JPWO2016159315A1 - 合金材料、コンタクトプローブおよび接続端子 - Google Patents
合金材料、コンタクトプローブおよび接続端子 Download PDFInfo
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- JPWO2016159315A1 JPWO2016159315A1 JP2017510230A JP2017510230A JPWO2016159315A1 JP WO2016159315 A1 JPWO2016159315 A1 JP WO2016159315A1 JP 2017510230 A JP2017510230 A JP 2017510230A JP 2017510230 A JP2017510230 A JP 2017510230A JP WO2016159315 A1 JPWO2016159315 A1 JP WO2016159315A1
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- 239000000956 alloy Substances 0.000 title claims abstract description 60
- 239000000523 sample Substances 0.000 title claims description 54
- 239000010949 copper Substances 0.000 claims abstract description 49
- 239000000203 mixture Substances 0.000 claims abstract description 42
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000011651 chromium Substances 0.000 claims abstract description 23
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 22
- 229910002058 ternary alloy Inorganic materials 0.000 claims abstract description 22
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 19
- 229910052741 iridium Inorganic materials 0.000 claims abstract description 16
- 229910052709 silver Inorganic materials 0.000 claims abstract description 15
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 14
- 229910052718 tin Inorganic materials 0.000 claims abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000004332 silver Substances 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 4
- 239000010941 cobalt Substances 0.000 claims abstract description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 4
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims abstract description 4
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 238000007689 inspection Methods 0.000 description 25
- 239000004065 semiconductor Substances 0.000 description 23
- 229910002668 Pd-Cu Inorganic materials 0.000 description 16
- 229910052725 zinc Inorganic materials 0.000 description 15
- 239000011701 zinc Substances 0.000 description 15
- 230000032683 aging Effects 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 238000005096 rolling process Methods 0.000 description 10
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000010944 silver (metal) Substances 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000003483 aging Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001330 spinodal decomposition reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
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- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
- Contacts (AREA)
Abstract
Description
2 コンタクトプローブ(プローブ)
3 プローブホルダ
4 ホルダ部材
21 第1プランジャ
22 第2プランジャ
23 コイルばね
23a 密着巻き部
23b 粗巻き部
31 第1部材
32 第2部材
33,34 ホルダ孔
100 半導体集積回路
101 接続用電極
200 回路基板
201 電極
Claims (6)
- 銀(Ag)、パラジウム(Pd)、銅(Cu)の3元合金の組成領域において、Agが20〜30wt%、Pdが35〜55wt%、Cuが20〜40wt%を占める組成とし、該組成を基本として、スズ(Sn)を0.5〜2.5wt%の範囲で添加し、さらにコバルト(Co)、クロム(Cr)および亜鉛(Zn)のいずれか1つ若しくはこれらの組み合わせを0.1〜1.0wt%の範囲で添加するとともに、イリジウム(Ir)およびルテニウム(Ru)のいずれか1つ若しくはこれらの組み合わせを0.01〜0.1wt%添加してなることを特徴とする合金材料。
- リン(P)を0.003〜0.03wt%さらに添加してなることを特徴とする請求項1に記載の合金材料。
- 加熱により時効処理させたビッカース硬さが、480〜560であることを特徴とする請求項1または2に記載の合金材料。
- 長手方向の両端で接触対象とそれぞれ接触する導電性のコンタクトプローブであって、
少なくとも一部が、請求項1〜3のいずれか一つに記載の合金材料を用いて形成されたことを特徴とするコンタクトプローブ。 - 一端で一方の接触対象と接触する導電性の第1プランジャと、
一端で他方の接触対象と接触する導電性の第2プランジャと、
前記第1および第2プランジャの間に設けられて該第1および第2プランジャを伸縮自在に連結するコイルばねと、を有し、
前記第1プランジャ、前記第2プランジャおよび前記コイルばねのうち、少なくとも一つが前記合金材料からなることを特徴とする請求項4に記載のコンタクトプローブ。 - 長手方向の両端で接触対象とそれぞれ接触する導電性の接続端子であって、
少なくとも一部が、請求項1〜3のいずれか一つに記載の合金材料を用いて形成されたことを特徴とする接続端子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015074330 | 2015-03-31 | ||
JP2015074330 | 2015-03-31 | ||
PCT/JP2016/060829 WO2016159315A1 (ja) | 2015-03-31 | 2016-03-31 | 合金材料、コンタクトプローブおよび接続端子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016159315A1 true JPWO2016159315A1 (ja) | 2018-09-13 |
JP6550457B2 JP6550457B2 (ja) | 2019-07-24 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2017510230A Active JP6550457B2 (ja) | 2015-03-31 | 2016-03-31 | 合金材料、コンタクトプローブおよび接続端子 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10889878B2 (ja) |
JP (1) | JP6550457B2 (ja) |
PH (1) | PH12017501772A1 (ja) |
SG (1) | SG11201708015XA (ja) |
TW (1) | TWI567207B (ja) |
WO (1) | WO2016159315A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3595094B1 (en) * | 2017-03-07 | 2023-05-03 | Mitsubishi Materials Corporation | Corrosion-resistant terminal material, corrosion-resistant terminal, and wire end structure |
JP7005939B2 (ja) * | 2017-05-25 | 2022-01-24 | 日本電産リード株式会社 | コンタクトプローブ |
CH715163A2 (fr) * | 2018-07-10 | 2020-01-15 | Blancpain Sa | Composant d'horlogerie avec partie arbrée en alliage amagnétique. |
EP3960890A1 (de) * | 2020-09-01 | 2022-03-02 | Heraeus Deutschland GmbH & Co. KG | Palladium-kupfer-silber-ruthenium-legierung |
EP4234733A1 (de) | 2022-02-28 | 2023-08-30 | Heraeus Deutschland GmbH & Co. KG | Palladium-kupfer-silber-legeriung |
CN117026055B (zh) * | 2023-10-09 | 2024-01-12 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试探针用钯合金及其制备方法 |
CN118374715B (zh) * | 2024-06-24 | 2024-09-06 | 汕头市骏码凯撒有限公司 | 一种晶圆测试用高强韧度耐磨耗性抗沾黏的探针材料及其制备工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013099682A1 (ja) * | 2011-12-27 | 2013-07-04 | 株式会社徳力本店 | 電気・電子機器用のPd合金 |
WO2014021465A1 (ja) * | 2012-08-03 | 2014-02-06 | 山本貴金属地金株式会社 | 合金材料、コンタクトプローブおよび接続端子 |
WO2014049874A1 (ja) * | 2012-09-28 | 2014-04-03 | 株式会社徳力本店 | 電気・電子機器用途のAg‐Pd‐Cu‐Co合金 |
JP2014114465A (ja) * | 2012-12-06 | 2014-06-26 | Ishifuku Metal Ind Co Ltd | Ag基合金からなるプローブピン |
-
2016
- 2016-03-31 JP JP2017510230A patent/JP6550457B2/ja active Active
- 2016-03-31 SG SG11201708015XA patent/SG11201708015XA/en unknown
- 2016-03-31 TW TW105110495A patent/TWI567207B/zh active
- 2016-03-31 US US15/562,580 patent/US10889878B2/en active Active
- 2016-03-31 WO PCT/JP2016/060829 patent/WO2016159315A1/ja active Application Filing
-
2017
- 2017-09-26 PH PH12017501772A patent/PH12017501772A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013099682A1 (ja) * | 2011-12-27 | 2013-07-04 | 株式会社徳力本店 | 電気・電子機器用のPd合金 |
WO2014021465A1 (ja) * | 2012-08-03 | 2014-02-06 | 山本貴金属地金株式会社 | 合金材料、コンタクトプローブおよび接続端子 |
WO2014049874A1 (ja) * | 2012-09-28 | 2014-04-03 | 株式会社徳力本店 | 電気・電子機器用途のAg‐Pd‐Cu‐Co合金 |
JP2014114465A (ja) * | 2012-12-06 | 2014-06-26 | Ishifuku Metal Ind Co Ltd | Ag基合金からなるプローブピン |
Also Published As
Publication number | Publication date |
---|---|
PH12017501772A1 (en) | 2018-03-19 |
US20180105902A1 (en) | 2018-04-19 |
TW201700745A (zh) | 2017-01-01 |
JP6550457B2 (ja) | 2019-07-24 |
TWI567207B (zh) | 2017-01-21 |
WO2016159315A1 (ja) | 2016-10-06 |
SG11201708015XA (en) | 2017-10-30 |
US10889878B2 (en) | 2021-01-12 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |