JPWO2011067851A1 - Crimp-type metal decorative plate, metal decorative plate, and manufacturing method thereof - Google Patents

Abstract

The crimp type metal decorative plate of the present invention has a metal decorative pattern that is substantially the same shape as the adhesion planned surface formed on the sticking surface, and the metal decoration pattern is bonded to the adhesion planned surface on the bottom surface of the metal decoration pattern. A double-sided pressure-sensitive adhesive tape to be fixed, and the double-sided pressure-sensitive adhesive tape has the same shape as the metal decoration pattern or 5 to 400 μm smaller than the metal decoration pattern by laser beam or pressing, leaving a release layer A crimp-type metal decorative plate characterized in that the metal decorative pattern is cut so that the metal decorative pattern can be stably held on the support for a long period of time, and the bonding process thereof Can also be simplified.

Description

  The present invention relates to a metal decorative pattern fixed to an adherend by pressure bonding, a decorative plate having the decorative pattern fixed to the adherend, and a method of manufacturing the same.

  A decorative pattern having a fine and complicated shape such as roses for a clock or a decorative member is formed on the surface of the metal plate by forming a resist curtain on the surface other than these decorative pattern portions. A conductive part having the same shape is formed, and a metal pattern is deposited on the conductive part by electrodeposition to form a decorative pattern. The decorative pattern is temporarily transferred to a supporting device such as a film through an adhesive layer. Then, an adhesive layer for fixing is formed on the exposed portion of the decorative pattern, and the decorative pattern is peeled off from the supporting substrate side, and an adherend such as a display panel for a watch is interposed through the fixing adhesive. It was formed by sticking to the surface.

  In addition to the above method, a metal is laminated on an insulating substrate, and a decorative pattern on the surface of the metal is drawn with a masking resist to remove the portion of the metal not covered with the masking resist by etching. And the method of leaving a decoration pattern on the insulating base material surface is also employ | adopted.

For example, Patent Document 1 (Japanese Patent Laid-Open No. 7-331479) and Patent Document 2 (Japanese Patent Application No. 8-27597) disclose a method for forming the above-described electrodeposition image and a method for improving the same. Yes.
Such a decoration pattern is often used to display a company name or a product name. However, there are cases where very small points such as “i”, “j”, “ga”, etc. have to be affixed to the company name or product name. It was extremely difficult to keep the sticking stably.

In consideration of these points, cited document 3 (Japanese Patent Laid-Open No. 2003-12420) discloses a decorative plate formed by sealing an electrodeposition image in a heat-meltable resin.
Further, when “V”, “W”, “A” or the like is formed by an electrodeposition method or an etching method, a sharp edge is formed at an acute angle portion. Not only does this acute angle part wear out and the appearance is easily damaged, but the fibers of clothing can get caught and the acute angle part can come into contact with the skin during handling. Yes, there is a possibility that the company will be held liable for defects.

  To solve these problems, a metal electroformed image is coated with a synthetic resin. However, the resin coating inherently impairs the metallic luster of the electrodeposited image. Arise.

  In addition, Cited Document 4 (Kai 2006-281652) discloses a method of fixing a decorative pattern to an adherend that shakes a recess using an ultraviolet curable resin, and has obtained very good results. However, since the ultraviolet curing resin is expensive, the ultraviolet irradiation process is complicated, and ultraviolet rays gradually enter the adhesive layer from the edge of the adhesive with time, the ultraviolet curing agent is included over time. There is a problem that the adhesive strength of the adhesive layer may decrease.

JP 7-331479 A Japanese Patent Application No. 8-27597 Japanese Patent Laid-Open No. 2003-12420 JP 2006-281652 A

  An object of the present invention is to provide a pressure-sensitive metal decorative plate that can be easily attached, a metal decorative plate formed using the pressure-resistant metal plate, and a method of manufacturing the metal decorative plate.

  The pressure-bonding type metal decorative plate of the present invention has a metal decorative pattern that is substantially the same shape as the planned bonding surface formed on the sticking surface, and the metal decorative pattern is bonded to the planned bonding surface on the bottom surface of the metallic decorative pattern. A double-sided pressure-sensitive adhesive tape to be fixed, and the double-sided pressure-sensitive adhesive tape has the same shape as the metal decoration pattern by the laser beam or press processing leaving a release layer, or 5 more than each edge of the metal decoration pattern It is characterized by being cut so as to be smaller by ˜400 μm.

  The decorative plate of the present invention has a metal decorative pattern substantially the same shape as the planned adhesion surface formed on the sticking surface, and a double-sided feeling in which the metal decorative pattern is bonded and fixed to the planned adhesion surface on the bottom surface of the metallic decorative pattern. And a double-sided pressure-sensitive adhesive tape that is the same shape as the metal decoration pattern or smaller than each edge of the metal decoration pattern by laser beam or pressing, leaving a release layer. The pressure-bonding type metal decorative plate that is cut and stuck to the metal decorative pattern as described above is characterized in that it is bonded to the planned bonding portion of the adherend by an adhesive fixing layer.

  In the present invention, the pressure-sensitive metal decorative plate is irradiated with a laser beam from the side where the release layer is not formed on the double-sided pressure-sensitive adhesive tape having a release layer attached to one surface to the surface of the release layer. Cut out a double-sided pressure-sensitive adhesive layer that is 5 to 400 μm smaller than the edges of the metal decoration pattern or the same shape as the metal decoration pattern to be attached, or reach the release layer by pressing. A double-sided pressure-sensitive adhesive layer having the same shape as the metal decoration pattern or 5 to 400 μm smaller than each edge of the metal decoration pattern is punched out, and then the same as the metal decoration pattern from the double-sided pressure-sensitive adhesive tape Remove the parts other than the double-sided pressure-sensitive adhesive layer formed so as to be 5 to 400 μm smaller than each edge of the shape or metal decoration pattern, and put the metal on the release layer surface Metal decoration formed on an application tape by forming a double-sided pressure-sensitive adhesive pattern with a release layer having a double-sided pressure-sensitive adhesive layer that is the same shape as the pattern or smaller than each edge of the metal decoration pattern by 5 to 400 μm The adhesive can be produced by contacting the adhesive of the double-sided pressure-sensitive adhesive pattern with a release layer on the back surface of the pattern to form an adhesive layer on the back surface of the metal decorative pattern.

  In addition, the decorative plate of the present invention is applied to a double-sided pressure-sensitive adhesive tape having a release layer attached to one surface by irradiating the surface of the release layer with a laser beam from the side where the release layer is not formed. A metal decoration that cuts out a double-sided pressure-sensitive adhesive layer that has the same shape as the metal decoration pattern to be worn or 5 to 400 μm smaller than each edge of the metal decoration pattern, or reaches the release layer by pressing. A double-sided pressure-sensitive adhesive layer having the same shape as the pattern or 5 to 400 μm smaller than each edge of the metal decoration pattern is punched out, and then the same shape or metal as the metal decoration pattern from the double-sided pressure-sensitive adhesive tape The part other than the double-sided pressure-sensitive adhesive layer, which is 5 to 400 μm smaller than each edge of the decorative pattern, is peeled off to be the same shape as the metal decorative pattern on the surface of the peeling layer Forming a double-sided pressure-sensitive adhesive pattern with a release layer having a double-sided pressure-sensitive adhesive layer that is 5 to 400 μm smaller than each edge of the metallic decorative pattern, and the back side of the metallic decorative pattern formed on the application tape A pressure-sensitive metal decorative plate prepared by abutting the adhesive of the double-sided pressure-sensitive adhesive pattern with a release layer to form an adhesive layer on the back surface of the metal decorative pattern; After removing the release layer, the adhesive layer formed on the pressure-bonding metal decoration pattern is brought into contact with the planned adhesion portion of the adherend and pressed, and the pressure-bonding metal decoration is applied to the adhesion target portion of the adherend. The pattern can be pressure-bonded, and then the metal decoration pattern that is not fixed to the adherend with the adhesive layer is peeled off together with the application tape.

  In the present invention, the pressure-sensitive metal decorative plate has a concave portion for bonding the metal mounting pattern on the sticking surface, and the pressure-sensitive metal decorative plate thickness including the adhesive fixing layer is on the sticking surface. It is in the range of 90 to 100% with respect to the depth of the concave portion that is the planned pasting portion, and the crimp-type metal decorative plate is in the range of 95 to 99% with respect to the width of the concave portion. It is preferable that the width is formed. Therefore, it is preferable to cut the double-sided adhesive so that the edge of the double-sided adhesive is located at a position of 30 to 50 μm inside from the edge of the decorative plate.

Moreover, the double-sided pressure-sensitive adhesive tape used in the present invention is a double-sided pressure-sensitive adhesive tape that is substantially the same type as the pressure-bonding metal decorative plate (that is, laser-cut so as to be 5 to 400 μm smaller than the same shape or metal decorative pattern). Pressure-cut adhesive double-sided tape laser-cut into the adhesive layer, or press-cut into approximately the same shape as the pressure-bonded metal decorative plate (ie, laser-cut to be 5 to 400 μm smaller than the same shape or metal decorative pattern) One of the pressure sensitive adhesive double sided tapes.
The initial 180 degree peel-off adhesive strength to stainless steel at 23 ° C. of the adhesive fixing layer constituting the crimp type metal decorative plate of the present invention or the decorative plate is in the range of 10.0 N / 20 mm to 18.0 N / 20 mm. Preferably there is.

In the present invention, the thickness of the metallic decorative pattern is usually in the range of 30 to 250 μm.
Furthermore, in the present invention, the metal decorative pattern is usually formed by electrolytic deposition or etching, and this metal decorative pattern is usually peelable from the application tape on the surface of the application tape. It is affixed to.

  In the present invention, the pressure-bonding metal decorative plate is formed by laminating a metal decorative plate, a double-sided pressure-sensitive adhesive layer, and a release layer in this order, and the thickness of the metal decorative plate is 30 to 250 μm. The thickness of the double-sided pressure-sensitive adhesive is in the range of 10 to 150 μm, and the ratio of the thickness of the metal decorative plate to the thickness of the double-sided pressure-sensitive adhesive layer is from 1: 3 to 1: It is preferable to be within the range of 0.8.

  The double-sided tape forming the adhesive fixing layer in the present invention is a double-sided pressure-sensitive adhesive tape having adhesive layers on both sides of the support, or a double-sided pressure-sensitive adhesive tape having adhesiveness on both sides without using the support. It is preferable that

  The crimping type metal decorative plate of the present invention is cut into an adherend by substantially the same shape as the metal decorative pattern (that is, the same shape or 5 to 400 μm smaller than the metal decorative pattern) by laser beam or pressing. The pressure-sensitive double-sided adhesive tape is firmly bonded. As described above, the pressure-sensitive double-sided adhesive tape is cut into the same shape as the metal decorative pattern (that is, smaller than the same shape or the metal decorative pattern by 5 to 400 μm) by laser beam processing or press processing, particularly laser beam processing. As a result, the shape of the metal decorative pattern matches the shape of the cut pressure-sensitive double-sided adhesive tape, so the metal decorative pattern falls off due to the pressure-sensitive adhesive sticking out, missing pressure-sensitive adhesive, or mismatched shape. There is nothing to do. Further, the pressure-sensitive adhesive that protrudes from the metal decoration pattern does not cause dust or the like to adhere to the edge of the metal decoration pattern and contaminate the edge of the metal decoration pattern.

  Furthermore, when a metallic decorative pattern is attached, the metallic decorative pattern can be attached inexpensively without requiring ultraviolet rays, heat, etc., and without requiring a large apparatus for the attaching.

FIG. 1 is a cross-sectional view showing an example of a process for producing a decorative plate using the crimp-type metal decorative plate of the present invention. FIG. 2 is a continuation cross-sectional view of FIG. 1 showing an example of a process for manufacturing a decorative plate using the crimp type metal decorative plate of the present invention. FIG. 3 is a cross-sectional view showing an example of a process for producing a metal decorative pattern used in the present invention by an electroforming method. FIG. 4 is a cross-sectional view showing an example of a process for producing a metal decorative pattern used in the present invention by an etching method. FIG. 5 is a cross-sectional view showing the relationship between the adherend and the pressure-bonded metal decorative plate when the pressure-bonded metal decorative plate of the present invention is embedded in the adherend and fixed. FIG. 6 is an exploded perspective view showing a state in which the crimping type metal decorative plate of the present invention is attached to an adherend. 7 is a cross-sectional view taken along the line AA in FIG. FIG. 8 is a top view showing an example of the decorative plate of the present invention.

Next, the crimping type metal decorative plate and decorative plate of the present invention will be specifically described with showing cross sections in each step.
The pressure-sensitive metal decorative plate of the present invention has a metal decorative pattern substantially the same shape as the planned adhesion surface formed on the sticking surface and the bottom surface of the metallic decorative pattern. And an adhesive fixing layer made of a double-sided pressure-sensitive adhesive tape to be adhesively fixed.

The metal decorative pattern used in the present invention can be manufactured by an electroforming method as shown in FIG. 3, or can be manufactured by an etching method as shown in FIG.
When a metal decorative pattern is manufactured by the electroforming method shown in FIG. 3, first, as shown in FIG. 3 (I), usually, a conductive substrate 10 and a conductive substrate having a conductive layer 12 on the surface of the conductor 10 are used. It is preferable to prepare the material 11. However, in the present invention, the conductor 10 can be used as it is as the conductive substrate without disposing the conductive layer 12. In this case, electrodeposition is directly performed on the surface of the conductor 10.

  Here, as the conductor 10, a foil or sheet made of a highly conductive metal can be used so that the metal can be stably deposited. Examples of such highly conductive metals include copper, stainless steel, nickel, BS, and white.

  The conductor 10 serves as a support for forming the metal decorative pattern 16 by electroforming, and has a certain thickness to stably supply power necessary for the electroforming. The thickness is preferably 200 μm to 1500 μm, and preferably 300 μm to 600 μm.

  In the present invention, the mask material 14 can be formed on the surface of the conductor 10 as described above, but it is preferable to provide a conductive layer 12 on the surface of the conductor 10 as shown in FIG. The conductive layer 12 is peeled off from the conductor 10 in a later step, and then peeled off from the electroformed product, so that the adhesive strength with the conductor 10 is lower than the adhesive strength with the electroformed product 16. It is desirable that Since the conductive layer 12 is bonded to the conductor 10 and the electroformed product 16 with the relative adhesive strength as described above, in the present invention, the conductor 10 and the conductive layer 12 are sequentially arranged in this order from the electroformed product 16. It becomes possible to peel.

Such a conductive layer 12 can usually be formed of a conductive metal thin film, a conductive inorganic material thin film, a conductive organic thin film, or a composite thereof.
Examples of conductive metal thin films include conductive metal sputtering films such as copper, nickel, gold, silver, iron, bismuth, or alloys thereof, CVD films, metal vapor deposition films, and plating thin films. Examples of the inorganic material thin film containing conductivity can include an ITO thin film, and examples of the organic thin film having conductivity include polyacetylene doped with halogen, polyphenylene doped with halogen, and the like. Examples thereof include n-electron conjugated conductive polymer compounds such as paraphenylene, halogen-doped polythiophene, halogen-doped polyaniline, and halogen-doped polyacene, and conductive polymers such as polyphenylene vinylene.

  When using a conductive film, the thickness of the conductive layer 12 formed from these metals is usually in the range of 10 to 50 μm, preferably 20 to 30 μm. By setting the thickness of the conductive layer 12 as described above, the formed electroformed body can be reliably held even if the conductor 10 is peeled and removed.

  Next, as shown in FIG. 3 (II), a mask material 14 is formed on the surface of the conductive layer 12 or the conductor 10 so as to expose the portion of the conductive substrate 11 on which the metal is deposited as described above. The conductive layer 12 is exposed in the gap 13 between the mask material 14 and the mask material 14 adjacent thereto, and when a voltage is applied, the metal in the plating solution is deposited in the gap 13 and the electroformed product. 16 is formed. On the other hand, no metal is deposited on the portion where the mask material 14 is formed.

  In the present invention, the mask material 14 as described above can be formed using, for example, a screen printing method. That is, for example, the mask material 16 and the gap 13 can be formed by applying a normal photosensitive resin to the entire surface by screen printing and exposing and developing it.

The height of the mask material 16 thus formed is usually in the range of 2 to 150 μm, preferably 10 to 50 μm.
As the plating solution used here, a normal electroplating solution containing a metal such as copper, nickel, silver, or an iron-containing alloy that forms an electroformed product can be used.

The electroplating also depends on the metal to be deposited. For example, when nickel is used, nickel is electrodeposited on the surface of the conductive portion 12 or the conductor 10 by using a nickel sulfate solution as a watt solution. As an electrodeposition condition at this time, an electrodeposition image of 100 μm ± 10 μm can be obtained in 3 hours by applying a current of 3 A / m ² to an electrodeposition effective area of 150 mm × 150 mm, for example. .

By performing electroplating under such conditions, as shown in FIG. 3 (III), the electroformed product is deposited substantially flush with the height of the mask material 14.
After the electroformed product 16 is deposited as described above, it is preferable to peel the conductor 10 from the conductive layer 12 as shown in FIG. By peeling the conductor 10 in this way, the electroformed product 16 and the mask material 14 are joined by the conductive layer 12. In the case of having a conductive layer, the conductor 10 is peeled off and discarded. Although not shown, the mask material 14 can be peeled after the electroformed product 16 is formed and before the application tape is attached.

  After peeling off the conductor 10 as described above, as shown in FIG. 3 (IV), an application tape 18 is attached to the surface where the conductive layer 12 is not provided. This application tape is a tape in which an adhesive layer is formed on one surface of a flexible synthetic resin film. In cooperation with the conductive layer 12, the mask material and the electroformed product 18 are sandwiched and stabilized. This application tape is a single-sided pressure-sensitive adhesive tape in which an adhesive is applied to one surface of a highly transparent film such as an acrylic resin film or a PET film, and the thickness of the film is usually 25 to 100 μm, preferably Is in the range of 25-50 μm. The adhesive does not require a very high adhesive strength because the application tape 18 is peeled off in a later step.

  Next, as shown in FIG. 3 (V), a film in which the mask material 14 is adhered to the conductive layer 12 (or the conductor 10), and a film in which an electroformed product (metallic decorative pattern) 16 is adhered to the application tape 18. And isolate. By doing in this way, as shown to (1) of FIG. 3 (V), the tape by which the electroformed product (metal decoration pattern) 16 was stuck to the application tape 18 is made into (2) of FIG. ) As shown in FIG. The conductive layer 12 separated here is discarded together with the mask material 14. Therefore, by the process shown in FIG. 3 (V), a tape is obtained in which the electroformed product (metal decorative pattern) 16 is adhered to the application tape 18 used in the next process ((1) in FIG. 3 (V). )reference).

After removing the conductive layer 12 and the mask material 14 in this way, as shown in FIG. 3 (VI), it is attached to the adherend 19 with a double-sided tape cut into a predetermined shape.
Moreover, as shown in FIG. 4, the metal decorative pattern of the present invention can also be manufactured by an etching method.

  FIG. 4 shows an example in the case where a metal decorative pattern is manufactured by an etching method. As shown in FIG. 4A, first, a resin / layer in which a support layer 21 and a metal layer 22 are laminated is shown. A metal composite sheet 23 is prepared.

  Here, the support layer 21 is preferably formed of a resin that has acid resistance to withstand contact with an etching solution that is acidic during etching and that has excellent adhesion to the metal layer 22. . Examples of such resins include polyimide (PI), polyamideimide, polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), and the like. The thickness of the support layer 21 is usually in the range of 25 to 125 μm, preferably in the range of 50 to 100 μm because the resin / metal composite sheet 23 has a certain degree of flexibility so that etching can be performed smoothly. Is in.

  The metal layer 22 constituting the resin / metal composite sheet 23 is made of a metal that can be selectively etched by an etching process. Examples of the metal that forms the metal layer 22 include copper, silver, nickel, stainless steel, tin, bismuth, aluminum, and white. These metals can be used alone or in combination.

Among these, a combination of PET and stainless steel, a combination of PI and copper, and the like are preferable.
FIG. 4 (a) shows a mode in which the metal layer 22 and the support layer 21 are directly bonded, but the metal layer 22 and the support layer 21 form an adhesive layer (not shown). It may be laminated via.

  Examples of adhesives that can be used here include polyimide adhesives, epoxy adhesives, acrylic adhesives, rubber adhesives, and other adhesives that are normally used when preparing resin / metal composite sheets. An agent can be mentioned. When an adhesive is used, the thickness of the adhesive layer is usually 1.0 to 30 μm, preferably 10 to 15 μm.

  A photosensitive resin layer 24 is formed on the surface of the metal layer 22 of the resin / metal composite sheet 23 formed as described above. The thickness of the photosensitive resin layer 24 is usually 10 to 100 μm, preferably 20 to 50 μm. By forming the photosensitive resin layer 24 having such a thickness, the cured photosensitive resin layer 24 that becomes a masking material during the etching process is not eroded by the etching process, and the metal is used until the end of the etching process. The surface of the layer 22 can be protected.

  After the photosensitive resin layer 24 is formed as described above, a mask 25 having a predetermined pattern is disposed on the photosensitive resin layer 24 as shown in FIG. Then, the photosensitive resin layer 24 is selectively exposed and developed.

As shown in FIG. 4C, the masking material (photosensitive cured body) 29 cured by the exposure remains on the surface of the metal layer 22 by the exposure and development as described above.
The resin / metal composite sheet thus formed with the masking material 29 is immersed in an etching solution to elute a metal layer not protected by the masking material 29. The masking material 29 used in the etching process can be easily removed by alkali cleaning or the like.

  In FIG. 4D, the metal layer 22 in a portion not protected by the masking material 29 is removed, and the metal layer 22 (metal decorative pattern 27) protected by the masking material 29 is replaced with the support layer 21. The standing situation is shown above.

  In the present invention, as shown in FIG. 4 (e), the application tape 28 is attached to the surface of the metal decorative pattern 27 erected on the support layer 21 as described above, and the application tape 28 and the support are supported. A metal decorative pattern is held between the body layer 21 and stabilized.

  As an example of the application tape used here, a polyethylene terephthalate (PET) sheet, an acrylic resin sheet, a polypropylene (PP) resin sheet, a polyethylene (PE) resin sheet, and the like can be used as described above.

  This application tape 28 has an adhesive layer or a pressure-sensitive adhesive layer formed on one surface for adhering to the metal decoration pattern 27, and is made of metal rather than the adhesive strength between the support 21 and the metal decoration pattern 27. It is desirable that the adhesive strength between the decorative pattern 27 and the application tape 28 is higher.

Usually, the adhesive strength between the application tape 28 and the metallic decorative pattern 27 is in the range of 1 to 10 N / 20 mm, preferably 1 to 7 N / 20 mm.
After the application tape 28 is attached to the surface of the metal decoration pattern 27 as described above, the metal decoration pattern is attached to the application tape 27 by peeling and removing the support 21 (FIG. 4 ( This is similar to the application tape 18 and the metallic decorative pattern 16 shown in FIG. FIG. 4G shows a mode in which the metal decorative pattern 28 is fixed with an adhesive so as to fit into a recess formed in the adherend 30.

  The pressure-sensitive metal decorative plate according to the present invention is an application tape prepared as described above, and a double-sided adhesive obtained by processing the metal decorative pattern obtained by the electroforming method or etching method by a specific processing method. And stick to the adherend.

FIG. 1A is a cross-sectional view showing a cross section of a double-sided pressure-sensitive adhesive tape 50 used in the present invention.
The double-sided pressure-sensitive adhesive tape used in the present invention is usually formed by laminating a pressure-sensitive adhesive layer (1) 41 and a pressure-sensitive adhesive layer (2) on both sides of a support 42, and pressure sensitive. A release tape (1) 51 is disposed on the surface of the adhesive layer (1) 41, and a release tape (2) 45 is disposed on the surface of the pressure-sensitive adhesive layer (2) 43. Thus, the release tape (1) 51 and the release tape (2) 45 are arranged on the surface of the pressure-sensitive adhesive layer (1) 41 and the surface of the pressure-sensitive adhesive layer (2) 43 of the double-sided pressure-sensitive adhesive tape 50. Thus, the double-sided pressure-sensitive adhesive tape 50 with a release layer can be wound around a reel or the like.

  In the above description, a mode in which the support 42 is provided on the double-sided pressure-sensitive adhesive tape 50 with a release layer used in the present invention is shown, but the support 42 is not necessarily required in the present invention. The pressure sensitive adhesive layer (1) 41 and the pressure sensitive adhesive (2) 43 may be integrated without the support 42 without the support 42. However, by providing the pressure-sensitive adhesive layer (1) 41 and the pressure-sensitive adhesive layer (2) 43 via the support 42, the dimensional stability of the double-sided pressure-sensitive adhesive tape 52 used in the present invention is high. Become.

  The support 42 used here is a synthetic resin thin film, and examples of the resin forming such a support include polyester such as PET, acrylic resin, and nonwoven fabric. The synthetic resin thin film forming the support 42 may be subjected to a surface treatment so that an adhesive layer can be easily formed on the surface thereof. The thickness of the support 42 is usually in the range of 1 to 50 μm, preferably 3 to 25 μm.

  The pressure-sensitive adhesive layers (1) 41 and (2) 43 are usually formed of the same adhesive, and the thickness of each adhesive layer is usually 10 to 50 μm, preferably 13 to It is in the range of 40 μm.

  The pressure-sensitive adhesive used here is preferably an adhesive with high adhesive strength between metal and plastic. Examples of such adhesives include acrylic adhesives, ester resin adhesives, rubbers. Based adhesives. There are various types of adhesives such as a solvent type and an emulsion type. In the present invention, a solvent type or an emulsion type is preferable, and a solvent type thin and highly uniform adhesive layer can be easily formed. It is particularly preferable because it can be formed. In addition, when using a solvent type adhesive here, the deterioration of a working environment etc. can be prevented by not using a halogen-type solvent as a solvent which melt | dissolves an adhesive agent.

Moreover, it is preferable that the adhesive agent used by this invention has a tack | tuck in normal temperature (25 degreeC).
In the double-sided pressure-sensitive adhesive tape 50 with a release layer used in the present invention, the release tape (1) 51 and the release tape (2) 45 are attached to both sides of the adhesive layer (1) 41 and the adhesive layer (2) 43. It is preferable that Many common double-sided adhesive tapes have a release tape attached to the surface of one adhesive layer, but in the present invention, in consideration of the ease of handling of the double-sided adhesive tape, the release tape is attached to both sides. use. In FIG. 1 (A), the release tape (2) 45 is a release tape provided for the necessity of manufacturing a double-sided pressure-sensitive adhesive tape, but the release tape (1) 51 is this double-sided pressure-sensitive adhesive tape. It is the peeling tape arrange | positioned for the convenience at the time of handling. Therefore, after the double-sided pressure-sensitive adhesive tape 50 with a release layer used in the present invention is cut into a predetermined length and placed at a predetermined position, the release tape (1) 51 is peeled and removed. On the other hand, the peeling tape (2) 45 is not peeled until the metal decorative pattern is adhered to a predetermined position of the adherend.

  Due to the difference in the effects of the peeling tape as described above, it is not necessary to form the peeling tape (1) 51 and the peeling tape (2) 45 from the same material, and in the present invention, the peeling tape is peeled off at the initial stage. As the release tape (1) 51, a release paper or the like that has been subjected to a release treatment with a silicone coating or the like is used. On the other hand, for the release tape (2) 45 that remains without being peeled to the end, for example, a thin film such as polyester or acrylic resin is used. The thickness of the release tape (2) 45 is usually 10 to 10 mm. It is in the range of 100 μm, preferably 50 to 75 μm.

1 (B) and (1) show an aspect in which the peeling tape (1) 51 is peeled and removed.
As shown in FIGS. 1 (B) and (1), the double-sided pressure-sensitive adhesive tape 52 from which the release tape (1) 51 is peeled and the pressure-sensitive adhesive layer (1) 41 is exposed is processed by laser beam or press processing. Thus, the double-sided pressure-sensitive adhesive tape 52 is cut into a desired shape.

  As a laser beam used here, various laser beams, such as a ruby laser, a YAG laser, a carbon dioxide laser, a helium ion laser, an excimer laser, an infrared laser, can be used, for example. Among these, YAG laser, carbon dioxide laser, excimer laser, etc. can be preferably used. Since the output of these lasers differs depending on the type, the irradiation time and irradiation energy are adjusted so that the adhesive removal part 56 can be formed on at least the double-sided pressure-sensitive adhesive tape 52. At this time, the peeling tape (2) 45 adjusts the laser output so as not to be cut by the laser beam.

  As shown in FIGS. 1B and 2B, a double-sided pressure-sensitive adhesive tape is formed so that a double-sided pressure-sensitive adhesive tape having the same shape as the metal decorative pattern to be bonded using the laser beam as described above is formed. The adhesive removal part 56 is formed in 52, The metal decoration pattern is formed in the surface of the peeling tape (2) 45 by making the part 56 from which the peeling material formed in the surface of this peeling tape (2) 45 was removed into a division line. The double-sided pressure-sensitive adhesive tape 52 having the same shape as the above and the other double-sided pressure-sensitive adhesive tape are partitioned and adhered. When a pattern having the same shape as the metal decoration pattern is drawn on the double-sided pressure-sensitive adhesive tape 52 as described above, the double-sided pressure-sensitive adhesive tape 52 and the release tape (2 ) It is preferable to form positioning means (not shown) penetrating 45.

  Further, in the present invention, when a press working is used to cut the double-sided pressure-sensitive adhesive tape into the same shape as the metal decorative pattern, a blade having the same shape as the metal decorative pattern is planted in the same manner as described above. The provided pressing die is pushed down from above the pressure-sensitive adhesive layer (1) 41 toward the peeling tape (2) 45 to form a cutting line (not shown) on the double-sided pressure-sensitive adhesive tape 52. Similar to the adhesive removing portion 56 shown in FIGS. 1B and 2, this cutting line defines a portion necessary for adhesion of the metal decorative pattern and a portion not used for adhesion.

  As described above, the adhesive removal portion 56 formed on the double-sided adhesive tape 52 is bounded by the laser beam processing or press processing as shown in FIGS. 1 (C) (1) and 1 (C) (2). As shown, the adhesive layer 44 not used for bonding is peeled off from the double-sided pressure sensitive adhesive tape and discarded. As a result, the adhesive fixing layer 55 having the same shape as the metal decorative pattern, which is an object to be bonded, remains on the surface of the release tape (2) 45. When removing the adhesive layer 44 that is not used for adhesion, the adhesive layer (41, 42, 43) shown in FIGS. When the layer is peeled, the adhesive layer 44 that is not used for bonding can be selectively peeled by pressing this portion against the peeling layer 45 side.

  1 (C) (1) shows a pressure-sensitive adhesive layer (2) 43 and a support 42 on the surface of the release tape (2) and the release tape (2) 45 having the same shape as the metal decorative pattern. A laminated body with the adhesive fixing layer 55 in which the pressure-sensitive adhesive layer (1) 41 is laminated in this order is shown.

  Next, a metal decorative pattern (electroformed product) is joined to the application tape shown in FIG. 3 (V) or FIG. 4 (f) to the adhesive fixing layer 55 manufactured as described above. In the following description of FIG. 1, the metal decoration pattern (electroformed product) is indicated by the metal decoration pattern 58 on the application tape shown in FIG. 3 (V) or FIG. 4 (f). Is indicated by the reference numeral 48. Here, as for the adhesive strength between the application tape 48 and the metal pattern 58, a sample having a width of 20 mm was prepared according to JIS Z-0237, and the adherend was made of a stainless steel plate under the condition of 23 ° C. × 50% RH. The initial 180-degree peeling adhesive strength when reciprocating once with a 2 kg roller is set lower than the adhesive strength for adhering the metallic decorative pattern 58 to the support 60.

  Next, as shown in FIG. 2D, there is a feeling on the bottom 62 of the metal decorative pattern 58 supported by the application tape 48 and on the surface of the adhesive fixing layer 55 laminated on the surface of the release tape (2) 45. The surface of the pressure adhesive layer (1) is joined. Since the adhesive fixing layer 55 has the same shape as the metal decorative pattern 58 by laser beam or pressing as described above, the bottom 62 of the metal decorative pattern 58 is completely covered with the adhesive fixing layer 55. Is done.

  In this way, in order to bond the adhesive fixing layer 55 to the bottom 62 of the metal decorative pattern, both may be bonded and pressed, and the pressurization condition at that time is usually 0.1 MPa to 0.6 MPa. Preferably, it is set to 0.3 MPa to 0.5 MPa. That is, it is necessary to peel off the peeling tape (2) 45 supporting the adhesive fixing layer 55 in a later step, and peeling of the peeling tape (2) 45 becomes difficult if a high pressure is applied. If the pressure is weak, the metal decorative pattern may be removed when the peeling tape (2) 45 is peeled off without exhibiting sufficient adhesive strength between the bottom 62 of the metal decorative pattern and the adhesive fixing layer 55. There is a tendency for peeling to occur between the bottom 62 and the adhesive fixing layer 55.

  As described above, after the adhesive fixing layer 55 is adhered to the bottom 62 of the metallic decorative pattern, the release tape (2) 45 is peeled off. By peeling the release tape (2) 45 in this way, the adhesive surface of the pressure-sensitive adhesive layer (2) 43 of the double-sided pressure-sensitive adhesive tape 52 is exposed, and this adhesive surface adheres to the surface of the adherend and is made of metal. The decorative pattern is fixed to the adherend.

Moreover, as shown to the number 29 of FIG.4 (g), the recessed part corresponding to the shape of the metal decoration pattern to crimp | bond to stick may be sufficient.
FIG. 2 shows an example in which an adherend 60 having a recess 61 corresponding to the shape of the metal decorative pattern 58 on the surface is used as the adherend.

  For example, as shown in FIG. 2E, the adherend 60 and the metal decoration pattern 58 are formed by positioning means (not shown) formed in advance on the adherend 60 and forming the metal decoration pattern. The metal decorative pattern 58 can be inserted into the recess 61 formed in the adherend 60 by aligning the positions of the two using the positioning means (not shown).

  After the metal decorative pattern 58 is inserted into the recess 61 formed in the adherend 60 as described above, the adhesive fixing layer bottom 53 of the adhesive fixing layer 52 is the bottom of the recess 61 of the adherend 60. Pressure is applied so as to firmly adhere to the portion 53. The pressure at this time is usually set in the range of 0.1 to 5 kg, preferably 1 to 2.5 kg. By performing pressure-sensitive adhesion with the pressure as described above, the metal decorative pattern is adhered to the adherend with a 180 ° C. peeling adhesive force that is usually 8 to 25 N / 20 mm, preferably 10 to 20 N / 20 mm. Can do. The 180 ° C. peel adhesive strength measured in the present invention was determined by applying an adhesive layer backed with PET cut to a width of 20 mm under the condition of 23 ° C. × 50 RH according to the method specified in JIS Z-0237. This is the force required to peel 180 ° at a pulling speed of 300 mm / min after a 2 kg roller is reciprocated once to adhere to the adherend. The 180 ° C. peeling adhesive strength varies slightly depending on the type of adherend. For example, an ABS resin plate, polystyrene plate, acrylic resin plate, polycarbonate plate, polyester film, stainless steel plate, aluminum plate, glass plate, When a 180 ° C. peel adhesion is measured using a polyimide film or the like, the peel adhesion to a resin plate often shows a high value in relative terms. In addition, among inorganic substances such as metal or glass, Then, there exists a tendency for the peeling adhesive force with respect to an aluminum plate to become comparatively low.

  In addition, the pressure required for bonding (crimping force) tends to increase the initial 180 ° C peeling adhesion strength as the bonding pressure increases. However, when the crimping force is 0.1 kg or more, the pressure increases. In addition, an increase in 180 ° C. peeling adhesive strength is difficult to be recognized, and even when crimping is performed with a pressing force exceeding 1 kg, the 180 ° C. peeling strength increase is very slight. Further, even when the pressure is applied with a pressure exceeding 5 kg, peeling at 180 ° C. and almost no increase in adhesion are observed, but there is a possibility that the metal decorative pattern or the adherend may be deformed by the application of pressure.

  Furthermore, the adhesive fixing layer 55 used in the present invention shows the initial initial 180-degree peel-off value that is adhered to the adherend 60 as described above, and the 180-degree peel-off value with the passage of time. It was confirmed that the adhesive strength increased. For example, according to the above, when the adherend is bonded to a stainless steel plate using a 2 kg roller under the condition of 23 ° C. × 50% RH, the initial 180-degree peeling adhesion is 23 ° C. 9N / 20mm, increased to 17.4N / 20mm after 24 hours, increased to 18.2N / 20mm after 72 hours, increased to 18.8N / 20mm after 14 days, and 30 days later Was confirmed to rise to 19.2 N / 20 mm. This is 2.9% after 24 hours, 7.6% after 72 hours, 11.2% after 14 days, and 13.6% after 30 days, based on the initial 180 degree peel adhesion. It will have risen. Such an increase in the 180 degree peeling adhesive strength over time occurs in the same tendency as described above regardless of the type of adherend, and the 180 degree peeling adhesion after 30 days is the initial 180 degree peeling strength. The peel strength is usually 5 to 20%, preferably 10 to 20% of the adhesive strength. As described above, it is estimated that the increase in the adhesive strength by peeling 180 degrees over time reaches saturation at a certain point, but the increase in the adhesive strength by peeling 180 degrees for at least 30 days continues, It means that the adhesive strength with the adherend increases with time and stabilizes. Such effects are, for example, as described above when using a hot melt adhesive, a UV adhesive whose adhesive strength is reduced by irradiation with an electron beam such as ultraviolet rays, or a mixture thereof. However, the adhesive strength does not increase by peeling 180 degrees over time.

  After the metal decorative pattern 58 having the adhesive fixing layer 55 is pressed against the support body together with the application tape 48 as described above, the application tape 48 is peeled off as shown in FIG. A metal decoration pattern 58 is attached to the surface of the application tape 48, and an adhesive fixing layer 55 is disposed on the metal decoration pattern 58 to be fixed to the surface of the adherend 60. The adhesive fixing layer 55 is not disposed on the metal decorative pattern 69 that is not scheduled to be bonded.

  Therefore, when the application tape 48 is peeled off, the metal decoration pattern 69 that is not bonded among the metal decoration patterns that do not have the means for bonding to the adherend 60 is peeled off together with the application tape 48 as shown in FIG. . On the other hand, the metal decorative pattern 58 having the adhesive fixing layer 55 is firmly adhered to the adherend 60 by the adhesive fixing layer 55. Therefore, even if the application tape 48 is peeled off, the metal decorative pattern 58 is Then, it is peeled off from the application tape 48 and fixed to the surface of the adherend 60. The peeled application tape 48 is discarded.

  Although not shown, a metal decorative pattern that is not provided with an adhesive fixing layer and is not bonded can be peeled off from the application tape before bonding to the adherend.

  By doing so, for example, as shown in FIG. 2 (G), the press-fit metal decorative plate 63 in which the metal decorative pattern 58 is fixed to the recess 61 formed in the adherend 60 with the adhesive fixing layer 55 is provided. Can be formed.

  In FIG. 2 (F), the press-fit metal decorative plate 63 is inserted into the recess 61 formed in the adherend 60, and the upper face 64 of the press-fit metal decor plate faces the adherend upper face 66. One aspect is shown in which the depth of the recess 61 and the height of the press-fit metal pattern are adjusted so that the press-fit metal decorative plate upper face 64 is lower than the upper face 66 of the adherend 60.

  The pressure-sensitive metal decorative plate of the present invention is formed by laminating a metal decorative pattern, a double-sided pressure-sensitive adhesive layer, and a release layer in this order, and the thickness of the metal decorative pattern is usually 30. The thickness of the double-sided pressure-sensitive adhesive is usually 10 to 150 μm, preferably 30 to 100 μm. The ratio between the thickness of the metal decoration pattern and the thickness of the double-sided pressure-sensitive adhesive layer is usually in the range of 1: 7: 1: 0.8.

  FIG. 5 is an enlarged cross-sectional view showing a portion in which the pressure-sensitive metal decorative plate 63 is embedded in the recess 61 in the adherend 60. In this way, when the press-fit metal decorative pattern 63 is embedded in the recess 61, when the press-fit metal decor pattern 63 is exposed on the surface of the product, the recess 61 is formed in the adherend 60 as shown in FIG. It is preferable to store a metal decorative plate in the recess of the lever. When the metal decorative pattern is used in an exposed state, the upper surface of the metal decorative plate having an acute angle portion such as “V” or “W” is slightly lower than the upper surface of the adherend 60. By doing so, it is possible to prevent the clothes from being caught at the acute angle portion or from damaging the skin at the acute angle portion.

Further, even if the pressure-sensitive metal decorative pattern is exposed by pressurization during pressure bonding, the entire surface becomes flush.
That is, FIG. As shown in 5 the width W ₀ of the concave portion 61 formed on the adherend 60, the width W ₁ of the metal decoration patterns, usually, -50 to-500 [mu] m, preferably -100 -Within the range of 500 μm. By thus the relationship between the width W ₁ of the width W ₀ and the metallic decorative pattern of the recesses to the above, it is possible to smoothly insert the metal decorative pattern in the recess, moreover W ₀ and W ₁ The gaps indicated by S ₁ and S ₂ , which are the differences from the above, are very small, and the gaps S ₁ and S ₂ hardly pose a problem. Further, the thickness T ₂ of the adhesive fixing layer 55 obtained by adding T ₃ , T ₄ , and T ₃ is usually in the range of 10 μm to 150 μm, and the thickness T ₁ of the metal decorative plate 58 is , usually from in the range of 30～250Myuemu, thickness H ₁ of the crimp-type metal decoration plate obtained by adding both, usually in the range of 40～500Myuemu. In the present invention, the depth T ₀ of the recess 61 formed in the adherend 60 is usually 100.5% or more, preferably 101, when the thickness H ₁ of the press-fit metal decorative plate is 100%. It is desirable to be in the range of% to 105%. As described above, the relationship between the depth H ₀ of the recess 61 and the thickness H ₁ of the press-fit metal decorative plate 63 is set as described above, so that the upper surface of the adherend 60 and the press-fit metal decor plate 63 are obtained. There is a difference of D _{0 in} the height from the upper surface of. This height difference D ₀ is usually _{0 to} 25 μm, preferably 5 to 25 μm. By doing so, even if the crimping type metal decorative plate is used in a form that is directly exposed to the outside, the acute angle portion of the crimping type metal decorative plate is not caught and it is safe.

  FIG. 6 is an exploded view showing a pressure-sensitive metal decorative plate in which the metal decorative pattern 58 of the present invention is attached to the planned bonding surface 53 formed in the recess 61 formed in the adherend 60 by the adhesive fixing layer 55. FIG. 7 is a perspective view, and FIG. 7 is a cross-sectional view taken along line AA in FIG.

  That is, as shown in FIG. 6, an adhesive fixing layer 55 cut out in the same shape as the metal decorative pattern 58 to be attached by laser beam or pressing is disposed on the back surface of the metal decorative pattern 58. The decorative pattern 58 and the adhesive fixing layer 55 on the back surface of the decorative pattern 58 are embedded in a recess 61 formed on the surface of the adherend 60, and the metallic decorative pattern 58 is formed on the bottom of the planned bonding surface 53 by the adhesive fixing layer 55. It is firmly bonded.

  The upper surface of the adherend 60 and the upper surface of the metal pattern 58 are flush with each other, or the metal adhesive pattern 58 is slightly recessed from the upper surface of the adherend 60 to form the press-fit metal decorative plate 63. Therefore, the sharp end of the metal decorative pattern 58 is not caught on clothes or the like, and the skin or the like is not damaged.

  When the metal decoration pattern 58 is exposed as described above, a recess 61 for embedding the metal decoration pattern 58 in the adherend 60 is formed as described above, and the recess 61 is made of metal. Although it is desirable to embed the decoration pattern 58, for example, when a glass or the like is disposed on the upper surface of a clock display board to prevent direct contact with the metal decoration pattern 58, the above-described deposition is applied. It is not always necessary to form the recess 61 in the body 60.

  That is, as shown in FIG. 3 (IV), a metallic decorative pattern is arranged on the surface of the adherend 19 together with the application tape 18, and the application tape 18 is peeled off while being pressure-bonded. A crimping type metal decorative plate 63 can be fixed to the surface of the adherend 19. At this time, the bonding conditions such as the pressure bonding conditions are the same as in the case of forming the recesses on the adherend.

When the press-bonded metal decoration pattern 63 formed as described above is attached to an adherend, for example, as shown in FIG. 8, the metal decoration pattern and the metal decoration pattern are formed on the surface of the application tape 18 as described above. A crimping type metal decorative plate 63 made of an adhesive fixing layer is arranged, and the positioning means 61 provided on the application tape 18 is matched with the positioning means (not shown) formed on the adherend, and the crimping mold for the adherend. The relative position of the metal decorative plate 63 is determined. Next, the pressure-sensitive metal decorative plate is applied to the adherend from above the application tape 18 at a pressure usually in the range of 0.1 to 5 kg / cm ² , preferably 1 to 3 kg / cm ^2. Pressurize. By applying pressure in this way, the adhesive strength between the pressure-bonded metal decorative plate and the adherend exceeds the adhesive strength between the application tape and the metal decorative pattern. Therefore, when the application tape 18 is peeled after pressure bonding as described above, the pressure-bonding type metal decorative plate 63 is adhered to the adherend and peeled off from the application tape.

  In addition, since the above-mentioned adhesion process is an adhesion process using a pressure sensitive adhesive, the adhesion may be performed under pressure as described above at room temperature (23 ° C.). You can also By bonding with heating or heating, the initial adhesive strength may be increased depending on the adhesive.

  As described above, the press-fit metal decorative plate of the present invention has a shape substantially the same as the metal decorative pattern by laser beam or press processing on the adherend (that is, the same shape as the metal decorative pattern or 5 to 5 than the metal decorative pattern). It is firmly bonded by a pressure-sensitive double-sided adhesive tape that is cut to a size of 400 μm. As described above, the pressure-sensitive double-sided adhesive tape is formed in substantially the same shape as the metal decorative pattern (that is, the same shape as the metal decorative pattern or 5 to 400 μm smaller than the metal decorative pattern by laser beam processing or press processing, particularly laser beam processing. ), The shape of the metal decorative pattern matches the shape of the cut pressure-sensitive double-sided adhesive tape. Therefore, the pressure-sensitive adhesive protrudes, the pressure-sensitive adhesive is missing, or the shape does not match. The decorative pattern will not fall off. Further, the pressure-sensitive adhesive that protrudes from the metal decoration pattern does not cause dust or the like to adhere to the edge of the metal decoration pattern and contaminate the edge of the metal decoration pattern.

  Furthermore, even if there is a sharp part on the metal decoration plate by sticking the crimping type metal decoration plate so as to be embedded in the recess formed in the adherend, this part is caught on clothes, etc. It will not damage your skin.

Furthermore, it can adhere | attach on a desired to-be-adhered body by pressurizing a crimp type | mold metal decorative plate, and an adhesion | attachment process is simplified very much.
In addition, the adhesive strength when the pressure-sensitive metal decorative plate of the present invention is crimped tends to increase with time, and the adhesion strength after 30 days is higher than the initial adhesive strength when observed for at least 30 days. It was confirmed to be high.

  Therefore, the pressure-bonding type metal decorative plate of the present invention does not cause a phenomenon in which the adhesive strength decreases with time like a UV curable adhesive or a hot-melt type adhesive, and supports the metal decorative pattern. It has the characteristic that it can continue to adhere firmly to the body for a long period of time, and its adhesive strength is also high.

EXAMPLES Next, the present invention will be described in more detail with reference to examples of the present invention, but the present invention is not limited thereto.
[Example 1]
An acrylic pressure-sensitive adhesive layer (1), (2) each having a thickness of 13 μm is provided on both surfaces of a support 42 made of polyester film and having a thickness of 13 μm. The surface of this pressure-sensitive adhesive (2) A double-sided adhesive tape (manufactured by Nitto Denko Corporation, double-sided adhesive tape 5603) on which a release tape (2) subjected to a release treatment was disposed was prepared.

  5 layers as shown in FIG. 1 (A) are attached to the surface of the pressure-sensitive adhesive layer 41 on which the release tape (2) of the double-sided adhesive tape is not provided. A structural laminate was prepared. The release tape (1) is different from the release tape (2) in that a release agent layer is coated on one surface of a paper tape. By attaching the release tape (1), the release tape (1) is almost transparent. The adhesive layers (1), (2), the support, and the release tape (2) can be visualized. This release tape (2) was inked and cut, then peeled off and discarded.

  Thus, the laminate was cut to produce a working sheet. This working sheet is placed on the jig of the laser beam marking device so that the surface of the jig and the surface of the peeling tape (2) face each other, and air is sucked from a large number of fine holes provided in the jig. Then, it was fixed to the working sheet jig.

  Next, the adhesive layer (1), the support (2), and the adhesive layer (3) of this working sheet were cut into the same shape as the metal decorative plate to be attached using a laser beam. At the same time, the part of the release sheet (2) required as positioning means was also cut.

  After cutting the adhesive layer (1), the support (2), and the adhesive layer (3) as described above, the part that is not used for bonding the metal decorative plate is peeled off from the release sheet (2), The adhesive layer thus peeled was discarded.

Therefore, an adhesive fixing layer (adhesive layer (1) / support / adhesive layer (2)) having the same shape as the metal decorative pattern to be attached remains on the surface of the release sheet (2). Yes.
Separately, a mask material was formed on one surface of a copper foil having a thickness of 70 μm by using a screen printing technique.

This conductive base material (150 mm × 150 mm) with a mask material is put in an electrolytic plating solution tank in which the deposited metal is nickel, and a current density of 3 A / cm ² DC voltage is applied to the copper layer of the conductive base material for 3 hours. A nickel decorative pattern was formed by depositing nickel having a thickness of 100 μm on the surface of the conductive base material on which no masking material was formed. At the same time, positioning means corresponding to the positioning means formed on the working sheet is formed. The electrolytic plating layer used here is widely used for the deposition of metallic nickel.

The thickness of the metal decorative pattern deposited as described above was substantially the same as the thickness of the mask material.
After forming the metal decoration pattern in this manner, an application tape was attached so as to cover the metal deposition end surface of the metal decoration pattern and the upper surface of the mask material.

  This application tape consists of a polyester film (specifically, PET film) with a thickness of 50 μm and an acrylic adhesive layer formed on one side of this film. Stainless steel based on JIS-Z-0237 The 180 ° peel adhesion measured at 23 ° C. × 50% RH and the pulling speed of 300 mm / min when the 2 kg roller was reciprocated once on the plate was 2.0 N / 20 mm. The 180 ° peel strength between the metal decorative pattern and the conductive layer measured according to the above method is 2.5 kg / mm.

  After applying the application tape as described above, the metal decoration pattern can be transferred to the application tape by peeling the application tape while pressing the metal decoration pattern. Since the mask material remains in the conductive layer after the metal decorative pattern is transferred to the application tape in this way, the metal decorative pattern to which the mask material with the conductive layer and the double-sided adhesive layer are not attached is discarded.

  As shown in FIG. 2 (D), the adhesive fixing layer of the tape in which the metal decoration pattern is transferred to the application tape obtained as described above is provided with the metal decoration on the surface of the release tape (2). A pattern (a pattern formed by deposited metal) is superposed and bonded.

  When bonded in this way, the bottom portion of the pattern formed from the deposited metal and the upper portion of the adhesive fixing portion are firmly bonded and integrated. On the other hand, since the release sheet (2) holding the adhesive fixing layer is a polyester tape subjected to a release treatment, the adhesive strength between the application tape, the pattern not having the double-sided adhesive layer, and the adhesive fixing layer is Since it was low, it could be easily peeled off from the adhesive fixing layer.

  By peeling off the release sheet in this manner, the lower end of the double-sided adhesive tape is exposed, and the lower end and the adherend are joined and pressed, whereby the adherend and the pressure-sensitive metal decorative plate are bonded. It was possible to press firmly. The pressure bonding condition at this time was 23 ° C.% RH, and the applied pressure was 2 kg / 20 mm.

  Further, the adherend at this time has a depth of 105% with respect to this height when the height of the pressure-bonding metal plate to be attached is 100%. Assuming that the width is 100%, the width is 110%, and the width is sufficient to insert the crimping type metal decorative plate.

  Further, since the adhesive fixing layer slightly spreads in the lateral direction due to pressurization at the time of crimping, even if the height of the crimping type metal plate is higher than the depth of the concave portion as defined in the present invention, it is crimped. Due to the pressure during this, it becomes flush with the surface of the adherend or slightly dented.

After pressure-bonding the pressure-bonding metal plate in this manner, the application tape was peeled off.
At this time, since the metal pattern without the adhesive fixing layer (mainly formed for maintaining the shape) does not adhere to the adherend, it is removed together with the application tape and discarded.

  As described above, the concave portion is formed in the adherend and the pressure-bonding type metal decorative plate has the metal decorative plate firmly adhered to the concave portion by the fixing adhesive, and the metal decorative plate is attached to the adherend. Since there is no part protruding from, it is very safe.

Further, the above-mentioned fixing adhesive tends to increase in adhesive strength with time.
Hereinafter, based on JIS-Z-0237 as described above, when a 2 kg roller was reciprocated once on a stainless steel plate, it was measured at a temperature of 23 ° C. × 50% RH and a pulling speed of 300 mm / min. Table 1 shows the change over time in the peel adhesive strength.

[Example 2]
In Example 1, instead of cutting with a laser beam when forming a working sheet, the adhesive layer is cut by pressing, and a flat adherend having no recess is used as the adherend. Then, the same operation was performed except that a dial-shaped metal decorative plate in the shape of a watch face as shown in FIG.

Since the upper surface of the dial-shaped plate of the obtained watch is covered with a cover glass, the above-mentioned crimp type metal decorative plate is formed so as to protrude from the adherend, and is in direct contact with this crimp type metal decorative plate. Therefore, there was no problem even if it protruded from the adherend.
Example 3
In Example 1, instead of electroforming and depositing a metal decorative pattern, this SUS was used by using a laminate in which a SUS plate having a thickness of 100 μm was bonded to the surface of an acid-resistant plastic film (PET) having a thickness of 50 μm. A photosensitive resin is applied to the surface of the plate, exposed to light and developed to form a cured body of the photosensitive resin. Using this cured body as a masking material, the electrolytic copper foil is selectively etched to form a metal decorative pattern. A crimped metal decorative plate was produced in the same manner except that it was produced.

  The obtained pressure-bonding type metal decorative plate showed the same effect as in Example 1 by fitting and crimping into a recess provided in a flat adherend as in Example 1.

DESCRIPTION OF SYMBOLS 10 ... Conductor 11 ... Conductive base material 12 ... Conductive layer 13 ... Gap 14 ... Mask material 16 ... Electroformed product (metal decoration pattern)
18 ... Application tape 19 ... Substrate 21 ... Support layer 22 ... Metal layer 23 ... Resin / metal composite sheet 24 ... Photosensitive resin layer 25 ... Mask 26 ..Light source 27 ... Metallic decorative pattern 28 ... Application tape 29 ... Masking material (photosensitive cured body)
30 ... Adherent 41 ... Pressure sensitive adhesive layer (1)
42 ... Support 43 ... Pressure sensitive adhesive layer (2)
44 ... Adhesive layer 45 not used for bonding 45 ... Peeling tape (2)
48 ... Application tape 50 ... Double-sided pressure-sensitive adhesive tape 51 ... Peeling tape (1)
52 ... Double-sided pressure sensitive adhesive tape 53 ... Planned adhesion surface 55 ... Adhesive fixing layer 56 ... Part where the release material has been removed (adhesive removal part)
58 ... Metal decorative pattern 60 ... Support 61 ... Recess 62 ... Bottom 63 ... Crimp type metal decorative plate 64 ... Top surface 66 of the press type metal decorative plate ... Upper surface 69 of the adherend: a metal decorative pattern that is not expected to be bonded

  The present invention relates to a metal decorative pattern fixed to an adherend by pressure bonding, a decorative plate having the decorative pattern fixed to the adherend, and a method of manufacturing the same.

A decorative pattern having a minute and complicated shape such as a rose for a watch or a decorative member is formed on the surface of the metal plate by forming a resist film on the surface other than these decorative pattern portions. Form a conductive part with the same shape, deposit a metal on this conductive part by electrodeposition to form a decorative pattern, and transfer this decorative pattern to a supporting substrate such as a film once through an adhesive layer Then, an adhesive layer for fixing is formed on the exposed portion of the decorative pattern, and the decorative pattern is peeled off from the supporting substrate side, and an adherend such as a display panel for a watch is interposed through the fixing adhesive. It was formed by sticking to the surface of the.

  In addition to the above method, a metal is laminated on an insulating substrate, and a decorative pattern on the surface of the metal is drawn with a masking resist to remove the portion of the metal not covered with the masking resist by etching. And the method of leaving a decoration pattern on the insulating base material surface is also employ | adopted.

  For example, Patent Document 1 (Japanese Patent Laid-Open No. 7-331479) and Patent Document 2 (Japanese Patent Application No. 8-27597) disclose a method for forming the above-described electrodeposition image and a method for improving the same. Yes.

Such a decoration pattern is often used to display a company name or a product name. However, there are cases where very small dots such as “i”, “j”, “ga”, etc. must be attached to the company name or product name, and these points are stably placed on the surface of the adherend. It was extremely difficult to keep sticking stably for a period.

In consideration of these points, cited document 3 (Japanese Patent Laid-Open No. 2003-12420) discloses a decorative plate formed by sealing an electrodeposition image in a heat-meltable resin.
Further, when “V”, “W”, “A” or the like is formed by an electrodeposition method or an etching method, a sharp edge is formed at an acute angle portion. Not only does this acute angle part wear out and the appearance is easily damaged, but the fibers of clothing can get caught and the acute angle part can come into contact with the skin during handling. Yes, there is a possibility that the company will be held liable for defects.

And a metal electrodeposition images in order to solve these problems by coating with synthetic resin, but the resin coating, a new problem that said metallic luster is impaired electrodeposited image is essentially a Arise.

Reference 4 ( Japanese Patent Laid-Open No. 2006-281652) discloses a method for fixing a decorative pattern to an adherend having a concave portion using an ultraviolet curable resin, and obtained very good results. are, but an ultraviolet curing resin is expensive, it irradiation step of ultraviolet rays is complex, over time the ultraviolet curing agent since over time UV little by little enters the adhesive layer from the edge of the adhesive layer There exists a problem that there exists a possibility that the adhesive strength of the adhesive bond layer containing may fall.

JP 7-331479 A Japanese Patent Application No. 8-27597 Japanese Patent Laid-Open No. 2003-12420 JP 2006-281652 A

The present invention aims at providing easily stuck can crimp-type metal decoration plate, the metallic decorative plate formed using a crimp-type metal decoration plate and a method for their preparation.

Crimping-type metal decoration plate according to the present invention, a metallic decorative pattern of substantially the same shape and bonding scheduled surfaces formed on the bonded surface, the bottom surface of the metallic decorative pattern, the metallic decorative pattern on the adhesive scheduled surface and an adhesive fixing layer made of double-sided pressure-sensitive adhesive tape is bonded and fixed, the edges of the metallic decorative pattern and the same shape or metallic decorative pattern by a laser beam or pressing double-sided pressure-sensitive adhesive tape, leaving the release layer It is characterized by being cut so as to be smaller than 5 to 400 μm.

Decorative plate of the present invention, a metallic decorative pattern of substantially the same shape and bonding scheduled surfaces formed on the bonded surface, the bottom surface of the metallic decorative pattern, both surfaces for adhering fixing the metallic decorative pattern on the adhesive scheduled surface and an adhesive fixing layer made of pressure-sensitive adhesive tape, 5 than the edge of the metallic decorative pattern and the same shape or metallic decorative pattern by a laser beam or pressing double-sided pressure-sensitive adhesive tape, leaving the release layer A pressure-sensitive metal decorative plate cut to a size of 400 μm and attached to a metal decorative pattern is characterized in that it is bonded to an adhesion target portion of an adherend by an adhesive fixing layer.

In the present invention, the pressure-sensitive metal decorative plate is irradiated with a laser beam from the side where the release layer is not formed on the double-sided pressure-sensitive adhesive tape having a release layer attached to one surface to the surface of the release layer. or to cut the double-sided pressure-sensitive adhesive layer which is adapted 5~400μm smaller than each edge of the metallic decorative pattern and the same shape or metallic decorative pattern to be bonded wear, or to the peeling layer by pressing reached 5~400μm become manner was punched double-sided pressure-sensitive adhesive layer smaller than each edge of the same shape or metallic decorative pattern and the metallic decorative pattern, then the double-sided pressure sensitive adhesive tape, metal decorative pattern gold in the same shape or metal stripping portions other than the double-sided pressure-sensitive adhesive layer formed so as 5~400μm smaller than each edge of the decorative pattern to the release layer surface and Forming a manufacturing decorative pattern and the same shape or release layer-sided pressure sensitive adhesive pattern having a double-sided pressure-sensitive adhesive layer which is adapted 5~400μm smaller than each edge of the metallic decorative pattern is formed on the application tape and the rear surface of the metallic decorative pattern can be an adhesive of the double-sided pressure-sensitive adhesive patterned the release layer in contact with produced by forming an adhesive layer on the back surface of the metallic decorative pattern.

In addition, the decorative plate of the present invention is applied to a double-sided pressure-sensitive adhesive tape having a release layer attached to one surface by irradiating the surface of the release layer with a laser beam from the side where the release layer is not formed. or cutting out the double-sided pressure-sensitive adhesive layer which is adapted 5~400μm smaller than each edge of the metallic decorative pattern and the same shape or metallic decorative pattern to be deposited, or a metal reaching the peeling layer by pressing the double-sided pressure-sensitive adhesive layer which is adapted 5~400μm smaller than each edge of the decorative pattern and the same shape or metallic decorative pattern stamped, then the double-sided pressure sensitive adhesive tape, metal decorative pattern and the same shape or portions other than the double-sided pressure-sensitive adhesive layer which is adapted 5~400μm smaller than each edge of the metallic decorative pattern peeled to the surface of the peeling layer and the metallic decorative pattern A metal decoration formed on an application tape by forming a double-sided pressure-sensitive adhesive pattern with a release layer having a double-sided pressure-sensitive adhesive layer that is 5 to 400 μm smaller than each edge of the shape or metal decoration pattern A pressure-sensitive metal decorative plate is prepared by abutting the adhesive of the double-sided pressure-sensitive adhesive pattern with a release layer on the back surface of the pattern to form an adhesive layer on the back surface of the metal decorative pattern. After removing the release layer from the metal decorative pattern, the adhesive layer formed on the pressure-bonded metal decorative pattern is brought into contact with the planned adhesion portion of the adherend and pressed to apply the adherend. It can be manufactured by press-bonding a pressure-sensitive metal decorative pattern to the part, and then peeling the metal decorative pattern not fixed to the adherend with the adhesive layer together with the application tape.

In the present invention, the pressure-sensitive metal decorative plate has a concave portion for bonding a metal decorative pattern on the bonding surface, and the pressure-sensitive metal decorative plate including the adhesive fixing layer has a thickness of the bonding. It is in the range of 90 to 100% with respect to the depth of the concave portion, which is the planned pasting portion formed on the surface, and the crimp type metal decorative plate is in the range of 95 to 99% with respect to the width of the concave portion The inner width is preferably formed. Therefore, it is preferable to cut the double-sided adhesive so that the edge of the double-sided adhesive is located at a position of 30 to 50 μm inside from the edge of the decorative plate.

The double-sided pressure-sensitive adhesive tape used in the present invention has a double-sided pressure-sensitive adhesive tape that is substantially the same type as the pressure-bonding metal decorative plate (that is, laser-cut so as to be 5 to 400 μm smaller than the same shape or metal decorative pattern). Double-sided pressure-sensitive adhesive tape laser-cut into the adhesive layer, or pressed to approximately the same shape as the pressure-bonding type metal decorative plate (that is, press-cut to be 5 to 400 μm smaller than the same shape or metal decorative pattern) One of the cut double-sided pressure sensitive adhesive tapes.

The initial 180 ° peel-off adhesion strength of stainless steel at 23 ° C. of the adhesive fixing layer constituting the crimp type metal decorative plate of the present invention or the decorative plate is in the range of 10.0 N / 20 mm to 18.0 N / 20 mm. Preferably there is.

  In the present invention, the thickness of the metallic decorative pattern is usually in the range of 30 to 250 μm.

  Furthermore, in the present invention, the metal decorative pattern is usually formed by electrolytic deposition or etching, and this metal decorative pattern is usually peelable from the application tape on the surface of the application tape. It is affixed to.

In the present invention, the pressure-bonding metal decorative plate is formed by laminating a metal decorative plate, a double-sided pressure-sensitive adhesive layer, and a release layer in this order, and the thickness of the metal decorative plate is 30 to 250 μm. in the range of, there thickness of the double-sided pressure-sensitive adhesive layer is in the range of 10 to 150 m, the ratio of the thickness of the metal decoration plate, the thickness of the double-sided pressure-sensitive adhesive layer, 1: 3 to 1 : It is preferable that it exists in the range of 0.8.

  The double-sided tape forming the adhesive fixing layer in the present invention is a double-sided pressure-sensitive adhesive tape having adhesive layers on both sides of the support, or a double-sided pressure-sensitive adhesive tape having adhesiveness on both sides without using the support. It is preferable that

Crimping-type metal decoration plate according to the present invention includes a metal decoration patterns substantially the same shape by a laser beam or pressing to the adherend (i.e., as 5~400μm smaller than isomorphic or metal decorative pattern) It is firmly bonded by the cut pressure-sensitive double-sided adhesive tape. Cut in this way the laser beam machining or press working, in particular the laser beam machining by pressure sensitive double-sided adhesive tape metallic decorative pattern substantially the same shape (i.e., 5～400Myuemu smaller so than isomorphic or metal decorative pattern) As a result, the shape of the metal decorative pattern matches the shape of the cut pressure-sensitive double-sided adhesive tape. It will not drop out. Further, the pressure-sensitive adhesive that protrudes from the metal decoration pattern does not cause dust or the like to adhere to the edge of the metal decoration pattern and contaminate the edge of the metal decoration pattern.

  Furthermore, when a metallic decorative pattern is attached, the metallic decorative pattern can be attached inexpensively without requiring ultraviolet rays, heat, etc., and without requiring a large apparatus for the attaching.

FIG. 1 is a cross-sectional view showing an example of a process for producing a decorative plate using the crimp-type metal decorative plate of the present invention. FIG. 2 is a continuation cross-sectional view of FIG. 1 showing an example of a process for manufacturing a decorative plate using the crimp-type metal decorative plate of the present invention. FIG. 3 is a cross-sectional view showing an example of a process for producing a metal decorative pattern used in the present invention by an electroforming method. FIG. 4 is a cross-sectional view showing an example of a process for producing a metal decorative pattern used in the present invention by an etching method. FIG. 5 is a cross-sectional view showing the relationship between the adherend and the pressure-bonded metal decorative plate when the pressure-bonded metal decorative plate of the present invention is embedded in the adherend and fixed. FIG. 6 is an exploded perspective view showing a state in which the crimping type metal decorative plate of the present invention is attached to an adherend. 7 is a cross-sectional view taken along the line AA in FIG. FIG. 8 is a top view showing an example of the decorative plate of the present invention.

  Next, the crimping type metal decorative plate and decorative plate of the present invention will be specifically described with showing cross sections in each step.

  The pressure-sensitive metal decorative plate of the present invention has a metal decorative pattern substantially the same shape as the planned adhesion surface formed on the sticking surface and the bottom surface of the metallic decorative pattern. And an adhesive fixing layer made of a double-sided pressure-sensitive adhesive tape to be adhesively fixed.

  The metal decorative pattern used in the present invention can be manufactured by an electroforming method as shown in FIG. 3, or can be manufactured by an etching method as shown in FIG.

  When a metal decorative pattern is manufactured by the electroforming method shown in FIG. 3, first, as shown in FIG. 3 (I), usually, a conductive substrate 10 and a conductive substrate having a conductive layer 12 on the surface of the conductor 10 are used. It is preferable to prepare the material 11. However, in the present invention, the conductor 10 can be used as it is as the conductive substrate without disposing the conductive layer 12. In this case, electrodeposition is directly performed on the surface of the conductor 10.

  Here, as the conductor 10, a foil or sheet made of a highly conductive metal can be used so that the metal can be stably deposited. Examples of such highly conductive metals include copper, stainless steel, nickel, Bi, and white.

  The conductor 10 serves as a support for forming the metal decorative pattern 16 by electroforming, and has a certain thickness to stably supply power necessary for the electroforming. The thickness is preferably 200 μm to 1500 μm, and preferably 300 μm to 600 μm.

  In the present invention, the mask material 14 can be formed on the surface of the conductor 10 as described above, but it is preferable to provide a conductive layer 12 on the surface of the conductor 10 as shown in FIG. The conductive layer 12 is peeled off from the conductor 10 in a later step, and then peeled off from the electroformed product, so that the adhesive strength with the conductor 10 is lower than the adhesive strength with the electroformed product 16. It is desirable that Since the conductive layer 12 is bonded to the conductor 10 and the electroformed product 16 with the relative adhesive strength as described above, in the present invention, the conductor 10 and the conductive layer 12 are sequentially arranged in this order from the electroformed product 16. It becomes possible to peel.

  Such a conductive layer 12 can usually be formed of a conductive metal thin film, a conductive inorganic material thin film, a conductive organic thin film, or a composite thereof.

Examples of conductive metal thin films include conductive metal sputtering films such as copper, nickel, gold, silver, iron, bismuth, or alloys thereof, CVD films, metal vapor deposition films, and plating thin films. Examples of the inorganic material thin film having conductivity include an ITO thin film, and examples of the organic thin film having conductivity include polyacetylene doped with halogen and polyparaffin doped with halogen. Examples thereof include phenylene, polythiophene doped with halogen, polyaniline doped with halogen, π electron conjugated conductive polymer such as polyacene doped with halogen, and conductive polymer such as polyphenylene vinylene.

  When using a conductive film, the thickness of the conductive layer 12 formed from these metals is usually in the range of 10 to 50 μm, preferably 20 to 30 μm. By setting the thickness of the conductive layer 12 as described above, the formed electroformed body can be reliably held even if the conductor 10 is peeled and removed.

Next, as shown in FIG. 3 (II), a mask material 14 is formed on the surface of the conductive layer 12 or the conductor 10 so as to expose the portion of the conductive substrate 11 on which the metal is deposited as described above. The conductive layer 12 is exposed in the gap 13 between the mask material 14 and the mask material 14 adjacent thereto , and when a voltage is applied , the metal in the plating solution is deposited in the gap 13 and the electroformed product. 16 is formed. On the other hand, no metal is deposited on the portion where the mask material 14 is formed.

In the present invention, the mask material 14 as described above can be formed using, for example, a screen printing method. That is, for example, the mask material 14 and the gap 13 can be formed by applying a normal photosensitive resin to the entire surface by screen printing and exposing and developing it.

The height of the mask material 14 thus formed is usually in the range of 2 to 150 μm, preferably 10 to 50 μm.

  As the plating solution used here, a normal electroplating solution containing a metal such as copper, nickel, silver, or an iron-containing alloy that forms an electroformed product can be used.

The electroplating also depends on the metal to be deposited. For example, when nickel is used, nickel is electrodeposited on the surface of the conductive layer 12 or the conductor 10 by using a nickel sulfate solution as a watt solution. As an electrodeposition condition at this time, an electrodeposition image of 100 μm ± 10 μm can be obtained in 3 hours by applying a current of 3 A / m ² to an electrodeposition effective area of 150 mm × 150 mm, for example. .

  By performing electroplating under such conditions, as shown in FIG. 3 (III), the electroformed product is deposited substantially flush with the height of the mask material 14.

  After the electroformed product 16 is deposited as described above, it is preferable to peel the conductor 10 from the conductive layer 12 as shown in FIG. By peeling the conductor 10 in this way, the electroformed product 16 and the mask material 14 are joined by the conductive layer 12. In the case of having a conductive layer, the conductor 10 is peeled off and discarded. Although not shown, the mask material 14 can be peeled after the electroformed product 16 is formed and before the application tape is attached.

After peeling off the conductor 10 as described above, as shown in FIG. 3 (IV), an application tape 18 is attached to the surface where the conductive layer 12 is not provided. This application tape is a tape in which an adhesive layer is formed on one surface of a flexible synthetic resin film. In cooperation with the conductive layer 12, the mask material and the electroformed product 16 are sandwiched and stabilized. This application tape is a single-sided pressure-sensitive adhesive tape in which an adhesive is applied to one surface of a highly transparent film such as an acrylic resin film or a PET film, and the thickness of the film is usually 25 to 100 μm, preferably Is in the range of 25-50 μm. The adhesive does not require a very high adhesive strength because the application tape 18 is peeled off in a later step.

  Next, as shown in FIG. 3 (V), a film in which the mask material 14 is adhered to the conductive layer 12 (or the conductor 10), and a film in which an electroformed product (metallic decorative pattern) 16 is adhered to the application tape 18. And isolate. By doing in this way, as shown to (1) of FIG. 3 (V), the tape by which the electroformed product (metal decoration pattern) 16 was stuck to the application tape 18 is made into (2) of FIG. ) As shown in FIG. The conductive layer 12 separated here is discarded together with the mask material 14. Therefore, by the process shown in FIG. 3 (V), a tape is obtained in which the electroformed product (metal decorative pattern) 16 is adhered to the application tape 18 used in the next process ((1) in FIG. 3 (V). )reference).

  After removing the conductive layer 12 and the mask material 14 in this way, as shown in FIG. 3 (VI), it is attached to the adherend 19 with a double-sided tape cut into a predetermined shape.

  Moreover, as shown in FIG. 4, the metal decorative pattern of the present invention can also be manufactured by an etching method.

  FIG. 4 shows an example in the case where a metal decorative pattern is manufactured by an etching method. As shown in FIG. 4A, first, a resin / layer in which a support layer 21 and a metal layer 22 are laminated is shown. A metal composite sheet 23 is prepared.

  Here, the support layer 21 is preferably formed of a resin that has acid resistance to withstand contact with an etching solution that is acidic during etching and that has excellent adhesion to the metal layer 22. . Examples of such resins include polyimide (PI), polyamideimide, polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), and the like. The thickness of the support layer 21 is usually in the range of 25 to 125 μm, preferably in the range of 50 to 100 μm because the resin / metal composite sheet 23 has a certain degree of flexibility so that etching can be performed smoothly. Is in.

  The metal layer 22 constituting the resin / metal composite sheet 23 is made of a metal that can be selectively etched by an etching process. Examples of the metal that forms the metal layer 22 include copper, silver, nickel, stainless steel, tin, bismuth, aluminum, and white. These metals can be used alone or in combination.

  Among these, a combination of PET and stainless steel, a combination of PI and copper, and the like are preferable.

  FIG. 4 (a) shows a mode in which the metal layer 22 and the support layer 21 are directly bonded, but the metal layer 22 and the support layer 21 form an adhesive layer (not shown). It may be laminated via.

  Examples of adhesives that can be used here include polyimide adhesives, epoxy adhesives, acrylic adhesives, rubber adhesives, and other adhesives that are normally used when preparing resin / metal composite sheets. An agent can be mentioned. When an adhesive is used, the thickness of the adhesive layer is usually 1.0 to 30 μm, preferably 10 to 15 μm.

  A photosensitive resin layer 24 is formed on the surface of the metal layer 22 of the resin / metal composite sheet 23 formed as described above. The thickness of the photosensitive resin layer 24 is usually 10 to 100 μm, preferably 20 to 50 μm. By forming the photosensitive resin layer 24 having such a thickness, the cured photosensitive resin layer 24 that becomes a masking material during the etching process is not eroded by the etching process, and the metal is used until the end of the etching process. The surface of the layer 22 can be protected.

  After the photosensitive resin layer 24 is formed as described above, a mask 25 having a predetermined pattern is disposed on the photosensitive resin layer 24 as shown in FIG. Then, the photosensitive resin layer 24 is selectively exposed and developed.

  As shown in FIG. 4C, the masking material (photosensitive cured body) 29 cured by the exposure remains on the surface of the metal layer 22 by the exposure and development as described above.

  The resin / metal composite sheet thus formed with the masking material 29 is immersed in an etching solution to elute a metal layer not protected by the masking material 29. The masking material 29 used in the etching process can be easily removed by alkali cleaning or the like.

  In FIG. 4D, the metal layer 22 in a portion not protected by the masking material 29 is removed, and the metal layer 22 (metal decorative pattern 27) protected by the masking material 29 is replaced with the support layer 21. The standing situation is shown above.

  In the present invention, as shown in FIG. 4 (e), the application tape 28 is attached to the surface of the metal decorative pattern 27 erected on the support layer 21 as described above, and the application tape 28 and the support are supported. A metal decorative pattern is held between the body layer 21 and stabilized.

  As an example of the application tape used here, a polyethylene terephthalate (PET) sheet, an acrylic resin sheet, a polypropylene (PP) resin sheet, a polyethylene (PE) resin sheet, and the like can be used as described above.

  This application tape 28 has an adhesive layer or a pressure-sensitive adhesive layer formed on one surface for adhering to the metal decoration pattern 27, and has a metal strength higher than the adhesive strength between the support layer 21 and the metal decoration pattern 27. It is desirable that the adhesive strength between the decorative pattern 27 and the application tape 28 is higher.

  Usually, the adhesive strength between the application tape 28 and the metallic decorative pattern 27 is in the range of 1 to 10 N / 20 mm, preferably 1 to 7 N / 20 mm.

After the application tape 28 is attached to the surface of the metal decoration pattern 27 as described above, the metal decoration pattern is attached to the application tape 28 by peeling and removing the support layer 21 (FIG. 4). (See (f)), which has the same form as the application tape 18 and the metallic decorative pattern 16 shown in FIG. FIG. 4G shows a mode in which the metallic decorative pattern 27 is fixed with an adhesive so as to fit into a recess formed in the adherend 30.

  The pressure-sensitive metal decorative plate according to the present invention is an application tape prepared as described above, and a double-sided adhesive obtained by processing the metal decorative pattern obtained by the electroforming method or etching method by a specific processing method. And stick to the adherend.

  FIG. 1A is a cross-sectional view showing a cross section of a double-sided pressure-sensitive adhesive tape 50 used in the present invention.

The double-sided pressure-sensitive adhesive tape used in the present invention is usually formed by laminating a pressure-sensitive adhesive layer (1) 41 and a pressure-sensitive adhesive layer (2) 43 on both sides of a support 42. A release tape (1) 51 is disposed on the surface of the adhesive layer (1) 41, and a release tape (2) 45 is disposed on the surface of the pressure-sensitive adhesive layer (2) 43. Thus, the release tape (1) 51 and the release tape (2) 45 are arranged on the surface of the pressure-sensitive adhesive layer (1) 41 and the surface of the pressure-sensitive adhesive layer (2) 43 of the double-sided pressure-sensitive adhesive tape 50. Thus, the double-sided pressure-sensitive adhesive tape 50 with a release layer can be wound around a reel or the like.

In the above description, a mode in which the support 42 is provided on the double-sided pressure-sensitive adhesive tape 50 with a release layer used in the present invention is shown, but the support 42 is not necessarily required in the present invention. The pressure-sensitive adhesive layer (1) 41 and the pressure-sensitive adhesive layer (2) 43 may be integrated without the support 42 without the support 42. However, by providing the pressure-sensitive adhesive layer (1) 41 and the pressure-sensitive adhesive layer (2) 43 via the support 42, the dimensional stability of the double-sided pressure-sensitive adhesive tape 52 used in the present invention is high. Become.

  The support 42 used here is a synthetic resin thin film, and examples of the resin forming such a support include polyester such as PET, acrylic resin, and nonwoven fabric. The synthetic resin thin film forming the support 42 may be subjected to a surface treatment so that an adhesive layer can be easily formed on the surface thereof. The thickness of the support 42 is usually in the range of 1 to 50 μm, preferably 3 to 25 μm.

  The pressure-sensitive adhesive layers (1) 41 and (2) 43 are usually formed of the same adhesive, and the thickness of each adhesive layer is usually 10 to 50 μm, preferably 13 to It is in the range of 40 μm.

The pressure-sensitive adhesive used here is preferably an adhesive with high adhesive strength between metal and plastic. Examples of such adhesives include acrylic adhesives, ester resin adhesives, rubbers. Based adhesives. There are various types of adhesives such as a solvent type and an emulsion type. In the present invention, a solvent type or an emulsion type is preferable, and the solvent type is a thin and highly uniform adhesive layer. It is particularly preferable because it can be easily formed. In addition, when using a solvent type adhesive here, the deterioration of a working environment etc. can be prevented by not using a halogen-type solvent as a solvent which melt | dissolves an adhesive agent.

  Moreover, it is preferable that the adhesive agent used by this invention has a tack | tuck in normal temperature (25 degreeC).

  In the double-sided pressure-sensitive adhesive tape 50 with a release layer used in the present invention, the release tape (1) 51 and the release tape (2) 45 are attached to both sides of the adhesive layer (1) 41 and the adhesive layer (2) 43. It is preferable that Many common double-sided adhesive tapes have a release tape attached to the surface of one adhesive layer, but in the present invention, in consideration of the ease of handling of the double-sided adhesive tape, the release tape is attached to both sides. use. In FIG. 1 (A), the release tape (2) 45 is a release tape provided for the necessity of manufacturing a double-sided pressure-sensitive adhesive tape, but the release tape (1) 51 is this double-sided pressure-sensitive adhesive tape. It is the peeling tape arrange | positioned for the convenience at the time of handling. Therefore, after the double-sided pressure-sensitive adhesive tape 50 with a release layer used in the present invention is cut into a predetermined length and placed at a predetermined position, the release tape (1) 51 is peeled and removed. On the other hand, the peeling tape (2) 45 is not peeled until the metal decorative pattern is adhered to a predetermined position of the adherend.

  Due to the difference in the effects of the peeling tape as described above, it is not necessary to form the peeling tape (1) 51 and the peeling tape (2) 45 from the same material, and in the present invention, the peeling tape is peeled off at the initial stage. As the release tape (1) 51, a release paper or the like that has been subjected to a release treatment with a silicone coating or the like is used. On the other hand, for the release tape (2) 45 that remains without being peeled to the end, for example, a thin film such as polyester or acrylic resin is used. The thickness of the release tape (2) 45 is usually 10 to 10 mm. It is in the range of 100 μm, preferably 50 to 75 μm.

  1 (B) and (1) show an aspect in which the peeling tape (1) 51 is peeled and removed.

  As shown in FIGS. 1 (B) and (1), the double-sided pressure-sensitive adhesive tape 52 from which the release tape (1) 51 is peeled and the pressure-sensitive adhesive layer (1) 41 is exposed is processed by laser beam or press processing. Thus, the double-sided pressure-sensitive adhesive tape 52 is cut into a desired shape.

  As a laser beam used here, various laser beams, such as a ruby laser, a YAG laser, a carbon dioxide laser, a helium ion laser, an excimer laser, an infrared laser, can be used, for example. Among these, YAG laser, carbon dioxide laser, excimer laser, etc. can be preferably used. Since the output of these lasers differs depending on the type, the irradiation time and irradiation energy are adjusted so that the adhesive removal part 56 can be formed on at least the double-sided pressure-sensitive adhesive tape 52. At this time, the peeling tape (2) 45 adjusts the laser output so as not to be cut by the laser beam.

  As shown in FIGS. 1B and 2B, a double-sided pressure-sensitive adhesive tape is formed so that a double-sided pressure-sensitive adhesive tape having the same shape as the metal decorative pattern to be bonded using the laser beam as described above is formed. The adhesive removal part 56 is formed in 52, The metal decoration pattern is formed in the surface of the peeling tape (2) 45 by making the part 56 from which the peeling material formed in the surface of this peeling tape (2) 45 was removed into a division line. The double-sided pressure-sensitive adhesive tape 52 having the same shape as the above and the other double-sided pressure-sensitive adhesive tape are partitioned and adhered. When a pattern having the same shape as the metal decorative pattern is drawn on the double-sided pressure-sensitive adhesive tape 52 as described above, the double-sided pressure-sensitive adhesive tape 52 and the release tape ( 2) It is preferable to form positioning means (not shown) penetrating 45.

  Further, in the present invention, when a press working is used to cut the double-sided pressure-sensitive adhesive tape into the same shape as the metal decorative pattern, a blade having the same shape as the metal decorative pattern is planted in the same manner as described above. The provided pressing die is pushed down from above the pressure-sensitive adhesive layer (1) 41 toward the peeling tape (2) 45 to form a cutting line (not shown) on the double-sided pressure-sensitive adhesive tape 52. Similar to the adhesive removing portion 56 shown in FIGS. 1B and 2, this cutting line defines a portion necessary for adhesion of the metal decorative pattern and a portion not used for adhesion.

As described above, the adhesive removal portion 56 formed on the double-sided adhesive tape 52 is bounded by the laser beam processing or press processing as shown in FIGS. 1 (C) (1) and 1 (C) (2). As shown, the adhesive layer 44 not used for bonding is peeled off from the double-sided pressure sensitive adhesive tape and discarded. As a result, the adhesive fixing layer 55 having the same shape as the metal decorative pattern, which is an object to be bonded, remains on the surface of the release tape (2) 45. When removing the adhesive layer 44 not used for adhesion, the adhesive layer (41, 42, 43) shown in FIGS. 1 (B) and (2) is peeled off from the end and left on the release tape (2) 45. When the part of the agent is peeled, the adhesive layer 44 that is not used for bonding can be selectively peeled by pressing this part against the peeling layer 45 side.

  1 (C) (1) shows a pressure-sensitive adhesive layer (2) 43 and a support 42 on the surface of the release tape (2) and the release tape (2) 45 having the same shape as the metal decorative pattern. A laminated body with the adhesive fixing layer 55 in which the pressure-sensitive adhesive layer (1) 41 is laminated in this order is shown.

Next, a metal decorative pattern (electroformed product) is joined to the application tape shown in FIG. 3 (V) or FIG. 4 (f) to the adhesive fixing layer 55 manufactured as described above. In the following description of FIG. 1, the metal decoration pattern (electroformed product) is indicated by the metal decoration pattern 58 on the application tape shown in FIG. 3 (V) or FIG. 4 (f). Is indicated by the reference numeral 48. Here, the adhesive strength between the application tape 48 and the metal decoration pattern 58 is 20 mm wide according to JIS Z-0237, and this sample is made of stainless steel under conditions of 23 ° C. × 50% RH. The initial 180 ° peel-off adhesive strength when the plate is reciprocated once by a 2 kg roller is set lower than the adhesive strength for adhering the metallic decorative pattern 58 to the support 60.

  Next, as shown in FIG. 2D, there is a feeling on the bottom 62 of the metal decorative pattern 58 supported by the application tape 48 and on the surface of the adhesive fixing layer 55 laminated on the surface of the release tape (2) 45. The surface of the pressure adhesive layer (1) is joined. Since the adhesive fixing layer 55 has the same shape as the metal decorative pattern 58 by laser beam or pressing as described above, the bottom 62 of the metal decorative pattern 58 is completely covered with the adhesive fixing layer 55. Is done.

  In this way, in order to bond the adhesive fixing layer 55 to the bottom 62 of the metal decorative pattern, both may be bonded and pressed, and the pressurization condition at that time is usually 0.1 MPa to 0.6 MPa. Preferably, it is set to 0.3 MPa to 0.5 MPa. That is, it is necessary to peel off the peeling tape (2) 45 supporting the adhesive fixing layer 55 in a later step, and peeling of the peeling tape (2) 45 becomes difficult if a high pressure is applied. If the pressure is weak, the metal decorative pattern may be removed when the peeling tape (2) 45 is peeled off without exhibiting sufficient adhesive strength between the bottom 62 of the metal decorative pattern and the adhesive fixing layer 55. There is a tendency for peeling to occur between the bottom 62 and the adhesive fixing layer 55.

  As described above, after the adhesive fixing layer 55 is adhered to the bottom 62 of the metallic decorative pattern, the release tape (2) 45 is peeled off. By peeling the release tape (2) 45 in this way, the adhesive surface of the pressure-sensitive adhesive layer (2) 43 of the double-sided pressure-sensitive adhesive tape 52 is exposed, and this adhesive surface adheres to the surface of the adherend and is made of metal. The decorative pattern is fixed to the adherend.

  Moreover, as shown to the number 29 of FIG.4 (g), the recessed part corresponding to the shape of the metal decoration pattern to crimp | bond to stick may be sufficient.

  FIG. 2 shows an example in which an adherend 60 having a recess 61 corresponding to the shape of the metal decorative pattern 58 on the surface is used as the adherend.

  For example, as shown in FIG. 2E, the adherend 60 and the metal decoration pattern 58 are formed by positioning means (not shown) formed in advance on the adherend 60 and forming the metal decoration pattern. The metal decorative pattern 58 can be inserted into the recess 61 formed in the adherend 60 by aligning the positions of the two using the positioning means (not shown).

After the metal decorative pattern 58 is inserted into the recess 61 formed in the adherend 60 as described above, the adhesive fixing layer bottom 53 of the adhesive fixing layer 52 is the bottom of the recess 61 of the adherend 60. Pressure is applied so as to firmly adhere to the portion 53. The pressure at this time is usually set in the range of 0.1 to 5 kg, preferably 1 to 2.5 kg. By performing pressure-sensitive adhesion with the pressure as described above, the metal decorative pattern is adhered to the adherend with a 180 ° peeling adhesive force that is usually 8 to 25 N / 20 mm, preferably 10 to 20 N / 20 mm. Can do. The 180 ° peel adhesive strength measured in the present invention is an adhesive lined with PET cut to a width of 20 mm under the condition of 23 ° C. × 50 % RH in accordance with the method specified in JIS Z-0237. This is the force required to peel the layer 180 ° at a pulling speed of 300 mm / min after the layer is attached to the adherend by reciprocating a 2 kg roller. Although the 180 ° peeling adhesive strength varies slightly depending on the type of adherend, for example, an ABS resin plate, polystyrene plate, acrylic resin plate, polycarbonate plate, polyester film, stainless steel plate, aluminum plate, glass plate, When a 180 ° peel adhesion is measured using a polyimide film or the like, the peel adhesion to the resin plate often shows a high value in relative terms. In addition, among inorganic substances such as metal or glass, Then, there exists a tendency for the peeling adhesive force with respect to an aluminum plate to become comparatively low.

In addition, the pressure required for bonding (crimping force) tends to increase by the initial 180 ° peeling and the bonding strength as the bonding pressure increases. In addition, an increase in the 180 ° peeling adhesive strength is difficult to be recognized, and the 180 ° peeling strength increase is very slight even when the pressure is more than 1 kg. Furthermore, even when the pressure is applied with a pressure exceeding 5 kg, the 180 ° peel is hardly peeled off, and almost no increase in the adhesive strength is observed, but there is a possibility that the metal decorative pattern or the adherend may be deformed by the application of pressure.

Furthermore, the adhesive fixing layer 55 for use in the present invention, the adhesive was initially initial 180 ° peel adhesion to the adherend 60 as described above showed the lowest value, peel 180 ° pull over time It was confirmed that the adhesive strength increased. For example, in accordance with the above, when the adherend is bonded to a stainless steel plate under the conditions of 23 ° C. × 50% RH using a 2 kg roller, the initial 180 ° peeling strength is 23 ° C. 9N / 20mm, increased to 17.4N / 20mm after 24 hours, increased to 18.2N / 20mm after 72 hours, increased to 18.8N / 20mm after 14 days, and 30 days later Was confirmed to rise to 19.2 N / 20 mm. Based on the initial 180 ° peel adhesion, this is 2.9% after 24 hours, 7.6% after 72 hours, 11.2% after 14 days, and 13.6% after 30 days. It will have risen. Such an increase in temporal 180 ° peeling adhesive force is generated in substantially the same tendency as the regardless of the kind of the adherend, adhesion peel 180 ° pull after 30 days, the initial 180 ° pull The peel strength is usually 5 to 20%, preferably 10 to 20% of the adhesive strength. Thus over time increase of 180 ° peeling adhesive force, but is estimated to reach saturation at a certain point, at least 30 days by following the increase in the adhesion peel 180 ° pull, a metallic decorative pattern It means that the adhesive strength with the adherend increases with time and stabilizes. Such effects are, for example, as described above when using a hot melt adhesive, a UV adhesive whose adhesive strength is reduced by irradiation with an electron beam such as ultraviolet rays, or a mixture thereof. However, the adhesive strength does not increase by peeling 180 ° over time.

  After the metal decorative pattern 58 having the adhesive fixing layer 55 is pressed against the support body together with the application tape 48 as described above, the application tape 48 is peeled off as shown in FIG. A metal decoration pattern 58 is attached to the surface of the application tape 48, and an adhesive fixing layer 55 is disposed on the metal decoration pattern 58 to be fixed to the surface of the adherend 60. The adhesive fixing layer 55 is not disposed on the metal decorative pattern 69 that is not scheduled to be bonded.

  Therefore, when the application tape 48 is peeled off, the metal decorative pattern 69 that is not bonded among the metal decorative patterns that do not have the means for bonding to the adherend 60 is peeled off together with the application tape 48 as shown in FIG. The On the other hand, the metal decorative pattern 58 having the adhesive fixing layer 55 is firmly adhered to the adherend 60 by the adhesive fixing layer 55. Therefore, even if the application tape 48 is peeled off, the metal decorative pattern 58 is Then, it is peeled off from the application tape 48 and fixed to the surface of the adherend 60. The peeled application tape 48 is discarded.

  Although not shown, a metal decorative pattern that is not provided with an adhesive fixing layer and is not bonded can be peeled off from the application tape before bonding to the adherend.

  By doing so, for example, as shown in FIG. 2 (G), the press-fit metal decorative plate 63 in which the metal decorative pattern 58 is fixed to the recess 61 formed in the adherend 60 with the adhesive fixing layer 55 is provided. Can be formed.

  In FIG. 2 (F), the press-fit metal decorative plate 63 is inserted into the recess 61 formed in the adherend 60, and the upper face 64 of the press-fit metal decor plate faces the adherend upper face 66. One aspect is shown in which the depth of the recess 61 and the height of the press-fit metal pattern are adjusted so that the press-fit metal decorative plate upper face 64 is lower than the upper face 66 of the adherend 60.

The pressure-sensitive metal decorative plate of the present invention is formed by laminating a metal decorative pattern, a double-sided pressure-sensitive adhesive layer, and a release layer in this order, and the thickness of the metal decorative pattern is usually 30. The thickness of the double-sided pressure-sensitive adhesive is usually 10 to 150 μm, preferably 30 to 100 μm. And the ratio of the thickness of a metal decoration pattern and the thickness of a double-sided pressure-sensitive adhesive layer is usually in the range of 1: 7 to 1: 0.8 .

  FIG. 5 is an enlarged cross-sectional view showing a portion in which the pressure-sensitive metal decorative plate 63 is embedded in the recess 61 in the adherend 60. In this way, when the press-fit metal decorative pattern 63 is embedded in the recess 61, when the press-fit metal decor pattern 63 is exposed on the surface of the product, the recess 61 is formed in the adherend 60 as shown in FIG. It is preferable to store a metal decorative plate in the recess of the lever. When the metal decorative pattern is used in an exposed state, the upper surface of the metal decorative plate having an acute angle portion such as “V” or “W” is slightly lower than the upper surface of the adherend 60. By doing so, it is possible to prevent the clothes from being caught at the acute angle portion or from damaging the skin at the acute angle portion.

  Further, even if the pressure-sensitive metal decorative pattern is exposed by pressurization during pressure bonding, the entire surface becomes flush.

That is, FIG. As shown in 5 the width W ₀ of the concave portion 61 formed on the adherend 60, the width W ₁ of the metal decoration patterns, usually, -50 to-500 [mu] m, preferably -100 -Within the range of 500 μm. By thus the relationship between the width W ₁ of the width W ₀ and the metallic decorative pattern of the recesses to the above, it is possible to smoothly insert the metal decorative pattern in the recess, moreover W ₀ and W ₁ The gaps indicated by S ₁ and S ₂ , which are the differences from the above, are very small, and the gaps S ₁ and S ₂ hardly pose a problem. Further, the thickness T ₂ of the adhesive fixing layer 55 obtained by adding T ₅ , T ₄ , and T ₃ is usually in the range of 10 μm to 150 μm, and the thickness T ₁ of the metal decorative plate 58 is , usually from in the range of 30～250Myuemu, thickness H ₁ of the crimp-type metal decoration plate obtained by adding both, usually in the range of 40～500Myuemu. In the present invention, the depth T ₀ of the recess 61 formed in the adherend 60 is usually 100.5% or more, preferably 101, when the thickness H ₁ of the press-fit metal decorative plate is 100%. It is desirable to be in the range of% to 105%. As described above, the relationship between the depth H ₀ of the recess 61 and the thickness H ₁ of the press-fit metal decorative plate 63 is set as described above, so that the upper surface of the adherend 60 and the press-fit metal decor plate 63 are obtained. There is a difference of D _{0 in} the height from the upper surface of. This height difference D ₀ is usually _{0 to} 25 μm, preferably 5 to 25 μm. By doing so, even if the crimping type metal decorative plate is used in a form that is directly exposed to the outside, the acute angle portion of the crimping type metal decorative plate is not caught and it is safe.

  FIG. 6 is an exploded view showing a pressure-sensitive metal decorative plate in which the metal decorative pattern 58 of the present invention is attached to the planned bonding surface 53 formed in the recess 61 formed in the adherend 60 by the adhesive fixing layer 55. FIG. 7 is a perspective view, and FIG. 7 is a cross-sectional view taken along line AA in FIG.

That is, as shown in FIG. 6, an adhesive fixing layer 55 cut out in the same shape as the metal decorative pattern 58 to be attached by laser beam or pressing is disposed on the back surface of the metal decorative pattern 58. Ltd. decorative pattern 58 and the adhesive fixing layer 55 in the back surface, are embedded in a recess 61 formed on the surface of the adherend 60, the metallic decorative pattern 58 is adhered and fixed layer 55, the bottom of the bonding scheduled surface 53 It is firmly bonded.

The upper surface of the adherend 60 and the upper surface of the metal pattern 58 are flush with each other, or the metal decorative pattern 58 is slightly recessed from the upper surface of the adherend 60 to form the press-fit metal decorative plate 63. Therefore, the sharp end of the metal decorative pattern 58 is not caught on clothes or the like, and the skin or the like is not damaged.

  When the metal decoration pattern 58 is exposed as described above, a recess 61 for embedding the metal decoration pattern 58 in the adherend 60 is formed as described above, and the recess 61 is made of metal. Although it is desirable to embed the decoration pattern 58, for example, when a glass or the like is disposed on the upper surface of a clock display board to prevent direct contact with the metal decoration pattern 58, the above-described deposition is applied. It is not always necessary to form the recess 61 in the body 60.

  That is, as shown in FIG. 3 (IV), a metallic decorative pattern is arranged on the surface of the adherend 19 together with the application tape 18, and the application tape 18 is peeled off while being pressure-bonded. A crimping type metal decorative plate 63 can be fixed to the surface of the adherend 19. At this time, the bonding conditions such as the pressure bonding conditions are the same as in the case of forming the recesses on the adherend.

When the press-bonded metal decoration pattern 63 formed as described above is attached to an adherend, for example, as shown in FIG. 8, the metal decoration pattern is applied to the surface of the application tape 18 as described above. And a pressure-bonding type metal decorative plate 63 made of an adhesive fixing layer, and positioning means 61 provided on the application tape 18 in accordance with positioning means (not shown) formed on the adherend. The relative position of the mold metal decorative plate 63 is determined. Next, the pressure-sensitive metal decorative plate is applied to the adherend from above the application tape 18 at a pressure usually in the range of 0.1 to 5 kg / cm ² , preferably 1 to 3 kg / cm ^2. Pressurize. By applying pressure in this way, the adhesive strength between the pressure-bonded metal decorative plate and the adherend exceeds the adhesive strength between the application tape and the metal decorative pattern. Therefore, when the application tape 18 is peeled after pressure bonding as described above, the pressure-bonding type metal decorative plate 63 is adhered to the adherend and peeled off from the application tape.

  In addition, since the above-mentioned adhesion process is an adhesion process using a pressure sensitive adhesive, the adhesion may be performed under pressure as described above at room temperature (23 ° C.). You can also By bonding with heating or heating, the initial adhesive strength may be increased depending on the adhesive.

  As described above, the press-fit metal decorative plate of the present invention has a shape substantially the same as the metal decorative pattern by laser beam or press processing on the adherend (that is, the same shape as the metal decorative pattern or more than the metal decorative pattern). It is firmly bonded by a pressure-sensitive double-sided adhesive tape that has been cut to 5 to 400 μm). As described above, the pressure-sensitive double-sided adhesive tape is formed into the same shape as the metal decorative pattern (that is, the same shape as the metal decorative pattern or 5 to 400 μm smaller than the metal decorative pattern by laser beam processing or press processing, particularly laser beam processing. As the shape of the metal decorative pattern and the cut pressure-sensitive double-sided adhesive tape match, the pressure-sensitive adhesive protrudes, the pressure-sensitive adhesive is missing, or the shape does not match. The metal decorative pattern will not fall off. Further, the pressure-sensitive adhesive that protrudes from the metal decoration pattern does not cause dust or the like to adhere to the edge of the metal decoration pattern and contaminate the edge of the metal decoration pattern.

  Furthermore, even if there is a sharp part on the metal decoration plate by sticking the crimping type metal decoration plate so as to be embedded in the recess formed in the adherend, this part is caught on clothes, etc. It will not damage your skin.

  Furthermore, it can adhere | attach on a desired to-be-adhered body by pressurizing a crimp type | mold metal decorative plate, and an adhesion | attachment process is simplified very much.

In addition, the adhesive strength when the pressure-sensitive metal decorative plate of the present invention is pressure-bonded tends to increase with the passage of time, and in at least 30 days of observation, the adhesive strength after 30 days is higher than the initial adhesive strength. It was confirmed.

  Therefore, the pressure-bonding type metal decorative plate of the present invention does not cause a phenomenon in which the adhesive strength decreases with time like a UV curable adhesive or a hot-melt type adhesive, and supports the metal decorative pattern. It has the characteristic that it can continue to adhere firmly to the body for a long period of time, and its adhesive strength is also high.

EXAMPLES Next, the present invention will be described in more detail with reference to examples of the present invention, but the present invention is not limited thereto.
[Example 1]
Acrylic pressure-sensitive adhesive layers (1) and (2) each having a thickness of 13 μm are provided on both sides of a support 42 made of polyester film and having a thickness of 4 μm. The pressure-sensitive adhesive layer (2) A double-sided adhesive tape (manufactured by Nitto Denko Corporation, double-sided adhesive tape 5603) having a release tape (2) subjected to a release treatment on its surface was prepared.

5 layers as shown in FIG. 1 (A) are attached to the surface of the pressure-sensitive adhesive layer 41 on which the release tape (2) of the double-sided adhesive tape is not provided. A structural laminate was prepared. The release tape (1) is different from the release tape (2) in that a release agent layer is coated on one surface of a paper tape. By attaching the release tape (1), the release tape (1) is almost transparent. The adhesive layers (1), (2), the support, and the release tape (2) can be visualized. The release tape ( 1 ) was inked and cut, then peeled off and discarded.

  Thus, the laminate was cut to produce a working sheet. This working sheet is placed on the jig of the laser beam marking device so that the surface of the jig and the surface of the peeling tape (2) face each other, and air is sucked from a large number of fine holes provided in the jig. Then, it was fixed to the working sheet jig.

Next, the adhesive layer (1), the support (2), and the adhesive layer (3) of this working sheet were cut into the same shape as the metal decorative plate to be attached using a laser beam. At the same time, the part of the peeling tape (2) necessary as positioning means was also cut.

After cutting the adhesive layer (1), the support (2), and the adhesive layer (3) as described above, the portion that is not used for bonding the metal decorative plate is peeled off from the peeling tape (2) , The adhesive layer thus peeled was discarded.

Therefore, an adhesive fixing layer (adhesive layer (1) / support / adhesive layer (2)) having the same shape as the metal decorative pattern to be attached remains on the surface of the release tape (2). Yes.

  Separately, a mask material was formed on one surface of a copper foil having a thickness of 70 μm by using a screen printing technique.

This conductive base material (150 mm × 150 mm) with a mask material is put in an electrolytic plating solution tank in which the deposited metal is nickel, and a current density of 3 A / cm ² DC voltage is applied to the copper layer of the conductive base material for 3 hours. A nickel decorative pattern was formed by depositing nickel having a thickness of 100 μm on the surface of the conductive base material on which no masking material was formed. At the same time, positioning means corresponding to the positioning means formed on the working sheet is formed, and the electrolytic plating bath used here is widely used for depositing metallic nickel.

  The thickness of the metal decorative pattern deposited as described above was substantially the same as the thickness of the mask material.

  After forming the metal decoration pattern in this manner, an application tape was attached so as to cover the metal deposition end surface of the metal decoration pattern and the upper surface of the mask material.

  This application tape consists of a polyester film (specifically, PET film) with a thickness of 50 μm and an acrylic adhesive layer formed on one side of this film. Stainless steel based on JIS-Z-0237 The 180 ° peel adhesion measured at 23 ° C. × 50% RH and the pulling speed of 300 mm / min when the 2 kg roller was reciprocated once on the plate was 2.0 N / 20 mm. The 180 ° peel strength between the metal decorative pattern and the conductive layer measured according to the above method is 2.5 kg / mm.

After applying the application tape as described above, the metal decoration pattern can be transferred to the application tape by peeling the application tape while pressing the metal decoration pattern. Since the mask material remains on the conductive layer after the metal decorative pattern is transferred to the application tape in this way, the metal decorative pattern to which the mask material with the conductive layer and the double-sided adhesive layer are not attached is discarded.

  As shown in FIG. 2 (D), the adhesive fixing layer of the tape in which the metal decoration pattern is transferred to the application tape obtained as described above is provided with the metal decoration on the surface of the release tape (2). A pattern (a pattern formed by deposited metal) is superposed and bonded.

  When bonded in this way, the bottom portion of the pattern formed from the deposited metal and the upper portion of the adhesive fixing portion are firmly bonded and integrated. On the other hand, since the release sheet (2) holding the adhesive fixing layer is a polyester tape subjected to a release treatment, the adhesive strength between the application tape, the pattern not having the double-sided adhesive layer, and the adhesive fixing layer is Since it was low, it could be easily peeled off from the adhesive fixing layer.

By peeling off the release sheet in this manner, the lower end of the double-sided adhesive tape is exposed, and the lower end and the adherend are joined and pressed, whereby the adherend and the pressure-sensitive metal decorative plate are bonded. It was possible to press firmly. The pressure bonding conditions at this time were 23 ° C. × 50% RH , and the applied pressure was 2 kg / 20 mm.

  Further, the adherend at this time has a depth of 105% with respect to this height when the height of the pressure-bonding metal plate to be attached is 100%. Assuming that the width is 100%, the width is 110%, and the width is sufficient to insert the crimping type metal decorative plate.

  Further, since the adhesive fixing layer slightly spreads in the lateral direction due to pressurization at the time of crimping, even if the height of the crimping type metal plate is higher than the depth of the concave portion as defined in the present invention, it is crimped. Due to the pressure during this, it becomes flush with the surface of the adherend or slightly dented.

  After pressure-bonding the pressure-bonding metal plate in this manner, the application tape was peeled off.

  At this time, since the metal pattern without the adhesive fixing layer (mainly formed for maintaining the shape) does not adhere to the adherend, it is removed together with the application tape and discarded.

  As described above, the concave portion is formed in the adherend and the pressure-bonding type metal decorative plate has the metal decorative plate firmly adhered to the concave portion by the fixing adhesive, and the metal decorative plate is attached to the adherend. Since there is no part protruding from, it is very safe.

  Further, the above-mentioned fixing adhesive tends to increase in adhesive strength with time.

  Hereinafter, based on JIS-Z-0237 as described above, when a 2 kg roller was reciprocated once on a stainless steel plate, it was measured at a temperature of 23 ° C. × 50% RH and a pulling speed of 300 mm / min. Table 1 shows the change over time in the peel adhesive strength.

[Example 2]
In Example 1, instead of cutting with a laser beam when forming a working sheet, the adhesive layer is cut by pressing, and a flat adherend having no recess is used as the adherend. The operation was performed in the same manner except that a dial-shaped metal decorative plate in the shape of a watch face as shown in FIG.

The resulting upper surface of the dial-like plates watch is covered with a cover glass, the crimp-type metal decoration plate is formed to protrude from the adherend, this crimping type metal decoration plate Since there was no direct contact, there was no problem even if it protruded from the adherend.
Example 3
In Example 1, instead of electroforming and depositing a metal decorative pattern, this SUS was used by using a laminate in which a SUS plate having a thickness of 100 μm was bonded to the surface of an acid-resistant plastic film (PET) having a thickness of 50 μm. A photosensitive resin is applied to the surface of the plate, exposed to light and developed to form a cured body of the photosensitive resin. Using this cured body as a masking material, the electrolytic copper foil is selectively etched to form a metal decorative pattern. A crimped metal decorative plate was produced in the same manner except that it was produced.

The resulting crimp-type metal decoration plate, by crimping fitted into a recess be provided on the plate-like adherend in the same manner as in Example 1, was shown the same effects as in Example 1 .

DESCRIPTION OF SYMBOLS 10 ... Conductor 11 ... Conductive base material 12 ... Conductive layer 13 ... Gap 14 ... Mask material 16 ... Electroformed product (metal decoration pattern)
18 ... Application tape 19 ... Substrate 21 ... Support layer 22 ... Metal layer 23 ... Resin / metal composite sheet 24 ... Photosensitive resin layer 25 ... Mask 26 ..Light source 27 ... Metallic decorative pattern 28 ... Application tape 29 ... Masking material (photosensitive cured body)
30 ... Adherent 41 ... Pressure sensitive adhesive layer (1)
42 ... Support 43 ... Pressure sensitive adhesive layer (2)
44 ... Adhesive layer 45 not used for bonding 45 ... Peeling tape (2)
48 ... Application tape 50 ... Double-sided pressure-sensitive adhesive tape 51 ... Peeling tape (1)
52 ... Double-sided pressure sensitive adhesive tape 53 ... Planned adhesion surface 55 ... Adhesive fixing layer 56 ... Part where the release material has been removed (adhesive removal part)
58 ... Metal decorative pattern 60 ... Support 61 ... Recess 62 ... Bottom 63 ... Crimp type metal decorative plate 64 ... Top surface 66 of the press type metal decorative plate ... Upper surface 69 of the adherend: a metal decorative pattern that is not expected to be bonded

The pressure-bonded metal decorative plate of the present invention includes a metal decorative pattern, and an adhesive fixing layer made of a double-sided pressure-sensitive adhesive tape that adheres and fixes the metal decorative pattern to a surface to be bonded to the bottom of the metal decorative pattern. The double-sided pressure-sensitive adhesive tape is cut by laser beam processing or press processing into the same shape as the metal decorative pattern, leaving a release layer, and the metal decorative pattern and the metal decorative An adhesive fixing layer made of a double-sided pressure-sensitive adhesive tape that adheres and fixes the metal decoration pattern to the planned adhesion surface on the bottom surface of the pattern. Is cut by laser beam processing or press processing so as to be smaller by 5 to 400 μm.

In addition, the double-sided pressure-sensitive adhesive tape used in the present invention is the same shape as the pressure-bonded metal decorative plate or a double-sided pressure-sensitive adhesive tape laser-cut by 5 to 400 μm smaller than the same shape , or a pressure-sensitive metal decorative plate Either the same shape or a double-sided pressure-sensitive adhesive tape that is 5 to 400 μm smaller than the same shape .

Crimping-type metal decoration plate according to the present invention, by pressing the laser beam or metal decorative pattern substantially the same shape to an adherend (i.e., as 5~400μm smaller than isomorphic or metal decorative pattern) It is firmly bonded by the cut pressure-sensitive double-sided adhesive tape. Thus the laser beam machining or press working by cutting, in particular laser beam machining by pressure sensitive double-sided adhesive tape metallic decorative pattern substantially the same shape (i.e., 5～400Myuemu smaller so than isomorphic or metal decorative pattern) Since the shape of the metal decorative pattern matches the shape of the cut pressure-sensitive double-sided adhesive tape, the metal decoration is caused by protrusion of pressure-sensitive adhesive, missing pressure-sensitive adhesive, or mismatched shape. The pattern never falls off. Further, the pressure-sensitive adhesive that protrudes from the metal decoration pattern does not cause dust or the like to adhere to the edge of the metal decoration pattern and contaminate the edge of the metal decoration pattern.

As shown in FIGS. 1 (B) and (1), the double-sided pressure-sensitive adhesive tape 52 from which the release tape (1) 51 is peeled and the pressure-sensitive adhesive layer (1) 41 is exposed is processed by laser beam or press processing. The double-sided pressure-sensitive adhesive tape 52 is cut into a desired shape by cutting.

Further, in the present invention, when a cut by pressing is used to cut the double-sided pressure-sensitive adhesive tape into the same shape as the metal decorative pattern, the blade having the same shape as the metal decorative pattern is used as described above. Is pressed down from above the pressure-sensitive adhesive layer (1) 41 toward the peeling tape (2) 45 to form a cutting line (not shown) on the double-sided pressure-sensitive adhesive tape 52. Similar to the adhesive removing portion 56 shown in FIGS. 1B and 2, this cutting line defines a portion necessary for adhesion of the metal decorative pattern and a portion not used for adhesion.

As described above, the press-fit metal decorative plate of the present invention has a shape substantially the same as the laser beam or the metal decorative pattern on the adherend (that is, the same shape as the metal decorative pattern or 5 to 400 μm than the metal decorative pattern). It is firmly bonded by a pressure-sensitive double-sided adhesive tape that has been cut by pressing . As described above, the pressure-sensitive double-sided adhesive tape is cut by press processing or laser beam processing , particularly by laser beam processing. The metal decorative pattern and the cut pressure-sensitive double-sided adhesive tape have the same shape, so that the pressure-sensitive adhesive protrudes, the pressure-sensitive adhesive is missing, or the shape is The metal decorative pattern will not fall off due to mismatch. Further, the pressure-sensitive adhesive that protrudes from the metal decoration pattern does not cause dust or the like to adhere to the edge of the metal decoration pattern and contaminate the edge of the metal decoration pattern.

[Example 2]
In Example 1, instead of cutting with a laser beam at the time of forming a working sheet, the adhesive layer is cut by press working , and further, a flat plate-shaped adherend having no recess is used as the adherend. The operation was performed in the same manner except that a dial-shaped metal decorative plate in the shape of a watch face as shown in FIG.

Crimping-type metal decoration plate according to the present invention, a metal advice service decoration pattern is rose character or decorative pattern, the bottom surface of the metallic decorative pattern, both sides feeling of contact adhesive fixing the metallic decorative pattern on the adhesive scheduled surface and an adhesive fixing layer made of adhesive tape, that the both surfaces pressure sensitive adhesive tape is cut by laser beam machining so 5~400μm smaller than metallic decorative pattern leaving peeling delamination It is a feature.

Decorative plate of the present invention, a metallic decorative pattern is rose character or decorative pattern, the bottom surface of the metallic decorative pattern consists of a double face pressure sensitive adhesive tape for bonding and fixing the metallic decorative pattern on the adhesive scheduled surface and an adhesive fixing layer, double-sided pressure sensitive adhesive tape is stuck to the mosquito Tsu bets have been made metallic decorative pattern by laser beam machining so 5~400μm smaller than metallic decorative pattern, leaving the release layer The peeling layer is peeled off from the pressure-bonding type metal decorative plate, and is bonded to the adhesion target portion of the adherend by the adhesive fixing layer .

In the present invention, crimping-type metal decoration plate, the double-sided pressure-sensitive adhesive tapes which release layer is stuck on one surface, the side on which the release layer is not formed, or the surface of the laser beam release layer cut roses letters or both pressure sensitive adhesive layer so that the metallic decorative pattern by remote 5~400μm small a decorative pattern going bonded wear to be irradiated, then the double-sided pressure sensitive adhesive tape, metal decoration A part other than the double-sided pressure-sensitive adhesive layer formed so as to be smaller than the pattern by 5 to 400 μm is peeled off, and a double-sided pressure-sensitive adhesive layer is formed on the surface of the release layer so as to be smaller than the metal decorative pattern by 5 to 400 μm. the double-sided pressure-sensitive adhesive patterned release layer is formed with, on the back surface of the metallic decorative pattern formed on the application tape, the release layer with the double-sided pressure sensitive adhesive pattern of adhesive It can be the contact prepared by that form an adhesive layer on the back surface of the metallic decorative pattern.

In addition, the decorative plate of the present invention is applied to a double-sided pressure-sensitive adhesive tape having a release layer attached to one surface by irradiating the surface of the release layer with a laser beam from the side where the release layer is not formed. A double-sided pressure-sensitive adhesive layer that is 5 to 400 μm smaller than a metallic decorative pattern that is a rose character or decorative pattern to be worn is cut out, and then, from the double-sided pressure-sensitive adhesive tape, 5 than the metallic decorative pattern. With a release layer having a double-sided pressure-sensitive adhesive layer that is 5 to 400 μm smaller than the metal decorative pattern by peeling off portions other than the double-sided pressure-sensitive adhesive layer formed so as to be reduced to ˜400 μm A double-sided pressure-sensitive adhesive pattern is formed, and the adhesive of the double-sided pressure-sensitive adhesive pattern with release layer is in contact with the back of the metal decorative pattern formed on the application tape. An adhesive layer is formed on the back surface of the metal decorative pattern to prepare a pressure-bonding metal decorative plate, and after removing the release layer from the pressure-bonding metal decorative pattern, The adhesive layer formed on the pressure-bonded metal decorative pattern is brought into contact with pressure, and the pressure-bonded metal decorative pattern is pressure-bonded to a portion to be stuck on the adherend, and then the adherend is bonded with the adhesive layer. It is possible to manufacture by peeling off the metal decorative pattern not fixed to the plate together with the application tape.

Moreover, the double-sided pressure-sensitive adhesive tape used in the present invention is a double-sided pressure- sensitive adhesive layer that is laser-cut so as to be smaller than the metal decorative pattern by 5 to 400 μm.

The pressure-sensitive metal decorative plate of the present invention is firmly bonded to an adherend with a pressure-sensitive double-sided adhesive tape cut with a laser beam so as to be smaller than the metal decorative pattern by 5 to 400 μm . Thus, the shape of the metal decorative pattern and the cut pressure-sensitive double-sided adhesive tape is matched by cutting the pressure-sensitive double-sided adhesive tape by laser beam processing so that it is 5 to 400 μm smaller than the metal decorative pattern. Therefore, the metal decorative pattern does not fall off due to the pressure sensitive adhesive protruding, the pressure sensitive adhesive missing or the shape mismatch. Further, the pressure-sensitive adhesive that protrudes from the metal decoration pattern does not cause dust or the like to adhere to the edge of the metal decoration pattern and contaminate the edge of the metal decoration pattern.

Figure 1 (B) release tape as shown in (1) (1) 51 is peeled off, the double-sided pressure sensitive adhesive tape 52 which pressure-sensitive adhesive layer (1) 41 is exposed more machining by laser beam, two-sided The pressure sensitive adhesive tape 52 is cut into a desired shape.

As shown in FIG. 1 (B) (2) adhesive, by double-sided pressure-sensitive adhesive tape 52 formed to 5~400μm smaller than metallic decorative pattern to be bonded by using a laser beam as described above The agent removing portion 56 is formed, and the portion 56 from which the release material formed on the surface of the release tape (2) 45 is removed is defined as a partition line, and the surface of the release tape (2) 45 is 5 more than the metal decorative pattern. The double-sided pressure-sensitive adhesive tape 52 formed to be smaller by ˜400 μm and the other double-sided pressure-sensitive adhesive tape are partitioned and adhered. When the pattern formed on the double-sided pressure-sensitive adhesive tape 52 as described above so as to be smaller than the metal decorative pattern by 5 to 400 μm is drawn on the double-sided pressure-sensitive adhesive tape using a laser beam, the double-sided pressure sensitive tape is used. It is preferable to form positioning means (not shown) penetrating the adhesive tape 52 and the release tape (2) 45.

As described above, more processing by the laser beam, and an adhesive removing portion 56 which is double-sided adhesive tape 52 formed on the boundary, shown in FIG. 1 (C) (1) and FIG. 1 (C) (2) Thus, the adhesive layer 44 not used for bonding is peeled off from the double-sided pressure-sensitive adhesive tape and discarded. Then, the adhesive fixing layer 55 smaller by 5 to 400 μm than the metal decorative pattern as the object to be bonded remains on the surface of the release tape (2) 45. When removing the adhesive layer 44 not used for adhesion, the adhesive layer (41, 42, 43) shown in FIGS. 1 (B) and (2) is peeled off from the end and left on the release tape (2) 45. When the part of the agent is peeled, the adhesive layer 44 that is not used for bonding can be selectively peeled by pressing this part against the peeling layer 45 side.

1 (C) (1) shows a release tape (2) and a pressure-sensitive adhesive layer (2) formed on the surface of the release tape (2) 45 so as to be 5 to 400 μm smaller than the metal decorative pattern. ) 43, the support 42, and the pressure sensitive adhesive layer (1) 41 are laminated with the adhesive fixing layer 55 laminated in this order.

Next, as shown in FIG. 2D, there is a feeling on the bottom 62 of the metal decorative pattern 58 supported by the application tape 48 and on the surface of the adhesive fixing layer 55 laminated on the surface of the release tape (2) 45. The surface of the pressure adhesive layer (1) is joined. Since the adhesive fixing layer 55 is formed so as to be smaller by 5 to 400 μm than the metal decorative pattern 58 by laser beam or pressing as described above, the bottom 62 of the metal decorative pattern 58 is bonded. It is coated by a fixed layer 55.

That is, as shown in FIG. 6, the adhesive fixing layer 55 which is cut out so 5~400μm smaller than metallic decorative pattern 58 thus attached to the laser beam is arranged on the back surface of the metallic decorative pattern 58 The metal decorative pattern 58 and the adhesive fixing layer 55 on the back surface thereof are embedded in a recess 61 formed on the surface of the adherend 60, and the metal decorative pattern 58 is to be bonded by the adhesive fixing layer 55. It is firmly bonded to the bottom of the surface 53.

Crimping-type metal decoration plate as described above, the present invention, it is firmly bonded by a pressure sensitive double-sided adhesive tapes by Uni cut 5~400μm smaller than metallic decorative pattern with a laser beam to an adherend Yes. By cutting the pressure-sensitive double-sided adhesive tape 5 to 400 μm smaller than the metal decorative pattern by the laser beam machining , the shape of the metal decorative pattern and the cut pressure-sensitive double-sided adhesive tape can be reduced. Therefore, the metal decorative pattern does not fall off due to the pressure-sensitive adhesive protruding, the pressure-sensitive adhesive missing, or the shape mismatch. Further, the pressure-sensitive adhesive that protrudes from the metal decoration pattern does not cause dust or the like to adhere to the edge of the metal decoration pattern and contaminate the edge of the metal decoration pattern.

Then, the adhesive layer of the working sheet (1), the support (2), adhesive layer (3), using a laser beam, and 5~400μm small fence than metal decoration plate to be bonded Cut. At the same time, the part of the peeling tape (2) necessary as positioning means was also cut.

[Example 2]

  In Example 1, instead of electroforming and depositing a metallic decorative pattern, an acid resistance of 50 μm thick Product of SUS plate with a thickness of 100μm bonded to the surface of a conductive plastic film (PET) Using a layered body, apply a photosensitive resin to the surface of this SUS plate, and then expose and develop to harden the photosensitive resin. The electrolytic copper foil is selectively etched using the cured body as a masking material. In the same manner, except that the metal decorative pattern was manufactured, the crimped metal decorative plate was manufactured. .

Claims (18)

  Adhesive fixing composed of a metal decorative pattern substantially the same shape as the planned adhesion surface formed on the sticking surface, and a double-sided pressure-sensitive adhesive tape that adheres and fixes the metal decorative pattern to the planned adhesion surface on the bottom surface of the metallic decoration pattern And the double-sided pressure-sensitive adhesive tape is cut with a laser beam or pressing so as to be the same shape as the metal decorative pattern or smaller than the metal decorative pattern by 5 to 400 μm, leaving the release layer. Crimp type metal decorative plate.   A concave portion for adhering the metal mounting pattern is formed on the affixing surface, and the thickness of the press-fitted metal decorative plate including the adhesive fixing layer is the depth of the indented portion that is the planned affixing portion formed on the affixing surface. The crimping type metal decorative plate is formed in a width within a range of 95 to 99% with respect to the width of the concave portion. Item 1. A crimp-type metal decorative plate according to item 1.   The above double-sided pressure-sensitive adhesive tape is the same type or slightly smaller than the pressure-sensitive metal decorative plate, or the pressure-sensitive adhesive double-sided tape that is slightly cut by the laser, The pressure-bonded metal decorative plate according to claim 1 or 2, wherein the pressure-bonding double-sided tape is used.   3. The pressure-sensitive fixing layer according to claim 1 or 2, wherein an initial 180-degree peeling adhesive strength to stainless steel at 23 ° C. is in a range of 10.0 N / 20 mm to 18.0 N / 20 mm. Crimp type metal decorative pattern.   The press-fit metal decorative plate according to claim 1 or 2, wherein a thickness of the metal decorative pattern is in a range of 30 to 250 µm.   The metal decoration pattern is formed by an electrolytic deposition method or an etching method, and the metal decoration pattern is attached to the surface of the application tape so as to be peelable from the application tape. The crimp-type metal decorative plate according to item 1 or 2.   The above-mentioned pressure bonding type metal decorative plate is formed by laminating a metal decorative pattern, a double-sided pressure-sensitive adhesive layer, and a release layer in this order, and the thickness of the metal decorative pattern is within a range of 30 to 250 μm. The thickness of the double-sided pressure-sensitive adhesive is in the range of 10 to 150 μm, and the ratio of the thickness of the metal decorative pattern to the thickness of the double-sided pressure-sensitive adhesive layer is 1: 7 to 1: 0.8. The pressure-bonding type metal decorative plate according to claim 1 or 2, wherein the pressure-decreasing metal decorative plate is within the range.   The adhesive fixing layer comprising the double-sided tape is a double-sided pressure-sensitive adhesive tape having an adhesive layer on both sides of the support, or a double-sided pressure-sensitive adhesive tape having adhesiveness on both sides without using the support. The crimp type metal decorative plate according to claim 1 or 2, characterized by the above-mentioned.   Adhesive fixing composed of a metal decorative pattern substantially the same shape as the planned adhesion surface formed on the sticking surface, and a double-sided pressure-sensitive adhesive tape that adheres and fixes the metal decorative pattern to the planned adhesion surface on the bottom surface of the metallic decoration pattern And the double-sided pressure-sensitive adhesive tape is cut with a laser beam or press process so that it is the same shape as the metal decoration pattern or smaller than each edge of the metal decoration pattern by leaving a release layer, and is smaller by 5 to 400 μm. A decorative plate, characterized in that a press-fitted metal decorative plate bonded to a pattern is bonded to an adhesion target portion of an adherend by an adhesive fixing layer.   A concave portion for adhering the metal mounting pattern is formed on the affixing surface, and the thickness of the press-fitted metal decorative plate including the adhesive fixing layer is the depth of the indented portion that is the planned affixing portion formed on the affixing surface. The crimping type metal decorative plate is formed in a width within a range of 95 to 99% with respect to the width of the concave portion. Item 10. A decorative plate according to item 9.   The double-sided pressure-sensitive adhesive tape is a pressure-sensitive adhesive double-sided tape laser-cut into the same type as the pressure-bonding metal decorative plate, or a pressure-sensitive adhesive double-sided tape press-cut into the same type as the pressure-sensitive metal decorative plate. The decorative plate according to claim 9 or 10, characterized in that:   11. The ninth or tenth aspect according to claim 9 or 10, wherein the pressure-sensitive fixing layer has an initial 180-degree peeling adhesion to stainless steel at 23 ° C. within a range of 10.0 N / 20 mm to 18.0 N / 20 mm. Decorative plate.   The thickness of the said metallic decoration pattern exists in the range of 30-250 micrometers, The decoration plate of Claim 9 or Claim 10 characterized by the above-mentioned.   The metal decoration pattern is formed by electrolytic deposition or etching, and the metal decoration pattern is attached to the surface of the application tape so as to be peelable from the application tape. 11. The decorative plate according to claim 9 or 10, wherein the application tape is discarded together with the metal decorative pattern that is not attached after being fixed to the adherend.   The above-mentioned pressure bonding type metal decorative plate is formed by laminating a metal decorative plate, a double-sided pressure-sensitive adhesive layer, and a release layer in this order, and the thickness of the metal decorative plate is within a range of 30 to 250 μm. The thickness of the double-sided pressure-sensitive adhesive is in the range of 0.01 to 0.15 mm, and the ratio of the thickness of the metal decorative plate to the thickness of the double-sided pressure-sensitive adhesive layer is 1: 7 to 1 The decorative plate according to claim 9 or 10, wherein the decorative plate is within a range of 0.8, and is peeled off from the release layer and attached to a part to be attached of the adherend.   The adhesive fixing layer comprising the double-sided tape is a double-sided pressure-sensitive adhesive tape having an adhesive layer on both sides of the support, or a double-sided pressure-sensitive adhesive tape having adhesiveness on both sides without using the support. The decorative plate according to claim 9 or 10, characterized in that:   A metal decorative pattern to be applied to a double-sided pressure-sensitive adhesive tape having a release layer attached to one surface, by irradiating the surface of the release layer with a laser beam from the side where the release layer is not formed. Cut out a double-sided pressure-sensitive adhesive layer that is 5 to 400 μm smaller than each edge of the same shape or metal decoration pattern, or press-process the same shape or metal decoration pattern as the metal decoration pattern that reaches the release layer A double-sided pressure-sensitive adhesive layer that is 5 to 400 μm smaller than each edge is punched out, and then, from the double-sided pressure-sensitive adhesive tape, the same shape as the metal decoration pattern or 5 to 5 than each edge of the metal decoration pattern Each part other than the double-sided pressure-sensitive adhesive layer formed so as to be reduced by 400 μm is peeled off, and each edge of the metal decoration pattern is the same shape as the metal decoration pattern on the surface of the release layer A double-sided pressure-sensitive adhesive pattern with a release layer having a double-sided pressure-sensitive adhesive layer that is made to be 5 to 400 μm smaller is formed, and the both sides with the release layer are formed on the back surface of the metal decoration pattern formed on the application tape. A method for producing a pressure-sensitive metal decorative plate, comprising contacting an adhesive of a pressure-sensitive adhesive pattern to form an adhesive layer on the back surface of the metal decorative pattern.   A metal decorative pattern to be applied to a double-sided pressure-sensitive adhesive tape having a release layer attached to one surface, by irradiating the surface of the release layer with a laser beam from the side where the release layer is not formed. Cut out a double-sided pressure-sensitive adhesive layer that is 5 to 400 μm smaller than each edge of the same shape or metal decoration pattern, or press-process the same shape or metal decoration pattern as the metal decoration pattern that reaches the release layer A double-sided pressure-sensitive adhesive layer that is 5 to 400 μm smaller than each edge is punched out, and then, from the double-sided pressure-sensitive adhesive tape, the same shape as the metal decoration pattern or 5 to 5 than each edge of the metal decoration pattern The part other than the double-sided pressure-sensitive adhesive layer that is made to be 400 μm is peeled off, and the surface of the peeling layer is the same shape as the metal decoration pattern or from each edge of the metal decoration pattern A double-sided pressure-sensitive adhesive pattern with a release layer having a double-sided pressure-sensitive adhesive layer that is reduced to 5 to 400 μm is formed, and the double-sided pressure-sensitive adhesive layer with the release layer is formed on the back surface of the metal decorative pattern formed on the application tape. A pressure-sensitive metal decorative plate is prepared by abutting the adhesive of the adhesive pattern to form an adhesive layer on the back surface of the metal decorative pattern. The adhesive layer formed on the press-bonded metal decoration pattern is brought into contact with and pressurized on the pasting portion of the body, and the press-bonding metal decoration pattern is pressed onto the pasting portion of the adherend, and then the adhesive A method for producing a decorative plate, characterized in that a metal decorative pattern not fixed to an adherend with a layer is peeled off together with an application tape.