JP2010274546A - Metal film with adhesive and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin metal film with adhesive, capable of suppressing peel, breakage or others of a metal film and excellent in handleability and a method for manufacturing the same. <P>SOLUTION: The method for manufacturing the metal film 1 with the adhesive comprises a metal part forming step for forming a metal part 10 comprising a plurality of metal layers by forming a thin film metal layer 11 by applying spattering on a resin film (a base material) 2 on which a coating layer (a covering layer) 21 having peelability on its surface and further forming metal layers; an adhesive layer forming step for forming an adhesive layer 13 on the metal part 10; a separate layer arranging step for arranging a separate layer 31 on the adhesive layer 13; and separating step for forming the metal film 1 with the adhesive constituted by laminating the adhesive layer 13 and the metal part 10 on the separate layer 31 in series by peeling the thin film metal layer 11 from the resin film 2 to separate the resin film 2 and the metal part 10. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a metal film with an adhesive applied as an electromagnetic shielding material or the like for blocking high-frequency electromagnetic waves generated from electronic devices and the like, and a method for producing the same.

As an electromagnetic wave shielding material for blocking high-frequency electromagnetic waves generated from electronic devices such as computers and mobile phones, there is, for example, a metal film with an adhesive in which an adhesive is coated on one side of a metal foil made of copper or the like. (See Patent Document 1).
Such a metal film with an adhesive is generally about 70 μm including the thickness of the adhesive.

Japanese Patent Laid-Open No. 11-80682

In recent years, with the thinning of cellular phones and the like, the built-in metal film is also required to be thin.
In order to meet this requirement, a method of stretching the metal foil to make the entire metal film thin can be considered. However, in this case, it is difficult to manage the thickness, and there is a limit to reducing the thickness. In addition, there is a method of forming a thin metal film by sputtering, vapor deposition or the like, but in this case, the metal film is easily peeled or torn, and there is a problem in handling properties.

  The present invention has been made in view of such conventional problems, and is intended to provide a thin metal film with a pressure-sensitive adhesive that can suppress peeling and tearing of a metal film and has excellent handling properties, and a method for producing the same. It is what.

According to a first aspect of the present invention, a thin film metal layer is formed on a substrate having a peelable coating layer formed on the surface by at least sputtering or vapor deposition, and if necessary, on the thin film metal layer. A metal part forming step of forming a metal part composed of one or more metal layers by further forming a metal layer;
An adhesive layer forming step of forming an adhesive layer by applying an adhesive on the metal part,
On the adhesive layer, a separate layer disposing step of disposing a separate layer having releasability with respect to the adhesive layer;
With the adhesive formed by laminating the adhesive layer and the metal part in order on the separate layer by separating the thin film metal layer from the base material and separating the base material and the metal part. And a separation step of forming a metal film. (Claim 1)

  A second invention is a metal film with pressure-sensitive adhesive, which is manufactured by the method for manufacturing a metal film with pressure-sensitive adhesive according to the first invention (claim 7).

  In the method for producing a metal film with an adhesive according to the first aspect of the invention, in the metal part forming step, a thin film metal layer is formed on the coating layer of the base material by sputtering or vapor deposition. The metal part which consists of 1 or several metal layers containing is formed. And after performing the said adhesion layer formation process and the said separate layer arrangement | positioning process, in the said isolation | separation process, the said thin-film metal layer is peeled from the said base material, and it adheres by isolate | separating the said base material and the said metal part. A metal film with an agent is obtained.

That is, in the present invention, the thin film metal layer is once formed on the substrate. Therefore, the thin film metal layer can be formed with a desired thickness with high accuracy by sputtering or vapor deposition.
And after forming another layer on the said thin-film metal layer, the said base material is removed. Here, the coating layer having peelability is formed in advance on the surface of the substrate. Therefore, even if the sputtering method or the vapor deposition method, which is a film forming method in which the thickness of the thin film metal layer is very thin and the adhesion between the base material and the thin film metal layer is increased, the presence of the coating layer is present. Thus, the base material and the thin film metal layer can be easily peeled off without causing the thin film metal layer to peel off and break.

  Thereby, finally the thin metal film with an adhesive including the said thin film metal layer of the thin film formed into a film by sputtering or vapor deposition can be obtained. In addition, this metal film with an adhesive has the above-mentioned adhesive layer made of an adhesive, and can be used by peeling off the above-mentioned separate layer and affixing it to a target part. .

  Thus, according to the manufacturing method of the said 1st invention, peeling of a metal film, a tear, etc. can be suppressed and the thin metal film with an adhesive (2nd invention) excellent in handling property is obtained. be able to.

Explanatory drawing which shows the process of manufacturing the metal film with an adhesive in (a)-(e) in Example 1. FIG. Explanatory drawing which shows the other structural example of the metal film with an adhesive in Example 1. FIG. Explanatory drawing which shows the process of manufacturing the metal film with an adhesive in (a)-(c) in Example 2. FIG. Explanatory drawing which shows the other structural example of the metal film with an adhesive in Example 3. FIG. Explanatory drawing which shows the other structural example of the metal film with an adhesive in Example 4. FIG.

In the first and second inventions, the adhesive-attached metal film is applied as an electromagnetic shielding material for blocking high-frequency electromagnetic waves generated from electronic devices such as computers and mobile phones.
In practice, the metal film with pressure-sensitive adhesive can be used by peeling off the separate layer and affixing it to a target electromagnetic shielding component or the like with the pressure-sensitive adhesive layer made of pressure-sensitive adhesive.

Moreover, it is preferable that the thickness of the said metal film with an adhesive is 20-50 micrometers.
When the thickness of the metal film with the pressure-sensitive adhesive is less than 20 μm, the thickness is too thin and the strength is lowered, which may cause a problem in handling properties such as being easily broken. On the other hand, when the thickness exceeds 50 μm, the thickness is not much different from conventional metal foils such as conventional copper foil supplied to the market. May not be applicable.

  Moreover, the said metal part is comprised by the 1 or several metal layer containing the said thin film metal layer at least. Therefore, the case where the metal part is composed of one metal layer refers to the case where the metal part is composed only of the thin film metal layer.

Moreover, it is preferable that the said thin metal layer in the said metal film with an adhesive is 2 micrometers or more.
When the thickness of the thin film metal layer is less than 2 μm, the overall strength is lowered, and there is a possibility that problems such as tearing may occur. On the other hand, if the thickness of the thin film metal layer is increased, it may not be applicable as an electromagnetic shielding material for electronic devices such as mobile phones that are required to be thinned. It is preferable to adjust appropriately in consideration.

Further, the coating layer formed on the surface of the base material is preferably composed of a heat release film, a UV film, a resist film, or a resin film or a paper film having an acrylic resin or a silicone resin on the surface. 2).
In this case, the thin film metal layer can be easily peeled from the coating layer in the separation step.

The heat-release film has a property that the adhesive strength is changed by applying heat. Therefore, in the case of using a heat release film as the coating layer, peeling at the interface between the coating layer and the thin film metal layer can be easily performed by heating the substrate.
Further, the UV film has a property that the adhesive strength is lowered by irradiating UV (ultraviolet rays). Therefore, when a UV film is used as the coating layer, peeling at the interface between the coating layer and the thin metal layer can be easily performed by irradiating UV from the UV film side.

  The resist film is a film made of a resist material that is cured by exposure to ultraviolet rays, and is mainly a film that can be dissolved by an organic solution such as acetone. Therefore, when a resist film is used as the coating layer, the coating layer and the thin film metal layer are formed by immersing the entire film in an organic solution such as acetone after the formation of the thin film metal layer and dissolving only the resist film. Can be easily peeled off.

  When a hard coat layer made of an acrylic resin is used as the coating layer, the hard coat layer made of an acrylic resin having hardness (2H or more in terms of hardness) is applied to the surface of the resin film or paper film. It can be easily formed and peeled off at the interface between the hard coat layer and the thin metal layer.

  Moreover, when using the resin film or paper film which has a silicone type resin (for example, a fluoro silicone type resin etc.) on the surface as the said coating layer, the adhesiveness of the said base material and the said coating layer tends to become low. is there. Therefore, when the thin film metal layer is peeled from the base material, peeling may occur in some places at the interface between the base material and the coating layer, and the coating layer (silicone resin) is formed on the surface layer of the thin film metal layer. May remain partially. However, since the coating layer is thin (for example, 50 nm or less) and does not become a layer having a high resistance enough to affect conductivity, there is no problem.

  For example, as shown in Example 5 described later, when the metal film with an adhesive is manufactured using a base material (base film) having a coating layer (coating layer) made of a silicone-based resin, When the thin film metal layer was peeled off, peeling occurred in some places at the interface between the base material and the coating layer, and a part of the coating layer remained on the surface layer of the thin film metal layer. However, when the surface resistance of the thin-film metal layer (thickness 10 μm) with a portion of the coating layer remaining was measured, the resistance value was 0.001Ω / □, as in Example 1 described later, The acrylic resin was used as the coating layer, and no significant difference was observed when the substrate was peeled at the interface between the coating layer and the thin metal layer.

Moreover, it is preferable that the unevenness | corrugation is formed in the surface of the said base material (Claim 3).
In this case, the thin film metal layer or the like is formed on the surface of the base material on which the unevenness is formed, and the base material and the metal part are separated, whereby one surface of the pressure-sensitive adhesive metal film ( Unevenness can be formed on the surface of the thin film metal layer. As a result, when the metal film with an adhesive is incorporated in an electronic device or the like, point contact on the surface on which the irregularities are formed increases, electrical conductivity becomes good, and electromagnetic wave shielding characteristics can be improved. .
In addition, the said unevenness | corrugation can be formed by embossing. Moreover, it is preferable that the depth of the said unevenness | corrugation is 3-20 micrometers.

Moreover, it is preferable to perform the protective metal layer formation process which forms the protective metal layer which consists of SUS (stainless steel) on the surface of the said thin film metal layer of the said metal part after the said isolation | separation process (Claim 4).
In this case, the surface is covered with the protective metal layer made of SUS (stainless steel), thereby providing excellent rust prevention. Thereby, long-term durability can be improved.
The protective metal layer can be formed on the surface of the thin film metal layer by a method such as sputtering.

Further, after the separation step, an additional adhesive layer forming step of forming an additional adhesive layer by applying an adhesive to the surface on which the adhesive layer is not formed, and the additional adhesive layer, It is preferable to perform an additional separate layer disposing step of disposing an additional separate layer having releasability with respect to the additional adhesive layer.
Here, the surface on which the adhesive layer is not formed is the surface of the thin-film metal layer when the protective metal layer is not provided, and the protective metal when the protective metal layer is provided. It becomes the surface of the layer.

  In this case, the said metal film with an adhesive becomes a structure by which the said adhesion layer, the said metal part, and the said additional adhesion layer were laminated | stacked. And it becomes the structure by which the said separate layer and the said additional separate layer were arrange | positioned on both surfaces. Therefore, both surfaces can be used as adhesive surfaces by peeling off the separate layer and the additional separate layer. Thereby, for example, the metal film with an adhesive can be used between two parts.

The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer may have conductivity (Claim 6).
In this case, the pressure-sensitive adhesive layer has conductivity. Thereby, the said metal film with an adhesive which has double-sided conductivity can be obtained.

  Moreover, as said base material, resin films, such as a polyethylene terephthalate (PET) and polyethylene (PE), can be used, for example. In addition, an inexpensive film such as paper can be used.

  Moreover, as a metal material which comprises the said thin film metal layer, it is a material suitable for performing sputtering or vapor deposition, and low resistance and excellent electroconductivity can be used. Further, if the resistance can be lowered by increasing the thickness, for example, SUS (stainless steel), Ni, Cr, or the like can be used.

  Moreover, copper, Al, Ag etc. can be used as a metal material which comprises the said metal layer formed on the said thin film metal layer. Further, in order to improve the electromagnetic wave shielding property, Ni, Fe alloy, Cr alloy, permalloy or the like having excellent magnetic properties can be used.

Moreover, as an adhesive which comprises the said adhesion layer and the said additional adhesion layer, the adhesive etc. which have the electroconductivity which mixed Ni filler in acrylic resin or silicone resin can be used.
Moreover, as a material which comprises the said separate layer and the said additional separate layer, resin films, paper films, etc., such as PET film which apply | coated silicone resin etc. can be used.

Example 1
The manufacturing method of the double-sided conductive adhesive metal film concerning the Example of this invention is demonstrated using figures.
The manufacturing method of the metal film 1 with an adhesive of this example is a resin film (base material) in which a coating layer (coating layer) 21 having peelability is formed on the surface as shown in FIGS. A thin film metal layer 11 is formed on the substrate 2 by sputtering, and further a metal layer (additional metal layer 12) is formed to form a plurality of metal layers (thin film metal layer 11, additional metal layer 12). A metal part forming step for forming the metal part 10, an adhesive layer forming process for forming the adhesive layer 13 by applying an adhesive on the metal part 10, and an adhesive layer 13 on the adhesive layer 13. And separating the thin film metal layer 11 from the resin film 2 and separating the resin film 2 and the metal portion 10, thereby separating the separation layer 31 having the separation layer 31. And sticky And a separation step of forming an adhesive-attached metal film 1 formed by laminating a layer 13 and a metal portion 10 in this order.
This will be described in detail below.

  First, as shown in FIG. 1A, a resin film 2 made of polyethylene terephthalate (PET) having a length of 100 m, a width of 500 mm, and a thickness of 100 μm wound in a roll shape is prepared. One surface of the resin film 2 is coated with a coating layer 21 made of an acrylic resin.

  The coating layer 21 made of an acrylic resin is more preferably hard so as to have peelability with respect to the thin-film metal layer 11 to be formed later by sputtering, that is, for controlling the adhesion, and is an index of hardness. A 2H acrylic hard coat layer close to 3H was obtained. Further, if the coating layer 21 is further hardened to 3H and 4H, it is preferable in that it does not penetrate into the resin film 2 when the thin film metal layer 11 is formed. The thing of was used.

<Metal part formation process>
Next, using a turbo molecular pump, evacuation is performed to bring the sputtering apparatus into a high vacuum state of 5 × 10 ⁻⁴ Pa, and the residual gas and moisture content in the sputtering apparatus are reduced. Thereby, oxidation of the thin film metal layer 11 to be formed later by sputtering can be reduced. Then, after the sputtering apparatus is evacuated to a high vacuum state, film formation by sputtering is performed while the resin film 2 is wound up by a winding roll.

Specifically, while operating the resin film 2 at a feed speed of 1.2 m / min, argon gas is supplied in an amount of 200 cc / min to the cathode electrode in the film forming chamber in which the metal target material made of copper is installed. A high voltage of 200 V is applied between the resin film 2 and the metal target material with a power of 1.5 kW using a pulsed DC (direct current) power source that can be applied and applied with a pulse waveform.
Thereby, as shown in FIG.1 (b), on the coating layer 21 of the resin film 2, the thin film metal layer 11 which is a sputtered film which consists of copper is formed with a thickness of 200 nm.

Next, the resin film 2 wound up in a roll is immersed in a copper sulfate solution. And a voltage is applied to the both ends of the resin film 2, and electroplating is performed by using the thin metal layer 11 made of copper as an electrode. Then, the resin film 2 is wound up with a winding roll.
Thereby, as shown in FIG.1 (c), the additional metal layer 12 which is an electrolytic plating film which consists of copper is formed into a film with a thickness of 10 micrometers on the thin film metal layer 11. FIG. And the metal part 10 comprised by the thin film metal layer 11 and the additional metal layer 12 is formed.

<Adhesive layer forming step / separate layer arranging step>
Next, a conductive paste (adhesive) containing Ni filler is applied to the surface of the metal part 10 of the resin film 2 wound up in a roll shape with a thickness of 20 μm. Then, a silicone-based resin is applied to the surface of the applied conductive paste, and a paper separator having peelability with respect to the conductive paste is disposed.
Thereby, as shown in FIG. 1 (d), the adhesive layer 13 made of conductive paste is formed on the additional metal layer 12, and the separate layer 31 made of paper separator is disposed on the adhesive layer 13. .

<Separation process>
Next, the thin film metal layer 11 is peeled from the resin film 2 (specifically, the thin film metal layer 11 is peeled from the coating layer 21 of the resin film 2), and the resin film 2 and the metal portion 10 are separated. That is, the resin film 2 is removed. Then, in order to prevent surface oxidation of the thin film metal layer 11, it is immersed in the coating liquid of a discoloration prevention agent.
Thereby, as shown in FIG.1 (e), the adhesive-attached metal film comprised by laminating | stacking the adhesion layer 13 and the metal part 10 (additional metal layer 12, thin film metal layer 11) in order on the separate layer 31. 1 (thickness: 30.2 μm) is formed.

Next, the effect in the manufacturing method of the metal film 1 with an adhesive of this example is demonstrated.
In the manufacturing method of the metal film 1 with pressure-sensitive adhesive of this example, in the metal part forming step, a thin film metal layer 11 of a thin film is formed on the coating layer 21 of the resin film 2 by sputtering. A metal portion 10 composed of a plurality of metal layers is formed. And after performing the adhesion layer formation process and the separate layer arrangement | positioning process, in the isolation | separation process, by peeling the thin film metal layer 11 from the resin film 2, and separating the resin film 2 and the metal part 10, it is with an adhesive. A metal film 1 is obtained.

That is, in this example, the thin film metal layer 11 is once formed on the resin film 2 as a base material. Therefore, the thin metal layer 11 can be formed with a desired thickness with high accuracy by sputtering.
And after forming another layer on the thin metal layer 11, the resin film 2 is removed. Here, a coating layer 21 having peelability is formed on the surface of the resin film 2 in advance. Therefore, when the thin film metal layer 11 is very thin and a sputtering method or a vapor deposition method (in this example, a sputtering method), which is a film forming method that increases the adhesion between the resin film 2 and the thin film metal layer 11, is used. However, the resin film 2 and the thin film metal layer 11 can be easily peeled off without being peeled off by the thin film metal layer 11 due to the presence of the coating layer 21 and causing a tear or the like.

  Thereby, finally the thin metal film 1 with an adhesive including the thin film metal layer 11 of the thin film formed by sputtering can be obtained. Moreover, this metal film 1 with an adhesive has the adhesive layer 13 which consists of adhesives, and can peel off the separate layer 31 and affix it to an object part, and it is excellent in handling property. Become.

  Further, in this example, a coating layer 21 having peelability with respect to the first metal layer 11 is formed on the surface of the resin film 2. The coating layer 21 is a hard coat layer made of an acrylic resin. Therefore, the resin film 2 and the first metal layer 11 can be easily separated in the separation step.

  Moreover, as the adhesive that forms the adhesive layer 13, a conductive paste containing Ni filler and having conductivity is used. Therefore, the pressure-sensitive adhesive layer 13 has conductivity. Thereby, the metal film 1 with an adhesive which has double-sided conductivity can be obtained.

  Moreover, the metal film 1 with an adhesive is very thin with a thickness of 30.2 μm, and is composed of a thin film metal layer 11 having conductivity, an additional metal layer 12 and an adhesive layer 13. It has characteristics such as sex. Therefore, it can be applied as an electromagnetic shielding material for electronic devices such as mobile phones that are required to be thin. At this time, the metal film 1 with a pressure-sensitive adhesive can be used by peeling off the separate layer 31 and affixing it to a target component with the pressure-sensitive adhesive layer 13.

  Thus, according to the manufacturing method of this example, peeling of a metal film, tearing, etc. can be suppressed and the thin metal film 1 with an adhesive which was excellent in handling property can be obtained.

  In this example, as shown in FIG. 1, the metal portion 10 in the metal film 1 with adhesive is composed of a thin film metal layer 11 that is a sputtered film and an additional metal layer 12 that is an electrolytic plating film. As shown, the metal part 10 can also be composed of only one metal layer, that is, the thin film metal layer 11.

(Example 2)
In this example, as shown in FIGS. 3A to 3C, when the metal film 1 with an adhesive is manufactured, the unevenness 22 is formed on the surface of the resin film 2.

In this example, as shown in FIG. 3A, embossing is performed on the surface of the resin film 2 coated with the coating layer 21 to form irregularities 22 having a depth of 20 μm at intervals of 2 mm.
Next, a metal part forming step, an adhesive layer forming step, and a separate layer disposing step are sequentially performed. As shown in FIG. 3B, on the resin film 2, the thin metal layer 11, the additional metal layer 12, and the adhesive layer 13. Then, the separate layer 31 is formed in order.

And a separation process is performed, the resin film 2 and the metal part 10 are isolate | separated, and the resin film 2 is removed. As a result, as shown in FIG. 3 (c), the adhesive layer 13 and the metal part 10 (additional metal layer 12, thin film metal layer 11) are stacked in this order on the separate layer 31, and the surface of the metal part 10 is formed. The metal film 1 with an adhesive in which the formation uneven part 101 is formed is formed.
Others are the same as in the first embodiment.

In the case of this example, the thin film metal layer 11 or the like is formed on the surface of the resin film 2 on which the irregularities 22 are formed, and the resin film 2 and the metal part 10 are separated, thereby allowing one of the metal films 1 with an adhesive to be applied. The formation uneven portion 101 can be formed on the surface (the surface on the side where the thin film metal layer 11 is formed). Thereby, when the metal film 1 with an adhesive is incorporated in an electronic device or the like, the point contact on the surface on which the formation uneven portion 101 is formed increases, the electrical conductivity becomes good, and the electromagnetic wave shielding property and the like Characteristics can be improved.
The other functions and effects are the same as those of the first embodiment.

(Example 3)
As shown in FIG. 4, this example is an example in which a protective metal layer forming step is further performed after the separating step in manufacturing the metal film 1 with an adhesive.

In this example, after performing a metal part formation process, an adhesion layer formation process, a separation layer arrangement process, and a separation process in order (the state of FIG. 1 (e)), as shown in FIG. 4, on the surface of the thin film metal layer 11 Then, a protective metal layer 19 made of SUS (stainless steel) is formed to a thickness of 40 nm by performing sputtering (protective metal layer forming step).
Thereby, as shown in the same figure, finally, the metal film 1 with an adhesive formed by laminating the adhesive layer 13, the metal part 12, and the protective metal layer 19 in this order is obtained.
Others are the same as in the first embodiment.

In the case of this example, by covering the surface with a protective metal layer 19 made of SUS (stainless steel), it is possible to obtain the metal film 1 with an adhesive having excellent rust prevention properties. Thereby, long-term durability can be improved.
The other functions and effects are the same as those of the first embodiment.

Example 4
In this example, as shown in FIG. 5, in manufacturing the metal film 1 with an adhesive, an additional adhesive layer forming step and an additional separate layer arranging step are further performed after the separation step.

  In this example, after performing a metal part formation process, an adhesion layer formation process, a separate layer arrangement process, and a separation process in order (the state of FIG. 1E), the adhesion layer 13 is formed as shown in FIG. On the other side, that is, on the surface of the thin metal layer 11, a conductive conductive paste (adhesive) containing Ni filler is applied to a thickness of 10 μm to form an adhesive layer (additional adhesive layer) 14 (additional adhesive layer formation) Process). And the separate layer (additional separate layer) 32 which consists of a paper separator which has peelability with respect to the adhesion layer 14 is arrange | positioned on the adhesion layer 14 (additional separate layer formation process).

Thereby, as shown in the same figure, finally, the metal film 1 with an adhesive formed by laminating the adhesive layer 13, the metal part 12, and the adhesive layer 14 in this order is obtained. And the metal film 1 with an adhesive is the structure by which the separate layers 31 and 32 were arrange | positioned on the both surfaces.
Others are the same as in the first embodiment.

In the case of this example, by separating the separate layers 31 and 32 disposed on both surfaces, both surfaces can be used as adhesive surfaces. Therefore, for example, the adhesive-attached metal film 1 can be used between two parts. Thereby, the adhesiveness between both components becomes high and electrical continuity can be improved. In addition, the reliability of electromagnetic wave shielding can be improved.
The other functions and effects are the same as those of the first embodiment.

(Example 5)
This example is an example in which a metal film 1 with an adhesive is manufactured using a resin film 2 having a coating layer 21 made of a silicone resin.

In this example, similarly to Example 1, the metal part forming step, the pressure-sensitive adhesive layer forming step, the separate layer forming step, and the separation step were performed in order, and the metal film 1 with pressure-sensitive adhesive was produced as shown in FIG.
In the metal part forming step, the thin film metal layer 11 (thickness 10 μm) made of SUS (stainless steel) was formed by sputtering on the resin film 2 having the coating layer 21 made of silicone resin. Then, an additional metal layer 12 constituted by a metal layer that is a sputtered film made of copper and a metal layer that is an electrolytic plating film made of copper was formed on the thin metal layer 11.
Others are the same as in the first embodiment.

  In the case of this example, as the coating layer 21 of the resin film 2, a silicone resin having lower adhesion than the acrylic resin used in Example 1 with respect to the thin metal layer 11 which is a sputtered film made of SUS. Is used. Therefore, the thin metal layer 11 can be easily peeled from the resin film 2. However, since the adhesion between the resin film 2 and the coating layer 21 is also lowered, peeling occurs at the interface between the resin film 2 and the coating layer 21 at the time of peeling, and the coating layer 21 is formed on the surface layer of the thin metal layer 11. A part remained. This was confirmed by performing surface analysis by fluorescent X-ray analysis.

  However, when the surface resistance of the thin-film metal layer 11 (thickness 10 μm) with a part of the coating layer 21 remaining was measured by the four-end needle method, the resistance value was 0.001Ω / □. Thus, a big difference was not seen when the acrylic resin was used as the coating layer 21 and peeled at the interface between the coating layer 21 of the resin film 2 and the thin metal layer 11.

  Therefore, the thin film metal layer 11 can be easily peeled from the resin film 2 by changing the material of the coating layer 21 depending on the material of the thin film metal layer 11. Depending on the combination of materials used, a part of the coating layer 21 may remain in the surface layer of the thin film metal layer 11, but the coating layer 21 is thin (for example, 50 nm or less) and conductive. There is no problem because the layer does not have a high resistance enough to affect the performance.

Moreover, in the case of this example, the metal film 1 with an adhesive excellent in antirust property can be obtained by covering the surface with the thin film metal layer 11 which consists of SUS (stainless steel). Thereby, long-term durability can be improved.
The other functions and effects are the same as those of the first embodiment.

DESCRIPTION OF SYMBOLS 1 Metal film with an adhesive 10 Metal part 101 Forming uneven part 11 Thin film metal layer 12 Additional metal layer 13 Adhesive layer 14 Adhesive layer (additional adhesive layer)
19 Protective metal layer 2 Resin film (base material)
21 Coating layer (coating layer)
22 Concavity and convexity 31 Separate layer 32 Separate layer (additional separate layer)

Claims (7)

A thin film metal layer is formed at least by sputtering or vapor deposition on a substrate having a peelable coating layer formed on the surface, and a metal layer is further formed on the thin film metal layer as necessary. A metal part forming step of forming a metal part composed of one or more metal layers,
An adhesive layer forming step of forming an adhesive layer by applying an adhesive on the metal part,
On the adhesive layer, a separate layer disposing step of disposing a separate layer having releasability with respect to the adhesive layer;
With the adhesive formed by laminating the adhesive layer and the metal part in order on the separate layer by separating the thin film metal layer from the base material and separating the base material and the metal part. The manufacturing method of the metal film with an adhesive characterized by having the isolation | separation process which forms a metal film.   2. The production of a metal film with a pressure-sensitive adhesive according to claim 1, wherein the coating layer comprises a heat release film, a UV film, a resist film, a resin film or a paper film having an acrylic resin or a silicone resin on the surface. Method.   3. The method for producing a metal film with an adhesive according to claim 1, wherein unevenness is formed on the surface of the substrate.   4. The protective metal layer forming step of forming a protective metal layer made of SUS (stainless steel) on the surface of the thin film metal layer of the metal part after the separating step according to claim 1. The manufacturing method of the metal film with an adhesive characterized by the above-mentioned.   The additional adhesion layer forming process which forms an additional adhesion layer by applying an adhesive to the surface of the side in which the above-mentioned adhesion layer is not formed after the above-mentioned separation process in any 1 paragraph of Claims 1-4. A method for producing a metal film with an adhesive, comprising: performing an additional separate layer disposing step of disposing an additional separate layer having peelability on the additional adhesive layer on the additional adhesive layer.   The method for producing a metal film with an adhesive according to any one of claims 1 to 5, wherein the adhesive forming the adhesive layer has conductivity.   It manufactures with the manufacturing method of the metal film with an adhesive of any one of Claims 1-6, The metal film with an adhesive characterized by the above-mentioned.

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