JPWO2014002722A1 - 蛍光体、発光装置及び照明装置 - Google Patents

蛍光体、発光装置及び照明装置 Download PDF

Info

Publication number
JPWO2014002722A1
JPWO2014002722A1 JP2014522511A JP2014522511A JPWO2014002722A1 JP WO2014002722 A1 JPWO2014002722 A1 JP WO2014002722A1 JP 2014522511 A JP2014522511 A JP 2014522511A JP 2014522511 A JP2014522511 A JP 2014522511A JP WO2014002722 A1 JPWO2014002722 A1 JP WO2014002722A1
Authority
JP
Japan
Prior art keywords
phosphor
light emitting
light
emitting device
nitrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014522511A
Other languages
English (en)
Japanese (ja)
Inventor
慶太 小林
慶太 小林
康人 伏井
康人 伏井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2014002722A1 publication Critical patent/JPWO2014002722A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883Arsenides; Nitrides; Phosphides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/77746Aluminium Nitrides or Aluminium Oxynitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
JP2014522511A 2012-06-26 2013-06-06 蛍光体、発光装置及び照明装置 Pending JPWO2014002722A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012143546 2012-06-26
JP2012143546 2012-06-26
PCT/JP2013/065660 WO2014002722A1 (ja) 2012-06-26 2013-06-06 蛍光体、発光装置及び照明装置

Publications (1)

Publication Number Publication Date
JPWO2014002722A1 true JPWO2014002722A1 (ja) 2016-05-30

Family

ID=49782888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014522511A Pending JPWO2014002722A1 (ja) 2012-06-26 2013-06-06 蛍光体、発光装置及び照明装置

Country Status (3)

Country Link
JP (1) JPWO2014002722A1 (zh)
TW (1) TW201408757A (zh)
WO (1) WO2014002722A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10475168B2 (en) * 2014-09-15 2019-11-12 Carl Zeiss Microscopy Gmbh Method for generating a result image and optical device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4991026B2 (ja) * 2003-02-26 2012-08-01 日亜化学工業株式会社 発光装置
EP1859006A1 (en) * 2005-03-08 2007-11-28 Philips Intellectual Property & Standards GmbH Illumination system comprising a radiation source and a luminescent material
JP5669855B2 (ja) * 2010-10-05 2015-02-18 株式会社ネモト・ルミマテリアル 緑色系発光蛍光体および発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10475168B2 (en) * 2014-09-15 2019-11-12 Carl Zeiss Microscopy Gmbh Method for generating a result image and optical device

Also Published As

Publication number Publication date
TW201408757A (zh) 2014-03-01
WO2014002722A1 (ja) 2014-01-03

Similar Documents

Publication Publication Date Title
JP5485218B2 (ja) 発光装置及び画像表示装置
JP5092667B2 (ja) 発光装置
US10927298B2 (en) Nitride fluorescent material, method for producing the same, and light emitting device
JP2011140664A5 (zh)
JP6138914B2 (ja) ケイ酸塩の蛍光物質
JP5791034B2 (ja) 発光装置
KR101789856B1 (ko) 청색 발광 형광체 및 그 청색 발광 형광체를 사용한 발광 장치
US8440104B2 (en) Kimzeyite garnet phosphors
JP6223988B2 (ja) 蛍光体、発光装置及び照明装置
JP2018109080A (ja) 緑色蛍光体、発光素子及び発光装置
CN116018388B (zh) 铕活化β型塞隆荧光体和发光装置
WO2014002722A1 (ja) 蛍光体、発光装置及び照明装置
JP5471021B2 (ja) 蛍光体及び蛍光体の製造方法、並びに、蛍光体含有組成物、発光装置、照明装置及び画像表示装置
JP6028858B2 (ja) 酸窒化物蛍光体粉末
JP2017222834A (ja) アルミン酸塩蛍光体、発光装置及びアルミン酸塩蛍光体の製造方法
WO2014002723A1 (ja) 蛍光体、発光装置及び照明装置
JP6747497B2 (ja) 酸窒化物蛍光体、発光装置及び酸窒化物蛍光体の製造方法
JP7010476B2 (ja) 波長変換部材、発光装置、および波長変換部材の製造方法
JP6357107B2 (ja) 蛍光体、発光装置及び照明装置
JP2016060844A (ja) 蛍光体、発光装置、および蛍光体の製造方法
KR20170096742A (ko) 적색 산 질화물 형광체 및 이를 이용한 발광 소자 패키지
JP2018109077A (ja) 緑色蛍光体、発光素子及び発光装置