JPWO2010097910A1 - Anodic bonding method, anodic bonding jig, and anodic bonding apparatus - Google Patents

Abstract

An anodic bonding method for anodically bonding a first substrate and a second substrate includes superposing the first substrate and the second substrate, and the first substrate and the second substrate on the plane of a base having a plane. A substrate placement step of placing the surface that becomes the cathode in contact with the substrate, and following the substrate placement step, contacting the surface of the first substrate and the second substrate that becomes the anode. A jig placement step of placing an anodic bonding jig having a visual recognition portion made of a material capable of transmitting visible light in contact with each other, and a pair of marks provided on each of the first substrate and the second substrate An alignment step of adjusting a relative positional relationship between the first substrate and the second substrate based on visible light transmitted through the visual recognition unit so as to have a predetermined positional relationship; and the base and the anode Pressurize in a direction to bring the joining jig close to each other, Serial comprising a first substrate and pressurizing step of sandwiching the second substrate, and applying step for applying a DC voltage between the first substrate and the second substrate.

Description

  The present invention relates to an anodic bonding method, an anodic bonding jig, and an anodic bonding apparatus.

Conventionally, in the manufacture of sensors, piezoelectric vibrators, and the like, package products having a package in which a plurality of substrates are joined and a cavity is formed between the substrates are known.
As a package in such a package product and a manufacturing method thereof, for example, Patent Document 1 describes a package manufactured by stacking and bonding substrates. According to the package described in Patent Document 1, the inside of the package can be hermetically sealed.

  Patent Document 1 discloses an anodic bonding method as a method for bonding substrates, and describes that a metal or a semiconductor such as aluminum, titanium, tantalum, or silicon can be used as a bonding layer.

Here, when the substrates to be anodically bonded as described above are aligned with each other and disposed on the base, and then the anodic bonding jig is disposed, the positional relationship between the substrates may be shifted.
In conventional anodic bonding jigs, alignment is performed based on the alignment mark on the substrate. However, the alignment mark is not displayed until pressurization is started after it has been accurately overlaid based on the alignment mark. Since it is hidden, there is no means for grasping the above-mentioned deviation, and anodic bonding was performed with the deviation remaining. Therefore, when a deviation exceeding the allowable range occurs, all products formed on the substrate may be defective.

In order to solve such a problem, one having a hole formed so as to penetrate the front and back of the anodic bonding jig has been considered. For example, the position of the alignment mark can be grasped through a hole provided in the anodic bonding jig, and it is possible to correct the deviation generated in the substrate to be anodically bonded even after the anodic bonding jig is arranged. ing.
Japanese Patent No. 362435

  However, even with conventional anodic bonding jigs that align holes by providing holes as described above, there is a limit to the size of the holes because it is necessary to apply pressure evenly to the substrate. There is a problem that it takes time to align the alignment mark with the hole.

The present invention has been made in view of the above-described problems, and a first object of the present invention is to provide an anodic bonding method capable of easily correcting a positional shift between substrates in an anodic bonding process. .
A second object of the present invention is to provide an anodic bonding jig and an anodic bonding apparatus capable of easily positioning a substrate to be anodic bonded.

In order to solve the above problems, the present invention proposes the following means.
The anodic bonding method of the present invention is an anodic bonding method in which a first substrate and a second substrate are anodically bonded, and the first substrate and the second substrate are overlapped with each other on the plane of the base having a plane. Substrate placement step of placing the first substrate and the second substrate in contact with the surface to be the cathode, and following the substrate placement step, the anode of the first substrate and the second substrate A jig placement step of placing an anodic bonding jig having a visual recognition portion made of a material that can transmit visible light so as to come into contact with the surface to be, and the first substrate and the second substrate The relative positional relationship between the first substrate and the second substrate is adjusted based on visible light transmitted through the visual recognition unit so that a pair of marks provided on each of the first and second marks has a predetermined positional relationship. An alignment step, the base and the anodic bonding jig. Pressurizing step for pressing the first substrate and the second substrate, and an applying step for applying a DC voltage between the first substrate and the second substrate. It is a feature.

  According to the present invention, the user can identify the pair of marks through the material capable of transmitting visible light in the visual recognition part of the anodic bonding jig. For this reason, in the alignment step, the relative positions of the first substrate and the second substrate can be adjusted so that the pair of marks have a predetermined positional relationship based on visible light transmitted through the visual recognition unit. Further, in the pressurizing step, it is possible to apply a predetermined pressure to the first substrate and the second substrate even in the visual recognition portion, so that pressurization unevenness can be suppressed.

Further, in the anodic bonding method of the present invention, the alignment step is based on the positions of the first substrate and the second substrate such that the pair of marks and the viewing portion overlap in the thickness direction of the viewing portion. A coarse adjustment step for adjusting the base, and a fine adjustment step for adjusting the relative position between the first substrate and the second substrate so that the pair of marks have a predetermined positional relationship following the coarse adjustment step. It is preferable to have.
In this case, in the coarse adjustment step, the pair of marks are arranged at positions that can be grasped via the visual recognition unit, and then the relative positions of the pair of marks are set to a predetermined positional relationship. For this reason, when the positions of the first substrate and the second substrate are shifted in the jig placement step, the positional relationship can be easily corrected in the alignment step.

An anodic bonding jig according to the present invention is an anodic bonding jig used for anodically bonding a first substrate and a second substrate, the main body having a first surface and a second surface, the first surface, A smooth surface provided on at least a part of the second surface and capable of being in close contact with the surface of the first substrate and the second substrate serving as an anode; and visible light provided on at least a part of the smooth surface. It has a visual recognition part which consists of material which can permeate between said 1st surface and said 2nd surface.
According to the present invention, the smooth surface of the anodic bonding jig is in contact with the substrate that becomes the anode in anodic bonding. Moreover, since the visual recognition part is provided in a part of smooth surface, the positional relationship of a 1st board | substrate and a 2nd board | substrate can be grasped | ascertained based on the visible light which permeate | transmits a visual recognition part. Therefore, the first substrate and the second substrate can be easily positioned, and the force applied to the first substrate and the second substrate via the anodic bonding jig is evenly distributed.

In the anodic bonding jig of the present invention, the smooth surface is preferably provided on each of the first surface and the second surface.
In this case, since both surfaces of the anodic bonding jig are smooth, both surfaces can be used to make contact with the surface to be the anode.

In the anodic bonding jig of the present invention, it is preferable that the main body is integrally formed of hard glass.
In this case, since the whole anodic bonding jig is integrally formed of hard glass, the visual recognition part and the other part are formed of a uniform material. Therefore, it is suppressed that stress concentrates on a specific location when temperature and pressure are applied by anodic bonding. Furthermore, the visual recognition part which can permeate | transmit visible light can be made into the whole anodic bonding jig | tool. For this reason, positioning with a 1st board | substrate and a 2nd board | substrate becomes still easier.

In the anodic bonding jig according to the present invention, the main body is preferably integrally formed of quartz glass.
In this case, since quartz glass is employed, the transparency is high, and the anodic bonding jig is not easily softened even when the anodic bonding jig is heated during anodic bonding.
Yes.

In the anodic bonding jig of the present invention, it is preferable that the main body has a notch at a position including at least a part of the smooth surface.
In this case, since an electrical contact can be connected to the anode exposed from the notch, anodic bonding is facilitated.

An anodic bonding apparatus according to the present invention is an anodic bonding apparatus for anodic bonding a first substrate and a second substrate, wherein the anodic bonding jig according to the present invention, a cathode among the first substrate and the second substrate, A base having a plane on which the surface to be arranged is arranged, and the first substrate and the second substrate are electrically connected to each other, and a DC voltage is applied between the first substrate and the second substrate. The power supply unit and a pressurizing unit that pressurizes the base and the anodic bonding jig in a direction to approach each other.
According to this invention, the positions of the first substrate and the second substrate can be easily adjusted via the visual recognition part, and the anodic bonding is performed in a state where the positions of the first substrate and the second substrate are accurately positioned. Therefore, the accuracy of anodic bonding can be increased.

According to the anodic bonding method, the anodic bonding jig, and the anodic bonding apparatus of the present invention, since the visual recognition portion made of a material capable of transmitting visible light is provided, it is easy to shift the positions of the substrates in the anodic bonding process. Can be corrected.
Further, according to the anodic bonding apparatus of the present invention, since the positional deviation in anodic bonding is reduced, the accuracy of anodic bonding is improved, and the yield of the anodic bonded product is improved.

FIG. 1 is a side view schematically showing an anodic bonding jig and an anodic bonding apparatus according to an embodiment of the present invention. FIG. 2 is a plan view showing a partial configuration of the anodic bonding jig and the anodic bonding apparatus. FIG. 3 is a perspective view for explaining the operation of the anodic bonding jig and the anodic bonding apparatus. FIG. 4 is a plan view showing one process during use of the anodic bonding jig and the anodic bonding apparatus. FIG. 5 is a side view showing a part of a process in use of the anodic bonding jig and the anodic bonding apparatus. FIG. 6 is a diagram showing a process during use of the anodic bonding jig and the anodic bonding apparatus. FIG. 7 is a flowchart showing an anodic bonding method according to an embodiment of the present invention. FIG. 8 is a flowchart showing in detail some steps of the anodic bonding method. FIG. 9 is a side view showing a modification of the anodic bonding apparatus shown in FIG.

Hereinafter, an anodic bonding jig, an anodic bonding apparatus, and an anodic bonding method according to an embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a side view schematically showing the anodic bonding apparatus of this embodiment. As shown in FIG. 1, the anodic bonding apparatus 1 is an apparatus for anodic bonding a first substrate B1 and a second substrate B2. In the present embodiment, both the first substrate B1 and the second substrate B2 are glass substrates, and a bonding film B11 made of a metal material is interposed between the first substrate B1 and the second substrate B2. The bonding film B11 is a thin film made of, for example, aluminum, and is disposed at a position facing the second substrate B2 on the surface of the first substrate B1.
In the present embodiment, the anodic bonding apparatus 1 performs anodic bonding of the bonding film B11 to the second substrate B2. Here, the first substrate B1 is a cathode side substrate, and the second substrate B2 is an anode side substrate.

  The anodic bonding apparatus 1 includes a base 20 having a flat surface 21 that can contact a first substrate B1 that serves as a cathode, an anodic bonding jig 10 that can contact a second substrate B2 that serves as an anode, a first substrate B1, and a first substrate B1. A power supply unit 30 that is electrically connected to the second substrate B2 and applies a DC voltage between the first substrate B1 and the second substrate B2, and a direction in which the base 20 and the anodic bonding jig 10 are brought close to each other (see FIG. And a pressurizing unit 40 that pressurizes in the direction of the arrow 1).

The base 20 has only to have a flat surface 21, and an appropriate configuration can be adopted for the material and the shape.
In the present embodiment, in the power supply unit 30, the electric wire 33 is connected to the bonding film B11 on the first substrate B1, and the electric wire 32 is connected to a part of the second substrate B2.
Although not shown, the anodic bonding jig 10 and the base 20 can support the first substrate B1 and the second substrate B2 with the first substrate B1 and the second substrate B2 sandwiched therebetween.
In the present embodiment, the pressurizing unit 40 shown in FIG. 1 employs a configuration in which the pressurizing unit 40 is tightened by being moved close to each other by a nut and a bolt. Other configurations may be adopted as long as it is possible to apply a compressive force in the thickness direction to the base 20.

  The anodic bonding jig 10 has a main body 10 a having a first surface 11 and a second surface 13. The first surface 11 is a smooth surface that can be in close contact with the second substrate B2 to be an anode. In the present embodiment, the smooth surface extends over the entire surface of the first surface 11, but the smooth surface may be at least partially so as to be in close contact with the second substrate B <b> 2 on the first surface 11. Further, the anodic bonding jig 10 is made of hard glass, and can transmit visible light between the first surface 11 and the second surface 13. Furthermore, it is preferable that the anodic bonding jig 10 is uniformly and integrally formed of a flat hard glass having a certain thickness. This is easy to manufacture the anodic bonding jig 10 and suppresses the occurrence of an interface where materials having different compositions come into contact with each other, and suppresses stress concentration when pressure is applied to the anodic bonding jig 10 and cracks. This is to make it difficult. The anodic bonding jig 10 is more preferably made of quartz glass.

  Further, in the anodic bonding jig 10, a region that can transmit visible light in the thickness direction is a visual recognition portion that is visually recognized in order to adjust the relative position between the first substrate B1 and the second substrate B2. In the present embodiment, the entire surface of the anodic bonding jig 10 can transmit visible light, and the entire anodic bonding jig 10 corresponds to a visual recognition portion. It should be noted that a part of the anodic bonding jig 10 may have a region that does not transmit visible light.

  FIG. 2 is a plan view showing a partial configuration of the anodic bonding apparatus 1 and the anodic bonding jig 10. As shown in FIG. 2, in the anodic bonding apparatus 1, the anodic bonding jig 10 is formed with a notch 12 in which a part of the second substrate B <b> 2 disposed in the anodic bonding apparatus 1 is exposed. The notch 12 is formed in a part of the peripheral edge of the anodic bonding jig 10, and the contact electrode 31 connected to the electric wire 32 is disposed in the notch 12. The contact electrode 31 is configured to be detachable from the second substrate B2.

Furthermore, in the plan view shown in FIG. 2, a pair of alignment marks (hereinafter referred to as “mark M”) provided on the first substrate B1 and the second substrate B2 through the visual recognition portion of the anodic bonding jig 10 to relatively position each other. Can be grasped.
FIG. 3 is a perspective view showing the operation of the mark M and the anodic bonding jig 10. As shown in FIG. 3, the mark M includes a first mark M1 provided on the first substrate B1 and a second mark M2 provided on the second substrate B2. Since the second substrate B2 is a glass-based substrate, it can transmit visible light, and the anodic bonding jig 10 can transmit visible light between the first surface 11 and the second surface 13. Therefore, the user can grasp through the anodic bonding jig 10 the state in which the first mark M1 and the second mark M2 are overlapped. The first mark M1 is arranged on the first substrate B1 while avoiding the pattern P of the bonding film B11.

  The operation of the anodic bonding apparatus 1 and the anodic bonding jig 10 according to the present embodiment in the above-described configuration and the anodic bonding method of the present invention will be described with reference to FIGS. FIGS. 4 to 6 are diagrams showing one process when the anodic bonding jig 10 and the anodic bonding apparatus 1 are used, and FIGS. 7 and 8 are flowcharts illustrating the anodic bonding method. Below, each process of the anodic bonding in this embodiment is demonstrated along the flowchart shown in FIG. 7 and FIG.

  As shown in FIG. 7, in this embodiment, first, a sandwiching step S <b> 1 is performed in which the first substrate B <b> 1 and the second substrate B <b> 2 are sandwiched between the anodic bonding jig 10 and the base 20. The sandwiching step S1 includes a substrate placement step S11 in which the first substrate B1 and the second substrate B2 are superposed, and the surface of the first substrate B1 serving as the cathode is brought into contact with the flat surface 21 of the base 20, and the substrate placement Subsequent to step S11, there is a jig arrangement step S12 in which the anode bonding jig 10 is arranged so as to come into contact with the surface of the second substrate B2 serving as the anode of the first substrate B1 and the second substrate B2. include.

  FIG. 4 is a plan view schematically showing a positional relationship between the anode bonding jig 10 and the first substrate B1 and the second substrate B2 in the sandwiching step S1. In FIG. 4, the positional relationship is emphasized so as to be easily understood. As shown in FIG. 4, in the sandwiching step S1, the first substrate B1 and the second substrate B2 are not completely overlapped, and the first mark M1 and the second mark M2 shown in FIG. It does not matter if it is shifted visually.

  Reference numerals A1 and A2 in FIG. 4 are areas used for alignment of the mark M in the visible portion of the anodic bonding jig 10 of the present embodiment (hereinafter referred to as “area A1 and area A2”). . In the sandwiching step S1, it is only necessary that the marks M are arranged so as to be located in the regions A1 and A2, respectively, and it is not necessary to perform detailed positioning between the sandwiching steps S1.

  Subsequently, as shown in FIG. 7, following the sandwiching step S1, the marks M1 and M2 provided on the first substrate B1 and the second substrate B2 are in a predetermined positional relationship, so Of these, an alignment step S2 is performed in which the relative positional relationship between the first substrate B1 and the second substrate B2 is adjusted based on visible light transmitted through the regions A1 and A2.

As shown in FIG. 8, the alignment step S2 includes a rough adjustment step S21 and a fine adjustment step S22.
In the coarse adjustment step S21, the positions of the first substrate B1 and the second substrate B2 are adjusted with respect to the base 20 to such an extent that the mark M overlaps the regions A1 and A2 in the thickness direction in the viewing portion, and the region A1 , A2 is aligned so that the mark M substantially matches the predetermined positional relationship. This may be performed by a technique such as visual alignment based on a circuit pattern or the like (for example, pattern P of the bonding film B11) formed on each of the first substrate B1 and the second substrate B2. good.

  In the fine adjustment step S22, as shown in FIGS. 5 and 6, a first substrate is used so that the first mark M1 and the second mark M2 are in a predetermined positional relationship using a microscope apparatus including the microscope 100 and the monitor D. The positions of B1 and second substrate B2 are adjusted.

When the alignment step S2 is completed, the anodic bonding jig 10 and the base 20 are temporarily fixed, and the first substrate B1 and the second substrate B2 are fixed. Subsequently, a bonding step S3 in which the first substrate B1 and the second substrate B2 are anodically bonded is performed.
In the bonding step S3, first, the anode bonding jig 10, the first substrate B1, the second substrate B2, and the base 20 are set on the pressure unit 40 in the positional relationship shown in FIG. 1, and the pressure step S31 is performed. Subsequently, the electric wire 33 is connected to the bonding film B11 of the first substrate B1, the contact electrode 31 is connected to the second substrate B2, and a DC voltage is applied by the power supply unit 30. Then, the bonding film B11 of the first substrate B1 on the cathode side and the second substrate B2 on the anode side are anodically bonded.

  As described above, according to the anodic bonding jig 10 and the anodic bonding method of the present embodiment, the smoothness on the first surface 11 of the anodic bonding jig 10 is applied to the second substrate B2 that becomes the anode in the anodic bonding. It is possible to easily grasp the positional relationship between the first substrate B1 and the second substrate B2 through the anodic bonding jig 10 that is in contact with the surface and can transmit visible light.

  Moreover, since the visual recognition part for visually recognizing the mark M is provided in a part of smooth surface (first surface 11) without a hole, when pressure is applied to the anodic bonding jig 10 in the pressurizing step S31. The force applied to the first substrate and the second substrate is evenly distributed. Further, since the anodic bonding jig 10 is integrally formed of hard glass, the visible light transmittance is high and the strength is high. Therefore, cracking of the anodic bonding jig is also suppressed during pressurization in the pressurization step S31.

  Further, according to the anodic bonding method of the present embodiment, in the alignment step S2, the first substrate is set such that the pair of marks M have a predetermined positional relationship based on visible light that passes through the visual recognition parts (for example, the regions A1 and A2). The relative position between B1 and the second substrate B2 can be easily matched.

Below, the modification of the anodic bonding apparatus 1 of this embodiment is demonstrated with reference to FIG.
FIG. 9 is a side view schematically showing an anodic bonding apparatus according to this modification. In this modification, as shown in FIG. 9, a case where the first substrate B111 is used instead of the first substrate B1 will be described.
The first substrate B111 is a metal-based substrate containing, for example, silicon, and is a type of substrate that does not require a bonding film for anodic bonding. In this case, it is possible to adopt a configuration in which the base 20 is made of a material having electrical conductivity and the electric wires 33 are arranged on the base 20.

As mentioned above, although embodiment of this invention was explained in full detail with reference to drawings, the concrete structure is not restricted to this embodiment, The design change etc. of the range which does not deviate from the summary of this invention are included.
For example, in the present embodiment, the configuration in which the smooth surface is provided on the first surface 11 of the main body 10a is adopted, but not limited to this, the configuration in which the smooth surface is also provided on the second surface 13 is adopted. You can also. In this case, since both the first surface 11 and the second surface 13 can be brought into close contact with the substrate serving as the anode, it is not necessary to pay attention to the direction of the main body 10a, and workability is improved.

  This can be suitably applied when it is necessary to correct the displacement of the substrates after being sandwiched when positioning and sandwiching a plurality of substrates.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Anode bonding apparatus 10 Anode bonding jig 10a Main body 11 First surface (smooth surface)
12 notch 13 second surface 20 base 21 plane 30 power supply unit 40 pressure unit B1 first substrate B2 second substrate B11 bonding film S1 sandwiching step S2 alignment step S21 coarse adjustment step S22 fine adjustment step S3 bonding step S31 pressure step S32 application process

Claims (8)

An anodic bonding method for anodically bonding a first substrate and a second substrate,
Substrate placement step of placing the first substrate and the second substrate on top of each other and placing the first substrate and the second substrate in contact with the surface of the first substrate and the second substrate which are in contact with each other. When,
Following the substrate placement step, an anodic bonding jig having a visual recognition portion made of a material capable of transmitting visible light so as to come into contact with the surface of the first substrate and the second substrate that becomes the anode. A jig placement step for placing in contact;
The first substrate and the second substrate based on visible light transmitted through the viewing portion so that a pair of marks provided on each of the first substrate and the second substrate have a predetermined positional relationship. An alignment process for adjusting the relative positional relationship between and
Pressurizing the base and the anodic bonding jig in directions close to each other, and sandwiching the first substrate and the second substrate; and
An application step of applying a DC voltage between the first substrate and the second substrate;
An anodic bonding method comprising: The anodic bonding method according to claim 1,
The alignment process includes:
A rough adjustment step of adjusting the positions of the first substrate and the second substrate with respect to the base so that the pair of marks and the visual recognition portion overlap in the thickness direction of the visual recognition portion;
Fine adjustment step of adjusting the relative position between the first substrate and the second substrate so that the pair of marks have a predetermined positional relationship following the rough adjustment step,
An anodic bonding method comprising: An anodic bonding jig used for anodic bonding of the first substrate and the second substrate,
A body having a first surface and a second surface;
A smooth surface that is provided on at least a part of the first surface and the second surface and can be in close contact with the surface of the first substrate and the second substrate that becomes the anode;
A visual recognition part made of a material provided on at least a part of the smooth surface and capable of transmitting visible light between the first surface and the second surface;
An anodic bonding jig comprising: The anodic bonding jig according to claim 3,
An anodic bonding jig in which the smooth surface is provided on each of the first surface and the second surface. The anodic bonding jig according to claim 3 or 4,
An anodic bonding jig in which the main body is integrally formed of hard glass. An anodic bonding jig according to any one of claims 3 to 5,
An anodic bonding jig in which the main body is integrally formed of quartz glass. The anodic bonding jig according to any one of claims 3 to 6,
An anodic bonding jig in which the main body has a cutout at a position including at least a part of the smooth surface. An anodic bonding apparatus for anodic bonding a first substrate and a second substrate,
The anodic bonding jig according to any one of claims 3 to 7,
A base having a plane on which the surface of the first substrate and the second substrate to be the cathode is disposed;
A power supply unit electrically connected to the first substrate and the second substrate to apply a DC voltage between the first substrate and the second substrate;
A pressurizing unit that pressurizes the base and the anodic bonding jig in a direction to bring them close to each other;
An anodic bonding apparatus comprising:

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