JPWO2014069131A1 - 異形除去装置および異形除去方法 - Google Patents

異形除去装置および異形除去方法 Download PDF

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Publication number
JPWO2014069131A1
JPWO2014069131A1 JP2014544384A JP2014544384A JPWO2014069131A1 JP WO2014069131 A1 JPWO2014069131 A1 JP WO2014069131A1 JP 2014544384 A JP2014544384 A JP 2014544384A JP 2014544384 A JP2014544384 A JP 2014544384A JP WO2014069131 A1 JPWO2014069131 A1 JP WO2014069131A1
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JP
Japan
Prior art keywords
shape
ball
deformed
moving surface
disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014544384A
Other languages
English (en)
Japanese (ja)
Inventor
寺嶋　晋一
晋一 寺嶋
小林　孝之
孝之 小林
將元 田中
將元 田中
勝一 木村
勝一 木村
忠礼 佐川
忠礼 佐川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Micrometal Corp, Nippon Steel Chemical and Materials Co Ltd filed Critical Nippon Micrometal Corp
Publication of JPWO2014069131A1 publication Critical patent/JPWO2014069131A1/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2014544384A 2012-10-30 2013-09-27 異形除去装置および異形除去方法 Pending JPWO2014069131A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012239482 2012-10-30
JP2012239482 2012-10-30
PCT/JP2013/076306 WO2014069131A1 (ja) 2012-10-30 2013-09-27 異形除去装置および異形除去方法

Publications (1)

Publication Number Publication Date
JPWO2014069131A1 true JPWO2014069131A1 (ja) 2016-09-08

Family

ID=50627047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014544384A Pending JPWO2014069131A1 (ja) 2012-10-30 2013-09-27 異形除去装置および異形除去方法

Country Status (4)

Country Link
JP (1) JPWO2014069131A1 (zh)
PH (1) PH12015500949A1 (zh)
TW (1) TW201429599A (zh)
WO (1) WO2014069131A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3003778B1 (fr) * 2013-03-27 2015-03-27 Heraeus Materials Tech Gmbh Procede et dispositif de tri de billes
CN109046992B (zh) * 2018-07-02 2021-09-10 威海无缝新材料有限公司 一种用于圆形球分选的离心装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2933065B2 (ja) * 1997-06-18 1999-08-09 日本電気株式会社 微小金属ボールの配列方法
JP2001286826A (ja) * 2000-04-10 2001-10-16 Allied Material Corp 回転傾斜選別システム
JP3589195B2 (ja) * 2001-05-18 2004-11-17 株式会社アライドマテリアル 微小金属球の選別方法
JP2004087756A (ja) * 2002-08-27 2004-03-18 Tamura Seisakusho Co Ltd 金属ボールの配列方法及びこれを用いた半導体装置の製造方法

Also Published As

Publication number Publication date
PH12015500949A1 (en) 2015-07-06
WO2014069131A1 (ja) 2014-05-08
TW201429599A (zh) 2014-08-01

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