JPWO2015045057A1 - Substrate inspection apparatus and substrate inspection method - Google Patents

Abstract

The present invention provides a substrate inspection apparatus that is disposed in the middle of a component mounting line for producing a substrate on which a plurality of components are mounted, inspects the mounted components, and inspects the mounting positions of the components to be mounted on the substrate. A means for setting an area on the board required for inspection of a mounted part as a part inspection area, a means for listing a part to be mounted together with its mounting position in a post-process parts list, A means for setting the area on the board required for the inspection of the presence or absence of foreign matter at the mounting position based on the process parts list, and the inspection based on the status information acquired for the parts inspection area and the foreign substance inspection area Means for implementing. Thereby, the area on the substrate required for the inspection of the mounting position is automatically set as the foreign substance inspection area, so that the labor of the operator's preparatory work can be reduced and the operator's special skill can be eliminated.

Description

  The present invention relates to a board inspection apparatus disposed in the middle of a component mounting line for producing a board on which a plurality of components are mounted, and a board inspection method performed in the middle of a component mounting process.

  There are solder printing devices, component mounting devices, reflow devices, substrate inspection devices, etc., as devices that produce substrates with a large number of components mounted, and it is common to build a substrate production line by connecting them with a substrate transport device It has become. Furthermore, considering the case where the number of parts to be mounted is large, a component mounting line is often configured by arranging a plurality of component mounting apparatuses. In order to inspect the mounting state of the components mounted on the board, a board inspection device is disposed on the downstream side of the component mounting line, as exemplified in Patent Document 1. As an inspection method, an image processing method is mainly employed in which the mounting state of components on a board is imaged by a camera, and the acquired image data is subjected to image processing to determine pass / fail, and the determination accuracy is high.

  The mounting line of Patent Document 1 includes a mounting machine and an inspection machine, a mounting machine control unit that controls the mounting machine based on production data, and an inspection machine control unit that controls the inspection machine based on inspection data. Furthermore, a means for obtaining data necessary for inspection from production data and creating inspection data is provided. Thereby, the creation of inspection data can be easily performed.

  Here, in the case where components are stacked and mounted at a certain mounting position, for example, when there is a shield component covering the specific component, the specific component cannot be imaged after the shield component is mounted. Therefore, in order to inspect the mounting state of the specific component, it is necessary to dispose the board inspection device between the upstream component mounting device for mounting the specific component and the downstream component mounting device for mounting the shield component. In a component mounting line that uses this arrangement, the component is accidentally dropped or dust is introduced by the mounting operation of the upstream component mounting device. There is a risk of foreign matter entering. For this reason, it is preferable to inspect the presence or absence of foreign matter on the substrate by the substrate inspection apparatus, and in particular, it is important to inspect the mounting position of the shield component to be mounted.

  Note that the component to be mounted on the downstream side of the board inspection apparatus is not limited to the shield component. For example, when there is a large part that cannot be supplied by the feeder-type part supply mechanism of the upstream part mounting apparatus, the large part is supplied and mounted from the tray-type part supply mechanism provided in the downstream part mounting apparatus. Can be considered. Even in such a case, it is preferable to inspect the presence or absence of foreign matter at the mounting position of the large component by the board inspection apparatus. Further, the inspection performed at the mounting position is not limited to the inspection for the presence or absence of foreign matter, and for example, the inspection of the fitting seat on the substrate of the shield component to be mounted by fitting can be considered.

  The applicant of the present application discloses a technical example of a system in which a board inspection apparatus is incorporated in this type of component mounting line and a component inspection method in the system. The component mounting system of Patent Document 2 includes a component mounting line in which a plurality of component mounting devices are arranged in series, and an inspection device that inspects in an inspection area set in an imaging screen acquired by the imaging device, and is further inspected Setting means is provided. The inspection target setting means has a mounting position in the inspection area based on mounting data indicating the type and mounting position of each component mounted on each component mounting apparatus and data on the inspection area specified on the board. Set the parts to be inspected. Thereby, the inspection can be performed only by the operator appropriately specifying the inspection area on the imaging screen, and the time required for the inspection can be greatly reduced.

  Furthermore, Claim 3 of Patent Document 2 discloses an aspect in which a part to be coated (specific part) covered with a covering part (shield part) is excluded from an inspection target. Thereby, it is possible to prevent an inspection error due to the inability to recognize the part to be coated by the imaging device in the inspection. As described above, automation / labor saving is progressing in setting a part inspection area for inspecting a mounted part.

JP 2006-339260 A JP 2012-89552 A

  By the way, in the technical examples of Patent Document 1 and Patent Document 2, it is intended to reduce the time and labor saving of inspection and preparation work by using a component already mounted on the upstream side of the board inspection apparatus as an inspection target. For this reason, it is not considered to check the presence / absence of a foreign substance at the mounting position of a component to be mounted on the downstream side. Since the image processing method for inspecting the presence or absence of foreign matter on a board is different from the image processing method for inspecting mounted parts, at present, an operator has a foreign matter inspection area for inspecting the presence or absence of foreign matters while checking the state of the board. It is manually specified. This is a preparatory work performed before the start of the production work, and it takes time and labor to specify the foreign matter inspection area. In addition, workers need special skills. However, the region on the board where inspection for the presence or absence of foreign matter is important can be specified to some extent from production data such as mounting positions and external dimensions of components to be mounted.

  The present invention has been made in view of the above-mentioned problems of the background art, and an area on a board that is required for inspection of a mounting position of a component to be mounted is automatically set as a foreign object inspection area so that an operator's It is an object to be solved to provide a substrate inspection apparatus and a substrate inspection method that reduce the labor of preparation work and eliminate the need for special skills of the operator.

  The invention of the board inspection apparatus according to claim 1 for solving the above-mentioned problem is arranged in the middle of a component mounting line for producing a substrate on which a plurality of components are mounted, inspects the mounted components and mounts them from now on. A board inspection apparatus for inspecting a mounting position of a component on the substrate, wherein a component inspection area setting means for setting a region on the substrate required for inspection of the mounted component as a component inspection area; List generating means for listing components to be mounted together with their mounting positions in a post-process component list, and an area on the substrate required for inspection of the presence or absence of foreign matter at the mounting position based on the post-process component list A foreign substance inspection area setting means for setting a foreign substance inspection area, and a test for performing an inspection based on state information acquired for the component inspection area and the foreign substance inspection area. And execution means, comprising a.

  According to this, based on the post-process component list that lists the components to be mounted together with their mounting positions, it is possible to set an area on the board that is required for the inspection of the presence or absence of foreign materials at the mounting position as the foreign material inspection area. Since this setting operation is performed automatically, the labor of the operator's preparatory work is reduced and the operator's special skill is not required. In addition, the presence or absence of foreign matter at the mounting position of the component to be mounted on the board can be inspected reliably and without leakage.

  According to a seventh aspect of the present invention, there is provided a substrate inspection method according to a seventh aspect of the present invention, wherein the substrate of the component to be mounted is inspected in the component mounting step for producing a substrate on which a plurality of components are mounted. A substrate inspection method for inspecting an upper mounting position, a component inspection area setting step for setting an area on the substrate required for inspection of the mounted component as a component inspection area, and the component to be mounted from now on A list generation step for listing the position on the substrate together with the mounting position, and a region on the substrate required for the inspection of the presence or absence of the foreign material at the mounting position based on the post-process component list. A foreign substance inspection area setting step to be set in the inspection, and an inspection for performing inspection based on the state information acquired with respect to the component inspection area and the foreign substance inspection area And facilities step, with a.

  According to this, the present invention can be implemented as a method instead of an apparatus, and the same effect as in claim 1 is produced.

It is the top view which illustrated the whole structure of the component mounting line incorporating the board | substrate inspection apparatus of 1st Embodiment. It is the top view which showed the apparatus structure of the board | substrate inspection apparatus of 1st Embodiment. It is the figure which illustrated production data and inspection data memorized by memory of a host computer. It is the top view which illustrated the board | substrate produced with a component mounting line. It is a figure of the operation | movement flow which shows operation | movement of the board | substrate inspection apparatus of 1st Embodiment. It is the figure which illustrated parts data and mounting data among production data about another substrate. It is the top view which illustrated another substrate produced with a component mounting line. It is a figure of the operation | movement flow which shows operation | movement of the board | substrate inspection apparatus of 2nd Embodiment.

  A substrate inspection apparatus according to a first embodiment of the present invention will be described with reference to FIGS. First, the overall configuration of the component mounting line 9 incorporating the board inspection apparatus 4 of the first embodiment will be described. FIG. 1 is a plan view illustrating the overall configuration of the component mounting line 9. As shown in the drawing, the component mounting line 9 includes the first component mounting device 1, the second component mounting device 2, the board inspection device 4, and the third component mounting device 3 in this order on the upstream side (left side in FIG. 1). Are arranged in a row from the downstream side to the downstream side (the right side in FIG. 1). Each of the four devices 1 to 4 is provided with a substrate transfer device 5. Each board transfer device 5 sequentially carries the board into and out of the first component mounting device 1, the second component mounting device 2, the board inspection device 4, and the third component mounting device 3. The direction from the left side to the right side in FIG. 1 for transporting the substrate is defined as the X direction, and the direction from the lower side to the upper side in FIG. 1 perpendicular to the X direction in the horizontal plane is defined as the Y direction.

  Each of the four devices 1 to 4 includes control devices 11, 21, 31, and 41 that control their operations. Each control device 11, 21, 31, 41 is connected to the host computer 6 via a communication cable 61 serving as a data transmission bus. An unillustrated board loader, solder printing device, and solder inspection device are arranged in the X direction in this order on the upstream side of the first component mounting device 1. Further, on the downstream side of the third component mounting device 3, a reflow device and a board unloader (not shown) are arranged in the X direction in this order. Thereby, the substrate production line is constructed. The number of component mounting devices arranged on the upstream side and the downstream side of the board inspection device 4 may be different from the overall configuration of FIG.

  The first component mounting device 1 and the second component mounting device 2 have the same configuration, and the former 1 will be described as an example. The first component mounting apparatus 1 includes a control device 11, a board positioning unit, a component supply unit 13, a head drive mechanism 14, and a component mounting head 15. A substrate positioning unit (not shown) positions the substrate carried in by the substrate transport device 5 at the mounting position. The component supply part 13 has a some feeder mechanism so that attachment or detachment is possible. Each feeder mechanism pulls out a tape containing a large number of components at regular intervals from the reel, and sequentially supplies the components to the respective supply positions. The head driving mechanism 14 includes an X direction moving mechanism and a Y direction moving mechanism, and drives the component mounting head 15 in the XY plane. The component mounting head 15 includes a suction nozzle 16, a nozzle drive mechanism (not shown), and a board camera 17. The suction nozzle 16 is disposed downward, and picks up a component from each supply position of the component supply unit 13 and mounts it on the substrate. The nozzle drive mechanism rotates and vertically moves the suction nozzle 16. The substrate camera 17 images the positioned substrate, confirms the type of the substrate, and detects a positioning error.

  The third component mounting apparatus 3 includes a control device 31, a board positioning unit, a component supply unit 33, a head drive mechanism 34, and a component mounting head 35. The structures of the board positioning unit, the head drive mechanism 34, and the component mounting head 35 are the same as those of the first component mounting device 1 and the second component mounting device 2, and thus description thereof is omitted. The component supply unit 33 sequentially supplies components from a plurality of tray mechanisms. Each tray mechanism holds a rectangular dish-shaped tray accommodating a large number of parts in a lattice shape so as to be replaceable. The tray mechanism can supply large parts and special parts that cannot be supplied by the feeder mechanism. Examples of large parts and special parts include, but are not limited to, a ball grid array part in which a plurality of connection terminals are arranged in a two-dimensional array, and a shield part that shields another part arranged inside.

  FIG. 2 is a plan view showing the apparatus configuration of the substrate inspection apparatus 4 of the first embodiment. The substrate inspection apparatus 4 includes a control device 41 (not shown), a substrate positioning unit, a head drive mechanism 44, an inspection head 45, an inspection camera 48, and a machine base 49. The machine base 49 is firmly formed, and the control device 41, the substrate positioning unit, and the head drive mechanism 44 are assembled. The substrate positioning unit positions the substrate K (displayed with hatching for convenience) carried in by the substrate transport device 5 at the inspection execution position 42.

  The head driving mechanism 44 includes an X-direction moving mechanism 46 and a Y-direction moving mechanism 47, and drives the inspection head 45 in the XY plane. The X direction moving mechanism 46 includes an X slider 461 and a pair of X driving units 462. Each X drive unit 462 includes an X servo motor 463 and an X ball screw 464 that is rotationally connected to the output shaft of the X servo motor 463. The X slider 461 is screwed into a pair of X ball screws 464 and is held so as to be movable in the X direction. When the pair of X servo motors 463 rotationally drive the X ball screws 464, the X slider 461 moves in the X direction.

  The Y direction moving mechanism 47 is provided on the X slider 461. The Y-direction moving mechanism 47 includes a Y slider 471 and a Y driving unit 472. The Y drive unit 472 includes a Y servo motor 473 and a Y ball screw (not shown) that is rotationally connected to the output shaft of the Y servo motor 473. The Y slider 471 is held so as to be movable in the Y direction by screwing into a Y ball screw. When the Y servo motor 473 rotationally drives the Y ball screw, the Y slider 471 moves in the Y direction.

  The inspection head 45 is fixed to the Y slider 471. The inspection head 45 has an inspection camera 48 disposed downward. The imaging field of view of the inspection camera 48 is rectangular, and the size thereof is constant in the X direction range XL and the Y direction range YW (see FIGS. 4 and 7). The imaging field of view of the inspection camera 48 is limited to at least one of the imaging distance and resolution, and the entire image of the substrate K does not enter. For this reason, the substrate K is divided into a plurality of imaging fields, and the inspection camera 48 is moved to perform imaging a plurality of times to acquire a plurality of image data. Further, the imaging field range on the substrate K is determined simply by specifying the imaging coordinate values (Xc, Yc) on the substrate K as the reference point of the imaging field. The inspection camera 48 captures one or a plurality of imaging fields including a component inspection area and a foreign substance inspection area on the board K, and acquires one or a plurality of image data corresponding to the state information. Corresponds to the imaging unit.

  Image data acquired by imaging by the inspection camera 48 is taken into the control device 41 via a signal cable (not shown) or via wireless communication. The control device 41 has a function corresponding to an image inspection unit of the present invention that performs inspection by performing image processing on image data.

  Returning to FIG. 1, the host computer 6 is a general computer that includes a CPU, a memory, an input / output interface, and the like and operates by software. The memory stores a main control program for controlling the entire operation of the component mounting line 9, various production data, inspection data, and the like. A general computer is also used for the control devices 11, 21, 31, and 41 of the devices 1 to 4. Production data is transmitted from the host computer 6 to the control devices 11, 21, and 31 via the communication cable 61, and inspection data is transmitted to the control device 41.

  FIG. 3 is a diagram illustrating production data and inspection data stored in the memory of the host computer 6. As production data, array data, component data, and mounting data can be exemplified, and imaging data can be exemplified as inspection data. These data are mutually transmitted and shared with the control devices 11, 21, 31, 41 of the devices 1 to 4 as necessary. The array data is data composed of the arrangement order of the devices 1 to 4 under the control of the host computer 6, the specifications of the devices 1 to 4, and the like. The arrangement data indicates the line configuration of the component mounting line 9 and does not change while the line configuration is not rearranged. On the other hand, a large number of component data, mounting data, and imaging data are stored or sequentially changed corresponding to the type of board K to be produced and the component type of the component to be used.

  The component data is data in which component types P1 to P8 of components to be mounted on the board K are associated with component specifications. In FIG. 3, the external dimensions of each component, that is, the lengthwise dimensions L1 to L8 and the widthwise dimensions W1 to W8 are shown as an example of the component specifications. The part specification is not limited to this, and may include various items.

  The mounting data is data that designates an operation of mounting the components of the component types P1 to P8 on the board K. The mounting data is configured by associating a component type, a mounting coordinate value, a mounting direction, and a mounting device. For example, for the component of component type P1 in FIG. 3, the first component is such that the center of the component is located at the mounting coordinate value (X1, Y1) on the substrate K and the longitudinal direction of the component coincides with the Y direction. The fact that it is mounted by the mounting apparatus 1 is specified. Further, for example, for the component of the component type P8, the third component mounting apparatus 3 is arranged such that the center of the component is located at the mounting coordinate value (X8, Y8) on the substrate K and the longitudinal direction of the component is aligned with the X direction. It is specified that it will be installed.

  The imaging data is data that designates the imaging field of view of the inspection camera 48 when the substrate inspection apparatus 4 performs the inspection. The imaging data is configured by associating an imaging order, imaging coordinate values, and an inspection application. For example, in the imaging sequence 1 in FIG. 3, the reference point of the imaging field of the inspection camera 48 is moved to the imaging coordinate values (Xc1, Yc1), and the acquired image data is used for the inspection of the mounted parts. Is specified. Further, for example, in the imaging sequence 3, the reference point of the imaging field of the inspection camera 48 is moved to the imaging coordinate values (Xc3, Yc3), and the acquired image data is checked for the presence / absence of foreign matter at the mounting position of the component to be mounted. Designated to be used for inspection. Furthermore, in the imaging sequence 4, the reference point of the imaging field of the inspection camera 48 is moved to the imaging coordinate values (Xc4, Yc4) and imaged, and the acquired image data is inspected for the mounted component and the component to be mounted in the future. It is specified to be commonly used for the inspection of the presence or absence of foreign matter at the position. The imaging data is generated in the process of the operation flow of the board inspection apparatus 4 described later.

  Next, the operation and action of the substrate inspection apparatus 4 according to the first embodiment will be described with reference to the produced substrate K1. FIG. 4 is a plan view illustrating the board K1 produced by the component mounting line 9. The substrate K1 is a two-piece substrate K1 that is divided into two unit substrates K11 and K12 after being taken out by the substrate unloader on the downstream side. Since the two unit substrates K11 and K12 are the same product, the left unit substrate K11 will be mainly described below. The board K1 is simplified for the sake of brevity of description of the present invention, and many more parts are often mounted on a general board.

  Of the production information related to the two-chip board K1, the part data and the mounting data are the same as those in FIG. As shown in the mounting data of FIG. 3, the components of the component types P1 to P4 are mounted by the first component mounting apparatus 1 so that the longitudinal direction of the components matches the Y direction. In addition, each component of component types P5 to P7 is mounted by the second component mounting apparatus 2 so that the longitudinal direction of the component matches the X direction. Furthermore, the component of the component type P8 is mounted by the third component mounting apparatus 3 so that the longitudinal direction of the component matches the X direction. The component of the component type P8 is a post-process component (shown by a broken line in FIG. 4) that is not yet mounted when the substrate inspection apparatus 4 inspects the substrate K1. A ball grid array component can be illustrated as a component of the component type P8, but is not limited thereto.

  FIG. 5 is an operational flow diagram illustrating the operation of the substrate inspection apparatus 4 according to the first embodiment. In step S1 of the operation flow of FIG. 5, the control device 41 of the board inspection apparatus 4 acquires production data relating to component mounting, that is, component data and mounting data of FIG. Next, in step S2, the control device 41 performs component inspection on an area on the board K1 required for inspection of components of the component types P1 to P7 already mounted by the first component mounting device 1 and the second component mounting device 2. Set to area.

  At this time, based on the component data, considering the component dimensions (L1 to L7, W1 to W7) for each component type P1 to P7, a predetermined inspection margin width is added, and each component inspection area (not shown) is set. Can be set. Also, considering parts of a plurality of parts types P1 to P7 collectively, a range located on the substrate K1 is obtained by arithmetic processing, a predetermined inspection margin width is added, and a part inspection area (not shown) is set. May be. Furthermore, the entire region of the imaging field of view described later obtained by considering the component types of the component types P1 to P7 together may be used as the component inspection area.

  Next, in step S3, the control device 41 sets one or a plurality of imaging fields including the part inspection area. In the two-chip board K1 shown in FIG. 4, it is impossible to collectively include the component inspection areas of the two unit boards K11 and K12 in one imaging field because of the limitation of the size of the imaging field. . Still, the component inspection area for each of the unit boards K11 and K12 can be included in one imaging field of view. Accordingly, a total of two imaging visual fields Ph1 and Ph2 (indicated by a one-dot chain line in FIG. 4) are set on the two-piece substrate K1.

  Next, in step S4, the control device 41 determines the presence / absence of a post-process component, and if not, proceeds to step S13. In the two-chip board K1, since the component type P8 is a post-process component, the process proceeds to step S5, and a post-process component list is generated. The post-process component list is a list of components to be mounted together with their mounting positions. In the two-chip board K1, since the post-process component is one component type, the stage of the component type P8 of the component data becomes the post-process component list as it is. In general, there may be a plurality of post-process components, and a line configuration in which a plurality of component mounting devices are arranged on the downstream side of the board inspection device 4 is also conceivable. Therefore, it is possible to avoid complications of various data by generating the post-process component list.

  Next, the control device 41 repeats the processing loop related to the post-process part from step S6 to step S12 by the quantity of the part type of the post-process part. More specifically, in step S7, the control device 41 indicates the area on the board required for the inspection of the presence or absence of the foreign substance at the mounting position on the basis of the post-process component list, as shown in the foreign substance inspection area At1 (shown by the one-dot chain line in FIG. 4). ). At this time, the foreign substance inspection area At1 can be set by adding a predetermined inspection margin width Mg to the external dimensions (L8, W8) of the component of the component type P8. The size of the foreign matter inspection area At1 is (L8 + Mg) in the X direction and (W8 + Mg) in the Y direction. Further, in consideration of the mounting coordinate values (X8, Y8) of the component type P8, the coordinate value range of the foreign matter inspection area At1 is {X8− (L8 + Mg) / 2} to {X8 + (L8 + Mg) / 2} in the X direction. And {Y8− (W8 + Mg) / 2} to {Y8 + (W8 + Mg) / 2} in the Y direction. Note that the foreign substance inspection area At2 (indicated by the alternate long and short dash line in FIG. 4) can be set in the same manner on the right unit substrate K12.

  Next, in step S8, the control device 41 determines whether or not the foreign object inspection areas At1 and At2 are included in the set imaging visual fields Ph1 and Ph2. In the two-piece substrate K1, the set imaging visual fields Ph1 and Ph2 include the foreign substance inspection areas At1 and At2, and the process proceeds to step S9. In step S9, the control device 41 sets the imaging fields of view Ph1 and Ph2 in common. By common setting, the image data acquired with respect to the imaging fields of view Ph1 and P2 can be commonly used for the inspection of the mounted parts and the inspection of the presence or absence of foreign matters at the mounting positions of the post-process parts. Next, it progresses to step S11 and it is determined whether it is the last post process component. In the two-chip board K1, since the post-process component is one component type, steps S7 to S12 are performed once, and the process goes to step S13.

  In step S13 after the production of the two-piece substrate K1 is started, the substrate inspection apparatus 4 images the two-piece substrate K1 and performs an inspection. Specifically, the substrate inspection apparatus 4 performs imaging for each set imaging field of view Ph1 and Ph2. Then, the board inspection apparatus 4 performs image processing on the image data acquired for the imaging fields of view Ph1 and Ph2 set in common, and inspects the components of the mounted component types P1 to P7. Furthermore, the board inspection apparatus 4 performs image processing on the foreign matter inspection areas At1 and At2 in the image data, and inspects for the presence or absence of foreign matter.

  In the inspection of the mounting state of the mounted component types P1 to P7, a known method can be appropriately employed. Image processing may be performed on the entire area of the image data of the imaging fields Ph1 and Ph2 by a known method, or image processing may be performed only on a limited part inspection area in the image data.

  Also, a known method can be appropriately employed in the inspection of the presence or absence of foreign matter at the mounting position of the post-process component of the component type P8. It is preferable to perform image processing only for the foreign substance inspection areas At1 and At2 in the image data by a known method. As a result, the amount of data to be subjected to image processing can be reduced, the calculation load related to the inspection for the presence or absence of foreign matter that requires a relatively long time can be reduced, and the time required for inspection can be shortened. Note that the inspection in the foreign matter inspection areas At1 and At2 is not necessarily limited to the inspection for the presence or absence of foreign matter. For example, the state of the fitting seat on the board may be inspected when the post-process component is a shield component fitted into the fitting seat instead of being mounted by soldering.

  Next, the operation when the substrate inspection apparatus 4 according to the first embodiment targets another substrate K2 will be described. FIG. 6 is a diagram illustrating part data and mounting data among the production data related to another board K2. FIG. 7 is a plan view illustrating another board K2 produced by the component mounting line 9. Another substrate K2 is a two-piece substrate K2 that produces the same two unit substrates K21 and K22. However, as shown in the component data in FIG. 6 and FIG. 7, in another board K2, a large component of the component type P9 is further added to the components of the component types P1 to P8.

  Then, as shown in the mounting data in FIG. 6 and FIG. 7, the mounting coordinate values (X11 to X18, Y11 to Y18) of the components of the component types P1 to P8 are on the Y direction negative side with respect to the two-piece substrate K1. (The lower side of the drawing in FIG. 7), and the mounting device corresponds to the case of the two-piece substrate K1. In addition, the added large component of component type P9 is a post-process component mounted by the third component mounting apparatus, and a total of two component types, including the component type P8, are post-process components. (A broken line is shown in FIG. 7). As shown in FIG. 7, the mounting coordinate values (X19, Y19) of the large component of the component type P9 are located on the Y direction positive side of the component of the component type P7 (upward in the drawing in FIG. 7).

  When the substrate inspection apparatus 4 of the first embodiment performs the operation flow shown in FIG. 5 for another substrate K2, the operation from step S1 to step S4 is the same as in the case of the two-piece substrate K1. That is, the control device 41 of the board inspection apparatus 4 sets the area on the board K1 required for the inspection of the mounted parts types P1 to P7 as the part inspection area, and includes two parts including the part inspection area. Imaging fields of view Ph3 and Ph4 are set.

  In step S5, the control device 41 generates a post-process component list corresponding to the stages of the component type P8 and the component type P9 of the component data. Next, the control device 41 repeats the processing loop regarding the post-process components from step S6 to step S12 for the components of the component type P8 and the component type P9, respectively. First, the component type P8 is operated in the same manner as in the case of the two-chip board K1, and two foreign substance inspection areas At3 and At4 (indicated by a one-dot chain line in FIG. 7) are set. Further, the foreign substance inspection areas At3 and At4 are set. The included imaging fields of view Ph3 and Ph4 (indicated by a one-dot chain line in FIG. 7) are set in common.

  Next, for the component type P9, in step S7, the control device 41 adds a predetermined inspection margin width Mg to the external dimensions (L9, W9) of the component type P9 and adds foreign substance inspection areas At5, At6 ( 1) is set. Next, in step S8, the control device 41 determines whether or not the foreign object inspection areas At5 and At6 are included in the set imaging visual fields Ph3 and Ph4. On the other substrate K2, the foreign matter inspection areas At5 and At6 are not included in the set imaging visual fields Ph3 and Ph4, so the process proceeds to step S10. In step S10, the control device 41 newly sets another imaging visual fields Ph5 and Ph6 (indicated by a one-dot chain line in FIG. 7) including the foreign object inspection areas At5 and At6. Thereafter, the process exits from step S11 to step S13 via step S12.

  In step S13 after the production of another substrate K2 is started, the substrate inspection apparatus 4 images another substrate K2 and performs inspection. Specifically, the board inspection apparatus 4 performs imaging for each set imaging field of view Ph3 to Ph6. Then, the board inspection apparatus 4 performs image processing on the image data acquired for the imaging fields Ph3 and Ph4 set in common, and inspects the components of the mounted component types P1 to P7. Further, the substrate inspection apparatus 4 performs image processing on the foreign matter inspection areas At3 and At4 in the image data to inspect for the presence of foreign matter. In addition, the substrate inspection apparatus 4 performs image processing on the foreign matter inspection areas At5 and At6 of the image data acquired regarding the imaging visual fields Ph5 and Ph6 to inspect for the presence of foreign matter.

  Note that the above-described substrates K1 and K2 are simplified examples for explanation, and in reality, many imaging fields are often set. In many cases, the imaging field of view includes the part inspection area and does not include the foreign substance inspection area, and the imaging field of view including the foreign substance inspection area decreases.

  Steps S2 and S3 in the operation flow correspond to the part inspection area setting means of the present invention. Step S5 corresponds to list generation means, and steps S7 to S10 correspond to foreign substance inspection area setting means. Further, step S13 corresponds to an inspection execution unit.

  Furthermore, the arithmetic processing from step S1 to step S12 of the operation flow shown in FIG. 5 can be performed not by the control device 41 of the substrate inspection apparatus 4 but by the host computer 6 or an external computer sharing the production data. In this case, the result of the arithmetic processing is transmitted from the host computer 6 or an external computer to the control device 41 of the substrate inspection apparatus 4 between step S12 and step S13. Further, it can be considered as the substrate inspection apparatus 4 including the arithmetic processing function of the host computer 6 or an external computer.

  The board inspection apparatus 4 according to the first embodiment is disposed in the middle of a component mounting line 9 for producing a board (two-chip board K1) on which a plurality of parts (component types P1 to P8) are mounted, and has been mounted. A board inspection apparatus 4 that inspects components (component types P1 to P7) and inspects the mounting position of a component (component type P8) to be mounted on the substrate K1, and is required for the inspection of the mounted components. A component inspection area setting means for setting an area on the board to be a part inspection area, a list generation means for listing a part to be mounted together with its mounting position in a post-process part list, and mounting based on the post-process part list A foreign substance inspection area setting means for setting a region on the substrate required for the presence or absence of a foreign substance at a position as a foreign substance inspection area At1, At2, a component inspection area and a foreign substance inspection area At1, And a, and inspection means for executing a test based on the acquired state information with respect to t2.

  According to this, based on the post-process component list that lists the parts to be mounted (part type P8) together with their mounting positions, the area on the board that is required for the inspection for the presence or absence of foreign substances at the mounting positions is checked for foreign substances. It can be set in areas At1 and At2. Since this setting operation is performed automatically, the labor of the operator's preparatory work is reduced and the operator's special skill is not required. In addition, the presence or absence of foreign matter at the mounting position on the substrate K1 of the component to be mounted (component type P8) can be reliably and without leakage.

  Further, in the first embodiment, the inspection execution unit performs imaging on one or a plurality of imaging visual fields Ph1 and Ph2 including the component inspection area and the foreign matter inspection areas At1 and At2 on the board K1, and corresponds to the state information. An image capturing unit (inspection camera 48) that acquires one or a plurality of image data to be processed, and an image inspection unit (control device 41) that performs image processing on the image data to perform inspection.

  According to this, both the inspection of the mounted parts (part types P1 to P7) and the inspection of the mounting position on the board K1 of the parts to be mounted (part type P8) can be performed using the image processing method. The accuracy of pass / fail judgment is high.

  Further, in the first embodiment, the component inspection area setting means sets the imaging visual fields Ph1 and Ph2 including the component inspection area, and the foreign matter inspection area setting means sets the foreign matter inspection area At1 in the set imaging visual fields Ph1 and Ph2. , At2 is included, the imaging fields of view Ph1 and Ph2 are set in common, and the inspection execution unit performs imaging with respect to the imaging fields of view Ph1 and Ph2 set by the component inspection area setting unit, and the imaging set in common The image data acquired with respect to the visual fields Ph1 and Ph2 is subjected to image processing to inspect the mounted parts and inspect for the presence of foreign matter at the mounting position.

  According to this, since the imaging visual fields Ph1 and Ph2 common to the component inspection area and the foreign substance inspection area are recognized, it is not necessary to take the same region on the inspection board K1 twice even if the inspection uses are different. Therefore, the time required for inspection can be shortened.

  Further, when another substrate K2 is targeted in the first embodiment, the component inspection area setting means sets imaging fields of view Ph3 and Ph4 that include the component inspection area, and the foreign matter inspection area setting means sets the imaging that has been set. If the visual fields Ph3 and Ph4 do not include the foreign matter inspection areas At5 and At6, other imaging visual fields Ph5 and Ph6 including the foreign matter inspection areas At5 and At6 are set, and the inspection execution unit includes the component inspection area setting unit and the foreign matter. Imaging is performed with respect to each imaging visual field Ph3, Ph4, Ph5, and Ph6 set by the inspection area setting means.

  According to this, even if there is a post-process component (component type P9) that is not included in the set imaging fields of view Ph3 and Ph4, the imaging fields of view Ph5 and Ph6 are newly set, and the post-process component (component type) The mounting position on the substrate K2 of P9) can be inspected reliably and without leakage.

  Further, in the first embodiment, at least one of the component inspection area setting unit and the foreign matter inspection area setting unit, in addition to the mounting position of the component on the substrate, the external dimensions (L1 to L9, W1) of the component (component types P1 to P9). To W9), at least one of the component inspection area and the foreign matter inspection areas At1 to At6 is set.

  According to this, the area on the boards K1 and k2 required for the inspection can be accurately set as the inspection area without considering the size of the component. Therefore, it is possible to reduce the amount of data to be subjected to image processing, reduce the calculation load, and shorten the time required for inspection.

  Furthermore, in the first embodiment, the component to be mounted from now on includes at least one of a ball grid array component and a shield component. According to this, each effect mentioned above becomes especially remarkable with respect to large-sized parts and special parts which are often post-process parts.

  Next, the difference between the substrate inspection apparatus of the second embodiment and the first embodiment will be mainly described. In the second embodiment, the overall configuration of the component mounting line 9 and the device configuration of the board inspection apparatus 4 are the same as those in the first embodiment, and the operation flow of the board inspection apparatus 4 is different. FIG. 8 is an operational flow diagram showing the operation of the substrate inspection apparatus 4 of the second embodiment. In the following, the operation flow in the second embodiment will be described by taking as an example the case of targeting the two-piece substrate K1 described in the first embodiment.

  In step S31 of the operation flow of FIG. 8, the control device of the board inspection apparatus 4 of the second embodiment acquires production data related to component mounting, that is, the component data and mounting data of FIG. Next, in step S32, the control device sets a region on the board K1 that is necessary for the inspection of all the component types P1 to P8 regardless of whether the component is mounted or not as a component inspection area. Next, in step S33, the control device sets one or a plurality of imaging fields that include all the component inspection areas.

  Next, in step S34, the control device determines the presence / absence of a post-process component, and if not, proceeds to step S42. If there is a post-process part, the process proceeds to step S35 to generate a post-process part list. Next, the control device repeats the processing loop relating to the imaging field from step S36 to step S41 by the number of imaging fields. More specifically, in step S37, the control device determines whether or not there is a post-process component mounting position in the focused imaging field of view, with reference to the post-process component list. Proceed to If there is, the control device sets the imaging field of view in common in step S38, and sets the foreign matter inspection area of the post-process component in step S39. After step S39, it merges into step S40.

  In step S40, the control device determines whether or not it is the last imaging field of view. If it is not the last, the imaging field of view to which attention is paid is changed, and steps S37 to S40 are repeated. When the last is reached, the process goes out to step S42 via step S41. In step S42 after the production of the two-piece substrate K1 is started, the substrate inspection apparatus images the two-piece substrate K1 and performs an inspection.

  Also in the operation flow in the second embodiment described above, as in the first embodiment, the component inspection area and the foreign matter inspection areas At1 and At2 can be set on the two-piece substrate K1, and the imaging fields of view Ph1 and Ph2 can be set in common. Since the effect of the substrate inspection apparatus of the second embodiment is the same as that of the first embodiment, description thereof is omitted.

  In addition, the board | substrate inspection method of this invention can be implemented using the board | substrate inspection apparatus 4 of 1st and 2nd embodiment. Various other applications and modifications are possible for the present invention.

1-3: First to third component mounting devices 4: Board inspection device 41: Control device 42: Inspection execution position 44: Head drive mechanism 45: Inspection head 48: Inspection camera 49: Machine base 5: Substrate transfer device 6: Host computer 9: Component mounting line K, K1, K2: Board At1-At6: Foreign matter inspection area Ph1-Ph6: Imaging field of view

Claims (7)

A board inspection apparatus that is disposed in the middle of a part mounting line for producing a board on which a plurality of parts are mounted, inspects a mounted part, and inspects a mounting position of the part to be mounted on the board. ,
Component inspection area setting means for setting a region on the board required for inspection of the mounted component as a component inspection area;
List generating means for listing the parts to be mounted from now on along with their mounting positions in a post-process parts list;
Based on the post-process component list, a foreign matter inspection area setting means for setting a region on the substrate that is required for the presence or absence of foreign matter at the mounting position as a foreign matter inspection area;
A board inspection apparatus comprising: an inspection execution unit that performs an inspection based on state information acquired with respect to the component inspection area and the foreign matter inspection area.   The inspection execution unit performs imaging with respect to one or a plurality of imaging fields including the component inspection area and the foreign matter inspection area on the substrate, and obtains one or more image data corresponding to the state information. The substrate inspection apparatus according to claim 1, further comprising: an imaging unit to be acquired; and an image inspection unit that performs inspection by performing image processing on the image data. The component inspection area setting means sets an imaging field of view including the component inspection area,
The foreign matter inspection area setting means sets the imaging field of view in common if the foreign matter inspection area is included in the set imaging field of view,
The inspection execution unit performs imaging with respect to each imaging field set by the component inspection area setting unit, performs image processing on image data acquired with respect to the commonly set imaging field, and inspects the mounted component and the mounting The substrate inspection apparatus according to claim 2, wherein position inspection is performed. The component inspection area setting means sets an imaging field of view including the component inspection area,
If the foreign matter inspection area is not included in the set imaging visual field, the foreign matter inspection area setting means sets another imaging visual field that includes the foreign matter inspection area,
The board inspection apparatus according to claim 2, wherein the inspection execution unit performs imaging on each imaging field of view set by the component inspection area setting unit and the foreign matter inspection area setting unit.   At least one of the component inspection area setting unit and the foreign matter inspection area setting unit takes into account the external dimensions of the component in addition to the mounting position of the component on the substrate, and at least the component inspection area and the foreign matter inspection area. The board | substrate inspection apparatus as described in any one of Claims 1-4 which sets one.   The board inspection apparatus according to claim 1, wherein the parts to be mounted include at least one of a ball grid array part and a shield part. A board inspection method that is performed in the middle of a component mounting process for producing a substrate on which a plurality of components are mounted, inspects a mounted component, and inspects a mounting position of the component to be mounted on the substrate,
A component inspection area setting step for setting a region on the board required for the inspection of the mounted component as a component inspection area;
A list generation step for listing the parts to be mounted together with the mounting position in a post-process parts list;
Based on the post-process component list, a foreign matter inspection area setting step for setting a region on the substrate that is required for the presence or absence of foreign matter at the mounting position as a foreign matter inspection area;
An inspection execution step for performing inspection based on state information acquired with respect to the component inspection area and the foreign matter inspection area.

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