JPWO2010016371A1 - Microchip, microchip manufacturing method, and microchip manufacturing apparatus - Google Patents

Abstract

A microchip manufacturing method and a manufacturing apparatus capable of preventing a decrease in productivity In the manufacturing method, the microchip manufacturing apparatus 5 that heat-bonds two resin substrates 10 and 20 includes two hot plates 51 that are heat-bonded so as to face each other and sandwich the resin substrates 10 and 20 therebetween. 52, a moving means 53 for bringing the hot plates 51 and 52 into and away from each other, and a peeling means 55 for peeling the resin substrate 10 attached to one hot plate 51 from the hot plate 51. The peeling means 55 peels the resin substrate 10 from the hot plate 51 by applying an external force to the resin substrate 10 through the through hole 510 formed in the thickness direction of the hot plate 51.

Description

  The present invention relates to a microchip, a microchip manufacturing method, and a microchip manufacturing apparatus.

  2. Description of the Related Art Conventionally, in a technical field that performs chemical reaction, separation, analysis, and the like of a liquid sample such as nucleic acid, protein, and blood in a minute space, a microchip having a minute channel or circuit formed therein has been put into practical use.

  Such a microchip has two substrates formed of resin or the like, and after fine processing is performed on at least one substrate, the two substrates are sandwiched between hot plates and bonded together. It is manufactured (for example, refer to Patent Document 1).

  By the way, in the above-mentioned microchip, peeling of the joint surface changes the way the analysis sample flows and moves in the flow path and causes the analysis sample to leak, thus preventing such problems. From this viewpoint, strong and uniform bonding strength is required.

  Therefore, in order to pressurize uniformly in the bonding of the microchip, the surface of the hot plate and the contact surface of the substrate with the hot plate are formed in advance smoothly.

JP-A-2005-77218

  However, when a smooth substrate is bonded with a smooth hot plate, the bonded microchip sticks to the hot plate, resulting in reduced productivity.

  In this regard, as a method for preventing the sticking of the microchip to the hot plate, a method of applying a release agent to the surface of the hot plate in advance can be considered, but even if such a method is simply used, bonding is possible. As a result of peeling off the applied release agent by repeating the work, the peeling effect may be reduced, sticking may occur, and productivity may be reduced.

  The subject of this invention is providing the manufacturing method and manufacturing apparatus of a microchip which can prevent the fall of productivity.

According to a first aspect of the present invention, there is provided a method for manufacturing a microchip, in which two substrates that are laminated and have a flow path formed inside are sandwiched between two hot plates facing each other and are heat-bonded.
A bonding step of heat-bonding the two substrates with the two hot plates;
A separation step of separating the two hot plates after the joining step;
A peeling step of peeling the substrate attached to one of the two hot plates from the one hot plate after the separating step;
The peeling step includes
The method includes a step of peeling the substrate from the one hot plate by applying an external force to the substrate through a through hole formed in the thickness direction of the one hot plate.

In this microchip manufacturing method,
The peeling step includes
It is preferable to include a step of peeling the substrate from the one hot plate by inserting a rod-like protruding pin through the through hole and projecting it toward the other hot plate.

Moreover, in this microchip manufacturing method,
The peeling step includes
It is preferable to include a step of peeling the substrate from the one hot plate by injecting air from the outside to the substrate through the through hole.

According to a second aspect of the present invention, there is provided a method of manufacturing a microchip, in which two substrates that are stacked and have a flow path formed inside are sandwiched between two hot plates facing each other and heat bonded.
A bonding step of heat-bonding the two substrates with the two hot plates;
A separation step of separating the two hot plates after the joining step;
A peeling step of peeling the substrate attached to one of the two hot plates from the one hot plate after the separating step;
The peeling step includes
Including a step of peeling the substrate from the one hot plate by peeling off the side portion of the substrate from the one hot plate using an engaging member that engages with the side portion of the substrate. To do.

In the manufacturing method of the microchip of the present invention,
Before the joining step, it is preferable to have a coating step of applying a release agent that prevents the substrate from sticking to the two hot plates.

According to a third aspect of the present invention, in a microchip,
It is manufactured by the method for manufacturing a microchip of the present invention.

According to a fourth aspect of the present invention, there is provided a microchip manufacturing apparatus that heat-bonds two substrates that are stacked and have a flow path formed inside thereof.
Two hot plates that are heated and bonded to each other with the two substrates sandwiched therebetween,
Moving means for bringing the two hot plates into contact with and away from each other;
A peeling means for peeling off the substrate attached to one of the two hot plates from the hot plate;
The peeling means includes
The substrate is separated from the one hot plate by applying an external force to the substrate through a through hole formed in the thickness direction of the one hot plate.

In this microchip manufacturing equipment,
The peeling means includes
It is preferable to have a rod-like protruding pin that is inserted into the through hole and protrudes toward the other hot plate to peel the substrate from the one hot plate.

Moreover, in this microchip manufacturing apparatus,
The peeling means includes
It is preferable to have a jetting means for peeling the substrate from the one hot plate by jetting air from the outside to the substrate through the through hole.

According to a fifth aspect of the present invention, there is provided a microchip manufacturing apparatus that heat-bonds two substrates that are laminated to form a flow path on the inside,
Two hot plates that are heated and bonded to each other with the two substrates sandwiched therebetween,
Moving means for bringing the two hot plates into contact with and away from each other;
A peeling means for peeling off the substrate attached to one of the two hot plates from the hot plate;
The peeling means includes
An engaging member that engages a side of the substrate;
Drive means for separating the engagement member from the one heat plate in a state of being engaged with the side portion of the substrate;
The substrate is peeled from the one hot plate by peeling the side portion of the substrate from the one hot plate by the engaging member.

In the microchip manufacturing apparatus of the present invention,
It is preferable that a release agent for preventing the substrate from sticking is applied to the two hot plates.

  According to the present invention, after separating the two hot plates, the substrate attached to the hot plate is peeled off from the hot plate, so that it is possible to prevent a decrease in productivity.

It is a top view of the microchip concerning the present invention. 4 is a cross-sectional view of the microchip according to the present invention, and is a cross-sectional view taken along the line IV-IV in FIG. It is a top view of the resin-made board | substrates in which the groove | channel for flow paths was formed. It is a conceptual diagram which shows schematic structure of the manufacturing apparatus of the microchip which concerns on this invention. It is a conceptual diagram which shows schematic structure of the modification of the manufacturing apparatus of the microchip which concerns on this invention. It is a conceptual diagram which shows schematic structure of the modification of the manufacturing apparatus of the microchip which concerns on this invention. It is sectional drawing of the modification of a resin-made board | substrate.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a top view of a microchip 1 according to the present invention, and FIG. 2 is a sectional view taken along line IV-IV in FIG.

  As shown in these drawings, the microchip 1 includes two rectangular plate-like resin substrates 10 and 20 bonded to each other.

  Among these, as shown in FIGS. 2 and 3, the resin substrate 10 has linear flow channel grooves 12 and 13 formed on one surface (the upper surface in FIG. 2). Further, as shown in FIG. 3, through holes 14 penetrating in the thickness direction of the resin substrate 10 are respectively formed at both ends of the flow path grooves 12 and 13. In the present embodiment, the other surface of the resin substrate 10 (the surface where the channel grooves 12 and 13 are not formed) is smooth. Further, the channel groove 12 and the channel groove 13 in the present embodiment are formed orthogonal to each other, but may be formed without being orthogonal to each other.

  On the other hand, as shown in FIG. 2, the resin substrate 20 is a member having a smooth surface, and is bonded to the formation surface of the flow path grooves 12 and 13 in the resin substrate 10. By this bonding, the resin substrate 20 functions as a cover (cover) for the flow path grooves 12 and 13 and the through hole 14, and the fine flow path 15 is formed between the flow path grooves 12 of the resin substrate 10 and the flow path. A fine channel 16 is formed between the groove 13 and the through hole 14 to form an opening 17.

  Here, the shape of the microchannels 15 and 16 (channel grooves 12 and 13) takes into consideration the fact that the amount of analysis sample and reagent used can be reduced, the fabrication accuracy of molds, transferability and mold release properties. The width and the depth are preferably in the range of 10 μm to 200 μm, but are not particularly limited, and may be determined according to the use of the microchip. And may be the same or different. In the present embodiment, the cross-sectional shape of the microchannels 15 and 16 is a rectangular shape, but this shape is an example, and other shapes such as a circular shape may be used.

  Since the through hole 14 of the resin substrate 10 is connected to the flow path grooves 12 and 13 as described above, the opening 17 formed by the through hole 14 is connected to the fine flow paths 15 and 16. . The opening 17 is a hole for introducing, storing, and discharging a gel, a sample, and a buffer solution, and is connected to a tube or nozzle provided in an analyzer (not shown). Thus, a gel, a sample, a buffer solution, or the like is introduced into or discharged from the fine channels 15 and 16. Note that the shape of the opening 17 (through hole 14) is not limited to a circular shape, and may be various other shapes such as a rectangular shape. Further, the inner diameter of the opening 17 (through hole 14) may be adjusted to the analysis method or the analysis apparatus, and is preferably about 2 mm, for example.

  The shape of the resin substrates 10 and 20 may be any shape as long as it is easy to handle and analyze. For example, a shape such as a square, a rectangle, or a circle is preferable. Moreover, the size of the resin substrates 10 and 20 is preferably about 10 mm square to 200 mm square, and more preferably 10 mm square to 100 mm square. In addition, the plate thickness of the resin substrate 10 on which the channel grooves 12 and 13 are formed is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability. The thickness of the resin substrate 20 functioning as a lid (cover) is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability. However, when the channel groove is not formed in the resin substrate 20 as in the present embodiment, a film (sheet member) may be used as the resin substrate 20 instead of a plate member. . In this case, the thickness of the film is preferably 30 μm to 300 μm, and more preferably 50 μm to 150 μm.

  Resin is used for the material of the resin substrates 10 and 20. As this resin, those having good moldability (transferability, releasability), high transparency, and low autofluorescence with respect to ultraviolet rays and visible light are preferable. For example, thermoplastic resins are used.

  Examples of the thermoplastic resin include polycarbonate, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, polyethylene terephthalate, polyamide, polyvinyl acetate, polyvinylidene chloride, polypropylene, polyisoprene, polyethylene, polydimethylsiloxane, and cyclic polyolefin. Etc. are preferably used. It is particularly preferable to use polymethyl methacrylate and cyclic polyolefin. The resin substrate 10 and the resin substrate 20 may be made of the same material or different materials.

  In addition to the thermoplastic resin, a thermosetting resin, an ultraviolet curable resin, or the like may be used for the resin substrate 20 in which the channel groove is not formed. As the thermosetting resin, polydimethylsiloxane is preferably used.

  The resin substrate 10 on which the flow path grooves 12 and 13 are formed is preferably formed by an injection molding method or a press molding method, and the resin substrate 20 on which the flow path grooves are not formed is formed by an extrusion molding method. It may be produced by a method other than an injection molding method such as a T-die molding method, an inflation molding method, or a calendar molding method, or by an injection molding method.

  Then, the manufacturing apparatus of said microchip 1 is demonstrated.

  FIG. 4 is a conceptual diagram showing a schematic configuration of a microchip manufacturing apparatus (hereinafter referred to as a manufacturing apparatus) 5. In this figure, the microchip 1 is shown in a simplified manner.

  As shown in this figure, the manufacturing apparatus 5 peels the resin board 10 (or 20) from the two hot plates 51 and 52 disposed vertically opposite to each other and the hot plate 51 (or 52). The peeling means 55 to be provided.

  The hot plates 51 and 52 are plate-like members that are heat-bonded with the resin substrates 10 and 20 therebetween, and are moved in the contact / separation direction (vertical direction in the figure) by the moving means 53. . The moving means 53 may move the hot plates 51 and 52, respectively, or only one of them. As such a moving means 53, a conventionally known apparatus can be used. Further, in the following description, the resin substrate 10 is disposed on the upper side and the resin substrate 20 is disposed on the lower side between the hot plates 51 and 52, and the resin substrates 10 and 20 are sandwiched. This will be explained. Further, the microchip 1 heated and bonded by the hot plates 51 and 52 will be described as being attached to the hot plate 51 on the resin substrate 10 side.

  Among the hot plates 51 and 52, the hot plate 51 disposed on the upper side is formed with a plurality of through holes 510 penetrating in the thickness direction. More specifically, these through holes 510 are provided in the hot plate 51 so as to open in a contact area with the end of the resin substrate 10 on the lower surface of the hot plate 51. In the present embodiment, the inner side surfaces of the hot plates 51 and 52 (the lower surface of the hot plate 51 and the upper surface of the hot plate 52) are smooth at portions other than the through holes 510. Also. In FIG. 4, a state is shown in which two through holes 510 are provided so as to open in the contact area with the two short side ends of the resin substrate 10 on the lower surface of the hot plate 51. However, it may be provided so as to open in a contact area with the end portion on the long side, or may be provided so as to open in a contact area with the end portion on the short side and the long side. .

  The peeling means 55 peels the resin substrate 10 from the hot plate 51 by applying an external force to the resin substrate 10 through the through hole 510 of the hot plate 51. It has rod-like protruding pins 511 inserted from the side opposite to the heat plate 52, and driving means 512 for reciprocating these protruding pins 511 in the axial direction so as to protrude and retract from the lower surface of the heat plate 51. . It should be noted that the protrusion / disengagement operation of the protrusion pin 511 may be performed synchronously or separately and independently.

  In the present embodiment, the protruding pin 511 is disposed only on the heat plate 51 side, but may be disposed on the heat plate 52 side or on both sides. It is determined as appropriate depending on which of the substrates 10 and 20 is attached to the hot plates 51 and 52. Usually, when the resin substrate is a film, since the film tends to stick to the hot plate, a configuration in which a pin configuration is arranged on the hot plate side on the film side is preferable.

  Moreover, it is preferable that the area | region which the protrusion pin 511 contact | abuts to the resin-made board | substrates 10 at the time of peeling is an area | region which avoided the flow path formation part in the resin-made board | substrates 10 It is preferable that the region avoids the above. In the former case, the deformation of the flow path shape due to the peeling operation can be prevented, and the shape of the through hole 510 is transferred to the film-like resin substrate 10 and the observation of the flow path is hindered. Can be prevented. In the latter case, it is possible to avoid the deformation of the joint surface due to the contact of the protruding pin 511 and to maintain the flatness.

  Then, the manufacturing method of the microchip 1 is demonstrated.

  First, a release agent (not shown) for preventing the resin substrates 10 and 20 from sticking is applied to the inner side surfaces of the two hot plates 51 and 52 (the lower surface of the hot plate 51 and the upper surface of the hot plate 52). (Application process). A conventionally known release agent can be used as such a release agent.

  Next, the resin substrates 10 and 20 are stacked one above the other with the formation surfaces of the flow path grooves 12 and 13 in the resin substrate 10 facing inward (lower side), and disposed between the hot plates 51 and 52. To do.

  Next, the hot plates 51 and 52 are brought close to the moving means 53 so that the resin substrates 10 and 20 are sandwiched between the hot plates 51 and 52, and in this state, the resin substrates 10 and 20 are heated and bonded while being pressed (bonding). Process).

  Here, the resin substrate 10 and the resin substrate 20 are joined by heat welding such as thermocompression bonding or heat lamination. By applying thermocompression bonding or heat laminating to the resin substrates 10 and 20, the resin on the bonding surface of the resin substrates 10 and 20 is melted, and the resin substrate 10 and the resin substrate 20 are bonded to each other. Chip 1 is formed. In addition, as heating temperature, the temperature of 70 to 200 degreeC can be used, for example.

  Next, as shown in FIG. 4A, the hot plates 51 and 52 are separated from the moving means 53 (a separation step). At this time, since the outer surface of the resin substrate 10 (surface opposite to the resin substrate 20) and the lower surface of the hot plate 51 are formed smoothly, the resin substrate 10 of the microchip 1 is the hot plate 51. Will be pasted on.

  Then, as shown in FIG. 4B, the protruding pin 511 is protruded from the through hole 510 toward the heat plate 52, and the resin substrate 10 (microchip 1) attached to the heat plate 51 is attached to the heat plate 51. The microchip 1 is manufactured by peeling from the substrate (peeling step).

  According to the microchip manufacturing method described above, after the two hot plates 51 and 52 are separated from each other, the resin substrate 10 attached to the hot plate 51 is peeled off from the hot plate 51. Can be prevented.

In addition, since the release agent is applied to the inner side surfaces of the hot plates 51 and 52 in advance before the resin substrates 10 and 20 are bonded, the peeling of the resin substrate 10 attached to the hot plate 51 can be facilitated. it can. Therefore, it is possible to reliably prevent a decrease in productivity.
[Modification (1)]
Next, a modification (1) of the microchip manufacturing apparatus according to the present invention will be described. In addition, the same code | symbol is attached | subjected to the component similar to said embodiment, and the description is abbreviate | omitted.

  As shown in FIG. 5, the microchip manufacturing apparatus 5 </ b> A according to the present modification includes a hot plate 51 </ b> A instead of the hot plate 51, and a peeling unit 55 </ b> A instead of the peeling unit 55.

  The heat plate 51A has an air injection port 510A that opens from the surface on the heat plate 52 side, that is, from the lower surface. In the present embodiment, air injection port 510A penetrates in the thickness direction of heat plate 51A so as to open in a contact area with the end of resin substrate 10 on the lower surface of heat plate 51A. However, as long as it opens on the lower surface, it may be bent from the lower surface toward the side end surface.

  The peeling means 55A has an injection means 550 for injecting air from the upper surface side to the lower surface side (resin substrate 10 side) of the hot plate 51A via the air injection port 510A of the hot plate 51A. As such an injection unit 550, a conventionally known injection device can be used.

According to the manufacturing apparatus 5A as described above, the injection means 550 injects air from the air injection port 510A in the peeling step, so that the resin substrate 10 (microchip 1) attached to the hot plate 51A is attached to the hot plate. Since it can peel from 51A, the effect similar to the said embodiment can be acquired.
[Modification (2)]
Next, a modification (2) of the microchip manufacturing apparatus according to the present invention will be described. In addition, the same code | symbol is attached | subjected to the component similar to said embodiment, and the description is abbreviate | omitted. Moreover, in this modification (2), the resin board | substrate 20 is formed larger than the resin board | substrate 10, and is in the state extended to the side.

  As shown in FIG. 6, the microchip manufacturing apparatus 5 </ b> B according to this modification includes a hot plate 51 </ b> B instead of the hot plate 51 and a peeling unit 55 </ b> B instead of the peeling unit 55.

  Unlike the hot plate 51, the hot plate 51 </ b> B is a flat plate member in which the through hole 510 is not provided.

  The peeling means 55B includes an engaging member 500 that engages with a side portion of the resin substrate 20, and a driving means 501 that separates the engaging member 500 from the heat plate 51B in a state where the engaging member 500 is engaged with the side portion of the resin substrate 20. And. In the present embodiment, the engaging member 500 is formed in a hook shape at the tip, and is engaged with the side portion of the resin substrate 20 at this hook-shaped portion. However, the engaging member 500 may be engaged with the resin substrate 20 in other forms such as friction engagement. The engaging member 500 may be engaged with the resin substrate 10 or may be engaged with both the resin substrates 10 and 20.

  According to the manufacturing apparatus 5B as described above, the resin adhered to the hot plate 51B by the driving means 501 peeling the side portion of the resin substrate 20 from the hot plate 51B via the engaging member 500 in the peeling process. Since the substrate-making substrate 20 (microchip 1) can be peeled from the hot plate 51B, the same effect as the above embodiment can be obtained.

  It should be noted that the present invention should not be construed as being limited to the above-described embodiments and modifications, and of course can be modified or improved as appropriate.

  For example, in the embodiment and the modification described above, the through hole 14 is formed in the resin substrate 10, but by forming the through hole in the resin substrate 20, an opening connected to the fine flow path is formed. May be.

  Further, the microchip 1 has been described as including the resin substrate 10 in which the non-formation surfaces of the flow path grooves 12 and 13 are smooth, but a resin substrate 40 as shown in FIG. It is good also as preparing for. Here, the resin substrate 40 is formed with flow channel grooves 12 and 13 on one surface, and a cylindrical protrusion 41 is provided around each through hole 14 on the other surface. Yes. These protrusions 41 surround the through-holes 14 and protrude in the thickness direction of the resin substrate 40 and are fitted into tubes and nozzles of an analyzer (not shown) to introduce and discharge samples and the like. To do. Such a protrusion 41 may have a cylindrical shape, or may have another shape such as a polygonal shape. However, the concavo-convex member provided on the non-formation surface of the flow path grooves 12 and 13 in the resin substrate 40 is not limited to the protrusion 41, and for example, for controlling the flow of the sample flowing in the fine flow path. It may be a switch or a lens for collecting light from the analyzer.

  Further, the resin substrate 10 of the microchip 1 has been described as being attached to the hot plate 51 (51A, 51B), but the resin substrate 20 may be attached to the hot plate 52. In this case, the through hole 510 (air injection port 510A) is provided in the hot plate 52, and the peeling means 55 (55A, 55B) is arranged to peel the resin substrate 20 from the hot plate 52.

1 Microchip 5, 5A, 5B Manufacturing equipment (Microchip manufacturing equipment)
10, 20, 40 Resin substrate (substrate)
51, 51A, 51B Hot plate (one hot plate)
52 Hot plate (other hot plate)
53 Moving means 55 Peeling means 500 Engaging member 501 Driving means 510 Through hole 510A Air injection port (through hole)
511 Extrusion pin 550 Injection means

Claims (11)

A method of manufacturing a microchip, in which two substrates that are stacked and have a flow path formed inside are sandwiched between two hot plates facing each other and heat bonded,
A bonding step of heat-bonding the two substrates with the two hot plates;
A separation step of separating the two hot plates after the joining step;
After the separating step, the substrate attached to one hot plate of the two hot plates, and a peeling step to peel from the one hot plate,
The peeling step includes
A method of manufacturing a microchip, comprising a step of peeling the substrate from the one hot plate by applying an external force to the substrate through a through hole formed in the thickness direction of the one hot plate. In the manufacturing method of the microchip of Claim 1,
The peeling step includes
A method of manufacturing a microchip, comprising a step of peeling the substrate from the one hot plate by inserting a rod-like protruding pin through the through hole and projecting it toward the other hot plate. In the manufacturing method of the microchip of Claim 1,
The peeling step includes
A method of manufacturing a microchip, comprising a step of peeling the substrate from the one hot plate by injecting air from the outside to the substrate through the through hole. A method of manufacturing a microchip, in which two substrates that are stacked and have a flow path formed inside are sandwiched between two hot plates facing each other and heat bonded,
A bonding step of heat-bonding the two substrates with the two hot plates;
A separation step of separating the two hot plates after the joining step;
A peeling step of peeling the substrate attached to one of the two hot plates from the one hot plate after the separating step;
The peeling step includes
Including a step of peeling the substrate from the one hot plate by peeling off the side portion of the substrate from the one hot plate using an engaging member that engages with the side portion of the substrate. A method for manufacturing a microchip. In the manufacturing method of the microchip as described in any one of Claims 1-4,
A method of manufacturing a microchip, comprising a coating step of applying a release agent for preventing the substrate from sticking to the two hot plates before the bonding step.   A microchip manufactured by the method for manufacturing a microchip according to claim 1. A microchip manufacturing apparatus that heat-bonds two substrates that are stacked and have a flow path formed inside,
Two hot plates that are heated and bonded to each other with the two substrates sandwiched therebetween,
Moving means for bringing the two hot plates into contact with and away from each other;
A peeling means for peeling off the substrate attached to one of the two hot plates from the hot plate;
The peeling means includes
An apparatus for manufacturing a microchip, wherein an external force is applied to the substrate through a through-hole formed in a thickness direction of the one hot plate to peel the substrate from the one hot plate. The microchip manufacturing apparatus according to claim 7,
The peeling means includes
An apparatus for manufacturing a microchip, comprising: a rod-like protruding pin that is inserted into the through hole and protrudes toward the other hot plate to peel the substrate from the one hot plate. The microchip manufacturing apparatus according to claim 7,
The peeling means includes
An apparatus for manufacturing a microchip, comprising spraying means for peeling the substrate from the one hot plate by spraying air from the outside to the substrate through the through hole. A microchip manufacturing apparatus that heat-bonds two substrates that are stacked and have a flow path formed inside,
Two hot plates that are heated and bonded to each other with the two substrates sandwiched therebetween,
Moving means for bringing the two hot plates into contact with and away from each other;
A peeling means for peeling off the substrate attached to one of the two hot plates from the hot plate;
The peeling means includes
An engaging member that engages a side of the substrate;
Drive means for separating the engagement member from the one heat plate in a state of being engaged with the side portion of the substrate;
The microchip manufacturing apparatus, wherein the substrate is peeled off from the one hot plate by peeling the side portion of the substrate from the one hot plate by the engaging member. In the microchip manufacturing apparatus according to any one of claims 7 to 10,
The microchip manufacturing apparatus, wherein a release agent for preventing the substrate from sticking is applied to the two hot plates.