JPWO2013125036A1 - 光起電力素子 - Google Patents
光起電力素子 Download PDFInfo
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- JPWO2013125036A1 JPWO2013125036A1 JP2014500836A JP2014500836A JPWO2013125036A1 JP WO2013125036 A1 JPWO2013125036 A1 JP WO2013125036A1 JP 2014500836 A JP2014500836 A JP 2014500836A JP 2014500836 A JP2014500836 A JP 2014500836A JP WO2013125036 A1 JPWO2013125036 A1 JP WO2013125036A1
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 261
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- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 6
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- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
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- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 3
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- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
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- 229910021332 silicide Inorganic materials 0.000 description 2
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
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- 239000011787 zinc oxide Substances 0.000 description 1
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- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
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Abstract
Description
図1−1〜図1−3は、この発明の実施の形態1にかかる光起電力素子であるヘテロ接合裏面電極型太陽電池の全体構成の一例を模式的に示す図である。図1−1は受光面(光入射面)と反対側の面(以下、裏面と呼ぶ)側から見た平面図、図1−2は図1−1において集電電極部分を除いた平面図である。図1−3は、図1−1の線分A−Bにおける要部拡大断面図である。また、比較のために従来の構成のヘテロ接合裏面電極型太陽電池の要部拡大断面図を図2に示す。なお、本実施の形態では、半導体基板と同じ伝導型の半導体膜を凹部に形成する場合について述べる。このような構造は、半導体基板と同じ導電型の凹部の半導体膜との界面の実効再結合速度が、半導体基板凹部のバルクの実効再結合速度に比べて小さい場合に特に有効であり、凹部での光吸収量が低減するものの、全体としての再結合が低減されることによる光電変換効率の向上が期待できる。特に表面パッシベーション能力が高い、最適化されたアモルファスシリコンによる単結晶シリコン基板のパッシベーションでは、このような状況となるため、ヘテロ接合を用いた裏面接合太陽電池構造の場合は、特に有効である。また、半導体基板に凹部を形成することにより、光吸収層としての半導体基板の厚みが減ることになり、光吸収量が減少する。しかし、凹部の内部表面を受光面に対して斜面を含むように形成することより、光吸収量の減少量を低減することができ、光電変換効率に優れた太陽電池を得ることができる。凹部が底面と側面とで構成される場合は側面のみが受光面に対して傾斜していてもよく、底面及び側面がともに傾斜しているとさらに好ましい。なお、受光面に微細な凹凸が形成されている場合、それらの高さを平均して得られる面を受光面の主面として、凹部の内面がその主面に対して斜面を含んでいればよい。
図4は、実施の形態2にかかる太陽電池の構成の一例を模式的に示す要部断面図である。図4においても、図1−3と同様に基板の面内において櫛歯状の集電電極の延在方向に垂直な方向の断面の一部を示している。また、実施の形態2では、半導体基板と逆の伝導型の半導体膜を凹部に形成する場合について述べる。特に、半導体基板と凸部の半導体膜との界面の実効再結合速度が半導体基板凸部のバルクの実効再結合速度に比べて大きい場合、あるいは半導体基板と凹部の半導体膜との界面の実効再結合速度が半導体基板凹部のバルクの実効再結合速度に比べて小さい場合、の少なくともどちらか一方を満たす際は、この構造によってバルクと界面を合わせた全体としての再結合が低減され、光電変換効率が向上する。また、図4においては、実施の形態1の場合と同様の部材については同じ符号を付している。
図6は、実施の形態3にかかる太陽電池の構成の一例を模式的に示す要部断面図である。図6においても図1−3と同様に基板の面内において櫛歯状の集電電極の延在方向に垂直な方向の断面の一部を示している。なお、本実施の形態では、半導体基板と同じ伝導型の半導体膜を凹部に形成する場合について述べる。このような構造は、半導体基板と凹部の半導体膜との界面の実効再結合速度が、半導体凹部のバルクの実効再結合速度に比べて小さい場合に有効であり、凹部における光吸収量が低減するものの、全体としての再結合が低減されることによる光電変換効率の向上が期待できる。特に表面パッシベーション能力が高い、最適化されたアモルファスシリコンによる単結晶シリコン基板のパッシベーションでは、このような状況となるため、ヘテロ接合を用いた裏面接合太陽電池構造の場合は、特に有効である。また、半導体基板に凹部を形成することにより、光吸収層としての半導体基板の厚みが減ることになり、光吸収量が減少する。しかし、凹部の底面及び側面を受光面に対して斜面をなすように形成することより、光吸収量の減少量を低減することができ、光電変換効率に優れた太陽電池を得ることができる。また、図6においては、実施の形態1と同様の部材については同じ符号を付している。
図12〜図14は、実施の形態4にかかる太陽電池の構成の一例を模式的に示す要部断面図である。図12〜図14も、図1−3と同様に基板の面内において櫛歯状の集電電極の延在方向に垂直な方向の断面の一部を示している。また、実施の形態4では、半導体基板と同じ伝導型の半導体膜を凹部に形成する場合について述べる。実施の形態4にかかる太陽電池は実施の形態1の変形例であり、凹部115の内部及びその周囲の部材位置が異なるが、基本的な構造は実施の形態1の場合と同様である。また、図12〜図14においては、実施の形態1の場合と同様の部材については同じ符号を付している。
101 n型シリコン基板(シリコン基板)
102 n型半導体層
103 反射防止膜
104 p型半導体層
105 真性半導体層
105L 真性半導体層
105H 真性半導体層
106 誘電体層
107 n型拡散層
108 マスク膜
109 シリコン酸化膜
110 電流取り出し電極
111 集電電極
115 凹部
116 凸部
117 耐酸性レジスト
120 電流取り出し電極
121 集電電極
131 シリコン酸化膜
132 溝
133 V溝
200 エッチング装置
201 エッチング貯留層
202 スポンジローラ
210 エッチング液
300 太陽電池
400 太陽電池
Claims (12)
- 第1主面と第2主面とを有する結晶系半導体基板の前記第1主面側に凹部と凸部とが形成され、
前記凹部の表面に、誘電体膜または真性半導体膜と、第1導電型を有するアモルファス膜からなる第1半導体層と、第1電極とがこの順で積層され、
前記凸部の表面に、誘電体膜または真性半導体膜と、第2導電型を有するアモルファス膜からなる第2半導体層と、第2電極とがこの順で積層され、
前記凹部の表面が前記基板の前記第2主面に対して傾斜した面を含んで構成されること、
を特徴とする光起電力素子。 - 前記凹部は底面と側面とで構成されて、前記側面が前記第2主面に対して40°以上60°未満の角度をなす傾斜面を有して構成されること、
を特徴とする請求項1に記載の光起電力素子。 - 前記凹部の底部に前記第2主面に対して傾斜した微細な面を多数含むテクスチャが形成されていること、
を特徴とする請求項2に記載の光起電力素子。 - 前記凸部の表面は、主に略平坦面により構成されること、
を特徴とする請求項1〜3のいずれか1項に記載の光起電力素子。 - 前記第1半導体層と前記第2半導体層がともに形成されない領域が、前記凹部の側面に形成されていること、
を特徴とする請求項1〜4のいずれか1項に記載の光起電力素子。 - 前記誘電体膜または真性半導体膜と前記第1半導体層の積層膜と、前記誘電体膜または真性半導体膜と前記第2半導体層の積層膜とが重なって形成される領域が、前記凹部の側面に形成されていること、
を特徴とする請求項1〜4のいずれか1項に記載の光起電力素子。 - 延伸方向が平行な複数の溝からなるテクスチャ構造が前記結晶系半導体基板の受光面に形成され、
前記凹部が、前記結晶系半導体基板の面方向において前記溝の延伸方向に対して直交する方向に延伸して形成されること、
を特徴とする請求項1〜6のいずれか1項に記載の光起電力素子。 - 前記結晶系半導体基板の他面側の表面に、前記半導体基板と同一の導電型の不純物を前記半導体基板よりも高い濃度で含む層を有すること、
を特徴とする請求項1〜7のいずれか1つに記載の光起電力素子。 - 前記結晶系半導体基板の導電型が第1導電型であること、
を特徴とする請求項1〜8のいずれか1つに記載の光起電力素子。 - 第1主面と第2主面とを有する結晶系半導体基板の前記第1主面側に凸部と前記第2主面に対して傾斜した面を含んで構成される凹部とを形成する工程と、
前記凹部の底部および側面の表面上に誘電体膜または真性半導体膜を形成する工程と、
前記凸部の一部の表面上に誘電体膜または真性半導体膜を形成する工程と、
前記凹部内の前記誘電体膜上または前記真性半導体膜上に第1導電型を有するアモルファス膜からなる第1半導体層を形成する工程と、
前記凸部の表面上の前記誘電体膜上または前記真性半導体膜上に第2導電型を有するアモルファス膜からなる第2半導体層を形成する工程と、
前記第1半導体層上に第1電極を形成する工程と、
前記第2半導体層上に第2電極を形成する工程と、
を含むことを特徴とする光起電力素子の製造方法。 - 前記凹部の底面に前記第2主面に対して傾斜した微細な面を多数含むテクスチャを形成して粗面化すること、
を特徴とする請求項10に記載の光起電力素子の製造方法。 - 請求項1〜9のいずれか1つに記載の光起電力素子の少なくとも2つ以上が電気的に直列または並列に接続されてなること、
を特徴とする光起電力モジュール。
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