JPWO2014034504A1 - 基板ステージ及びそれを備えた基板処理装置 - Google Patents
基板ステージ及びそれを備えた基板処理装置 Download PDFInfo
- Publication number
- JPWO2014034504A1 JPWO2014034504A1 JP2014532957A JP2014532957A JPWO2014034504A1 JP WO2014034504 A1 JPWO2014034504 A1 JP WO2014034504A1 JP 2014532957 A JP2014532957 A JP 2014532957A JP 2014532957 A JP2014532957 A JP 2014532957A JP WO2014034504 A1 JPWO2014034504 A1 JP WO2014034504A1
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- Japan
- Prior art keywords
- substrate
- stage
- spin chuck
- substrate stage
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Abstract
Description
<第1実施形態>
<第2実施形態>
次に、第3実施形態の基板処理装置(塗布装置)及び基板ステージ(スピンチャックステージ)について説明する。ただし、第3実施形態の構成は、第1実施形態の構成と概ね同様である。このために、以下、異なる部分について絞って説明する。なお、第1実施形態の構成と重複する部分には同一の符号を付して説明する。
5 モーター(回転部)
8 減圧部
10 スピンチャックステージ(基板ステージ)
13 載置面
15 吸着溝
16 微細な凹凸
21 横ずれ防止ピン(横ずれ防止部)
S 基板
Claims (11)
- 基板が載置される載置面と、
前記載置面に設けられて、前記基板を吸着するための吸着溝と、
前記載置面の少なくとも一部にランダムに多数設けられる微細な凹凸と、
を備えることを特徴とする基板ステージ。 - 当該基板ステージが回転可能に設けられていることを特徴とする請求項1に記載の基板ステージ。
- 前記載置面の最外周部には微細な凹凸が設けられていないことを特徴とする請求項1又は2に記載の基板ステージ。
- 前記微細な凹凸が設けられている領域のRa(算術平均粗さ)は、0.6μm以上1.0μm以下であることを特徴とする請求項1から3のいずれかに記載の基板ステージ。
- 前記微細な凹凸が前記載置面の略全域に亘って設けられていることを特徴とする請求項1から4のいずれかに記載の基板ステージ。
- 前記微細な凹凸が前記載置面の一部の範囲に設けられていることを特徴とする請求項1から4のいずれかに記載の基板ステージ。
- 前記一部の範囲は、同心円状に間隔をあけて形成される複数の環状領域を含む構成であることを特徴とする請求項6に記載の基板ステージ。
- 前記基板の横ずれを防止する横ずれ防止部を更に備えることを特徴とする請求項1から7のいずれかに記載の基板ステージ。
- 前記微細な凹凸は、ブラスト加工によって形成されていることを特徴とする請求項1から8のいずれかに記載の基板ステージ。
- 請求項1から9のいずれかに記載の基板ステージを備えることを特徴とする基板処理装置。
- 前記基板ステージを回転させる回転部と、
前記吸着溝を減圧する減圧部と、
を更に備えることを特徴とする請求項10に記載の基板処理装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012187765 | 2012-08-28 | ||
JP2012187765 | 2012-08-28 | ||
PCT/JP2013/072344 WO2014034504A1 (ja) | 2012-08-28 | 2013-08-22 | 基板ステージ及びそれを備えた基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014034504A1 true JPWO2014034504A1 (ja) | 2016-08-08 |
JP5997281B2 JP5997281B2 (ja) | 2016-09-28 |
Family
ID=50183319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014532957A Expired - Fee Related JP5997281B2 (ja) | 2012-08-28 | 2013-08-22 | 基板ステージ及びそれを備えた基板処理装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5997281B2 (ja) |
CN (1) | CN104603927B (ja) |
WO (1) | WO2014034504A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6076954B2 (ja) * | 2014-11-25 | 2017-02-08 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
EP3826050A4 (en) * | 2018-07-19 | 2022-09-21 | Bondtech Co., Ltd. | SUBSTRATE WELDING DEVICE |
KR20230013541A (ko) | 2021-07-19 | 2023-01-26 | 세메스 주식회사 | 지지 유닛 및 이를 포함하는 기판 처리 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63287030A (ja) * | 1987-05-20 | 1988-11-24 | Toshiba Corp | ウェハ保持具 |
JP2004165582A (ja) * | 2002-09-17 | 2004-06-10 | Nikon Corp | 基板ホルダ、基板トレイ、ステージ装置、及び基板ホルダの製造方法 |
JP2010010719A (ja) * | 2009-10-13 | 2010-01-14 | Tokyo Electron Ltd | 基板処理装置 |
JP2010161238A (ja) * | 2009-01-08 | 2010-07-22 | Nippon Futsuso Kogyo Kk | フッ素樹脂コーティングプレート及び吸着ステージ |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI439351B (zh) * | 2008-09-29 | 2014-06-01 | Nitto Denko Corp | Adsorption tablets |
-
2013
- 2013-08-22 WO PCT/JP2013/072344 patent/WO2014034504A1/ja active Application Filing
- 2013-08-22 JP JP2014532957A patent/JP5997281B2/ja not_active Expired - Fee Related
- 2013-08-22 CN CN201380045572.5A patent/CN104603927B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63287030A (ja) * | 1987-05-20 | 1988-11-24 | Toshiba Corp | ウェハ保持具 |
JP2004165582A (ja) * | 2002-09-17 | 2004-06-10 | Nikon Corp | 基板ホルダ、基板トレイ、ステージ装置、及び基板ホルダの製造方法 |
JP2010161238A (ja) * | 2009-01-08 | 2010-07-22 | Nippon Futsuso Kogyo Kk | フッ素樹脂コーティングプレート及び吸着ステージ |
JP2010010719A (ja) * | 2009-10-13 | 2010-01-14 | Tokyo Electron Ltd | 基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
CN104603927B (zh) | 2016-10-26 |
CN104603927A (zh) | 2015-05-06 |
JP5997281B2 (ja) | 2016-09-28 |
WO2014034504A1 (ja) | 2014-03-06 |
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