JPWO2011152364A1 - 変性ポリアミドイミド樹脂、電気絶縁材料、絶縁層の耐絶縁破壊性向上方法及び絶縁電線 - Google Patents

変性ポリアミドイミド樹脂、電気絶縁材料、絶縁層の耐絶縁破壊性向上方法及び絶縁電線 Download PDF

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Publication number
JPWO2011152364A1
JPWO2011152364A1 JP2012518386A JP2012518386A JPWO2011152364A1 JP WO2011152364 A1 JPWO2011152364 A1 JP WO2011152364A1 JP 2012518386 A JP2012518386 A JP 2012518386A JP 2012518386 A JP2012518386 A JP 2012518386A JP WO2011152364 A1 JPWO2011152364 A1 JP WO2011152364A1
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polybutadiene
polyamideimide resin
resin
modified polyamideimide
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JP2012518386A
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English (en)
Japanese (ja)
Inventor
慧峰 鐘
慧峰 鐘
大川原　敏一
敏一 大川原
任廷 佐藤
任廷 佐藤
鈴木　賢二
賢二 鈴木
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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Publication of JPWO2011152364A1 publication Critical patent/JPWO2011152364A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/34—Carboxylic acids; Esters thereof with monohydroxyl compounds
    • C08G18/343—Polycarboxylic acids having at least three carboxylic acid groups
    • C08G18/345—Polycarboxylic acids having at least three carboxylic acid groups having three carboxylic acid groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6204—Polymers of olefins
    • C08G18/6208—Hydrogenated polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/69—Polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/728—Polymerisation products of compounds having carbon-to-carbon unsaturated bonds and having isocyanate or isothiocyanate groups or groups forming isocyanate or isothiocyanate groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/78—Nitrogen
    • C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
    • C08G18/791—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups
    • C08G18/794—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups formed by oligomerisation of aromatic isocyanates or isothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D109/00—Coating compositions based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Organic Insulating Materials (AREA)
  • Insulated Conductors (AREA)
  • Paints Or Removers (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2012518386A 2010-05-31 2011-05-30 変性ポリアミドイミド樹脂、電気絶縁材料、絶縁層の耐絶縁破壊性向上方法及び絶縁電線 Withdrawn JPWO2011152364A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010124712 2010-05-31
JP2010124712 2010-05-31
PCT/JP2011/062419 WO2011152364A1 (fr) 2010-05-31 2011-05-30 Résine polyamideimide modifiée, matériau électriquement isolant, procédé d'amélioration de la tenue à la perforation diélectrique de la couche isolante, et fil isolé

Related Child Applications (1)

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JP2014237856A Division JP5896006B2 (ja) 2010-05-31 2014-11-25 変性ポリアミドイミド樹脂、電気絶縁材料、絶縁層の耐絶縁破壊性向上方法及び絶縁電線

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JPWO2011152364A1 true JPWO2011152364A1 (ja) 2013-08-01

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JP2014237856A Active JP5896006B2 (ja) 2010-05-31 2014-11-25 変性ポリアミドイミド樹脂、電気絶縁材料、絶縁層の耐絶縁破壊性向上方法及び絶縁電線

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Country Status (4)

Country Link
JP (2) JPWO2011152364A1 (fr)
CN (1) CN102918084B (fr)
TW (1) TWI548676B (fr)
WO (1) WO2011152364A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102918084B (zh) * 2010-05-31 2015-03-25 日立化成株式会社 改性聚酰胺酰亚胺树脂、电绝缘材料、绝缘层的耐绝缘破坏性提高方法和绝缘电线
SI2679605T1 (sl) * 2012-06-29 2016-02-29 Evonik Degussa Gmbh Polibutadien z epoksi skupinami
JP6412740B2 (ja) * 2014-08-26 2018-10-24 三菱マテリアル株式会社 電着塗装体の製造方法
JP7312931B2 (ja) * 2016-09-28 2023-07-24 東特塗料株式会社 電気絶縁電線
EP3979262A4 (fr) 2019-05-31 2022-06-22 Showa Denko Materials Co., Ltd. Composition de résine électriquement isolante et isolant électrique
JP6974646B1 (ja) * 2021-05-10 2021-12-01 第一工業製薬株式会社 二液硬化型樹脂組成物
CN114410034B (zh) * 2022-03-03 2023-03-14 山东利凯塑胶有限公司 一种pvc稳定剂及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005029734A (ja) * 2003-07-10 2005-02-03 Taiyo Ink Mfg Ltd プリント配線基板用プリプレグ及びそれを用いて作製された多層プリント配線板
JP2006052318A (ja) * 2004-08-11 2006-02-23 Hitachi Chem Co Ltd 熱硬化性樹脂組成物及びそれを用いた樹脂ワニス
JP2008280431A (ja) * 2007-05-10 2008-11-20 Dic Corp 熱硬化性ポリイミド樹脂組成物
JP2010053216A (ja) * 2008-08-27 2010-03-11 Dic Corp 熱硬化性樹脂組成物
JP2010155975A (ja) * 2008-12-05 2010-07-15 Toyobo Co Ltd ポリイミド系樹脂及び該ポリイミド系樹脂の製造方法並びに該ポリイミド系樹脂を用いた接着剤組成物、接着剤シート、印刷用インキ組成物及びプリント回路基板

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JPS5026596B2 (fr) * 1972-08-15 1975-09-02
US4714754A (en) * 1986-11-10 1987-12-22 General Electric Company Polyetherimide esters
US4795790A (en) * 1986-12-02 1989-01-03 General Electric Company Thermoplastic polyetherimide ester polymers exhibiting improved flexibility
JP4892819B2 (ja) * 2004-03-03 2012-03-07 東レ株式会社 多孔質膜とその製造法及びこれを用いたリチウムイオン二次電池
JP2010052316A (ja) * 2008-08-29 2010-03-11 Casio Comput Co Ltd 画像形成装置
CN102918084B (zh) * 2010-05-31 2015-03-25 日立化成株式会社 改性聚酰胺酰亚胺树脂、电绝缘材料、绝缘层的耐绝缘破坏性提高方法和绝缘电线

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005029734A (ja) * 2003-07-10 2005-02-03 Taiyo Ink Mfg Ltd プリント配線基板用プリプレグ及びそれを用いて作製された多層プリント配線板
JP2006052318A (ja) * 2004-08-11 2006-02-23 Hitachi Chem Co Ltd 熱硬化性樹脂組成物及びそれを用いた樹脂ワニス
JP2008280431A (ja) * 2007-05-10 2008-11-20 Dic Corp 熱硬化性ポリイミド樹脂組成物
JP2010053216A (ja) * 2008-08-27 2010-03-11 Dic Corp 熱硬化性樹脂組成物
JP2010155975A (ja) * 2008-12-05 2010-07-15 Toyobo Co Ltd ポリイミド系樹脂及び該ポリイミド系樹脂の製造方法並びに該ポリイミド系樹脂を用いた接着剤組成物、接着剤シート、印刷用インキ組成物及びプリント回路基板

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Also Published As

Publication number Publication date
JP5896006B2 (ja) 2016-03-30
WO2011152364A1 (fr) 2011-12-08
JP2015084329A (ja) 2015-04-30
CN102918084B (zh) 2015-03-25
CN102918084A (zh) 2013-02-06
TW201213394A (en) 2012-04-01
TWI548676B (zh) 2016-09-11

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