JPWO2010021286A1 - Connection terminals, connectors, sockets and semiconductor packages - Google Patents

Abstract

Provided are a connection terminal, a connector, a socket, and a semiconductor package, which can realize a narrow pitch while ensuring a stroke range, and have excellent durability. For this purpose, a flat base portion, a first contact portion that rises from the surface of the base portion and deforms in response to a load applied from the outside, and a first contact portion of the surface of the base portion rises. A second contact portion that rises from the surface opposite to the surface and extends and deforms according to a load applied from the outside.

Description

  The present invention relates to a connection terminal and a connector, socket, and semiconductor package provided with the connection terminal.

  2. Description of the Related Art Conventionally, those using leaf springs as connection terminals provided in various semiconductor connectors and semiconductor packages are known. When manufacturing a leaf spring to be used as a connection terminal, a flat spring material is subjected to plastic deformation such as press working, and is subjected to an appropriate displacement with respect to the plastically deformed spring material. The desired load characteristics and electrical characteristics are imparted (for example, see Patent Documents 1 to 4).

JP 2004-319209 A JP 2001-85131 A JP 2002-231401 A Japanese Patent No. 3847227

  However, the leaf springs described in Patent Documents 1 to 3 have a structure in which the maximum stress during the spring stroke is likely to be concentrated on a specific portion of the spring and thus cannot be repeatedly used. In addition, there is a problem that the stroke range that can be used without causing settling is narrow. As a result, it has been difficult to ensure a sufficient stroke due to the load while accommodating the recent narrowing of the connection terminals and connectors.

  Further, the leaf spring described in Patent Document 4 can realize a narrow pitch while securing a stroke due to a load by narrowing the width of the spring and increasing the length of the spring. Because of the structure having contact points, mechanical wear tends to occur, and there is a problem in durability.

  The present invention has been made in view of the above, and can provide a connection terminal, a connector, a socket, and a semiconductor package that can achieve a narrow pitch while ensuring a stroke due to a load, and have excellent durability. With the goal.

  In order to solve the above-described problems and achieve the object, the connection terminal according to the present invention is a connection terminal that is formed using a conductive material and electrically connects two different circuit structures, and has a flat plate shape. A base portion of the base portion, a first contact portion that rises from the surface of the base portion and deforms according to a load applied from the outside, and a surface opposite to the surface of the base portion on which the first contact portion rises And a second contact portion that extends from the surface of the substrate and deforms according to a load applied from the outside.

  In the connection terminal according to the present invention, in the above invention, the first contact portion extends to the first base end portion that extends while curving in a direction away from the base portion, and the first base end portion. A first distal end portion that extends while curving in a direction opposite to the first base end portion, and the second contact portion extends while curving in a direction away from the base portion. It has a 2nd base end part and the 2nd tip part which extends while curving to the 2nd base end part and curving to the side opposite to the 2nd base end part, It is characterized by the above-mentioned.

  In the connection terminal according to the present invention, in the above invention, the base portion has an opening penetrating in the thickness direction, and the first contact portion extends from a part of an edge of the opening portion. The second contact portion extends from a portion of the edge of the opening that is different from the portion where the first contact portion extends.

  Further, the connection terminal according to the present invention is the above-described invention, wherein the opening is not based on the shape of the first and second contact portions that change according to a load, and the first and second contact portions are the bases. It is characterized by having a shape that always includes a region projected onto the surface of the part.

  The connection terminal according to the present invention is characterized in that, in the above-mentioned invention, the first and second contact portions are formed by plastic working.

  In the connection terminal according to the present invention, in the above invention, the base part is integrated with the first contact part, the first base part is integrated with the second contact part, and the first base part A second base part to which a part of each other is fixed, and the first and second base parts are at least a boundary part between the surfaces facing each other and the first and second contact parts. It is characterized in that the surfaces not including each are fixed.

  In the above invention, the connection terminal according to the present invention has the same shape as the first partial connection terminal, the first partial connection terminal including the first contact portion and the first base portion, and the second contact. And a second partial connection terminal comprising the second base portion.

  In the connection terminal according to the present invention, the first partial connection terminal and the second partial connection terminal are in a mirror image target positional relationship.

  In the connection terminal according to the present invention, in the above invention, the first contact portion and the second contact portion are adjacent to each other, and the base portion is connected to the first contact portion and the second contact portion. It is characterized by having a slit between the part connected to.

  The connection terminal according to the present invention is characterized in that, in the above invention, the two-dimensional region obtained by projecting the connection terminal onto a plane passing through the surface of the base portion has an axisymmetric shape. .

  In the connection terminal according to the present invention as set forth in the invention described above, the first and second contact portions extend from portions separated from each other.

  In the connection terminal according to the present invention, the two-dimensional region obtained by projecting the connection terminal onto a plane passing through the surface of the base portion has a point-symmetric shape. .

  In addition, a connector according to the present invention includes a plurality of connection terminals according to the above-described invention, wherein the surfaces of the base portions included in the connection terminals are arranged on the same plane.

  According to another aspect of the present invention, there is provided a socket for mounting a semiconductor package, comprising the connector according to the present invention.

  A semiconductor package according to the present invention includes the connector described in the above invention.

  According to the present invention, the flat base portion, the first contact portion rising from the surface of the base portion and extending in accordance with a load applied from the outside, and the first contact portion among the surfaces of the base portion are The first contact portion and the second contact portion are independently deformed because the second contact portion extends from the surface opposite to the rising surface and extends in accordance with a load applied from the outside. The stroke can be secured. Moreover, since it is not necessary for the first contact portion and the second contact portion to have contacts, wear due to repeated use does not occur. Therefore, it is possible to reduce the pitch while securing the stroke range, and it is possible to provide a connection terminal, a connector, a socket, and a semiconductor package that are excellent in durability.

FIG. 1 is a perspective view showing a configuration of a connection terminal according to Embodiment 1 of the present invention. FIG. 2 is a side view in the direction of arrow A in FIG. FIG. 3 is a perspective view showing the configuration of the socket according to Embodiment 1 of the present invention. FIG. 4 is a diagram illustrating a configuration of a connector (part) according to the first embodiment of the present invention. FIG. 5 is a diagram showing an adhesion portion between a partial connection terminal and a connection terminal support film constituting the connection terminal according to Embodiment 1 of the present invention. FIG. 6 is a diagram showing a state before the semiconductor package is mounted on the socket according to the first embodiment of the present invention. FIG. 7 is a diagram showing a state after the semiconductor package is mounted on the socket according to the first embodiment of the present invention. FIG. 8 is a diagram illustrating load characteristics when a part of the base portion of the partial connection terminal constituting the connection terminal according to Embodiment 1 of the present invention is not fixed. FIG. 9 is a diagram showing load characteristics when the base portion of the partial connection terminal constituting the connection terminal according to Embodiment 1 of the present invention is completely fixed. FIG. 10 is a diagram showing a configuration of a semiconductor package to which the connection terminal according to Embodiment 1 of the present invention is applied. FIG. 11 is a perspective view showing a configuration of a connection terminal according to Embodiment 2 of the present invention. 12 is a side view in the direction of arrow B in FIG. FIG. 13 is a plan view showing the configuration of the connection terminal according to Embodiment 2 of the present invention. FIG. 14 is a diagram showing a configuration of a connector (part) according to the second embodiment of the present invention. FIG. 15 is a diagram showing an adhesion portion between the connection terminal and the connection terminal support film according to Embodiment 2 of the present invention. FIG. 16 is a plan view showing the configuration of the connection terminal according to Embodiment 3 of the present invention. 17 is a side view in the direction of arrow C in FIG. FIG. 18 is a plan view showing the configuration of the connection terminal according to Embodiment 3 of the present invention. FIG. 19 is a diagram showing a configuration of a connector (part) according to the third embodiment of the present invention. FIG. 20 is a diagram showing an adhesion portion between the connection terminal and the connection terminal support film according to Embodiment 3 of the present invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as “embodiments”) will be described with reference to the accompanying drawings. Note that the drawings referred to in the following description are schematic, and when the same object is shown in different drawings, dimensions, scales, and the like may be different.

(Embodiment 1)
FIG. 1 is a diagram showing a configuration of a connection terminal according to Embodiment 1 of the present invention. FIG. 2 is a side view in the direction of arrow A in FIG. The connection terminal 1 shown in FIGS. 1 and 2 includes two partial connection terminals 2 that have the same shape as each other and are partially fixed to each other. The connection terminal 1 has a mirror image shape with respect to one plane.

  The partial connection terminal 2 includes a flat base portion 21 provided with an opening 20 penetrating in the plate thickness direction, and a contact portion that rises from the surface of the base portion 21 and extends in accordance with a load applied from the outside. 22. The contact portion 22 extends from the part of the edge of the opening 20 in a direction away from the base portion 21 while extending in a strip shape, and is connected to the base end portion 22a and is opposite to the base end portion 22a. And a distal end portion 22b extending in a tapered band shape while being curved to the side.

  In the two partial connection terminals 2, surfaces that do not include a boundary portion with the base end portion 22 a of the contact portion 22 among surfaces facing each other of the base portion are bonded and fixed by the solder 3. Therefore, one of the two partial connection terminals 2 is a first partial connection terminal, and the other is a second partial connection terminal. The base portion 21 and the contact portion 22 of the partial connection terminal 2 that is the first partial connection terminal are the first base portion and the first contact portion, respectively, and the base portion 21 of the partial connection terminal that is the second partial connection terminal and The contact portions 22 are a second base portion and a second contact portion, respectively.

  The partial connection terminal 2 is formed using a conductive material such as a copper alloy such as copper or phosphor bronze, nickel, a nickel alloy, spring steel, or stainless steel. Note that the surface of these conductive materials may be plated with nickel, gold, or the like. The partial connection terminal 2 is formed by, for example, etching a single flat plate to shape a portion of the contact portion 22 and then subjecting the shaped portion of the contact portion 22 to plastic processing such as press molding. Is done.

  FIG. 3 is a diagram showing a configuration of a socket as an application example of the connection terminal 1 having the above configuration. A socket 100 shown in the figure electrically connects between a semiconductor package 200 such as LGA or BGA and a printed circuit board 300. The socket 100 is a sheet-like connector 101 in which a plurality of connection terminals are arranged in an array, a housing member 102 that is provided around the connector 101 and that is attached with the electrode surface of the semiconductor package 200 as a bottom surface, and is attached to the housing member 102. And a frame member 103 that fixes the semiconductor package 200 by applying a predetermined load. At four corners of the frame member 103, holes for inserting the screw members 104 are provided. The screw member 104 inserted through the hole of the frame member 103 is screwed into the mounting hole 105 of the corresponding housing member 102.

  FIG. 4 is a diagram illustrating the configuration of the connector 101 (a part). The connector 101 shown in FIG. 1 has a plurality of connection terminals 1 arranged in an array so that the surface of each base portion 21 passes on the same plane, and a part of the surface of each base portion 21 is made of polyimide or the like. It is covered with a connection terminal support film 111 made of an insulating material. For this reason, two connection terminal support films 111 are provided on the upper surface side and the lower surface side.

  When the connector 101 is formed, a plurality of flat plates each serving as the partial connection terminals 2 are arranged in an array on the film to be the connection terminal support film 111 and attached with an adhesive, and then each flat plate is etched. The mold is formed into a predetermined shape by the above method, and the portion to be the contact portion 22 is bent and raised by press working or the like.

  FIG. 5 is a diagram showing a configuration in the vicinity of an adhesive portion between the partial connection terminal 2 and the connection terminal support film 111, and corresponds to a plan view of one partial connection terminal 2 as viewed from the upper surface of FIG. An adhesive portion G shown in FIG. 5 is a portion where the connection terminal support film 111 covers the base portion 21. As shown in FIG. 5, the area of the opening 111 a of the connection terminal support film 111 is larger than the area of the opening 20. Further, as shown in FIG. 5, the opening 111 a is formed so as not to cover a portion that acts as a spring in the partial connection terminal 2 (near the boundary portion between the contact portion 22 and the base end portion 22 a). For this reason, the part which continues to the base end part 22a among the base parts 21 can be deform | transformed with a load, and functions as a spring. Therefore, the load can be distributed between the base portion 21 and the contact portion 22. As a result, the stress of the contact portion 22 is relaxed, and durability against a load applied from the outside is improved. The opening 20 has a shape that always includes a region in which the contact portion 22 is projected onto the surface of the base portion 21, regardless of the shape of the contact portion 22 that changes according to the load. For this reason, even if the contact portion 22 changes in shape due to an external load, the contact portion 22 does not hit the base portion 21.

  By connecting a part of the bottom surfaces (rear surfaces) of the base portions 21 corresponding to each other to the two connection terminal support films 111 each provided with the plurality of partial connection terminals 2 as described above, the connector 101 is joined. Is formed. The formed connector 101 is installed inside the housing member 102 in a state in which the surface of the printed circuit board 300 and the surface of the connection terminal support film 111 are substantially parallel.

  FIG. 6 is a diagram illustrating a state before the semiconductor package 200 is attached to the socket 100. In addition, since the adhesive which affixes the connection terminal support film 111 and the partial connection terminal 2 is thin, description of the adhesive is abbreviate | omitted in FIG. In FIG. 6, when the semiconductor package 200 descends and comes into contact with the contact portion 22 of the partial connection terminal 2 located above, a load is applied to the two partial connection terminals 2. When a load starts to be applied to the partial connection terminal 2, the tip end portion of the contact portion 22 gradually approaches the base portion 21 while being deformed, and the contact portion 22 is in a state of lying on the base portion 21. A portion of the base portion 21 that is not fixed to the other base portion 21 by the solder 3 is curved in a direction away from the other base portion 21. As a result, the contact portion 22 of one partial contact terminal 2 contacts the electrode 201 of the semiconductor package 200, and the contact portion 22 of the other partial contact terminal 2 contacts the electrode 301 of the printed circuit board 300. At this time, a part of the connection terminal support film 111 is slightly deformed following the movement of the partial connection terminal 2 in the vicinity of the base end portion 22 a of the contact portion 22.

  FIG. 7 is a diagram illustrating a state in which the semiconductor package 200 is attached to the socket 100. In this state, the load applied to the connection terminal 1 is maximized, and a stable contact load and contact resistance can be ensured. The electrodes of the semiconductor package 200 are not limited to a planar shape like the electrode 201, but may be spherical like a BGA.

  FIG. 8 is a diagram showing the relationship between the stroke of the partial connection terminal 2 and the load when the semiconductor package 200 is removed after the semiconductor package 200 is once attached to the socket 100. As shown in FIG. 8, the relationship between the stroke of the partial connection terminal 2 and the load is a quadratic curve. This means that the non-linear effect is large in the partial connection terminal 2 in which only a part of the base portion 21 is fixed. Such a load characteristic is due to the fact that the spring constant of the contact portion 22 also changes as the load changes.

  In the curve L1 shown in FIG. 8, even after the semiconductor package 200 is mounted and removed once in the socket 100, the stroke returns to the zero position, and no settling occurs. Therefore, since the load characteristic of the partial connection terminal 2 does not change after use, the semiconductor package 200 can be mounted again and used.

  FIG. 9 is a diagram showing a stroke load relationship when the entire surface of the base portion 21 of the partial connection terminal 2 is fixed by the solder 3 as a comparative example of FIG. When the base portion 21 is completely fixed, the base portion 21 is not deformed even if a load is applied to the partial connection terminals 2. For this reason, the load applied to the partial connection terminal 2 is applied to the contact portion 22. As a result, even if the stroke is increased by the same amount as that of the curve L1, even if the load is reduced, the stroke does not decrease immediately, and the stroke starts to decrease after the load is reduced to some extent (curve L2). Therefore, when the base portion 21 is completely fixed, even if the load is returned to zero after the load is applied, the stroke does not return to zero, and the settling occurs. When the partial connection terminal 2 is settling in this way, the load characteristics of the partial connection terminal 2 change, so that when the partial connection terminal 2 is used again, a desired electrical connection cannot be realized.

  As is clear from the above description, the entire base portion 21 of the partial connection terminal 2 is not fixed, but a part thereof is appropriately selected and fixed, so that the load characteristics are hardly changed even when used repeatedly. And durability can be improved.

  The connection terminal 1 can also be applied as various semiconductor devices other than the socket 100. FIG. 10 is a perspective view illustrating a configuration of a semiconductor package to which the connection terminal 1 is applied. In the semiconductor package 400 shown in FIG. 1, a plurality of connection terminals 1 are arranged in an array so that the surfaces of the base portions 21 pass on the same plane, and a part of the surface of each base portion 21 is connected to the connection terminals. It includes a connector 401 covered with a support film 411, a base material 402 on which the connector 401 is placed, and a screw member 403 that fixes a peripheral portion of the connector 401 to the base material 402. Also in the semiconductor package 400 having such a configuration, the same effect as that of the socket 100 can be obtained.

  According to the first embodiment of the present invention described above, the connection terminal 1 having a mirror image shape is formed by joining the two partial connection terminals 2 having the same shape with the solder 3. The contact portion 22 is deformed independently. Therefore, a sufficient stroke can be ensured even when the connection terminal is downsized to cope with a narrow pitch.

  Further, according to the first embodiment, the base portion 21 and the contact portion 22 have a composite spring action, and the load applied from the outside can be dispersed by the base portion 21 and the contact portion 22. Therefore, durability against a load applied from the outside is improved, it is possible to repeatedly use it, and a stroke range in which no settling occurs can be expanded. As a result, even if a device or substrate to be touched is warped or waved, and there is a variation in mounting height, it can be absorbed, and mounting can be performed easily and at low cost.

  Further, according to the first embodiment, since the degree of freedom in spring design is high, a connection with a sufficient stress can be realized, and durability can be improved.

  Further, according to the first embodiment, unlike the invention described in Patent Document 4 described above, the only part related to contact is the contact part where the two contact parts 22 come into contact with the contact object, and therefore mechanical wear. Is less likely to occur and the spring characteristics are less likely to deteriorate. In addition, since there are few contact locations, the contact resistance can be reduced.

(Embodiment 2)
FIG. 11 is a diagram showing the configuration of the connection terminal according to Embodiment 2 of the present invention. 12 is a side view in the direction of arrow B in FIG. FIG. 13 is a view of the connection terminal according to the second embodiment as viewed from above. The connection terminal 4 shown in FIG. 11 to FIG. 13 is a flat base portion 41 provided with an opening 40 penetrating in the plate thickness direction, and rises from the surface of the base portion 41 and extends to the load applied from the outside. A first contact portion 42 that deforms in response to the second contact, a second contact that rises from the surface of the base portion 41 opposite to the surface on which the first contact portion 42 rises and extends in response to a load applied from the outside. Part 43. The connection terminal 4 is formed using the same material as the partial connection terminal 2 described in the first embodiment.

  The first contact portion 42 includes a first base end portion 42a that extends in a band shape while curving in a direction away from a part of the edge of the opening 40 with respect to the base portion 41 (upward in FIG. 12), and a first base It has a first distal end portion 42b extending in a tapered band while being curved to the opposite side to the first base end portion 42a.

  The second contact portion 43 is away from the portion of the edge of the opening 40 that is different from the portion where the first contact portion 42 extends, away from the first base end portion 42a with respect to the base portion 41 (FIG. 12). A second base end portion 43a extending in a strip shape while being curved downward), and a second base end portion 43a extending in a taper strip shape while curving toward the opposite side of the second base end portion 43a. 2 tip portions 43b.

  The first contact part 42 and the second contact part 43 are adjacent to each other. A narrow belt-like shape is formed between a portion of the base portion 41 that is continuous with the first contact portion 42 (the first base end portion 42a) and a portion that is continuous with the second contact portion 43 (the second base end portion 43a). A slit 41s penetrating the base portion 41 is provided. Instead of providing the slit 41 s, a slit that does not penetrate the base portion 41 from between a portion continuous with the first contact portion 42 and a portion continuous with the second contact portion 43 may be provided. As shown in FIG. 13, the two-dimensional region obtained by projecting the connection terminal 4 onto the plane passing through the surface of the base portion 41 has the center of the slit 41 s along the penetration direction of the slit 41 s on the plane. The line is symmetrical with respect to the straight line passing through.

  The opening 40 is a region obtained by projecting the first contact portion 42 and the second contact portion 43 onto the surface of the base portion 41 regardless of the shapes of the first contact portion 42 and the second contact portion 43 that change according to the load. The shape is always included. For this reason, even if the first contact portion 42 and the second contact portion 43 change in shape due to an external load, they do not hit the base portion 41.

  FIG. 14 is a diagram illustrating a configuration of a connector (part) according to the second embodiment. The connector 501 shown in FIG. 1 has a plurality of connection terminals 4 arranged in an array so that the surfaces of the base portions 41 pass on the same plane, and a part of one surface of each base portion 41 is polyimide. It is covered with a connection terminal support film 511 made of an insulating material such as.

  When the connector 501 is formed, a plurality of flat plates each serving as the connection terminals 4 are arranged in an array on the film serving as the connection terminal support film 511 and attached with an adhesive, and then each flat plate is subjected to chemical etching or the like. The mold is formed into a predetermined shape by a technique, and the portions that become the first contact portion 42 and the second contact portion 43 are bent and raised by pressing or the like.

  FIG. 15 is a view showing an adhesive portion between the connection terminal 4 and the connection terminal support film 511, and corresponds to a plan view of one connection terminal 4 as viewed from the upper surface of FIG. The area of the opening 511 a of the connection terminal support film 511 is larger than the area of the opening 40. Further, the opening 511a is formed so as not to cover a portion (a boundary portion between the first base end portion 42a and the second base end portion 43a) that acts as a spring in the connection terminal 4, and the covering portion is an adhesive portion. G.

  The connector 501 having the above configuration is applied as a socket or a terminal of a semiconductor package as in the first embodiment. Among these, the configuration of the socket excluding the connector 501 is the same as that of the socket 100 shown in FIG. Note that a connector corresponding to the connector 401 of the semiconductor package 400 shown in FIG. 10 can be formed by using the connection terminals 4.

  According to the second embodiment of the present invention described above, each of them is a part of the edge of the opening 40 of the base portion 41 and extends from the adjacent portions to the base portion 41 in different directions. Since the first contact portion 42 and the second contact portion 43 that can be deformed by an external load are provided, the first contact portion 42 and the second contact portion 43 are independently deformed to ensure a stroke. be able to. Further, since the first contact portion 42 and the second contact portion 43 do not need to have a contact point, wear due to repeated use does not occur. Therefore, it is possible to reduce the pitch while securing the stroke range, and it is possible to provide a connection terminal, a connector, a socket, and a semiconductor package that are excellent in durability.

(Embodiment 3)
FIG. 16 is a diagram illustrating a configuration of a connection terminal according to Embodiment 3 of the present invention. 17 is a side view in the direction of arrow C in FIG. FIG. 18 is a view of the connection terminal according to the third embodiment as viewed from above. The connection terminal 5 shown in FIGS. 16 to 18 has a flat plate-like base portion 51 provided with an opening 50 penetrating in the plate thickness direction, and rises from the surface of the base portion 51 and extends to the load applied from the outside. A first contact portion 52 that deforms in response to the first contact portion 52, and a second contact that rises from the surface opposite to the surface on which the first contact portion 52 rises out of the surface of the base portion 51 and deforms according to a load applied from the outside. Unit 53. The connection terminal 5 is formed using the same material as the partial connection terminal 2 described in the first embodiment.

  The first contact portion 52 includes a first base end portion 52a extending in a band shape while curving in a direction away from a part of the edge of the opening 50 with respect to the base portion 51 (upward in FIG. 17), and a first base It has a first distal end portion 52b that extends in a tapered band shape while being curved to the opposite side to the first proximal end portion 52a.

  The second contact portion 53 extends away from the portion of the edge of the opening 50 that is different from the portion where the first contact portion 52 extends, away from the first base end portion 52a with respect to the base portion 51 (FIG. 17). A second base end portion 53a extending in a belt shape while curving downward), and a second base end portion 53a extending in a taper strip shape while curving toward the opposite side of the second base end portion 53a. 2 tip portions 53b.

  The first contact portion 52 and the second contact portion 53 extend from the portions of the inner edge of the opening 50 that are separated from each other. As shown in FIG. 18, the two-dimensional region obtained by projecting the connection terminal 5 onto a plane passing through the surface of the base portion 51 has a point-symmetric shape with respect to the center of the connection terminal 5 on the plane. Eggplant.

  The opening 50 is a region obtained by projecting the first contact portion 52 and the second contact portion 53 onto the surface of the base portion 51 regardless of the shapes of the first contact portion 52 and the second contact portion 53 that change according to the load. The shape is always included. For this reason, even if the first contact portion 52 and the second contact portion 53 change in shape due to an external load, they do not hit the base portion 51.

  FIG. 19 is a diagram showing a configuration of a connector (part) according to the third embodiment. The connector 601 shown in FIG. 1 has a plurality of connection terminals 5 arranged in an array so that the surfaces of the base portions 51 pass on the same plane, and a part of one surface of each base portion 51 is polyimide. It is covered with a connection terminal support film 611 made of an insulating material such as. The connector 601 can be formed in the same manner as the connector 501 according to the second embodiment.

  FIG. 20 is a view showing an adhesive portion between the connection terminal 5 and the connection terminal support film 611, and corresponds to a plan view of one connection terminal 5 as viewed from the upper surface of FIG. The opening 611 a of the connection terminal support film 611 is larger than the area of the opening 50. Further, the opening 611a is formed so as not to cover a portion (a boundary portion between the first base end portion 52a and the second base end portion 53a) that acts as a spring in the connection terminal 5, and the covering portion is an adhesive portion. G.

  The connector 601 having the above configuration can be applied to a socket or a semiconductor package as in the first and second embodiments.

  According to the third embodiment of the present invention described above, each of them is a part of the edge of the opening 50 of the base portion 51 and extends from a portion that is separated from each other to the base portion 51 in different directions. In addition, since the first contact portion 52 and the second contact portion 53 that can be deformed by an external load are provided, the first contact portion 52 and the second contact portion 53 are independently deformed to ensure a stroke. be able to. In addition, since the first contact portion 52 and the second contact portion 53 do not need to have a contact point, wear due to repeated use does not occur. Therefore, it is possible to reduce the pitch while securing the stroke range, and it is possible to provide a connection terminal, a connector, a socket, and a semiconductor package that are excellent in durability.

  So far, the first to third embodiments have been described in detail as the best mode for carrying out the present invention, but the present invention should not be limited by these embodiments. For example, as for the connection terminal which concerns on this invention, the base part does not need to have an opening part. Moreover, the number of the contact parts with which the connection terminal which concerns on this invention is provided may be two or more. Thus, the present invention can include various embodiments and the like not described herein, and various design changes and the like can be made without departing from the technical idea specified by the claims. It is possible to apply.

  As described above, the present invention is suitable as a connection terminal provided in various semiconductor connectors and semiconductor packages.

1, 4, 5 Connection terminal 2 Partial connection terminal 3 Solder 20, 40, 50, 111a, 511a, 611a Opening portion 21, 41, 51 Base portion 22 Contact portion 22a Base end portion 22b Tip end portion 41s Slit 42, 52 First Contact portion 42a, 52a First base end portion 42b, 52b First tip end portion 43, 53 Second contact portion 43a, 53a Second base end portion 43b, 53b Second tip end portion 100 Socket 101, 401, 501, 601 Connector 102 Housing member 103 Frame member 104 Screw member 105 Mounting hole 111, 411, 511, 611 Connection terminal support film 200, 400 Semiconductor package 201, 301 Electrode 300 Printed circuit board 402 Base material 403 Screw member G Adhesive portion

Claims (15)

A connection terminal formed using a conductive material and electrically connecting two different circuit structures,
A flat base portion;
A first contact portion that rises from the surface of the base portion and extends in accordance with a load applied from the outside;
A second contact portion that rises and extends from a surface opposite to the surface on which the first contact portion rises among the surfaces of the base portion, and is deformed in accordance with a load applied from the outside;
A connection terminal characterized by comprising: The first contact portion is
A first base end portion extending while curving in a direction away from the base portion;
A first distal end that extends to the first base end while curving to the opposite side of the first base end;
Have
The second contact portion is
A second base end portion extending while curving in a direction away from the base portion;
A second distal end extending to the second proximal end and extending while curving to the opposite side of the second proximal end;
The connection terminal according to claim 1, further comprising: The base portion has an opening that penetrates in the plate thickness direction,
The first contact portion extends from a part of the edge of the opening,
The connection terminal according to claim 1, wherein the second contact portion extends from a portion of the edge of the opening that is different from a portion where the first contact portion extends. The opening is
Regardless of the shape of the first and second contact portions that change according to the load, the shape always includes a region in which the first and second contact portions are projected onto the surface of the base portion. The connection terminal according to claim 3.   The connection terminal according to claim 1, wherein the first and second contact portions are formed by plastic working. The base portion is
A first base part integral with the first contact part;
A second base part that is integral with the second contact part and to which the first base part and a part of each other are fixed;
Have
The first and second base portions are
The connection according to any one of claims 1 to 5, wherein surfaces that do not include at least a boundary portion between the first and second contact portions are fixed to each other between the surfaces facing each other. Terminal. A first partial connection terminal comprising the first contact portion and the first base portion;
A second partial connection terminal having the same shape as the first partial connection terminal, and comprising the second contact portion and the second base portion;
The connection terminal according to claim 6, further comprising:   The connection terminal according to claim 7, wherein the first partial connection terminal and the second partial connection terminal are in a mirror image target positional relationship. The first contact portion and the second contact portion are adjacent to each other;
The connection terminal according to claim 1, wherein the base portion has a slit between a portion continuous with the first contact portion and a portion continuous with the second contact portion.   The connection terminal according to claim 9, wherein the two-dimensional region obtained by projecting the connection terminal onto a plane passing through the surface of the base portion has a line-symmetric shape.   6. The connection terminal according to claim 1, wherein the first contact portion and the second contact portion respectively extend from portions separated from each other.   The connection terminal according to claim 11, wherein a two-dimensional region obtained by projecting the connection terminal onto a plane passing through the surface of the base portion has a point-symmetric shape.   A connector comprising a plurality of connection terminals according to any one of claims 1 to 12, wherein a surface of the base portion provided in each connection terminal is arranged on the same plane. A socket for mounting a semiconductor package,
A socket comprising the connector according to claim 13.   A semiconductor package comprising the connector according to claim 13.

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