JPWO2016163229A1 - Method and apparatus for measuring electrical characteristics of electronic parts - Google Patents

Abstract

Provided is a method for measuring electrical characteristics of an electronic component having high measurement accuracy. In advance, a step of creating a correlation equation between the magnitude of the load when the measurement terminal is brought into contact with the external electrode and the measurement error amount of the electrical characteristics, and the measurement terminal is brought into contact with the external electrode of the electronic component, An electrical signal flowing through the electronic component is detected by a measuring instrument, and the electrical characteristics of the electronic component are measured to obtain the measured electrical characteristics.At the same time, the load at the contact is measured by a load sensor to determine the load value. And a step of correcting the measured electrical characteristic based on the magnitude of the load value based on the correlation equation.

Description

  The present invention relates to a method for measuring electrical characteristics of electronic components, and more particularly to a method for measuring electrical characteristics of electronic components having high measurement accuracy.

  The present invention also relates to an electrical property measuring apparatus suitable for use in the electrical property measuring method of the electronic component, and more particularly to an electrical property measuring apparatus having high measurement accuracy.

  With higher functionality and higher precision of electronic devices, high characteristic accuracy is also required for electronic components used in electronic devices. In particular, electronic components used in medical and in-vehicle electronic devices are required to have higher characteristic accuracy from the viewpoint of safety. For example, in applications that require such high characteristic accuracy, there may be cases where the variation in characteristic accuracy is required to be within a range of 1/2 to 1/10 or less than that of general consumer applications.

  In order to meet such demands for high characteristic accuracy for electronic components, high measurement accuracy is also required in methods for measuring electrical characteristics of electronic components and electrical characteristic measuring apparatuses. That is, it is necessary to measure the electrical characteristics of an electronic component with high measurement accuracy and not use an electronic component that deviates from the target electrical characteristic value as being out of specification.

  One of the major causes of measurement errors in the measurement of electrical characteristics of electronic components is a reference temperature (a specific temperature required for measuring the electrical characteristics; hereinafter referred to as “reference temperature”). And the actual temperature of the electronic component at the time of measurement (hereinafter referred to as “measurement temperature”). That is, for example, when the measured temperature deviates from 25 ° C. even though the electrical property must be measured at the reference temperature of 25 ° C., the measured measured electrical property is actually the electronic component. Deviates from the electrical characteristics at 25 ° C. of However, in the production line of factories that actually measure the electrical characteristics of electronic components, the measurement temperature is the same as the reference temperature because it is affected by the climate, air conditioning conditions, door opening and closing, the number of workers, etc. It is difficult to keep at the temperature.

  In particular, thermistors such as NTC thermistor and PTC thermistor are electronic components whose resistance value varies greatly depending on the temperature. Therefore, in measuring the resistance value of the thermistor, there is a measurement error caused by the difference between the reference temperature and the measured temperature. It becomes a big problem.

  A resistance value measuring method that solves this problem is disclosed in Japanese Patent Application Laid-Open No. 2007-240158.

  In the resistance value measuring method disclosed in Patent Document 1, the resistance value of the thermistor is measured in the following steps.

  First, a reference thermistor (reference work) that is strictly equipped with the required electrical characteristics is selected. The selection of this standard thermistor is not difficult. That is, for example, when it is necessary to measure the resistance value at 25 ° C., the resistance value of a plurality of thermistors is measured after the measurement temperature is strictly maintained at 25 ° C., and the obtained resistance value is strictly determined. The provided thermistor may be selected as the reference thermistor. A plurality of reference thermistors may be selected.

Then, the resistance was prepared under measurement thermistor (measured work) for measuring, the measuring terminal in contact with the external electrodes of the measured thermistor to obtain a measured resistance value R ₁ by measuring the resistance value of the measured thermistor . At the same time, the resistance value of the reference thermistor is measured to obtain the measured resistance value R ₀ in the very vicinity of the place where the resistance value of the thermistor to be measured is measured.

Then, by equation 1 below, to the measured resistance value R ₀ of the reference thermistor, a deviation of the measured resistance value R ₁ of the measurement thermistor (measurement value deviation rate).
Deviation (%) = (R ₁ −R ₀ ) / R ₀ × 100 (Equation 1)
Next, a non-defective product / defective product of the measured thermistor is determined from the obtained deviation. Specifically, the measured thermistor is determined to be a non-defective product when the obtained deviation is within a predetermined allowable range, and the measured thermistor is determined to be defective when it is outside the predetermined allowable range.

  In this case, since the measured thermistor and the reference thermistor are arranged very close to each other, when the resistance value is measured, the measured thermistor and the reference thermistor are estimated to have the same temperature, and a deviation is obtained. Judgment of non-defective / defective products of the thermistor being measured.

  That is, for example, when the reference temperature is 25 ° C., it is ideal to measure the resistance value by strictly setting the measurement temperature of the measured thermistor to 25 ° C. However, as described above, in measuring the electrical characteristics of an actual electronic component, it is difficult to keep the measurement temperature of the measured thermistor at the same temperature as the reference temperature due to various factors.

Therefore, in the resistance value measuring method disclosed in Patent Document 1, it is estimated that the measured thermistor and the reference thermistor are at the same temperature by arranging the measured thermistor and the reference thermistor very close to each other. , a deviation of the measured resistance value R ₁ of the measurement thermistor for measuring the resistance value R ₀ of the reference thermistor, doing good / defective determination of the measured thermistor.

  In other words, the resistance value measuring method disclosed in Patent Document 1 makes a determination as to whether the measured thermistor is non-defective / defective while the measurement error due to the difference between the measured temperature of the measured thermistor and the reference temperature is extremely small. Is going.

The resistance value measuring method disclosed in Patent Document 1 uses a reference thermistor as a kind of high-precision thermometer, and extremely reduces a measurement error due to a difference between the measured temperature of the measured thermistor and the reference temperature. .
(Note that the resistance value measuring method disclosed in Patent Document 1 aims to make the temperature of the reference thermistor and the temperature of the measured thermistor as the same as possible, and to obtain a more accurate measured value deviation rate (deviation). ing.)

JP 2007-240158 A JP 2002-82144 A

  The electrical characteristic measurement method (resistance value measurement method) disclosed in Patent Document 1 is an electrical characteristic measurement method with high measurement accuracy in which a measurement error due to a difference between a reference temperature and a measurement temperature is extremely small.

  However, the cause of the measurement error in the measurement of the electrical characteristics of the electronic component is not only the difference between the reference temperature and the measurement temperature.

  In order to improve the measurement accuracy of the electrical characteristics, the inventors of the present invention pay attention to the measurement error caused by the variation in the load when the measurement terminal contacts the external electrode of the electronic component, and work on the improvement. It is. In addition, a load refers to the load measured within the time when the measurement terminal is in contact with the external electrode of the electronic component.

  Note that the variation in the magnitude of the load when the measurement terminal abuts on the external electrode of the electronic component is the variation in the shape and size of the electronic component whose electrical characteristics are measured, the variation in the thickness dimension of the external electrode, This can occur due to various factors such as the location within the measurement cavities.

  As a technique related to this theme, there is an electric characteristic measuring method and an electric characteristic measuring apparatus (test handler) disclosed in Japanese Patent Application Laid-Open No. 2002-82144.

  The electrical characteristic measuring method and electrical characteristic measuring apparatus disclosed in Patent Document 2 are a semiconductor package in which an electronic component to be measured has a large number of solder balls formed on its lower surface as external electrodes. Below, the outline of the electrical property measuring method and electrical property measuring device disclosed in Patent Document 2 will be described.

  First, a measuring device is prepared. The measuring apparatus includes a handler arm that moves the upper surface of the semiconductor package by vacuum suction. A pressing force sensor is incorporated in the handler arm. Further, the measuring apparatus includes a measuring board. The measurement board is provided with a plurality of measurement terminals (spring probes) facing upward.

  Next, the upper surface of the semiconductor package is vacuum-sucked by the handler arm, and the semiconductor package is moved onto the measurement terminal.

  Next, the handler arm is lowered to bring the corresponding solder ball of the semiconductor package into contact with the measurement terminal. When the handler arm is lowered, the pressing force is monitored by a pressing force sensor, and when the pressing force reaches a predetermined reference pressing force, the lowering of the handler arm is stopped.

  The reference pressing force is determined in advance from the following viewpoint. First, if the contact pressure between the solder ball and the measurement terminal is small, the contact resistance between the solder ball and the measurement terminal becomes unstable, and the reliability of the measured electrical characteristic value may not be ensured. Accordingly, the reference pressing force is set to a pressing force having a magnitude greater than a certain level at which the contact resistance between the solder ball and the measurement terminal is stabilized. However, if the contact pressure between the solder ball and the measurement terminal is too large, there is a risk of causing appearance defects such as contact marks on the solder ball of the semiconductor package. Therefore, the reference pressing force is set to a pressing force of a certain level or larger that stabilizes the contact resistance between the solder ball and the measurement terminal, and is set to a pressing force that is smaller than the pressing force that causes the solder ball to have an appearance defect. Is done.

  Next, in a state where the contact pressure between the solder ball and the measurement terminal is kept at the reference pressing force, the electrical characteristics of the semiconductor package are measured by the measurement terminal.

  The electrical property measuring method and electrical property measuring device disclosed in Patent Document 2 having such a content have high measurement accuracy in consideration of the contact pressure between the solder ball and the measurement terminal. There was a problem like this.

  That is, the electrical characteristic measurement method disclosed in Patent Document 2 is a method in which the handler arm is lowered while monitoring the contact pressure between the solder ball and the measurement terminal with a pressing force sensor, and when the reference pressing force is reached, the handler Since the arm descent was stopped, the handler arm could not be lowered at a high speed, and there was a problem that the measurement took time. In other words, if the handler arm is lowered at a high speed, the reference pressing force has already been exceeded when the handler arm has been lowered and stopped, causing appearance defects such as contact marks on the solder balls of the semiconductor package. The handler arm could not be lowered at a high speed because there was a risk of it being trapped. In the method for measuring electrical characteristics disclosed in Patent Document 2, it takes time to measure electrical characteristics. For example, when measuring electrical characteristics in the manufacturing process of an electronic component, productivity decreases, There was a problem that the manufacturing cost of the parts would be high.

  In addition, in the electrical characteristic measuring device disclosed in Patent Document 2, a pressing force sensor is incorporated in a handler arm that is a driving part. When the pressing force sensor is incorporated in the driving portion, there is a problem that the structure becomes complicated and the measuring device becomes expensive. Further, the maintenance work of the measuring apparatus is complicated, and there is a problem that the maintenance cost becomes high. As described above, the electrical characteristic measuring device disclosed in Patent Document 2 has a problem that the structure is complicated, expensive, and maintenance cost is high.

  The present invention has been made to solve the above-described problems of the prior art. As its means, the method for measuring the electrical characteristics of an electronic component according to the present invention is such that a measurement terminal is brought into contact with an external electrode of the electronic component, and an electrical signal flowing through the electronic component is detected by a measuring instrument connected to the measurement terminal This is an electrical property measurement method for measuring electrical properties of electronic components, and a correlation formula between the magnitude of the load when the measurement terminal is brought into contact with the external electrode and the measurement error amount of the electrical property is created in advance. A measurement terminal is brought into contact with an external electrode of the electronic component, an electrical signal flowing through the electronic component is detected by a measuring instrument, and an electrical characteristic of the electronic component is measured to obtain a measured electrical characteristic, Measuring the magnitude of the load in the contact with a load sensor and obtaining a load value; and correcting the measured electrical characteristics based on the magnitude of the load value based on a correlation equation.

  Furthermore, the method for measuring the electrical characteristics of the electronic component may include a step of correcting the measured electrical characteristics based on a difference between a reference temperature serving as a reference and the temperature of the electronic component during measurement. In this case, in addition to the correction of the measurement error caused by the load when the measurement terminal contacts the external electrode of the electronic component, the measurement error caused by the difference between the reference temperature and the measurement temperature is also combined. It can be corrected.

  Furthermore, the method for measuring the electrical characteristics of an electronic component includes a step of classifying the electronic component as a non-defective product or a defective product depending on whether or not the corrected electrical property of the electronic component is within a predetermined allowable range. May be. In this case, it becomes possible not to use an electronic component that does not have the required electrical characteristics as being out of specification.

  Further, the method of measuring the electrical characteristics of the electronic component is applicable to at least one of a case where the magnitude of the load value is small exceeding a predetermined threshold value and a case where the load value is large exceeding a predetermined threshold value. You may provide the step which judges an electronic component to be inferior goods. When the magnitude of the load value is small beyond a predetermined threshold, the contact resistance between the measuring terminal and the external electrode of the electronic component is large, and the measured electrical characteristics exceed the limit that can be corrected. There may be an error. Also, if the load value is larger than a predetermined threshold value, there is a risk that a defect such as a crack has occurred inside the electronic component, or an external appearance defect such as a contact mark on the external electrode of the electronic component. There is a risk that a measurement error exceeding the correctable limit may occur in the measured electrical characteristics. Therefore, by determining the electronic component as a defective product in at least one of the case where the magnitude of the load value is smaller than a predetermined threshold and the case where the load value is larger than a predetermined threshold. The electronic component can be prevented from being used outside the standard.

  As an electrical characteristic to be measured, for example, a resistance value can be raised. However, the electrical characteristics to be measured are not limited to resistance values, and may be other electrical characteristics such as capacitance values and inductance values.

  In addition, the electrical characteristic measuring apparatus according to the present invention detects, as means for solving the above-described problems of the prior art, a measurement terminal that contacts an external electrode of an electronic component and an electrical signal that is connected to the measurement terminal and flows through the electronic component. A measuring instrument that measures the electrical characteristics of the electronic component, a contact member that contacts the surface of the electronic component opposite to the surface on which the measurement terminal contacts, and the contact member. And a load sensor that measures the magnitude of the load when the measurement terminal is brought into contact with the external electrode of the electronic component.

  In the electrical characteristic measuring apparatus, instead of providing the load sensor on the contact member, the load sensor itself may be used as the contact member.

  Furthermore, the electrical characteristic measuring device includes a storage unit that stores a correlation formula between a magnitude of a load when the measurement terminal is brought into contact with the external electrode and a measurement error amount of the electrical characteristic, which is created in advance, An arithmetic means for correcting the measured electrical characteristic measured at the measurement terminal based on the magnitude of the load value measured by the load sensor based on the equation may be provided. In this case, it is possible to obtain a highly accurate measurement result in which a measurement error caused by a load caused when the measurement terminal contacts the external electrode of the electronic component is corrected.

  Furthermore, the electrical property measuring apparatus may include a calculation unit that corrects the measured electrical property based on a difference between a reference temperature serving as a reference and the temperature of the electronic component during measurement. In this case, in addition to the correction of the measurement error caused by the load when the measurement terminal contacts the external electrode of the electronic component, the measurement error caused by the difference between the reference temperature and the measurement temperature is also combined. It can be corrected.

  As an electrical characteristic to be measured, for example, a resistance value can be raised. However, the electrical characteristics to be measured are not limited to resistance values, and may be other electrical characteristics such as capacitance values and inductance values.

  According to the electrical characteristic measurement method for an electronic component of the present invention, it is possible to obtain a highly accurate measurement result in which a measurement error caused by a load caused when the measurement terminal contacts the external electrode of the electronic component is corrected. . Based on the measurement result, it is possible to make an appropriate non-defective / defective product determination. In addition, the electrical characteristic measurement method of the present invention monitors the magnitude of the load and does not control the magnitude of the load when the measurement terminal comes into contact with the external electrode of the electronic component. Since the measurement results are obtained with high accuracy, the electrical characteristics of the electronic component can be measured by driving the measurement device at high speed. Therefore, according to the electrical characteristic measuring method of the present invention, even when the electrical characteristics are measured in the manufacturing process of the electronic component, for example, the productivity of the electronic component is not reduced, and the manufacturing cost of the electronic component is reduced. Will not become expensive.

  In addition, the electrical property measuring apparatus of the present invention can obtain a highly accurate measurement result in which a measurement error caused by a load caused when the measurement terminal comes into contact with the external electrode of the electronic component is corrected. Based on the measurement result, it is possible to make an appropriate non-defective / defective product determination. In addition, the electrical characteristic measuring device of the present invention has a simple structure in which a load sensor is provided on a contact member that abuts a surface opposite to a surface that a measurement terminal of an electronic component abuts at the time of measurement. Can be manufactured. Also, maintenance work is simple, and maintenance costs can be kept low.

It is a conceptual diagram of the electrical property measuring apparatus 100 used for the electrical property measuring method of the electronic component concerning 1st Embodiment. 3 is a cross-sectional view of a main part of the electrical characteristic measuring apparatus 100. FIG. 4 is a bottom view of a reference electronic component A and a measured electronic component B. FIG. It is a flowchart of the electrical property measuring method of the electronic component concerning 1st Embodiment. It is a flowchart of the electrical property measuring method of the electronic component concerning 2nd Embodiment. It is a flowchart of the electrical property measuring method of the electronic component concerning 3rd Embodiment. It is a flowchart of the electrical property measuring method of the electronic component concerning 4th Embodiment. It is a flowchart of the electrical property measuring method of the electronic component concerning 5th Embodiment.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 shows an electrical characteristic measuring apparatus 100 used in the present embodiment. However, FIG. 1 is a conceptual diagram of the electrical characteristic measuring apparatus 100. FIG. 1 also shows a reference electronic component A and a measured electronic component B.

  The reference electronic component A and the electronic component B to be measured are electronic components of the same type and the same standard, and are NTC thermistors in this embodiment. However, the type of the electronic component is arbitrary and is not limited to the NTC thermistor, and may be a PTC thermistor, a fixed resistor, a capacitor, an inductor, or the like. The reference electronic component A includes a pair of external electrodes Aa and Ab, and the electronic component B to be measured includes a pair of external electrodes Ba and Bb. However, the number of external electrodes included in each is not limited to one pair, and may be larger than that.

  The electrical characteristic measuring apparatus 100 includes a parts feeder 1 that sequentially supplies a plurality of electronic components B to be measured. The parts feeder 1 includes a rotating plate 2 that is rotated by a motor, and sequentially supplies a large number of electronic components B to be measured placed on the rotating plate 2 as the rotating plate 2 rotates.

  The parts feeder 1 is connected to the linear feeder 3. The linear feeder 3 includes a conveyor and conveys the electronic component B to be measured supplied from the parts feeder 1 in a straight line.

  The linear feeder 3 is connected to an index table 5 provided on the measurement base 4. The index table 5 has a disk shape, and a plurality of recesses 5a for accommodating the electronic component B to be measured are formed on the outer periphery thereof. The index table 5 is intermittently rotated by a motor in a state where the measured electronic component B is accommodated in the recess 5a.

  Although not shown in FIG. 1, the measured electronic component B accommodated in the recess 5 a is conveyed around the index table 5 in a circular shape as the index table 5 rotates. An index guide is provided as appropriate. Further, although not shown in FIG. 1, an index cover may be provided on the upper surface of the index table 5.

  The measurement base 4 includes a reference electronic component measurement region S for measuring the electrical characteristics of the reference electronic component A.

  In addition, the measurement base 4 includes a measured electronic component measurement region T that measures the electrical characteristics of the measured electronic component B in the vicinity of the reference electronic component measurement region S. The electronic component B to be measured is sequentially conveyed by the index table 5 to the electronic component measurement area T to be measured.

  FIG. 2 shows a cross-sectional view of the reference electronic component measurement region S and the measured electronic component measurement region T. FIG. 2 shows a portion XX in FIG.

  As shown in FIG. 2, the reference electronic component measurement region S is provided with a cavity 6 that accommodates the reference electronic component A. The cavity 6 includes a measurement base 4, guides 7 a and 7 b, and a contact member 8. The contact member 8 is a member that contacts the upper surface of the reference electronic component A.

  Further, as shown in FIG. 2, a cavity 9 for accommodating the electronic component B to be measured is provided in the electronic component measurement area T to be measured. The cavity 9 includes a measurement base 4, a recess 5 a of the index table 5, a guide 7 c, and a contact member 10. The contact member 10 is a member that contacts the upper surface of the electronic component B to be measured.

  For example, four holes are provided in the measurement base 4 of the cavity 6 portion, and two pairs of measurement terminals 11a, 11b, 12a, and 12b are disposed in the four holes. The measurement terminals 11a, 11b, 12a, and 12b are for contacting the external electrodes Aa and Ab of the reference electronic component A. The measurement terminals 11a, 11b, 12a, and 12b are attached to the measurement terminal drive mechanism 15 and are not constantly affected by the pressure of the reference electronic component A at a pressure that does not affect the measurement electrical characteristics of the reference electronic component A (does not cause a measurement error). It is in contact with the external electrodes Aa and Ab.

  In the present embodiment, the measurement terminals 11a, 11b, 12a, and 12b attached to the measurement terminal drive mechanism 15 are always in contact with the external electrodes Aa and Ab of the reference electronic component A with a constant pressure. Instead, by driving the measurement terminal drive mechanism 15, the measurement terminals 11 a, 11 b, 12 a, and 12 b are intermittently brought into contact with the external electrodes Aa and Ab of the reference electronic component A every time measurement is performed. Also good. However, in this case, the magnitude of the load when the measurement terminals 11a, 11b, 12a, 12b contact the external electrodes Aa, Ab of the electronic component A to be measured is measured, and the measured resistance value of the reference electronic component A is measured. Therefore, it is necessary to correct the measurement error caused by the load.

  The measurement base 4 in the cavity 9 portion is also provided with, for example, four holes, and two pairs of measurement terminals 13a, 13b, 14a, and 14b are arranged in the four holes. The measurement terminals 13a, 13b, 14a, and 14b are for contacting the external electrodes Ba and Bb of the electronic component B to be measured. The measurement terminals 13a, 13b, 14a, and 14b are attached to the measurement terminal drive mechanism 16, and are intermittently brought into contact with the external electrodes Ba and Bb of the electronic component B to be measured by driving the measurement terminal drive mechanism 16.

  A load sensor 17 is provided on the contact member 10 of the cavity 9. The load sensor 17 is for measuring the magnitude of the load when the measurement terminals 13a, 13b, 14a, 14b are in contact with the external electrodes Ba, Bb of the electronic component B to be measured. Note that the load refers to a load measured within the time when the measurement terminals 13a, 13b, 14a, and 14b are in contact with the external electrodes Ba and Bb of the electronic component B to be measured.

  As shown in FIG. 1, the electrical characteristic measuring apparatus 100 includes a measuring device 18. The measuring terminal 11a, 11b, 12a, 12b and the measuring terminal 13a, 13b, 14a, 14b are connected to the measuring device 18. The measuring device 18 is for measuring the electrical characteristics of the reference electronic component A and the electrical characteristics of the electronic component B to be measured.

  FIG. 3 shows the bottom surfaces of the reference electronic component A and the electronic component B to be measured. Further, FIG. 3 shows a portion where the measurement terminals 11a, 11b, 12a, 12b of the external electrodes Aa, Ab of the reference electronic component A abut, and measurement terminals 13a, 13b of the external electrodes Ba, Bb of the electronic component B to be measured. , 14a and 14b are shown by broken lines.

  For example, the measuring instrument 18 can measure the resistance value of the reference electronic component A by passing a current of a predetermined value between the measurement terminals 11a and 11b and measuring the voltage between the measurement terminals 12a and 12b. Further, the measuring device 18 can measure the resistance value of the reference electronic component B by flowing a current of a predetermined value between the measurement terminals 13a and 13b and measuring the voltage between the measurement terminals 14a and 14b.

  In the present embodiment, the single measuring instrument 18 measures the electrical characteristics of the reference electronic component A and the electrical characteristics of the electronic component B to be measured. You may provide separately the measuring device to measure, and the measuring device to measure the electrical property of the to-be-measured electronic component B. FIG.

  The electrical characteristic measuring apparatus 100 includes a personal computer (hereinafter referred to as “PC”) 19. The PC 19 includes at least a storage device, an arithmetic device, an input interface, an output interface, and the like.

  The PC 19 is connected to the drive system of the parts feeder 1, the linear feeder 3, the index table 5, and the measurement terminal drive mechanism 16. The storage device of the PC 19 stores a predetermined computer program for controlling the parts feeder 1, the linear feeder 3, the index table 5, and the measurement terminal drive mechanism 16, and the PC 19 includes the parts feeder 1, the linear feeder 3, The index table 5 and the measurement terminal drive mechanism 16 are controlled.

  The PC 19 is connected to the load sensor 17. An amplifier 20 and an analog / digital converter 21 are inserted between the load sensor 17 and the PC 19.

  The PC 19 is connected to the measuring instrument 18.

  Further, in the storage device of the PC 19, the magnitude of the load when the measurement terminals 13a, 13b, 14a, 14b, which will be described later, are brought into contact with the external electrodes Ba, Bb of the electronic component B to be measured, and the measurement device 18 are used. A correlation equation (correlation data) with the measurement error amount of the measured electrical characteristics (measurement resistance value) is stored.

  The measurement base 4 of the electrical characteristic measuring apparatus 100 includes a defective product exclusion region U that excludes the measured electronic component B that is determined to be defective after measuring the electrical characteristics. The defective product exclusion area U is provided with a rejection mechanism (not shown) that excludes the measured electronic component B determined to be defective from the recess 5a of the index table 5. The rejection mechanism is connected to the PC 19 and excludes the measured electronic component B, which is determined as a defective product by the computing device of the PC 19, from the recess 5 a of the index table 5.

  Furthermore, the measurement base 4 of the electrical characteristic measuring apparatus 100 removes the measured electronic component B determined to be defective, and then collects the measured electronic component recovery area R for recovering the measured electronic component B determined to be non-defective. Is provided. In the present embodiment, the electronic component B to be measured, which is determined to be a non-defective product, is uniformly collected. However, the electronic component B to be measured is connected to the PC 19 according to the measurement result of the electrical characteristics (resistance value). You may make it select and collect | recover.

  Next, a method for measuring electrical characteristics of electronic components using the electrical characteristic measuring apparatus 100 will be described. In the present embodiment, as described above, an NTC thermistor is used as the electronic component B to be measured, and the resistance value of the electronic component B to be measured is measured as an electrical characteristic. Further, as the reference electronic component A, an NTC thermistor of the same type and the same standard as the electronic component B to be measured is used.

  Prior to the measurement, a reference electronic component (reference NTC thermistor) A that is strictly provided with a required resistance value (electrical characteristic) is selected from a plurality of NTC thermistors in advance. Specifically, for example, when it is necessary to measure the resistance value at 25 ° C., the resistance value of the plurality of NTC thermistors is measured after the measurement temperature is strictly maintained at 25 ° C. An NTC thermistor with strict values is selected as the reference electronic component A. A plurality of reference electronic components A are selected.

  Prior to the measurement, a correlation equation (correlation data) between the magnitude (deviation) of the load when the measurement terminal is brought into contact with the external electrode using the reference electronic component A and the resistance measurement error amount in advance. ). Specifically, each of the cavity 6 that accommodates the reference electronic component A and the cavity 9 that originally accommodates the electronic component B to be measured has a strictly standard resistance value of the electrical characteristic measuring apparatus 100. The reference electronic component A is accommodated. Subsequently, while monitoring the magnitude of the load with the load sensor 17, the measurement terminal drive mechanism 16 is controlled and driven, and the reference load (the reference electronic component A housed in the cavity 9 when measured at the reference temperature) When the measurement terminal is brought into contact with the external electrode by measuring the resistance value multiple times while forcibly shifting the load slightly in the plus or minus direction from the load at which the true resistance value is measured) The correlation formula between the magnitude of the load and the measurement error amount of the resistance value is created. At this time, the index table 5 is stopped and is not rotated. The correlation formula is created after correcting the measurement error caused by the magnitude of the difference between the reference temperature and the measured temperature.

  Alternatively, instead of the above method, a correlation equation between the magnitude of the load when the measurement terminal is brought into contact with the external electrode and the measurement error amount of the resistance value can be created by the following method. First, a plurality of reference electronic components A having strict reference resistance values are prepared. Next, one reference electronic component A is accommodated in the cavity 6, and the remaining reference electronic component A is put on the rotating plate 2 of the parts feeder 1. Next, the electrical characteristic measuring apparatus 100 is actually driven, and the resistance values of the plurality of reference electronic components A are measured. In this measurement, from the relationship between the magnitude of the load when the measurement terminal is brought into contact with the external electrode and the measurement resistance value, the measurement error amount of the magnitude of the load and the resistance value when the measurement terminal is brought into contact with the external electrode A correlation equation can be created.

  The created correlation equation between the magnitude of the load when the measurement terminal is brought into contact with the external electrode and the measurement error amount of the resistance value is stored in the storage device of the PC 19.

  Prior to the measurement, an allowable range of the resistance value (electrical characteristic) for determining that the electronic component B to be measured is a non-defective product is stored in the storage device of the PC 19 in advance. Further, in the case where at least one of the case where the magnitude of the load value measured by the load sensor 17 is smaller than a predetermined threshold and is larger than the predetermined threshold, the measured electron is If it is determined that the part B is defective, those threshold values are stored in the storage device of the PC 19.

  After the above preparation, measurement is started. FIG. 4 shows a flow of a method for measuring the electrical characteristics of the electronic component according to the present embodiment.

  First, the reference electronic component A is accommodated in the cavity 6, and a plurality of electronic components B to be measured are placed on the rotating plate 2 of the parts feeder 1.

  Next, based on the control of the PC 19, the parts feeder 1, the linear feeder 3, and the index table 5 each start driving. As a result, the measured electronic component B is sequentially transferred to the measured electronic component measurement area T of the measurement base 4.

  When the first (first) measured electronic component B approaches the cavity 9 in the measured electronic component measurement region T of the measurement base 4, the measurement terminal drive mechanism 16 starts driving based on the control of the PC 19.

  Then, the resistance value of the reference electronic component A is measured by the measuring device 18 via the measurement terminals 11a, 11b, 12a, and 12b, and the measured resistance value of the reference electronic component A is obtained. At the same time, the resistance value of the first electronic component B to be measured is measured by the measuring instrument 18 via the measurement terminals 13a, 13b, 14a, 14b, and the measured resistance value of the electronic component B to be measured is obtained. Note that the measurement of the resistance value of the reference electronic component A and the measurement of the resistance value of the electronic component B to be measured need not be strictly the same, and may be slightly shifted in time.

  In measuring the resistance value of the electronic component B to be measured, the load sensor 17 determines the magnitude of the load when the measurement terminals 13a, 13b, 14a, 14b abut on the external electrodes Ba, Bb of the electronic component B to be measured. Measured.

  The measurement resistance value of the first electronic component B to be measured and the measurement resistance value of the reference electronic component A measured at the same time are transmitted from the measuring instrument 18 to the PC 19. Further, the magnitude of the load measured by the load sensor 17 when the resistance value of the first electronic component B to be measured is measured is transmitted from the load sensor 17 to the PC 19.

  Next, the following arithmetic processing is performed in the arithmetic unit of the PC 19.

  First, based on the correlation equation stored in the storage device of the PC 19 when the measurement terminal is brought into contact with the external electrode and the measurement error amount of the resistance value, the load measured by the load sensor 17 is calculated. The measurement resistance value of the first electronic component B to be measured is corrected according to the size. As a result, the measurement error caused by the load when the measurement terminal is brought into contact with the external electrode is removed from the measurement resistance value of the first electronic component B to be measured.

Next, the deviation (measured value deviation rate) of the measured resistance value R ₁ of the measured thermistor after the measurement error caused by the load is removed with respect to the measured resistance value R ₀ of the reference thermistor is calculated by Equation 1. Ask for.
Deviation (%) = (R ₁ −R ₀ ) / R ₀ × 100 (Equation 1)
The calculation of the deviation may be performed independently after the calculation of removing the measurement error caused by the load when the measurement terminal is brought into contact with the external electrode, but the measurement terminal is brought into contact with the external electrode. It may be performed simultaneously with the calculation for removing the measurement error caused by the load at the time.

  Next, the first measured electronic component B is judged to be non-defective or defective based on whether or not the obtained deviation is within a predetermined allowable range, and is classified. If it is within the predetermined allowable range, the first electronic component B to be measured is judged as a non-defective product, and if it is outside the predetermined allowable range, the first electronic component B to be measured is a defective product. To be judged. Note that the allowable range of the resistance value at which the electronic component B to be measured is determined to be non-defective is stored in advance in the storage device of the PC 19. The determination of whether the product is non-defective or defective is performed after the measurement error caused by the load is removed, and the measurement error due to the difference between the measurement temperature and the reference temperature is extremely small. Is high.

  The determination as to whether the product is a non-defective product or a defective product may be completed as described above. Further, as an arbitrary setting (calculation process), even if the obtained deviation is within a predetermined allowable range, the load sensor 17 is used for measurement. The measured electronic component B is determined to be defective when at least one of the case where the magnitude of the applied load value is small exceeding a predetermined threshold and the case where it is large exceeding a predetermined threshold. You may make it do. If the magnitude of the load value is small beyond a predetermined threshold, the contact resistance between the measurement terminal and the external electrode is large, and a measurement error exceeding the correctable limit occurs in the measured resistance value. It is because there is a possibility that. In addition, when the magnitude of the load value is larger than a predetermined threshold, there is a possibility that a defect such as a crack has occurred in the electronic component B to be measured, or the external electrode Ba of the electronic component B to be measured. This is because there is a possibility that an appearance defect such as a contact mark has occurred in Bb, or that there is a possibility that a measurement error exceeding the correctable limit may occur in the measured resistance value. The determination of the non-defective / defective product of the measured electronic component B based on the magnitude of the load value measured by the load sensor 17 is performed before the determination of the acceptable / defective product of the measured electronic component B based on the deviation described above. It may be later or later.

  The determination result of whether the first measured electronic component B is a non-defective product or a defective product is stored in the storage device of the PC 19.

  When it is determined that the first measured electronic component B is a non-defective product, the first measured electronic component B is collected as a non-defective product in the measured electronic component collection area R.

  On the other hand, when it is determined that the first electronic component B to be measured is a defective product, the first electronic device B to be measured is an exclusion mechanism (not shown) controlled by the PC 19 in the defective product exclusion area U. Therefore, it is excluded as a defective product.

  With the above method, the resistance value of the first electronic component B to be measured is measured. The measured resistance value corrects the measurement error caused by the load when the measurement terminal is in contact with the external electrode, and the measurement error caused by the difference between the reference temperature and the measurement temperature is extremely small. It is extremely accurate.

  Thereafter, the resistance value of the second and subsequent measured electronic components B is measured by the same method.

[Second Embodiment]
FIG. 5 shows a flow of a method for measuring electrical characteristics of an electronic component according to the second embodiment. In addition, the electrical property measuring method of the electronic component concerning 2nd Embodiment is also performed using the electrical property measuring apparatus 100. FIG.

  In the electrical characteristic measurement method of the electronic component according to the first embodiment described above, as shown in FIG. 4, the measurement caused due to the load when the measurement terminal is brought into contact with the external electrode of the electronic component B to be measured. The error was corrected first, and the deviation of the measured resistance value of the measured thermistor (after the measurement error caused by the load was removed) with respect to the measured resistance value of the reference thermistor was obtained later.

  In the method for measuring the electrical characteristics of the electronic component according to the second embodiment, this order is changed. That is, the deviation of the measured resistance value of the measured thermistor relative to the measured resistance value of the reference thermistor is obtained first, and the measurement error caused by the load when the measuring terminal is brought into contact with the external electrode of the measured electronic component B is calculated. It was corrected later.

  The other steps of the method for measuring electrical characteristics of electronic components according to the second embodiment are the same as those of the method for measuring electrical characteristics of electronic components according to the first embodiment.

[Third Embodiment]
FIG. 6 shows a flow of a method for measuring electrical characteristics of an electronic component according to the third embodiment. In addition, the electrical property measuring method of the electronic component concerning 3rd Embodiment is also performed using the electrical property measuring apparatus 100. FIG.

  In the electrical characteristic measurement method of the electronic component according to the first embodiment described above, as shown in FIG. 4, the measurement caused due to the load when the measurement terminal is brought into contact with the external electrode of the electronic component B to be measured. The error was corrected first, and the deviation of the measured resistance value of the measured thermistor (after the measurement error caused by the load was removed) with respect to the measured resistance value of the reference thermistor was obtained later.

  In the method for measuring the electrical characteristics of the electronic component according to the third embodiment, the above two operations were performed simultaneously. That is, the calculation of correction of the measurement error caused by the load when the measurement terminal is brought into contact with the external electrode of the electronic component B to be measured, and the deviation of the measured resistance value of the measured thermistor from the measured resistance value of the reference thermistor The calculation was performed at the same time.

  The other steps of the method for measuring the electrical characteristics of the electronic component according to the third embodiment are the same as those of the method for measuring the electrical characteristics of the electronic component according to the first embodiment.

[Fourth Embodiment]
FIG. 7 shows a flow of a method for measuring electrical characteristics of an electronic component according to the fourth embodiment. In addition, the electrical property measuring method of the electronic component concerning 4th Embodiment is also performed using the electrical property measuring apparatus 100. FIG.

  In the method for measuring the electrical characteristics of the electronic component according to the fourth embodiment, one step is added to the method for measuring the electrical characteristics of the electronic component according to the first embodiment shown in FIG. 4 described above. Specifically, correction of the measurement error caused by the load when the measurement terminal is brought into contact with the external electrode of the electronic component B to be measured, and the measurement resistance value of the measurement thermistor with respect to the measurement resistance value of the reference thermistor After the calculation of the deviation is finished, when the magnitude of the load value measured by the load sensor 17 is smaller than a predetermined threshold and larger than a predetermined threshold, the measured electronic component A step for judging B as a defective product was added.

  If the magnitude of the load value is small beyond a predetermined threshold, the contact resistance between the measurement terminal and the external electrode is large, and a measurement error exceeding the correctable limit occurs in the measured resistance value. It is because there is a possibility that. In addition, when the magnitude of the load value is larger than a predetermined threshold, there is a possibility that a defect such as a crack has occurred in the electronic component B to be measured, or the external electrode Ba of the electronic component B to be measured. This is because there is a possibility that an appearance defect such as a contact mark has occurred in Bb, or that there is a possibility that a measurement error exceeding the correctable limit may occur in the measured resistance value.

  The other steps of the method for measuring electrical characteristics of electronic components according to the fourth embodiment are the same as those of the method for measuring electrical characteristics of electronic components according to the first embodiment.

[Fifth Embodiment]
FIG. 8 shows a flow of a method for measuring electrical characteristics of an electronic component according to the fifth embodiment.

  In the electrical characteristic measurement method of the electronic component according to the first to fourth embodiments described above, the measurement error caused by the load when the measurement terminal is brought into contact with the external electrode of the electronic component B to be measured. In addition to correcting the measurement, the deviation of the measured resistance value of the measured thermistor from the measured resistance value of the reference thermistor is calculated to reduce the measurement error caused by the difference between the reference temperature and the measured temperature.

  In the electrical characteristic measuring method of the electronic component according to the fifth embodiment, the deviation of the measured resistance value of the measured thermistor from the measured resistance value of the reference thermistor is not calculated, and the measurement terminal is connected to the external electrode of the measured electronic component B. Only the correction of the measurement error caused by the load at the time of contact is made. That is, the resistance value (electrical characteristic) after correcting the measurement error caused by the load when the measurement terminal is brought into contact with the external electrode of the electronic component B to be measured is within a predetermined allowable range. Whether or not the thermistor to be measured is good or bad is determined based on whether or not it is present.

  For example, when measuring the electrical characteristics of an electronic component in a strictly temperature-controlled environment, it is not necessary to correct (reduce) the measurement error caused by the difference between the reference temperature and the measured temperature. In this case, it becomes possible to measure the electrical characteristics of the electronic component with a measurement device simpler than the electrical property measurement device 100 described above.

  As described above, in the method for measuring electrical characteristics of an electronic component according to the present invention, correction (reduction) of a measurement error caused by a difference between the reference temperature and the measurement temperature is not an essential configuration.

  Heretofore, the method for measuring the electrical characteristics of the electronic component according to the first to fifth embodiments and the configuration and operation of the electrical characteristic measuring apparatus 100 have been described. However, the present invention is not limited to the contents described above, and various modifications can be made in accordance with the spirit of the invention.

  For example, in the first to fifth embodiments, the resistance value of the NTC thermistor is measured, but the type of electronic component is not limited to the NTC thermistor, and the measured electrical characteristics are not limited to the resistance value. For example, the resistance value of a PTC thermistor or a fixed resistor may be measured, or the capacitor's capacitance value or inductor's inductance value may be measured.

In the first to fourth embodiments, a deviation of the measured resistance value R ₁ of the measurement thermistor for measuring the resistance value R ₀ of the reference thermistor, is within the allowable range set obtained deviation advance Whether the product is good or defective is determined based on whether or not the measurement error due to the difference between the measurement temperature of the measured thermistor and the reference temperature is reduced. Instead of the measurement error caused by the difference between the measurement temperature of the measured thermistor and the reference temperature, the measurement error caused by the load when the measurement terminal contacts the external electrode of the measured thermistor Similar to the correction, create a correlation formula between the magnitude of the deviation between the reference temperature and the measured temperature and the measurement error amount of the resistance value, and measure the reference thermistor and measured thermistor from the correlation formula and the measured resistance value of the reference thermistor The temperature may be calculated, and the measured resistance value of the thermistor to be measured may be corrected by the correlation equation based on the calculated temperature.

  In addition, the electrical characteristic measuring apparatus 100 includes the PC 19, but instead of the PC 19, a dedicated storage device, a dedicated arithmetic device, or the like may be incorporated in the electrical characteristic measuring apparatus 100 itself.

  Furthermore, although the electrical characteristic measuring apparatus 100 is provided with the load sensor 17 on the contact member 10, the contact member 10 may be omitted, and the load sensor 17 itself may also function as the contact member.

DESCRIPTION OF SYMBOLS 1 ... Parts feeder 2 ... Rotary plate 3 ... Linear feeder 4 ... Measurement base 5 ... Index table 5a ... Concave part 6 ... Cavity (reference electronic component A is accommodated)
7a, 7b, 7c ... guide 8 ... contact member 9 ... cavity (accommodates electronic component B to be measured)
DESCRIPTION OF SYMBOLS 10 ... Contact member 11a, 11b, 12a, 12b, 13a, 13b, 14a, 14b ... Measurement terminal 15, 16 ... Measurement terminal drive mechanism 17 ... Load sensor 18 ... Measuring device 19 ... Personal computer (PC)
20 ... Amplifier 21 ... Analog / digital converter A ... Reference electronic component (NTC thermistor)
B: Electronic component to be measured (NTC thermistor)
S: reference electronic component measurement region T: measured electronic component measurement region U: defective product exclusion region R: measured electronic component recovery region 100: electrical characteristic measuring device

Claims (10)

An electrical characteristic measurement method for measuring an electrical characteristic of the electronic component by contacting an external electrode of the electronic component with a measurement terminal, detecting an electrical signal flowing through the electronic component with a measuring instrument connected to the measurement terminal Because
Creating a correlation formula between the magnitude of the load when the measurement terminal is brought into contact with the external electrode in advance and the measurement error amount of the electrical characteristics;
When the measurement terminal is brought into contact with the external electrode of the electronic component, an electric signal flowing through the electronic component is detected by the measuring instrument, and an electric characteristic of the electronic component is measured to obtain a measured electric characteristic. At the same time, measuring the magnitude of the load in the contact with a load sensor to obtain a load value;
Correcting the measured electrical characteristics based on the magnitude of the load value based on the correlation equation.   The electrical property measurement method according to claim 1, further comprising a step of correcting the measured electrical property based on a difference between a reference temperature serving as a reference and a temperature of the electronic component at the time of measurement.   The electronic component according to claim 1, further comprising a step of classifying the electronic component as a non-defective product or a defective product depending on whether or not the corrected electrical characteristics of the electronic component are within a predetermined allowable range. The electrical property measurement method described.   Further, the step of determining the electronic component as a defective product in at least one of a case where the magnitude of the load value is small exceeding a predetermined threshold and a case where the magnitude is larger than a predetermined threshold. The method for measuring electrical characteristics according to any one of claims 1 to 3, further comprising:   The electrical property measuring method according to claim 1, wherein the electrical property is a resistance value. A measurement terminal that contacts the external electrode of the electronic component;
A measuring instrument connected to the measurement terminal for detecting an electrical signal flowing through the electronic component and measuring an electrical characteristic of the electronic component;
A contact member that abuts on the surface of the electronic component opposite to the surface on which the measurement terminal abuts,
An electrical characteristic measurement device comprising: a load sensor provided on the contact member for measuring the magnitude of a load when the measurement terminal is brought into contact with the external electrode of the electronic component. A measurement terminal that contacts the external electrode of the electronic component;
A measuring instrument connected to the measurement terminal for detecting an electrical signal flowing through the electronic component and measuring an electrical characteristic of the electronic component;
During measurement, the magnitude of the load when the electronic component abuts on the surface opposite to the surface on which the measurement terminal abuts and the measurement terminal abuts on the external electrode of the electronic component And a load sensor for measuring the electrical characteristic measuring device. Furthermore, a storage unit that stores a correlation formula between a magnitude of a load when the measurement terminal is brought into contact with the external electrode and a measurement error amount of electrical characteristics, which is created in advance,
The calculation means according to claim 6, further comprising: an arithmetic unit that corrects a measured electrical characteristic measured at the measurement terminal based on a magnitude of a load value measured by the load sensor based on the correlation equation. Electrical characteristic measuring device.   The calculation device according to any one of claims 6 to 8, further comprising calculation means for correcting the measurement electrical characteristics based on a difference between a reference temperature serving as a reference and a temperature of the electronic component at the time of measurement. Electrical characteristic measuring device.   The electrical property measuring device according to claim 6, wherein the electrical property is a resistance value.

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