JPWO2013145800A1 - Mask transport apparatus, mask holding apparatus, mask substrate, substrate processing apparatus, and device manufacturing method - Google Patents

Abstract

The mask transfer device sucks the mask substrate and carries the mask substrate into the cylindrical holding surface of the mask holding device, and the suction device and the mask holding device relative to each other in the circumferential direction of the holding surface. The moving device to be moved, and when the mask substrate is transferred from the suction device to the holding surface of the mask holding device as the moving device moves, the suction state of the mask substrate by the suction device according to the relative movement position in the circumferential direction of the holding surface And a control device for changing.

Description

The present invention relates to a mask transfer device, a mask holding device, a mask substrate, a substrate processing apparatus, and a device manufacturing method.
This application claims priority based on Japanese Patent Application No. 2012-071056 for which it applied on March 27, 2012, and uses the content here.

  A substrate processing apparatus such as an exposure apparatus is used for manufacturing various devices as described in Patent Document 1 below, for example. As one of the methods for manufacturing a device, for example, a roll-to-roll system as described in Patent Document 2 below is known. The roll-to-roll system is a system in which various processes are performed on a substrate on a transport path while a substrate such as a film is transported from a delivery roll to a collection roll.

Japanese Unexamined Patent Publication No. 2007-299918 International Publication No. 2008/129819

  The substrate processing apparatus as described above is desired to efficiently process a substrate. The substrate processing apparatus can improve the efficiency by processing the substrate while rotating the roll-shaped mask substrate, for example. Therefore, the substrate processing apparatus is expected to devise a technique for mounting the mask substrate on the substrate processing apparatus by bending the mask substrate.

  An aspect of the present invention is to provide a mask transfer device, a mask holding device, a mask substrate, a substrate processing apparatus, and a device manufacturing method that can efficiently process a substrate.

  According to the first aspect of the present invention, there is provided a mask transfer device for carrying the mask substrate into a mask holding device having a holding portion for holding the pattern surface of the mask substrate in a cylindrical shape, A suction device that sucks the substrate, a moving device that relatively moves the suction device and the holding portion of the mask holding device with respect to a circumferential direction of the cylindrical surface, and the mask substrate that moves along with the movement by the moving device. A mask transporter, comprising: a controller that changes the suction state of the mask substrate by the suction device in accordance with a relative movement position in the circumferential direction of the cylindrical surface when delivering from the suction device to the holding portion of the mask holding device. An apparatus is provided.

  According to the second aspect of the present invention, a mask holding device that holds a mask substrate that can be curved along a cylindrical surface and includes a magnetic body, the mask carrying device carrying in the mask substrate. A movable member having a cylindrical surface on which the mask substrate is disposed and rotatable about a central axis of the cylindrical surface, a magnetic force generator for generating a magnetic force on the cylindrical surface, and the mask transport device There is provided a mask holding device comprising: a control device that controls the magnetic force generation device to control the distribution of the magnetic force on the cylindrical surface according to the relative position between the mask substrate and the cylindrical surface.

  According to the third aspect of the present invention, there is provided a mask holding device for holding a mask substrate that can be curved along a cylindrical surface and is made of a dielectric base material. A movable member that has a cylindrical surface on which the mask substrate is disposed by a mask transporting device that is rotatable about a central axis of the cylindrical surface, and for electrostatic attraction disposed at a plurality of locations in the circumferential direction of the cylindrical surface The cylindrical surface by controlling the voltage applying device in accordance with a relative position between a voltage applying device that applies a voltage to the electrode member of the electrode member and a cylindrical surface of the movable member and the mask substrate carried by the mask transfer device. And a control device that controls the distribution of electrostatic attraction in the mask.

  According to the fourth aspect of the present invention, a mask including a base material that can be curved along a cylindrical surface, a pattern formed on the base material, and a magnetic body provided on the base material. A substrate is provided.

  According to a fifth aspect of the present invention, there is provided a substrate processing apparatus comprising: a mask holding device that holds a pattern surface of a bendable mask substrate in a cylindrical shape; and the mask transfer device according to the first aspect. .

  According to the sixth aspect of the present invention, the substrate processing apparatus according to the fifth aspect exposes the pattern of the mask substrate to the substrate on which the photosensitive layer is formed, and the photosensitive layer of the exposed substrate. And performing subsequent processing using the change in the device.

  ADVANTAGE OF THE INVENTION According to the aspect of this invention, the mask conveyance apparatus which can process a board | substrate efficiently, a mask holding | maintenance apparatus, a mask substrate, a substrate processing apparatus, and a device manufacturing method can be provided.

It is a figure which shows the structure of the device manufacturing system by 1st Embodiment. It is a figure which shows the structure of the substrate processing apparatus (exposure apparatus) by 1st Embodiment. It is a figure which shows the structure of the mask by 1st Embodiment. It is a figure which shows the structure of the mask by 1st Embodiment. It is a figure which shows the structure of the mask holding | maintenance apparatus by 1st Embodiment. It is a figure which shows the external appearance of the holding part of the mask holding apparatus by 1st Embodiment. It is a side view which shows the structure of the mask conveying apparatus by 1st Embodiment. It is a top view which shows the structure of the mask conveying apparatus by 1st Embodiment. It is a figure which shows the structure of the arm member of the mask conveying apparatus by 1st Embodiment. It is a figure which shows the structure of the arm member of the mask conveying apparatus by 1st Embodiment. It is a figure which shows the structure of the arm member of the mask conveying apparatus by 1st Embodiment. It is a side view which shows operation | movement of the mask conveying apparatus by 1st Embodiment. It is a top view which shows operation | movement of the mask conveying apparatus by 1st Embodiment. It is a figure which shows the attachment method of the mask by 1st Embodiment. It is a figure which shows the structure of the mask holding | maintenance apparatus by 2nd Embodiment. It is a figure which shows the structure of the mask holding | maintenance apparatus by 2nd Embodiment. It is a figure which shows the external appearance of the holding part of the mask holding apparatus by 3rd Embodiment. It is a figure which shows the external appearance of the holding part of the mask holding apparatus by 3rd Embodiment. It is a figure which shows the circuit structure of the mask holding | maintenance apparatus by 3rd Embodiment. It is a flowchart which shows a device manufacturing method.

  Next, an embodiment will be described. In the embodiment, the same elements are denoted by the same reference numerals, and the description thereof may be simplified or omitted.

[First Embodiment]
FIG. 1 is a diagram showing a configuration of a device manufacturing system SYS (flexible display manufacturing line) of the present embodiment. Here, the flexible substrate P (sheet, film, etc.) pulled out from the supply roll FR1 passes through n processing devices U1, U2, U3, U4, U5,. The example until it winds up to FR2 is shown.

  In FIG. 1, the orthogonal coordinate system XYZ is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long direction) of the substrate P is the Y-axis direction. It shall be set. In the following description, the rotation direction around the X axis direction is defined as the θX direction, and similarly, the rotation directions around the Y axis direction and the Z axis direction are defined as the θY direction and the θZ direction, respectively.

  The substrate P wound around the supply roll FR1 is pulled out by the nipped driving roller DR1 and conveyed to the processing apparatus U1. The center of the substrate P in the Y-axis direction (width direction) is servo-controlled by the edge position controller EPC1 so as to be within a range of about ± 10 μm to several tens μm with respect to the target position.

  The processing device U1 continuously or selects a photosensitive functional liquid (photoresist, photosensitive coupling material, UV curable resin liquid, etc.) on the surface of the substrate P by a printing method with respect to the transport direction (long direction) of the substrate P. It is the coating device which coats automatically. In the processing apparatus U1, a coating mechanism including a pressure drum DR2 around which the substrate P is wound and a coating roller for uniformly coating the photosensitive functional liquid on the surface of the substrate P on the pressure drum DR2. Gp1, a drying mechanism Gp2 for rapidly removing a solvent or moisture contained in the photosensitive functional liquid applied to the substrate P, and the like are provided.

  The processing apparatus U2 heats the substrate P conveyed from the processing apparatus U1 to a predetermined temperature (for example, about several tens of degrees Celsius to 120 degrees Celsius), and stably fixes the photosensitive functional layer applied on the surface. It is a heating device. In the processing device U2, a plurality of rollers and an air turn bar for returning and conveying the substrate P, a heating chamber HA1 for heating the substrate P that has been carried in, and the temperature of the heated substrate P are as follows: A cooling chamber HA2 and a nipped drive roller DR3 are provided for lowering the temperature so as to match the environmental temperature of the post-process (processing device U3).

  The processing apparatus U3 as a substrate processing apparatus is an exposure apparatus that irradiates the photosensitive functional layer of the substrate P conveyed from the processing apparatus U2 with ultraviolet patterning light corresponding to a circuit pattern or a wiring pattern for display. Including. In the processing apparatus U3, an edge position controller EPC2 that controls the center of the substrate P in the Y-axis direction (width direction) to a fixed position, a nipped drive roller DR4, and a substrate P that is transported in the X-axis direction with a predetermined tension. Are provided with a substrate stage ST for supporting the back surface of the substrate by an air bearing layer, and two sets of drive rollers DR6 and DR7 for giving a predetermined slack (play) DL to the substrate P.

  Further, in the processing apparatus U3, a sheet-like mask substrate (hereinafter referred to as a mask M) is wound around the outer peripheral surface, and rotates around a center line parallel to the Y-axis direction. An illumination unit IU that irradiates the wound mask M with slit-shaped exposure illumination light extending in the Y-axis direction, and a mask that is wound around the rotary drum DM on a portion of the substrate P that is supported in a planar shape by the substrate stage ST. Projection optical system PL for projecting an image of a part of the pattern in the substrate, and detecting an alignment mark or the like previously formed on the substrate P in order to relatively align (align) the image of the part of the projected pattern with the substrate P Alignment microscope AM, mask cassette MC that can store a plurality of masks M, and mask M that is used for exposure as mask cassette MC Mask transport apparatus ML for wrapping the outer circumferential surface of the rotary drum DM is taken out is provided.

  Although the detailed configuration and operation of the processing apparatus U3 shown in FIG. 1 will be described later, the processing apparatus U3 attaches a sheet-like mask M to the outer peripheral surface of the rotating drum DM to form a cylindrical mask body. If it is an exposure apparatus, it will not be restricted to a projection system. For example, the processing apparatus U3 is a proximity method in which the cylindrical mask body and the substrate P are brought close to each other with a predetermined gap (within several tens of μm), or a contact method in which the substrate P is wound around the outer periphery of the cylindrical mask body. The exposure apparatus may be used.

  When such a proximity type or contact type exposure apparatus is adopted, an illumination unit is arranged inside the rotating drum DM, and illumination light is irradiated from the inside of the rotating drum DM toward the transmission type mask on the outer peripheral surface. What is necessary is just to comprise so. The configuration in which the illumination unit is arranged inside the rotary drum DM can also be applied to a projection method in which an image of the pattern of the mask M is projected via the projection optical system PL.

  In the present embodiment, the transmission type mask M is wound around the rotary drum DM to form a cylindrical mask body. However, the reflection type mask M may be wound around the rotary drum DM to form a cylindrical mask body. In the reflective mask M, for example, a pattern is formed of a high reflection portion and a low reflection portion. For example, when a reflective mask M is employed, the exposure apparatus illuminates the reflective mask M by epi-illumination and projects light emitted from the mask M onto the substrate P by the projection optical system PL. Also good.

  1 is at least one of various wet processes such as a wet development process and an electroless plating process on the photosensitive functional layer of the substrate P conveyed from the process apparatus U3. It is the wet processing apparatus which performs. In the processing apparatus U4, there are provided three processing tanks BT1, BT2, BT3 layered in the Z-axis direction, a plurality of rollers for bending and transporting the substrate P, a nipped drive roller DR8, and the like. .

  The processing apparatus U5 is a heating and drying apparatus that warms the substrate P conveyed from the processing apparatus U4 and adjusts the moisture content of the substrate P wetted by the wet process to a predetermined value, but the details are omitted. After that, the substrate P that has passed through several processing devices and passed through the last processing device Un of the series of processes is wound up on the collection roll FR2 via the nipped drive roller DR9. Also during the winding, the drive roller DR9 and the recovery roll are driven by the edge position controller EPC3 so that the center of the substrate P in the Y-axis direction (width direction) or the substrate end in the Y-axis direction does not vary in the Y-axis direction. The relative position of the FR2 in the Y-axis direction is successively corrected and controlled.

  The host control device CONT performs overall control of the operation of the processing devices U1 to Un constituting the production line. The host control device CONT monitors the processing status and processing status of each processing device U1 to Un, monitors the transport status of the substrate P between the processing devices, and performs feedback correction and feedforward based on the results of prior and subsequent inspections and measurements. Correction is also performed.

  The board | substrate P used by this embodiment is foil (foil) etc. which consist of metals or alloys, such as a resin film and stainless steel, for example. The material of the resin film is, for example, one of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Or two or more.

  As the substrate P, it is desirable to select a substrate whose thermal expansion coefficient is not remarkably large so that the amount of deformation caused by heat in various processing steps can be substantially ignored. The thermal expansion coefficient may be set smaller than a threshold corresponding to the process temperature or the like, for example, by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. The substrate P may be a single layer of ultrathin glass having a thickness of about 100 μm manufactured by a float process or the like, or a laminate in which the above resin film, foil, or the like is bonded to the ultrathin glass. It may be. In addition, the substrate P may be a substrate whose surface is modified and activated in advance by a predetermined pretreatment, or a substrate having a fine partition structure (uneven structure) for precise patterning.

  The device manufacturing system SYS of the present embodiment repeatedly or continuously executes various processes for manufacturing a device (display panel or the like) on the substrate P. The substrate P that has been subjected to various types of processing is divided (diced) for each device to form a plurality of devices. As for the dimension of the substrate P, for example, the dimension in the width direction (short Y-axis direction) is about 10 cm to 2 m, and the dimension in the length direction (long X-axis direction) is 10 m or more. The dimension in the width direction (short Y-axis direction) of the substrate P may be 10 cm or less, or 2 m or more. The dimension in the length direction (long X-axis direction) of the substrate P may be 10 m or less.

  Next, the configuration of the processing device U3 will be described in more detail. FIG. 2 is a view showing the arrangement of the processing apparatus U3 (exposure apparatus EX) according to this embodiment.

  The processing apparatus U3 shown in FIG. 2 includes a substrate transfer apparatus PT that transfers a substrate, an exposure apparatus EX, a mask cassette MC that stores a mask M, and a mask transfer apparatus ML. The mask transport device ML carries the mask M stored in the mask cassette MC into the exposure device EX. The exposure apparatus EX holds the mask M carried in by the mask transport apparatus ML, and projects an image of a part of the pattern formed on the mask M onto the substrate P.

  Here, prior to description of each unit of the processing apparatus U3, the configuration of the mask M will be described with reference to FIGS. 3A and 3B. 3A is a plan view of the mask M according to the present embodiment, and FIG. 3B is a cross-sectional view orthogonal to the feeding direction of the mask M.

  The mask M shown in FIG. 3A is created as a transmissive planar sheet mask, for example, and is generally rectangular in a state of being developed in a planar shape. 3A and 3B, the Xa axis direction corresponds to a direction parallel to one side (for example, a long side) of the mask M, and the Ya axis direction is parallel to the other side (for example, a short side) of the mask M. Direction and the Za-axis direction correspond to the thickness direction of the mask M, respectively.

  The mask M is flexible enough to be curved along the cylindrical surface. The mask M is wound around a cylindrical surface (rotary drum DM, see FIG. 5) around an axis parallel to the Ya-axis direction and is curved so that the side extending in the Xa-axis direction is along the circumferential direction of the cylindrical surface. And is subjected to an exposure process. The cylindrical surface is a curved surface obtained by rotating a line segment (bus line) around an axis parallel to the line segment, and is, for example, an outer peripheral surface of a cylinder or a cylinder.

  As shown in FIG. 3A, the mask M includes a base material M1, a pattern M2 formed on the base material M1, a magnetic body M3 formed on the base material M1, and an alignment mark M4. The mask M is held by various devices having a magnetic force generation source by attracting the magnetic body M3 by the magnetic force. The alignment mark M4 is used for alignment with various devices that hold the mask M.

  The base material M1 is made of a material that transmits light (exposure light) projected onto the substrate P, such as a dielectric such as glass. The base material M1 is, for example, a strip-shaped ultrathin glass plate with a good flatness (for example, a thickness of 100 to 500 μm).

  As shown in FIG. 3B, the pattern M2 is formed of a light shielding layer of chromium or the like in a region (pattern formation region MA1) separated from the outer periphery of the substrate M1 on the first surface M1a of the substrate M1. In the base material M1, the pattern non-formation area MA2 where the pattern M2 is not formed is arranged so as to surround the pattern formation area MA1 in a frame shape (annular shape).

  The magnetic body M3 is disposed in the pattern non-formation region MA2 on the first surface M1a (the same surface as the pattern M2) of the substrate M1. The magnetic body M3 has a strip shape extending in the direction corresponding to the circumferential direction of the cylindrical surface on which the mask M is arranged (the Xa axis direction on the base material M1, the feeding direction of the mask M), and corresponds to the axial direction of the cylindrical surface. It arrange | positions at the both ends of a direction (Ya-axis direction on the base material M1). The magnetic body M3 is formed, for example, by depositing a ferromagnetic material such as iron, nickel, or cobalt on the base material M1 by a vapor deposition method or the like. The alignment mark M4 may be formed of the same material as the magnetic body M3 together with the magnetic body M3 when the magnetic body M3 is formed by a mask vapor deposition method or the like.

  The mask M is provided with a magnet generation source on the first surface M1a side, whereby the magnetic body M3 is attracted toward the magnetic force generation source, and the first surface M1a side is held in contact with the magnetic force generation source side. In this case, a magnetic force can be applied to the magnetic body M3 without passing through the base material M1, and a decrease in the attractive force is suppressed.

  The mask M has a magnetic force generation source disposed on the second surface M1b opposite to the first surface M1a, whereby the magnetic body M3 is attracted toward the magnetic force generation source through the base M1, and the second The surface M1b side is held in contact with the magnetic force generation source side. In this case, since the second surface M1b side opposite to the pattern M2 is in contact with the magnetic force generation source side, contact between the pattern M2 and the magnetic force generation source side is suppressed.

  The magnetic body M3 may be formed on the second surface M1b of the base material M1, or may be formed on both the first surface M1a and the second surface M1b. When the magnetic body M3 is formed on the second surface M1b, if the mask M is attracted on the second surface M1b side, a decrease in the attraction force is suppressed, and contact between the pattern M2 and the magnetic force generation source side is suppressed. The

  Further, when the magnetic body M3 is formed on the same surface as the pattern M2, the magnetic body M3 may protrude from the pattern M2 in the thickness direction (Za axis direction) of the base material M1, and in this case, the pattern M2 is another The contact with the member is suppressed. The mask M may include a pellicle formed so as to cover the pattern M2 with a gap between the pattern M2 and in this case, contact between the pattern M2 and another member is suppressed. The

  Further, the mask M may be formed with all or part of a panel pattern corresponding to one display device, or may be formed with a panel pattern corresponding to a plurality of display devices. For example, the mask M may include a plurality of patterns that are repeatedly arranged in the Ya-axis direction, or may include a plurality of patterns that are repeatedly arranged in the Xa-axis direction. The mask M may include a panel pattern for the first display device and a panel pattern for a second display device that is different in size and the like from the first display device.

  Returning to the description of FIG. 2, the substrate transport device PT includes a roller 10 that supports the substrate P, a first drive unit 11 that drives the roller 10, a first detection unit 12 that outputs position information of the substrate P, and a control. Device 13. The substrate stage ST shown in FIG. 1 is disposed between the rollers 10, for example.

  The substrate transport apparatus PT transports (moves) the substrate P on the substrate stage ST when the first driving unit 11 rotationally drives the roller 10 supporting the substrate P. The substrate stage ST may be a part of the substrate transport apparatus PT or a part of the exposure apparatus EX, for example.

  For example, the first detection unit 12 optically or magnetically reads a reference mark formed on the substrate P to detect the position of the substrate P and outputs position information of the substrate P to the control device 13. The position information of the substrate P includes at least one of information indicating the position of the substrate P, information indicating the speed (transport speed) of the substrate P, and information indicating the acceleration of the substrate P. The first detection unit 12 may detect the position of the substrate P by detecting the rotational position of the roller 10.

  The control device 13 controls the first drive unit 11 based on the position information output from the first detection unit 12 and manages at least one of the position of the substrate P, the conveyance speed, and the conveyance acceleration. For example, the control device 13 controls each part of the substrate transport device PT in accordance with a control command to the host control device CONT.

  The exposure apparatus EX includes a mask holding device 20 that holds a mask M, an illumination unit IU, a projection optical system PL, and a control device 21. The exposure apparatus EX is a so-called scanning exposure apparatus, and moves the substrate P while moving (rotating) the mask M held by the mask holding apparatus 20 in synchronization with the substrate P being transferred by the substrate transfer apparatus PT. Exposure.

  The mask holding device 20 includes a rotary drum DM on which the mask M is disposed and holds the mask M, a second drive unit 23 that rotationally drives the rotary drum DM, and outputs position information of the rotary drum DM. A second detector 24. The control device 21 of the exposure apparatus EX also serves as the control device of the mask holding device 20 and controls each part of the mask holding device 20. The control device of the mask holding device 20 may be provided separately from the control device 21 of the exposure apparatus EX.

  The second detection unit 24 includes, for example, a rotary encoder and optically detects the position of the rotary drum DM. The second detection unit 24 outputs position information of the rotary drum DM to the control device 21 based on the detection result. The position information of the rotating drum DM includes at least one of information indicating the position of the rotating drum DM, information indicating the speed (angular velocity) of the rotating drum DM, and information indicating the acceleration (angular acceleration) of the rotating drum DM.

  The second drive unit 23 includes an actuator such as an electric motor, for example, and is rotated by the control device 21 to rotate the rotary drum DM. The control device 21 controls the second drive unit 23 based on the position information output from the second detection unit 24, and manages at least one of the position, speed, and acceleration of the rotating drum DM. For example, the control device 21 controls the second drive unit 23 in accordance with a control command from the host control device CONT, so that the mask M disposed on the rotary drum DM and the substrate P transported to the substrate transport device PT are obtained. Synchronized movement (synchronous rotation). Further, the second drive unit 23 can move the rotary drum DM in each of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction. The second drive unit 23 can finely adjust the position of the rotating drum DM, for example, in alignment when a mask is attached to the rotating drum DM, alignment of the rotating drum DM and the substrate stage ST, and the like.

  The illumination unit IU includes a light source 25 and an illumination optical system IL. The light source includes a lamp light source such as a mercury lamp, or a solid light source such as a laser diode or a light emitting diode (LED). Illumination light emitted from the light source is, for example, far ultraviolet light (DUV light) such as bright line (g line, h line, i line) KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (wavelength 193 nm), or the like. . The illumination optical system is configured by any one of a refractive system, a catadioptric system, and a reflective system. The illumination optical system IL includes a homogenization optical system that uniformizes the illuminance distribution of the illumination light emitted from the light source, and uniformly brightens a part of the mask M (illumination region IR) held by the mask holding device 20. Now illuminate. The homogenizing optical system includes, for example, a fly-eye lens array or a rod lens.

  The projection optical system PL projects a partial image of the mask M illuminated by the illumination unit IU onto the substrate P being transported by the substrate transport device PT. The projection optical system is constituted by any one of a refractive system, a catadioptric system, and a reflective system. In the exposure apparatus EX, the part on the mask M arranged in the illumination area IR changes as the mask M moves, and the part on the substrate P arranged in the projection area PA changes as the substrate P moves. By doing so, an image of a predetermined pattern (mask pattern) on the mask M is projected (scanning exposure) onto the substrate P.

  The control device 21 includes, for example, a computer system. The computer system includes, for example, a CPU, various memories, an OS, and hardware such as peripheral devices. The operation process of each unit of the processing apparatus is stored in a computer-readable recording medium in the form of a program, and various processes are performed by the computer system reading and executing the program. When the computer system can be connected to the Internet or an intranet system, it also includes a homepage providing environment (or display environment). The computer-readable recording medium includes a portable medium such as a flexible disk, a magneto-optical disk, a ROM, and a CD-ROM, and a storage device such as a hard disk built in the computer system. A computer-readable recording medium is one that dynamically holds a program for a short time, such as a communication line when transmitting a program via a network such as the Internet or a communication line such as a telephone line. Some of them hold programs for a certain period of time, such as volatile memory inside computer systems that serve as servers and clients. Further, the program may be a program for realizing a part of the function of the processing device U3, or may be a program capable of realizing the function of the processing device U3 in combination with a program already recorded in the computer system.

  The control device 21 may be a part or all of the host control device CONT of the device manufacturing system SYS illustrated in FIG. Further, the control device 21 of the exposure apparatus EX may also serve as a control device for apparatuses other than the exposure apparatus EX in the device manufacturing system SYS. For example, the control device 21 may control the substrate transport device PT. At least one of the various control devices (for example, the host control device CONT) included in the device manufacturing system SYS can be realized by using a computer system, like the control device 21.

  Note that the exposure apparatus EX shown in FIG. 2 projects a pattern image on a planar projection region on the substrate P in a state where the substrate P is substantially planar. However, for example, the exposure apparatus EX may project a pattern image onto a cylindrical projection area on the substrate P in a state where the substrate P is curved in a cylindrical plane on the roller of the substrate transport apparatus PT. Good. Further, the substrate transport device PT only needs to be able to transport the substrate P along the projection area PA of the projection optical system PL, and the configuration thereof can be changed as appropriate. Further, at least a part of the substrate transport apparatus PT may be a part of the exposure apparatus EX.

  Next, the mask holding device 20 will be described in detail with reference to FIGS. 4 and 5. FIG. 4 is a diagram illustrating the configuration of the mask holding device 20, and FIG. 5 is a diagram illustrating the appearance of the rotating drum DM of the mask holding device 20.

  The mask holding device 20 shown in FIG. 4 holds the mask M by attracting the magnetic body M3 (see FIGS. 3A and 3B) of the mask M to the holding portion 22 by magnetic force. The holding unit 22 includes a rotary drum DM having an outer peripheral surface 26 on which the mask M is disposed, and a magnetic force generator 27 that generates a magnetic force on the outer peripheral surface 26.

  The rotating drum DM is a movable member that is supported so as to be rotatable about a central axis 28 (rotating axis) thereof. The rotating drum DM has a cylindrical shape having a certain thickness, and its outer peripheral surface 26 has a cylindrical surface shape. As shown in FIG. 5, the rotating drum DM includes an end portion 30 including an end in the Y-axis direction parallel to the central axis 28, and a central portion 31 excluding the end portion 30. The mask M (see FIGS. 3A and 3B) is disposed on the rotating drum DM so that the pattern M2 overlaps the central portion 31 of the rotating drum DM and does not overlap the end portion 30. The rotating drum DM is made of, for example, glass or quartz, and the central portion 31 that overlaps the pattern of the mask M as viewed from the radial direction of the rotating drum DM is translucent to illumination light. In the rotary drum DM, the end portion 30 and the central portion 31 are integrally formed of the same material.

  The magnetic force generator 27 includes an electromagnet 32, a drive circuit 33, and a power storage unit (hereinafter referred to as a battery 34). The battery 34 supplies power to the electromagnet 32 via the drive circuit 33, and the electromagnet 32 generates a magnetic force according to the supplied power. The control device 21 of the exposure apparatus EX controls one or both of the presence / absence of magnetic force generated by the electromagnet 32 and the strength of the magnetic force generated by the electromagnet 32 by controlling the drive circuit 33.

  The electromagnet 32 is disposed in the vicinity of the surface of the outer peripheral surface 26 so that the magnetic force generated by the electromagnet 32 acts on the surface of the outer peripheral surface 26 of the rotary drum DM. As shown in FIG. 5, the electromagnet 32 is disposed at each end 30 in the Y-axis direction of the rotary drum DM. The mask M (see FIGS. 3A and 3B) is positioned by the magnetic body M3 so as to overlap the electromagnet 32 when viewed from the radial direction of the rotary drum DM, and is held by the holding unit 22. The holding unit 22 includes a plurality of electromagnets 32, and the plurality of electromagnets 32 are discretely arranged in the circumferential direction of the rotary drum DM. For example, the electromagnet 32 is fixed inside a hole formed in the rotary drum DM, and moves (rotates) along with the rotary drum DM.

  The hole in which the electromagnet 32 is arranged in the rotary drum DM may be formed from the inner peripheral surface 35 (see FIG. 5) of the rotary drum DM toward the outer peripheral surface 26, or from the outer peripheral surface 26 to the inner peripheral surface. It may be formed toward the surface 35, or may be formed from the end surface 36 side (see FIG. 5) in a direction parallel to the central axis 28. Moreover, the hole part in which the electromagnet 32 is arrange | positioned in the rotating drum DM may be filled with fillers, such as resin. Further, the electromagnet 32 may be fixed to the outer peripheral surface 26 or the inner peripheral surface 35 of the rotary drum DM.

  The drive circuit 33 is electrically connected to each of the plurality of electromagnets 32 and electrically connected to the battery 34. The drive circuit 33 and the battery 34 are attached to, for example, the inner peripheral surface 35 at the end 30 of the rotary drum DM shown in FIG. For example, the electromagnet 32, the drive circuit 33, and the battery 34 are arranged in consideration of the weight balance so that the center of gravity of the rotary drum DM to which the electromagnet 32 is attached is located on the central axis 28. The drive circuit 33 can receive power from the battery 34 and supply power to each of the electromagnets 32 independently.

  The control device 21 of the exposure apparatus EX controls the drive circuit 33 by supplying a control signal (control command) to the drive circuit 33 in a wired or wireless manner. The control device 21 controls the drive circuit 33 to control whether or not to supply power to each of the plurality of electromagnets 32 and one or both of the supplied power amounts. That is, the control device 21 controls the strength of the magnetic force generated from each of the plurality of electromagnets 32 (including the case where the magnetic force is 0).

  In addition, the 1 or 2 or more element arrange | positioned inside the rotating drum DM may be fixed with respect to the exterior of the rotating drum DM. For example, when at least a part of the optical system (illumination optical system IL, projection optical system PL) of the exposure apparatus EX is arranged, the optical members and the like arranged inside the rotary drum DM are located outside the rotary drum DM. And may be fixed. Further, one or both of the drive circuit 33 and the battery 34 of the magnetic force generator 27 may be fixed to the outside of the rotating drum DM. In this case, the electrical connection with the electromagnet 32 or the like may be a connection through a contact such as a brush or the like, for example, by non-contact power transmission (contactless power transfer) using electromagnetic mutual induction action. It may be a connection.

  Next, the mask transport device ML and the mask cassette MC shown in FIG. 2 will be described. FIG. 6 is a side view showing the configuration of the mask transport device ML and the mask cassette MC according to the present embodiment. FIG. 7 is a top view showing the configuration of the mask transport device ML and the mask cassette MC according to the present embodiment.

  The mask cassette MC is a mask storage device that stores a plurality of masks M. The mask cassette MC includes, for example, a suction unit that sucks the mask M, and holds the mask M by the suction force of the suction unit. The suction part of the mask cassette MC sucks the pattern non-formation region MA2 of the mask M shown in FIG. 3B by at least one suction force of pressure, magnetic force, and electrostatic force. The mask cassette MC may hold the pattern non-formation area MA2 of the mask M.

  For example, the suction portions of the mask cassette MC are arranged discretely or continuously in the horizontal direction (X-axis direction). In such a mask cassette MC (see FIG. 6), for example, the planar mask M is parallel to the vertical direction (Z-axis direction), and the magnetic body M3 of the mask M is parallel to the horizontal direction (mask). The mask M is held such that the extending direction of the M magnetic body M3 is the X-axis direction).

  The mask cassette MC (see FIG. 7) holds the mask M so that the pattern M2 of the mask M does not come into contact with other masks M, the mask cassette MC, and the like. Here, the mask cassette MC (see FIG. 7) holds the mask M so that the plurality of masks M are arranged apart in the horizontal direction (Y-axis direction). The mask cassette MC may hold a plurality of masks M apart in the vertical direction.

  The mask cassette MC has an opening MC1 in the direction (X-axis direction) in which the magnetic body M3 extends while the mask M is held. The mask cassette MC can carry the mask M into the inside from the outside of the mask cassette MC through the opening MC1, and can carry the mask M out from the inside through the opening MC1.

  When the mask M is unloaded from the mask cassette MC, the host controller CONT shown in FIG. 2 controls the suction force of the mask cassette MC and releases the unloaded mask M. Further, when the mask M is carried into the mask cassette MC, the host controller CONT controls the suction force of the mask cassette MC and holds the carried mask M.

  The mask cassette MC only needs to store the mask M, and the configuration thereof is changed as appropriate. The mask cassette MC may be an apparatus outside the processing apparatus U3, may be a housing case that does not include electrical components, or may be omitted.

  As shown in FIG. 6, the mask transport device ML includes a suction device 41 having an arm member 40 that sucks the mask M, a moving device 42 that relatively moves the arm member 40 and the holding unit 22 of the mask holding device 20, and A control device 43 is provided. The arm member 40 of the suction device 41 has a flat suction surface 44 (see FIG. 7), and holds the mask M so that the mask M is planar along the suction surface 44. The control device 43 controls the suction force of the arm member 40 by controlling the suction device 41 while controlling the position of the arm member 40 by controlling the moving device 42.

  The mask transport device ML can suck, hold, and release the mask M at a desired position by the control device 43 controlling the suction device 41 and the moving device 42. For example, the mask transport device ML sucks the mask M stored in the mask cassette MC, transports the mask M to the position of the rotating drum DM of the mask holding device 20 while holding the mask M, and then masks the mask M. Carry in 20. The mask transport device ML sucks the mask M held by the mask holding device 20 and carries the mask M out of the mask holding device 20. Thus, the mask transfer device ML serves as both a mask carry-in device and a mask carry-out device.

  The mask transport device ML carries the mask M sucked by the suction device 41 into the mask holding device 20 while moving it in a direction corresponding to the circumferential direction of the rotary drum DM. The “direction corresponding to the circumferential direction of the rotating drum DM” is, for example, a direction parallel to one of the tangential planes with respect to the outer circumferential surface 26 of the rotating drum DM and orthogonal to the central axis 28 of the rotating drum DM. “One of the predetermined tangent planes” is selected from tangent planes for the respective positions of the outer peripheral surface 26 of the rotary drum DM, and here, a horizontal plane (plane parallel to the XY plane) orthogonal to the vertical direction (Z-axis direction). ). That is, assuming that the central axis 28 of the rotating drum DM is parallel to the Y-axis direction and the predetermined tangent plane is a plane parallel to the XY plane, the direction corresponding to the circumferential direction of the rotating drum DM is X Axial direction.

  The moving device 42 includes a bending / extending mechanism 50, a Y moving mechanism 51, a Z moving mechanism 52, and a θX moving mechanism 53. The arm member 40 of the suction device 41 is supported by the bending / stretching mechanism 50 via the θX moving mechanism 53. The bending / stretching mechanism 50 is supported by the Y moving mechanism 51 via the Z moving mechanism 52.

  The Y moving mechanism 51 moves the portion from the Z moving mechanism 52 to the arm member 40 in the Y-axis direction. The Z moving mechanism 52 moves a portion from the bending / extending mechanism 50 to the arm member 40 in the Z-axis direction. The bending / stretching mechanism 50 moves the θX moving mechanism 53 and the arm member 40 in a direction parallel to the XY plane, and rotates the θX moving mechanism 53 and the arm member 40 around an axis (θZ direction) intersecting the XY plane. The θX moving mechanism 53 rotates the arm member 40 around an axis parallel to the XY plane. The control device 43 controls each mechanism of the moving device 42, whereby each position of the arm member 40 in the X-axis direction, the Y-axis direction, and the Z-axis direction, and the rotation position (yaw) of the arm member 40 in the θZ direction are determined. The tilt (tilt) of the arm member 40 with respect to the XY plane is controlled.

  Next, each part of the moving device 42 will be described in detail. The bending / stretching mechanism 50 shown in FIG. 7 bends and stretches in a direction substantially parallel to the tangential plane (XY plane) with respect to the outer peripheral surface 26 of the rotating drum DM. One end of the bending / extending mechanism 50 is connected to the θX moving mechanism 53 (arm member 40), and the other end of the bending / extending mechanism 50 is connected to the Z moving mechanism 52. The bending / stretching mechanism 50 moves the arm member 40 in a direction parallel to the XY plane by extending linearly or bending in a polygonal line (bending / stretching operation).

  The bending / stretching mechanism 50 includes a plurality of column portions 56 (56a to 56e) and a plurality of connection portions 57 (57a to 57e) that connect the column portions 56. Each of the plurality of support columns 56 has, for example, a rod shape extending in a direction parallel to the XY plane. Here, an example in which the number of support columns is five will be described, but the number of support columns is not limited. Each connecting portion 57 connects the supporting column portion 56 connected to the connecting portion 57 to another supporting column portion 56, the θX moving mechanism 53, or the Z moving mechanism 52 so as to be rotatable in the θZ direction.

  Specifically, one end portion of the first support column portion 56a is connected to the θX moving mechanism 53 (arm member 40), and the other end portion is connected to the first connection portion 57a. The 2nd support | pillar part 56b is connected with the 1st support | pillar part 56a via the 1st connection part 57a. Similarly, the 2nd support | pillar part 56b is connected with the 3rd support | pillar part 56c via the 2nd connection part 57b. The 3rd support | pillar part 56c, the 4th support | pillar part 56d, and the 5th support | pillar part 56e are connected via the 3rd connection part 57c and the 4th connection part 57d. The fifth support column portion 56e is connected to the Z moving mechanism 52 through the fifth connection portion 57e.

  Each of the plurality of connection parts 57 includes an actuator such as an electric motor, and rotates the connected column part 56 by the operation of the actuator. For example, the first connection portion 57a supports the second support column portion 56b, and rotates the first support column portion 56a in the θZ direction around the first connection portion 57a. Further, the fifth connecting portion 57e supports the Z moving mechanism 52 and rotates the fifth support column portion 56e in the θZ direction around the fifth connecting portion 57e.

  Here, in a state where the second connection portion 57b to the fifth connection portion 57e do not rotate the second support portion 56b to the fifth support portion 56e, the first connection portion 57a is the first support portion. Assume that 56a is rotated counterclockwise. In this case, the arm member 40 connected to the first support column part 56a moves to draw an arc counterclockwise in the θZ direction with the first connection part 57a as the center. As a result, the arm member 40 moves in the −X axis direction and the + Y axis direction, and the rotation angle (yaw, posture) in the θZ direction changes.

  Further, it is assumed that the third connection portion 57c rotates the third support column 56c clockwise in a state where the first connection unit 57a rotates the first support column 56a counterclockwise. In this case, the arm member 40 moves so that the portion from the third support column portion 56c to the arm member 40 draws an arc in the clockwise direction in the θZ direction with the third connection portion 57c as the rotation center. As a result, the arm member 40 moves in the + X-axis direction and the −Y-axis direction, and the rotation angle in the θZ direction changes so as to cancel the change in the rotation angle in the θZ direction caused by the first connecting portion 57a.

  In addition, the moving device 42 has a plurality of connecting portions such that, for example, the second supporting portion 56b to the fifth supporting portion 56e are rotationally symmetric (for example, S-shaped) around the third connecting portion 57c. By cooperating with 57, the arm member 40 can be moved linearly in parallel with the X-axis direction so that neither the rotation position in the θZ direction nor the position in the Y-axis direction changes. As described above, the bending / stretching mechanism 50 includes the first moving unit that moves the arm member 40 of the suction device 41 in a direction parallel to the tangential plane with respect to the cylindrical surface of the holding unit 22 and the suction device 41 around the axis that intersects the tangential plane. It functions as a second moving part that rotates the arm member 40. In addition, the control device 43 controls the actuators of the first connection portion 57a to the fifth connection portion 57e, whereby the X-axis direction coordinates, the Y-axis direction coordinates, and the θZ-direction coordinates of the arm member 40 are controlled. Control each rotation angle.

  The θX moving mechanism 53 supports the arm member 40 and rotates the arm member 40 with respect to the bending / stretching mechanism 50. For example, the θX moving mechanism 53 can rotate the arm member 40 in the θX direction when the bending / extending mechanism 50 extends in the X-axis direction, and the arm member 40 when the bending / extending mechanism 50 extends in the Y-axis direction. Can be rotated in the θY direction. The control device 43 controls the inclination (tilt, posture) of the mask M held by the arm member 40 with respect to the XY plane by controlling the θX moving mechanism 53 to control the rotation angle of the arm member 40.

  As shown in FIG. 6, the Z moving mechanism 52 includes a support portion 58 that supports the bending and stretching mechanism 50 and a drive portion 59 that drives the support portion 58 in the Z-axis direction. The control device 43 controls the position of the arm member 40 in the Z-axis direction by controlling the drive unit 59. Thereby, the control apparatus 43 can make the mask M attracted | sucked planarly by the arm member 40 approach or separate from the rotating drum DM, for example in the normal line direction (Z-axis direction). .

  As shown in FIG. 7 (and FIG. 6), the Y moving mechanism 51 includes a pair of rail portions 60 (guide members) extending in a direction (Y-axis direction) parallel to the central axis 28 of the rotary drum DM, and a rail portion. And a main body 61 that moves along (guided) 60. The main body 61 moves in the Y axis direction together with the support 58 of the Z moving mechanism 52. The control device 43 controls the position of the arm member 40 in the Y-axis direction by controlling the Y moving mechanism 51.

  By the way, the position of the arm member 40 may change in the X-axis direction and the Y-axis direction depending on the manner of movement of the arm member 40 by the bending / stretching mechanism 50. The moving device 42 moves the Y moving mechanism 51 in the Y-axis direction so as to cancel the change in the Y-axis coordinate of the arm member 40 by the bending / extending mechanism 50, so that the arm member 40 is linearly parallel to the X-axis direction. It can also be moved to. That is, the bending / stretching mechanism 50 and the Y moving mechanism 51 are substantially parallel to a direction (X-axis direction) perpendicular to the central axis 28 of the rotating drum DM and parallel to the tangential plane (XY plane) of the rotating drum DM. It also functions as a linear drive source that moves the arm member 40 linearly. When the arm member 40 is linearly moved in the X-axis direction, the control device 43 associates the amount of movement of the arm member 40 by the bending / extension mechanism 50 with the amount of movement of the arm member 40 by the Y movement mechanism 51, 50 and the Y moving mechanism 51 are controlled.

  As shown in FIG. 6, the processing device U <b> 3 includes a shape detection device 62 that detects the shape of the mask M that is attracted to the arm member 40. The shape detection device 62 optically detects the shape of the mask M, for example. The detection result of the shape detection device 62 is used, for example, for determining whether or not the deformation amount (sag or deflection) of the mask M attracted to the arm member 40 is within an allowable range. This determination may be performed by an operator, for example, or may be performed by the shape detection device 62 or another device of the processing device U3.

  Further, the processing device U3 includes an alignment device 63 that detects an alignment mark M4 (see FIG. 3A) formed on the mask M. The alignment device 63 optically detects the relative positional relationship between the alignment mark M4 formed on the mask M and the rotary drum DM of the mask holding device 20. The detection result of the alignment device 63 is used, for example, for alignment when the mask M is carried into the mask holding device 20.

  Next, the configuration of the arm member 40 of the suction device 41 will be described with reference to FIGS. 8A, 8B, and 8C. FIG. 8A is a configuration diagram of the arm member 40 viewed from the Zb-axis direction. FIG. 8B is a configuration diagram of the arm member 40 viewed from the Yb axis direction. FIG. 8C is a configuration diagram of the arm member 40 as viewed from the Xb-axis direction. 8A to 8C correspond to the Xa axis direction, the Ya axis direction, and the Za axis direction shown in FIGS. 3A and 3B, respectively.

The arm member 40 has a suction surface 44 extending in the Xb-axis direction corresponding to a direction (for example, the X-axis direction) parallel to the tangential plane to the outer peripheral surface 26 of the rotary drum DM and orthogonal to the central axis 28.
As shown in FIG. 8A, the suction surface 44 is disposed at both ends 40b of the arm member 40 in the Yb axis direction.

  In the mask M shown in FIGS. 3A and 3B, for example, the entire pattern M2 can be stored in the central portion 40a excluding the end portion 40b of the arm member 40, and the entire pattern M2 of the mask M can be stored in the central portion 40a. The size and shape are set so that at least a part of the pattern non-formation region MA2 projects on the suction surface 44 (end portion 40b) in a state where the pattern is stored.

  The arm member 40 includes an observation window 65 disposed on the suction surface 44. The observation window 65 is a through hole provided in the arm member 40, for example, and is provided so that the alignment mark M4 of the mask M can be observed through the observation window 65 from the side opposite to the suction surface 44 of the arm member 40. Yes. The arm member 40 may be formed of a translucent material so that the alignment mark M4 of the mask M can be observed through the arm member 40. In this case, the observation window 65 is omitted. May be.

  The arm member 40 includes a plurality of suction portions 66 (66a to 66e) and 67 (67a to 67e). The plurality of suction portions 66 are disposed on the suction surface 44 on the + Yb axis side with respect to the central portion 40a, and the plurality of suction portions 67 are disposed on the suction surface 44 on the −Yb axis side with respect to the central portion 40a. . Here, each of the plurality of adsorbing portions 66 is referred to as a first adsorbing portion 66a, a second adsorbing portion 66b,... In the order from the + Xb axis side to the −Xb axis side. These are referred to as a first suction part 67a, a second suction part 67b,.

  The first suction part 66a has a one-to-one correspondence with the first suction part 67a, and the coordinates in the Xb-axis direction are substantially the same. Similarly, each of the plurality of suction units 67 has a one-to-one correspondence with one of the plurality of suction units 66, and the pair of suction units in a correspondence relationship have substantially the same coordinate in the Xb axis direction.

  As shown in FIG. 8B, each of the plurality of suction portions 66 includes a hole portion 68 having an opening on the suction surface 44, a three-way valve 69 connected to the hole portion 68, and a first valve of the three-way valve 69. 68, and a first flow path 71 connecting the first valve and the suction device 70, and a second flow path 72 connected to the hole 68 through the second valve of the three-way valve 69.

  The suction device 70 (decompression device) can suck the inside of the hole 68 through the first flow path 71 and the three-way valve 69 in a state where the first valve of the three-way valve 69 is opened. The inside of the part 68 can be depressurized. The second flow path 72 is opened to the atmosphere, for example, and opens (increases) the inside of the decompressed hole 68 in a state where the second valve of the three-way valve 69 is opened. The second flow path 72 may be connected to a delivery device (pressurization device) that sends out gas, and this delivery device has a hole for the gas through the second flow path 72 and the second valve of the three-way valve 69. By supplying the inside of the portion 68, the inside of the hole 68 may be boosted.

  As shown in FIG. 8C, each of the first adsorbing portion 66a and the first adsorbing portion 67a has a hole 68 connected to the same three-way valve 69 via the third flow path 73, and the first adsorbing portion 66a and the first adsorbing portion 66a. The inside of the hole 68 is decompressed or pressurized in parallel with the first suction portion 67a. Further, the first suction part 66a and the first suction part 67a have the first flow path 71 and the second flow path 72 in common, and the first suction part 66a and the first suction part 67a have a hole 68. Is provided so that the pressure inside is substantially the same. As described above, the three-way valve 69, the first flow path 71, and the second flow path 72 are shared by a pair of suction sections that have a corresponding relationship among the plurality of suction sections 66 and 67.

  The control device 43 controls the first valve for each of the plurality of three-way valves 69, thereby connecting the holes 68 and the suction device 70 via the three-way valve 69 and the first flow path 71. By controlling 70, the inside of the hole 68 can be decompressed independently for each hole 68. When the inside of the hole 68 is depressurized in a state where the mask M is disposed in the vicinity of the plurality of suction portions 66 and 67, the mask M is sucked toward the hole 68 and contacts the suction surface 44, It is held by the arm member 40. That is, the mask M is attracted to the arm member 40 using the pressure difference between the inside and outside of the hole 68 as an attracting force.

  By the way, as shown in FIG. 8C, the arm member 40 has a central portion 40a disposed between the suction surfaces 44 in the Yb-axis direction, which is recessed from the suction surface 44 (the central portion 40a of the arm member 40 is external). To the Zb axis direction). Therefore, in the mask M, the pattern M2 does not contact the arm member 40 when the first surface M1a side on which the pattern M2 is formed is sucked by the suction surface 44. As a result, the pattern M2 is prevented from being damaged by contact or the like.

  Further, the control device 43 controls the second valve of the three-way valve 69 to open the hole 68 to the atmosphere via the three-way valve 69 and the second flow path 72, so that the inside of the hole 68 that has been depressurized is opened. Boost the pressure. When the pressure inside the hole 68 of the suction part 66 that sucks the mask M is increased, the pressure difference between the inside and the outside of the hole 68 decreases, and the suction force of the suction part 66 decreases.

  In addition, the control device 43 can independently control the pressure inside the hole 68 for each hole 68 connected to each three-way valve 69 by controlling the plurality of three-way valves 69 independently. it can. For example, it is assumed that the plurality of suction portions 66 and 67 shown in FIG. In this case, the control device 43 opens only the second valve of the three-way valve 69 of the first adsorption unit 66a among the three-way valves 69 of the plurality of adsorption units 66 and 67, thereby causing adsorption by the plurality of adsorption units 66. Of these, only the suction of the first suction part 66a can be released. Here, the first adsorbing part 67a (see FIG. 8C) paired with the first adsorbing part 66a is configured such that the first adsorbing part 66a and the first adsorbing part 66a are opened by opening the second valve of the three-way valve 69 common to the first adsorbing part 66a. Adsorption is stopped as in 66a.

  As described above, the control device 43 can change the spatial distribution and temporal distribution of the suction force by the plurality of suction units 66, for example, sucking only a part of the mask M to the arm member 40. The suction to a part of the mask M that has been sucked can be released. Note that the control device 43 can start the adsorption of the plurality of adsorption units 66 at the same time, or can simultaneously cancel the adsorption of the plurality of adsorption units 66.

  Next, operations of the mask transport device ML and the mask holding device 20 will be described. First, an operation for transporting the mask M from the mask cassette MC to the vicinity of the rotary drum DM will be described with reference to FIGS.

  FIG. 9 is a diagram showing the processing device U3 viewed from a direction (Y-axis direction) parallel to the central axis 28 of the rotary drum DM. FIG. 10 is a diagram illustrating the processing device U3 viewed from the normal direction (Z-axis direction) of the tangent plane of the rotating drum DM. Note that FIG. 9A and FIG. 10A are views in which the same state is viewed from different viewpoints. Similarly, FIGS. 9B and 10B, FIGS. 9C and 10C, and FIGS. 9D and 10D correspond to each other.

  The processing device U3 (see FIGS. 9A and 10A) moves the arm member 40 to the storage position of the mask M (mask cassette MC) when carrying the mask M into the mask holding device 20. Hereinafter, the target mask M to be carried into the mask holding device 20 is simply referred to as the target mask M.

  Here, the control device 43 of the mask transport device ML controls the θX moving mechanism 53 to adjust the posture of the arm member 40 from the state shown in FIG. 7, for example, and the suction surface 44 of the arm member 40 is moved to the mask cassette MC. Is substantially parallel to the mask M stored in Further, for example, the control device 43 controls the Y moving mechanism 51 to move the arm member 40 in the Y-axis direction from the state shown in FIG. 7, and targets the position of the suction surface 44 of the arm member 40 in the Y-axis direction. Is aligned with the position in the Y-axis direction of the mask M (for example, the coordinates in the Y-axis direction are substantially the same).

  Then, the control device 43 controls the bending / extension mechanism 50 and the Y movement mechanism 51 to extend the bending / extension mechanism 50 and move the bending / extension mechanism 50 in the Y axis direction by the Y movement mechanism 51, thereby moving the arm member 40 in the X axis direction. Is moved almost linearly. In this way, the arm member 40 is aligned so that the suction surface 44 of the arm member 40 and the target mask M face each other through the opening MC1 on the side surface of the mask cassette MC.

  Then, the host controller CONT shown in FIG. 2 controls the suction device 41 via the control device 43 of the mask transport device ML to suck the target mask M onto the arm member 40. Further, the mask cassette MC is controlled to release the holding of the target mask M by the mask cassette MC. As shown in FIGS. 8B and 8C, the target mask M is adsorbed on the adsorption surface 44 of the arm member 40 in a substantially planar shape.

  Next, the processing apparatus (see FIGS. 9B and 10B) carries the target mask M out of the mask cassette MC. Here, the control device 43 controls the bending / extension mechanism 50 to move the arm member 40 in the −X-axis direction by bending the bending / extension mechanism 50. The control device 43 linearly moves the arm member 40 along the X-axis direction by controlling the bending / stretching mechanism 50 and the Y moving mechanism 51 at least during the period until the target mask M is unloaded from the mask cassette MC. Let Thereby, the mask transport device ML carries the target mask M to the outside through the opening MC1 of the mask cassette MC so that the pattern M2 does not come into contact with other masks M and the mask cassette MC.

Next, in the processing apparatus U3 (see FIGS. 9C and 10C), the mask M held flat on the arm member 40 is substantially parallel to the tangential plane (XY plane) of the rotary drum DM. To do.
Here, the control device 43 of the mask transport device ML controls the θX moving mechanism 53 to rotate the arm member 40 in the θX direction.

  Then, as shown in FIG. 9C, the shape detection device 62 is configured so that the mask M held by the arm member 40 is shaped in parallel with the tangential plane (XY plane) of the rotary drum DM. Measure. That is, the shape detection device 62 measures the shape of the target mask M in a state where the target mask M is in the same posture (inclination with respect to the XY plane) as when the mask M is carried into the mask holding device 20.

  Based on the measurement result of the shape detection device 62, for example, it is determined whether or not the deflection of the mask M held by the arm member 40 is within a predetermined allowable range. Here, when it is determined that the deflection of the mask M exceeds the allowable range, the mask M is removed from the arm member 40, and the mask M or the mask M having the same pattern M2 is held by the arm member 40. It will be reworked.

  When it is determined that the deflection of the mask M held by the arm member 40 is within the allowable range, the processing device U3 (see FIGS. 9D and 10D) causes the arm member 40 to The mask M held on the rotary drum DM is disposed at a position away from the rotary drum DM in the −X axis direction. Here, the control device 43 controls the bending / stretching mechanism 50 and the Y moving mechanism 51 to extend the magnetic body M3 of the mask M held by the arm member 40 and the loading direction of the mask M with respect to the rotating drum DM. The rotation angle of the arm member 40 in the θZ direction is adjusted so that the (X-axis direction) is substantially parallel.

  Further, the control device 43 controls the Z moving mechanism 52 so that the mask member M held by the arm member 40 and the tangential plane of the rotary drum DM are spaced at a predetermined interval in the Z-axis direction. The position of 40 in the Z-axis direction is adjusted. As described above, the processing apparatus U3 prepares to attach the target mask M to the mask holding apparatus 20.

  Next, a method of attaching the target mask M to the mask holding device 20 using the mask transport device ML and the mask holding device 20 (mask attaching method) will be described with reference to FIG. FIG. 11 is a diagram illustrating a method of attaching the mask M.

  When attaching the mask M to the mask holding device 20, the control device 43 of the mask transport device ML controls the bending / extension mechanism 50 and the Y movement mechanism 51 of the moving device 42, so that the state shown in FIG. The arm member 40 is linearly moved in the + X axis direction. Here, the control device 43 arranges the front end side (+ X axis side) of the mask M held by the arm member 40 in the vicinity of the portion where the XY plane and the rotary drum DM are in contact with each other. The portion where the XY plane and the rotating drum DM are in contact includes, for example, the top DMt (see FIG. 11A) disposed on the + Z axis side of the rotating drum DM. In this way, the mask M attracted by the arm member 40 is arranged so as to face the rotating drum DM of the mask holding device 20 at a predetermined interval.

  Prior to attaching the mask M, the processing device U3 arranges the alignment device 63 at a position where the top DMt of the rotating drum DM can be observed, and the processing device U3 is formed on the outer peripheral surface of the rotating drum DM. The rotational position of the rotary drum DM is adjusted as appropriate so that the alignment mark being held is within the visual field of the alignment device 63.

  Then, the processing device U3 aligns the mask M held on the arm member 40 of the mask transport device ML and the rotary drum DM. Here, the alignment device 63 detects the relative position between the alignment mark M4 of the mask M and the alignment mark of the rotary drum DM through an observation window 65 (see FIG. 8A) provided in the arm member 40 of the mask transport device ML. . The alignment between the mask M and the rotating drum DM is performed using the detection result of the alignment device 63. Accordingly, the processing device U3 can align the mask M and the rotary drum DM with high accuracy.

  In the alignment between the mask M and the rotating drum DM, the moving device 42 of the mask transport device ML roughly adjusts the relative position of the mask M and the rotating drum DM by moving the arm member 40. Further, the second drive unit 23 of the mask holding device 20 finely adjusts the relative position of the mask M and the rotary drum DM by moving the rotary drum DM. The rough adjustment by the mask transport device ML is performed with a stroke larger than the fine adjustment of the mask holding device 20, for example.

  Here, the bending / stretching mechanism 50 can adjust the relative position in the X-axis direction and the relative position in the Y-axis direction of the mask M and the rotating drum DM by moving the arm member 40 along the XY plane. Further, the bending / stretching mechanism 50 can adjust the relative position of the mask M and the rotating drum DM in the θZ direction by rotating the arm member 40 in the θZ direction. In this way, the processing apparatus U3 can align the mask M attracted by the arm member 40 and the rotary drum DM with high accuracy.

  Then, with the mask M and the rotating drum DM aligned, as shown in FIG. 11A, the processing device U3 causes the arm member 40 of the mask transport device ML to partially release the suction of the mask M. In synchronism with this, the holding unit 22 of the mask holding device 20 partially sucks the mask M.

  Here, the control device 43 of the mask transfer device ML performs first suction portions 66a and 67a (on the tip side (+ X axis side) of the arm member 40 in accordance with the control of the host control device CONT shown in FIG. The suction by the second suction parts 66b and 67b to the fifth suction parts 66e and 67e is continued. Further, the control device 13 of the exposure apparatus EX shown in FIG. 4 causes the holding unit 22 (mask holding device 20) to suck the mask M under the control of the host control device CONT. In detail, the control apparatus 13 selects the electromagnet 32 arrange | positioned in the position facing the part from which adsorption | suction of the mask M was cancelled | released among the some electromagnets 32, and generates magnetic force.

  As a result, the portion of the mask M that has been desorbed by the arm member 40 is attracted to the rotating drum DM by the magnetic force generated by the electromagnet 32 by the magnetic body M3 and is attracted to the rotating drum DM. Thus, the mask holding device 20 can adsorb the mask M to the rotating drum DM in order for each portion, and can hold the mask M without slack, for example.

  By the way, the generating principle (type of physical force) of the processing device U3 differs between the suction force (pressure) of the mask transfer device ML with respect to the mask M and the suction force (magnetic force) of the mask holding device 20. Therefore, the processing device U3 can easily control the suction force independently by the mask transport device ML and the mask holding device 20, and can suppress the occurrence of positional deviation between the mask M and the rotating drum DM. Further, as shown in FIG. 9C, the processing unit U3 detects the shape (deformation, deflection) of the mask M attracted to the arm member 40 prior to mounting the mask M on the rotary drum DM. Therefore, the mask M can be mounted on the rotating drum DM without slack.

  Then, using the observation result of the alignment device 63, it is determined whether or not the distal end side (+ X axis side) of the mask M in the loading direction is disposed at a predetermined position on the outer peripheral surface 26 of the rotary drum DM. When it is determined that the front end side of the mask M in the loading direction is disposed at a predetermined position of the rotating drum DM, the processing device U3 performs the loading direction as shown in FIGS. 11B to 11D. The mask M is attached to the rotating drum DM in the order from the front end side to the rear end side.

  Specifically, the mask holding device 20 rotates the rotary drum DM so that the mask M is wound around the rotary drum DM. The mask transport device ML moves the arm member 40 linearly in the X-axis direction at a speed corresponding to the speed of the outer peripheral surface 26 due to the rotation of the rotary drum DM. The speed of the arm member 40 is set so that, for example, a tension that does not sag is applied to the mask M in the portion where the adsorption of the arm member 40 is released, and the elongation of the mask M due to this tension can be ignored.

  Further, the mask transport device ML has the second suction portions 66b and 67b at substantially the same timing (slightly earlier) as the second suction portions 66b and 67b of the arm member 40 are closest to the arm member 40 to the rotary drum DM. The suction of the mask M due to is released. In addition, the holding unit 22 (mask holding device 20) generates a magnetic force in the electromagnet 32 when the electromagnet 32 is disposed in a portion of the rotary drum DM that comes into contact with the wound mask M, so that the mask M And the portions of the mask M wound around the rotary drum DM are fixed in order by suction.

  In this way, the entire mask M is released from the arm member 40 as shown in FIG. Then, as shown in FIG. 11F, the mask transport device ML appropriately retracts the arm member 40 to a position where it does not interfere (collision) with the rotary drum DM or the like. After the mask transport device ML retracts the arm member 40, the alignment device 63 detects the positional relationship between the alignment mark M4 of the mask M held on the rotating drum DM and the alignment mark of the rotating drum DM. . This detection result is used, for example, to determine whether or not the mask M is disposed at a predetermined position of the rotary drum DM. When it is determined that the mask M is not disposed at the predetermined position of the rotary drum DM, the mask M is removed from the rotary drum DM and has the mask M or the same pattern according to the procedure described above. Another mask is reattached to the rotating drum DM.

  As described above, the processing device U3 bends the planar mask M into a cylindrical surface and attaches it to the cylindrical outer peripheral surface 26 of the rotary drum DM. The exposure apparatus EX of the processing apparatus U3 performs an exposure process using the rotating drum DM on which the mask M is mounted. Further, after the exposure processing by the exposure apparatus EX is completed, the mask transport apparatus ML can carry out the mask M from the rotating drum DM of the exposure apparatus EX, and carry the carried out mask M into the mask cassette MC. The unloading of the mask M from the rotating drum DM can be executed, for example, by a procedure reverse to that when the mask M is loaded into the rotating drum DM.

  The mask transport device ML of the present embodiment moves the arm member 40 relative to the circumferential direction of the rotating drum DM (holding portion 22), and moves the arm according to the relative movement of the arm member 40 when delivering the mask M to the rotating drum DM. The suction state of the mask M by the member 40 is changed. Therefore, the mask transport device ML can efficiently mount the flat mask M on the outer peripheral surface 26 of the cylindrical rotating drum DM, mount it with high positional accuracy, and the like.

  The mask transport device ML is configured to suck the mask M in a substantially flat shape, for example, and the arm member 40 holds the mask M so that the mask M faces the holding portion 22 of the mask holding device 20 at a predetermined interval. Adsorb. Therefore, the mask transport device ML can attach the mask M to the rotary drum DM with high positional accuracy. The moving device 42 linearly moves the arm member 40 along the pattern M2 of the mask M adsorbed in a substantially planar shape. Therefore, the mask transport device ML can efficiently mount the mask M on the rotary drum DM.

  Further, the plurality of suction portions 66 of the arm member 40 suction a plurality of portions arranged in a direction corresponding to the circumferential direction of the cylindrical surface of the mask M, for example, and the control device 21 is positioned at the relative movement position accompanying the movement of the movement device 42. Accordingly, control is performed so as to change the suction force of each of the plurality of suction portions 66. Therefore, the mask transport device ML can adjust the spatial distribution of the suction force of the suction device 41 with high accuracy, and can attach the mask M to the rotary drum DM with high positional accuracy.

[Second Embodiment]
Next, a second embodiment will be described. The mask holding device 20 of this embodiment is different from that of the first embodiment in that an end 30 in a direction parallel to the central axis 28 of the rotary drum DM is formed of a material different from that of the center 31.

  12A and 12B are diagrams illustrating the configuration of the mask holding device 20 according to the present embodiment. In FIG. 12A, an overview of the mask holding device 20 and the mask M is shown. FIG. 12B shows an enlarged view of the alignment mark 82 of the rotary drum DM and the alignment mark M4 of the mask M.

A central portion 31 of the rotating drum DM shown in FIGS. 12A and 12B is a portion overlapping the pattern M2 of the mask M when viewed from the radial direction of the rotating drum DM, and is formed of a light-transmitting material such as quartz. .
The rotating drum DM is in contact with the guide roller 80 and the driving roller 81, and is supported by these rollers. The driving roller 81 is a part of the second driving unit 23 shown in FIG. 2, and rotates the rotating drum DM by transmitting torque supplied from an electric motor or the like via a speed reducer to the end 30. .

  The end 30 of the rotating drum DM includes a portion that circumscribes the guide roller 80 and the driving roller 81. The material of the end portion 30 is selected from a material that is less susceptible to brittle fracture than a material (quartz or the like) of the central portion 31 such as a metal, or a material that has high workability. For example, the electromagnet 32 is disposed inside a recess formed in the end 30. The recess has an opening on the outer peripheral surface 26 of the rotary drum DM and is insulated so that the surface does not conduct with the electromagnet 32.

  As shown in FIG. 12B, the mask M of the present embodiment is different from the first embodiment in that the alignment mark M4 is formed in a region different from the magnetic body M3 in the region around the pattern M2. Here, the alignment mark 82 of the rotating drum DM is formed in the central portion 31 of the rotating drum DM, and the alignment mark M4 of the mask M is arranged so as to be able to overlap the alignment mark 82 of the rotating drum DM. Yes. Such an alignment mark M4 of the mask M may be formed together with the pattern M2 with the same forming material (light shielding layer) as the pattern M2, for example.

  In the mask holding device 20 of the present embodiment, since the end 30 is formed of a material different from that of the central portion 31, the degree of freedom in selecting the material of the end 30 is increased. For example, if the end portion 30 is formed of a metal material or the like, the workability at the time of manufacturing the rotary drum DM is improved, and the electromagnet 32 and the like can be easily attached. Further, if the end portion 30 is formed of a metal material or the like, it is possible to suppress the occurrence of damage such as cracks or scratches on the end portion 30 due to contact between the end portion 30 and the roller.

[Third Embodiment]
Next, a third embodiment will be described. The mask holding device 20 of the present embodiment is different from the first embodiment in that the mask M is attracted by electrostatic force.

  13A and 13B are views showing the appearance of the holding unit 22 of the mask holding device 20 according to the present embodiment. FIG. 14 is a diagram schematically illustrating a circuit configuration of the mask holding device 20. In FIG. 13A, the holding portion 22 is disassembled and schematically shown. In FIG. 13B, a part of FIG. 13A is omitted to make it easier to see the electrodes, wirings, and the like. 13A and 13B show a part (one end portion 85a) in a direction parallel to the central axis 28 of the rotary drum DM. The other end 85b (see FIG. 14) of the rotating drum DM has a structure symmetrical to one end with respect to a plane orthogonal to the central axis 28, and the elements thereof are the same as those of the one end 85a.

  As shown in FIG. 13A, the holding unit 22 of the mask holding device 20 includes a cylindrical movable member 85 (rotary drum DM) on which an electrode pattern 84 is formed as an electrode member for electrostatic attraction, and a movable member 85. A rolling ring 87 attached to an end in a direction parallel to the central axis 28 and provided with a drive circuit 86 (voltage applying device) for driving the electrode pattern 84, and a fixing member arranged inside the rolling ring 87 88.

  The movable member 85 has an outer peripheral surface 26 on which the mask M is disposed, and is formed of a light-transmitting material such as quartz. The rolling ring 87 is an annular member fixed to the end of the movable member 85 by adhesion or the like, and rotates together with the movable member 85. The rolling ring 87 is formed of a material such as metal like the end 30 of the rotating drum DM shown in FIGS. 12A and 12B, for example. The fixed member 88 is disposed between the rolling ring 87 via an air bearing 89, and is provided so as not to rotate with respect to the outside when the movable member 85 and the rolling ring 87 rotate. . The rolling ring 87 and the fixed member 88 are provided at the other end portion of the movable member 85 in the same manner as the one end portion 85a.

  The fixed member 88 has a first portion 88 a disposed outside the movable member 85 and a second portion 88 b disposed inside the movable member 85. The fixed member 88 is fixed to the outside of the movable member 85, for example, by supporting the first portion 88a. When an element such as the illumination optical system IL is disposed inside the movable member 85, this element is attached to the second portion 88b. Thereby, the second portion 88 b fixes the element disposed inside the movable member 85 so as not to rotate with respect to the outside of the movable member 85.

  The first portion 88 a and the second portion 88 b of the fixed member 88 are respectively cylindrical, and the inside of the first portion 88 a and the second portion 88 b is a through hole 88 c (duct) that connects the inside and the outside of the movable member 85. It has become. The through hole 88c can be used as, for example, a vent hole, a cable outlet, or the like. For example, when a light source device or the like is disposed inside the movable member 85, a cable connected to the light source device is drawn out of the movable member 85 through the through hole 88c. Further, the heat generated inside the movable member 85 by the light source device or the like is radiated to the outside of the movable member 85 through the through hole 88c, for example, by passing through the through hole 88c.

  As shown in FIG. 13B, each of the plurality of electrode patterns 84 includes a first electrode 84a and a second electrode 84b, and one first electrode 84a and one second electrode 84b are combined to form a capacitance. Form. The first electrode 84a and the second electrode 84b of each electrode pattern 84 are formed, for example, in a comb shape and are arranged close to each other. When the charge for adsorption is accumulated in the capacitance of the electrode pattern 84, the first electrode 84a is set, for example, as an anode, and the second electrode 84b is set, for example, as a negative electrode.

  The movable member 85 is formed at the first terminal 90 electrically connected to the first electrode 84a, the wiring pattern 91 electrically connected to each of the plurality of second electrodes 84b, and the end of the movable member 85. And a second terminal 92 electrically connected to the wiring pattern 91.

  The first terminal 90 is a so-called power supply terminal, and a predetermined potential with respect to the potential (reference potential) of the second terminal 92 is applied. The first terminal 90 has a one-to-one correspondence with the first electrode 84a and is repeatedly arranged in the circumferential direction of the rotary drum DM. For example, the first terminal 90 is disposed on an end surface orthogonal to the central axis 28 of the rotating drum DM, and is electrically connected to the first electrode 84a by a wiring extending in a direction parallel to the central axis 28 of the rotating drum DM. Yes.

  The second terminal 92 is a so-called ground terminal, to which a reference potential is applied. For example, the second terminal 92 may be disposed on an end surface orthogonal to the central axis 28 of the rotary drum DM, and the number thereof may be one or plural. The wiring pattern 91 is a so-called common ground line, and holds the plurality of second electrodes 84b at substantially the same potential. The wiring pattern 91 includes a first wiring 91a extending in the circumferential direction of the rotating drum DM and a second wiring 91b extending in a direction parallel to the central axis 28 of the rotating drum DM. The first wiring 91a is continuous with each of the plurality of first electrodes 84a provided at the one end portion 85a of the movable member 85, and is electrically connected to each of the plurality of first electrodes 84a at the one end portion 85a. Yes.

  As shown in FIG. 14, a plurality of electrode patterns 84 are formed on the other end portion 85b of the movable member 85 in the same manner as the one end portion 85a. The electrode pattern 84 at the other end portion is provided in a one-to-one correspondence with the electrode pattern 84 at the one end portion 85a, and the electrode pattern 84 at the one end portion 85a and the circumferential position (θY It is arranged so that the angular position of the direction is aligned. For example, one of the electrode patterns 84 at the one end 85a (84-1) and one of the electrode patterns 84 at the other end 85b (84-4) are arranged in a direction parallel to the central axis 28 of the movable member 85. Is arranged.

  Further, the first wiring 91a is formed at the other end 85b of the movable member 85 in the same manner as the one end 85a. The first wiring 91a of the other end 85b is electrically connected to each of the second electrodes 84b in the plurality of electrode patterns 84 of the other end 85b. The first wiring 91a at the one end 85a and the first wiring 91a at the other end 85b are electrically connected via the second wiring 91b. The second wiring 91b is electrically connected to the second terminal 92 and is held at the reference potential. As described above, the plurality of second electrodes 84b at the one end portion 85a and the other end portion 85b are all electrically connected to the second terminal 92 via the wiring pattern 91 (common ground line). The potential (reference potential) is maintained.

  The mask M has a pattern non-formation region MA2 where the pattern M2 is not formed, and the surface of the pattern non-formation region MA2 is made of a dielectric. Such a mask M may be, for example, one obtained by omitting the magnetic body M3 from the mask M shown in FIGS. 3A and 3B, or one in which a dielectric film is formed so as to cover the magnetic body M3. The mask M is arranged so that the pattern M2 does not overlap with the plurality of electrode patterns 84 and the pattern non-formation region MA2 overlaps with the plurality of electrode patterns 84 when viewed from the radial direction of the movable member 85.

  The drive circuit 86 selects at least one of the first switch section 94 that switches the power (voltage) supplied from the power supply section 93 (voltage application device) to the drive circuit 86 and the plurality of first electrodes 84a. 1 switch part 94 and the 2nd switch part 95 electrically connectable are provided.

  The power supply unit 93 includes a high voltage power supply 93a for accumulating charges for electrostatic attraction in the capacitance formed by the electrode pattern 84, and a reverse bias power supply 93b having a reverse bias to the high voltage power supply 93a. The power supply unit 93 is provided, for example, outside the rotating drum DM, and the positive electrode of the high-voltage power supply 93a and the negative electrode of the reverse bias power supply 93b are electrically connected to the first switch unit 94 via a contact such as a brush. Further, the negative electrode of the high voltage power supply 93 a and the positive electrode of the reverse bias power supply 93 b are electrically connected to the second electrode 84 b of the electrode pattern 84 via the second terminal 92.

  Note that the arrangement and configuration of the power supply unit 93 can be changed as appropriate. For example, the power supply unit 93 may be arranged inside the rotating drum DM like the battery 34 shown in FIG. 4, or may be arranged as shown in FIG. 13A. The moving ring 87 or the fixing member 88 may be disposed.

  The first switch unit 94 has a first state in which the contact 94a is conducted to the positive electrode of the high-voltage power supply 93a of the power supply unit 93, a second state in which the contact 94a is conducted to the negative electrode of the reverse bias power supply 93b of the power supply unit 93, The third state in which 94a is insulated from both the high-voltage power supply 93a and the reverse bias power supply 93b can be alternatively switched. The control device 21 of the exposure apparatus EX as shown in FIG. 4 can select one of the first to third states by controlling the first switch unit 94.

  The second switch unit 95 is electrically connected to the first electrode 84a of the electrode pattern 84 via the contact point 95a electrically connected to the contact point 94a of the first switch unit 94 and the first terminal 90 shown in FIG. 13B. A plurality of contact points 96 connected to each other. The second switch unit 95 can electrically connect a contact selected from the plurality of contacts 96 to the first switch unit 94.

  Of the plurality of contacts 96, the contact 96a is electrically connected to the first electrode 84a of the electrode pattern 84-1, and the first electrode 84a of the electrode pattern 84-4 corresponding to the electrode pattern 84-1. Yes. The contact 96b includes two electrode patterns 84-1, 84-2 arranged in the circumferential direction of the movable member 85, and an electrode pattern 84-4 corresponding to the electrode patterns 84-1, 84-2. , 84-5 are electrically connected to the first electrode 84a. The contact 96c includes three electrode patterns 84-1 to 84-3 arranged in the circumferential direction of the movable member 85, and an electrode pattern 84-4 corresponding to the electrode patterns 84-1 to 84-3. To 84-4 are electrically connected to the first electrode 84a.

  In FIG. 14, three contacts 96 a to 96 c are illustrated as the plurality of contacts 96, but the plurality of contacts 96 are actually contacts corresponding to four electrode patterns 84, and five electrode patterns 84. Includes contacts that are electrically connected to the first electrodes 84a of the plurality of electrode patterns 84 arranged in the circumferential direction of the movable member 85, such as contacts corresponding to all electrode patterns 84. . In FIG. 14, each of the first switch unit 94 and the second switch unit 95 is illustrated as a mechanical switch. However, one of the first switch unit 94 and the second switch unit 95 or switching of a MOS or the like is used. You may be comprised with the element.

  The control device 21 of the exposure apparatus EX as shown in FIG. 4 controls the second switch unit 95 to select one of the plurality of contacts 96 and electrically connect it to the first switch unit 94. Can do.

  Here, in the drive circuit 86, a first state is assumed in which the first switch unit 94 is electrically connected to the positive electrode of the high-voltage power supply 93a. When the contact point 96a of the second switch unit 95 is electrically connected to the contact point 94a of the first switch unit 94 in the first state, a positive voltage is applied to the first electrodes 84a of the electrode patterns 84-1 and 84-4. Applied. Thereby, each of the electrode patterns 84-1 and 84-4 generates an attracting force due to an electrostatic force by accumulating charges in the capacitance. Similarly, in the first state, when the contact 96b of the second switch unit 95 is electrically connected to the contact 94a of the first switch unit 94, the electrode patterns 84-1, 84-2, 84-4, 84- 5 generates an attracting force due to electrostatic force. Further, when the contact 96c of the second switch unit 95 is electrically connected to the contact 94a of the first switch unit 94, the electrode patterns 84-1 to 84-6 generate an attracting force due to electrostatic force. As described above, the drive circuit 86 can change the region where the attracting force is generated in the movable member 85.

  In the driving circuit 86, a third state is assumed in which both the high-voltage power supply 93a and the reverse bias power supply 93b are insulated. In the third state, the portion where the electrode pattern 84 is charged (suction portion 66) is maintained in a state where the suction force is generated. For example, when the plurality of electrode patterns 84 are all set to the third state in a charged state, all of the electrode patterns 84 are held with an attractive force generated.

  In the drive circuit 86, a second state is assumed in which the first switch unit 94 is electrically connected to the negative electrode of the reverse bias power source 93b of the power source unit 93. In the second state, when the contact 96a of the second switch unit 95 is electrically connected to the first switch unit 94, a negative voltage is applied to the first electrodes 84a of the electrode patterns 84-1, 84-4. The As a result, when charges are accumulated in each of the electrode patterns 84-1, 84-4, the charges are discharged from the capacitance, so that the electrode patterns 84-1, 84-4 are almost all. It can be switched to a state where no suction force is generated. Similarly, in the second state, when the contact 96b of the second switch unit 95 is electrically connected to the contact 94a of the first switch unit 94, the electrode patterns 84-1, 84-2, 84-4, 84- 5 is switched to a state in which almost no adsorption force is generated. Further, when the contact point 96c of the second switch unit 95 is electrically connected to the contact point 94a of the first switch unit 94, the electrode patterns 84-1 to 84-6 are switched to a state in which almost no attracting force is generated. As described above, the drive circuit 86 can switch at least a part of the region where the attracting force is generated in the movable member 85 to a state where the attracting force is hardly generated.

  In the same manner as shown in FIG. 11, the mask holding device 20 of the present embodiment sucks the mask M in order for each portion by sequentially generating a suction force in the circumferential direction of the movable member 85 (the rotating drum DM). be able to. Thus, the processing device U3 can efficiently mount the mask M on the rotating drum DM, mount the mask M on the rotating drum DM with high positional accuracy, and the like.

  The technical scope of the present invention is not limited to the above-described embodiment. For example, one or more of the elements described in the embodiments may be omitted. The elements described in the embodiments can be combined as appropriate.

  The suction force of the mask transport device ML with respect to the mask M and the suction force of the mask holding device 20 with respect to the mask M are different from each other in the generation principle due to the suction force by pressure (decompression), the suction force by magnetic force, the suction force by electrostatic force, and the like. May be appropriately selected, or may be selected so that the generation principle is the same.

The bending / stretching mechanism 50 only needs to be able to bend and stretch on the moving surface including the direction (X-axis direction) in which the mask M (arm member 40) is moved when the mask M is mounted on the rotary drum DM.
Such a moving surface may be, for example, an XZ plane. In this case, the bending / extending mechanism 50 and the Z moving mechanism 52 are arranged so as to cancel the movement of the arm member 40 in the Z-axis direction by the bending / extending mechanism 50. The moving mechanism 52 functions as a linear drive source by moving the bending / stretching mechanism 50.

  Note that the delivery of the mask between the mask transport device ML and the mask cassette MC can be performed in the same manner as the delivery of the mask between the mask transport device ML and the mask holding device 20.

[Device manufacturing method]
Next, a device manufacturing method will be described. FIG. 20 is a flowchart showing the device manufacturing method of this embodiment.

  In the device manufacturing method shown in FIG. 15, first, function / performance design of a device such as an organic EL display panel is performed (step 201). Next, a mask M is manufactured based on the design of the device (step 202). In addition, a transparent film or sheet as a substrate of the device, or a substrate such as an ultrathin metal foil is prepared by purchase or manufacture (step 203).

  Next, the prepared substrate is put into a roll type or patch type production line, and TFT backplane layers such as electrodes, wiring, insulating film, semiconductor film, etc. constituting the device on the substrate, and organic EL light emission that becomes a pixel portion A layer is formed (step 204). Step 204 typically includes a step of forming a resist pattern on a film on the substrate and a step of etching the film using the resist pattern as a mask. In forming the resist pattern, a step of uniformly forming a resist film on the substrate surface, a step of exposing the resist film on the substrate with exposure light patterned through the mask M according to each of the above embodiments, A step of developing the resist film on which the latent image of the mask pattern is formed by exposure is performed.

  In the case of flexible device manufacturing using printing technology, etc., a process of forming a functional photosensitive layer (photosensitive silane coupling material, etc.) on the substrate surface by a coating method, via the mask M according to each of the above embodiments. A process of irradiating the functional photosensitive layer with patterned exposure light to form a hydrophilic part and a water-repellent part according to the pattern shape on the functional photosensitive layer, and the functional photosensitive layer has high hydrophilicity. A step of applying a plating base solution or the like to the portion and depositing and forming a metallic pattern by electroless plating is performed.

  Next, depending on the device to be manufactured, for example, the substrate is diced or cut, or another substrate manufactured in a separate process, such as a sheet-like color filter having a sealing function or a thin glass substrate is attached. The combining process is performed to assemble the device (step 205). Next, post-processing such as inspection is performed on the device (step 206). A device can be manufactured as described above.

DESCRIPTION OF SYMBOLS 20 ... Mask holding device, 21 ... Control device, 22 ... Holding part, 26 ... Outer peripheral surface, 27 ... Magnetic force generator, 28 ... Center axis, 32 ... Electromagnet, 34 ... Battery, 40 ... Arm member, 41 ... Adsorption device, 42 ... Moving device, 43 ... Control device, 50 ... Bending / extending mechanism, 62 ... Shape detection device, 63 ... Alignment device, 66, 67 ... Suction part, 82 ... Alignment mark, 84 ... Electrode pattern, DM ... Rotating drum, EX ... Exposure device, M ... Mask, M1 ... Base material, M2 ... Pattern, M3 ... Magnetic material, P ... Substrate, U3 ... Processing device

Claims (19)

A mask carrying device for carrying the mask substrate into a mask holding device having a holding portion for holding the pattern surface of the mask substrate in a cylindrical shape,
A suction device for sucking the mask substrate;
A moving device for relatively moving the suction device and the holding portion of the mask holding device with respect to the circumferential direction of the cylindrical surface;
When the mask substrate is transferred from the suction device to the holding portion of the mask holding device in accordance with the movement by the moving device, the mask substrate is moved by the suction device according to a relative movement position in the circumferential direction of the cylindrical surface. And a control device that changes the suction state. The mask conveyance device according to claim 1, wherein the suction device has an arm member that sucks the mask substrate so as to face the holding portion of the mask holding device at a predetermined interval. The mask conveyance device according to claim 2, wherein the suction device has a plurality of suction portions provided on the arm member so as to suck a plurality of portions arranged in a direction corresponding to a circumferential direction of the cylindrical surface of the mask substrate. . The arm member is configured to suck the mask substrate in a substantially flat shape by the plurality of suction portions, and the moving device moves the arm member along a pattern surface of the mask substrate sucked in a substantially flat shape. The mask transfer apparatus according to claim 3, further comprising a linear drive source that linearly moves the mask. The mask holding device attracts the magnetic body provided on the mask substrate to the holding part by magnetic force,
5. The mask transfer device according to claim 3, wherein a plurality of suction units provided on an arm member of the suction device suck the mask substrate by reducing pressure. The mask according to any one of claims 3 to 5, wherein the control device performs control so as to change each suction force of the plurality of suction portions according to the relative movement position accompanying the movement of the moving device. Conveying device. The moving device moves the arm member until the mask substrate sucked by the arm member of the suction device comes close to the holding portion of the mask holding device,
The said control apparatus controls the said adsorption | suction apparatus so that the adsorption | suction force which acts on the site | part which is closest to the holding | maintenance part of the said mask holding | maintenance apparatus among the said mask board | substrate becomes relatively low. The mask transfer apparatus according to claim 1. The holding portion of the mask holding device is formed in a cylindrical surface shape, and the moving device moves the arm member of the suction device in a direction parallel to a tangential plane with respect to the cylindrical surface of the holding portion; A mask transfer device according to claim 1, further comprising: a second moving unit that rotates an arm member of the suction device around an axis that intersects a tangential plane. The mask according to any one of claims 1 to 8, wherein the control device controls the moving device based on a relative position between an alignment mark formed on the mask substrate and a holding portion of the mask holding device. Conveying device. The control device sucks the mask substrate to the arm member of the suction device so that the relative position between the alignment mark formed on the mask substrate and the specific portion of the arm member of the suction device has a predetermined relationship. The mask transfer device according to claim 2, wherein the moving device is controlled such that the mask substrate sucked by the arm member moves relative to the mask holding device. The mask conveyance apparatus as described in any one of Claim 1 to 10 provided with the shape detection apparatus which detects the shape of the said mask board | substrate adsorbed by the said adsorption | suction apparatus. A mask holding device that holds a mask substrate that can be curved along a cylindrical surface and includes a magnetic body,
A movable member having a cylindrical surface on which the mask substrate is arranged by a mask transfer device that carries the mask substrate; and rotatable about a central axis of the cylindrical surface;
A magnetic force generator for generating a magnetic force on the cylindrical surface;
A mask holding device comprising: a control device that controls the magnetic force generation device to control the distribution of magnetic force on the cylindrical surface in accordance with a relative position between the mask substrate carried in by the mask transfer device and the cylindrical surface. . The magnetic force generator includes an electromagnet, and a power storage unit that stores power supplied to the electromagnet,
The mask holding device according to claim 12, wherein the power storage unit is disposed inside the movable member. A mask holding device that holds a mask substrate that can be curved along a cylindrical surface and is composed of a dielectric base material,
A movable member having a cylindrical surface on which the mask substrate is arranged by a mask transfer device that carries the mask substrate; and rotatable about a central axis of the cylindrical surface;
A voltage applying device for applying a voltage to electrode members for electrostatic attraction disposed at a plurality of locations in the circumferential direction of the cylindrical surface;
A control device for controlling the distribution of electrostatic adsorption on the cylindrical surface by controlling the voltage application device according to the relative position between the mask substrate carried in by the mask transport device and the cylindrical surface of the movable member; A mask holding device comprising: A substrate that can be curved along a cylindrical surface;
A pattern formed on the substrate;
And a magnetic substrate provided on the base material. A mask holding device that holds the pattern surface of the bendable mask substrate in a cylindrical shape; and
A substrate processing apparatus comprising: the mask transfer apparatus according to claim 1. The mask holding device is
A movable member rotatable around a central axis of the cylindrical surface;
A magnetic force generator for generating a magnetic force on the cylindrical surface;
A control device that controls the magnetic force generation device to control the distribution of magnetic force on the cylindrical surface according to the relative position between the mask substrate carried in by the mask transfer device and the cylindrical surface. 2. The substrate processing apparatus according to 1. The mask substrate includes a dielectric substrate;
The mask holding device is
A movable member having a cylindrical surface on which the mask substrate is arranged by the mask transfer device, and rotatable about a central axis of the cylindrical surface;
A voltage applying device for applying a voltage to electrode members for electrostatic attraction disposed at a plurality of locations in the circumferential direction of the cylindrical surface;
A control device for controlling the distribution of electrostatic adsorption on the cylindrical surface by controlling the voltage application device according to the relative position between the mask substrate carried in by the mask transport device and the cylindrical surface of the movable member; The substrate processing apparatus according to claim 16. The substrate processing apparatus according to any one of claims 16 to 18, exposing a pattern of the mask substrate to a substrate on which a photosensitive layer is formed,
Performing a subsequent process using a change in the photosensitive layer of the exposed substrate.

Images