JPWO2013099936A1 - Input / output member and electronic component storage package and electronic device - Google Patents

Abstract

It is necessary to reduce high-frequency signal loss in the input / output member of the electronic component storage package. The input / output member 9 according to one embodiment of the present invention includes a first insulating member 11, a second insulating member 12 bonded to the upper surface of the first insulating member 11, and a central portion of the first insulating member 9. And a wiring conductor 13 sandwiched between the second insulating member 12 and the second insulating member 12. The wiring conductor 13 has an impedance matching portion having a wider line width than other portions at the boundary portion between the second insulating member 12 and the portion exposed from the second insulating member 12.

Description

  The present invention relates to an input / output member used for an electronic component storage package in which an electronic component such as a semiconductor element is stored, an electronic component storage package using the input / output member, and an electronic apparatus. Such an electronic device can be used for various electronic devices.

  As an electronic component storage package for storing electronic components (hereinafter also simply referred to as a package), for example, an electronic component package described in Japanese Patent Application Laid-Open No. 9-64223 is known. This package includes an input / output conductor pattern for electrically connecting an electronic component housed inside and an external electric circuit. Further, a second grounding conductor pattern is provided so as to sandwich the input / output conductor pattern, and the coplanar wiring is formed by the input / output conductor pattern and the second grounding conductor pattern. .

  In this package, the distance excluding the input / output conductor pattern portion between the second grounding conductor patterns is set so that the portion covered by the third insulator layer is not covered by the third insulator layer. Compared to longer. As a result, matching of the characteristic impedance is performed between the portion covered by the third insulator layer and the portion not covered.

JP-A-9-64223

  However, even though the characteristic impedances of the portion covered with the insulator layer and the portion not covered can be matched with each other, the high-frequency characteristics of the continuous high-frequency line have not been sufficient.

  Moreover, when making a high frequency signal high output, it is necessary to consider the pressure | voltage resistance of a high frequency signal track | line. The present invention has been made in view of the above problems, and an object thereof is to provide an input / output member capable of performing good impedance matching, an electronic component storage package and an electronic apparatus using the input / output member.

  An input / output member according to one aspect of the present invention includes a first insulating member, a second insulating member joined to an upper surface of the first insulating member, and a central portion of the first insulating member and the first insulating member. And a wiring conductor sandwiched between the second insulating members. The wiring conductor has an impedance matching portion having a wider line width than other portions at a boundary portion between the portion exposed from the second insulating member and the second insulating member.

  According to the input / output member according to an embodiment of the present invention, the impedance of the wiring conductor that is wider than the other part at the boundary between the wiring conductor and the second insulating member at the portion exposed from the second insulating member. Since the matching portion is included, impedance mismatching occurring at the boundary portion is matched by the impedance matching portion having a wide line width, and the high-frequency characteristics of the wiring conductor in which the portion covered with the second insulating member and the portion not covered are continuous. Can be improved.

It is a disassembled perspective view of the electronic component storage package of 1st Embodiment, and an electronic apparatus provided with the same. It is a perspective view of the electronic component storage package of 1st Embodiment shown in FIG. It is sectional drawing of the XX cross section in the electronic component storage package shown in FIG. FIG. 3 is an exploded perspective view of an input / output member used in the electronic component storage package shown in FIGS. 1 and 2. It is a top view of the input / output member shown in FIG. It is a top view of the input-output member in the electronic component storage package of 2nd Embodiment. It is a top view of the input-output member in the electronic component storage package of 3rd Embodiment. It is a top view of the input-output member in the electronic component storage package of 4th Embodiment. It is a top view of the input-output member in the electronic component storage package of 5th Embodiment. It is a diagram which shows the simulation result of the high frequency reflection loss of the input-output member in the electronic component storage package of 4th Embodiment. It is a diagram which shows the simulation result of the high frequency insertion loss of the input-output member in the electronic component storage package of 4th Embodiment.

  Hereinafter, an input / output member of each embodiment of the present invention, an electronic component storage package including the input / output member, and an electronic device will be described in detail with reference to the drawings. However, each drawing referred to below is a simplified illustration of the main configuration. The input / output member, the package, and the electronic device according to the present invention may include arbitrary constituent members and detailed configurations that are not shown in the drawings referred to in the present specification. Moreover, the scale of each figure differs from an actual thing.

  1, 2 and 3 show a package 1 and an electronic device 101 according to a first embodiment of the present invention. The package 1 includes a substrate 5 having a placement area on which the electronic component 3 is placed on an upper surface, and a frame 7 provided on the upper surface of the substrate 5 so as to surround the placement area. The frame body 7 has openings on the inner peripheral surface and the outer peripheral surface, and has a through hole 7 a that penetrates the frame body 7. An input / output member 9 for inputting and outputting signals between the inside and the outside of the region surrounded by the frame body 7 is fixed to the through hole 7a.

  FIG. 4 is an exploded perspective view of the input / output member 9 in the present embodiment. The input / output member 9 includes a first insulating member 11 and a second insulating member 12 joined to the upper surface of the first insulating member 11. A wiring conductor 13 is formed on the upper surface of the first insulating member 11. One end of the wiring conductor 13 is formed between the second insulating members 12. The width of the wiring conductor 13 in the line direction of the second insulating member 12 is narrower than that of the first insulating member 11, so that one end of the wiring conductor 13 is exposed. It should be noted that the ground conductor 14 may be provided on both sides of the wiring conductor 13 along the line direction with a certain interval. The wiring conductor 13 and the ground conductor 14 form a coplanar line.

  The wiring conductor 13 is adjacent to the first portion 13 a and the first portion 13 a sandwiched between the first insulating member 11 and the second insulating member 12, and at the boundary portion exposed from the second insulating member 12. It has the 2nd site | part 13b located, and the 3rd site | part 13c exposed from the 2nd insulating member 12, and adjoining the 2nd site | part 13b. The second portion 13b is a boundary portion between the first portion 13a sandwiched between the second insulating members 12 and the portion where the wiring conductor 13 is exposed from the second insulating member 12, and the second insulating portion 13b. It is located on the side exposed from the member 12. And the 2nd site | part 13b is formed so that line | wire width W2 may become wider than the 1st site | part 13a and the 3rd site | part 13c.

  Thus, by making the line width W2 of the second part 13b wider than the line width W1 of the first part 13a and the line width W3 of the third part 13c, the first part 13a and the third part The high frequency impedance is lower in the second portion 13b than in 13c. Therefore, it is possible to alleviate the discontinuity of impedance by relieving the high impedance generated at the boundary. Thus, the 2nd site | part 13b functions as an impedance matching part, and the impedance matching between the 1st site | part 13a and the 3rd site | part 13c can be performed.

  The substrate 5 in the present embodiment has a flat plate-like main body portion and screwing portions that are pulled out sideways from the four corners of the main body portion. The flat plate portion has a placement area where the electronic component 3 is placed on the upper surface. A screwing hole 5b is formed in each screwing portion. The package 1 can be fixed to a mounting substrate (not shown) with the screw holes 5b.

  In the present embodiment, the placement area means an area that overlaps the electronic component 3 when the substrate 5 is viewed in plan. The size of the substrate 5 is, for example, a rectangle having a side of 5 mm to 50 mm in the main body. Moreover, the thickness of the board | substrate 5 is 0.3 mm-3 mm, for example.

  In the present embodiment, the placement area is formed at the center of the upper surface of the substrate 5, but the present invention is not limited to this form. An area where the electronic component 3 is placed is referred to as a placement area. For example, there is no problem even if a placement area is formed at the end of the upper surface of the substrate 5. Moreover, the board | substrate 5 may have a some mounting area | region, and the electronic component 3 may be mounted in each mounting area | region.

  The electronic component 3 is placed on the placement area on the upper surface of the substrate 5. Examples of the electronic component 3 include an electronic component 3 such as an optical semiconductor element, an IC element, and a capacitor. Examples of the optical semiconductor element include a light emitting element that emits light represented by an LD (Laser Diode) element or a light receiving element that receives light represented by a PD (Photo Detector) element.

  The electrodes of the electronic component 3 are electrically connected to the wiring conductor 13 of the input / output member 9 via bonding wires (not shown) or the like. The electronic component 3 can input / output signals to / from an external wiring circuit (not shown) via the bonding wire and the wiring conductor 13. In some cases, the substrate 5 is required to have high insulating properties in the portion where the electronic component 3 is installed.

  The substrate 5 having high insulation is made of an insulating member. As the insulating member, for example, a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body may be used. it can. Further, a glass ceramic material may be used instead of these ceramic materials.

  A mixing member is prepared by mixing the raw material powder containing these glass powder and ceramic powder, an organic solvent, and a binder. A plurality of ceramic green sheets are produced by forming the mixed member into a sheet. A plurality of laminated bodies are produced by laminating the produced ceramic green sheets. The substrate 5 is produced by integrally firing the plurality of laminated bodies at a temperature of about 1600 ° C., respectively.

  The substrate 5 is not limited to a configuration in which a plurality of insulating members are stacked. The substrate 5 may be constituted by one insulating member. Moreover, as the board | substrate 5, it is good also as a structure which mounted the insulating member on the metal member, for example. In particular, when high heat dissipation is required for the substrate 5, the substrate 5 preferably includes a metal member. This is because the metal member has high heat dissipation. By setting it as the structure which mounted the insulating member on the metal member, the heat dissipation of the board | substrate 5 can be improved.

  For example, like the substrate 5 in this embodiment, an insulating mounting substrate 27 may be provided. In the package 1 of the present embodiment, the substrate 5 is made of a metal member, and the placement substrate 27 is placed on the placement region of the substrate 5. Then, the electronic component 3 is placed on the placement board 27.

  As the metal member, a metal material such as iron, copper, nickel, chromium, cobalt, and tungsten, an alloy made of these metals, or a metal member composed of these metals can be used. The metal member which comprises the board | substrate 5 is producible by giving metal processing methods, such as a rolling method, a punching method, and a cutting method, to such an ingot of a metal material.

  Further, as the mounting substrate 27, it is preferable to use a member having a good insulating property similarly to the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, a nitriding body is used. Ceramic materials such as an aluminum sintered body and a silicon nitride sintered body can be used. Further, a glass ceramic material may be used instead of these ceramic materials.

  The package 1 of the present embodiment includes a frame body 7 fixed to the upper surface of the substrate 5 so as to surround the mounting area. The frame 7 has a rectangular cylindrical shape on the inner peripheral surface and the outer peripheral surface in plan view, and includes four side wall portions. The frame body 7 is bonded to the substrate 5 via a bonding member (not shown) such as silver solder.

  For example, the outer periphery of the frame body 7 in a plan view has a vertical and horizontal side of 5 mm or more and 50 mm or less. Moreover, the thickness of the frame 7 which is the width between the outer periphery and the inner periphery is, for example, not less than 0.5 mm and not more than 2 mm. Moreover, the height of the frame 7 is 3 mm or more and 30 mm or less, for example.

  As the frame body 7, for example, a member having a good insulating property or a metal member is used similarly to the substrate 5. Examples of members having good insulation include ceramic materials such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body. Used. Further, as the metal member, for example, a metal material such as iron, copper, nickel, chromium, cobalt, and tungsten, an alloy made of these metal materials, or a metal member composed of these metals is used.

  The frame body 7 has a through-hole 7a that penetrates between the inner peripheral surface and the outer peripheral surface and has openings on the inner peripheral surface and the outer peripheral surface. The through hole in the present embodiment has a shape that opens to the inner peripheral surface, the outer peripheral surface, and the lower surface. In other words, a part of the lower surface side of the frame body 7 is cut out. Thus, the through hole 7a may have a shape in which the lower surface of the frame body 7 is cut out or a shape in which the upper surface is cut out. Further, the frame body 7 may have a plurality of such through holes 7a.

  The input / output member 9 is inserted and fixed in the through hole 7a. The input / output member 9 is a member that electrically connects the inside and outside of the frame body 7. In FIG. 1, FIG. 2, FIG. 4, and FIG. 5, the wiring conductor 13 and the ground conductor 14 are hatched for easy visual understanding.

  In the package 1 of the present embodiment, as can be seen from FIGS. 1 and 3, the substrate 5 has a notch portion 5a in a portion located below the through hole 7a. The input / output member 9 is fixed so that the side surface of the one insulating member 11 contacts. The first insulating member 11 has a through hole penetrating from the upper surface to the lower surface, and a through conductor 29 is formed in the through hole. The through conductor 29 is electrically connected to the end of the wiring conductor 13. The wiring conductor 13 is connected to the lower surface side of the package 1 by the through conductor 29. A lead terminal 31 is disposed on the lower surface of the first insulating member 11. The lead terminal 31 is electrically connected to the lower end of the through conductor 29. The lead terminal 31 is a member for electrically connecting an external wiring circuit and the through conductor 29. Note that ground terminals 31 a connected to the ground conductor 14 are shown on both sides of the lead terminal 31.

  The first insulating member 11 has a square plate shape. As an exemplary size of the first insulating member 11, one side parallel to the line direction of the wiring conductor 13 when viewed in plan is about 1 to 10 mm, and one side intersecting the line direction of the wiring conductor 13 when viewed in plan Is about 5 to 50 mm, and the thickness is about 0.5 to 2 mm.

  Similar to the first insulating member 11, the second insulating member 12 has a square plate shape. As an exemplary size of the second insulating member 12, one side parallel to the line direction of the wiring conductor 13 in a plan view is about 0.5 to 5 mm in the line direction of the wiring conductor 13 in a plan view. One side that is orthogonal is about 5 to 50 mm, and the thickness is about 0.5 to 2 mm.

  As the first insulating member 11 and the second insulating member 12, dielectric members having good insulation properties are preferably used. For example, an aluminum oxide sintered body having a relative dielectric constant of about 9.4, a mullite sintered body having a relative dielectric constant of about 7.5, a silicon carbide sintered body having a relative dielectric constant of about 40, A ceramic material such as an aluminum nitride sintered body having a relative dielectric constant of about 8.5 and a silicon nitride sintered body having a relative dielectric constant of about 9.6, or a glass ceramic material is used as the first insulating member. 11 and the second insulating member 12. In order to transmit a signal satisfactorily in the wiring conductor 13, the first insulating member 11 and the second insulating member 12 are made of a dielectric having a relative dielectric constant of about 4 to 50 as in the above member. Is preferred.

  The lower surface of the first insulating member 11 is preferably located above the lower surface of the substrate 5. This is because when the lead terminal 31 is joined to the lower surface of the first insulating member 11, the lead terminal 31 can be prevented from projecting below the lower surface of the substrate 5. Therefore, when the substrate 5 is fixed to the mounting substrate, the substrate 5 can be brought into close contact with the mounting substrate so as not to prevent heat dissipation.

  The line width W1 in the first part 13a of the wiring conductor 13 is, for example, about 0.05 to 0.5 mm, and the line width W2 in the second part 13b is, for example, about 0.15 to 1.5 mm. The line width W3 at 13c is, for example, about 0.1 to 1 mm. The line widths of the first part 13a, the second part 13b, and the third part 13c are based on the transmission characteristics required for the wiring conductor 13, and the dielectric constants of the first insulating member 11 and the second insulating member 12 are used. As appropriate.

  In addition, the said line | wire width assumes the case where the wiring conductor 13 forms the coplanar track | line. When the wiring conductor 13 is, for example, a microstrip line that does not have the ground conductor 14 on both sides, the line width is generally larger than the above.

  The line width W1 in the first part 13a is surrounded by the first part 13a and the second insulating member 12. Therefore, the line width W1 is set such that the dielectric has a high frequency line width having a characteristic impedance of, for example, 50Ω.

  The third portion 13c is disposed in air having a dielectric below the wiring conductor 13 and having a relative dielectric constant of approximately 1 above. Therefore, the line width W3 in the third portion 13c is determined so as to have a high-frequency line width having a characteristic impedance of, for example, 50Ω under such conditions.

  Since the effective dielectric constant around the wiring conductor 13 in the third portion 13c is smaller than the dielectric constant in the first portion 13a as described above, the line width W3 of the third portion 13c and the first portion 13a. Is different from the line width W1 before and after sandwiching the second portion 13b as the impedance matching portion. Generally, the line width W1 of the first part 13a is formed narrower than the line width W3 of the third part 13c.

  The second portion 13b determines a line width that has a shape having a capacitance component or the like that can cancel a high impedance value generated by an inductance component or the like at the boundary. These can also be obtained by simulation.

  When the wiring conductor 13 is a coplanar line, a gap of 0.05 mm to 1 mm is provided between the wiring conductor 13 and the ground conductor 14. When a plurality of wiring conductors 13 are arranged, the wiring conductors 13 are arranged at intervals of about 0.3 to 2 mm.

  In the package 1 of the present embodiment, the line width W2 in the second part 13b is larger than the line widths W1 and W3 in the first part 13a and the third part 13c, and the width of the wiring conductor 13 is not constant. . At this time, it is preferable that both the width of the gap between the ground conductor 14 and the second portion 13b and the width of the gap between the ground conductor 14 and the third portion 13c are set to the minimum width. That is, it is preferable that the edge of the ground conductor 14 facing the wiring conductor 13 is not a linear shape, but has a shape having a gap of a constant width according to a change in the width of the wiring conductor 13. Thereby, the signal transmission efficiency in the coplanar line can be increased.

  In the present embodiment, “ground” means being electrically connected to an external reference potential (not shown) as a so-called ground potential. Therefore, the ground potential as the reference potential does not necessarily have to be 0V.

  As the wiring conductor 13 and the ground conductor 14, it is preferable to use a member having good conductivity. For example, a metal material such as tungsten, molybdenum, nickel, copper, silver and gold can be used as the wiring conductor 13. The above metal materials may be used alone or as an alloy.

As a method for manufacturing the input / output member 9, for example, when the first insulating member 11 and the second insulating member 12 are made of an alumina (Al ₂ O ₃ ) ceramic, they are manufactured as follows. Add appropriate organic binder, organic solvent, plasticizer, dispersant, etc. to raw material powders such as alumina (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO). A plurality of ceramic green sheets are obtained by forming a slurry and forming this into a sheet by a conventionally known doctor blade method.

  Next, a plurality of ceramic green sheets serving as the first insulating member 11 are prepared and subjected to appropriate punching, and the upper ceramic green sheet is suitable for metal powders such as W, Mo, manganese (Mn). A conductive paste formed by mixing a binder and a solvent is printed and applied to a predetermined pattern of the wiring conductor 13 by a screen printing method, a gravure printing method, or the like. When the wiring conductor 13 is a coplanar line, the ground conductor 14 is simultaneously printed in a predetermined pattern. In addition, the conductor paste is applied and formed on the outer surface of the input / output member 9 to be joined to the substrate 5 and the frame body 7 for brazing.

  Next, a plurality of ceramic green sheets serving as the second insulating member 12 are prepared, and a metal powder such as W, Mo, Mn or the like for brazing is attached to the surface to be joined to the frame body 7 of the ceramic green sheet as the upper layer. A conductor paste formed by mixing an appropriate binder and solvent is applied in a predetermined pattern by screen printing, gravure printing or the like.

  Next, the laminated body to be the second insulating member 12 is laminated and pressure-bonded to the laminated body to be the first insulating member 11 to obtain a laminated body having the input / output member 9 having a convex side surface. The input / output member 9 is produced by printing and applying a conductor paste or the like that becomes a metal layer to be bonded to the side frame 7 of the laminated body, and finally baking at a temperature of about 1500 ° C. to 1600 ° C. The

  Finally, on the surface of the conductor layer such as the wiring conductor 13 of the input / output member 9, in order to prevent oxidative corrosion, to improve bondability such as wire bonding, to reduce electrical resistance, or to improve solderability Therefore, a metal layer such as a Ni (nickel) layer having a thickness of 0.5 to 9 μm or an Au (gold) layer having a thickness of 0.5 to 5 μm is deposited on the surface by a plating method.

  Next, another embodiment of the wiring conductor 13 will be described in detail with reference to the drawings. In addition, in each structure concerning this embodiment, about the structure which has a function similar to 1st Embodiment, the same referential mark is attached | subjected and the detailed description is abbreviate | omitted. In FIGS. 6, 7, 8, and 9, the wiring conductor 13 and the ground conductor 14 are hatched for easy visual understanding.

  In the wiring conductor 13 in the embodiment shown in FIG. 6, the shape of the second portion 13b is different from the shape of the second portion 13b in the wiring conductor 13 of the embodiment shown in FIG. The wiring conductor 13 in the first embodiment shown in FIG. 5 has a constant line width W2 at the second portion 13b, and the shape when viewed in plan is a substantially rectangular shape. On the other hand, in the wiring conductor 13 in the second embodiment, the line width W2 of the second part 13b gradually and linearly expands toward the first part 13a as shown in the plan view of FIG. . That is, the shape of the second portion 13b when viewed in plan is a trapezoidal shape.

  When the line width W2 of the second part 13b is not constant like the wiring conductor 13 of the present embodiment, the average value of the line widths of the second part 13b may be set to W2.

  As described in the above manufacturing method, the surface of the wiring conductor 13 is plated with a metal such as Ni or Au. At this time, if the second portion 13b is rectangular as shown in FIG. 5, the electric charge concentrates on the corners of the rectangle, and the plating may grow like a whisker from the corner to the outside. . The plating layer grown like a beard narrows the gap between the ground conductor 14 and easily causes a short circuit between the wiring conductor 13 and the ground conductor 14. By forming the wiring conductor 13 in the shape shown in FIG. 6, the sharp corner of the second portion 13 b is eliminated, so that the phenomenon that the plating layer grows abnormally like a beard can be made difficult to occur.

  Next, the shape of the wiring conductor 13 in the third embodiment will be described in detail with reference to FIG. In each configuration of the present embodiment, the same reference numerals are assigned to portions having the same functions as those in the first embodiment, and detailed description thereof is omitted.

  The wiring conductor 13 of this embodiment differs in the shape of the 2nd site | part 13b as shown in FIG. That is, the line width W2 in the second part 13b has a shape that gradually expands in a curve toward the first part 13a. For example, the outer periphery of the second portion 13b has a curved shape forming a part of an arc.

  Also in the wiring conductor 13 of the present embodiment, an acute corner is not formed in the second portion 13b, and the phenomenon that the plating layer grows abnormally like a beard can be made difficult to occur. Furthermore, the area of the 2nd site | part 13b can be taken larger than the 2nd site | part 13b in 2nd Embodiment.

  Further, in the wiring conductor 13 in the third embodiment shown in FIG. 8, the second portion 13b is circular in plan view. Therefore, similarly to the wiring conductor 13 shown in FIG. 7, the phenomenon that the plating layer abnormally grows like a beard can be made difficult to occur. Furthermore, the area can be increased while shortening the outer peripheral length of the second portion 13b, and the effect of the second portion 13b can be maximized as an impedance matching portion.

  10 and 11 show the simulation results of the high-frequency characteristics of the wiring conductor 13 when the second portion 13b is circular. FIG. 10 shows the reflection loss when a high frequency signal of 50 GHz or less is propagated through the wiring conductor 13. What is indicated by a solid line is a circular second portion 13b. Moreover, what is shown with a broken line is a conventional one in which the second portion 13b is not provided.

  FIG. 11 shows insertion loss when a high frequency signal of 50 GHz or less is propagated through the wiring conductor 13. What is indicated by a broken line indicates an insertion loss of the linear wiring conductor 13 in which the second portion 13b is not provided. The solid line indicates the insertion loss of the wiring conductor 13 when the circular second portion 13b is provided. As can be seen from FIGS. 10 and 11, it is understood that the reflection loss or the insertion loss is reduced by providing the circular second portion 13b.

  In any case where the line width W2 of the second part 13b is not constant, the average value of the line widths of the second part 13b may be set to W2.

  Furthermore, as a solution for making it difficult for the plating layer to grow abnormally like a beard, a portion where the plating layer grows abnormally like a beard may be covered with the insulator layer 15. For example, the wiring conductor 13 shown in FIG. 9 realizes the insulator layer 15 by forming a ceramic layer at the boundary covered by the second insulating member 12. This ceramic layer is formed by applying ceramic slurry to the boundary portion of the wiring conductor 13 before the second insulating member 12 is laminated on the upper surface of the first insulating member 11.

  The thickness of the ceramic layer is, for example, about 10 μm. With such a thickness, the high frequency characteristics due to the change in the dielectric constant are not greatly affected. Also, the thickness is sufficient to prevent abnormal growth of the plating layer.

  The insulator layer 15 may be provided so as to cover not only the boundary portion covered by the second insulating member 12 but also the acute angle portion of the wiring conductor 13 generated by providing the second portion 13b, and the plated layer grows abnormally. Can be prevented. In addition, although the example which provides the insulator layer 15 in embodiment of FIG. 5 was shown, it is applicable also to any embodiment of FIG. 6, FIG. 7, FIG. 8 other than FIG. preferable.

  Next, the electronic device 101 using the package 1 of the present embodiment is placed on the placement area of the substrate 5, the electronic component 3 connected to the wiring conductor 13, and a lid joined to the upper surface of the frame body 7. A body 103 is provided. The lid 103 is provided so as to seal the electronic component 3. The lid body 103 is joined to the upper surface of the frame body 7. The electronic component 3 is sealed in a space surrounded by the base body, the frame body 7 and the lid body 103. By sealing the electronic component 3 in this way, deterioration of the electronic component 3 due to the long-term use of the package 1 can be suppressed.

  As the lid 103, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, an alloy made of these metals, or a composite member in which these metals are combined can be used. The frame body 7 and the lid body 103 may be joined using, for example, gold-tin solder.

  Further, the frame body 7 and the lid body 103 may be directly joined by seam welding or the like. For example, a metal member having a ring shape that overlaps the frame body 7 when viewed in plan, a so-called seal ring is used. They may be joined with being sandwiched between them.

  As described above, the element storage package and the electronic device including the same according to each embodiment have been described. However, the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments may be made without departing from the scope of the present invention.

1: Electronic component storage package (package)
3: Electronic component 5: Substrate 5b: Screw hole 7: Frame body 9: Input / output member 11: First insulating member 12: Second insulating member 13: Wiring conductor 13a: First portion 13b: Second Part 13c: Third part 14: Ground conductor 15: Insulator layer 27: Mounting substrate 29: Through conductor 31: Lead terminal 101: Electronic device 103: Lid

Claims (8)

A first insulating member, a second insulating member bonded to the upper surface of the first insulating member, and a wiring conductor having a central portion sandwiched between the first insulating member and the second insulating member; And the wiring conductor has an impedance matching portion whose line width is wider than other portions at a boundary portion between the second insulating member and a portion exposed from the second insulating member. I / O member to be used. The input / output member according to claim 1, wherein the wiring conductor has different line widths before and after the impedance matching portion. The input / output member according to claim 1, wherein the impedance matching portion has a curved shape in a plan view and has a wide line width. The input / output member according to claim 3, wherein the impedance matching portion has an arc shape in a plan view and has a wide line width. The input / output member according to claim 4, wherein the impedance matching portion is circular in a plan view. The input / output member according to claim 1, wherein the wiring conductor is covered with an insulator layer at the boundary. A substrate having a placement area on the top surface on which electronic components are placed;
A frame body provided on the upper surface of the substrate so as to surround the placement area, and having a through-hole opened in an inner peripheral surface and an outer peripheral surface;
An electronic component housing package comprising: the input / output member according to claim 1, which is fixed so as to close the through hole. The electronic component storage package according to claim 7;
An electronic device comprising: an electronic component placed on the placement area of the electronic component storage package and connected to the wiring conductor.

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