JPWO2014017291A1 - Method for making silicone resin conductive and silicone resin with metal film - Google Patents

Abstract

The conductive method of the silicone resin of the present invention comprises a substrate preparation step of polymerizing an unsaturated bond-containing organopolysiloxane to prepare a substrate made of a silicone resin, a UV treatment step of irradiating the substrate with ultraviolet rays, and the substrate. It comprises at least one of an ozone process for contacting ozone water, a catalyst process for imparting a catalyst for electroless plating reaction to a substrate, and a conductive process for forming an electroless plating film.

Description

  The present invention relates to a conductive method for a silicone resin by an electroless plating method and a silicone resin with a metal film formed by an electroless plating method.

  Silicone resin, which is a hybrid material of an organic substance and an inorganic substance, is expected to be applied to MEMS structures, nanotechnology structures, optical parts and the like because of its excellent characteristics. That is, a silicone resin in which an organic group is bonded to a siloxane-bonded linear polymer exhibits high chemical resistance and high heat resistance. In particular, silicone resin based on PDMS (poly dimethyl siloxane), for example, silicone rubber, which is an elastomer having rubber elasticity at room temperature, is a next-generation material for optical applications that exhibits excellent optical properties such as transparency and high refractive index. Also attracting attention.

  In order to further enhance the functionality of silicone resins, much research has been conducted on the formation of metal films on silicone resins. However, most of them are so-called dry film forming methods such as vapor deposition or sputtering.

  The inventor has been conducting research while focusing on a wet film forming method, particularly an electroless plating method capable of forming a uniform metal film even on a resin having a complicated surface shape. When forming a metal film on a resin by electroless plating, the surface is generally roughened by chemical etching, physical etching, etc., and then a catalyst is applied, followed by film formation by plating. Is called.

  However, the chemical etching of the silicone resin is not easy, and there is a possibility that optical properties and / or physical properties may be deteriorated by physical roughening.

  In addition, in Japanese Unexamined Patent Application Publication No. 2008-94923, the inventors of the present invention have improved adhesion by irradiating the cycloolefin polymer (COP) with ultraviolet rays without greatly roughening the surface. It discloses that an electrolytic plating film can be formed.

  However, since the structure of silicone resin is completely different from that of cycloolefin polymer, the technology of cycloolefin polymer cannot be simply applied. In particular, in the case of a transparent silicone resin for optical use, there has been a concern that surface roughening has a great influence on optical properties.

  For this reason, there has been a demand for a conductive method for a silicone resin that can form an electroless plating film with good adhesion without deteriorating the properties of the silicone resin, particularly the optical properties.

  An object of an embodiment of the present invention is to provide a conductive method of a silicone resin capable of forming an electroless plating film having good adhesion and a silicone resin with a metal film having good adhesion.

  The conductive method of the silicone resin according to the embodiment of the present invention includes a substrate preparation step of preparing a substrate made of a silicone resin by polymerizing an unsaturated bond-containing organopolysiloxane, a UV treatment step of irradiating the substrate with ultraviolet rays, and the above It comprises at least one of an ozone process for contacting the substrate and ozone water, a catalyst process for imparting a catalyst for electroless plating reaction to the surface, and a conductive process for forming an electroless plating film.

  Moreover, the silicone resin with a metal film of another embodiment consists of the base | substrate which consists of a silicone resin, and the electroless-plating film | membrane formed into a film on the said base | substrate.

It is a flowchart for demonstrating the electrically conductive method of PDMS of 1st Embodiment. It is a figure which shows the light transmittance of PDMS of 1st Embodiment. It is a figure for demonstrating the UV process in the electrically conductive method of PDMS of 1st Embodiment. It is a figure which shows the measurement result by the contact angle measuring device before UV processing of PDMS of 1st Embodiment. It is a figure which shows the measurement result by the contact angle measuring device after UV processing of PDMS of 1st Embodiment. It is a figure which shows the measurement result by the Fourier-transform infrared spectroscopy analyzer of PDMS of 1st Embodiment. It is a figure which shows the measurement result by the Fourier-transform infrared spectroscopy analyzer of PDMS of 1st Embodiment. It is a figure which shows the surface form measurement result of untreated PDMS of 1st Embodiment. It is a figure which shows the surface form measurement result of PDMS after the alkali treatment of 1st Embodiment. It is a figure which shows the surface form measurement result of PDMS after the two-step process of 1st Embodiment. It is a figure for demonstrating the ozone water preparation method of 2nd Embodiment.

<First Embodiment>
Hereinafter, the PDMS conductive method according to the first embodiment will be described with reference to the flowchart shown in FIG. In addition, description is abbreviate | omitted about the water washing process between processes.

<Step S11> Substrate preparation step A substrate made of silicone rubber is prepared by polymerizing an unsaturated bond-containing organopolysiloxane as a main component. In the polymerization, organohydrogenpolysiloxane was used as a crosslinking agent. Hereinafter, the silicone rubber is also simply referred to as “PDMS” or “silicone resin”.

  The organopolysiloxane containing unsaturated bonds, which is the main component of PDMS, has at least two aliphatic unsaturated bonds such as vinyl groups or allyl groups in one molecule. For example, the following chemical formula (Formula 1) Indicated.

上記式中、ｐ、ｑは正の整数であり、１０≦ｐ＋ｑ≦１，０００、好ましくは５０≦ｐ＋ｑ≦５００で、０＜ｑ／（ｐ＋ｑ）≦０．２を満足する。(Chemical formula 1)

In the above formula, p and q are positive integers, 10 ≦ p + q ≦ 1,000, preferably 50 ≦ p + q ≦ 500, and 0 <q / (p + q) ≦ 0.2 is satisfied.

  The organohydrogenpolysiloxane that is a cross-linking agent is represented, for example, by the following chemical formula (Formula 2).

上記式中、ｋ、ｍは正の整数であり、一分子中にケイ素原子に結合した水素原子（ＳｉＨ基）を少なくとも２個（ｍ＝２〜３００）、好ましくは３個以上（ｍ＝３〜２００）、更に好ましくは４〜１００個（ｍ＝４〜１００）有する。(Chemical formula 2)

In the above formula, k and m are positive integers, and at least 2 hydrogen atoms (SiH groups) bonded to silicon atoms (m = 2 to 300), preferably 3 or more (m = 3) in one molecule. To 200), more preferably 4 to 100 (m = 4 to 100).

  A silicone resin is produced by a curing (polymerization) reaction in which an SiH group of the organohydrogenpolysiloxane and an unsaturated group such as a vinyl group as a main component are added.

Incidentally, as the polymerization catalyst, a platinum group metal catalyst, for example, the _{H 2 PtCl 6 · mH 2 O} , may contain 0.1~500ppm by weight is a platinum group metal.

Furthermore, if necessary, a low molecular component such as silicone oil, a curing inhibitor such as acetylene alcohol, or an adhesion improving component such as alkoxysilane or silane coupling agent may be blended. It is 5 minutes to 6 hours at 180 ° C., preferably 10 minutes to 4 hours at 100 to 160 ° C.

  For example, a one-part silicone resin (RTV) manufactured by Shin-Etsu Chemical Co., Ltd. is applied to an alumina ceramic substrate to a thickness of 2 mm, polymerized by heat treatment at 150 ° C. for 30 minutes, and consists of PDMS having a molecular weight of 5000 to 10,000. A substrate 10 was produced.

  When the base 10 is manufactured, an uncured resin is poured into a predetermined mold frame or a frame mold obtained by joining two mold frames, whereby a base body having a desired shape can be easily manufactured. For example, a transparent substrate having a non-linear spherical surface is produced by using a concave frame shape having a non-linear inner surface shape.

  In FIG. 2, the result of having measured the light transmittance of the base | substrate 10 with the spectrophotometer (the Hitachi High-Technologies company make, U-3310) is shown. The substrate 10 showed a gentle absorption peak in the vicinity of a wavelength of 250 to 350 nm. However, no absorption peak was observed at a wavelength of 400 nm or more, and the substrate 10 had good light transmittance.

<Step S12> UV treatment step The UV treatment step is a step of surface modification by irradiating the substrate 10 with ultraviolet rays in an aerobic atmosphere. The dominant wavelength of ultraviolet rays used in the UV treatment step is preferably, for example, 170 to 400 nm, and the irradiation intensity (intensity of ultraviolet rays on the surface of the substrate 10) is preferably 1 to 500 mW / cm ² . If the irradiation intensity is not less than the above range, the production efficiency is good.

  If the main wavelength of the ultraviolet light is not less than the above range, a general light source can be used, and if it is not more than the above range, the light transmittance is small, so that the modification effect is easily obtained. A more preferable wavelength range is 170 to 300 nm, and a more preferable wavelength range is 180 to 280 nm.

  The irradiation time is determined in consideration of the relationship with the irradiation intensity, but is preferably 0.5 minutes to 60 minutes. Above the range, the control is easy, and below the range, there is no problem in mass productivity.

For example, as shown in FIG. 3, using a UV irradiation apparatus 20 (main wavelength: 253.7 nm, manufactured by Koto Electric Co., Ltd., KOL1-300) equipped with a low-pressure mercury lamp 21, an irradiation distance D: 30 mm, an irradiation intensity: 60 mW The substrate 10 was irradiated with ultraviolet rays at / cm ² for a maximum of 30 minutes.

  Note that the light transmittance was not significantly changed by the UV treatment.

  In order to confirm the effect of the UV treatment, the wettability evaluation of the substrate 10 before and after the UV treatment was performed using a contact angle measuring device (Meiwa Forsys, Phoenix alpha, ion-exchanged water: 50 μL). As shown in FIG. 4A, the silicone resin before UV treatment was hydrophobic with a contact angle θ = 99.8 degrees. On the other hand, as shown in FIG. 4B, the silicone resin that had been subjected to UV irradiation for 30 minutes became highly hydrophilic and the water spread greatly, so that accurate contact angle measurement was impossible.

Moreover, the chemical structure change of the silicone resin by UV treatment was analyzed using a Fourier transform infrared spectrometer (manufactured by JASCO Corporation, FT / IR-6100 + IRT-5000). As shown in FIGS. 5A and 5B, the UV treatment, absorption appeared absorption peak attributable to a carboxyl (RCOO-) group near 1720 cm ^-1, from (-OH) group in the vicinity of 3000～3500Cm ^-1 The peak became more prominent.

  That is, a part of the organic group bonded to the linear silicon polymer is decomposed to form a (—C (= 0) —) group, and the (RCOO—) group and the low molecular (− It is presumed that the modification generated by the (OH) group or the like is performed by the UV treatment.

  In addition, it is also possible to modify | reform to the structure which took in N etc. by performing UV treatment in the atmosphere containing the element which comprises organic polymer, such as nitrogen atmosphere or ammonia atmosphere.

<Step S13> Alkali Treatment Step The substrate 10 after UV treatment was immersed in an alkali solution (50 g / L, NaOH solution, 60 ° C.) for 2 minutes. Since the terminal of the reforming portion becomes Na by the alkali treatment, it becomes more hydrophilic, and the amount of adsorption of the catalyst in the catalyst process increases. Note that the alkali treatment step is not an essential step.

<Step S14> Catalyst Process In the catalyst process, palladium (Pd), which is a catalyst for the electroless plating reaction, is applied to the surface of the substrate 10.

  In the electroless plating catalyst step, (a) Sn / Pd mixed catalyst treatment, (b) acidic ion activator treatment, (c) stannous chloride-Pd two-stage treatment, and (d) alkaline activator Four types of catalyst treatment are widely used. For this reason, four types of catalyst treatments were performed for comparison.

  In (a) Sn / Pd mixed catalyst treatment and (b) acidic ion activator treatment, first, a conditioning treatment using a conditioning agent containing a cationic surfactant (CC-231 manufactured by Rohm and Haas Electronic Materials) is performed. By the conditioning treatment, the hydrophobic group of the surfactant is adsorbed on the surface of the substrate 10, and Pd ions are adsorbed on the hydrophilic group of the surfactant adsorbed on the substrate 10 in the catalyst step.

  (A) In the Sn / Pd mixed catalyst treatment, a pre-dip treatment was further performed after the conditioning treatment. In the pre-dip treatment, for example, by immersing in a sodium chloride aqueous solution, sodium ions and chlorine ions are adsorbed on the hydrophilic groups of the substrate 10 and the hydrophilic groups of the surfactant adsorbed on the surface by the conditioning treatment. For this reason, surface potential etc. are leveled more and a catalyst provides more uniformly. And in a catalyst process, the activation process (reducer process) immersed in 10% sulfuric acid is performed after being immersed in Pd / Sn colloid solution (Cataposit 44, manufactured by Rohm and Haas).

  (B) In the acidic ion activator treatment, after conditioning treatment, it is immersed in a 0.3 g / L Pd chloride solution to adsorb Pd ions on the surface, and then a reducing agent-containing solution such as a hypophosphite solution. Thus, a reducer process for reducing Pd ions to metal is performed.

  (C) In the two-stage treatment, for example, after dipping in a 0.1 g / L first chloride chloride (tin) solution, it is dipped in a 0.05 g / L Pd chloride solution. Since divalent Sn ions change to tetravalent Sn ions, Pd ions adsorbed on the substrate are reduced to metal.

  (D) Alkaline activator treatment includes conditioning treatment with Neogant B (Atotech), activator treatment for adsorbing Pd ions with Neogant 834 (Atotech), and Pd ions with Neogant WA (Atotech) The reducer process to reduce to is performed in order.

  In addition, in order to contact the base | substrate 10 with a catalyst solution etc., it is not restricted to an immersion method, The spray method etc. can also be used.

  The Pd adsorption amount after each catalyst treatment was measured with an atomic absorption analyzer (Solaar S4, manufactured by Thermo Fisher Inc.) by immersing the substrate 10 in aqua regia to dissolve Pd. For reference, the substrate not subjected to UV treatment (untreated) was similarly subjected to catalyst treatment, and the Pd adsorption amount was measured.

As shown in Table 1, the amount of Pd adsorbed (mg / dm ² ) was greatly increased by UV treatment in any catalyst treatment. In particular, in (c) the two-stage treatment, the amount of adsorption was very small for the untreated substrate, but the amount of adsorption for the substrate after UV treatment was increased to 10 times that before treatment.

表２にＵＶ処理時間によるＰｄ吸着量（ｍｇ／ｄｍ^２）の変化を、（ｃ）二段処理において測定した結果を示す。(Table 1)

Table 2 shows the results of measuring the change in Pd adsorption amount (mg / dm ² ) with UV treatment time in (c) two-stage treatment.

以上の結果から、ＵＶ照射装置２０を用い、照射距離Ｄ：３０ｍｍ、照射強度：６０ｍＷ／ｃｍ^２の条件の場合には、照射時間は、２０分で十分なことが判明した。(Table 2)

From the above results, it was found that the irradiation time of 20 minutes was sufficient when the UV irradiation apparatus 20 was used and the irradiation distance D was 30 mm and the irradiation intensity was 60 mW / cm ² .

<Step S15> Conduction Process The following electroless NiP plating bath was used for forming the electroless plating film in the conductivity process.

<Electroless NiP plating bath>
Nickel sulfate hexahydrate 0.10 mol / dm ³
Citric acid 0.20 mol / dm ³
Ammonium chloride 0.75 mol / dm ³
Sodium hypophosphite monohydrate 0.20 mol / dm ³
Thiourea 2.0 mg / dm ³
pH adjuster Sodium hydroxide, sulfuric acid pH: 9.0
Bath temperature: 45 ° C
Plating time: 5 minutes After the UV treatment, as a result of electroless nickel plating on the substrate 10 subjected to the four types of catalyst treatments (a) to (d) above, the electroless reaction proceeds in any catalyst treatment, Conductive treatment was possible. However, (a) in the Sn / Pd mixed catalyst treatment, the plating film had a slightly non-uniform region. In addition, in the (d) alkaline activator treatment, the uniformity of the plating film was not high. In contrast, (c) a two-stage treatment formed a very uniform plating film, and (b) an acidic ion activator treatment formed a very uniform and highly adhesive plating film. .

  In the substrate not subjected to UV treatment, the electroless reaction proceeded in (a) Sn / Pd mixed catalyst treatment and (b) acidic ion activator treatment, but the adhesion was weak and was peeled off by washing with water after plating. Further, in (c) two-stage treatment and (d) alkaline activator treatment, almost no electroless reaction occurred.

  In the electroless plating reaction catalyst step, an Ag catalyst, a Cu catalyst, or the like can be used instead of the Pd catalyst.

<Step S16> Heat treatment step A
Heat treatment was performed at 80 ° C. for 30 min.

<Step S16> Thickening Process The following electrolytic copper plating bath was used for forming the electrolytic plating film in the thickening process.

<Electrolytic copper plating bath>
Copper sulfate pentahydrate 200g / L
Sulfuric acid 50g / L
Brightener appropriate amount current density: 2 A / dm ²
Bath temperature: Room temperature Plating film thickness: 20 μm
<Step S17> Heat treatment step B
Again, heat treatment was performed at 80 ° C. for 30 min.

  Note that the thickening step performed after the metal film-coated silicone resin is produced by the electroless plating method is not an essential step. The heat treatment steps A and B are treatments performed for promoting crystallization of the electroless plating film and the electroplating film, and may be omitted.

  The adhesion strength of the metal film thickened by electroplating was measured using a peel tester.

  The adhesion strength of the silicone resin subjected to the two-stage treatment was as high as 0.4 kN / m. And both peeling surfaces were silicone resins, and it was not peeling at the interface between the silicone resin and the plating film, but peeling due to shear fracture of the silicone resin itself. On the other hand, the adhesion strength of the silicone resin subjected to the other three types of treatment was not as high as that of the silicone resin subjected to the two-step treatment. However, a metal film-coated silicone resin comprising a base made of a silicone resin and an electroless plating film formed on the base, which could not be conventionally produced, is produced by the method of the above embodiment. It was.

  In order to elucidate the reason why a film having the best characteristics by the two-stage treatment as a catalyst treatment was measured, the surface shape was measured by an atomic force microscope.

  6A shows an untreated substrate, FIG. 6B shows a substrate after alkali treatment, and FIG. 6C shows a substrate after two-stage treatment. The surface roughness Ra (centerline average roughness: JIS 0601-1976) was 2.9 nm for the untreated substrate, 7.8 nm for the substrate after alkali treatment, and 1.6 nm for the substrate after two-stage treatment.

  That is, the surface roughness of the substrate 10 is increased by the alkali treatment, but is decreased by the two-stage treatment process and is smaller than that after the alkali treatment process. Furthermore, the surface roughness after the two-stage treatment process is smaller than that of the untreated substrate.

  From the above results, the reason why the silicone resin, which has been difficult to conduct by electroless plating, can be made conductive by the method of the embodiment, in particular, the reason why the two-stage treatment is preferable is as follows. Conceivable.

  Deteriorated components fall off from the silicone resin surface-modified by UV treatment, and minute nanometer-scale recesses are formed on the surface. Nanometer-scale recesses below the wavelength of light do not have a significant effect on optical properties. In particular, since the inner surface of the recess is covered with a hydrophilic group modified by UV treatment, the adsorption of the catalyst proceeds. Not only the adhesion improvement effect due to chemical adsorption but also the adhesion improvement effect due to the physical anchor effect occurs, so the catalyst is firmly bonded to the silicone resin. For this reason, the electroless plating film deposited on the catalyst exhibits sufficient adhesion strength as a conductive layer.

  In particular, in a two-stage process or the like, a large amount of the catalyst enters the inside of the minute recess and fills the inside of the recess. For this reason, the surface roughness of the substrate after the two-stage treatment was lowered.

  On the other hand, in the Sn / Pd mixed catalyst treatment, the colloidal catalyst is large in size, so that it is difficult to enter the inside of the recess. For this reason, the mixed catalyst treatment has a large amount of adsorption of the catalyst, but the adhesion is not high.

<Modification>
The silicone resin may contain so-called silicone oil, which is a low molecular weight component. In this case, there is a possibility that stable film formation with strong water repellency is not easy. For this reason, it is preferable to provide the degreasing process which degreases a base | substrate using an organic solvent before a UV treatment process. As the organic solvent, a solvent that hardly dissolves the silicone resin but dissolves silicone oil or the like, such as toluene, is used.

  In the method for electrically conducting a silicone resin comprising a degreasing step using an organic solvent, an electroless plating film having good adhesion can be formed even on a silicone resin containing silicone oil or the like.

Second Embodiment
Next, a method for conducting a silicone resin according to the second embodiment will be described. Since the method for conducting a silicone resin according to the second embodiment is similar to the method for conducting a silicone resin according to the first embodiment, description of the same steps is omitted.

  In the method of the present embodiment, an ozone treatment process in which the substrate 10 and the ozone water 9 are brought into contact is performed as step S12A instead of the UV treatment process in step S12. As a method of bringing the substrate 10 into contact with the ozone water, a spray method, an immersion method, or the like is used.

  As shown in FIG. 7, the ozone water 9 of the embodiment is directly produced by water electrolysis reaction. That is, an electrolytic cell is constructed by sandwiching a solid polymer electrolyte membrane between a porous or reticulated anode and cathode, and ozone water 9 is produced by an electrolytic method in which tap water or pure water is electrolyzed using this cell. The

  In the electrolytic cell 1 shown in FIG. 7, an anode 3 and a cathode 5 are disposed with a solid polymer electrolyte membrane 7 (for example, “Nafion (registered trademark)” manufactured by DuPont) interposed therebetween, and the anode 3 and the cathode 5 are solid. The polymer electrolyte membrane 7 is fixed in close contact with the mutually facing surfaces to constitute a so-called zero gap cell. An anode chamber 13 is formed on the surface of the anode 3, and a cathode chamber 15 is formed on the surface of the cathode 5. The anode chamber 13 and the cathode chamber 15 have supply ports 13 a and 15 a and outlets 13 b and 15 b, respectively. Have.

  The anode 3 is formed by, for example, forming a hole in a self-stereoscopic conductive diamond plate formed in a rectangular plate shape by a microwave plasma CVD method by laser processing. As the cathode 5, a reticulated platinum electrode was used. In the electrolysis cell 1, when water is supplied from the supply ports 13 a and 15 a while applying a direct current between the anode 3 and the cathode 5, the ozone water 9 is discharged from the outlet 13 b of the anode chamber 13.

  Since the ozone concentration of the ozone water 9 greatly affects the surface modification of the substrate 10, it is preferably 0.3 ppm or more and 6.0 ppm or less, and particularly preferably 0.4 ppm or more and 4.0 ppm or less. If it is more than the said range, an effect will be remarkable, and if it is less than the said range, it will not have a bad influence on the surrounding environment, or the surface of the base | substrate 10 will be excessively roughened.

  In addition, the temperature of ozone water 9 of an ozone treatment process, the treatment time, etc. are set suitably.

  Here, ozone water generated by a silent discharge method or an electrolytic method can be prepared by, for example, passing through a gas-liquid dissolution tower and dissolving it in water. However, when the ozone water produced by the above method is used, the effect cannot be obtained unless the ozone concentration is very high, for example, 40 ppm or more. The cause of this is not clear, but when using ozone gas composed of nanobubbles, the effect can be obtained even at the same low concentration as when ozone water 9 is used. It is thought to have influenced.

  A dedicated device is required to generate ozone gas composed of nanobubbles, but the ozone water 9 directly generated by water electrolysis reaction is inexpensive and easy to mass-produce.

  In addition, you may irradiate an ultraviolet-ray further in an ozone treatment process. In other words, the method of the present invention only needs to include at least one of a UV treatment step of irradiating ultraviolet rays and an ozone step of bringing the substrate into contact with ozone water.

  The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the scope of the present invention.

  This application is filed on the basis of the priority claim of Japanese Patent Application No. 2012-165903 filed in Japan on July 26, 2012, and the above disclosed contents include the present specification, claims, It shall be cited in the drawing.

The method for electrically conducting a silicone resin according to an embodiment of the present invention includes a substrate preparation step for preparing a substrate made of a transparent silicone resin by polymerizing an unsaturated bond-containing organopolysiloxane, and a UV treatment step for irradiating the substrate with ultraviolet rays. And at least one of an ozone step for bringing the substrate into contact with ozone water, and an alkali treatment step for immersing the substrate in an alkaline solution. And a catalyst step of applying palladium , which is a catalyst for an electroless plating reaction, to a portion of the substrate where the recess is formed , using a first tin chloride solution and a palladium chloride solution in order. in turn comprises a conductive step of forming an electroless plating film on the portion where the catalyst is applied in the substrate, the.

Further, the silicone resin with a metal film according to another embodiment is made of a transparent silicone resin, and has a base having a nanometer-scale recess having a wavelength less than the wavelength of light on the surface, and metal palladium entering the recess of the base. When, having a non-electrolytic plating film that is a film-forming metal coating on the substrate.

Claims (9)

A substrate production step of polymerizing an unsaturated bond-containing organopolysiloxane to produce a substrate comprising a silicone resin;
At least one of a UV treatment step of irradiating the substrate with ultraviolet light, and an ozone step of contacting the substrate with ozone water;
A catalyst step of imparting a catalyst for electroless plating reaction to the substrate;
And a conductive process for forming an electroless plating film.   2. The method for electrically conducting a silicone resin according to claim 1, wherein the catalyst step is a two-stage method in which a first tin chloride solution and a palladium chloride solution are sequentially used.   2. The method for electrically conducting a silicone resin according to claim 1, wherein the catalytic step is an acidic ion activator treatment performed using a palladium chloride solution and a reducing agent-containing solution in order.   4. The method for electrically conducting a silicone resin according to claim 2, further comprising an alkali treatment step of immersing in an alkaline solution after the UV treatment step or the ozone step. 5.   The surface roughness of the substrate is increased by the alkali treatment step than before the UV treatment step, but is reduced by the catalyst step and becomes smaller than before the UV treatment step or the ozone step. The method for electrically conducting a silicone resin according to claim 4.   6. The method of electrically conducting a silicone resin according to claim 5, further comprising a degreasing step of degreasing the substrate using an organic solvent before the UV treatment step or the ozone step.   The method for electrically conducting a silicone resin according to any one of claims 1 to 6, wherein the ozone water is directly produced by an electrolysis reaction of water. A base made of silicone resin;
A silicone resin with a metal film, comprising: an electroless plating film formed on the substrate.   The silicone resin with a metal film according to claim 8, wherein the silicone resin is transparent.

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