JP5078655B2 - Connection terminals, connectors and semiconductor packages - Google Patents

Description

  The present invention relates to a connection terminal, a connector provided with the connection terminal, and a semiconductor package.

  2. Description of the Related Art Conventionally, those using leaf springs as connection terminals provided in various semiconductor connectors and semiconductor packages are known. When manufacturing a leaf spring to be used as a connection terminal, a flat spring material is subjected to plastic deformation such as press working, and is subjected to an appropriate displacement with respect to the plastically deformed spring material. The desired load characteristics and electrical characteristics are imparted (see, for example, Patent Documents 1 to 3).

JP 2004-319209 A JP 2001-85131 A JP 2002-231401 A

  However, the above-described conventional leaf spring has a structure in which the maximum stress during the spring stroke is likely to be concentrated on a specific portion of the spring and thus cannot be repeatedly used. Further, since the leaf spring has the above-described structure, there is a problem that the stroke range that can be used without causing settling is narrow.

  The present invention has been made in view of the above, and provides a connection terminal that can be used repeatedly and has a wide usable stroke range, and a connector and a semiconductor package including the connection terminal. With the goal.

  In order to solve the above-described problems and achieve the object, a connection terminal according to the present invention is a connection terminal that is formed using a conductive material and electrically connects two different circuit structures. A base portion partially fixed to one of the circuit structures, and a portion extending from the portion of the base portion not fixed to the one circuit structure to the base portion, and the other And a contact portion that contacts the circuit structure.

  Further, in the connection terminal according to the present invention, in the above invention, the base portion has a flat plate shape, and the base end portion of the contact portion has a side on which the contact portion extends with respect to the surface of the base portion. When it is above the base portion, it has a curved surface convex downward with respect to the surface of the base portion.

  Further, in the connection terminal according to the present invention, in the above invention, the contact portion is formed on the surface of the base portion when the side where the contact portion extends with respect to the surface of the base portion is above the base portion. On the other hand, it has an upwardly convex curved surface and has a distal end portion connected to the base end portion.

  Further, in the connection terminal according to the present invention, in the above invention, the contact portion is formed on the surface of the base portion when the side where the contact portion extends with respect to the surface of the base portion is above the base portion. A tip portion having a curved surface convex downward, and a portion located between the tip portion and the base end portion and farthest from the base portion in the contact portion, the contact portion being the And an intermediate portion having a curved surface convex upward with respect to the surface of the base portion when the side extending with respect to the surface of the base portion is above the base portion.

  In the connection terminal according to the present invention as set forth in the invention described above, the base portion has an opening that has a shape that always includes a portion obtained by projecting the outer edge of the contact portion onto the surface of the base portion.

  Moreover, the connection terminal according to the present invention is characterized in that, in the above invention, the contact portion is formed by plastic working.

  The connector according to the present invention is characterized in that a plurality of connection terminals according to any one of the above inventions are provided on a plane.

  In addition, a semiconductor package according to the present invention is characterized in that a plurality of connection terminals according to any of the above inventions are provided on a plane.

  According to the present invention, a base part in which a part of the surface is fixed to one of the two circuit structures, and a part of the surface of the base part that is not fixed to the one circuit structure from the base part to the base part. And a contact portion that is in contact with the other circuit structure, so that a plurality of spring elements are substantially provided, and the two circuit structures are electrically connected. Can be distributed to the base portion and the contact portion. Therefore, the durability against a load applied from the outside is improved, it can be used repeatedly, and the range of strokes that can be used without causing settling can be expanded.

  The best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described below with reference to the accompanying drawings. The drawings referred to in the following description are schematic, and when the same object is illustrated in different drawings, the dimensions, scales, and the like may be different from each other.

  FIG. 1 is a perspective view showing a configuration of a connection terminal according to an embodiment of the present invention. 2 is a plan view seen from above in FIG. 1, and FIG. 3 is a side view in the direction of arrow A in FIG. The connection terminal 1 shown in these drawings has a flat base portion 11 having an opening 10 in the center, and tapers in a direction rising from the inner peripheral surface of the opening 10 of the base portion 11 with respect to the base portion 11. And a tapered contact portion 12 that contacts the circuit structure to be contacted. When the side where the contact portion 12 extends with respect to the base portion 11 is located above the base portion 11, the contact portion 12 includes a base end portion 12 a that has a curved surface convex downward with respect to the surface of the base portion 11, and a base It has a curved surface that is convex upward with respect to the surface of the portion 11, and has a tip portion 12b that comes into contact with the contact object.

  The connection terminal 1 is formed using a conductive material such as phosphor bronze, spring steel, copper, stainless steel, nickel, nickel alloy. The connection terminal 1 is formed, for example, by etching a flat plate and shaping the contact portion 12 and then subjecting the shaped contact portion 12 to plastic working such as press molding. The

  FIG. 4 is a diagram showing a configuration of a socket connector which is an application example of the connection terminal 1 having the above configuration. A socket connector 100 shown in the figure electrically connects a semiconductor package 200 such as LGA or BGA and a printed circuit board 300. As shown in FIG. 5, the socket connector 100 includes a plurality of connection terminals 1 arranged in an array on the surface of the printed circuit board 300, and is provided around the plurality of connection terminals 1. The housing member 101 is mounted on the bottom surface, and the frame member 102 is fixed to the semiconductor package 200 mounted on the housing member 101 by applying a predetermined load. Holes for inserting the screw members 103 are provided at four corners of the frame member 102. The screw member 103 inserted through the hole of the frame member 102 is screwed into the mounting hole 104 of the corresponding housing member 101. When the frame member 102 is attached to the housing member 101 in this way, a predetermined load is applied to the connection terminal 1, and the semiconductor package 200 and the printed circuit board 300 are electrically connected via the connection terminal 1.

  FIG. 6 is a diagram illustrating a manner of attaching the connection terminal 1 to the printed circuit board 300 in the socket connector 100. A part of the base portion 11 of the connection terminal 1 is fixed to an electrode portion of the printed circuit board 300 which is one of two different circuit structures by soldering or welding. In FIG. 6, the fixed portion G fixed to the printed circuit board 300 in the base portion 11 is illustrated by a broken line region. In FIG. 6, the length d from the end portion of the base portion 11 that is not fixed to the printed circuit board 300 to the fixed portion G is shown. The length d is a parameter indicating a region of the base portion 11 that can be separated from the printed circuit board 300.

  As a method of arranging a plurality of connection terminals 1 on the printed circuit board 300, for example, a single sheet arranged in an array by connecting adjacent connection terminals 1 is formed, and this sheet is attached to the printed circuit board 300. Thereafter, a method of applying an insulation treatment to the connecting portion of the adjacent connection terminals 1 can be applied.

  FIG. 7 is a diagram illustrating a change in the shape of the connection terminal 1 when the semiconductor package 200 is mounted with the socket connector 100. FIG. 8 is a diagram showing the relationship between the stroke of the connection terminal 1 and the load when the semiconductor package 200 is removed after the semiconductor package 200 is once attached to the socket connector. Hereinafter, the load characteristics of the connection terminal 1 will be described with reference to these drawings. In FIG. 7, it is assumed that the electrodes of the semiconductor package 200 are planar, but the electrodes may be spherical, such as BGA.

  When the semiconductor package 200 descends and contacts the contact portion 12 of the connection terminal 1, a load is applied to the connection terminal 1. When a load starts to be applied to the connection terminal 1, the contact portion 12 gradually lies down with respect to the base portion 11, while portions other than the fixed portion G of the base portion 11 are separated from the surface of the printed circuit board 300. Going up. Then, the load becomes maximum when the semiconductor package 200 is mounted (as shown on the right side of the arrow in FIG. 7), and the tip of the tip 12b passes through the opening 10 and contacts the surface of the printed circuit board 300. .

  The shape of the curved surface of the base end portion 12a of the contact portion 12 does not change until the maximum load is reached after the load is applied to the connection terminal 1 (illustrated by the curvature radius R in FIG. 7). For this reason, the bottom surface of the base end portion 12a continues to keep contact with the printed circuit board 300 even when the load changes. The position of the contact C between the base end portion 12a and the printed circuit board 300 gradually moves closer to the tip end portion 12b as the load increases as the semiconductor package 200 moves down. Thereby, since the spring constant of the contact part 12 changes gradually, the relationship between a stroke and a load becomes a quadratic curve as shown in FIG. In this sense, the connection terminal 1 to which only a part of the base portion 11 is fixed has a large non-linear effect.

  From the start of applying a load to the connection terminal 1 until the maximum load is reached, the shape of the tip 12b gradually changes, and the position of the contact between the semiconductor package 200 and the contact 12 also changes little by little.

  In the curve L1 shown in FIG. 8, in the socket connector 100, even after the semiconductor package 200 is mounted and once removed, the stroke returns to the zero position, and no settling occurs. Therefore, since the load characteristic of the connection terminal 1 does not change after use, the semiconductor package 200 can be mounted again and used.

  FIG. 9 shows the relationship between the length d from the end portion of the base portion 11 not fixed to the printed circuit board 300 to the fixed portion G and the maximum stress Pmax when a load is applied to the connection terminal 1. FIG. The value of the maximum stress Pmax in the curve L2 of FIG. 9 is maximum when the base portion 11 is all fixed (d = 0), and decreases as the length d increases. The degree of decrease of the maximum stress Pmax with respect to the length d decreases as the length d increases, and is substantially constant in the range D shown in FIG. Therefore, if the value of the length d is set to a value included in the range D, the load applied to the connection terminal 1 can be appropriately distributed to the base portion 11 and the contact portion 12.

  FIG. 10 is a diagram showing a change in the shape of the connection terminal 1 when the semiconductor package 200 is mounted when the entire surface of the base portion 11 of the connection terminal 1 is fixed to the surface of the printed circuit board 300. It is a corresponding figure. As shown in FIG. 10, when the base portion 11 is completely fixed to the printed circuit board 300, the base portion 11 is not deformed even when a load is applied to the connection terminal 1. For this reason, a load applied to the connection terminal 1 is applied to the contact portion 12.

  FIG. 11 is a diagram illustrating a relationship between a stroke and a load until a load is removed from the connection terminal 1 after a load is applied to the connection terminal 1 as illustrated in FIG. 10, and corresponds to FIG. 8. In the curve L3 shown in FIG. 11, even if the stroke is increased by the same amount as the curve L1, the stroke does not decrease immediately even if the load is reduced, and the stroke starts to decrease after the load is reduced to some extent. For this reason, even if the load becomes zero, the stroke does not return to zero, and the settling occurs. When the connection terminal 1 is loosened, the load characteristic of the connection terminal 1 changes, so that when the connection terminal 1 is used again, a desired electrical connection cannot be realized.

  Thus, even if the same connection terminal 1 is used, the possibility of repeatedly using the connection terminal 1 varies depending on whether or not the base portion 11 is completely fixed to the printed circuit board 300. In other words, by appropriately selecting and fixing a part of the base portion 11 of the connection terminal 1 without fixing it, it is possible to keep the load characteristics of the connection terminal 1 almost unchanged even after repeated use. .

  The connection terminal 1 can also be applied to various semiconductor connectors other than the socket connector 100. Further, the connection terminal 1 can be applied as an electrode of a semiconductor package. FIG. 12 is a perspective view showing a configuration of a semiconductor package to which the connection terminal 1 is applied. In the semiconductor package 400 shown in the figure, a plurality of connection terminals 1 arranged on a plane are attached to electrode positions of a base material 401 by soldering or welding. Also in the semiconductor package 400 having such a configuration, the same effect as that of the socket connector 100 can be obtained.

  According to the embodiment of the present invention described above, a base part in which a part of the surface is fixed to one of the two circuit structures, and a circuit structure fixed to one of the surfaces of the base part. Since it is provided with a contact portion that extends in a direction that rises from the non-existing portion with respect to the base portion and contacts the other circuit structure, a plurality of spring elements are substantially provided, and two circuit structures are provided. It is possible to disperse the load applied when electrically connecting between the base portion and the contact portion. Therefore, the durability against a load applied from the outside is improved, it can be used repeatedly, and the range of strokes that can be used without causing settling can be expanded.

  FIG. 13 is a diagram illustrating a configuration of a connection terminal according to a first modification of the present embodiment. Similar to the connection terminal 1 described above, the connection terminal 2 shown in the figure includes a base portion 21 and a contact portion 22. The contact portion 22 has a base end portion 22a extending from the base portion 21, a tip end portion 22b, and an intermediate portion 22c positioned between the base end portion 22a and the tip end portion 22b. The base end portion 22 a and the tip end portion 22 b have a curved surface that protrudes downward with respect to the base portion 21. On the other hand, the intermediate portion 22 c has a curved surface that is convex upward with respect to the base portion 21, includes a portion of the contact portion 22 that is farthest from the base portion 21, and is in direct contact with the contact target substrate. As a result, it is possible to reduce the impact when the tip 22b comes into contact with the surface of the printed circuit board 300 of the socket connector 100 or the surface of the base material 401 of the semiconductor package 400 in a state where a load is applied. It is possible to prevent excessive damage. Further, the contact portion 22 can be prevented from being damaged when contacting the surface of the printed circuit board 300 or the base material 401.

  FIG. 14 is a perspective view showing a configuration of a connection terminal according to a second modification of the present embodiment. The connection terminal 3 shown in the figure includes a base portion 31 having an opening 30 having a cross-sectional shape in which the center portions of a pair of opposite sides of a substantially square shape are constricted, and a constriction having a substantially square cross section on the inner peripheral surface of the opening 30. The contact portion 32 extends in a different direction from the surface of the base portion 31 from the inner peripheral surface of the non-side. As described above, the shape of the opening only needs to always include a portion obtained by projecting the outer edge of the contact portion onto the surface of the base portion regardless of the shape change of the contact portion. It is possible to change appropriately according to.

  FIG. 15 is a perspective view illustrating a configuration of a connection terminal according to a third modification of the present embodiment. The connection terminal 4 shown in the figure is provided with a pair of tongue pieces 43 extending in the direction in which the base end portion of the contact portion 42 is extended from the boundary portion between the base portion 41 having the opening 40 and the contact portion 42. ing. According to the connection terminal 4 having such a configuration, the torsional characteristics of the boundary portion between the base portion 41 and the contact portion 42 can be changed by adjusting the length of the tongue piece portion 43.

  As is apparent from the above description, the present invention can include various embodiments and the like not described herein, and within the scope not departing from the technical idea specified by the claims. Various design changes and the like can be made.

It is a perspective view which shows the structure of the connecting terminal which concerns on one embodiment of this invention. It is a top view which shows the structure of the connecting terminal which concerns on one embodiment of this invention. It is a side view of the arrow A direction of FIG. It is a perspective view which shows the structure of the connector (socket connector) which concerns on one embodiment of this invention. It is a figure which shows the example of arrangement | positioning of the connection terminal of the connector (socket connector) which concerns on one embodiment of this invention. It is a figure which shows the attachment aspect of the connection terminal which concerns on one embodiment of this invention. It is a figure which shows the change of the shape of a connection terminal when mounting a semiconductor package in the connector (socket connector) which concerns on one embodiment of this invention. It is a figure which shows the load characteristic of the connection terminal in the connector (socket connector) which concerns on one embodiment of this invention. It is a figure which shows the relationship between the free area | region of the base part of the connection terminal which concerns on one embodiment of this invention, and maximum stress. It is a figure which shows the change of the shape of a connection terminal when mounting a semiconductor package when the base part of the connection terminal which concerns on one embodiment of this invention is completely fixed to a printed circuit board. It is a figure which shows the load characteristic of a connection terminal at the time of fixing the base part of the connection terminal which concerns on one embodiment of this invention to a printed circuit board completely. It is a perspective view which shows the structure of the semiconductor package which concerns on one embodiment of this invention. It is a figure which shows the structure of the connection terminal which concerns on the 1st modification of one embodiment of this invention. It is a perspective view which shows the structure of the connection terminal which concerns on the 2nd modification of one embodiment of this invention. It is a perspective view which shows the structure of the connection terminal which concerns on the 3rd modification of one embodiment of this invention.

Explanation of symbols

1, 2, 3, 4 Connection terminal 10, 30, 40 Open portion 11, 21, 31, 41 Base portion 12, 22, 32, 42 Contact portion 12a, 22a Base end portion 12b, 22b Tip portion 22c Intermediate portion 43 Tongue One part 100 Socket connector 101 Housing member 102 Frame member 103 Screw member 104 Mounting hole 200, 400 Semiconductor package 300 Printed circuit board 401 Base material

Claims (7)

A connection terminal formed using a conductive material and electrically connecting two different circuit structures,
While a flat base portion partially Ru is fixed to the circuit structure of said two circuit structures,
Extending from the one circuit structure fixed such not part of the base portion in a direction that rises relative to the base portion, a contact portion for contact with the other circuit structure,
Equipped with a,
The contact portion has a base end portion that forms a curved surface that protrudes downward with respect to the surface of the base portion when the side on which the contact portion extends with respect to the surface of the base portion is above the base portion. A connection terminal characterized by that. The contact portion is
When the side where the contact portion extends with respect to the surface of the base portion is above the base portion, a curved surface protruding upward with respect to the surface of the base portion is formed, and a distal end portion connected to the base end portion is formed. The connection terminal according to claim 1, further comprising: The contact portion is
A tip portion having a curved surface convex downward with respect to the surface of the base portion when the contact portion extends above the surface of the base portion with respect to the surface of the base portion;
The portion that is located between the distal end portion and the base end portion and that is farthest from the base portion in the contact portion, and the side on which the contact portion extends with respect to the surface of the base portion An intermediate portion that forms a curved surface that is convex upward with respect to the surface of the base portion when the base portion is above;
The connection terminal according to claim 1, further comprising: The base unit of claim 1 to 3, characterized in that it comprises an opening in the shape always containing regardless portions obtained by projecting the surface of the base portion of the outer edge in the shape change of the contact portion of the contact portion Connection terminal as described in any one. It said contact portion is a connection terminal according to any one of claims 1 to 4, characterized in that it is formed by plastic working. Connector connection terminal according to any one of claims 1 to 5, characterized in that is provided with a plurality on a plane. Semiconductor package connecting terminal according to any one of claims 1 to 5, characterized in that is provided with a plurality on a plane.

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