KR20170096496A - C clip - Google Patents

C clip Download PDF

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Publication number
KR20170096496A
KR20170096496A KR1020160017943A KR20160017943A KR20170096496A KR 20170096496 A KR20170096496 A KR 20170096496A KR 1020160017943 A KR1020160017943 A KR 1020160017943A KR 20160017943 A KR20160017943 A KR 20160017943A KR 20170096496 A KR20170096496 A KR 20170096496A
Authority
KR
South Korea
Prior art keywords
contact
clip
base
round
elastic
Prior art date
Application number
KR1020160017943A
Other languages
Korean (ko)
Inventor
이권구
Original Assignee
이권구
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이권구 filed Critical 이권구
Priority to KR1020160017943A priority Critical patent/KR20170096496A/en
Publication of KR20170096496A publication Critical patent/KR20170096496A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2428—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using meander springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module

Abstract

The present invention provides a C clip in which an insertion hole into which a lower end part of a contact part can be inserted is formed in a base part disposed on a substrate. To this end, according to the present invention, the C clip comprises: the base part fixed to the substrate; the contact part electrically contacting a component; and an elastic part having elasticity, and connecting the base part and the contact part. The contact part is disposed on an upper end part of the base part. The contact part includes: a connection part connected with the elastic part; and a round part connected to the connection part, and having a hemispherical shape which is hollow inside and is convex in the direction opposite to the base part. The base part is formed with the insertion hole into which the round part is inserted.

Description

C clip {C CLIP}

The present invention relates to a C clip which is applied to a mobile phone to maintain electrical connection between electronic components.

The C clip functions as a connector for maintaining electrical connection between electronic parts disposed in the mobile phone, and can also function as an antenna.

Since the thickness of the cell phone can be determined by the thickness of the C clip, the C clip performs an important function in the cell phone.

FIG. 1 is an exemplary view showing the structure of a conventional C clip, and particularly shows a structure of a C clip in the absence of external pressure and a structure of a C clip in the case of receiving pressure from the outside.

The conventional C clip has a height of 1.1 mm or more when there is no external pressure.

In the conventional C clip, in order to prevent sagging of the contact portion 30 when the contact portion 30 of the C clip is pushed, as shown in Fig. 1, a C The base portion 10 of the clip is bent in an inverted U shape.

Due to the bent portion in the U-shape, the conventional C-clip can not be manufactured to 0.5 mm or less. Further, due to the above-described structure, even when there is no external pressure, the height of the conventional C clip is less than 1 mm.

As described above, since the thickness of the cell phone depends on the height of the C clip, the thickness of the cell phone is less likely to be reduced by the conventional C clip.

Prior art related to the present invention is disclosed in Patent Document No. 10-2015-0096986 et al.

An object of the present invention to solve the aforementioned problems is to provide a C clip in which an insertion hole into which a lower end portion of a contact portion can be inserted is formed in a base portion disposed on a substrate.

According to an aspect of the present invention, there is provided a C-clip including: a base fixed to a substrate; A contact portion in electrical contact with the component; And an elastic portion having elasticity and connecting the base portion and the contact portion, wherein the contact portion is disposed at an upper end portion of the base portion, and the contact portion includes: a connection portion connected to the elastic portion; And a round portion connected to the connection portion and having a hemispherical shape which is convex in a direction opposite to the base portion, wherein the base portion is formed with an insertion hole into which the round portion is inserted.

According to the present invention, since the height of the C clip can be reduced, the thickness of the cell phone in which the C clip is disposed can be reduced.

Further, according to the present invention, deflection of the contact portion of the C-clip can be prevented.

1 is an exemplary view showing the structure of a conventional C clip.
2 is a plan view of a C clip according to the present invention;
3 is an exemplary view showing a side surface of a C clip according to the present invention;
4 is a rear view of a C clip according to the present invention.
FIG. 5 is an exemplary view showing a state in which a C-clip according to the present invention starts to be pressed by a contact object. FIG.
6 is an exemplary view showing a state in which the C-clip according to the present invention is pressed to the maximum by the contact object.
7 is an exemplary view showing a state in which a C-clip according to the present invention is mounted on a substrate.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a plan view of a C clip according to the present invention, FIG. 3 is a side view of a C clip according to the present invention, and FIG. 4 is a rear view of a C clip according to the present invention.

2 to 4, the C clip according to the present invention includes a base portion 100 fixed to a substrate, a contact portion 300 electrically contacting the component, and a base portion 100 having elasticity. And an elastic part 200 connecting the contact part 300 with the elastic part.

First, the base unit 100 may be fixed to a substrate such as a cellular phone or various electronic products, for example, a printed circuit board through soldering or the like. Since the elastic portion 200 and the contact portion 300 are formed as a conductor as well as the base portion 100, the antenna, the battery, or various electronic components , Simply referred to as a contact object) can be electrically connected to the electric wiring formed on the substrate through the C clip.

An insertion hole 110 is formed in the base portion 100.

The contact portion 300 may be inserted into the insertion hole 110, and in particular, the round portion 330 constituting the contact portion may be inserted. The connection hole 350 may be formed in the insertion hole 110 to connect the round portion 330 with the elastic portion 200.

Second, the elastic part 200 may be integrally formed with the base part 100. One end of the elastic part is connected to the base part 100 at one end of the base part 100 and is bent in a rounded form from the base part 100.

The other end of the elastic part 200 extends toward the other end of the base part 100.

Accordingly, the elastic part 200 is adjacent to the base part 100 at a predetermined interval, and covers the upper surface of the base part 100.

The elastic part 200 is formed in a flat plate shape.

The elastic portion 200 is formed with a cutout 210 such as a circular or oval shape. The cut-off portion 210 may function to reduce the material of the elastic portion 200, and may also function to increase the elastic force of the elastic portion 200.

Thirdly, the front surface of the base part 100 may be provided with a blocking part 400 for preventing deformation of the elastic part 200 from an external force of the elastic part 200 in the front direction.

The blocking portion 400 protrudes in a direction perpendicular to the plane at the front surface of the base portion 100.

As shown in FIGS. 2 to 4, the blocking portion 400 may be provided not only in the front direction of the elastic portion 200, but also in the lateral direction.

That is, the blocking portion 400 protrudes in a direction perpendicular to the plane at the edge of the plane of the base portion 100, and the blocking portion 400 protrudes from the front surface, the left surface, and the rear surface of the contact portion 300, And the right side surface.

In addition, the blocking portion 400 functions to prevent the contact portion 300 from being pressed down below the blocking portion 400.

For example, when the contact object pushes the contact portion 300, the bottom surface of the contact object spans the upper surface of the blocking portion 400, so that the contact portion 300 is not pressed any more do. Accordingly, the sagging of the contact portion 300 can be prevented.

Fourth, the contact portion 300 is in electrical contact with the contact object, so that the contact object can be electrically connected to the electric wiring formed on the substrate.

The contact portion 300 is disposed at the upper end of the base portion 100.

For example, the contact portion 300 may include a connection portion 350 connected to the elastic portion 200 and a connection portion 350 connected to the connection portion 350. The contact portion 300 may be convex in a direction opposite to the base portion 100, And a round portion 330 having a hemispherical shape.

2, the connecting portion 350 is formed to have an angle A of 135 degrees or more with respect to the upper surface of the elastic portion 200, ).

When the contact portion 300, particularly, the round portion 330 receives a pressure in the direction of the base portion 100, the lower end surface of the connection portion 350 is inserted into the insertion hole 110, .

Accordingly, sagging of the contact portion 300 or the elastic portion 200 can be prevented.

The round portion 330 has a hemispherical shape which is convex in the direction opposite to the base portion 100 and hollow.

The round portion 330 is integrally connected to the connection portion 350 and is bent in a Λ or ∞ shape opposite to the base portion 100, for example, as shown in FIG. 3 have.

The round portion 330 has a hemispherical shape as shown in Figs. In this case, the round part 330 may be hollow but may be hollow.

The round portion 330 may prevent the contact portion 300 from sagging.

When the contact part 300, particularly, the round part 330 receives a pressure in the direction of the base part 100, the round part 330 is inserted into the insertion hole 110 and supported on the substrate .

That is, in the present invention, the round portion 330 and the connection portion 350 are inserted into the insertion hole 110 and supported on the substrate. However, the insertion hole 110 may be formed to have a size that allows only the round portion 330 to be inserted. In this case, the connection portion 350 may be supported on the upper surface of the base portion 110 .

In addition, a contact portion protruding from the upper end surface of the round portion 330 and forming a predetermined region may be disposed on the upper end surface of the round portion 330.

The contact object and the contact portion 300 can be electrically connected to each other by the contact portion.

The base portion 100, the elastic portion 200, and the contact portion 300 may be integrally formed of a material having electrical conductivity.

When the contact part 300 receives a pressure in the direction of the base part 100, the round part 330 and the connection part 350 of the contact part 300, in particular, (Not shown).

Therefore, as shown in FIG. 3, when the contact portion 300 is subjected to the maximum pressing force, the overall height Z of the C clip may be reduced to 0.3 mm to 0.4 mm.

The height Y of the C clip, which can be increased by the elasticity of the elastic part 200 when the contact part 300 is not pressed from outside, may be approximately 0.45 mm to 0.55 mm .

Therefore, the total height X of the contact portion 300 may be 0.3 mm to 1.0 mm.

That is, in the present invention, the insertion hole 110 is formed in the base part 100. When the contact part 300 is pressed by the contact object, the round part 330 and the connection part 350 May be inserted into the insertion hole 110. Accordingly, the minimum height Z of the C clip can be reduced as compared with the conventional one.

3 illustrates a relationship between a maximum height X of the C clip in a state where the contact portion 300 is not pressed and a minimum height X of the C clip in a state in which the contact portion 300 is pressed to a maximum pressure. And the height (Z). In this case, the maximum height X may be smaller than 1.0 mm, and the minimum height Z may be 0.3 mm to 0.4 mm.

The height of the blocking portion 400 may be greater than or less than the total height Z of the C clip when the contact portion 300 is subjected to the maximum pressing force.

FIG. 5 is an exemplary view showing a state where the C clip according to the present invention starts to be pressed by the contact object, FIG. 6 is an exemplary view showing a state where the C clip according to the present invention is maximally pressed by the contact object, 7 is an exemplary view showing a state in which a C-clip according to the present invention is mounted on a substrate.

As described above, the contact object 800 may be an antenna, a battery, or various electronic parts applied to a mobile phone or various electronic products. The contact object 800 may be formed on the substrate through the C clip. And can be electrically connected to the electric wiring.

As shown in FIG. 5, the contact object 800 is disposed on the upper surface of the contact portion 300 and presses the contact portion 300.

In this case, the round portion 330 of the contact portion 300 and the upper surface of the contact portion may be electrically connected to the contact object 800.

6, when the round part 330 is pushed toward the base part 100 by the contact object 800, the round part 330 and the connection part 350 may be formed in the base part 100, Is inserted into the insertion hole (110) formed in the body (100).

In this case, the round portion 330 and the connection portion 350 are closely attached to the upper surface of the substrate 900 and supported by the substrate 900, as shown in FIG. Particularly, the bottom surface 320 of the round portion 330 is in close contact with the substrate 900 and is supported by the substrate 900.

As the round portion 330 and the connection portion 350 are supported on the substrate 900, the contact portion 300 is not pressed any more even if the contact portion 300 is pressed at a certain pressure or more . Therefore, the contact portion 300 and the elastic portion 200 can be prevented from being deformed and sagged.

However, as described above, the connection portion 350 may not be inserted into the insertion hole 110. In this case, the connection portion 350 may be supported on the upper surface of the base portion 110. [

The contact portion 300 and the elastic portion 200 may be formed to have a height equal to or less than 1.0 mm, for example, 0.8 mm or 0.9 mm, when the pressure is not applied, A phenomenon of sagging or deformation due to a high pressing force can be prevented.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

100: base portion 200: elastic portion
300: contact part 800: contact object
900: substrate

Claims (4)

A base portion fixed to the substrate;
A contact portion in electrical contact with the component; And
And an elastic portion having elasticity and connecting the base portion and the contact portion,
Wherein the contact portion is disposed at an upper end portion of the base portion,
The contact portion includes:
A connection part connected to the elastic part; And
And a round portion which is connected to the connection portion and is convex in a direction opposite to the base portion and has a hemispherical shape hollow inside,
And an insertion hole into which the round portion is inserted is formed in the base portion. The method according to claim 1,
And the insertion hole has a size such that the round portion and the connection portion can be inserted. The method according to claim 1,
And the round portion and the connection portion are inserted into the insertion hole and are supported by the substrate when the contact portion receives a pressure toward the base portion. The method according to claim 1,
And a blocking portion protruding in a direction perpendicular to the plane at an edge of the plane of the base portion,
Wherein the blocking portion is provided in at least one of a front surface, a left surface, and a right surface of the contact portion.




KR1020160017943A 2016-02-16 2016-02-16 C clip KR20170096496A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160017943A KR20170096496A (en) 2016-02-16 2016-02-16 C clip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160017943A KR20170096496A (en) 2016-02-16 2016-02-16 C clip

Publications (1)

Publication Number Publication Date
KR20170096496A true KR20170096496A (en) 2017-08-24

Family

ID=59758129

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160017943A KR20170096496A (en) 2016-02-16 2016-02-16 C clip

Country Status (1)

Country Link
KR (1) KR20170096496A (en)

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A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application