CN204144237U - Input and output component and electronic unit storage packaging part and electronic installation - Google Patents
Input and output component and electronic unit storage packaging part and electronic installation Download PDFInfo
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- CN204144237U CN204144237U CN201290001069.0U CN201290001069U CN204144237U CN 204144237 U CN204144237 U CN 204144237U CN 201290001069 U CN201290001069 U CN 201290001069U CN 204144237 U CN204144237 U CN 204144237U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
- H01L2223/6655—Matching arrangements, e.g. arrangement of inductive and capacitive components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model proposes a kind of input and output component and electronic unit storage packaging part and electronic installation.In the input and output component of electronic unit storage packaging part, need to reduce high-frequency signal loss.Input and output component (9) based on an execution mode of the present utility model possesses the wiring conductor (13) that the 1st insulating component (11), the 2nd insulating component (12) engaged with the upper surface of the 1st insulating component (11) and central portion are clipped by the 1st insulating component (11) and the 2nd insulating component (12).Then, wiring conductor (13) the part exposed from the 2nd insulating component (12) with the boundary portion of the 2nd insulating component (12), there is the impedance match portion that live width is wider compared with other positions.
Description
Technical field
The utility model relates to the input and output component of electronic unit storage packaging part for receiving the such electronic unit of semiconductor element etc. and employs electronic unit storage packaging part, the electronic installation of this input and output component.Such electronic installation can use in electronic equipment of various.
Background technology
As the electronic unit storage of housing electronic parts with packaging part (following, also referred to as packaging part), there will be a known the electronic parts package part such as recorded in Unexamined Patent 9-64223 publication.This packaging part possesses the input and output conductive pattern for being electrically connected with outside electric circuit by the electronic unit being accommodated in inside.In addition, possess the 2nd earthy conductive pattern being set to input and output conductive pattern to be clipped in the middle, define coplanar line by input and output conductive pattern and the 2nd earthy conductive pattern.
In this packaging part, the distance except input and output conductive pattern part between the 2nd earthy conductive pattern is set to the part length compared with the part do not covered by the 3rd insulator layer covered by the 3rd insulator layer.Thus, carried out by the 3rd part of insulator layer covering and mating of the characteristic impedance between not capped part.
At first technical literature
Patent documentation
Patent documentation 1:JP Unexamined Patent 9-64223 publication
Utility model content
The problem that utility model will solve
But even if the part that insulated body layer covers can be mated respectively with the characteristic impedance of not capped part, the high frequency characteristics of these continuous print HF link is also abundant not enough.
In addition, when making high-frequency signal become high output, the resistance to pressure considering high-frequency signal circuit is also needed.The utility model is done in view of above-mentioned problem, and object is that providing a kind of can carry out the input and output component of good impedance matching and employ electronic unit storage packaging part and the electronic installation of this input and output component.
Solve the means of problem
Input and output component based on 1 mode of the present utility model possesses: the 1st insulating component; 2nd insulating component, it engages with the upper surface of the 1st insulating component; And wiring conductor, its central portion is clipped by described 1st insulating component and described 2nd insulating component.This wiring conductor the part exposed from described 2nd insulating component with the boundary portion of described 2nd insulating component, there is the impedance match portion that live width is wider compared with other positions.
Utility model effect
According to the input and output component involved by an execution mode of the present utility model, wiring conductor the part exposed from the 2nd insulating component with the boundary portion of the 2nd insulating component, there is the impedance match portion that live width is wider compared with other positions, thus by the impedance match portion that live width is wider, the impedance mismatch produced in boundary portion is mated, can improve by the high frequency characteristics of the part of the 2nd insulating component covering with the wiring conductor of not capped partial continuous.
Accompanying drawing explanation
Fig. 1 is the electronic unit storage packaging part of the 1st execution mode and possesses the exploded perspective view of electronic installation of this packaging part.
Fig. 2 is the stereogram of the electronic unit storage packaging part of the 1st execution mode shown in Fig. 1.
Fig. 3 is the profile of the X-X section of the electronic unit storage packaging part shown in Fig. 2.
Fig. 4 is the exploded perspective view of the input and output component for the electronic unit storage packaging part shown in Fig. 1, Fig. 2.
Fig. 5 is the vertical view of the input and output component shown in Fig. 4.
Fig. 6 is the vertical view of the input and output component in the electronic unit storage packaging part of the 2nd execution mode.
Fig. 7 is the vertical view of the input and output component in the electronic unit storage packaging part of the 3rd execution mode.
Fig. 8 is the vertical view of the input and output component in the electronic unit storage packaging part of the 4th execution mode.
Fig. 9 is the vertical view of the input and output component in the electronic unit storage packaging part of the 5th execution mode.
Figure 10 is the line chart of the analog result of the high frequency reflection loss of the input and output component represented in the electronic unit storage packaging part of the 4th execution mode.
Figure 11 is the line chart of the analog result of the high frequency insertion loss of the input and output component represented in the electronic unit storage packaging part of the 4th execution mode.
Embodiment
Below, about each execution mode of the present utility model input and output component and possess electronic unit storage packaging part, the electronic installation of this input and output component, use accompanying drawing to be described in detail.But each figure of following institute reference illustrates main formation briefly.Input and output component, packaging part and electronic installation involved by the utility model can possess arbitrary member of formation not shown in each figure of this specification institute reference, form in detail.In addition, the reduced scale of each figure is different from actual reduced scale.
Fig. 1, Fig. 2, Fig. 3 represent packaging part 1 and the electronic installation 101 of the 1st execution mode of the present utility model.Packaging part 1 possesses: substrate 5, and it has the mounting region of mounting electronic unit 3 at upper surface; With framework 7, it is arranged at the upper surface of substrate 5 with surrounding mounting region.Framework 7 has and has opening and the through hole 7a of through framework 7 at inner peripheral surface and outer peripheral face.In through hole 7a, between the inner and outer being fixed for the region surrounded in framework 7, carry out the input and output component 9 of the input and output of signal.
Fig. 4 represents the exploded perspective view of the input and output component 9 in present embodiment.The 2nd insulating component 12 that input and output component 9 possesses the 1st insulating component 11 and engages with the upper surface of the 1st insulating component 11.Wiring conductor 13 is formed at the upper surface of the 1st insulating component 11.Wiring conductor 13 is clamped an end by the 2nd insulating component 12 and is formed.Width and the 1st insulating component 11 of the line direction of the wiring conductor 13 of the 2nd insulating component 12 are narrow, and therefore one end of wiring conductor 13 is exposed.In addition, also in the both sides of the line direction along wiring conductor 13, earthing conductor 14 can be set with separating certain intervals.Wiring conductor 13 and earthing conductor 14 form coplanar lines.
Wiring conductor 13 has: the 1st position 13a, and it is clamped by the 1st insulating component 11 and the 2nd insulating component 12; 2nd position 13b, it is adjacent with the 1st position 13a and be positioned at the boundary portion exposed from the 2nd insulating component 12; And the 3rd position 13c, it exposes from the 2nd insulating component 12, and adjacent with the 2nd position 13b.The 1st position 13a that 2nd position 13b is clipped by the 2nd insulating component 12 and the portion boundary portion that wiring conductor 13 exposes from the 2nd insulating component 12, be positioned at the side of exposing from the 2nd insulating component 12.Then, to be formed as live width W2 compared with the 1st position 13a and the 3rd position 13c wider for the 2nd position 13b.
Like this, by making the live width W2 of the 2nd position 13b wider than the live width W1 of the 1st position 13a and the live width W3 of the 3rd position 13c, thus reduce at the 2nd position 13b high-frequency resistance compared with the 1st position 13a and the 3rd position 13c.Therefore, it is possible to relax the high impedance that produces in boundary portion thus relax impedance discontinuous.Like this, the 2nd position 13b plays a role as impedance match portion, can carry out the impedance matching between the 1st position 13a and the 3rd position 13c.
The main part that substrate 5 in present embodiment has writing board shape and the holding screw portion of drawing respectively to side from the corner of this main part.Flat part has the mounting region of mounting electronic unit 3 at upper surface.In holding screw portion, be formed with holding screw hole 5b respectively.By this holding screw hole 5b, packaging part 1 can be stamped screw and be fixed on installation base plate (not shown).
In addition, so-called mounting region means the region overlapped each other with electronic unit 3 when overlooking substrate 5 in the present embodiment.As the size of substrate 5, such as, main part is the rectangle for 5mm ~ 50mm.In addition, the thickness of substrate 5 is such as 0.3mm ~ 3mm.
In the present embodiment, mounting region is formed at the central portion of the upper surface of substrate 5, but is not limited to which.Be called mounting region as by the region of mounting electronic unit 3, such as, also can form mounting region in the end of the upper surface of substrate 5.In addition, also multiple mounting region can be had by substrate 5, and at each mounting region mounting electronic unit 3.
Electronic unit 3 is placed in the mounting region of the upper surface of substrate 5.As the example of electronic unit 3, the electronic unit 3 of optical semiconductor, IC element and capacitor and so on can be listed.As the example of optical semiconductor, such as, the light-emitting component of LD (Laser Diode) the injection light representated by element or the photo detector accepting light representated by PD (Photo Detector) element can be listed.
The electrode of electronic unit 3 is electrically connected with the wiring conductor 13 of input and output component 9 via bonding wire (not shown) etc.Electronic unit 3 can carry out the input and output of signal between the wired circuit (not shown) of outside via this bonding wire and wiring conductor 13 etc.As substrate 5, there is the situation to the means suitable high-insulativity arranging electronic unit 3.
The substrate 5 with high-insulativity is made into by insulating component.As insulating component, such as, the ceramic material of aluminum oxide sintered body, mullite sintered body, silicon carbide-based sintered, aluminum nitride sintered body and silicon nitride based sintered material and so on can be used.In addition, also can replace these ceramic materials and use glass ceramic material.
By being stirred in together by the material powder containing these glass powders and ceramic powders, organic solvent and adhesive, make hybrid component.Multiple ceramic green sheet is made by this hybrid component is shaped to sheet.By making multiple duplexer by stacked for the multiple ceramic green sheets be made into.Substrate 5 is made into by integrally being fired with the temperature of about 1600 DEG C respectively by multiple duplexer.
In addition, as substrate 5, be not limited to the formation being laminated with multiple insulating component.Also substrate 5 can be formed by 1 insulating component.In addition, as substrate 5, such as, also can be set to loaded the formation of insulating component on hardware.Especially, when requiring high-cooling property to substrate 5, preferable substrate 5 is the formations comprising hardware.This is because hardware has high-cooling property.On hardware, loading the formation of insulating component by being set to, the thermal diffusivity of substrate 5 can have been improved.
Such as, also as the substrate 5 in present embodiment, the mounting substrate 27 of insulating properties can be possessed.In the packaging part 1 of present embodiment, substrate 5 is made up of hardware, and the mounting region of this substrate 5 is placed with mounting substrate 27.Then, this mounting substrate 27 loads electronic unit 3.
As hardware, iron, copper, nickel, chromium, the metal material of cobalt and tungsten and so on or the alloy be made up of these metals can be used or by the hardware of these metal composite.By implementing the such intermetallic composite coating method of rolling processing method, punch process method, cut method to the ingot casting of such metal material, the hardware forming substrate 5 can be made.
In addition, as mounting substrate 27, the component that preferred use insulating properties same with insulating component is good, such as, can use the ceramic material of aluminum oxide sintered body, mullite sintered body, silicon carbide-based sintered, aluminum nitride sintered body and silicon nitride based sintered material and so on.In addition, also can replace these ceramic materials and use glass ceramic material.
The packaging part 1 of present embodiment possesses be fixed on the upper surface of substrate 5 framework 7 with surrounding mounting region.For framework 7, overlook inner peripheral surface in situation and outer peripheral face is respectively dimetric barrel shape, and be made up of 4 sidewall sections.Framework 7 engages with substrate 5 via the engagement member (not shown) of silver solder etc.
Overlook the periphery of the framework 7 in situation, such as, anyhow be more than 5mm and below 50mm.In addition, the thickness of the width between periphery and inner circumferential and framework 7, such as, be more than 0.5mm and below 2mm.In addition, the height of framework 7, such as, be more than 3mm and below 30mm.
As framework 7, such as, the component that can insulating properties be used in the same manner as substrate 5 good or hardware.As the component that insulating properties is good, such as, the ceramic material of aluminum oxide sintered body, mullite sintered body, silicon carbide-based sintered, aluminum nitride sintered body and silicon nitride based sintered material and so on can be used.In addition, as hardware, such as, iron, copper, nickel, chromium, the metal material of cobalt and tungsten and so on or the alloy be made up of these metal materials can be used or by the hardware of these metal composite.
Framework 7 has through hole 7a, and this through hole 7a by through between inner peripheral surface and outer peripheral face, and has opening at inner peripheral surface and outer peripheral face.Through hole in present embodiment has the shape at inner peripheral surface, outer peripheral face and lower surface opening.In other words, a shape part for the lower face side of framework 7 cut is set to.Like this, through hole 7a also can be the shape of the lower surface cutting framework 7 or cut the shape of upper surface.This outer frame body 7 also can have multiple such through hole 7a.
In through hole 7a, insert and fix input and output component 9.Input and output component 9 is by the component of electrical connection inside and outside framework 7.In addition, in Fig. 1, Fig. 2, Fig. 4, Fig. 5, for the ease of visual understanding, hacures are employed to wiring conductor 13 and earthing conductor 14.
In the packaging part 1 of present embodiment, from Fig. 1, Fig. 3, substrate 5 has notch 5a in the part of the below being positioned at through hole 7a, at this notch 5a, fixes input and output component 9 with the side phase ground connection of the 1st insulating component 11.In addition, in the 1st insulating component 11, be formed from upper surface until lower surface carries out through through hole, in this through hole, be formed with through conductor 29.Through conductor 29 is electrically connected with the end of wiring conductor 13.By through conductor 29, wiring conductor 13 is connected to the lower face side of packaging part 1.Then, at the lower surface of the 1st insulating component 11, lead terminal 31 is configured with.Lead terminal 31 is electrically connected with the lower end of through conductor 29.Lead terminal 31 is the components for being electrically connected with through conductor 29 by the wired circuit of outside.In addition, in the both sides of lead terminal 31, indicate the earth terminal 31a be connected with earthing conductor 14.
1st insulating component 11 is Square consisting of two isosceles right-angled triangles shapes.As the illustrative size of the 1st insulating component 11, that overlooks in situation is parallel with the line direction of wiring conductor 13 while be 1 ~ 10mm degree, that overlooks in situation is crossing with the line direction of wiring conductor 13 while be 5 ~ 50mm degree, and thickness is 0.5 ~ 2mm degree.
2nd insulating component 12 and the 1st insulating component 11 are similarly Square consisting of two isosceles right-angled triangles shape.As the illustrative size of the 2nd insulating component 12, that overlooks in situation is parallel with the line direction of wiring conductor 13 while be 0.5 ~ 5mm degree, that overlooks in situation is orthogonal with the line direction of wiring conductor 13 while be 5 ~ 50mm degree, and thickness is 0.5 ~ 2mm degree.
As the 1st insulating component 11 and the 2nd insulating component 12, be preferably the dielectric component using insulating properties good.Such as, the aluminum nitride sintered body that the mullite sintered body that the aluminum oxide sintered body that relative dielectric constant is 9.4 degree, relative dielectric constant are 7.5 degree, relative dielectric constant are the silicon carbide-based sintered of 40 degree, relative dielectric constant is 8.5 degree and relative dielectric constant are ceramic material or the glass ceramic material of the silicon nitride based sintered material of 9.6 degree and so on, can be used as the 1st insulating component 11 and the 2nd insulating component 12.In order to signal transmission well in wiring conductor 13, the dielectric that preferably the 1st insulating component 11 and the 2nd insulating component 12 are 4 ~ 50 degree by the relative dielectric constant that above-mentioned component is such is formed.
Preferably the lower surface of the 1st insulating component 11 is positioned at lower surface than substrate 5 closer to top.This is because when lead terminal 31 engages with the lower surface of the 1st insulating component 11, lead terminal 31 can be made downwards can not to give prominence to than the lower surface of substrate 5.Therefore, when substrate 5 is fixed on installation base plate, substrate 5 can be made to be close to installation base plate, thus not hinder heat radiation.
The live width W1 of the 1st position 13a of wiring conductor 13 is such as the live width W2 of 0.05 ~ 0.5mm degree, the 2nd position 13b, such as, be the live width W3 of 0.15 ~ 1.5mm degree, the 3rd position 13c, such as, be 0.1 ~ 1mm degree.Each live width of the 1st position 13a, the 2nd position 13b and the 3rd position 13c is based on transmission characteristic required in wiring conductor 13, and the dielectric constant according to the 1st insulating component 11 and the 2nd insulating component 12 suitably determines.
In addition, above-mentioned live width supposes the situation that wiring conductor 13 defines coplanar lines.When wiring conductor 13 is such as the microstripline not having earthing conductor 14 in both sides, be generally set to than above-mentioned thick live width.
For the live width W1 of the 1st position 13a, around surrounded by the 1st position 13a and the 2nd insulating component 12.Therefore, the live width W1 that the such HF link width of characteristic impedance for having such as 50 Ω is in the dielectric such is positioned.
For the 3rd position 13c, the below of wiring conductor 13 is for dielectric and top is configured at relative dielectric constant is roughly in the air of 1.Therefore, the live width W3 of the 3rd position 13c is positioned the such HF link width of characteristic impedance for having such as 50 Ω in such a situa-tion.
Because the effective dielectric constant of the surrounding of the wiring conductor 13 of the 3rd position 13c is less than the dielectric constant of the 1st position 13a as mentioned above, thus the live width W3 of the 3rd position 13c and the live width W1 of the 1st position 13a, clipping, the front and back live width as the 2nd position 13b of impedance match portion is different.Generally speaking, the live width W1 of the 1st position 13a is formed thinner compared with the live width W3 of the 3rd position 13c.
2nd position 13b, determines to become the live width of the shape of the capacitive component of the inductance composition etc. having and can cancel due to boundary portion and the high impedance value produced etc.These also can be tried to achieve by simulation.
In addition, when wiring conductor 13 is coplanar lines, the gap of 0.05mm ~ 1mm is set between wiring conductor 13 and earthing conductor 14.In addition, when configuring multiple wiring conductor 13, wiring conductor 13 configures according to the interval of 0.3 ~ 2mm degree.
In the packaging part 1 of present embodiment, the live width W2 of the 2nd position 13b is large compared with live width W1, the W3 of the 1st position 13a and the 3rd position 13c, and the width of wiring conductor 13 is not fixed.Now, preferably both width in the width in the gap between earthing conductor 14 and the 2nd position 13b and the gap between earthing conductor 14 and the 3rd position 13c are all set to minimum widith.That is, the edge of preferably opposite with wiring conductor 13 earthing conductor 14 non-linear shapes, but the change become according to the width of wiring conductor 13 and there is the shape in the gap of fixed width.Thereby, it is possible to improve the efficiency of transmission of the signal of coplanar lines.
In addition, so-called " ground connection " means and to be electrically connected with the reference potential (not shown) as so-called earthy outside in the present embodiment.Therefore, the ground connection as reference potential does not need current potential must be 0V.
As wiring conductor 13 and earthing conductor 14, preferably use the component that conductivity is good.Such as, tungsten, molybdenum, nickel, copper, silver and golden and so on metal material can be used as wiring conductor 13.Can solely use above-mentioned metal material, or, also can use as alloy.
As the manufacture method of input and output component 9, if such as at the 1st insulating component 11 and the 2nd insulating component 12 by aluminium oxide (Al
2o
3) matter pottery form when, then can make according to mode below.At aluminium oxide (Al
2o
3), silica (SiO
2), add the suitable organic bond, organic solvent, plasticizer, dispersant etc. of mixing in the material powder of magnesium oxide (MgO), calcium oxide (CaO) etc. and be formed as pulp-like, it is well-knownly scraped the skill in using a kitchen knife in cookery by existing and be formed as sheet, obtains many pieces of ceramic green sheets thus.
Then, prepare the ceramic green sheet that many pieces become the 1st insulating component 11, implement suitable punch process, and becoming the ceramic green sheet on upper strata, by mixing suitable adhesive in the metal dust of W, Mo, manganese (Mn) etc., the conductor paste of solvent prints the predetermined pattern being applied as wiring conductor 13 by silk screen print method, woodburytype etc.When wiring conductor 13 is coplanar lines, earthing conductor 14 also side by side printing is applied as predetermined pattern.In addition, at the position engaged with substrate 5 and the framework 7 of outside of input and output component 9, the coated formation of above-mentioned conductor paste uses for soldering.
Then, prepare the ceramic green sheet that many pieces become the 2nd insulating component 12, and in the face engaged with framework 7 of ceramic green sheet becoming upper strata, by mixing suitable adhesive in the metal dust of W, Mo, Mn etc. of soldering, the conductor paste of solvent to be printed by silk screen print method, woodburytype etc. and is applied as predetermined pattern.
Then, laminate on the duplexer upper strata becoming the 1st insulating component 11 that to be connected into be the duplexer of the 2nd insulating component 12, obtain the duplexer becoming input and output component 9 that side is convex shape.Printing coating become gained to the conductor paste etc. of the metal level engaged with framework 7 of side of duplexer, finally fire at the temperature of 1500 DEG C ~ 1600 DEG C of degree, be made into input and output component 9 thus.
Finally, on the surface of the conductor layer of wiring conductor 13 grade of input and output component 9, in order to prevent oxide etch, in order to improve wire-bonded etc. zygosity, in order to reduce electrical resistance or in order to improve weldability, by plating method, the metal level of Ni (nickel) layer of thickness 0.5 ~ 9 μm or Au (gold) layer of thickness 0.5 ~ 5 μm etc. be covered in surface.
Then, accompanying drawing other execution modes to wiring conductor 13 are used to be described in detail.In addition, in each formation involved by present embodiment, for having the formation with the 1st execution mode identical function, mark identical reference marks, description is omitted.In addition, in Fig. 6, Fig. 7, Fig. 8, Fig. 9, for the ease of visual understanding, hacures are employed to wiring conductor 13 and earthing conductor 14.
The shape of the 2nd position 13b of the wiring conductor 13 in the execution mode shown in Fig. 6 is different from the shape of the 2nd position 13b of the wiring conductor 13 of the execution mode shown in Fig. 5.Live width W2 for wiring conductor the 13,2nd position 13b in the 1st execution mode shown in Fig. 5 fixes, and the shape of overlooking in situation is roughly rectangular shape.On the other hand, for the wiring conductor 13 in the 2nd execution mode, vertical view is as shown in Figure 6 such, and the live width W2 of the 2nd position 13b linearly expands gradually towards the 1st position 13a.That is, the shape of overlooking the 2nd position 13b in situation becomes trapezoidal shape.
In addition, as the wiring conductor 13 of present embodiment, in the unfixed situation of live width W2 of the 2nd position 13b, as long as the mean value of the live width of the 2nd position 13b is set to W2.
What illustrate in above-mentioned manufacture method is such, at the metal of coating surface Ni, Au etc. of wiring conductor 13.Now, if the 2nd position 13b is oblong-shaped as shown in Figure 5, then there is charge concentration in rectangular bight thus plating grows into the situation of beard shape outside angle.This coating layer growing into beard shape makes the gap turn narrow between earthing conductor 14, is easily short-circuited between wiring conductor 13 and earthing conductor 14.By wiring conductor 13 is set to the shape shown in Fig. 6, the acute angle of the 2nd position 13b and bight disappear, so can make to be difficult to produce the phenomenon that this coating layer misgrowth becomes beard shape.
Then, be described in detail with reference to the shape of Fig. 7 to the wiring conductor 13 in the 3rd execution mode.In addition, in each formation of present embodiment, also have the part of identical function to the 1st execution mode, mark identical reference marks, description is omitted.
As shown in Figure 7, the shape of the 2nd position 13b is different for the wiring conductor 13 of present embodiment.That is, the live width W2 of the 2nd position 13b has the shape expanded in a curve gradually towards the 1st position 13a.Such as, the periphery of the 2nd position 13b is set as the curve shape of the part forming circular arc.
In the wiring conductor 13 of present embodiment, be not formed into the bight of acute angle at the 2nd position 13b yet, thus can make to be difficult to produce the phenomenon that coating layer misgrowth becomes beard shape.And then, can the area of the 2nd position 13b be made compared with the 2nd position 13b in the 2nd execution mode to obtain larger.
And then, be toroidal under overlooking for wiring conductor the 13,2nd position 13b in the 3rd execution mode shown in Fig. 8.Therefore, it is possible to make to be difficult to produce the phenomenon that coating layer misgrowth becomes beard shape in the same manner as the wiring conductor 13 shown in above-mentioned Fig. 7.And then area obtains very large area while can shortening the outer perimeter of the 2nd position 13b, the effect of the 2nd position 13b can be improved to greatest extent as impedance match portion.
In Figure 10 and Figure 11, the analog result of the high frequency characteristics of the wiring conductor 13 when the 2nd position 13b is toroidal is shown.Figure 10 illustrates reflection loss when making wiring conductor 13 propagate the high-frequency signal of below 50GHz.Shown in solid line is the wiring conductor of the 2nd position 13b being provided with toroidal.In addition, shown in dotted line is the existing wiring conductor not arranging the 2nd position 13b.
Figure 11 illustrates insertion loss when making wiring conductor 13 propagate the high-frequency signal of below 50GHz.Dotted line represents the insertion loss of the wiring conductor 13 of the linearity not arranging the 2nd position 13b.The insertion loss of the wiring conductor 13 when solid line represents the 2nd position 13b being provided with toroidal.From Figure 10, Figure 11, by arranging the 2nd position 13b of toroidal, reflection loss or insertion loss reduce.
In live width W2 any one situation unfixed of the 2nd position 13b as described above, as long as the mean value of the live width of the 2nd position 13b is set to W2.
And, being difficult to produce the solution that coating layer misgrowth becomes the phenomenon of beard shape as making, also can covering with insulator layer 15 position that coating layer misgrowth becomes beard shape.Such as, the wiring conductor 13 shown in Fig. 9, achieves insulator layer 15 by forming ceramic layer in the boundary portion covered by the 2nd insulating component 12.This ceramic layer by before the upper surface the 2nd insulating component 12 being layered in the 1st insulating component 11, in advance wiring conductor 13 boundary portion coated with ceramic slurry and formed.
The thickness of ceramic layer is such as 10 μm of degree.As long as the thickness of this degree would not cause very large impact to the high frequency characteristics based on change in dielectric constant.In addition, this is to prevent the excrescent sufficient thickness of coating layer.
Insulator layer 15 also can be set to, except covering boundary portion that the 2nd insulating component 12 covers, also cover the acute angle part of the wiring conductor 13 produced owing to arranging the 2nd position 13b, thus can prevent coating layer misgrowth.In addition, the example arranging insulator layer 15 in the execution mode of Fig. 5 is represented, but except the execution mode that can be applied to Fig. 5, also can be applied to any one execution mode in Fig. 6, Fig. 7, Fig. 8, preferably insulator layer is set.
Then, the electronic installation 101 employing the packaging part 1 of present embodiment possesses: electronic unit 3, and it is placed in the mounting region of substrate 5 and is connected with wiring conductor 13; And lid, it engages with the upper surface of framework 7.Lid 103 is set to seal electronic unit 3.Lid 103 engages with the upper surface of framework 7.Then, in the space that matrix, framework 7 and lid 103 surround, electronic unit 3 is sealed.By such encapsulated electronic components 3, the deterioration of the electronic unit 3 caused by use of long-standing packaging part 1 can be suppressed.
As lid 103, such as, iron, copper, nickel, chromium, the hardware of cobalt and tungsten and so on or the alloy be made up of these metals can be used or by the composite component of these metal composite.In addition, framework 7 and lid 103 such as also can use gold-tin solder etc. to engage.
In addition, framework 7 and lid 103 also directly can be engaged by seam weldering etc., but also such as, overlap each other with framework 7 in the situation of overlooking such annular hardware, i.e. so-called sealing ring can be clipped in the middle and be engaged.
Above, the element storage packaging part of each execution mode and the electronic installation that possesses this packaging part are illustrated, but the utility model is not defined in above-mentioned execution mode.That is, as long as the combination of various change, execution mode can be carried out in the scope not departing from purport of the present utility model.
Symbol description
1 electronic unit storage packaging part (packaging part)
3 electronic units
5 substrates
5b holding screw hole
7 frameworks
9 input and output components
11 the 1st insulating components
12 the 2nd insulating components
13 wiring conductor
13a the 1st position
13b the 2nd position
13c the 3rd position
14 earthing conductors
15 insulator layers
27 mounting substrates
29 through conductors
31 lead terminals
101 electronic installations
103 lids
Claims (8)
1. an input and output component, is characterized in that, possesses:
1st insulating component;
2nd insulating component, it engages with the upper surface of the 1st insulating component; With
Wiring conductor, its central portion is clipped by described 1st insulating component and described 2nd insulating component,
This wiring conductor, in the boundary portion of the part exposed from described 2nd insulating component with described 2nd insulating component, has the impedance match portion that live width is wider compared with other positions.
2. input and output component according to claim 1, is characterized in that,
Described wiring conductor is different in the front and back live width of described impedance match portion.
3. input and output component according to claim 1, is characterized in that,
Described impedance match portion has curve shape under overlooking and live width expands.
4. input and output component according to claim 3, is characterized in that,
Described impedance match portion has circular shape under overlooking and live width expands.
5. input and output component according to claim 4, is characterized in that,
Described impedance match portion is circle overlooking lower.
6. the input and output component according to any one of Claims 1 to 5, is characterized in that,
Described wiring conductor covers at described boundary portion insulated body layer.
7. an electronic unit storage packaging part, is characterized in that, has:
Substrate, it has the mounting region of mounting electronic unit at upper surface;
Framework, it is arranged at the upper surface of described substrate with surrounding described mounting region, and has the through hole at inner peripheral surface and outer peripheral face opening; With
Input and output component according to any one of claim 1 ~ 6, it is fixed to blocks described through hole.
8. an electronic installation, possesses:
Electronic unit storage packaging part according to claim 7; With
Be placed in the described mounting region of this electronic unit storage packaging part and the electronic unit be connected with described wiring conductor.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011286801 | 2011-12-27 | ||
| JP2011-286801 | 2011-12-27 | ||
| PCT/JP2012/083636 WO2013099936A1 (en) | 2011-12-27 | 2012-12-26 | Input/output member, package for housing electronic component, and electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204144237U true CN204144237U (en) | 2015-02-04 |
Family
ID=48697418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201290001069.0U Expired - Fee Related CN204144237U (en) | 2011-12-27 | 2012-12-26 | Input and output component and electronic unit storage packaging part and electronic installation |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5926290B2 (en) |
| CN (1) | CN204144237U (en) |
| WO (1) | WO2013099936A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109979883A (en) * | 2019-04-30 | 2019-07-05 | 烟台艾睿光电科技有限公司 | A kind of integrated device mould group |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015030093A1 (en) * | 2013-08-28 | 2015-03-05 | 京セラ株式会社 | Package for housing elements and mounting structure |
| TWI506828B (en) * | 2013-11-20 | 2015-11-01 | Lextar Electronics Corp | Illuminating device |
| WO2015088028A1 (en) * | 2013-12-13 | 2015-06-18 | 京セラ株式会社 | Element housing package and mounting structure |
| JP6497644B2 (en) * | 2014-07-11 | 2019-04-10 | パナソニックＩｐマネジメント株式会社 | Photoelectric conversion device and signal transmission device using the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6122328Y2 (en) * | 1980-09-16 | 1986-07-04 | ||
| JPS60123044A (en) * | 1983-12-07 | 1985-07-01 | Fujitsu Ltd | Semiconductor device |
| JP3311279B2 (en) * | 1996-11-14 | 2002-08-05 | 株式会社東芝 | Ultra high frequency package |
| JPH11339898A (en) * | 1998-03-27 | 1999-12-10 | Kyocera Corp | High frequency input and output terminal, and package for high frequency circuit |
| JP5287390B2 (en) * | 2009-03-16 | 2013-09-11 | ソニー株式会社 | Semiconductor device, transmission system, semiconductor device manufacturing method, and transmission system manufacturing method |
-
2012
- 2012-12-26 JP JP2013551735A patent/JP5926290B2/en active Active
- 2012-12-26 WO PCT/JP2012/083636 patent/WO2013099936A1/en active Application Filing
- 2012-12-26 CN CN201290001069.0U patent/CN204144237U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109979883A (en) * | 2019-04-30 | 2019-07-05 | 烟台艾睿光电科技有限公司 | A kind of integrated device mould group |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013099936A1 (en) | 2013-07-04 |
| JPWO2013099936A1 (en) | 2015-05-11 |
| JP5926290B2 (en) | 2016-05-25 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150204 Termination date: 20201226 |
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| CF01 | Termination of patent right due to non-payment of annual fee |