JPWO2013011921A1 - 研磨パッド - Google Patents

研磨パッド Download PDF

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Publication number
JPWO2013011921A1
JPWO2013011921A1 JP2012532393A JP2012532393A JPWO2013011921A1 JP WO2013011921 A1 JPWO2013011921 A1 JP WO2013011921A1 JP 2012532393 A JP2012532393 A JP 2012532393A JP 2012532393 A JP2012532393 A JP 2012532393A JP WO2013011921 A1 JPWO2013011921 A1 JP WO2013011921A1
Authority
JP
Japan
Prior art keywords
polishing
angle
rate
pad
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012532393A
Other languages
English (en)
Japanese (ja)
Inventor
奈々 竹内
奈々 竹内
誠司 福田
誠司 福田
奥田　良治
良治 奥田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2012532393A priority Critical patent/JPWO2013011921A1/ja
Publication of JPWO2013011921A1 publication Critical patent/JPWO2013011921A1/ja
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2012532393A 2011-07-15 2012-07-12 研磨パッド Withdrawn JPWO2013011921A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012532393A JPWO2013011921A1 (ja) 2011-07-15 2012-07-12 研磨パッド

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011156424 2011-07-15
JP2011156424 2011-07-15
JP2012532393A JPWO2013011921A1 (ja) 2011-07-15 2012-07-12 研磨パッド

Publications (1)

Publication Number Publication Date
JPWO2013011921A1 true JPWO2013011921A1 (ja) 2015-02-23

Family

ID=47558099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012532393A Withdrawn JPWO2013011921A1 (ja) 2011-07-15 2012-07-12 研磨パッド

Country Status (7)

Country Link
US (1) US20140141704A1 (fr)
EP (1) EP2732917A4 (fr)
JP (1) JPWO2013011921A1 (fr)
KR (1) KR20140039043A (fr)
CN (1) CN103648718A (fr)
TW (1) TW201313388A (fr)
WO (1) WO2013011921A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017001111A (ja) * 2015-06-05 2017-01-05 株式会社ディスコ 研磨パッド及びｃｍｐ研磨方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9114501B2 (en) * 2011-07-15 2015-08-25 Toray Industries, Inc. Polishing pad
KR20140062095A (ko) * 2011-09-15 2014-05-22 도레이 카부시키가이샤 연마 패드
US8980749B1 (en) * 2013-10-24 2015-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing silicon wafers
US9925637B2 (en) * 2016-08-04 2018-03-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapered poromeric polishing pad
TWI595968B (zh) * 2016-08-11 2017-08-21 宋建宏 研磨墊及其製造方法
CN109562506B (zh) * 2017-02-06 2021-11-12 株式会社大辉 抛光垫的凹部形成方法以及抛光垫
JP7105334B2 (ja) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5882251A (en) * 1997-08-19 1999-03-16 Lsi Logic Corporation Chemical mechanical polishing pad slurry distribution grooves
CN1312742C (zh) * 1999-03-30 2007-04-25 株式会社尼康 抛光垫、抛光机及制造半导体器件的方法
US6238271B1 (en) * 1999-04-30 2001-05-29 Speed Fam-Ipec Corp. Methods and apparatus for improved polishing of workpieces
JP4855571B2 (ja) 2000-08-31 2012-01-18 ニッタ・ハース株式会社 研磨パッド及びその研磨パッドを用いた被加工物の研磨方法
US7070480B2 (en) * 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
JP3612708B2 (ja) * 2001-11-29 2005-01-19 信越半導体株式会社 溝入り研磨布並びにワークの研磨方法及び研磨装置
JP2004186392A (ja) * 2002-12-03 2004-07-02 Toshiba Ceramics Co Ltd 研磨布
CN1270356C (zh) * 2003-02-14 2006-08-16 中芯国际集成电路制造(上海)有限公司 化学机械研磨垫
KR20070070094A (ko) * 2005-12-28 2007-07-03 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 화학 기계 연마 방법
JP2009023018A (ja) * 2007-07-17 2009-02-05 Jsr Corp 化学機械研磨パッドおよび化学機械研磨方法
JP2009220265A (ja) * 2008-02-18 2009-10-01 Jsr Corp 化学機械研磨パッド
CN101637888B (zh) * 2008-08-01 2013-09-18 智胜科技股份有限公司 研磨垫及其制造方法
JP2010045306A (ja) 2008-08-18 2010-02-25 Kuraray Co Ltd 研磨パッド
TWM352127U (en) * 2008-08-29 2009-03-01 Bestac Advanced Material Co Ltd Polishing pad
KR20140062095A (ko) * 2011-09-15 2014-05-22 도레이 카부시키가이샤 연마 패드
WO2013039203A1 (fr) * 2011-09-16 2013-03-21 東レ株式会社 Tampon de polissage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017001111A (ja) * 2015-06-05 2017-01-05 株式会社ディスコ 研磨パッド及びｃｍｐ研磨方法

Also Published As

Publication number Publication date
US20140141704A1 (en) 2014-05-22
CN103648718A (zh) 2014-03-19
WO2013011921A1 (fr) 2013-01-24
EP2732917A4 (fr) 2015-04-15
TW201313388A (zh) 2013-04-01
KR20140039043A (ko) 2014-03-31
EP2732917A1 (fr) 2014-05-21

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