WO2007138795A1

WO2007138795A1 - Catalytic agent for electroless plating

Info

Publication number: WO2007138795A1
Application number: PCT/JP2007/058313
Authority: WO
Inventors: Keiko Takagi; Masaru Seita
Original assignee: Technic Japan Inc.
Priority date: 2006-05-31
Filing date: 2007-04-17
Publication date: 2007-12-06
Also published as: JP2007321189A

Abstract

[PROBLEMS] To provide a low-cost catalytic agent for electroless plating for obtaining high adhesion. [MEANS FOR SOLVING PROBLEMS] A catalytic agent is composed of a mixture of a metal compound, an alkali metal hydroxide, a water-soluble silane coupling agent, and at least one of inorganic acid and organic acid.

Description

Specification

Catalyst agent for electroless plating

Technical field

[0001] The present invention relates to a metal compound, an alkali metal hydroxide, a water-soluble silane coupling agent,

The present invention also relates to a catalyst agent for electroless plating using a mixture of at least one of an inorganic acid and an organic acid.

Background art

[0002] For a long time, it has been possible to use it as a functional material or a decorative material for the formation of conductive wiring by performing electroless plating on electrical non-conductive materials such as glass, ceramics and plastic resins. As These electroless plating include substitution plating and chemical reduction plating (non-catalytic and autocatalytic). Substitution plating is intended to deposit the target metal by performing substitution based on the difference in ionization tendency between the metal to be plated and the metal ion in the plating bath. For these, replacement gold plating for depositing gold on the surface of Nikkenore and substitution tin plating for depositing tin on copper have been put into practical use. Non-catalytic chemical reduction plating is a method of forming a metal film by chemical reduction that is controlled without using a deposited metal or alloy as a catalyst. Has been used.

[0003] In autocatalytic chemical plating, the reducing agent reduces the metal ions in the bath and deposits as a metal on the substrate. These include electroless nickel plating and electroless copper plating. Electroless copper plating is a plating that deposits copper on a catalytic surface, and has been widely used as a printed wiring board formation technology such as through-hole plating, semi-additive method, additive method, and plastic plating. Electroless nickel plating is used for decorative purposes and electronic parts because nickel is deposited on the catalytic surface. In addition, nickel phosphorus alloy plating, nickel boron alloy plating, and ternary alloy plating baths to which tantasten and molybdenum are added have been developed to improve the characteristics.

[0004] The method of plating deposited on these catalytic surfaces is a catalyst on the surface of a non-conductive material. As a step of imparting, a catalyst nucleus serving as an initiator for electroless plating such as palladium colloid or palladium ion is formed on a non-conductive material, and then a metal film is formed by a reduction reaction around the catalyst nucleus. It is the method of making it precipitate.

[0005] The conventionally used palladium-tin colloidal catalyst has very good activity and colloidal stability, and the bath management is poor. On the other hand, since a highly hydrochloric acid solution (pH 1 or less) is used, there is a problem that the apparatus is corroded and the working environment is deteriorated. In addition, when a circuit is formed by the semi-additive method, a palladium-tin colloidal catalyst remains between the circuits, causing a decrease in insulation. A stripping agent has been developed to completely remove this residue, but it has not been fully effective.

[0006] When a metal film is formed on a non-conductive substance by these treatments, generally, since the adhesion between the non-conductive substance and the metal film is low, as a pretreatment for improving the adhesion, It is treated with chemicals such as chromic acid and permanganate, which have a high environmental impact, and an etching process is performed on the resin surface to obtain an anchor effect. However, when the resin is a polyimide resin, it is difficult to form irregularities that cause an anchor effect, so that it is difficult to obtain sufficient adhesion as compared with other resins. As chemical etching methods for polyimide resin, methods using 30 wt% or more of sulfuric acid and methods of performing the first-stage etching process with diamine and the second-stage etching process with 4th ammonium hydroxide are proposed. (See, for example, Patent Document 1). In addition, a method using a mixture of 3 to 15 wt% amine, 15 to 40 wt% alkali metal hydroxide, and about 10 to 50 wt% water-miscible alcohol has also been proposed (see, for example, Patent Document 2). In addition, mechanical roughing by sandblasting has been proposed (see, for example, Patent Document 3).

[0007] As a method for improving the adhesion between these resins and plating, a treatment with a silane coupling agent is generally performed as a pretreatment. According to Patent Document 4, if a silane coupling agent is adsorbed after irradiating a resin with far-ultraviolet rays having a wavelength of 350 ηm or less, application of a palladium-tin catalyst is promoted, and electroless plating with stronger adhesion is obtained. It is said that Further, in Patent Document 5, the step of immersing a polyimide film in a 0.05 to 10 wt% aqueous solution of a water-soluble aminosilane coupling agent and washing the film surface with water at least once in the next step, and a palladium-tin colloid catalyst solution Dipping in metal, removing tin and removing metal It consists of a step of immersing in a catalytically active solution that changes into a volume, and a step of forming an electroless plating layer by performing electroless metal plating.

[0008] In Patent Document 6, after the surface treatment with a silane coupling agent obtained by the reaction of an azole compound and an epoxy silane compound is treated with a solution containing a noble metal ion such as palladium. , Copper or nickel electroless plating. In Patent Document 7, after pretreatment of a covering material with an alkali metal salt, a silane coupling agent having a substituent having a metal-capturing ability in one molecule is converted into a nitrogen-containing heterocyclic azole compound and an epoxy group. Surface treatment is applied to the coating agent with a pre-mixed or reacted pre-metal compound (palladium chloride), which is a reaction product of the silane compound, and the electroless plating Has been given.

[0009] In order to impart conductivity to the surface of these non-conductive substances, it is important to adjust the adsorption with a catalyst that is strongly acidic and highly corrosive, has a high running cost, and a high catalyst. Excessive adsorption of the catalyst will reduce connection reliability and reduce adhesion. For this reason, such as a treatment agent in which an azole silane coupling agent, which is a reaction product of a nitrogen-containing heterocyclic azole compound and an epoxy group-containing silane compound, and a noble metal compound (palladium chloride) are mixed or reacted in advance. A silane coupling agent obtained by a complicated reaction is used. In addition, even in electroless bonding to a polyimide resin or the like, there was a problem that a practically satisfactory adhesion strength could not be obtained.

[0010] As other methods for forming a conductive film on a non-conductive material, a metal vapor deposition method, a laminating method, a casting method, or the like is generally used.

[0011] For example, as a method for imparting conductivity to the polyimide resin, a laminating method, a casting method, a sputtering method, or the like is used. The laminating method is a method in which a double-sided adhesive layer is applied to a polyimide film and a copper foil is laminated. Since an adhesive layer is required on both sides, there is a limit to reducing the thickness. The casting method is a method in which a polyimide raw material is applied to an electrolytic copper foil, heat-treated, and then the copper foil is further bonded. Since copper foil with a large number of processes is used, there is a limit to reducing the thickness of the film. When handling is taken into consideration, it is 10 zm or more, making it difficult to meet future demands for fine wiring. Wet treatment (plating method) was also considered force. Polyimide was difficult because of its high chemical resistance. [0012] The sputtering method has a force of forming nickel-chromium sputter 0 · 003 to 0.03 / im and copper sputter 0 · 2 / im on a 25 μΐη polyimide film. Equipment and running costs are expensive. Therefore, it is necessary to balance film tension avoidance, the conveyance tension, and the sputter output, which are difficult during sputtering, and there is a problem in low mass productivity. In addition, it is possible to perform sputtering on one side. Since double-sided processing requires two passes through the sputtering device, the incidence of scratches and wrinkles increases, and the processing cost increases, causing problems in mass production. is there.

In recent years, in order to maintain high-frequency characteristics, it is necessary to perform plating with good adhesion on a smooth non-conductive surface, and methods such as UV treatment and atmospheric plasma treatment have been proposed. However, no method has yet been found to form a conductive thin film with good adhesion on a smooth non-conductive surface by a wet method.

Patent Document 1: Japanese Patent No. 2622016

Patent Document 2: JP 63-259083 A

Patent Document 3: Japanese Patent Laid-Open No. 2005-116745

Patent Document 4: JP-A-10-310873

Patent Document 5: Japanese Unexamined Patent Application Publication No. 2005-116745

Patent Document 6: Japanese Patent No. 3277463

Patent Document 7: JP 2002-226972 A

Disclosure of the invention

Problems to be solved by the invention

[0014] For this reason, in order to obtain high adhesion strength between the resin substrate and the conductive thin film, there is a strong demand for a new method for catalyzing a non-conductive surface in place of the conventional electroless plating pretreatment.

[0015] Also, a palladium-seed colloid catalyst has been widely used for hitting through-holes in printed wiring boards, but the catalyst remains between the lines during circuit formation by the semi-additive method, and later electroless nickel In other words, the problem is that the substitutional gold plating is deposited between the lines and deteriorates the insulation. In order to solve such problems, there is an urgent need for a catalyzing method that can be easily removed by acid treatment or the like, and an inexpensive catalyzing method that replaces the palladiumose colloidal catalyst solution.

[0016] The present invention has been made in view of such circumstances, and includes a resin substrate and a conductive thin film. The purpose is to provide a new method for catalyzing on non-conductive surfaces, replacing the conventional electroless plating pre-treatment for obtaining high adhesion strength, and a relatively simple treatment by the wet method. It is an object of the present invention to provide a catalytic method for forming a conductive thin film on the surface of the non-conductive material that does not pollute the work environment or the global environment.

Means for solving the problem

[0017] The electroless plating catalyst of the present invention comprises a mixture of a metal compound, an alkali metal hydroxide, a water-soluble silane coupling agent, and at least one of an inorganic acid and an organic acid. And

The invention's effect

[0018] The electroless plating catalyst of the present invention is a new catalyst on a non-conductive surface, replacing the conventional electroless plating pretreatment for obtaining high adhesion strength between a resin substrate and a conductive thin film. The agent is provided.

[0019] Conventionally, palladium-tin colloidal catalysts have been widely used for through-hole plating of printed wiring boards, but the catalyst remains between the lines during circuit formation by the semi-additive method, and later electroless nickel, substitutional gold A problem arises in that the metal deposits are deposited between the lines and the insulation is deteriorated. The present invention solves this problem and makes it possible to provide a catalyzing method that can be easily removed by acid treatment or the like and a catalyst agent that replaces the palladiumose colloid catalyst solution.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the electroless plating catalyst agent according to an embodiment of the present invention will be described in detail.

[0021] The non-conductive substrate that can be used in the electroless plating catalyst of the present embodiment is a resin substrate having appropriate physical properties according to the purpose of use, such as strength, insulation, and corrosion resistance. It is not particularly limited. Further, the non-conductive substrate that can be used in the electroless plating catalyst of the present embodiment is not limited to a resin molded product, but may be a composite in which the resin is reinforced. It is also possible to use a base material made of various materials such as ceramics, glass, metal, etc., or a film formed from these with a resin.

[0022] Arbitrary resins can be used for the non-conductive substrate, such as epoxy resin, polyimide resin, polyphenylene ether resin, fluorine resin, ABS resin, epoxy resin, and poly An imide resin is exemplified. The resin substrate may be composed of a single resin or a plurality of resins.

[0023] The treatment process using the electroless plating catalyst of the present embodiment includes (1) a surface modification treatment of a non-conductive substrate, and (2) a non-electrolytic plating catalyst on the non-conductive substrate. It comprises the steps of forming nuclei, (3) a step of forming a metal conductive thin film layer by electroless plating, and (4) a step of heat treatment after electroless plating. ) Can be adjusted appropriately by changing each condition. In the case of a composite resin substrate with a metal, a metal etching treatment step and an acid activation step can be added as necessary. In addition, if necessary, the electroless reaction can be accelerated before the electroless connection.

[0024] After the heat treatment, the electroless plating film may be subjected to degreasing treatment, descaling treatment, acid activation treatment, etc., and then electroplating. Heat treatment after electroplating can be applied as needed.

[0025] The above-mentioned (1) surface modification treatment of the non-conductive substrate can be applied by a dry method such as general-purpose plasma treatment or a wet method using chemicals. The optimum method can be selected considering the chemical characteristics of the non-conductive substrate to be treated.

By the plasma treatment, the non-conductive substrate is subjected to surface roughening by etching, desorption of the resin constituent elements by high-energy active species, branch cross-linking and desaturation, and introduction of a group having ion exchange ability. Occurs and can impart hydrophilicity. Examples of the plasma processing apparatus include a room temperature plasma processing apparatus and a microwave low temperature oxygen plasma processing apparatus.

[0027] An acidic solution such as sulfuric acid or an alkaline solution such as sodium hydroxide or potassium hydroxide can be used for surface modification of a non-conductive substrate by a wet method. For example, in the case of polyimide resin epoxy resin, 0.1 mol / L to 10 mol / L-NaOH solution or 0.1 mol / L to 10 mol / L-KOH solution can be used. The temperature is preferably in the range of 20 to 90 ° C, and the treatment time is preferably in the range of 10 seconds to 10 minutes.

[0028] (2) The step of forming a catalyst nucleus with electroless plating on a non-conductive substrate includes the step of forming a metal compound, an alkali metal hydroxide, a water-soluble silane coupling agent on the non-conductive substrate, This is a step of treating with the electroless plating catalyst of the present embodiment comprising a mixture of at least one of an inorganic acid and an organic acid. Metallization to be reacted depending on the type of electroless plating A compound can be selected.

[0029] For example, metal compounds of metals such as palladium, gold, silver and platinum can be used for electroless copper plating, and palladium, titanium, cobalt, tungsten, gold, Metal compounds of metals such as silver and platinum can be used. Concentration is 5 X 10 5 X 10 ¹ molZL, 3 X 10 5 X 10 ² molZL is preferred. The electroless plating catalyst according to the present embodiment develops the catalytic ability of metal compounds by metals such as titanium, cobalt, tungsten, etc. that have not been used as a catalyst as well as palladium, gold, silver, platinum. It becomes possible.

[0030] As the electroless plating catalyst of this embodiment, an optimal water-soluble silane coupling agent can be selected depending on the type of non-conductive substrate. For example, for the epoxy resin, polyimide resin, phenol resin, polyethylene resin, polypropylene resin, polystyrene resin, PET resin, acrylic resin, the trialkoxysilane is trimethoxysilane, triethoxysilane, tripropoxysilane, triplicate. As Toxisilane, Diethoxymonomethoxysilane, Monomethoxydimethoxysilane, Monomethoxydipropoxysilane, Ptoxhetoxypropoxysilane, Dimethoxymonopropoxysilane, Diethoxymonopropoxysilane, Monobutoxydimethoxysilane, Tetraalkoxysilane Are tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetrabutoxysilane, tetraethoxymonomethoxysilane, dimethoxydioxydipropoxysilane, Toximopropoxysilane, dibutoxydimethoxysilane, and monoalkyltrialkoxysilane include monomethyltrimethoxysilane, monoethyltrimethoxysilane, monopropyltriethoxysilane, monomethyltryptoxysilane, monoethyltributoxysilane, monopropyltributoxysilane Dialkyl dialkoxy

. The concentration is 5 10 ^{3 to} 311101/210 ⁴ to 1 10 ³ 11101 / is preferred. These alkoxysilanes may be used alone or in combination of two or more. [0031] In addition, the water-soluble silane coupling agent of this embodiment includes a vinyl group, an epoxy group, an amino group, a methacryloxy group, a mercapto group, a methoxy group chemically bonded to an inorganic material, and an ethoxy group. One or a plurality selected from a group having a group. Examples of the bur group possessed by the water-soluble silane coupling agent of the present embodiment include butyl trimethoxy silane, butyl triethoxy silane, butyl trichloro silane, butyl triacetoxy silane, burtris (methoxy ethoxy) silane, butyl triisopropoxy silane, The epoxy group possessed by the water-soluble silane coupling agent of the embodiment includes 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyljetoxysilane, and 3-glycidoxy. Propylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and the amino group of the water-soluble silane coupling agent of this embodiment include N- (2-aminoethyl) 3 —Aminopropi

N- (2-aminoethyl) 3-aminopropyltriethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, aminosilane, 3-(-2-aminoethyl) anolene N — (1,3-dimethylbutylidene) propylamine, N-phenyl-3-triaminotrimethoxysilane, methacryloxy dimethoxysilane, 3-methacryloxypropyltriethoxysilane, which the water-soluble silane coupling agent of this embodiment has, Examples of mercapto groups possessed by 3-methacryloxypropylmethylmethoxysilane and the water-soluble silane coupling agent of this embodiment include 3-mercaptopropyltriethoxysilane, 3-mercaptopropyltrisilane.

[0032] The concentration of the inorganic acid used in the electroless plated catalyst agent of the present embodiment 3 is X 10 5mol / L, 2 10- 1 ~2111017 Mr. Shi favored I. The concentration of the alkali metal hydroxide used in the electroless plated catalyst agent of the present embodiment, 2 10- ^2-311101 / Shideari, IX 10 ¹ ~ 2 mol / L is preferred. The concentration of the organic acid used in the electroless plating catalyst of the present embodiment is ² × 10−2 to ² mol / L, preferably 3 × 10−1 to ¹ mol / L.

[0033] The alkali metal hydroxide used for the electroless plating catalyst of this embodiment is sodium hydroxide. Any alkali metal hydroxide selected from the group consisting of thorium and potassium hydroxide may be used. In addition, the inorganic acid used in the electroless plating catalyst of the present embodiment may be an inorganic acid selected from the group consisting of hydrochloric acid, sulfuric acid, nitric acid, and carbonic acid. The organic acid used in the electroless plating catalyst of this embodiment is an organic acid selected from the group consisting of carboxylic acids, hydroxycarboxylic acids, and amino acids.

[0034] The step (3) of forming a metal conductive thin film layer by electroless plating can be selected according to the purpose as long as it is an electroless plating having catalytic activity. For example, electroless nickel plating, electroless copper plating, electroless cobalt plating, electroless palladium plating, electroless silver plating, electroless gold plating, electroless platinum plating, electroless ruthenium plating, Examples include electroless openings such as zinc plating, electroless indium plating, electroless tin plating, electroless lead plating, electroless antimony plating, and electroless bismuth plating.

[0035] (4) Force that can provide sufficient adhesion strength even if there is no heat treatment step after electroless plating. Adhesion strength is improved by heat treatment. The heat treatment method is also related to the heat resistance of the resin. It is preferable that the heat treatment is performed within a range where the resin does not deteriorate or excessively oxidize. For example, in the case of an epoxy resin-based resin substrate, it is preferable to heat at about 80 to 150 ° C. In the case of a polyimide-based resin substrate, it is preferable to heat at about 80 to 180 ° C. The heating time is usually preferably about 30 to about 120 minutes. The heating atmosphere may be heat-treated in air with no particular limitation, but heating may be performed in a reducing atmosphere such as a nitrogen atmosphere or a hydrogen atmosphere so that oxidation of the formed conductive thin film does not proceed excessively. A heating atmosphere may be appropriately set according to the properties of the target component.

As described above, the electroless plating catalyst of the present embodiment is a new alternative to the conventional electroless plating pretreatment for obtaining high adhesion strength between the resin substrate and the conductive thin film. The catalyst agent is provided on the surface of the non-conductor.

[0037] Conventionally, a palladium-tin colloidal catalyst has been widely used to mate through holes in printed wiring boards, but this catalyst remains between lines during circuit formation by the semi-additive method, and later electroless nickel, substitutional gold A problem arises in that the metal deposits are deposited between the lines and the insulation is deteriorated. The electroless plating catalyst of the present embodiment solves this problem, It is possible to provide a catalytic method that can be easily removed by acid treatment or the like and a catalyst agent that replaces the palladiumose colloidal catalyst solution.

[0038] In addition to the palladium ion, the metal ion having catalytic ability to be mixed or reacted with the silane coupling agent is alone from the group consisting of cobalt ion, tungsten ion, titanium ion, silver ion, gold ion, platinum ion, Alternatively, since a plurality of options can be selected, it is possible to provide a low-cost electroless plating catalyst.

Example

[0039] Next, the electroless plating catalyst of the present invention will be described more specifically with reference to examples.

However, the present invention is not limited to only these examples.

[0040] In the resin composite material produced using the electroless plating catalyst of this example, the adhesion between the metal element-containing component and the resin substrate is improved. When the metal element-containing component forms a film, the adhesion can be judged by the peel strength of the film and the tape peeling test.

[0041] After the produced electroless plating thin film used for the electroless plating catalyst of this embodiment is formed to about 0.1 force 0.3 μΐη, a copper film of 10 to 20 μΐη is formed on the electrolytic copper. It is formed by eye contact. After heat treatment at 200 ° C for 10 minutes, the film was cut into a lcm width and measured by a vertical peeling test (90 ° peel strength) at a rate of 5 OmmZ using a tensile tester.

[Example 1] Preparation of nickel thin film on polyimide resin

A 15 cm X 15 cm polyimide film (UPILEX-25R manufactured by Ube Industries) was placed in an atmospheric pressure plasma apparatus (manufactured by Nippon Paint Co., Ltd.) and treated at 80 kV for a distance of 2 cm between electrodes for 10 minutes. After that, from a mixed solution of palladium chloride 5 X 10_ ³ mol / L, triethoxysilane 0.5 mol / L, hydrochloric acid 5 X 10 " ² mol / L, sodium hydroxide 1 X 10" ² mol / L, formic acid ImolZL After immersing in an electroless plating catalyst at room temperature for 1 minute and washing with water, this sample was placed in an electroless nickel plating bath (Technic Nickel AT_ 5000A: 60 mL / L, B: 150 mL / L) Immersion was performed at 80 ° C for 2 minutes to obtain a nickel conductive thin film. Thereafter, heat treatment was performed at 200 ° C. for 10 minutes.

[0043] This sample was immersed in a degreasing agent (Techni FPD Cleaner 20mL / L, 60 ° C) for 1 minute, washed with water, and then in an activator (Technique ACT9600 50g / L) solution at room temperature for 30 seconds. Soak After washing with water, use a copper sulfate plating bath (Techni TECH2 CU2300) to perform copper plating at 15 / m, wash with water, and prevent oxidation of the copper film surface (Technics Corp. And then washed with water and dried for 20 seconds at room temperature. After that, when observed with a metallographic microscope, cracks did not occur and a uniform film was obtained. After heat treatment at 250 ° C. for 1 minute, the peel strength of the obtained film was measured to be 0.85 kN / m.

[table 1]

[0045] (Example 2: Preparation of copper thin film on polyimide resin)

15cm X 15cm polyimide film (Toray DuPont Kapton EN) is immersed in 80g / L sodium hydroxide solution at 80 ° C for 5 minutes, activator (Techni ACT3500 lOOmL / L), palladium sulfate 5 Electroless electrolysis consisting of a mixed solution of X 10 ^_3 mol / L, jetyl dimethoxysilane 0.4 mol / L, hydrochloric acid 6 X 10 ^_2 mol / L, sodium hydroxide 2 X 10 ^_2 mol / L, acetic acid lmol / L Soak in a catalyst for 2 minutes at room temperature, rinse with water, soak for 1 minute, rinse with water, and then wash this sample with an electroless copper bath (Technique: Cuprosic 84 A: 40 mL / L, B: (30 mL / L, additive: 30 mL / L, F: 100 mL / L) The film was immersed for 5 minutes at 50 ° C. to obtain a copper plating film. Thereafter, heat treatment was performed at 200 ° C. for 10 minutes.

[0046] This sample was immersed in a degreasing agent (Techni FPD Cleaner 20mL / L 60 ° C) for 1 minute, washed with water, and then in an activating agent (Technique: ACT9600 50mL / L) solution at room temperature for 30 seconds. After soaking, washing with water, using a commercially available copper sulfate bath, wash the copper with 15 zm, wash with water, and prevent oxidation of the copper film surface (Technique: Tech. And then washed with water and dried for 20 seconds. After that, when observed with a metallurgical microscope, no cracks occurred, a uniform film was obtained, and heat treatment at 150 ° C for 5 minutes Later, when the peel strength of the obtained film was measured, it was 0.60 kN / m.

[0047] (Example 3: Production of copper thin film on epoxy resin)

After installing 5cm X 15cm (plate thickness 1 · 6mm) epoxy resin (Matsushita Electric Works Co., Ltd.) on the turntable in the microwave low-temperature oxygen plasma treatment tank, operate the vacuum pump to set the inside of the treatment tank to 0. Depressurize to 13 Pa or less, introduce oxygen gas at a rate of 10 mL / min while operating the vacuum pump, and irradiate the epoxy resin at a discharge current of 150 (mA) for 5 minutes to form hydrophilic groups on the resin surface. did. Thereafter, palladium acetate 6 X 10- ³ mol / L, Jefferies chill dimethoxysilane 0. 5MolZL, hydrochloride 5 X 10_ ² mol / L, sodium hydroxide 2 X 10 mol / L, free of a mixed solution of acetic acid I mol / L After immersing in an electrocatalyst catalyst for 3 minutes at room temperature and washing with water, this sample is electroless copper bath (Technique: Cuprosic 8 4 A: 40 mL / L, B: 30 mL / L, Additive: 30 mL / L, F: 100 mL / L 50 ° C), and immersed for 5 minutes to obtain a copper conductive thin film. Thereafter, heat treatment was performed at 200 ° C for 10 minutes.

[0048] This sample was immersed in a degreasing agent (Techni FPD Cleaner 20mL / L 60 ° C) for 1 minute, washed with water, and then immersed in an activator (Technique 50g / L ACT9600 solution, room temperature) for 30 seconds. After washing with water, using a copper sulfate bath (Technique: Cuprochic 84 A: 40 mL / L, B: 30 mL / L, Additive: 30 mL / L, F: 100 mL / L 50 ° C) Copper plating was performed at 15 μm, washed with water, and treated with a discoloration inhibitor (Technic Anti-Turnish, Technic Co., Ltd.) for 20 seconds at room temperature to prevent oxidation of the copper film surface, and then washed with water and dried. When the surface was observed with a metallurgical microscope, a uniform film with no cracks or scratches on the material was obtained. Then, after heat treatment at 150 ° C for 5 minutes, the peel strength of the obtained film was measured and showed 0.75k NZm.

[0049] (Example 4: Preparation of nickel thin film on epoxy resin)

15cm X 15cm (thickness 1. 6 mm) of an epoxy resin (Matsushita Electric Works Co., Ltd.) was immersed for 5 minutes at 80 ° C in 80gZL sodium hydroxide solution, washed with water, palladium chloride ³ X 10- 3 mol / L, Tetraethoxysilane 0.5 molZL, hydrochloric acid 5 X 10_ ² mol / L, sodium hydroxide 2 X 10—2 mol / L, glycolic acid lmol / L mixed catalyst agent for electroless plating for 1 minute at room temperature After immersion and washing with water, this sample is electroless nickel plating bath (Technique: Tech. Ni-Nickel AT—5000 A: 60 mL / LB: 150 mL / L at 80 ° C.) for 2 minutes to obtain a nickel thin conductive film. Thereafter, heat treatment was performed at 200 ° C. for 10 minutes.

[0050] This sample is immersed in a degreasing agent (Techni FPD Cleaner 20mL / L, 60 ° C) for 1 minute, washed with water, and then immersed in an activating agent (Technique: ACT9600 50mL / L, room temperature) for 30 seconds. After washing with water, use a copper sulfate bath (Technique: Cuprochic 84 A: 40mL / L, B: 30m LZL, additive: 30mLZL, F: 100mL / L 50 ° C). In order to prevent oxidation of the copper film surface, it was treated with a discoloration inhibitor (Technique: Techni Anti-Turnish) for 20 seconds at room temperature, and then washed with water and dried. After that, when the surface was observed with a metallographic microscope, a uniform film with no cracks or scratches on the material was obtained. After heat treatment at 150 ° C for 10 minutes, the peel strength of the obtained film was measured and found to be 0.85 k NZm.

[0051] (Example 5: Fabrication of build-up substrate)

An epoxy resin (manufactured by Matsushita Electric Works Co., Ltd.) 100 / m was applied as an insulating layer to a 5cm x 10cm (plate thickness 1.6mm) substrate, cured at 150 ° C for 1 hour, and then micro vias with a carbon dioxide laser Formed. This sample was treated with an atmospheric pressure plasma apparatus at 80 kV for 10 minutes with an electrode distance of 2 cm. This sample was palladium acetate 3 X 10 ^_3 mol / L, diethoxymonomethoxysilane 0 3 mol / L, hydrochloric acid 3 X 10 ^_2 mol / L, sodium hydroxide 1 X 10 ^_2 mol / L, glycolic acid 0 Immerse in an electroless plating catalyst consisting of a 5 mol / L mixed solution at room temperature for 5 minutes, wash with water, and then wash this sample with an electroless copper plating bath (Technic Co., Ltd .: Cuprosic 84 A: 40 mL / L, B: 30 mL / L, additive: 30 mL / L, F: 100 mL / L 50 ° C) for 5 minutes to obtain a copper conductive thin film. Thereafter, heat treatment was performed at 200 ° C. for 10 minutes. After that, using a copper sulfate plating bath (Techni Tech-2 Cu-2300), perform copper plating at 15 zm, wash with water, and prevent oxidation of the copper film surface (technitech Techni). Anti-Turnish room temperature) for 20 seconds, washed with water and dried. Then, when observed with a metallographic microscope, a uniform film with no cracks on the surface was obtained. After annealing at 150 ° C for 1 hour, the peel strength of the obtained film was measured and found to be 0.8 kNZm, indicating good adhesion.

[Example 6: Preparation of electroless copper thin film on glass] 2. 6cm X 7.6cm slide glass (Iwaki Glass Co., Ltd.) is immersed in 80g / L sodium hydroxide solution at 80 ° C for 5 minutes, washed with water, and activated (Techni ACT3500 lOOmL / L chamber) after immersion in temperature), the sample, palladium sulfate 5 X 10- ³ mol / L, Jefferies chill dimethoxy silane-0. 4 mol / L, hydrochloric 6 X 10_ ² mol / L, Mizusani匕sodium 2 X 10- Immerse it in a catalyst for electroless plating consisting of ² mol / L and 1 mol / L acetic acid at room temperature for 10 minutes, wash with water, and then use an electroless nickel bath (Techni AT-5000 A: 60 mLZL, B: (150 mL / L) for 5 minutes, washed with water and dried. When the tape test was performed, no part was found. When the surface was observed with a metallographic microscope, no cracks occurred and a uniform film was obtained. As a result of the tape test, no peeling was observed.

[0053] This sample is immersed in a degreasing agent (Techni FPD cleaner 20mL / L, 60 ° C) for 1 minute, washed with water, and then immersed in an activator (Technique: ACT9600 50mL / L, room temperature) for 30 seconds. After washing with water, use a copper sulfate bath (Technique: Cuprochic 84 A: 40 mL / L, B: 30 mL / L, Additive: 30 mL / L, F: 100 mL / L 50 ° C) Copper plating was performed at 15 / im, washed with water, and treated with a discoloration inhibitor (Technique: Techni Anti-Turnish) for 20 seconds at room temperature to prevent oxidation of the copper film surface, and then washed with water and dried. After that, when the surface was observed with a metallographic microscope, a uniform film with no cracks or scratches on the material was obtained. After heat treatment at 150 ° C for 1 minute, the peel strength of the obtained film was measured and found to be 0.65 kN / m.

[Example 7: Preparation of nickel thin film on epoxy resin]

10 cm X 10 cm (thickness 1 · 6 mm) of an epoxy resin (Matsushita Electric Works Co., Ltd.) was immersed for 5 minutes at 80 ° C in 80 g / L sodium hydroxide solution, washed with water, titanium sulfate ³ X 10- 3 mol / For electroless plating consisting of a mixed solution of L, tetraethoxysilane 0.5 mol / L, hydrochloric acid 7 X 10_ ² mol / L, sodium hydroxide 1 X 10_ ³ mol / L, EDTA-2Na3 X 10_ ² molZL After immersing in a catalyst agent at room temperature for 1 minute and washing with water, this sample is immersed in an electroless nickel plating bath (Techninickel AT—5000 A: 60mL / LB: 150mLZL80 ° C) for 2 minutes. A conductive thin film was obtained. Thereafter, heat treatment was performed at 200 ° C. for 10 minutes.

[0055] This sample was immersed in a degreasing agent (Techni FPD Cleaner 20mL / L, 60 ° C) for 1 minute, washed with water, and then immersed in an activator (Technique: ACT9600 50mL / L, room temperature) for 30 seconds. Water After washing, use a copper sulfate bath (Technique: Cuprochic 84 A: 40 mL / L, B: 30 mL / L, Additive: 30 mL / L, F: 100 mL / L 50 ° C). The surface was washed with water, washed with water, treated with a discoloration inhibitor (Technique: Techni Anti-Turnish) for 20 seconds at room temperature to prevent oxidation of the copper film surface, washed with water and dried. After that, when the surface was observed with a metallographic microscope, a uniform film with no cracks or scratches on the material was obtained. After heat treatment at 150 ° C for 1 minute, the peel strength of the obtained film was measured to be 0.65 kN / m.

[Example 8: Preparation of nickel thin film on epoxy resin]

10cm X 10cm (plate thickness 1.6mm) epoxy resin (Matsushita Electric Works) immersed in 80gZL sodium hydroxide solution at 80 ° C for 5 minutes, washed with water, sodium tungstate 3 X 10-2 mol / L, Monolithic dimethoxysilane 0.45 mol / L, hydrochloric acid 7 X 10 ^_2 molZL, sodium hydroxide 1 X 10 ^_3 mol / L, maleic acid 1 X 10 ^{_ 1} molZL After immersing for 1 minute at room temperature and rinsing with water, this sample is immersed in an electroless nickel bath (Technic Nickel AT-5000A: 60mL / LB: 150mL / L80 ° C) for 2 minutes. A conductive thin film was obtained. Then, heat treatment was performed at 200 ° C for 10 minutes.

[0057] This sample was immersed in a degreasing agent (Techni FPD Cleaner 20mL / L, 60 ° C) for 1 minute, washed with water, and then immersed in an activator (Technique: ACT9600 50mL / L, room temperature) for 30 seconds. After washing with water, use a copper sulfate bath (Technique: Cuprochic 84 A: 40 mL / L, B: 30 mL / L, Additive: 30 mL / L, F: 100 mL / L 50 ° C) Copper plating was performed at 15 / im, washed with water, and treated with a discoloration inhibitor (Technique: Techni Anti-Turnish) for 20 seconds at room temperature to prevent oxidation of the copper film surface, and then washed with water and dried. After that, when the surface was observed with a metallographic microscope, a uniform film with no cracks or scratches on the material was obtained. After heat treatment at 200 ° C for 1 minute, the peel strength of the obtained film was measured and found to be 0.70 kN / m.

[Example 9: Preparation of copper thin film on polyimide resin]

15 cm X 15 cm polyimide film (Toray DuPont Kapton EN) is immersed in 80 g / L sodium hydroxide solution at 80 ° C for 5 minutes, and the activator (Techni ACT3500 lOOmL / L), cobalt chloride 4 X 10 mol / L, Jefferies chill dimethoxysilane 1 X 10 mol / L, hydrochloric acid 7 X 10- ² mol / L, sodium hydroxide 2 X 10- ³ mol / L, maleic acid I mol / Immerse in a catalyst for electroless plating consisting of a mixed solution of L at room temperature for 2 minutes, rinse with water, soak for 1 minute, and rinse with water. Prosic 84 A: 40 mL / L, B: 30 mL / L, additive: 30 mL / L, F: 100 mL / L) Dipped at 50 ° C for 5 minutes to obtain a copper plating film. Thereafter, heat treatment was performed at 200 ° C. for 10 minutes.

[0059] This sample was immersed in a degreasing agent (Techni FPD Cleaner 20mL / L 60 ° C) for 1 minute, washed with water, and then in an activating agent (Technique: ACT9600 50mL / L) solution at room temperature for 30 seconds. After soaking, washing with water, using a commercially available copper sulfate bath, wash the copper with 15 zm, wash with water, and prevent oxidation of the copper film surface (Technique: Tech. And then washed with water and dried for 20 seconds. Thereafter, when observed with a metallurgical microscope, no cracks occurred and a uniform film was obtained. After heat treatment at 150 ° C for 1 minute, the peel strength of the obtained film was measured to be 0.65 kN / m. showed that.

[0060] (Example 10: Preparation of nickel thin film on polyimide resin)

5cm X 10cm polyimide film (Ube Industries Upilex 25R) is immersed in 80g / L sodium hydroxide solution at 80 ° C for 5 minutes, washed with water, and then activated (Techni ACT350 0 lOOmL / L room temperature) after, the sample, palladium chloride 5 X 10 ^_3 mol / L, salts of cobalt 5 X 10 ^_3 mol / L, triethoxy silane 0 · 5 mol / L, hydrochloric ^{6 X 10 "2 mol / L} , sodium hydroxide Soak in water for 10 minutes at room temperature in a non-electrolytic agent consisting of a mixture of 2 X 10 ^_2 mol / L and lmol / L maleic acid, rinse with water, and electroless nickel plating bath (Techni AT-5000 A: A uniform nickel film was obtained when immersed in 60 mL / L, B: 150 mL / L 80 ° C. for 5 minutes, and then heat-treated at 200 ° C. for 10 minutes.

[0061] This sample was immersed in a degreasing agent (Techni FPD Cleaner 20mL / L 60 ° C) for 1 minute, washed with water, and then in an activating agent (Technique: ACT9600 50mL / L) solution at room temperature for 30 seconds. After soaking, washing with water, using a commercially available copper sulfate bath, wash the copper with 15 zm, wash with water, and prevent oxidation of the copper film surface (Technique: Tech. And then washed with water and dried for 20 seconds. After that, when observed with a metallurgical microscope, cracks did not occur and a uniform film was obtained, which was heat-treated at 200 ° C for 5 minutes. Later, when the peel strength of the obtained film was measured, it was 0.60 kN / m.

[Example 11: Preparation of copper thin film on polyimide resin]

5 cm X 1 Ocm polyimide film (Ube Industries Upilex 25R) is immersed in 80 g / L sodium hydroxide solution at 80 ° C for 5 minutes, washed with water, and activator (Techni ACT350 0 lOOmL / L room temperature) It immersed 5 minutes at after immersion silver nitrate 5 X 10- ³ mol / L, Jechi dimethoxysilane 0. 5 mol / L, hydrochloric 6 X 10_ ² mol / L, sodium hydroxide ² X 10_ 2 m ol / maleic ImolZL Soaked in an electroless plating catalyst consisting of a mixture solution at room temperature for 5 minutes, washed with water, and then electroless copper plating bath (Technic Co., Ltd .: Cuprochic 84 A: 40m LZL, B: 30mL / L, (Additive: 30mL / L, F: 100mL / L 50 ° C) When immersed for 5 minutes, a uniform Nikkenore film was obtained. Thereafter, heat treatment was performed at 200 ° C for 10 minutes.

[0063] This sample was immersed in a degreasing agent (Techni FPD Cleaner 20mL / L 60 ° C) for 1 minute, washed with water, and then in an activator (Technique: ACT9600 50mL / L) solution at room temperature for 30 seconds. After soaking, rinsing with water, use a commercially available copper sulfate messenger bath to perform copper plating at 15 / m, wash with water, and prevent oxidation of the copper film surface (anti-discoloration made by Technic Co., Ltd.). And room temperature) for 20 seconds, washed with water and dried. After that, when observed with a metallographic microscope, no cracks occurred and a uniform film was obtained. After heat treatment at 150 ° C for 10 minutes, the peel strength of the obtained film was measured to be 0.65 kN / m. showed that.

[0064] (Example 12: Preparation of nickel thin film on polyimide resin)

5cm X 10cm polyimide film (Ube Industries Upilex 25R) is immersed in 80g / L sodium hydroxide solution at 80 ° C for 5 minutes, washed with water, and then activated (Techni ACT350 0 lOOmL / L room temperature) after, the sample, cobalt chloride l X 10_ ² molZL, tetramethylene Tokishishiran 0. 5 mol / L, hydrochloric 6 X 10- ² mol / L, sodium hydroxide ² X 10- 2 mol / L, maleic acid I mol / L Immerse in an electroless plating catalyst consisting of a mixed solution at room temperature for 5 minutes, wash with water, and then electroless nickel plating bath (Techni AT-5000 A: 60 mL / L, B: 150 mL / L 80 ° C) When immersed for 5 minutes, a uniform nickel film was obtained. Thereafter, heat treatment was performed at 200 ° C. for 10 minutes.

[0065] This sample was immersed in a degreasing agent (Techni FPD Cleaner 20mL / L 60 ° C) for 1 minute, After washing, immerse in an activating agent (Technique: ACT9600 50mL / L) solution at room temperature for 30 seconds, wash with water, and then use a commercially available copper sulfate bath to perform copper plating at 15 / m. Then, in order to prevent oxidation of the copper film surface, it was treated with a discoloration inhibitor (manufactured by Technic Co., Ltd .: Techni Anti-Tanisch, room temperature) for 20 seconds, washed with water and dried. Thereafter, when observed with a metallurgical microscope, cracks did not occur and a uniform film was obtained. After heat treatment at 250 ° C for 1 minute, the peel strength of the obtained film was measured to show 0.70 kNZm. It was.

[0066] (Comparative Example 1: Preparation of copper thin film on polyimide resin)

Conductive copper thin film by electroless copper plating (ATS Ad Power Par IW process manufactured by Okuno Seiyaku Co., Ltd.) using commercially available palladium-tin colloid on 5cm X 1 Ocm polyimide film (UPILEX-25R manufactured by Ube Industries) Formed. After that, using a copper sulfate plating bath (Techni Cu_2300 manufactured by Technic Co., Ltd.), the copper plating is washed at 15 zm, washed with water, and used to prevent oxidation of the copper film surface (Technic Co., Ltd.). Manufactured by Techni Anti-Turnish, room temperature), washed for 20 seconds and dried. After heat treatment at 200 ° C for 10 minutes, when measuring the peel strength of the copper plating film, it showed 0.1 kN / m, and good adhesion could not be obtained.

[0067] (Comparative Example 2: Preparation of nickel thin film on polyimide resin)

5 cm x 1 Ocm polyimide film (UPILEX 25R manufactured by Ube Industries, Ltd.) is immersed in 80 g / L sodium hydroxide solution at 80 ° C for 5 minutes, washed with water, and then a commercially available electroless copper plating pretreatment agent (Okuno Pharmaceutical) Paradium-tin colloidal catalyst was applied by OPC-SALM and OPC-80 Catalyst M). After washing with water, immersed in an electroless nickel plating bath (Technic Corp .: Techni AT—5000 A: 60 mL / LB: 150 mL / L 80 ° C) for 5 minutes, after film formation, the surface was observed with a metal microscope Innumerable cracks were formed on the Nikkenore surface, and then after 10 minutes of heat treatment at 200 ° C., the nickel film peeled off from the polyimide substrate. Further, the adhesion strength was not measurable.

[0068] (Comparative Example 3: Preparation of nickel thin film on polyimide resin)

5 cm x 1 Ocm polyimide film (UPILEX-25R manufactured by Ube Industries, Ltd.) is immersed in 80 g / L sodium hydroxide solution at 80 ° C for 5 minutes, washed with water, and then a commercially available electroless copper plating pretreatment agent (Okuno) 100mL / L3 aminosilane (Torayda And immersing it at room temperature for 5 minutes to give a palladium-tin colloidal catalyst. After washing with water, immersed in an electroless nickel plating bath at 80 ° C for 5 minutes.After film formation, the surface was observed with a metallurgical microscope, and numerous cracks were formed on the nickel surface, and then at 200 ° C for 10 minutes. As a result of this heat treatment, the nickel film peeled off from the polyimide substrate. Further, the adhesion strength was not measurable.

[0069] (Comparative Example 4: Preparation of nickel thin film on polyimide resin)

A 5cm x 10cm polyimide film (UPILEX-25R made by Ube Industries) is immersed in 80g / L sodium hydroxide solution at 80 ° C for 5 minutes, washed with water, and then added to 0.05g / L stannous chloride solution at room temperature. After immersion for 5 minutes, it was immersed in 0.05 g ZL palladium chloride solution at room temperature for 5 minutes to give a palladium catalyst. After washing with water, a nickel thin film was formed by immersing in an electroless nickel plating bath (Techni AT-500 00 A: 60 mL / LB: 150 L / L 80 ° C) for 5 minutes, and then the surface was observed with a metallurgical microscope. However, innumerable cracks occurred, and when heat treatment was performed at 200 ° C. for 10 minutes, the nickel thin film peeled off from the polyimide base material. Further, the adhesion strength was not measurable.

[0070] (Comparative Example 5: Preparation of nickel thin film on polyimide resin)

A 5cm x 10cm polyimide film (UPILEX 25R manufactured by Ube Industries) is immersed in 80g / L sodium hydroxide solution at 80 ° C for 5 minutes, washed with water, and then a commercially available electroless copper plating pre-treatment agent (Okuno Pharmaceutical Co., Ltd.) 100 mL / L3 aminosilane (Toray Duco Co., Ltd. Z-6050) was added to OPC-80 KYATARISTO M), and immersed for 5 minutes at room temperature to give a palladium-tin colloid catalyst. After washing with water and dipping in an electroless nickel plating bath (Techni AT-5000 A: 60 mL / L, B: 150 mL / L 80 ° C) for 5 minutes, a Nikkenore film could be formed. When the surface was observed with a metallographic microscope, countless cracks occurred on the nickel surface. Thereafter, when heat treatment was performed at 200 ° C. for 10 minutes, the nickel thin film was peeled off from the polyimide base material. The adhesion strength was not measurable due to the infinite number of cracks on the nickel surface.

[0071] [Table 2] For ^^ f ^ j

Alkali: ¾S ¾ Silane force surface! ^ Brin

Salt it radium sodium bromide igjg 5 10 "½I / L 0.85k N / m

5 I0-½1 / L Run 0.5nifll No L Starvation 1 / L

Radium 續 Hysodium Jetyldimeth 讎 6 10 "½I / L 0.60k N / m Row 2 5 10-¾iol / L 2X10- ½I / L Xisilane Job ImolA

0./L

¾ ΐ Radium Shelf cocoon sodium Jetyl dimet fiber 5X10 " ² ffiol / L uniform? 0.75k N / m

2X10-¾I / L Xisilane mi Imol / L

0.5mol / L

Radium sodium acetal tetraethea t 5 10 "½I / L 0.8 & k / m nasi row 4

3X10-½ol L 2X10-½I / L Silane 0 Glyco- I mol / L

Palladium Shelf-sodium sodium ketoxymono fiber 3X10- ½) I / L 0.8kN / m ½) Ι / Ι_ 1X10-½I / L Methoxysilane Glyco ¾0 8

0.3mol / L

5¾¾palladium Magic sodium Di-treated tilde separation 6XlG-½ol / L Uniform ¾ ^ 0,65k N / m Difficult J 6 SXIO-WI L 2X10- ^e mol / L

0. ½ol / L

«I ^ Tan shelf sodium sodium tetraethoxy tgjg 7X10-½I / L 0.fi5k Nl / m

¾WJ7

3X10 "¾ol 1 10-¾ Silane 几 E0TA-2Na 3X1fl-¾iQl / L

Tungstic acid paste sodium monomonoxide 鹏 7X10 L 0, 70k / m actual fiber 8 sodium 1X10-½I / L methoxysilane maleic acid IX 10 "'

3 I0-½I / L D.45mol / L raol / L

Cobalt chloride 纖匕 Sodium Jetyl dimeth iM 7XI0-½ol / L 0.65kN / m 4XI0-½ol / L 2X10 "½I / L Xylsilane IX Maleic acid 1mol L

10- 'mo 几

i 复 radium lake sodium 卜 rie xyxi iS &exiC-'niol / L uniform 0.60kN / m 5X10—¾I / L 2XI0- ^? mol / L run O.Sniol octamaleic acid tmol / L

¾ »Π 0

Shiohikono

5XlO ^ ½ol / L

mm 雕 Sodium Jetyldimeth 鹏 6X10- ^! mol / L 0.65k N / m

1 5XlO- ³ mol / L 2XI0- L Xysilane Male i ™ l / L

0.5molA

Cobalt chloride Sodium bromide Tetramethoxy 0.70 k N / m

¾56 ^ Π 2 1X10—WL 2XI0½I / L Silane O.Sirol 几 Maleic acid〗 ol / L] Measurement result Treatment agent

Surface η observation Peel strength Comparative example 1 S-free plating process using commercially available palladium-tin colloids Innumerable elephant cracks 0.1 k N / m Comparative example 2 Commercially available «Unwrapping pre-treatment agent Countless cracks; Impossible Comparative Example 3 Commercially available s »Pre-treatment agent for countless cracks; ¾ Not determined Comparable example 4 0.05 s / L fermented * Sousse ¾ solution at room temperature for 5 min, 0.05 s count & crack iJU Indefinite

/ L in palladium halide solution at room temperature for 5 minutes M «»

Specific example 5 Commercially available No B-Bopping pretreatment agent Countless cracks iH indeterminate Tables 2 and 3 are tables showing the observation results and measurement results of the films obtained from the above Examples:! -12 and Comparative Examples 1-5. As can be seen from Tables 2 and 3, the film obtained with the electroless plating catalyst of this example has sufficient peel strength and surface properties, and is superior to the electroless plating catalyst of this example. Sex was confirmed.

Claims

The scope of the claims

[1] a metal compound;

An alkali metal hydroxide,

Water-soluble † raw silane pulling agent,

At least one of an inorganic acid and an organic acid;

The catalyst agent for electroless plating characterized by comprising the mixture of these.

[2] The metal compound is

2. The electroless plating catalyst according to claim 1, which is a compound of a metal selected from the group consisting of palladium, cobalt, tungsten, titanium, silver, gold, and platinum.

[3] The alkali metal hydroxide is

2. The electroless plating catalyst according to claim 1, wherein the catalyst is an alkali metal hydroxide selected from the group consisting of sodium hydroxide and potassium hydroxide.

[4] The water-soluble silane power coupling agent is:

2. The electroless plating according to claim 1, comprising a group selected from the group consisting of a bur group, an epoxy group, an amino group, a methacryloxy group, a mercapto group, a methoxy group, and an ethoxy group. Catalyst agent.

[5] The inorganic acid is

2. The electroless plating catalyst according to claim 1, wherein the catalyst is an inorganic acid selected from the group consisting of hydrochloric acid, sulfuric acid, nitric acid, and carbonic acid.

[6] The organic acid is

2. The electroless plating catalyst according to claim 1, wherein the catalyst is an organic acid selected from the group consisting of carboxylic acid, hydroxycarboxylic acid, and amino acid.