JPWO2017175629A1 - 導電性基板 - Google Patents
導電性基板 Download PDFInfo
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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Abstract
Description
透明基材と、
前記透明基材の少なくとも一方の面上に配置された金属層と、
前記金属層上に配置された湿式めっき黒化層とを有し、
前記金属層の前記湿式めっき黒化層と対向する面の表面粗さRa(μm)が、前記湿式めっき黒化層の厚さ(μm)の0.35倍以上である導電性基板を提供する。
(導電性基板)
本実施形態の導電性基板は、透明基材と、透明基材の少なくとも一方の面上に配置された金属層と、金属層上に配置された湿式めっき黒化層とを有することができる。そして、金属層の湿式めっき黒化層と対向する面の表面粗さRa(μm)を、湿式めっき黒化層の厚さ(μm)の0.35倍以上とすることができる。
(導電性基板の製造方法)
次に本実施形態の導電性基板の製造方法の構成例について説明する。
金属層上に湿式めっき法により湿式めっき黒化層を形成する湿式めっき黒化層形成工程。
そして、金属層形成工程では、金属層の湿式めっき黒化層と対向する面の表面粗さRa(μm)が、湿式めっき黒化層の厚さ(μm)の0.35倍以上となるように金属層を形成することができる。なお、湿式めっき黒化層形成工程において、金属層の湿式めっき黒化層と対向する面の表面粗さRa(μm)が、湿式めっき黒化層の厚さ(μm)の0.35倍以上となるように、湿式めっき黒化層の厚さを調整することもできる。
(評価方法)
以下の実験例1〜8において作製した導電性基板の評価方法について説明する。
(1)表面粗さRa
以下の実施例、比較例では、図2Aに示した導電性基板を作製した。そして、導電性基板を作製する際、金属層12の成膜後、湿式めっき黒化層13を成膜する前に、金属層12の第2の金属層表面12bの表面粗さを評価した。
(2)エッチング時間差
エッチング液として、3質量%塩化第二鉄と0.3質量%塩酸とを混合した水溶液を用意し、エッチング液の温度を室温(25℃)に保持した。
(導電性基板の作製条件)
以下に各実験例における導電性基板の作製条件、及び評価結果を示す。なお、実験例1〜実験例5が実施例、実験例6〜実験例8が比較例となる。
[実験例1]
図2Aに示した構造を有する導電性基板を作製した。
(透明基材準備工程、密着層形成工程)
まず、厚さ100μmのポリエチレンテレフタレート樹脂(PET)製の透明基材の一方の面上に密着層を形成した。
(金属層形成工程)
続いて、密着層を成膜した透明基材の密着層上に金属層を成膜した。
(湿式めっき黒化層形成工程)
硫酸ニッケルと、硫酸亜鉛とを含有するめっき浴を用い、湿式めっき法により、湿式めっき黒化層として、厚さtが60nmのニッケル−亜鉛合金層を成膜した。
[実験例2〜実験例8]
各実験例において、粗化金属めっき層形成ステップを実施する時間を変更し、金属層の湿式めっき黒化層と対向する面の表面粗さRaを表1に示す値となるようにした点以外は、実験例1と同様にして、導電性基板の作製、及び評価を行った。結果を表1に示す。
表1に示した結果から、実施例であり、金属層の湿式めっき黒化層と対向する面である第2の金属層表面の表面粗さRa(μm)が、湿式めっき黒化層の厚さ(μm)の0.35倍以上である実験例1〜実験例5は、評価が〇になっていることが確認できる。すなわち、エッチング均一性に優れた導電性基板であることが確認できる。
11、111、112 透明基材
12、121、122 金属層
13、131、132、321、322 湿式めっき黒化層
Claims (3)
- 透明基材と、
前記透明基材の少なくとも一方の面上に配置された金属層と、
前記金属層上に配置された湿式めっき黒化層とを有し、
前記金属層の前記湿式めっき黒化層と対向する面の表面粗さRa(μm)が、前記湿式めっき黒化層の厚さ(μm)の0.35倍以上である導電性基板。 - 前記金属層が金属めっき層を有する請求項1に記載の導電性基板。
- 前記金属層の前記湿式めっき黒化層と対向する面の表面粗さRaが0.024μm以上である請求項1または2に記載の導電性基板。
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JP2016076157 | 2016-04-05 | ||
JP2016076157 | 2016-04-05 | ||
PCT/JP2017/012728 WO2017175629A1 (ja) | 2016-04-05 | 2017-03-28 | 導電性基板 |
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JPWO2017175629A1 true JPWO2017175629A1 (ja) | 2019-02-14 |
JP7071915B2 JP7071915B2 (ja) | 2022-05-19 |
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KR (1) | KR102353073B1 (ja) |
CN (1) | CN108885509B (ja) |
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WO (1) | WO2017175629A1 (ja) |
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JP6706013B1 (ja) * | 2019-10-02 | 2020-06-03 | 住友金属鉱山株式会社 | 銅張積層板および銅張積層板の製造方法 |
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JP2015158829A (ja) * | 2014-02-25 | 2015-09-03 | 介面光電股▲ふん▼有限公司 | タッチパネル装置及びその電極構造 |
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JP4086132B2 (ja) | 2001-11-16 | 2008-05-14 | 株式会社ブリヂストン | 透明導電性フィルムおよびタッチパネル |
JP5588597B2 (ja) * | 2007-03-23 | 2014-09-10 | 富士フイルム株式会社 | 導電性材料の製造方法及び製造装置 |
JP5361579B2 (ja) | 2009-07-09 | 2013-12-04 | 信越ポリマー株式会社 | 大型ディスプレイ用のセンサパネル及びその製造方法 |
JP2013069261A (ja) | 2011-09-08 | 2013-04-18 | Dainippon Printing Co Ltd | タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置 |
JP6099875B2 (ja) * | 2011-11-22 | 2017-03-22 | 東レ株式会社 | 積層体の製造方法 |
TWI509484B (zh) * | 2013-12-13 | 2015-11-21 | J Touch Corp | 觸控面板裝置與其電極結構 |
JP2015164030A (ja) * | 2014-01-31 | 2015-09-10 | 住友金属鉱山株式会社 | 導電性基板、積層導電性基板、導電性基板の製造方法、及び積層導電性基板の製造方法 |
EP3156886A4 (en) * | 2014-06-10 | 2017-06-21 | Fujifilm Corporation | Electrically-conductive laminate for touchscreen, touchscreen, and transparent electrically-conductive laminate |
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- 2017-03-28 WO PCT/JP2017/012728 patent/WO2017175629A1/ja active Application Filing
- 2017-03-28 KR KR1020187025733A patent/KR102353073B1/ko active IP Right Grant
- 2017-03-28 JP JP2018510550A patent/JP7071915B2/ja active Active
- 2017-03-28 CN CN201780019954.9A patent/CN108885509B/zh active Active
- 2017-03-30 TW TW106110668A patent/TWI795356B/zh active
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JP2015158829A (ja) * | 2014-02-25 | 2015-09-03 | 介面光電股▲ふん▼有限公司 | タッチパネル装置及びその電極構造 |
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Publication number | Publication date |
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TWI795356B (zh) | 2023-03-11 |
JP7071915B2 (ja) | 2022-05-19 |
CN108885509B (zh) | 2022-03-29 |
CN108885509A (zh) | 2018-11-23 |
KR102353073B1 (ko) | 2022-01-19 |
KR20180132625A (ko) | 2018-12-12 |
WO2017175629A1 (ja) | 2017-10-12 |
TW201738903A (zh) | 2017-11-01 |
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