JPWO2016035631A1 - 部品内蔵基板 - Google Patents
部品内蔵基板 Download PDFInfo
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- JPWO2016035631A1 JPWO2016035631A1 JP2016546578A JP2016546578A JPWO2016035631A1 JP WO2016035631 A1 JPWO2016035631 A1 JP WO2016035631A1 JP 2016546578 A JP2016546578 A JP 2016546578A JP 2016546578 A JP2016546578 A JP 2016546578A JP WO2016035631 A1 JPWO2016035631 A1 JP WO2016035631A1
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- thermoplastic resin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H05K2201/09527—Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
Abstract
Description
以下、本発明の第1の実施形態に係る部品内蔵基板10について説明する。図1は、部品内蔵基板10の構造を示す側面断面図である。
次に、第1の実施形態の変形例に係る回路モジュール10Aおよび部品内蔵基板11Aについて説明する。図3は、回路モジュール10Aおよび部品内蔵基板11Aの構造を示す側面断面図である。
以下、本発明の第2の実施形態に係る部品内蔵基板10Bについて説明する。図4は、部品内蔵基板10Bの構造を示す側面断面図である。
10A…回路モジュール
11,11B…積層体
111,112,113,114,115,116,114A,115A,116A,111B,112B,113B,114B,115B…熱可塑性樹脂基材
21,22,21B,22B…電子部品
211,212,221,222,211B,212B,221B,222B…端子
23A,24A…コネクタ部品
31,31B…配線部
331,332,341,342,343,351,344A,345A,331B,332B,333B,334B,341B…平面導体
431,441,442,443,451,431B,432B,433B,441B…層間接続導体
431DP,441DP,442DP,443DP,451DP,431BDP,432BDP,433BDP,441BDP…導電ペースト
431TH,441TH,442TH,443TH,451TH…貫通孔
82,85,82B,84B…穴
Claims (4)
- 複数の熱可塑性樹脂基材を積層方向に積層した積層体と、
前記積層体の内部に配置され、第1の端子が設けられた第1の部品と、
前記積層体の内部で前記第1の部品と前記積層方向に異なる位置に配置され、第2の端子が設けられた第2の部品と、
前記積層体の内部に配置され、前記第1の端子と前記第2の端子とに接続される配線部と、
を備え、
前記第1の部品は、前記積層方向において前記第1の端子を前記第2の部品側に向けて配置され、
前記第2の部品は、前記積層方向において前記第2の端子を前記第1の部品側に向けて配置され、
前記配線部は、前記第1の端子が超音波接合により直接接合する第1の平面導体と、前記第2の端子が直接接合し、前記第1の平面導体に導通する第1の層間接続導体と、を含む、
部品内蔵基板。 - 前記第1の平面導体は、前記積層方向において前記第1の部品と前記第2の部品との間に配置されている、
請求項1に記載の部品内蔵基板。 - 前記第1の部品は、前記第1の端子を含む複数の端子を備え、
前記第2の部品は、前記第2の端子を含む複数の端子を備え、
前記第1の部品における複数の端子の配置間隔は、前記第2の部品における複数の端子の配置間隔よりも狭い、
請求項1または請求項2に記載の部品内蔵基板。 - 前記第1の層間接続導体は、前記第1の平面導体に直接接合している、請求項1乃至請求項3のいずれかに記載の部品内蔵基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014180354 | 2014-09-04 | ||
JP2014180354 | 2014-09-04 | ||
PCT/JP2015/073953 WO2016035631A1 (ja) | 2014-09-04 | 2015-08-26 | 部品内蔵基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016035631A1 true JPWO2016035631A1 (ja) | 2017-04-27 |
JP6233524B2 JP6233524B2 (ja) | 2017-11-22 |
Family
ID=55439696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016546578A Active JP6233524B2 (ja) | 2014-09-04 | 2015-08-26 | 部品内蔵基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10028388B2 (ja) |
JP (1) | JP6233524B2 (ja) |
CN (1) | CN206908962U (ja) |
WO (1) | WO2016035631A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN210725458U (zh) * | 2017-03-02 | 2020-06-09 | 株式会社村田制作所 | 树脂多层基板以及电子设备 |
JP6891582B2 (ja) * | 2017-03-27 | 2021-06-18 | 横河電機株式会社 | 防爆部品実装基板 |
KR102173615B1 (ko) * | 2018-07-19 | 2020-11-03 | 스템코 주식회사 | 다층 회로 기판 및 그 제조 방법 |
CN112351571B (zh) * | 2019-08-06 | 2022-08-16 | 奥特斯(中国)有限公司 | 半柔性部件承载件及其制造方法 |
Citations (13)
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JP2002305382A (ja) * | 2001-02-05 | 2002-10-18 | Denso Corp | プリント基板およびその製造方法 |
JP2003086949A (ja) * | 2001-06-13 | 2003-03-20 | Denso Corp | プリント基板の製造方法およびその製造方法によって形成されるプリント基板 |
JP2003264369A (ja) * | 2002-03-07 | 2003-09-19 | Denso Corp | プリント基板の製造方法及びプリント基板の構造 |
JP2004152963A (ja) * | 2002-10-30 | 2004-05-27 | Denso Corp | 電子回路と外部部品との接続方法 |
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WO2015198870A1 (ja) * | 2014-06-23 | 2015-12-30 | 株式会社村田製作所 | 部品内蔵基板および部品内蔵基板の製造方法 |
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-
2015
- 2015-08-26 WO PCT/JP2015/073953 patent/WO2016035631A1/ja active Application Filing
- 2015-08-26 CN CN201590000925.4U patent/CN206908962U/zh active Active
- 2015-08-26 JP JP2016546578A patent/JP6233524B2/ja active Active
-
2017
- 2017-02-13 US US15/430,869 patent/US10028388B2/en active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002305382A (ja) * | 2001-02-05 | 2002-10-18 | Denso Corp | プリント基板およびその製造方法 |
JP2003086949A (ja) * | 2001-06-13 | 2003-03-20 | Denso Corp | プリント基板の製造方法およびその製造方法によって形成されるプリント基板 |
JP2003264369A (ja) * | 2002-03-07 | 2003-09-19 | Denso Corp | プリント基板の製造方法及びプリント基板の構造 |
JP2004152963A (ja) * | 2002-10-30 | 2004-05-27 | Denso Corp | 電子回路と外部部品との接続方法 |
JP2006344631A (ja) * | 2005-06-07 | 2006-12-21 | Murata Mfg Co Ltd | 部品内蔵基板 |
JP2011249410A (ja) * | 2010-05-24 | 2011-12-08 | Denso Corp | 半導体装置 |
JP2012182390A (ja) * | 2011-03-02 | 2012-09-20 | Murata Mfg Co Ltd | リジッドフレキシブル基板およびその製造方法 |
JP2012209383A (ja) * | 2011-03-29 | 2012-10-25 | Murata Mfg Co Ltd | 多層基板およびその製造方法 |
WO2012141096A1 (ja) * | 2011-04-13 | 2012-10-18 | 株式会社村田製作所 | フレキシブル多層基板 |
WO2012147550A1 (ja) * | 2011-04-27 | 2012-11-01 | 株式会社村田製作所 | フレキシブル多層基板 |
JP2013207194A (ja) * | 2012-03-29 | 2013-10-07 | Kyocera Corp | 部品内蔵基板および実装構造体 |
WO2014069107A1 (ja) * | 2012-10-31 | 2014-05-08 | 株式会社村田製作所 | 部品内蔵基板および通信端末装置 |
WO2015198870A1 (ja) * | 2014-06-23 | 2015-12-30 | 株式会社村田製作所 | 部品内蔵基板および部品内蔵基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6233524B2 (ja) | 2017-11-22 |
US20170156214A1 (en) | 2017-06-01 |
WO2016035631A1 (ja) | 2016-03-10 |
US10028388B2 (en) | 2018-07-17 |
CN206908962U (zh) | 2018-01-19 |
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