TW201339766A - Mask transferring apparatus, mask holding apparatus, mask substrate, substrate processing apparatus, and device manufacturing method - Google Patents

Abstract

A mask transferring apparatus includes a suction apparatus which suctions a mask substrate and transfers the mask substrate with respect to a cylindrical holding surface of a mask holding apparatus, a moving apparatus which relatively moves the suction apparatus and the mask holding apparatus in a circumferential direction of the holding surface, and a controller which, at a moment when the mask substrate is transferred from the suction apparatus to the holding surface of the mask holding apparatus in accordance with a movement caused by the moving apparatus, changes a suction state of the mask substrate created by the suction apparatus according to a relative-movement-position in the circumferential direction of the holding surface.

Description

Mask transfer device, mask holding device, mask substrate, substrate processing device, and device manufacturing method

The present invention relates to a mask transfer device, a mask holding device, a mask substrate, a substrate processing device, and a device manufacturing method.

The priority of Japanese Patent Application No. 2012-071056, filed on March 27, 2012, is hereby incorporated by reference.

A substrate processing apparatus such as an exposure apparatus is used in the production of various elements, for example, as described in Patent Document 1 below. One of the methods for manufacturing an element is, for example, a roll to roll method described in Patent Document 2 below. In the roll-to-roll method, a substrate such as a film is conveyed from a feeding roller to a collecting roller, and various processes are performed on the substrate on the transport path.

Advanced technical literature

[Patent Document 1] Japanese Special Opening No. 2007-299918

[Patent Document 2] International Publication No. 2008/129819

The substrate processing apparatus described above is required to be able to process the substrate with good efficiency. In the substrate processing apparatus, for example, the substrate can be processed while rotating the roll-shaped mask substrate to improve the efficiency. Therefore, in the substrate processing apparatus, it is expected that a technique of bending the mask substrate into a roll shape to be attached to the substrate processing apparatus can be conceived.

An aspect of the present invention is to provide a mask transport apparatus, a mask holder, a mask substrate, a substrate processing apparatus, and a device manufacturing method capable of processing a substrate with good efficiency.

According to a first aspect of the present invention, a mask holding device is provided in a mask holding device including a holding portion that holds a pattern surface of a mask substrate in a cylindrical shape, and is carried in the mask substrate, and includes an adsorption device. To move the reticle substrate; moving the device such that the holding portion of the absorbing device and the reticle holding device relatively move in a circumferential direction of the cylindrical surface; and controlling the device to move the light with the moving device When the cover substrate is transferred from the adsorption device to the holding portion of the mask holding device, the adsorption state of the mask substrate of the adsorption device is changed in accordance with the relative movement position in the circumferential direction of the cylindrical surface.

According to a second aspect of the present invention, there is provided a reticle holding device which is a reticle substrate which is provided with a magnetic body and which is bendable along a cylindrical surface, and includes a movable member which is provided with a reticle conveying device carried in the reticle substrate a cylindrical surface of the cover substrate rotatable about a central axis of the cylindrical surface; a magnetic force generating device generating a magnetic force on the cylindrical surface; and a control device according to the reticle substrate carried by the reticle conveying device and the circle The relative position of the cylindrical surface controls the magnetic force generating means to control the distribution of the magnetic force on the cylindrical surface.

According to a third aspect of the present invention, there is provided a photomask holding device which is a photomask substrate which is formed by a substrate which is bent along a cylindrical surface and is made of a dielectric material, and includes a movable member having a movable member The reticle transfer device of the reticle substrate is disposed on the cylindrical surface of the reticle substrate and is rotatable about a central axis of the cylindrical surface; and the voltage applying device is configured to electrostatically adsorb the plurality of places disposed in the circumferential direction of the cylindrical surface Applying a voltage to the electrode member; and a control device that controls the voltage application device to control electrostatic adsorption on the cylindrical surface based on a relative position of the mask substrate carried by the mask transport device and the cylindrical surface of the movable member Distribution.

A fourth aspect of the present invention provides a photomask substrate comprising: a substrate which is bendable along a cylindrical surface; a pattern formed on the substrate; and a magnetic body provided on the substrate.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus comprising: a mask holding device that holds a pattern surface of a bendable mask substrate in a cylindrical shape; and a mask transfer device according to the first aspect.

A sixth aspect of the present invention provides a device manufacturing method comprising: a substrate processing apparatus according to a fifth aspect, an operation of exposing a pattern of the mask substrate to a substrate on which a photosensitive layer is formed; and using the substrate after the exposure The change of the light sensing layer and the action of subsequent processing are performed.

According to the aspect of the invention, it is possible to provide a mask transport apparatus, a mask holder, a mask substrate, a substrate processing apparatus, and a device manufacturing method which can perform processing of a substrate with good efficiency.

20‧‧‧Photomask holder

21‧‧‧Control device

22‧‧‧ Keeping Department

26‧‧‧ outer perimeter

27‧‧‧Magnetic generating device

28‧‧‧ center axis

32‧‧‧Electrical Stone

33‧‧‧Drive circuit

34‧‧‧Battery

40‧‧‧ Arm members

41‧‧‧Adsorption device

42‧‧‧Mobile devices

43‧‧‧Control device

44‧‧‧Adsorption surface

50‧‧‧Flexing and extension mechanism

51‧‧‧Y mobile agency

52‧‧‧Z mobile agency

53‧‧‧θ X moving mechanism

56‧‧‧ Pillars

57‧‧‧Connecting Department

58‧‧‧Support

59‧‧‧ Drive Department

60‧‧‧ Tracks

61‧‧‧ Body Department

62‧‧‧Shape detection device

63‧‧‧Alignment device

66, 67‧‧ ‧ adsorption department

82‧‧‧ alignment mark

84‧‧‧electrode pattern

AM‧‧‧Aligning microscope

BT1~BT3‧‧‧Processing tank

CONT‧‧‧ control device

DM‧‧‧Rotary tube

DR1, DR3, DR4, DR8, DR9‧‧‧ drive roller

DR2‧‧‧pressure roller

EPC1, EPC2, EPC3‧‧‧ edge position controller

EX‧‧‧Exposure device

FR1‧‧‧ supply roller

FG2‧‧‧Recycling roller

Gp1‧‧‧ Coating Agency

Gp2‧‧‧Drying mechanism

HA1‧‧‧Heating Space Department

HA2‧‧‧Cooling Space Department

IU‧‧‧Lighting unit

M‧‧‧Photo Mask

M1‧‧‧Substrate

M2‧‧‧ pattern

M3‧‧‧ magnetic body

MC‧‧‧Photomask

MC1‧‧‧ openings

ML‧‧‧Substrate transfer device

P‧‧‧Substrate

PL‧‧‧Projection Optics

U1~Un‧‧‧Processing device

ST‧‧‧Substrate stage

SYS‧‧‧ component manufacturing system

Fig. 1 is a view showing the configuration of a component manufacturing system of a first embodiment.

Fig. 2 is a view showing the configuration of a substrate processing apparatus (exposure apparatus) according to the first embodiment.

Fig. 3A is a view showing the configuration of a photomask according to the first embodiment.

Fig. 3B is a view showing the configuration of a photomask according to the first embodiment.

Fig. 4 is a view showing the configuration of a mask holding device according to the first embodiment.

Fig. 5 is a view showing the appearance of a holding portion of the mask holding device of the first embodiment.

Fig. 6 is a side view showing the configuration of the mask transporting apparatus of the first embodiment.

Fig. 7 is a plan view showing the configuration of the mask transporting apparatus of the first embodiment.

Fig. 8A is a view showing the configuration of an arm member of the mask transporting device of the first embodiment.

Fig. 8B is a view showing a configuration of an arm member of the mask transporting apparatus of the first embodiment.

Fig. 8C is a view showing the configuration of an arm member of the mask transporting apparatus of the first embodiment.

Fig. 9 is a side view showing the operation of the mask transport apparatus of the first embodiment.

Fig. 10 is a plan view showing the operation of the mask transporting apparatus of the first embodiment.

Fig. 11 is a view showing a method of attaching the reticle according to the first embodiment.

Fig. 12A is a view showing the configuration of a mask holding device of a second embodiment;

Fig. 12B is a view showing the configuration of the mask holding device of the second embodiment.

Fig. 13A is a view showing the appearance of a holding portion of a mask holding device according to a third embodiment.

Fig. 13B is a view showing the appearance of a holding portion of the mask holding device of the third embodiment.

Fig. 14 is a view showing a circuit configuration of a mask holding device according to a third embodiment.

Fig. 15 is a flow chart showing a method of manufacturing an element.

Next, an embodiment will be described. The same elements in the embodiments are denoted by the same reference numerals, and the description thereof is simplified or omitted.

"First Embodiment"

Fig. 1 is a view showing the configuration of a component manufacturing system SYS (flexible ‧ display manufacturing line) of the present embodiment. Here, the flexible substrate P (sheet) pulled out from the supply roller FR1 is shown The material, the film, and the like are sequentially wound up to the recovery roller FR2 via the n processing apparatuses U1, U2, U3, U4, U5, ... Un.

In FIG. 1, the orthogonal coordinate system XYZ sets the surface (or the back surface) of the substrate P to be perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (longitudinal direction) of the substrate P is set to the Y-axis direction. In the following description, the rotation direction around the X-axis direction is the θ X direction, and the rotation directions around the Y-axis direction and the Z-axis direction are set to the θ Y direction and the θ Z direction, respectively.

The substrate P wound around the supply roller FR1 is pulled out by the clamped drive roller DR1 and transported to the processing device U1. The center of the substrate P in the Y-axis direction (width direction) is servo-controlled by the edge position controller EPC1 so as to be within a range of ± ten μm to several tens of μm with respect to the target position.

The processing device U1 continuously or selectively applies a photosensitive functional liquid (photoresist, photosensitive coupling material, UV-curable resin liquid, or the like) to the transfer direction (longitudinal direction) of the substrate P on the surface of the substrate P by printing. Coating device. In the processing apparatus U1, a pressure roller DR2 for winding the substrate P, a coating mechanism Gp1 for uniformly coating a photosensitive functional liquid coating roller on the surface of the substrate P, and the like are provided. The drying mechanism Gp2 or the like which rapidly removes the solvent or water contained in the photosensitive functional liquid applied to the substrate P.

The processing device U2 is configured to heat the substrate P transferred from the processing device U1 to a predetermined temperature (for example, about several tens of degrees Celsius to 120° C.) so that the photosensitive functional layer coated on the surface reaches a stable heating device. The processing unit U2 is provided with a plurality of rollers for reversing the transport substrate P, an air-turn bar, a heating space portion HA1 for heating the loaded substrate P, and a temperature for heating the substrate P. The cooling space portion HA2 that matches the ambient temperature of the post-processing (processing device U3), and the clamped driving roller DR3 and the like are lowered.

The processing device U3 as the substrate processing apparatus includes the processing device U2 An exposure device that irradiates the photosensitive functional layer of the substrate P with the ultraviolet patterned light corresponding to the circuit pattern and the wiring pattern for the display. In the processing apparatus U3, an edge position controller EPC2 that controls the center of the substrate P in the Y-axis direction (width direction) at a constant position, a clamped drive roller DR4, and a substrate that is conveyed in the X-axis direction with a predetermined tension are provided. The substrate stage ST on which the back surface of the P is planarly supported by the layer of the air bearing, and the two sets of driving rollers DR6 and DR7 for imparting a predetermined slack DL to the substrate P.

Further, the sheet-shaped mask base is wound on the outer peripheral surface in the processing device U3. A plate (hereinafter referred to as a mask M) is rotated around a center line parallel to the Y-axis direction, and the mask M wound around the Y-axis direction is irradiated with the slit-shaped exposure illumination light that is wound in the Y-axis direction. The illumination unit IU projects the image of the partial pattern of the photomask wound around the rotating cylinder DM onto the projection optical system PL of a portion of the substrate P supported by the substrate stage ST in a planar manner, and the partial pattern of the projection is An alignment microscope AM that is formed in advance on the alignment mark of the substrate P, an reticle 可MC that can accommodate a plurality of reticle M, and a reticle to be exposed for exposure, such as alignment (alignment) with respect to the substrate P M removes the mask transport apparatus ML wound around the outer peripheral surface of the rotary cylinder DM from the mask 匣MC.

The detailed configuration and action of the processing device U3 shown in FIG. 1 will be left after In addition, the processing apparatus U3 is not limited to the projection system as long as it is an exposure apparatus which attaches the sheet mask M to the outer surface of the rotating cylinder DM as a cylindrical mask body. For example, the processing device U3 may be a proximity method in which the cylindrical mask body and the substrate P are close to each other with a predetermined gap (within tens of μm), or a contact of the substrate P around the outer circumference of the cylindrical mask body. Mode of exposure device.

When using such a proximity or contact type exposure device, in the rotating cylinder DM The illumination unit is disposed inside, and the illumination light can be radiated from the inside of the rotating cylinder DM toward the penetrating reticle of the outer peripheral surface. The configuration in which the illumination unit is disposed inside the rotary cylinder DM is also applicable to the projection method of projecting the pattern image of the mask M through the projection optical system PL.

Further, in the present embodiment, the transmissive mask M is wound around the rotary cylinder DM. Although it is a cylindrical mask body, the reflective mask M may be wound around the rotating cylinder DM as a cylindrical mask body. The reflective reticle M is formed, for example, by a high reflection portion and a low reflection portion. For example, when the reflective mask M is used, the exposure apparatus may illuminate the reflective mask M by epi-illumination, and the light emitted from the mask M may be projected onto the substrate P by the projection optical system PL.

The processing device U4 of Fig. 1 is a substrate P transferred from the processing device U3. The photosensitive functional layer is subjected to at least one wet processing apparatus of various wet treatments such as wet development treatment and electroless plating treatment. In the processing apparatus U4, three processing tanks BT1, BT2, and BT3 which are layered in the Z-axis direction, a plurality of rollers which are used to bend the substrate P, and the driven roller DR8 which are sandwiched are provided.

The processing device U5 heats the substrate P transferred from the processing device U4. The heating and drying apparatus which adjusts the moisture content of the board|substrate P wet by the wet process to a predetermined value is abbreviate|omitted. Thereafter, the substrate P of the final processing apparatus Un, which has been produced in series, is wound around the recovery roller FR2 through the clamped driving roller DR9 via a plurality of processing apparatuses. At the time of winding, in order to prevent the center of the substrate P in the Y-axis direction (width direction) or the substrate end in the Y-axis direction from being misaligned in the Y-axis direction, the control position of the control roller DR9 and the recovery roller FR2 are sequentially corrected by the edge position controller EPC3. The relative position of the Y-axis direction.

The upper control unit CONT system controls the devices constituting the operation of the processing units U1 to Un of the manufacturing line. The upper control unit CONT is also performed from each processing unit U1 to The monitoring of the processing status and processing status of Un, the monitoring of the transport status of the substrate P between the processing devices, the feedback correction based on the pre/post check/measurement results, and the feedforward correction.

The substrate P used in the present embodiment is made of, for example, a resin film or stainless steel. A foil made of a metal or an alloy. The material of the resin film includes, for example, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene vinyl copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, a polycarbonate resin. One or more of materials such as polystyrene resin and polyvinyl alcohol resin.

The substrate P may be selected to be deformed by heat in various processing processes. The coefficient of thermal expansion of the degree of neglect is not significantly greater. The coefficient of thermal expansion can be set, for example, by mixing the inorganic filler with the resin film to set a threshold value higher than the corresponding process temperature or the like. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, cerium oxide, and the like. In addition, the substrate P may be a very thin glass monomer having a thickness of about 100 μm manufactured by a floating method or the like, or a laminated body in which the above-mentioned resin film and aluminum foil are bonded to the ultra-thin glass. Further, the substrate P may be activated by modifying the surface of the substrate by a predetermined pretreatment or forming a fine partition structure (concave structure) for precise patterning on the surface.

The component manufacturing system SYS of this embodiment is a reverse or continuous implementation of the substrate P. Various treatments are applied to manufacture components (display panels, etc.). The substrate P subjected to various treatments is divided (cut) into a plurality of elements. The size of the substrate P is, for example, about 10 cm to 2 m in the width direction (the Y-axis direction of the short side) and 10 m or more in the longitudinal direction (the X-axis direction of the long side). The dimension of the substrate P in the width direction (the Y-axis direction of the short side) may be 10 cm or less or 2 m or more. The dimension of the longitudinal direction of the substrate P (the X-axis direction of the long side) may be 10 m or less.

Next, the configuration of the processing device U3 will be described in detail below. Figure 2 shows this A diagram showing the configuration of the processing apparatus U3 (exposure apparatus EX) of the embodiment.

The processing device U3 shown in FIG. 2 includes a substrate transfer device that transports a substrate The PT, the exposure device EX, the photomask 匣MC of the reticle M, and the reticle transfer device ML. The mask transport apparatus ML carries the photomask M stored in the mask 匣MC into the exposure apparatus EX. In the exposure apparatus EX, the mask M carried by the mask transfer apparatus ML is held, and the image formed in the pattern of the mask M is projected onto the board|substrate P.

Here, before describing each part of the processing apparatus U3, refer to FIG. 3A and FIG. 3B. The configuration of the mask M will be described. 3A is a plan view of the mask M of the embodiment, and FIG. 3B is a cross-sectional view orthogonal to the conveyance direction of the mask M.

The mask M shown in FIG. 3A is, for example, made into a transmissive planar sheet of light. The cover is substantially rectangular in a state of being developed into a planar shape. In the orthogonal coordinate system shown in FIGS. 3A and 3B, the Xa-axis direction corresponds to a direction parallel to one side (for example, a long side) of the mask M, and the Ya-axis direction and the other side of the mask M (for example, a short side). The parallel direction and the Za axis direction correspond to the thickness direction of the mask M, respectively.

The mask M has flexibility to be bendable along the cylindrical surface. Photomask M is wound The cylindrical surface (the rotating cylinder DM, see FIG. 5) which is parallel to the axis in the Ya-axis direction is provided in the exposure process in a state in which the side extending in the Xa-axis direction is curved in the circumferential direction of the cylindrical surface. The cylindrical surface refers to a curved surface (bus bar) that rotates around an axis parallel to the line segment, such as a cylindrical or cylindrical outer surface.

As shown in FIG. 3A, the mask M includes a substrate M1, a pattern M2 formed on the substrate M1, a magnetic body M3 formed on the substrate M1, and an alignment mark M4. The mask M is magnetically attracted by the magnetic body M3, thereby being held by various devices having a magnetic force generating source . The alignment mark M4 is used for alignment with various devices holding the mask M, and the like.

The substrate M1 is light projected onto the substrate P by a dielectric such as glass (exposure) Light is made of light and can be penetrated. The substrate M1 is, for example, an elongated ultra-thin glass plate (for example, having a thickness of 100 to 500 μm) which is excellent in flatness.

As shown in FIG. 3B, the pattern M2 is in the first surface M1a of the substrate M1 and the base The region (pattern formation region MA1) in which the material M1 is separated from the periphery is formed by a light shielding layer such as chromium. In the substrate M1, the pattern non-formation region MA2 of the pattern M2 is not formed, and is arranged in a frame shape (annular shape) around the pattern formation region MA1.

The magnetic body M3 is disposed on the first surface M1a of the substrate M1 (same as the pattern M2) The pattern of the face is not formed in the region MA2. The magnetic body M3 extends in a strip shape (the Xa-axis direction on the base material M1 and the transport direction of the mask M) corresponding to the circumferential direction of the cylindrical surface on which the mask M is placed, and is disposed in the direction corresponding to the cylindrical surface axis. Both ends of the direction (the Ya axis direction on the substrate M1). The magnetic body M3 is formed, for example, by forming a ferromagnetic material such as iron, nickel or cobalt on the substrate M1 by a vapor deposition method. Further, the alignment mark M4 may be formed of the same material as the magnetic material M3 and formed together with the magnetic body M3 when the magnetic body M3 is formed by the mask deposition method.

In the mask M, the magnet generation source is disposed on the first surface M1a side, and the magnetic body M3 is attracted to the magnetic force generation source, and the first surface M1a side is brought into contact with the magnetic force generation source side and held. In this case, the magnetic force can be directly applied to the magnetic body M3 without permeating the substrate M1, and the decrease in the adsorption force can be suppressed.

Further, the photomask M is also disposed on the second surface M1b opposite to the first surface M1a, and the magnetic material M3 is adsorbed to the magnetic force generating source through the substrate M1, and the second surface M1b side is in contact with the magnetic force generating source. Stayed sideways. In this case, since the second surface M1b side opposite to the pattern M2 is in contact with the magnetic force generating source side, contact between the pattern M2 and the magnetic force generating source side can be suppressed.

Further, the magnetic body M3 may be formed on the second surface M1b of the substrate M1 or formed. The square of the first surface M1a and the second surface M1b. When the magnetic body M3 is formed on the second surface M1b, when the mask M is adsorbed on the second surface M1b side, the decrease in the adsorption force can be suppressed, and the contact between the pattern M2 and the magnetic force generating source side can be suppressed.

Moreover, when the magnetic body M3 and the pattern M2 are formed on the same surface, the substrate can be used. The thickness direction of the M1 (the direction of the Za axis) is protruded from the pattern M2, and at this time, the pattern M2 can be suppressed from coming into contact with other members. Further, the mask M may include a pellicle having a gap with the pattern M2 and formed to cover the pattern M2. In this case, contact of the pattern M2 with other members can also be suppressed.

Moreover, the mask M can form a pattern for a panel corresponding to one display element. A pattern for a panel corresponding to a plurality of display elements may be formed in a body or a part. For example, the mask M may include a plurality of patterns arranged repeatedly in the Ya axis direction, or may include a plurality of patterns arranged in the Xa axis direction. Further, the mask M may include a pattern for a panel of the first display element and a pattern for a panel of the second display element different from the size of the first display element.

Referring back to FIG. 2, the substrate transfer device PT includes a roller 10 for supporting the substrate P, The first driving unit 11 of the driving roller 10, the first detecting unit 12 that outputs the position information of the substrate P, and the control device 13. The substrate stage ST shown in Fig. 1 is disposed, for example, between the rolls 10.

In the substrate transfer device PT, the support substrate P is rotationally driven by the first drive unit 11 The roller 10 transports (moves) the substrate P on the substrate stage ST. The substrate stage ST may be, for example, a part of the substrate transfer device PT or a part of the exposure device EX.

The first detecting unit 12 is formed by, for example, reading by optical or magnetic gas. The reference mark of the substrate P detects the position of the substrate P, and outputs the position information of the substrate P to the control device 13. Position information of the substrate P, including information on the position of the display substrate P, display substrate P At least one of information on the speed (transport speed) and information on the acceleration of the display substrate P. Further, the first detecting unit 12 may detect the rotational position of the roller 10 to detect the position of the substrate P.

The control device 13 controls the first drive unit 11 based on the position information output from the first detecting unit 12 to manage at least one of the position of the substrate P, the transport speed, and the transport acceleration. The control device 13 controls each unit of the substrate transfer device PT in accordance with, for example, a control command of the upper control device CONT.

The exposure apparatus EX includes a mask holding device 20 that holds the mask M, an illumination unit IU, a projection optical system PL, and a control device 21. The exposure apparatus EX is a so-called scanning exposure apparatus, and the substrate P is exposed while moving (rotating) the mask M held by the mask holding device 20 in synchronization with the conveyance of the substrate P of the substrate transfer apparatus PT.

The mask holding device 20 includes a rotating drum DM including a mask M for holding the holding portion 22 of the mask M, a second driving unit 23 for rotating the rotating drum DM, and a position information of the output rotating drum DM. 2 detection unit 24. The control device 21 of the exposure device EX also serves as a control device for the mask holding device 20, and controls each unit of the mask holding device 20. The control device of the mask holding device 20 may be separately provided from the control device 21 of the exposure device EX.

The second detecting unit 24 includes, for example, a rotary encoder, and optically detects the position of the rotating drum DM. The second detecting unit 24 outputs the position information of the rotary cylinder DM to the control device 21 based on the detection result. The position information of the rotary cylinder DM includes at least one of information indicating the position of the rotary cylinder DM, information indicating the speed (angular velocity) of the rotary cylinder DM, and information indicating the acceleration (angular acceleration) of the rotary cylinder DM.

The second drive unit 23 includes an actuator such as an electric motor, and is controlled by the control device 21 to rotate the rotary drum DM. The control device 21 outputs the position based on the second detecting unit 24. The second drive unit 23 is controlled to control at least one of the position, speed, and acceleration of the rotary drum DM. The control device 21 controls the second drive unit 23 in accordance with, for example, a control command of the upper control unit CONT, so that the mask M disposed in the rotary cylinder DM and the substrate P transported by the substrate transport apparatus PT are synchronously moved (synchronized rotation). Further, the second drive unit 23 can move the rotary drum DM in each of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ Z direction. For example, the second driving unit 23 can finely adjust the position of the rotating drum DM by aligning the position of the reticle to the rotating drum DM, aligning the position of the rotating drum DM with the substrate stage ST, and the like.

The illumination unit IU comprises a light source 25 and an illumination optics IL. The light source contains, for example A light source such as a mercury lamp or a solid light source such as a laser diode or a light emitting diode (LED). The illumination light emitted from the light source is, for example, a far-ultraviolet light (DUV light) such as a bright line (g line, h line, i line), KrF excimer laser light (wavelength 248 nm), or ArF excimer laser light (wavelength 193 nm). The illumination optical system is composed of any one of a refractive system, a catadioptric system, and a reflection system. The illumination optical system IL includes a uniform optical system that uniformizes the illuminance distribution of the illumination light emitted from the light source, and illuminates a portion (illumination region IR) of the mask M held by the mask holding device 20 with uniform brightness. The homogenizing optical system includes, for example, a fly-eye lens array or a rod lens.

The projection optical system PL will be part of the reticle M illuminated by the illumination unit IU For example, it is projected onto the substrate P conveyed by the substrate transfer device PT. The projection optical system is composed of any one of a refractive system, a catadioptric system, and a reflection system. The exposure device EX is changed by a portion that is disposed on the mask M of the illumination region IR as the mask M moves, or a portion that is disposed on the substrate P of the projection region PA as the substrate P moves. The image of the predetermined pattern (mask pattern) on the mask M is projected (scanned and exposed) to the substrate P.

The control device 21 includes, for example, a computer system. Computer system, including for example CPU And a variety of memory and OS, peripheral equipment and other hardware. The operation process of each part of the processing device is stored in a program-readable recording medium on a computer, and the program is read and implemented by the computer system, and various processes are performed. When the computer system can be connected to the Internet or an internal network system, it also includes the environment (or display environment) provided by the home page. In addition, the computer readable recording medium includes a removable medium such as a floppy disk, an optical disk, a ROM, a CD-ROM, and a hard disk built in a computer system. A computer-readable recording medium, which also contains a communication line such as a network via a network such as the Internet and a telephone line, and is a server that maintains the program in a short period of time, and the server and the client at this time. The volatility memory inside the computer system is kept for a certain period of time. Further, the program may be part of the function of the processing device U3, or may be combined with a program already recorded in the computer system to implement the function of the processing device U3.

Further, the control device 21 may be the component manufacturing system SYS shown in FIG. Part or all of the upper control unit CONT. Further, the control device 21 of the exposure device EX may also serve as a control device for the device other than the exposure device EX in the component manufacturing system SYS. For example, the control device 21 can also control the substrate transfer device PT. At least one of various control devices (for example, the higher-level control device CONT) included in the component manufacturing system SYS can be realized by a computer system similarly to the control device 21.

Moreover, the exposure apparatus EX shown in FIG. 2 is substantially planar on the substrate P. In the state of the image, the pattern image is projected onto the planar projection area on the substrate P. However, for example, the exposure apparatus EX may project the pattern image onto the cylindrical planar projection area on the substrate P in a state where the substrate P is bent into a cylindrical shape on the roller of the substrate transfer apparatus PT. Further, the substrate transfer device PT may be configured to transport the substrate P along the projection area PA of the projection optical system PL. change. Further, at least one portion of the substrate transfer device PT may be a part of the exposure device EX.

Next, the mask holding device 20 will be described in detail with reference to FIGS. 4 and 5. 4 is a view showing the configuration of the mask holding device 20, and FIG. 5 is a view showing the appearance of the rotating drum DM of the mask holding device 20.

The mask holding device 20 shown in FIG. 4 magnetically changes the mask M by magnetic force. The body M3 (see FIGS. 3A and 3B) is adsorbed to the holding portion 22 to hold the mask M. The holding portion 22 has a rotating cylinder DM having a peripheral surface 26 on which the mask M is disposed, and a magnetic force generating device 27 that generates a magnetic force on the outer peripheral surface 26.

The rotary cylinder DM is supported to be rotatable about its central axis 28 (rotational axis) member. The rotating cylinder DM has a cylindrical shape having a constant thickness, and the outer peripheral surface 26 has a cylindrical surface shape. As shown in FIG. 5, the rotary cylinder DM includes an end portion 30 including an end in the Y-axis direction parallel to the central axis 28, and a central portion 31 excluding the end portion 30. The mask M (refer to FIG. 3A and FIG. 3B) is disposed in the rotating cylinder DM such that the pattern M2 overlaps the central portion 31 of the rotating cylinder DM without overlapping the end portion 30. The rotating cylinder DM is made of, for example, glass, quartz, or the like, and the central portion 31 overlapping the pattern of the mask M as viewed from the radial direction of the rotating cylinder DM is translucent to the illumination light. The rotating cylinder DM, the end portion 30 and the central portion 31 are integrally formed of the same material.

The magnetic force generating device 27 includes an electromagnet 32, a drive circuit 33, and electric power accumulation. Department (hereinafter referred to as battery 34). The battery 34 supplies electric power to the electromagnet 32 through the drive circuit 33, and the electromagnet 32 generates a magnetic force corresponding to the supplied electric power. The control device 21 of the exposure device EX controls the drive circuit 33 to control the presence or absence of the magnetic force generated by the electromagnet 32 and the strength of the magnetic force generated by the electromagnet 32.

Electromagnet 32, which is magnetically generated by electromagnet 32, can act on rotating drum DM The degree of the surface of the outer peripheral surface 26 is disposed near the surface of the outer peripheral surface 26. As shown in FIG. 5, the electromagnets 32 are disposed at the respective end portions 30 of the rotating cylinder DM in the Y-axis direction. The mask M (see FIGS. 3A and 3B ) is aligned so that the magnetic body M3 overlaps the electromagnet 32 when viewed from the radial direction of the rotating cylinder DM and is held by the holding portion 22 . The holding portion 22 includes a plurality of electromagnets 32, and a plurality of electromagnets 32 are discretely arranged in the circumferential direction of the rotating cylinder DM. The electromagnet 32 is fixed, for example, inside the hole formed in the rotary cylinder DM, and moves (rotates) as the rotary cylinder DM rotates.

Further, the hole portion of the electromagnet 32 may be disposed in the rotating cylinder DM, and may be formed from the inner circumferential surface 35 (see FIG. 5) of the rotating cylinder DM toward the outer circumferential surface 26, or may be formed from the outer circumferential surface 26 toward the inner circumferential surface 35. It may be formed from the end face 36 side (see FIG. 5) in the direction parallel to the central axis 28. Further, the hole portion of the electromagnet 32 is disposed in the rotary cylinder DM, and may be filled with a filler such as a resin. Further, the electromagnet 32 can be fixed to the outer peripheral surface 26 or the inner peripheral surface 35 of the rotary cylinder DM.

Drive circuit 33 is electrically coupled to each of a plurality of electromagnets 32 and is also electrically coupled to battery 34. The drive circuit 33 and the battery 34 are attached to the inner peripheral surface 35 of the end portion 30 of the rotary cylinder DM shown in Fig. 5, for example. The electromagnet 32, the drive circuit 33, and the battery 34 are, for example, in such a manner that the center of gravity of the rotating drum DM is placed on the center shaft 28, and the weight balance arrangement is considered. The drive circuit 33 receives power supply from the battery 34 and supplies power to each of the plurality of electromagnets 32 independently.

The control device 21 of the exposure device EX supplies a control signal (control command) to the drive circuit 33 in a wired or wireless manner, thereby controlling the drive circuit 33. The control device 21 controls the drive circuit 33 to control whether one or both of the power or the amount of power supplied to each of the plurality of electromagnets 32 is supplied. That is, the control device 21 controls the intensity of the magnetic force generated from each of the plurality of electromagnets 32 (including the case where the magnetic force is 0).

Further, one or two or more elements disposed inside the rotary cylinder DM can be fixed to the outside of the rotary cylinder DM. For example, when at least a part of the optical system (illumination optical system IL, projection optical system PL) of the exposure apparatus EX is disposed, an optical member or the like disposed inside the rotary cylinder DM can be fixed to the outside of the rotary cylinder DM. Further, one or both of the drive circuit 33 of the magnetic force generating device 27 and the battery 34 may be fixed to the outside of the rotary cylinder DM. In this case, the electrical connection to the electromagnet 32 or the like may be a connection through a contact such as a brush, or may be a connection such as non-contact power transmission (contactless power transmission) by electromagnetic mutual induction.

Next, the mask transfer apparatus ML and the mask 匣MC shown in Fig. 2 will be described. Fig. 6 is a side view showing the configuration of the mask transporting apparatus ML and the mask 匣MC of the embodiment. Fig. 7 is a plan view showing the configuration of the mask transporting apparatus ML and the mask 匣MC of the embodiment.

The mask 匣MC is a reticle storage device for storing a plurality of reticle M. The mask 匣MC includes, for example, an adsorption portion that adsorbs the mask M, and holds the mask M by the adsorption force of the adsorption portion. The adsorption portion of the mask 匣MC adsorbs the pattern non-formation region MA2 of the mask M shown in FIG. 3B by at least one adsorption force of pressure, magnetic force, and electrostatic force. The mask 匣MC may also be a pattern non-formation area MA2 that holds the mask M.

The adsorption portion of the mask 匣 MC is, for example, discrete or continuous in the horizontal direction (X-axis direction). Such a mask 匣MC (see FIG. 6) is, for example, a planar mask M parallel to the vertical direction (Z-axis direction), and the magnetic body M3 of the mask M is parallel to the horizontal direction (magnetism of the mask M) The extension direction of the body M3 is the X-axis direction), and the mask M is held.

Further, the mask 匣MC (see FIG. 7) holds the mask M so that the pattern M2 of the mask M does not come into contact with the other mask M and the mask 匣MC. Here, the mask 匣MC (see FIG. 7) holds the mask M in such a manner that a plurality of masks M are arranged in the horizontal direction (Y-axis direction). Light The cover 匣MC can also be separated and held in a vertical direction by a plurality of reticle M.

The mask 匣MC has an opening MC1 in a direction (X-axis direction) in which the magnetic body M3 extends while holding the mask M. The mask 匣MC can carry the mask M from the outside of the mask 匣MC through the opening MC1, or carry the mask M out to the outside through the opening MC1 from the inside.

The upper position control device CONT shown in Fig. 2 controls the absorbing force of the reticle cymbal MC to release the ejector M when the reticle M is carried out from the reticle 匣MC. Further, when the mask M is carried into the mask 匣MC, the upper control unit CONT controls the suction force of the mask 匣MC to hold the reticle M carried therein.

In addition, the mask 匣MC can be stored as long as it can store the reticle M, and its configuration can be changed as appropriate. The mask 匣MC may be a device external to the processing device U3, may be a storage box that does not include electrical components, or may be omitted.

As shown in FIG. 6, the mask transport apparatus ML includes the adsorption device 41 having the arm member 40 that adsorbs the mask M, and the moving device 42 and the control device that relatively move the arm member 40 and the holding portion 22 of the mask holder 20. 43. The arm member 40 of the adsorption device 41 has a planar adsorption surface 44 (see FIG. 7), and the mask M is held in a planar shape along the adsorption surface 44. The control device 43 controls the adsorption device 41 to control the adsorption force of the arm member 40 while controlling the movement device 42 to control the position of the arm member 40.

The mask transport apparatus ML can control, adsorb, and release the mask M at a desired position by the control unit 43 controlling the adsorption unit 41 and the moving unit 42. For example, the mask transport apparatus ML adsorbs the mask M stored in the mask 匣MC, and transports it to the rotary cylinder DM of the mask holder 20 while holding the mask M, and carries the mask M into the mask. Holding device 20. Further, the mask transport apparatus ML adsorbs the mask M held by the mask holding device 20, and carries the mask M out of the mask holder 20. As described above, the mask transport apparatus ML also serves as a mask carry-in device and a mask carry-out device.

The mask transport device ML moves the mask M that is adsorbed by the adsorption device 41 to The movement of the rotating drum DM in the circumferential direction is carried into the mask holding device 20. Corresponding to the "direction of the circumferential direction of the rotating cylinder DM" means, for example, a direction parallel to the tangent plane of the outer peripheral surface 26 of the rotating cylinder DM and orthogonal to the central axis 28 of the rotating drum DM. The "one of the predetermined tangential planes" is selected from the tangent planes of the respective positions of the outer peripheral surface 26 of the rotary cylinder DM, and is set to a horizontal plane orthogonal to the vertical direction (Z-axis direction) (with the XY plane). Parallel side). In other words, when the central axis 28 of the rotating cylinder DM is parallel to the Y-axis direction and the predetermined tangent plane is parallel to the XY plane, the direction corresponding to the circumferential direction of the rotating cylinder DM is the X-axis direction.

The mobile device 42 is provided with a flexing and extension mechanism 50, a Y moving mechanism 51, and a Z moving machine. Structure 52 and θ X moving mechanism 53. The arm member 40 of the adsorption device 41 is supported by the flexion and extension mechanism 50 through the θ X moving mechanism 53. The flexing and stretching mechanism 50 is supported by the Y moving mechanism 51 through the Z moving mechanism 52.

The Y moving mechanism 51 makes the portion from the Z moving mechanism 52 to the arm member 40 Move in the Y-axis direction. The Z moving mechanism 52 moves a portion from the flexing mechanism 50 to the arm member 40 in the Z-axis direction. The flexing and stretching mechanism 50 moves the θ X moving mechanism 53 and the arm member 40 in a direction parallel to the XY plane, and further rotates the θ X moving mechanism 53 and the arm member 40 about an axis (θ Z direction) intersecting the XY plane. The θ X moving mechanism 53 rotates the arm member 40 about an axis parallel to the XY plane. The control device 43 controls the respective positions of the arm member 40 in the X-axis direction, the Y-axis direction, and the Z-axis direction, and the θ Z-direction rotational position (yawing) of the arm member 40 by controlling each mechanism of the moving device 42. And the inclination of the arm member 40 with respect to the XY plane.

Next, each part of the mobile device 42 will be described in detail. Figure 7 shows the flexion and extension mechanism 50 is bent in a direction substantially parallel to a tangent plane (XY plane) of the outer peripheral surface 26 of the rotary cylinder DM. One end of the flexing and extension mechanism 50 is connected to the θ X moving mechanism 53 (arm member 40), and the other end of the flexing and stretching mechanism 50 is connected to the Z moving mechanism 52. The flexion and extension mechanism 50 is linearly bent and bent into a curved shape (flexing and stretching motion) to move the arm member 40 in a direction parallel to the XY plane.

The flexing and stretching mechanism 50 is provided with a plurality of pillar portions 56 (56a to 56e) and a connecting branch A plurality of connecting portions 57 (57a to 57e) of the column portion 56. Each of the plurality of pillar portions 56 is, for example, a rod shape extending in a direction parallel to the XY plane. Here, although the number of pillar portions is five, the number of pillar portions is not limited. Each of the connecting portions 57 is connected to the other pillar portion 56, the θ X moving mechanism 53 or the Z moving mechanism 52 so that the pillar portion 56 connected to the connecting portion 57 can be rotated in the θ Z direction.

In detail, the first pillar portion 56a has one end portion and the θ X moving mechanism 53 (arm structure) The member 40) is connected and the other end is connected to the first connecting portion 57a. The second pillar portion 56b is connected to the first pillar portion 56a via the first connecting portion 57a. Similarly, the second pillar portion 56b is connected to the third pillar portion 56c via the second connecting portion 57b. The third pillar portion 56c, the fourth pillar portion 56d, and the fifth pillar portion 56e are connected to each other through the third connecting portion 57c and the fourth connecting portion 57d. The fifth pillar portion 56e is connected to the Z moving mechanism 52 through the fifth connecting portion 57e.

Each of the plurality of connecting portions 57 includes an actuator such as an electric motor, and the connected pillar portion 56 is rotated by the operation of the actuator. For example, the first connecting portion 57a is supported by the second pillar portion 56b, and the first pillar portion 56a is rotated in the θZ direction about the first connecting portion 57a. Further, the fifth connecting portion 57e is supported by the Z moving mechanism 52, and the fifth leg portion 56e is connected to the fifth link. The joint portion 57e is rotated centrally in the θ Z direction.

Here, in a state where the second pillar portion 56b to the fifth pillar portion 56e are not rotated from the second connecting portion 57b to the fifth connecting portion 57e, the first connecting portion 57a rotates the first pillar portion 56a counterclockwise. The situation. At this time, the arm member 40 connected to the first pillar portion 56a moves so as to form an arc in the counterclockwise direction in the θ Z direction around the first connecting portion 57a. As a result, the arm member 40 moves in the -X axis direction and the +Y axis direction, and the rotation angle (yawing, posture) in the θ Z direction changes.

In the state where the first link portion 56a is rotated counterclockwise in the first connecting portion 57a, the third link portion 57c rotates the third post portion 56c clockwise. In this case, the arm member 40 moves from the third pillar portion 56c to the arm member 40, that is, the third connecting portion 57c as a center of rotation, and clockwise in the θZ direction. As a result, the arm member 40 moves in the +X axis direction and the -Y axis direction, and the rotation angle in the θ Z direction changes to cancel the rotation angle change in the θ Z direction by the first connecting portion 57a.

In addition, the moving device 42 may be rotationally symmetrical (for example, S-shaped) around the third connecting portion 57c from the second pillar portion 56b, and may be coordinated by a plurality of connecting portions 57. In the operation, when the rotational position in the θ Z direction and the position in the Y-axis direction do not change, the arm member 40 is moved in a straight line substantially parallel to the X-axis direction. As described above, the flexing and stretching mechanism 50 has the first moving portion that moves the arm member 40 of the adsorption device 41 in a direction parallel to the tangent plane of the cylindrical surface of the holding portion 22, and the axis that intersects the cutting plane to adsorb The function of the second moving portion in which the arm member 40 of the device 41 rotates. Moreover, the control device 43 controls the rotation angles of the arm member 40 in the X-axis direction coordinate, the Y-axis direction coordinate, and the θ Z direction by controlling the respective actuators of the first connection portion 57a to the fifth connection portion 57e.

The θ X moving mechanism 53 supports the arm member 40 such that the arm member 40 is relatively bent and extended 50 rotations. For example, the θ X moving mechanism 53 can rotate the arm member 40 in the θ X direction when the flexing and stretching mechanism 50 extends in the X-axis direction, and the arm member 40 in the θ Y direction when the flexing and stretching mechanism 50 extends in the Y-axis direction. Rotate. The control device 43 controls the θ X moving mechanism 53 to control the rotation angle of the arm member 40, thereby controlling the inclination (tilt, posture) of the reticle M held by the arm member 40 with respect to the XY plane.

As shown in FIG. 6, the Z moving mechanism 52 is provided with a support portion that supports the flexion and extension mechanism 50. 58 and a drive unit 59 that drives the support portion 58 in the Z-axis direction. The control device 43 controls the position of the arm member 40 in the Z-axis direction by controlling the driving portion 59. According to this, the control device 43 can make the mask M that is adsorbed to the arm member 40 in a planar shape, for example, in the normal direction (Z-axis direction), approaching or leaving the rotating cylinder DM.

As shown in FIG. 7 (and FIG. 6), the Y moving mechanism 51 is provided to extend and rotate with the DM A pair of rail portions 60 (guide members) in which the center axis 28 is parallel (the Y-axis direction) and a body portion 61 that moves along the rail portion 60 (guided). The body portion 61 moves together with the support portion 58 of the Z moving mechanism 52 in the Y-axis direction. The control device 43 controls the position of the arm member 40 in the Y-axis direction by controlling the Y moving mechanism 51.

However, the position of the arm member 40 may be an arm member that is performed by the flexion and extension mechanism 50. The movement of 40, and the change in the X-axis direction and the Y-axis direction. The moving device 42 can linearly move the arm member 40 substantially parallel to the X-axis direction by shifting the Y moving mechanism 51 in the Y-axis direction in order to cancel the change in the Y-axis coordinate of the arm member 40 by the flexing mechanism 50. That is, the flexing and stretching mechanism 50 and the Y moving mechanism 51 also have a direction parallel to the central axis 28 of the rotating cylinder DM and parallel to the tangent plane (XY plane) of the rotating cylinder DM (X-axis direction), so that the arm structure The function of the linear drive source of the member 40 moving in a substantially parallel straight line. When the arm member 40 is linearly moved in the X-axis direction, the control device 43 associates the amount of movement of the arm member 40 by the flexing mechanism 50 with the amount of movement of the arm member 40 by the Y moving mechanism 51 to control the flexing and extension mechanism 50 and Y moving mechanism 51.

The processing device U3, as shown in FIG. 6, is provided to detect that it is adsorbed to the arm member A shape detecting device 62 of a shape of a mask M of 40. The shape detecting device 62 optically detects the shape of the mask M, for example. The detection result of the shape detecting device 62 is used to determine, for example, whether or not the amount of deformation (bending, slack) of the mask M adsorbed to the arm member 40 is within an allowable range. This determination can be performed, for example, by an operator, or by the shape detecting device 62 or another device of the processing device U3.

Moreover, the processing device U3 is provided with an alignment mark M4 formed on the mask M (see Alignment device 63 of Figure 3A). The alignment device 63 optically detects the relative positional relationship between the alignment mark M4 formed in the mask M and the rotating cylinder DM of the mask holding device 20. The detection result of the alignment device 63 is used, for example, for alignment of the mask M when it is carried into the mask holding device 20.

Next, the adsorption device will be described with reference to FIGS. 8A, 8B, and 8C. The composition of the arm member 40 of 41. Fig. 8A is a view showing the configuration of the arm member 40 as seen from the Zb axis direction. Fig. 8B is a configuration view of the arm member 40 as seen from the Yb axis direction. Fig. 8C is a view showing the configuration of the arm member 40 as seen from the Xb-axis direction. Further, the Xb-axis direction, the Yb-axis direction, and the Zb-axis direction shown in FIGS. 8A to 8C correspond to the Xa-axis direction, the Ya-axis direction, and the Za-axis direction shown in FIGS. 3A and 3B, respectively.

The arm member 40 has a parallel plane to the tangent plane of the outer peripheral surface 26 of the rotating cylinder DM. And an adsorption surface extending in the Xb-axis direction corresponding to the direction orthogonal to the central axis 28 (for example, the X-axis direction) 44.

As shown in FIG. 8A, the adsorption surface 44 is disposed at both end portions 40b of the arm member 40 in the Yb-axis direction.

The mask M shown in FIGS. 3A and 3B can, for example, incorporate the entire pattern M2 into the central portion 40a except the end portion 40b of the arm member 40, and is sized and shaped to set the pattern M2 of the mask M. In the state in which all of the central portion 40a is incorporated, at least a part of the pattern non-formation region MA2 protrudes from the adsorption surface 44 (end portion 40b).

The arm member 40 includes an observation window 65 disposed on the adsorption surface 44. The observation window 65 is, for example, a through hole provided in the arm member 40, and is provided so that the alignment mark M4 of the mask M can be observed through the observation window 65 from the side opposite to the suction surface 44 of the arm member 40. Further, the arm member 40 can be formed of a material having a light transmissive property in which the alignment mark M4 of the mask M can be observed by the penetrable arm member 40, and the observation window 65 can be omitted at this time.

The arm member 40 is provided with a plurality of adsorption portions 66 (66a to 66e) and 67 (67a to 67e). The plurality of adsorption portions 66 are disposed on the adsorption surface 44 on the +Yb axis side with respect to the central portion 40a, and the plurality of adsorption portions 67 are disposed on the adsorption surface 44 on the -Yb axis side with respect to the central portion 40a. Here, each of the plurality of adsorption portions 66 is referred to as a first adsorption portion 66a and a second adsorption portion 66b from the +Xb axis side to the -Xb axis side, and is also referred to as a plurality of adsorption portions 67. The first adsorption unit 67a and the second adsorption unit 67b.

The first adsorption unit 66a is in one-to-one correspondence with the first adsorption unit 67a, and the coordinates in the Xb-axis direction are substantially the same. Similarly, each of the plurality of adsorption portions 67 corresponds to one-to-one of the plurality of adsorption portions 66, and is one of the correspondence portions, and the coordinates of the adsorption portion are substantially the same in the Xb-axis direction.

As shown in FIG. 8B, each of the plurality of adsorption portions 66 has: on the adsorption surface A hole portion 68 having an opening, a three-way valve 69 connected to the hole portion 68, a first valve that is connected to the hole portion 68 through the three-way valve 69, and a first flow path 71 that connects the first valve and the suction device 70 And the second valve passing through the three-way valve 69 is connected to the second flow path 72 of the hole portion 68.

The suction device 70 (decompression device) is open to the first valve of the three-way valve 69 Then, the inside of the hole portion 68 can be sucked through the first flow path 71 and the three-way valve 69, whereby the inside of the hole portion 68 can be decompressed. For example, the second flow path 72 is opened to the atmosphere, and the inside of the hole portion 68 that has been decompressed is opened to the atmosphere (boosting) while the second valve of the three-way valve 69 is open. The second flow path 72 may be connected to a delivery device (pressurizing device) for delivering a gas, and the delivery device may supply the gas to the inside of the hole portion 68 through the second flow path 72 and the second valve of the three-way valve 69. The inside of the hole portion 68 is boosted.

As shown in FIG. 8C, each of the first adsorption unit 66a and the first adsorption unit 67a has its own The hole portion 68 is connected to the same three-way valve 69 through the third flow path 73, and the first adsorption portion 66a and the first adsorption portion 67a simultaneously reduce or increase the pressure inside the hole portion 68. In addition, the first adsorption unit 66a and the first adsorption unit 67a are provided to use the first flow path 71 and the second flow path 72 in common, and the first adsorption portion 66a and the first adsorption portion 67a are used to press the inside of the hole portion 68. Roughly the same. As described above, one of the plurality of adsorption portions 66 and 67 is in the corresponding relationship with the adsorption portion, and the three-way valve 69, the first flow path 71, and the second flow path 72 are common.

The control device 43 can control the first one for each of the plurality of three-way valves 69. The valve connects the hole portions 68 and the suction device 70 through the three-way valve 69 and the first flow path 71, and the suction device 70 controls the inside of the hole portion 68 to independently decompress the respective hole portions 68. When the mask M is placed in the vicinity of the plurality of adsorption portions 66 and 67, when the inside of the hole portion 68 is decompressed, The mask M is sucked toward the hole portion 68 to contact the adsorption surface 44, and is held by the arm member 40. In other words, the mask M is adsorbed to the arm member 40 with the pressure difference between the inside and the outside of the hole portion 68 as an adsorption force.

Further, as shown in FIG. 8C, the arm member 40 is disposed on the adsorption surface in the Yb-axis direction. The central portion 40a between the 44 is recessed from the suction surface 44 (the central portion 40a of the arm member 40 is recessed from the outside in the Zb-axis direction). Therefore, when the first surface M1a side of the mask M on which the pattern M2 is formed is adsorbed to the adsorption surface 44, the pattern M2 does not contact the arm member 40. As a result, it is possible to prevent the pattern M2 from being damaged due to contact or the like.

Moreover, the control device 43 controls the second valve of the three-way valve 69 to pass through the three-way valve. The 69 and the second flow path 72 open the hole portion 68 to the atmosphere, and pressurize the inside of the hole portion 68 in a reduced pressure state. When the inside of the hole portion 68 of the adsorption portion 66 of the absorbing mask M is pressurized, the pressure difference between the inside and the outside of the hole portion 68 is reduced, and the adsorption force of the absorbing portion 66 is reduced.

Moreover, the control device 43 can control the plurality of three-way valves 69 independently, and the hole portion can be The pressure inside the 68 is independently controlled by the respective hole portions 68 connected to the respective three-way valves 69. For example, a plurality of adsorption portions 66 and 67 shown in FIG. 8B are attached to the photomask M. In this case, the control device 43 can open only the plurality of adsorption units 66 by only opening the third valve of the three-way valve 69 of the plurality of adsorption units 66 and 67 and the three-way valve 69 of the first adsorption unit 66a. The adsorption of the first adsorption portion 66a in the adsorption. Here, the first adsorption unit 67a (see FIG. 8C) that is paired with the first adsorption unit 66a is opened, and the second valve of the three-way valve 69 that is common to the first adsorption unit 66a is in an open state. 66a stops adsorption as well.

As described above, the control device 43 can cause the plurality of adsorption portions 66 to suck The space distribution and the temporal distribution change of the attachment force may be, for example, only one portion of the mask M is adsorbed to the arm member 40, or the adsorption of a portion of the mask M to be adsorbed is released. In addition, the control device 43 The adsorption of the plurality of adsorption portions 66 can be started at the same time, and the adsorption of the plurality of adsorption portions 66 can be simultaneously cancelled.

Next, the operation of the mask transporting device ML and the mask holding device 20 will be described. First, an operation of transporting the mask M from the mask 匣MC to the vicinity of the rotary cylinder DM will be described with reference to FIGS. 9 and 10 .

Fig. 9 is a view showing the processing device U3 viewed from a direction (Y-axis direction) parallel to the central axis 28 of the rotary cylinder DM. Fig. 10 is a view showing the processing device U3 as viewed from the normal direction (Z-axis direction) of the tangent plane of the rotary cylinder DM. 9(A) and FIG. 10(A) are views showing the same state from different viewpoints. 9(B) is the same as FIG. 10(B), FIG. 9(C), FIG. 10(C), FIG. 9(D) and FIG. 10(D), respectively.

When the mask M is carried into the mask holding device 20, the processing device U3 (see FIGS. 9(A) and 10(A)) moves the arm member 40 to the storage position (mask 匣 MC) of the mask M. Hereinafter, the mask M to be carried into the mask holding device 20 will be simply referred to as the target mask M.

Here, the control device 43 of the mask transport apparatus ML controls the θ X moving mechanism 53 to adjust the posture of the arm member 40 from the state shown in FIG. 7, for example, the suction surface 44 of the arm member 40 and the mask 匣MC. The masks M stored therein are substantially parallel. Further, for example, the control device 43 controls the Y moving mechanism 51 to move the arm member 40 in the Y-axis direction from the state shown in FIG. 7, and positions the Y-axis direction of the suction surface 44 of the arm member 40 and the Y of the target mask M. The axial direction is aligned (for example, the coordinates in the Y-axis direction are approximately the same).

Next, the control device 43 controls the flexion and extension mechanism 50 and the Y moving mechanism 51 to extend the flexion and extension mechanism 50, and moves the flexion and extension mechanism 50 in the Y-axis direction by the Y moving mechanism 51, whereby the arm member 40 is moved substantially linearly in the X-axis direction. In this manner, the arm member 40 is aligned so as to pass through the opening MC1 on the side surface of the mask 匣MC, and the adsorption surface 44 of the arm member 40 faces the target mask M.

Next, the upper position control device CONT shown in FIG. 2 controls the adsorption device 41 through the control device 43 of the mask transfer device ML to cause the target mask M to be adsorbed to the arm member 40. Further, the mask 匣MC is controlled to release the holding of the mask M by the mask 匣MC. As shown in FIG. 8B and FIG. 8C, the target mask M is formed in a substantially planar shape by the adsorption surface 44 adsorbed to the arm member 40.

Next, the processing device (see FIGS. 9(B) and 10(B)) carries the target mask M out of the mask 匣MC. At this time, the control device 43 controls the flexion and extension mechanism 50 to bend the flexion and extension mechanism 50 to move the arm member 40 in the -X-axis direction. The control device 43 controls the flexing mechanism 50 and the Y moving mechanism 51 at least until the target mask M is carried out from the mask 匣MC, so that the arm member 40 linearly moves in the X-axis direction. In the mask transfer apparatus ML, the target mask M can be carried out to the outside through the opening MC1 of the mask 匣 MC when the pattern M2 does not come into contact with the mask 匣 MC, which is the other mask M.

Next, the processing apparatus U3 (see FIGS. 9(C) and 10(C)) causes the mask M held by the arm member 40 to be substantially parallel to the tangent plane (XY plane) of the rotating cylinder DM.

At this time, the control device 43 of the mask transport apparatus ML controls the θ X moving mechanism 53 to rotate the arm member 40 in the θ X direction.

As shown in Fig. 9(C), the shape detecting device 62 measures the shape of the mask M in a state where the mask M held by the arm member 40 and the tangential plane (XY plane) of the rotating cylinder DM are substantially parallel. . In other words, the shape detecting device 62 measures the shape of the target mask M in a state in which the target mask M and the mask holder 20 are moved in the same posture (inclination with respect to the XY plane).

Then, based on the measurement result of the shape detecting device 62, for example, it is determined whether or not the bending of the mask M held by the arm member 40 is within a predetermined allowable range. Here, when it is determined that the bending of the mask M exceeds the allowable range, the mask M is removed from the arm member 40, The mask M or the mask M having the same pattern M2 is held back to the arm member 40.

Further, when it is determined that the curvature of the mask M held by the arm member 40 is allowed In the range, the processing apparatus U3 (see FIGS. 9(D) and 10(D)) is disposed at a position where the mask M held by the arm member 40 is separated from the rotary cylinder DM in the -X-axis direction. At this time, the control device 43 controls the flexing mechanism 50 and the Y moving mechanism 51 to adjust the rotation angle of the arm member 40 in the θ Z direction so that the magnetic body M3 held by the mask M of the arm member 40 extends in the direction and light. The cover M is substantially parallel to the loading direction (X-axis direction) of the rotary cylinder DM.

Further, the control device 43 adjusts the Z of the arm member 40 by controlling the Z moving mechanism 52. The axial direction position is such that the reticle M held by the arm member 40 and the tangential plane of the rotating cylinder DM are spaced apart from each other by a predetermined interval in the Z-axis direction. By the above operation, the processing device U3 performs preparation for attaching the target mask M to the mask holding device 20.

Next, the mask transfer apparatus ML and light will be described with reference to FIG. The cover holding device 20 mounts the subject mask M to the mask holding device 20 (mask mounting method). Fig. 11 is a view showing a mounting method of the reticle M.

When the photomask M is attached to the mask holding device 20, the mask transport device ML The control device 43 controls the flexure mechanism 50 and the Y moving mechanism 51 of the moving device 42 to linearly move the arm member 40 in the +X-axis direction from the state shown in Fig. 9(D). At this time, the control device 43 is placed on the front end side (+X-axis side) of the mask M held by the arm member 40, and is disposed in the vicinity of the contact portion between the XY plane and the rotary cylinder DM. The contact portion of the XY plane with the rotating drum DM includes, for example, the top DMt disposed on the most +Z-axis side of the rotating drum DM (refer to FIG. 11(A)). In this manner, the mask M that is adsorbed to the arm member 40, that is, the rotating cylinder DM that is disposed as the mask holding device 20, is opposed at a predetermined interval.

Next, the processing device U3 first aligns the device 63 before installing the reticle M. Positioned at the top DMt of the observable rotating drum DM, the processing device U3 appropriately adjusts the rotational position of the rotating drum DM so that the alignment marks formed on the outer peripheral surface of the rotating cylinder DM can be in the field of view of the aligning device 63.

Next, the processing device U3 performs the arm held by the mask transport device ML. The reticle M of the member 40 is aligned with the position of the rotating cylinder DM. Here, the alignment device 63 detects the relative position of the alignment mark M4 of the reticle M and the alignment mark of the rotary cylinder DM through the observation window 65 (refer to FIG. 8A) provided in the arm member 40 of the reticle conveying device ML. . The positional alignment of the mask M and the rotating cylinder DM is performed using the detection result of the alignment device 63. According to this, the processing device U3 can accurately align the position of the mask M and the rotating cylinder DM with high precision.

In the alignment of the mask M and the rotating cylinder DM, the mask transport device ML The moving device 42 moves the arm member 40 to perform coarse adjustment of the relative position of the mask M and the rotating cylinder DM. Further, the second driving unit 23 of the mask holding device 20 moves the rotating cylinder DM to finely adjust the relative position of the mask M and the rotating cylinder DM. The coarse adjustment by the mask transporting device ML is performed, for example, by a stroke that is larger than the fine adjustment of the mask holding device 20.

At this time, the flexing and stretching mechanism 50 can move the arm member 40 along the XY plane. The relative position of the reticle M and the rotating cylinder DM in the X-axis direction and the relative position in the Y-axis direction are adjusted. Further, the flexing and stretching mechanism 50 can adjust the relative position of the reticle and the rotating cylinder DM in the θ Z direction by rotating the arm member 40 in the θ Z direction. As described above, the processing apparatus U3 can align the position of the mask M and the rotating cylinder DM which are adsorbed to the arm member 40 with high precision.

Next, in a state in which the mask M and the rotating cylinder DM are aligned, as shown in the figure As shown in FIG. 11(A), the processing device U3 adsorbs the arm member 40 of the mask transfer device ML to the mask M. Partial release is performed, and in synchronization with this, the holding portion 22 of the mask holding device 20 adsorbs the portion of the mask M.

At this time, the control device 43 of the mask transport device ML is as shown in FIG. 2 The control of the upper control unit CONT releases the adsorption of the first adsorption units 66a and 67a (see FIG. 8B) disposed on the distal end side (+X-axis side) of the arm member 40, and continues from the second adsorption unit 66b, 67b to the fifth Adsorption of the adsorption portions 66e, 67e. Further, the control device 13 of the exposure apparatus EX shown in FIG. 4 adsorbs the mask M to the holding portion 22 (the mask holding device 20) in accordance with the control of the upper control unit CONT. In detail, the control device 13 selects the electromagnet 32 of the plurality of electromagnets 32 disposed at a position opposite to the portion where the adsorption of the mask M is released, and generates a magnetic force.

According to this, in the mask M, the portion where the adsorption of the arm member 40 is released is magnetic The body M3 is pulled by the magnetic force generated by the electromagnet 32 toward the rotating cylinder DM, and is adsorbed to the rotating drum DM. As described above, the mask holding device 20 can sequentially adsorb a part of a portion of the mask M to the rotating cylinder DM, for example, to maintain the mask M without slack or the like.

Here, the processing device U3, which is opposite to the mask transport device ML of the mask M The adsorption force (pressure) is different from the principle of generating the adsorption force (magnetic force) of the mask holding device 20 (the type of physical force). Therefore, the processing apparatus U3 can easily control the adsorption force independently of the mask transport apparatus ML and the mask holding apparatus 20, and suppress the occurrence of the positional deviation of the mask M and the rotary cylinder DM. Further, as shown in FIG. 9(C), the processing device U3 detects the shape (deformation and bending) of the mask M that is adsorbed to the arm member 40 before attaching the mask M to the rotating cylinder DM. The photomask M is attached to the rotary cylinder DM without bending or the like.

Next, using the observation result of the alignment device 63, it is determined that the mask M is carried in. Whether the direction front end side (+X axis side) is disposed at a predetermined position of the outer peripheral surface 26 of the rotary cylinder DM. When it is determined that the front end side of the loading direction of the mask M is disposed at a predetermined position of the rotary cylinder DM, the processing apparatus U3, as shown in FIGS. 11(B) to 11(D), is from the front end side to the rear end side in the loading direction. The order of the photomask M is mounted on the rotary cylinder DM.

In detail, the reticle holding device 20 rotates the rotating cylinder DM to replace the reticle M Winded around the rotating drum DM. The mask transporting device ML linearly moves the arm member 40 in the X-axis direction at a speed corresponding to the speed at which the rotating cylinder DM rotates the outer peripheral surface 26. The speed of the arm member 40 is set to, for example, a tension that does not bend to the mask M of the arm member 40 where the suction is released, and the stretching of the mask M caused by the tension can be ignored.

Further, the mask transport apparatus ML is the second adsorption unit 66b of the arm member 40, The timing at which 67b is closest to the rotating drum DM is substantially the same timing (slightly earlier timing), and the adsorption of the second suction portions 66b and 67b to the mask M is released. Further, when the holding portion 22 (the mask holding device 20) is provided with the electromagnet 32 in the portion of the rotating cylinder DM that is in contact with the wound mask M, the magnet 32 is magnetically generated to adsorb the mask M, and The portion of the mask M that is wound around the rotating drum DM is sequentially fixed by suction.

In the above manner, as shown in FIG. 11(E), the entire mask M is taken from the arm structure. The piece 40 is released. Next, as shown in FIG. 11(F), the mask transport apparatus ML appropriately evacuates the arm member 40 to a position where it does not interfere (collide) with the rotary cylinder DM or the like. After the mask conveyance device ML retracts the arm member 40, the alignment device 63 detects the positional relationship between the alignment mark M4 of the mask M held by the rotary cylinder DM and the alignment mark of the rotary cylinder DM. This detection result is used, for example, to determine whether or not the reticle M is disposed at a predetermined position of the rotary cylinder DM or the like. When it is determined that the mask M is not disposed at a predetermined position of the rotating cylinder DM, the mask M is removed from the rotating cylinder DM, and the mask M or other masks having the same pattern are remounted to the rotating cylinder according to the above procedure. DM.

As described above, the processing device U3 bends the planar mask M into a cylinder After the surface is formed, it is attached to the cylindrical outer peripheral surface 26 of the rotary cylinder DM. The exposure apparatus EX of the processing apparatus U3 performs exposure processing using the rotating cylinder DM equipped with the mask M. Moreover, after the exposure processing by the exposure apparatus EX is completed, the mask conveyance apparatus ML can carry out the mask M from the rotating cylinder DM of the exposure apparatus EX, and carries the carried-out mask M into the mask 匣MC. The mask M is carried out from the rotary cylinder DM, and can be carried out, for example, in the opposite procedure to when the mask M is carried into the rotary cylinder DM.

The mask transport apparatus ML of the present embodiment is attached to the rotary cylinder DM (holding section) 22) The arm member 40 is relatively moved in the circumferential direction, and when the mask M is transferred to the rotary cylinder DM, the relative movement of the arm member 40 changes the adsorption state of the arm member 40 to the mask M. Therefore, the mask transfer apparatus ML can mount the planar mask M to the outer peripheral surface 26 of the cylindrical rotating drum DM with high efficiency, and mount it with high positional accuracy.

Further, the mask transporting device ML is, for example, adsorbing the mask M to be substantially flat. The planar shape and arm member 40 adsorbs the mask M so that the mask M and the holding portion 22 of the mask holding device 20 face each other at a predetermined interval. Therefore, the mask transport apparatus ML can attach the mask M to the rotary cylinder DM or the like with high precision. Further, the moving device 42 linearly moves the arm member 40 along the pattern M2 of the mask M that is adsorbed into a substantially planar shape. Therefore, the mask transport apparatus ML can mount the mask M to the rotary cylinder DM or the like with good efficiency.

Moreover, the plurality of adsorption portions 66 of the arm member 40 are, for example, the absorbing mask M. The control unit 21 controls a plurality of portions corresponding to the circumferential direction of the cylindrical surface, and the control device 21 controls the adsorption force of each of the plurality of adsorption portions 66 in accordance with the relative movement position of the movement of the moving device 42. Therefore, the mask transport apparatus ML can adjust the spatial distribution of the adsorption force of the adsorption device 41 with high precision, and mount the mask M to the rotary drum DM or the like with high positional accuracy.

"Second Embodiment"

Next, a second embodiment will be described. The mask holding device 20 of the present embodiment differs from the first embodiment in that the end portion 30 in the direction parallel to the central axis 28 of the rotary cylinder DM is formed of a material different from that of the central portion 31.

12A and 12B are views showing the configuration of the mask holding device 20 of the present embodiment. An overview of the reticle holder 20 and the reticle M is shown in Figure 12A. In Fig. 12B, the alignment mark 82 of the rotary cylinder DM and the alignment mark M4 of the mask M are enlarged and displayed.

The central portion 31 of the rotary cylinder DM shown in FIG. 12A and FIG. 12B is formed of a material having light transmissivity such as quartz, as viewed from the radial direction of the rotary cylinder DM and overlapping with the pattern M2 of the mask M.

The rotary cylinder DM is externally connected to the guide roller 80 and the drive roller 81, and is supported by the roller. The drive roller 81 is a part of the second drive unit 23 shown in FIG. 2, and is transmitted to the end portion 30 by a torque supplied from a motor or the like through a reduction gear or the like to rotate the rotary drum DM.

The end portion 30 of the rotary cylinder DM includes a portion circumscribing the guide roller 80 and the drive roller 81. The material of the end portion 30 is selected from materials such as gold metal and the like, which are less likely to be brittlely damaged by the material of the center portion 31 (quartz or the like) and have high workability. The electromagnet 32 is disposed, for example, inside the recess formed in the end portion 30. This recess has an opening in the outer peripheral surface 26 of the rotating cylinder DM, and its surface is insulated to prevent conduction with the electromagnet 32.

As shown in Fig. 12B, the mask M of the present embodiment differs from the first embodiment in that the alignment mark M4 is formed in a region around the pattern M2 and is different from the magnetic body M3. Here, the alignment mark 82 of the rotary cylinder DM is formed at the central portion 31 of the rotary cylinder DM, the reticle The alignment mark M4 of M is configured to overlap the alignment mark 82 of the rotary cylinder DM. The alignment mark M4 of the mask M may be formed, for example, with the same forming material (light shielding layer) as the pattern M2.

In the mask holding device 20 of the present embodiment, since the end portion 30 is in the middle and the middle Since the central portion 31 is formed of a different material, the material of the end portion 30 has a high degree of freedom of choice. For example, when the end portion 30 is formed of a metal material or the like, the workability in manufacturing the rotary cylinder DM is high, and it is easy to mount the electromagnet 32 or the like. Further, when the end portion 30 is formed of a metal material, it is possible to prevent the end portion 30 from coming into contact with the roller or the like, which may cause damage to the end portion 30, that is, a flaw or the like.

"Third Embodiment"

Next, a third embodiment will be described. The mask holding device 20 of the present embodiment differs from the first embodiment in that the mask M is adsorbed by electrostatic force.

13A and 13B are views showing the appearance of the holding portion 22 of the mask holding device 20 of the present embodiment. Fig. 14 is a view showing the circuit configuration of the mask holding device 20 in a schematic manner. The holding portion 22 is disassembled in Fig. 13A and is shown in a schematic manner. In Fig. 13B, a portion of Fig. 13A is omitted to facilitate observation of electrodes, wiring, and the like. In Figs. 13A and 13B, a part (one end portion 85a) in a direction parallel to the central axis 28 of the rotary cylinder DM is shown. The other end portion 85b (see Fig. 14) of the rotating cylinder DM has a structure in which the surface orthogonal to the central axis 28 is symmetrical with the one end portion, and the element is the same as the one end portion 85a.

As shown in FIG. 13A, the holding portion 22 of the mask holding device 20 includes a cylindrical movable member 85 (rotary cylinder DM) in which an electrode pattern 84 as an electrode member for electrostatic adsorption is formed, and is attached to the movable member 85. A rotating ring 87 of a driving circuit 86 (voltage applying means) for driving the electrode pattern 84 and a rotating ring 87 are disposed at the end portion of the central axis 28 in the parallel direction. The inner fixing member 88.

The movable member 85 has a peripheral surface 26 on which the mask M is disposed, for example, quartz or the like. A material having light transmissivity is formed. The rotating ring 87 is an annular member that is fixed to the end of the movable member 85 in the following manner, and rotates together with the movable member 85. The rotating ring 87 is formed of a material such as metal, like the end portion 30 of the rotating cylinder DM shown in Figs. 12A and 12B. The fixing member 88 is disposed between the rotating ring 87 and the air bearing 89, and is provided so that the movable member 85 and the rotating ring 87 do not rotate relative to the outside when the movable member 85 and the rotating ring 87 rotate. Further, the rotation ring 87 and the fixing member 88 are also provided at the other end portion of the movable member 85 in the same manner as the one end portion 85a.

The fixing member 88 has a first portion 88a disposed outside the movable member 85, And a second portion 88b disposed inside the movable member 85. The fixing member 88 is fixed to the outside of the movable member 85 by being supported by the first portion 88a, for example. Further, when an element such as the illumination optical system IL is disposed inside the movable member 85, the element is disposed in the second portion 88b. According to this, the second portion 88b fixes the element disposed inside the movable member 85 so as not to rotate relative to the portion of the movable member 85.

The first portion 88a and the second portion 88b of the fixing member 88 are each cylindrical. The inner side of the first portion 88a and the second portion 88b is a through hole 88c (duct) that connects the inner side and the outer side of the movable member 85. The through hole 88c can be used, for example, as a vent hole, a cable pull-out port, or the like. For example, when a light source device or the like is disposed inside the movable member 85, the cable connected to the light source device can be pulled out to the outside of the movable member 85 through the through hole 88c. Further, the heat generated inside the movable member 85 by the light source device or the like may be radiated to the outside of the movable member 85 through the through hole 88c by the ventilation of the through hole 88c or the like.

As shown in FIG. 13B, each of the plurality of electrode patterns 84 includes the first one. The electrode 84a and the second electrode 84b are grouped into a single electrode 84a and a second electrode 84b to form an electrostatic capacitance. The first electrode 84a and the second electrode 84b of each electrode pattern 84 are formed, for example, in a comb shape, and are arranged close to each other. When the charge for adsorption is accumulated in the electrostatic capacity of the electrode pattern 84, the first electrode 84a is set to, for example, an anode, and the second electrode 84b is set to, for example, a cathode.

The movable member 85 has a first terminal 90 electrically connected to the first electrode 84a, A wiring pattern 91 electrically connected to each of the plurality of second electrodes 84b, and a second terminal 92 formed at an end portion of the movable member 85 and electrically connected to the wiring pattern 91.

The first terminal 90 is a so-called power supply terminal, and is applied to the second terminal 92. The potential of the potential (reference potential). The first terminal 90 corresponds to one of the first electrodes 84a, and a plurality of them are arranged in the circumferential direction of the rotary cylinder DM. The first terminal 90 is disposed, for example, on an end surface orthogonal to the central axis 28 of the rotary cylinder DM, and is electrically connected to the first electrode 84a by a wire extending in a direction parallel to the central axis 28 of the rotary cylinder DM.

The second terminal 92 is a so-called ground terminal, and a reference potential is applied. 2nd The terminal 92 is disposed, for example, at an end face orthogonal to the central axis 28 of the rotary cylinder DM, and the number thereof may be one or plural. The wiring pattern 91 is a so-called common ground line, and holds the plurality of second electrodes 84b at substantially the same potential. The wiring pattern 91 has a first wiring 91a extending in the circumferential direction of the rotating cylinder DM and a second wiring 91b extending in a direction parallel to the central axis 28 of the rotating cylinder DM. The first wiring 91a is continuous with each of the plurality of first electrodes 84a provided at one end 85a of the movable member 85, and is electrically connected to each of the plurality of first electrodes 84a of the one end portion 85a.

As shown in FIG. 14, at the other end portion 85b of the movable member 85, and one end portion 85a is similarly formed with a plurality of electrode patterns 84. The electrode pattern 84 at the other end is disposed in a one-to-one correspondence with the electrode pattern 84 of the one end portion 85a, and is configured to be in a corresponding relationship. The electrode pattern 84 of the one end portion 85a coincides in the circumferential direction position (angular position in the θ Y direction) of the movable member 85. For example, one of the electrode patterns 84 of one end portion 85a (84-1) and one of the electrode patterns 84 of the other end portion 85b (84-4) are arranged in a direction parallel to the central axis 28 of the movable member 85.

Further, the other end portion 85b of the movable member 85 is the same as the one end portion 85a. The first wiring 91a is formed. The first wiring 91a of the other end portion 85b is electrically connected to each of the plurality of electrode patterns 84 of the other end portions 85b. The first wiring 91a of the one end portion 85a and the first wiring 91a of the other end portion 85b are electrically connected to each other through the second wiring 91b. The second wiring 91b is electrically connected to the second terminal 92 and held at the reference potential. As described above, the plurality of second electrodes 84b of the one end portion 85a and the other end portion 85b are electrically connected to the second terminal 92 through the wiring pattern 91 (common ground line), and are held at substantially the same potential (reference potential).

The mask M has a pattern non-formation area MA2 in which the pattern M2 is not formed, the pattern The surface of the non-formation region MA2 is composed of a dielectric. Such a mask M may be, for example, a magnetic body M3 omitted from the mask M shown in FIGS. 3A and 3B, or a dielectric film formed by covering the magnetic body M3. When the mask M is viewed from the radial direction of the movable member 85, the pattern M2 does not overlap with the plurality of electrode patterns 84, and the pattern non-formation region MA2 overlaps with the plurality of electrode patterns 84.

The drive circuit 86 is provided with switching from the power supply unit 93 (voltage application device) to The first switching unit 94 of the electric power (voltage) of the drive circuit 86 and the second switching unit 95 that can electrically connect at least one of the plurality of first electrodes 84a to the first switching unit 94.

The power supply unit 93 is provided to accumulate charge for electrostatic adsorption on the electrode pattern A high-voltage power source 93a having an electrostatic capacitance formed at 84, and a reverse bias power source 93b having a reverse bias voltage with the high-voltage power source 93a. The power supply unit 93 is, for example, disposed outside the rotating drum DM, and the positive electrode of the high voltage power source 93a. The contact of the negative electrode brush or the like of the reverse bias power source 93b is electrically connected to the first switching unit 94. Further, the anode of the high voltage power source 93a and the anode of the reverse bias power source 93b are electrically connected to the second electrode 84b of the electrode pattern 84 through the second terminal 92.

Moreover, the arrangement and configuration of the power supply unit 93 can be appropriately changed, for example, Like the battery 34 shown in FIG. 4, it is disposed inside the rotating cylinder DM, and may be disposed in the rotating ring 87 or the fixing member 88 shown in FIG. 13A.

The first switching unit 94 can be alternately switched to its contact 94a and the power supply unit 93. The first state in which the positive electrode of the high-voltage power source 93a is turned on, the second state in which the contact 94a is electrically connected to the negative electrode of the reverse bias power source 93b of the power supply unit 93, and either the contact 94a and the high-voltage power source 93a and the reverse bias power source 93b All are in the third state of insulation. The control device 21 of the exposure apparatus EX shown in FIG. 4 can select any of the first to third states by controlling the first switching unit 94.

The second switching unit 95 has an electrical connection with the contact 94a of the first switching unit 94. The contact 95a and a plurality of contacts 96 electrically connected to the first electrode 84a of the electrode pattern 84 through the first terminal 90 shown in FIG. 13B. The second switching unit 95 can electrically connect the contacts selected from the plurality of contacts 96 to the first switching unit 94.

The contact 96a of the plurality of contacts 96 and the first electrode of the electrode pattern 84-1 The electrode 84a and the first electrode 84a of the electrode pattern 84-4 corresponding to the electrode pattern 84-1 are electrically connected. The contact 96b has an electrode pattern 84-corresponding to the first electrode 84a of the two electrode patterns 84-1 and 84-2 arranged in the circumferential direction of the movable member 85 and the electrode patterns 84-1 and 84-2. 4. The first electrode 84a of 84-5 is electrically connected. The contact 96c has an electrode pattern 84 corresponding to the first electrode 84a of the three electrode patterns 84-1 to 84-3 arranged in the circumferential direction of the movable member 85 and the electrode patterns 84-1 to 84-3. The first electrode 84a of 4 to 84-4 is electrically connection.

Further, in FIG. 14, although a plurality of contacts 96 display three contacts of the contacts 96a to 96c, actually, the plurality of contacts 96 include contacts corresponding to the four electrode patterns 84, and five electrodes. The contact point of the pattern 84, the contact point corresponding to all the electrode patterns 84, and the like are electrically connected to the first electrode 84a of the plurality of electrode patterns 84 arranged in the circumferential direction of the movable member 85. In addition, in FIG. 14, the first switching unit 94 and the second switching unit 95 are each shown as a mechanical switch, but one or both of the first switching unit 94 and the second switching unit 95 may be configured as switching elements such as MOS.

The control device 21 of the exposure apparatus EX shown in FIG. 4 can control the second switching unit 95 to selectively connect one of the plurality of contacts 96 to the first switching unit 94.

Here, the first state in which the first switching unit 94 is electrically connected to the positive electrode of the high-voltage power source 93a is assumed in the drive circuit 86. In the first state, when the contact 96a of the second switching unit 95 is electrically connected to the contact 94a of the first switching unit 94, the first electrode 84a of each of the electrode patterns 84-1 and 84-4 is applied with a positive voltage. . As a result, each of the electrode patterns 84-1 and 84-4 generates an adsorption force by electrostatic force due to accumulation of electric charge in the electrostatic capacitance. Similarly, in the first state, when the contact 96b of the second switching unit 95 is electrically connected to the contact 94a of the first switching unit 94, the electrode patterns 84-1, 84-2, 84-4, 84-5 That is, an adsorption force formed by an electrostatic force is generated. Further, when the contact 96c of the second switching unit 95 is electrically connected to the contact 94a of the first switching unit 94, the electrode patterns 84-1 to 84-6 generate an adsorption force formed by an electrostatic force. As described above, the drive circuit 86 can be varied in a region where the movable member 85 generates an adsorption force.

Further, in the drive circuit 86, the high voltage power supply 93a and the reverse bias power supply 93b are all in a third state of insulation. Where the electrode pattern 84 is charged (adsorption portion 66), in the third state Next, the state in which the adsorption force is generated is maintained. For example, when a plurality of electrode patterns 84 are set to the third state in a state of being charged, they are all maintained in a state of generating an adsorption force.

Further, in the drive circuit 86, the first switching unit 94 and the power supply unit 93 are assumed. The second state in which the negative electrode of the reverse bias power source 93b is turned on. In the second state, when the contact 96a of the second switching unit 95 is electrically connected to the first switching unit 94, a negative voltage is applied to each of the first electrodes 84a of the electrode patterns 84-1 and 84-4. According to this, when the electric charge is accumulated in each of the electrode patterns 84-1 and 84-4, the electric charge is discharged from the electrostatic capacity, so that the electrode patterns 84-1 and 84-4 are switched to generate almost no adsorption force. status. Similarly, in the second state, when the contact 96b of the second switching unit 95 is electrically connected to the contact 94a of the first switching unit 94, the electrode patterns 84-1, 84-2, 84-4, 84-5 That is, it is switched to a state in which almost no adsorption force is generated. Further, when the contact 96c of the second switching unit 95 is electrically connected to the contact 94a of the first switching unit 94, the electrode patterns 84-1 to 84-6 are switched to a state in which the adsorption force is hardly generated. As described above, the drive circuit 86 can switch at least a part of the region where the adsorption force is generated in the movable member 85 to a state in which the adsorption force is hardly generated.

In the mask holding device 20 of the present embodiment, similarly to the one shown in Fig. 11, the suction force is sequentially generated by the circumferential direction of the movable member 85 (rotary cylinder DM), and a part of the mask M is sequentially adsorbed. . According to this, the processing apparatus U3 can efficiently mount the mask M to the rotary cylinder DM, and attach the mask M to the rotary cylinder DM with high positional accuracy.

The technical scope of the present invention is not limited to the above embodiment. For example, one or more of the elements described in the embodiments may be omitted. Further, the elements described in the embodiments can be combined as appropriate.

Adsorption force of the mask transfer device ML to the mask M and the mask holding device 20 The adsorption force to the mask M can be selected from the adsorption force formed by the pressure (decompression), the adsorption force formed by the magnetic force, the adsorption force formed by the electrostatic force, etc., and the principle of generating the principle is also appropriately selected, and the principle of generation is also selected.

Further, the flexing and stretching mechanism 50 can be attached to the rotating drum DM in the mask M. In this case, the moving surface including the direction (X-axis direction) in which the mask M (arm member 40) is moved may be bent.

The moving surface may be, for example, an XZ plane. In this case, the flexing and stretching mechanism 50 and The Z moving mechanism 52 moves the flexing and stretching mechanism 50 as a linear driving source so as to offset the Z-axis direction of the arm member 40 by the flexing and stretching mechanism 50.

Moreover, the transfer of the mask between the mask transfer device ML and the mask 匣MC, The transfer of the mask between the mask transfer device ML and the mask holder 20 can be performed in the same manner.

"Component Manufacturing Method"

Next, a method of manufacturing a component will be described. Fig. 20 is a flow chart showing the method of manufacturing the device of the embodiment.

The component manufacturing method shown in FIG. 15 is first performed, for example, by an organic EL display. Functional and performance design of components such as panels (step 201). Next, the mask M is produced in accordance with the design of the component (step 202). A substrate such as a transparent film, a sheet, or an extremely thin metal foil of the substrate of the device is prepared by purchase or manufacturing (step 203).

Secondly, the prepared substrate is put into a roller type and a patch type manufacturing line. An electrode and a wiring constituting the element, a TFT substrate layer such as an insulating film or a semiconductor film, and an organic EL light-emitting layer as a pixel portion are formed on the substrate (Step 204). In step 204, a step of forming a photoresist pattern on the film on the substrate and an etching step of etching the film using the photoresist pattern as a mask are typically performed. In the formation of the photoresist pattern, the photoresist film is formed on the surface of the substrate. The step of exposing the photoresist film of the substrate by the patterned exposure light through the mask M according to the above embodiments, and the step of developing the photoresist film for forming the latent image of the mask pattern by the exposure .

When a flexible element such as printing technology is used in combination, it is implemented in a step of forming a functional photosensitive layer (photosensitive decane coupling material or the like) by coating on the surface of the substrate, and irradiating the photosensitive light patterned by the mask M to the functional photosensitive layer according to each of the above embodiments, and applying the functional photosensitive layer to the functional photosensitive layer The step of forming the hydrophilized portion and the water-repellent portion in the shape of the view, and the step of coating the plating underlayer on the portion where the hydrophilicity of the functional photosensitive layer is high, and depositing a metallic pattern by electroless plating, or the like.

Secondly, depending on the components manufactured, for example, cutting the substrate or cutting, and Other substrates manufactured by other processes, for example, a sheet-like color filter having a sealing function or a thin glass substrate, are bonded together to assemble the components (step 205). Next, the component is inspected and the like and processed (step 206). By the above means, components can be manufactured.

22‧‧‧ Keeping Department

26‧‧‧ outer perimeter

28‧‧‧ center axis

32‧‧‧Electrical Stone

40‧‧‧ Arm members

41‧‧‧Adsorption device

42‧‧‧Mobile devices

43‧‧‧Control device

50‧‧‧Flexing and extension mechanism

51‧‧‧Y mobile agency

52‧‧‧Z mobile agency

53‧‧‧θ X moving mechanism

56‧‧‧ Pillars

57‧‧‧Connecting Department

58‧‧‧Support

59‧‧‧ Drive Department

60‧‧‧ Tracks

61‧‧‧ Body Department

62‧‧‧Shape detection device

DM‧‧‧Rotary tube

M‧‧‧Mask M

M2‧‧‧ pattern

M3‧‧‧ magnetic body

MC‧‧‧Photomask

MC1‧‧‧ openings

ML‧‧‧mask transfer device

U3‧‧‧Processing device

Claims (19)

A mask holding device for carrying a mask holding device that holds a pattern surface of a mask substrate in a cylindrical shape, and carries the mask substrate, and includes an adsorption device for adsorbing the mask substrate; Moving the device such that the holding portion of the absorbing device and the reticle holding device relatively move in a circumferential direction of the cylindrical surface; and the control device, the photomask substrate is transferred from the absorbing device as the movement is performed by the moving device When the holding portion of the mask holding device is moved, the adsorption state of the mask substrate of the adsorption device is changed in accordance with the relative movement position in the circumferential direction of the cylindrical surface. The reticle conveying apparatus according to claim 1, wherein the absorbing means has an arm member that adsorbs the reticle substrate to face the holding portion of the reticle holding device at a predetermined interval. The reticle conveying device of claim 2, wherein the absorbing device has a plurality of adsorption portions provided on the arm member, and is adsorbed in a direction corresponding to a circumferential direction of the cylindrical surface of the reticle substrate. Plural part. The reticle conveying device of claim 3, wherein the arm member is configured to adsorb the mask substrate into a substantially planar shape by the plurality of adsorption portions, the moving device having the arm member along the A linear drive source that is linearly moved by the pattern surface of the mask substrate that is adsorbed into a substantially planar shape. The reticle conveying device of claim 3, wherein the reticle holding device magnetically adsorbs the magnetic body provided on the reticle substrate to the holding portion; and is disposed on the arm member of the absorbing device The plurality of adsorption portions absorb the photomask substrate by decompression. The reticle conveying device according to any one of claims 3 to 5, wherein the control device is controlled in such a manner that the plurality of the relative movement positions of the movement with the movement device are changed The adsorption force of each adsorption part. The reticle conveying device according to any one of claims 2 to 6, wherein the moving device moves the arm member to a reticle substrate that is adsorbed to an arm member of the absorbing device, and the reticle is held close to the reticle a holding portion of the device, wherein the control device controls the adsorption device such that a portion of the mask substrate that is closest to the holding portion of the mask holding device has a relatively low adsorption force. The reticle conveying device according to any one of claims 1 to 7, wherein the holding portion of the reticle holding device is formed in a cylindrical shape; and the moving device is provided with an arm member of the absorbing device a first moving portion that moves in a direction in which the tangent plane of the cylindrical surface of the holding portion is parallel, and a second moving portion that rotates an arm member of the suction device about an axis intersecting the tangent plane. The reticle conveying device according to any one of claims 1 to 8, wherein the control device controls the relative position of the alignment mark formed on the reticle substrate and the holding portion of the reticle holding device The mobile device. The reticle conveying device according to any one of claims 2 to 9, wherein the control device is defined by a relative position of an alignment mark formed on the reticle substrate and a specific portion of an arm member of the absorbing device. In a relationship, the mask substrate is adsorbed to the arm member of the adsorption device, and the moving device is controlled to move the mask substrate adsorbed to the arm member relative to the mask holder. The reticle conveying apparatus according to any one of claims 1 to 10, further comprising a shape detecting device that detects a shape of the reticle substrate adsorbed to the absorbing device. A reticle holding device that holds a reticle substrate that is bendable along a cylindrical surface and that includes a magnetic body, and includes a movable member that has a cylindrical surface on which the reticle substrate is placed by a reticle transfer device that carries the reticle substrate. Rotating around a central axis of the cylindrical surface; a magnetic force generating device generating a magnetic force on the cylindrical surface; and a control device for controlling the relative position of the reticle substrate and the cylindrical surface carried by the reticle conveying device The magnetic force generating means controls the distribution of the magnetic force on the cylindrical surface. The photomask holding device according to claim 12, wherein the magnetic force generating device includes an electromagnet and an electric power accumulating portion that stores electric power supplied to the electromagnet; and the electric power accumulating portion is disposed inside the movable member. A mask holding device that holds a mask substrate that is bendable along a cylindrical surface and is made of a dielectric substrate, and includes a movable member that has a circle in which the mask substrate is placed by a mask transport device that carries the mask substrate a cylindrical surface rotatable about a central axis of the cylindrical surface; a voltage applying device for applying a voltage to the electrode member for electrostatic adsorption disposed at a plurality of circumferential directions of the cylindrical surface; and a control device according to the photomask The relative position of the mask substrate carried by the transport device and the cylindrical surface of the movable member is controlled, and the voltage application device is controlled to control the distribution of electrostatic adsorption on the cylindrical surface. A photomask substrate having: The substrate may be curved along the cylindrical surface; a pattern formed on the substrate; and a magnetic body disposed on the substrate. A substrate processing apparatus comprising: a mask holding device that holds a pattern surface of a bendable mask substrate in a cylindrical shape; and a mask transport apparatus according to any one of claims 1 to 11. The substrate processing apparatus of claim 16, wherein the mask holding device includes: a movable member rotatable about a central axis of the cylindrical surface; a magnetic force generating device that generates a magnetic force on the cylindrical surface; and control The apparatus controls the magnetic force generating means to control the distribution of the magnetic force on the cylindrical surface based on the relative position of the mask substrate carried by the mask transporting apparatus and the cylindrical surface. The substrate processing apparatus according to claim 16, wherein the mask substrate includes a substrate of a dielectric, and the mask holding device includes: a movable member having a cylinder in which the mask substrate is disposed by the mask transport device a surface that is rotatable about a central axis of the cylindrical surface; a voltage applying device that applies a voltage to the electrode member for electrostatic adsorption disposed at a plurality of positions in the circumferential direction of the cylindrical surface; and a control device that transports the light according to the mask The position of the mask substrate carried in the apparatus and the cylindrical surface of the movable member is controlled, and the voltage application device is controlled to control the distribution of electrostatic adsorption on the cylindrical surface. A device manufacturing method comprising: the substrate processing apparatus according to any one of claims 16 to 18, wherein the pattern of the mask substrate is exposed to a substrate on which the photosensitive layer is formed; and the exposed substrate is utilized The change of the light sensing layer and the subsequent processing are performed.