JP2003110299A - Inspecting device for mounting - Google Patents

Inspecting device for mounting

Info

Publication number
JP2003110299A
JP2003110299A JP2001301968A JP2001301968A JP2003110299A JP 2003110299 A JP2003110299 A JP 2003110299A JP 2001301968 A JP2001301968 A JP 2001301968A JP 2001301968 A JP2001301968 A JP 2001301968A JP 2003110299 A JP2003110299 A JP 2003110299A
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JP
Japan
Prior art keywords
inspection
mounting
data
component
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001301968A
Other languages
Japanese (ja)
Other versions
JP4667681B2 (en
JP2003110299A5 (en
Inventor
Takayuki Fukae
Yasushi Mizuoka
Hiroshi Sato
Yoichiro Ueda
陽一郎 上田
大資 佐藤
靖司 水岡
崇行 深江
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, 松下電器産業株式会社 filed Critical Matsushita Electric Ind Co Ltd
Priority to JP2001301968A priority Critical patent/JP4667681B2/en
Publication of JP2003110299A publication Critical patent/JP2003110299A/en
Publication of JP2003110299A5 publication Critical patent/JP2003110299A5/ja
Application granted granted Critical
Publication of JP4667681B2 publication Critical patent/JP4667681B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for inspecting components mounted on a substrate or printed cream solder at the same time using a single set of facilities. SOLUTION: In a step S1, a flag in inspection data is decoded, and in a step S2, an inspection area is set according to external shape size values of the inspection data. Then a step S3 for performing component information using the value of the flag or a step S6 for performing solder inspection is carried out. In the step S3, a template is used to search for the inner side of the area, and in a step S4, it is decided whether components are present by deciding evaluated values on the basis of thresholds. In a step S5, a component shift is decided by comparing a detected position with a coordinate position. In the step S6 for the solder inspection, a solder color is extracted, and in a step S7, the position of the center of gravity and the area are measured by border tracing. In a step S8, a print shift is decided by comparing the position of the center of gravity with a coordinate position. In a step S9, blurring and faint parts are decided by threshold decision making.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection device and method for inspecting a cream solder printed on a printed circuit board or a mounted component at high speed for displacement or presence.

[0002]

2. Description of the Related Art Due to recent miniaturization and weight reduction of electric products, printed circuit boards which are main components of electric products are remarkably miniaturized, and the mounting density of parts is increased with the miniaturization of printed circuit boards. The miniaturization of parts has made it difficult for humans to perform visual inspection. Therefore, an inspection device for automatically inspecting these printed circuit boards is desired, but a higher-speed inspection device is required as the production tact is improved.

For example, the image inspection apparatus disclosed in Japanese Patent Application Laid-Open No. 05-006422 meets such a demand. As shown in FIG. 13, the image inspection apparatus is
A line sensor that can secure a wider imaging range than an area sensor is used as an image sensor, and various inspection items are inspected in parallel while capturing image data to achieve high-speed inspection. The configuration and operation of the conventional inspection machine will be briefly described with reference to FIG.

The image inspection apparatus has a color line sensor camera 10 for taking in image data of the inspection object while moving relative to the inspection object, and a linear scale 39 for measuring a relative movement distance to the inspection object. Based on the relative movement distance of the inspection target obtained from this, a capture memory 44 for starting and ending the capture of image data from the color line sensor camera 10, and the inspection of the inspection target from the captured image data. A cutout memory 45 that cuts out and stores the image data of the target area, an image processing circuit 46 that processes the cutout image data to obtain image processing data, and a plurality of inspections for various inspection items by the image processing data. Inspection processing circuit 47. Then, the image inspection apparatus inspects various inspection items in parallel while capturing the image data. Conventionally, using such an image inspection device, a cream solder printing inspection device that inspects the solder printing state after cream solder printing, a mounted component inspection device that inspects the mounting state of components after component mounting, and solder after soldering by reflow etc. The quality of the printed circuit board was inspected by an appearance inspection device that inspects the bonding state.

[0005]

However, the conventional preparation of the inspection machine for each individual process requires more expensive equipment investment. In addition, if the inspection of solder or parts is performed by soft switching with one inspection machine, it is necessary to perform multiple inspection operations such as saying that the inspection of parts is performed after the inspection of solder. After all, it takes a lot of inspection time, which becomes a bottleneck of the line tact.

[0006]

Means for Solving the Problems and Effects of the Invention In order to solve the above problems, the present invention has a function of inspecting the condition of components mounted on a substrate and printed or applied cream solder, It is configured to inspect the mounting state of the above components, the printing or applying state of cream solder, or both based on a determined procedure.

Therefore, according to the configuration of the present invention, it is impossible to inspect the mounting state of a small component requiring high mounting accuracy and the joint failure due to the defective printing state after mounting the component with one inspection device. Chip size package (CS
The printing states such as P) can be inspected at the same time, and the cause of the poor quality of the printed circuit board can be detected most effectively. Furthermore, while the data structure is standardized and the inspection data is sequentially decoded, the inspection of parts and solder is automatically switched according to the inspection object, so multiple inspections can be performed with one operation. It is not necessary to carry out the inspection of 1 and the inspection of solder in two steps, and the time required for inspection can be shortened.

[0008] Generally, in solder printing other than CSP, QFP (quad flat package), or extremely small parts, the probability of occurrence of defects remarkably decreases, so that the effect of inspecting the solder printing state is low, but it is previously printed on the printed circuit board. By providing a test print pattern and constantly inspecting this print pattern, it is possible to know the change in the state of the printing machine at an early stage. As described above, according to the configuration of the present invention, it is possible to most effectively achieve quality maintenance in mounting.

[0009]

DETAILED DESCRIPTION OF THE INVENTION An inspection machine according to an embodiment of the present invention will be described below with reference to the drawings. In addition,
The same components as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted. FIG. 1 shows a component mounting line according to the configuration of an inspection machine according to an embodiment of the present invention, and FIG. 5 shows a part of a printed circuit board which is an inspection object in the inspection machine.

As shown in FIGS. 1 (b) and 5, the inspection machine 8 prints the cream solder 25 on the printed board 30 by the printing machine 7, and then mounts the small chip parts 24 mainly by the chip mounter 5. The printed circuit board 30 after the process is used as an inspection object and is used in the inspection process of the component mounting line.

Next, an example of inspection items performed by the inspection machine 8 will be described. 10 shows an example of inspection items related to component mounting performed by the inspection machine 8, and FIG. 11 shows an example of inspection items related to solder state performed by the inspection machine 8.

In FIG. 10 and FIG. 11, as the inspection items related to component mounting, the inspection machine 8 detects whether or not the small component 24 mounted by the chip mounter 5 is present (FIG. 10A) and shifts the position of the small component 24 ( 10 (b)) and the rotation deviation of the small component 24 (FIG. 10 (c)) are inspected. Along with them, the inspecting machine 8 performs, as solder state-related inspection items, bleeding of the cream solder 25 of a chip size package (CSP) or a quad flat package (QFP) mounted in a downstream process (FIG. 11A), Fading of the cream solder 25 (FIG. 11B), printing misalignment of the cream solder 25 (FIG. 11C), and CSP and Q
Detection of foreign matter scattered on the FP cream solder 25 (Fig. 1
1 (d)) is to be inspected.

FIG. 2 is an external view of the inspection machine according to the embodiment of the present invention. As shown in FIG. 2, the inspection machine does not simply combine the two equipments, but realizes the inspections for two conventional equipments with one control unit.

FIG. 3 is a control block diagram of the inspection machine according to the embodiment of the present invention. In FIG. 3, the inspection machine drives the color line sensor camera 10 to sequentially capture images. The images are sequentially sent to the color image processing board 16, and the images are transferred to the CPU board 17 using the image transfer mechanism (FIG. 4) in the color image processing board 16.

Since the image is captured line by line due to the characteristics of the color line sensor camera 10,
The image may be sequentially transferred to the CPU board 17 every time one line is captured, but in the present embodiment, the image is transferred every time 64 lines of image are accumulated in the color image processing board 16.

Further, the color line sensor camera 10
Requires constant speed driving during image capturing, and cannot stop driving during image capturing. Therefore, as shown in FIG. 4, the color image processing board 16 is provided with a memory A22 and a memory B23 in order to accumulate the image of the color line sensor camera 10 even during the image transfer of 64 lines,
Data for four lines are accumulated respectively. And
The color image processing board 16 alternately performs the image storage and the image transfer while sequentially switching the storage memory A22 and the memory B23.

The image transferred to the CPU board 17 is transferred to the color line sensor camera 1 in the CPU board 17.
0 manages the position of the image captured and transferred to the CPU board 17, so that the position of the image transferred to the CPU board 17 can be known in real time. In addition, FIG.
As shown in FIG. 3, the CPU board 17 has read the inspection data 26 described in advance for inspection, and the inspection data 26 can be used to identify the location of the object to be inspected on the captured image. The position coordinates are described in. At the moment when the inspection object described in the inspection data 26 is captured by the color line sensor camera 10 and the image is transferred to the CPU board 17, the CPU
The board 17 inspects this inspection object. Therefore, it is preferable that the inspection data 26 describe the objects to be inspected in the order in which the images are captured.

Generally, the number of inspection points per substrate, which is an object to be inspected, is about 1000 for parts and about 10,000 for solder. In this case, the inspection data 26 includes data for component inspection at 1000 points and data for solder inspection at 10,000 points. As described above, in the inspection data 26, the data for component inspection and the data for solder inspection are described in the order of image capture, and the position data of the component or solder, the external dimensions,
It is composed of an inspection mode indicating an inspection algorithm, a flag for distinguishing a component or solder, a solder reference area included in solder inspection data, and the like. The inspection data 26 shown in FIG. 6A is an example thereof, and shows 10 points of solder inspection data and 2 points of component inspection data. Based on the inspection data 26, the inspection machine 8 executes inspections in the order of serial numbers. That is, the inspection machine 8 inspects in the ascending order of the numbers based on the numbers on the layout diagram of the components and the solder shown in FIG. 6B.

The inspection machine 8 expands the inspection data 26 corresponding to the type of the printed circuit board 30 from the hard disk 21 connected to the CPU board 17 to the memory 20 of the CPU board 17 when the inspection machine 8 is activated or when the type is switched. Inspection machine 8
When the memory is expanded, the template data for component inspection is expanded for angle search, and parameters for extracting solder are set in the color image processing board 16.

Next, a specific operation performed by the inspection machine 8 at the time of executing an inspection will be described with reference to FIGS. 7. FIG. 7 is a flowchart showing the processing operation performed by the inspection machine 8 when the inspection is executed.

In FIG. 7, the inspection machine 8 has the inspection data 2
Based on the flag of No. 6, it is identified that the inspection object is the component 24 or the solder 25 (step S1),
An inspection area is set based on the above-mentioned outer dimension value of the inspection data 26 (step S2). Next, when the inspection object is the component 24, the inspection machine 8 searches the inspection area using the template described in the component data linked to the inspection data 26 (step S3). And the inspection machine 8
Is a threshold judgment of the evaluation value of the point with the highest evaluation value,
If it is less than or equal to the threshold value, it is determined that there is no component (step S
4). Next, when the evaluation value is equal to or larger than the threshold value, the inspection machine 8 compares the detection point having the highest evaluation value with the position coordinates of the inspection data 26, and when the evaluation value is equal to or larger than the deviation determination value, determines that there is a deviation (step S5). Then, the inspection machine 8 returns to step S1 and repeats the processing.

FIG. 8 is a schematic diagram of a part search for explaining the processing operation of the above-described inspection machine 8 and a schematic diagram showing template data. In FIG. 8, the inspection machine 8 sequentially searches the preset model data in the search area to detect the position where the closest pattern exists.

Returning to FIG. 7, when the inspection machine 8 identifies that the inspection object is the solder 25 based on the flag, the cream solder 25 preset in the inspection area.
Only the component having the same color as is extracted (step S6), and the boundary of the extracted portion is traced to calculate the position and area of the center of gravity (step S7).

FIG. 9 is a schematic diagram of solder extraction for explaining the processing operation of the above-mentioned inspection machine 8 and an enlarged view thereof. In FIG. 9, the inspection machine 8 sets the portion extracted as the solder 25 as 1, the unextracted portion as 0, and treats the portion having 1 as the processing target. The inspection machine 8 calculates the barycentric position and area of the processing target portion by performing boundary tracking of the processing target portion.

Returning to FIG. 7, the inspection machine 8 compares the position of the center of gravity calculated on the basis of the processing target portion with the position coordinate area of the inspection data 26. The determination is made (step S8). Next, with respect to the blur and bleeding of the solder 25, the inspection machine 8 compares the area data of the processing target portion calculated in step S7 with the reference area of the solder of the inspection data 26 to obtain a predetermined blur. If it is less than or equal to the judgment value, it is blurred, and if it is greater than or equal to the predetermined bleeding judgment value, it is judged as bleeding (step S
9). Then, the inspection machine 8 returns to step S1 and repeats the processing.

Depending on the state of the chip mounter 5 which is an upstream process of the inspection machine 8, the chip parts 24 which are not properly mounted can be mounted.
A foreign substance such as a tape cut piece of a component supply cassette or the like may get on the printed circuit board. When such a foreign substance is placed on the solder 25 on which the CSP or the like is mounted, the foreign substance becomes a defective bit when the CSP is mounted in the downstream process.
Usually, since the joint portion after component mounting cannot be seen by a CSP or the like, it is difficult to find the above-mentioned foreign matter, and the defect detection may be delayed until the functional inspection of the product. In the present invention, since the area of the printed solder 25, which is the mounting position, is measured before the CSP or the like is mounted, when a foreign substance is placed on the solder 25, the normal solder area is not calculated. Therefore, according to the present invention, such foreign matter on the solder 25 can be detected before mounting.

Further, depending on the type of the printed circuit board 30, there is a type in which CSP and QFP are not mounted because high-density mounting is unnecessary. In the case of such a substrate, if the printing machine 7 maintains a certain condition, the printing state is less likely to occur, but the rolling property is deteriorated due to the volatilization of the flux contained in the cream solder 25, and the long-term use is prevented. Since the printing state may be deteriorated due to deterioration of the mask due to, the condition check of the printing machine 7 is necessary. However, since the defect occurrence frequency is low, the printing machine 7
It is difficult to install a solder inspection machine on the downstream side in terms of investment effect. Therefore, in such a printed circuit board 30, a test pattern 28 is provided in a portion where the component 24 is not mounted, as shown in FIG. 12, and a solder inspection of the test pattern 28 is performed simultaneously with the component inspection in a step after component mounting. Although it is an inspection machine, it can monitor the condition of the printing machine.

[0028]

According to the configuration of the present invention, therefore, a single inspection device can be used to inspect the mounting state of small components that require high mounting accuracy and to check for joint defects due to defective printing after mounting the components. Chip size package (CS
It is possible to inspect the printing conditions such as P) at the same time, and most effectively detect the cause of poor quality of the printed circuit board. Furthermore, by sharing the data structure and sequentially decoding the inspection data, the inspection of the component and the solder can be performed by automatic switching according to the target, so that the inspection can be performed with a single operation. Since it is not necessary to perform the inspection in two steps, the time required for the inspection can be shortened.

In addition, in general, solder printing other than CSP, QFP, or extremely small parts has a significantly low probability of occurrence of defects, so the effect of inspecting the solder printing state is low, but a printing pattern for testing is printed beforehand on the printed circuit board. By providing and constantly inspecting this print pattern, it is possible to know the change in the state of the printing machine at an early stage. As described above, according to the configuration of the present invention, it is possible to most effectively realize quality maintenance in mounting.

[Brief description of drawings]

FIG. 1 is a diagram showing a component mounting line and a conventional component mounting line example by a configuration of an inspection machine according to an embodiment of the present invention.

2 is an external view of the inspection machine 8 in FIG.

3 is a functional block diagram showing a control configuration of an inspection machine 8 in FIG.

FIG. 4 is a functional block diagram showing an image transfer configuration unit included in the color image processing board 16 in FIG.

5 is a schematic view showing a part of a printed circuit board which is an inspection target of the inspection machine 8 in FIG.

6 is a diagram showing an example of inspection data used by the inspection machine 8 in FIG. 1 and a layout diagram thereof.

FIG. 7 is a flowchart showing a processing operation performed by the inspection machine 8 in FIG. 1 at the time of performing an inspection.

8 is a schematic diagram of a component inspection performed by the inspection machine 8 in FIG.

9 is a schematic diagram of a solder inspection performed by the inspection machine 8 in FIG.

10 is a schematic diagram showing an example of component inspection items performed by the inspection machine 8 in FIG.

11 is a schematic diagram showing an example of solder inspection items performed by the inspection machine 8 in FIG.

12 is a schematic diagram showing a solder inspection test pattern used by the inspection machine 8 in FIG. 1. FIG.

FIG. 13 is a functional block diagram showing a functional configuration of a conventional image inspection apparatus.

[Explanation of symbols]

1 ... Appearance inspection machine 2 ... Reflow 3 ... Multi-function machine 4 ... Parts inspection machine 5 ... Chip mounter 6 ... Solder inspection machine 7 ... Printing machine 8 ... Inspection machine 9 ... Signal tower 10 ... Color line sensor camera 11 ... Monitor 12 ... Transport section 13 ... Operation panel 14 ... Power receiving board 15 ... Controller 16 ... Color image processing board 17 ... CPU board 18 ... PLC / NC board 19 ... C-PCI bus 20 ... memory 21 ... HDD 22 ... Memory A 23 ... Memory B 24 ... Parts 25 ... Solder 26 ... Inspection data 27 ... Land 28 ... Test pattern 29 ... Mark 30 ... Printed circuit board 31 ... Memory board 32 ... Man-machine interface 33 ... Monitor TV 34 ... Keyboard 35 ... I / O device 36 ... Lighting equipment 37 ... Motor 38 ... Encoder 39 ... Linear scale 40 ... Linear scale counting circuit 41 ... Capture memory address generation circuit 42 ... Cut-out memory address generation circuit 43 ... Image processing timing generation circuit 44 ... Acquisition memory 45 ... Cutting memory 46 ... Image processing circuit 47 ... Inspection processing circuit

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takayuki Fukae             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Yasushi Mizuoka             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 5B057 AA03 BA02 BA24 DA03 DA07                       DB02 DB06 DB09 DC04 DC06                       DC17 DC34                 5E319 AA03 AC01 BB05 CD26 CD29                       CD53 GG03 GG15                 5E338 CC09 CC10 CD12 CD32 EE41                       EE51

Claims (10)

[Claims]
1. An image pickup means for picking up an image of a board, a means for inspecting a state of a component mounted on the board and a printed or applied cream solder, and a mounted state of the part or a printed or applied state of the cream solder. Or a mounting means for controlling the inspection data of both of them.
2. The mounting inspection apparatus according to claim 1, wherein the imaging means includes means for imaging a component mounted on a substrate and a printed or applied cream solder in one view. Inspection device.
3. The mounting inspection apparatus according to claim 1, wherein common inspection data for cream solder inspection and component inspection is collected as one data when inspecting one type of board. A mounting inspection device equipped with means for inspecting.
4. The mounting inspection apparatus according to claim 3, further comprising: means for sequentially decoding common data; and identification means for identifying whether the data is cream solder inspection data or component inspection data. Inspection device.
5. The mounting inspection apparatus according to claim 1, further comprising means for detecting whether or not a foreign substance is present in the peripheral portion of the cream solder having no mounted component.
6. The mounting inspection device according to claim 1, wherein the inspecting means uses a substrate provided with an inspection pattern for printing only cream solder that does not mount components on the substrate. Mounting inspection device that inspects the printed or applied state of the solder for the application pattern.
7. An image of a state of a component mounted on a mounting board or a printed or applied cream solder is imaged, where the component is mounted, the mounting state of the component is inspected, and where the component is not mounted, A mounting inspection method that selects and inspects the printed or applied state of cream solder.
8. The mounting inspection method according to claim 7, wherein the inspection data for the cream solder inspection and the inspection data for the component inspection are collected as one data when inspecting one type of board. Yes, the mounting inspection method.
9. The mounting inspection method according to claim 8, wherein the common data is sequentially decoded to discriminate between the solder paste inspection data and the component inspection data, and the inspection is performed.
10. The mounting inspection method according to claim 7, wherein the mounting inspection method inspects whether or not a foreign substance is present in the peripheral portion of the cream solder where no component is mounted.
JP2001301968A 2001-09-28 2001-09-28 Mounting inspection system and mounting inspection method Expired - Fee Related JP4667681B2 (en)

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Cited By (18)

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Publication number Priority date Publication date Assignee Title
JP2007335524A (en) * 2006-06-13 2007-12-27 Fuji Mach Mfg Co Ltd Mounting line
JP2008117975A (en) * 2006-11-06 2008-05-22 Yamaha Motor Co Ltd Printing machine and component mounting system using the same
JP2009129923A (en) * 2007-11-19 2009-06-11 Juki Corp Substrate for confirmation, soldering displacement inspection device and solder displacement inspection method
JP2011014946A (en) * 2010-10-22 2011-01-20 Fuji Mach Mfg Co Ltd Method and machine for mounting electronic component
JP2011018816A (en) * 2009-07-10 2011-01-27 I-Pulse Co Ltd Method for attaching electronic component
JP2011223037A (en) * 2011-07-28 2011-11-04 Panasonic Corp Screen printing system and screen printing method
JP2011244001A (en) * 2011-07-28 2011-12-01 Panasonic Corp Electronic component mounting line and electronic component mounting method
JP2012169687A (en) * 2012-06-15 2012-09-06 Panasonic Corp Electronic component packaging line and electronic component packaging method
JP2012169686A (en) * 2012-06-15 2012-09-06 Panasonic Corp Electronic component packaging line and electronic component packaging method
JP2012209570A (en) * 2012-06-15 2012-10-25 Panasonic Corp Screen printing system and screen printing method
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US8327761B2 (en) 2008-04-02 2012-12-11 Panasonic Corporation Screen printer
JP2012245788A (en) * 2012-09-03 2012-12-13 Panasonic Corp Screen printing system, and screen printing method
JP2013069872A (en) * 2011-09-22 2013-04-18 Nec Corp Substrate inspection device, component mounting system, substrate inspection method and program
WO2015045057A1 (en) * 2013-09-26 2015-04-02 富士機械製造株式会社 Substrate inspection device and substrate inspection method
WO2016080809A1 (en) * 2014-11-20 2016-05-26 주식회사 고영테크놀러지 Component inspection apparatus and component mounting system having same
JP2018113467A (en) * 2018-03-14 2018-07-19 株式会社Fuji Component mounting line, and board inspection device
US10060859B2 (en) 2013-04-02 2018-08-28 Koh Young Technology Inc. Method of inspecting foreign substance on substrate

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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007335524A (en) * 2006-06-13 2007-12-27 Fuji Mach Mfg Co Ltd Mounting line
JP2008117975A (en) * 2006-11-06 2008-05-22 Yamaha Motor Co Ltd Printing machine and component mounting system using the same
JP2009129923A (en) * 2007-11-19 2009-06-11 Juki Corp Substrate for confirmation, soldering displacement inspection device and solder displacement inspection method
US8327761B2 (en) 2008-04-02 2012-12-11 Panasonic Corporation Screen printer
US8499688B2 (en) 2008-04-02 2013-08-06 Panasonic Corporation Screen printer
US8375852B2 (en) 2008-04-02 2013-02-19 Panasonic Corporation Screen printer
JP2011018816A (en) * 2009-07-10 2011-01-27 I-Pulse Co Ltd Method for attaching electronic component
JP2011014946A (en) * 2010-10-22 2011-01-20 Fuji Mach Mfg Co Ltd Method and machine for mounting electronic component
JP2011223037A (en) * 2011-07-28 2011-11-04 Panasonic Corp Screen printing system and screen printing method
JP2011244001A (en) * 2011-07-28 2011-12-01 Panasonic Corp Electronic component mounting line and electronic component mounting method
JP2013069872A (en) * 2011-09-22 2013-04-18 Nec Corp Substrate inspection device, component mounting system, substrate inspection method and program
JP2012209570A (en) * 2012-06-15 2012-10-25 Panasonic Corp Screen printing system and screen printing method
JP2012169686A (en) * 2012-06-15 2012-09-06 Panasonic Corp Electronic component packaging line and electronic component packaging method
JP2012169687A (en) * 2012-06-15 2012-09-06 Panasonic Corp Electronic component packaging line and electronic component packaging method
JP2012245788A (en) * 2012-09-03 2012-12-13 Panasonic Corp Screen printing system, and screen printing method
JP2012235169A (en) * 2012-09-03 2012-11-29 Panasonic Corp Electronic component mounting line and electronic component mounting method
US10060859B2 (en) 2013-04-02 2018-08-28 Koh Young Technology Inc. Method of inspecting foreign substance on substrate
WO2015045057A1 (en) * 2013-09-26 2015-04-02 富士機械製造株式会社 Substrate inspection device and substrate inspection method
JPWO2015045057A1 (en) * 2013-09-26 2017-03-02 富士機械製造株式会社 Substrate inspection apparatus and substrate inspection method
WO2016080809A1 (en) * 2014-11-20 2016-05-26 주식회사 고영테크놀러지 Component inspection apparatus and component mounting system having same
JP2018113467A (en) * 2018-03-14 2018-07-19 株式会社Fuji Component mounting line, and board inspection device

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