの)
5ab・・・磁性体粒子(球状、中空のもの)
5bb・・・磁性体粒子(扁平状、中空のもの)
6・・・ボンディングワイヤ
7・・・端子
10・・・RFIDタグ
20・・・リーダライタ
21・・・アンテナ
30・・・RFIDシステム
40・・・物品
Claims (8)
- 上面を有する絶縁基板と、
該絶縁基板の内部に配置されたコイル導体と、
前記絶縁基板の前記上面に搭載された半導体素子と、
前記絶縁基板の上面および前記半導体素子を被覆しているモールド樹脂とを備えており、
該モールド樹脂が、互いに粒径の異なる複数の磁性体粒子を含有しているRFIDタグ。 - 前記磁性体粒子の前記モールド樹脂における含有率が、前記モールド樹脂の下部において上部よりも大きい請求項1に記載のRFIDタグ。
- 前記磁性体粒子が扁平状の磁性体粒子を含んでおり、
前記扁平状の磁性体粒子は、扁平面が前記絶縁基板の前記上面に沿うように配置されている請求項1または請求項2に記載のRFIDタグ。 - 前記磁性体粒子における前記扁平状の磁性体粒子の割合が、前記モールド樹脂の下部において上部よりも大きい請求項3に記載のRFIDタグ。
- 前記磁性体粒子が中空の磁性体粒子を含んでいる請求項1〜請求項4のいずれかに記載のRFIDタグ。
- 前記磁性体粒子における前記中空の磁性体粒子の割合が、前記モールド樹脂の上部において下部よりも大きい請求項5に記載のRFIDタグ。
- 前記コイル導体と電気的に接続されて前記絶縁基板の上面に配置されており、前記半導体素子とボンディングワイヤを介して電気的に接続された端子をさらに備える請求項1〜請求項6のいずれかに記載のRFIDタグ。
- 請求項1〜請求項7のいずれかに記載のRFIDタグと、
該RFIDタグの前記コイル導体と対向するアンテナを有するリーダライタとを備えるRFIDシステム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016080388 | 2016-04-13 | ||
JP2016080388 | 2016-04-13 | ||
PCT/JP2017/014772 WO2017179562A1 (ja) | 2016-04-13 | 2017-04-11 | Rfidタグおよびrfidシステム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017179562A1 true JPWO2017179562A1 (ja) | 2019-02-28 |
JP6595705B2 JP6595705B2 (ja) | 2019-10-23 |
Family
ID=60041582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018512014A Active JP6595705B2 (ja) | 2016-04-13 | 2017-04-11 | Rfidタグおよびrfidシステム |
Country Status (5)
Country | Link |
---|---|
US (1) | US10657337B2 (ja) |
EP (1) | EP3444756B1 (ja) |
JP (1) | JP6595705B2 (ja) |
CN (1) | CN109074508B (ja) |
WO (1) | WO2017179562A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11316252B2 (en) * | 2019-10-25 | 2022-04-26 | Sj Semiconductor (Jiangyin) Corporation | Antenna packaging structure and method for forming the same |
DE102020201821A1 (de) * | 2020-02-13 | 2021-08-19 | Mahle International Gmbh | Induktionsladevorrichtung für ein Fahrzeugladesystem |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005080023A (ja) * | 2003-09-01 | 2005-03-24 | Sony Corp | 磁芯部材、アンテナモジュール及びこれを備えた携帯型通信端末 |
JP2010103313A (ja) * | 2008-10-23 | 2010-05-06 | Alps Electric Co Ltd | Rfid用磁気シート及びその製造方法、ならびに前記rfid用磁気シートを用いたrfidデバイス及びその製造方法 |
WO2011108341A1 (ja) * | 2010-03-03 | 2011-09-09 | 株式会社村田製作所 | 無線通信デバイス及び無線通信端末 |
JP2013045995A (ja) * | 2011-08-26 | 2013-03-04 | Panasonic Corp | 積層インダクタ |
JP2013210948A (ja) * | 2012-03-30 | 2013-10-10 | Lintec Corp | 金属体貼付用データキャリア、データキャリアの貼付方法および無線通信方法 |
JP2013242698A (ja) * | 2012-05-21 | 2013-12-05 | Murata Mfg Co Ltd | 無線icモジュール付き基材シートの製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4196554B2 (ja) * | 2001-09-28 | 2008-12-17 | 三菱マテリアル株式会社 | タグ用アンテナコイル及びそれを用いたrfid用タグ |
JP4793584B2 (ja) * | 2007-01-10 | 2011-10-12 | 戸田工業株式会社 | 磁性体アンテナを実装した基板 |
US20120269728A1 (en) * | 2006-08-02 | 2012-10-25 | Antara Biosciences Inc. | Methods and compositions for detecting one or more target agents using tracking components |
CN101183588A (zh) * | 2007-10-18 | 2008-05-21 | 上海交通大学 | 高分子微纳米球为模板制备磁性空心微纳米球的方法 |
CN102792520B (zh) | 2010-03-03 | 2017-08-25 | 株式会社村田制作所 | 无线通信模块以及无线通信设备 |
JP6024246B2 (ja) * | 2012-07-05 | 2016-11-09 | 株式会社リコー | 導電性磁性インク、並びに該導電性磁性インクを用いた電磁シールド及び金属対応rfid |
JP6050667B2 (ja) * | 2012-12-04 | 2016-12-21 | デクセリアルズ株式会社 | コイルモジュール、非接触電力伝送用アンテナユニット、及び電子機器 |
WO2016126236A1 (en) * | 2015-02-03 | 2016-08-11 | Halliburton Energy Services, Inc. | Improved radio frequency identification tag |
-
2017
- 2017-04-11 JP JP2018512014A patent/JP6595705B2/ja active Active
- 2017-04-11 EP EP17782375.4A patent/EP3444756B1/en active Active
- 2017-04-11 WO PCT/JP2017/014772 patent/WO2017179562A1/ja active Application Filing
- 2017-04-11 CN CN201780022638.7A patent/CN109074508B/zh active Active
- 2017-04-11 US US16/092,800 patent/US10657337B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005080023A (ja) * | 2003-09-01 | 2005-03-24 | Sony Corp | 磁芯部材、アンテナモジュール及びこれを備えた携帯型通信端末 |
JP2010103313A (ja) * | 2008-10-23 | 2010-05-06 | Alps Electric Co Ltd | Rfid用磁気シート及びその製造方法、ならびに前記rfid用磁気シートを用いたrfidデバイス及びその製造方法 |
WO2011108341A1 (ja) * | 2010-03-03 | 2011-09-09 | 株式会社村田製作所 | 無線通信デバイス及び無線通信端末 |
JP2013045995A (ja) * | 2011-08-26 | 2013-03-04 | Panasonic Corp | 積層インダクタ |
JP2013210948A (ja) * | 2012-03-30 | 2013-10-10 | Lintec Corp | 金属体貼付用データキャリア、データキャリアの貼付方法および無線通信方法 |
JP2013242698A (ja) * | 2012-05-21 | 2013-12-05 | Murata Mfg Co Ltd | 無線icモジュール付き基材シートの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN109074508B (zh) | 2021-08-03 |
US10657337B2 (en) | 2020-05-19 |
CN109074508A (zh) | 2018-12-21 |
EP3444756A1 (en) | 2019-02-20 |
US20190163939A1 (en) | 2019-05-30 |
EP3444756A4 (en) | 2019-12-11 |
JP6595705B2 (ja) | 2019-10-23 |
EP3444756B1 (en) | 2021-03-31 |
WO2017179562A1 (ja) | 2017-10-19 |
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