JP2008216121A - Method for manufacturing microchip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a microchip, capable of enhancing sealability of a flow channel, and capable of joining firmly fellow microchip substrates. <P>SOLUTION: A flow channel groove 2 is formed on a surface of the microchip substrate 1. A protrusion 4 is formed on a surface of the microchip substrate 3. The protrusion 4 is engaged with the flow channel groove 2, by layering overlappingly the microchip substrate 1 to the microchip substrate 3, under the condition where a face formed with the flow channel groove 2 and the protrusion 4 is directed inward. A joining face is fused under the condition, by irradiating the microchip substrates 1, 3 with an ultrasonic wave or a laser, and the substrates are pressurized to join the microchip substrates 1, 3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a microchip having a flow path.

  A micro-analysis chip that uses microfabrication technology to form fine channels and circuits on silicon and glass substrates, and to perform chemical reactions, separation, and analysis of liquid samples such as nucleic acids, proteins, and blood in a minute space Alternatively, an apparatus called μTAS (Micro Total Analysis Systems) has been put into practical use. As an advantage of such a microchip, it is conceivable to realize an inexpensive system that can be carried in a small space because the amount of sample or reagent used or the amount of discharged waste liquid is reduced.

  The microchip is manufactured by bonding two members having at least one member subjected to fine processing. Conventionally, a glass substrate is used for the microchip, and various fine processing methods have been proposed. However, since glass substrates are not suitable for mass production and are very expensive, development of inexpensive and disposable resin microchips is desired.

  The microchip on which the fine flow path is formed is composed of a resin microchip substrate having a flow path groove formed on the surface and a resin microchip substrate that functions as a cover for the flow path groove. It is manufactured by joining the grooved surface inside.

  In the microchip in which the fine channel is formed, the fluid in the fine channel must not ooze out of the fine channel, and ensuring the sealing property of the fine channel is an important joining requirement. That is, it is necessary to join the microchip substrates so that no gap is generated between the channel groove and the microchip substrate functioning as a cover.

  Conventionally, when a resin member that is transparent to laser light and a resin member that is impermeable to laser light are welded by a laser, a concave portion is formed in the transparent resin member, A convex part is formed on a transparent resin member, the concave part and the convex part are fitted, and then the convex part is melted by irradiating the convex part with laser light, thereby welding two resin members. (For example, Patent Document 1).

JP 2005-7759 A

  However, in the method according to Patent Document 1, one of the members to be welded needs to be impermeable to laser light. Therefore, when both members to be welded are permeable members, the members cannot be welded together by the method of Patent Document 1.

  The present invention solves the above-mentioned problems, and a first object is to provide a microchip capable of bonding the microchip substrates more firmly regardless of whether the microchip substrates are light transmissive or not. An object is to provide a manufacturing method. The second object is to improve the sealing performance of the flow path.

According to a first aspect of the present invention, a flow path groove includes a first resin substrate having a flow path groove formed on a surface and a second resin substrate having a protrusion formed on the surface. The first resin substrate and the second resin substrate are overlapped with the formed surface and the surface on which the protruding portion is formed being aligned, positioning the channel groove and the protruding portion. In this state, the protrusion is fitted into the channel groove, and in this state, ultrasonic waves are applied to the first resin substrate and the second resin substrate. The surface to which the substrate and the second resin substrate are joined is melted, and the first resin substrate and the second resin substrate are pressurized, whereby the first resin substrate and the second resin substrate are pressed. A method of manufacturing a microchip, comprising bonding a resin substrate.
The second embodiment of the present invention is a light-transmitting first resin substrate having a channel groove formed on the surface and a light-transmitting second resin having a protrusion formed on the surface. The substrate is positioned with the surface on which the channel groove is formed and the surface on which the projection is formed, and the channel groove and the projection are aligned, and the substrate is positioned via the light absorber. By overlapping the first resin substrate and the second resin substrate, the protrusion is fitted into the flow channel groove, and in this state, the first resin substrate and the second resin substrate are fitted. By irradiating the substrate with a laser, the surface to be joined between the first resin substrate and the second resin substrate is melted, and the first resin substrate and the second resin substrate are added. The method for manufacturing a microchip is characterized in that the first resin substrate and the second resin substrate are joined by pressing. .
A third aspect of the present invention is a method of manufacturing a microchip according to either the first aspect or the second aspect, wherein the flow path groove depth D and the protrusion height H is characterized in that the relationship of depth D> height H is established.
According to a fourth aspect of the present invention, there is provided a microchip manufacturing method according to any one of the first to third aspects, wherein the width W of the channel groove is equal to the width of the channel groove. It is characterized by being constant in the depth direction.
According to a fifth aspect of the present invention, there is provided a microchip manufacturing method according to any one of the first to third aspects, wherein the width of at least a part of the channel groove is the channel size. It is characterized by being gradually narrowed in the depth direction of the groove.
According to a sixth aspect of the present invention, there is provided a microchip manufacturing method according to any one of the first to fifth aspects, wherein the width L of the protrusion in the width direction of the channel groove is The protrusion is constant in the height direction.
According to a seventh aspect of the present invention, there is provided a microchip manufacturing method according to any one of the first to fifth aspects, wherein the width L of the protrusion in the width direction of the channel groove is The projection is gradually narrowed toward the tip of the projection.
According to an eighth aspect of the present invention, there is provided a microchip manufacturing method according to the seventh aspect, wherein the protrusion has a planar side surface and the width L gradually decreases toward the tip. It is characterized by.
According to a ninth aspect of the present invention, there is provided a microchip manufacturing method according to the seventh aspect, wherein the protrusion has a curved side surface, and the width L gradually decreases toward the tip. It is characterized by.
According to a tenth aspect of the present invention, there is provided a microchip manufacturing method according to any one of the first to third aspects, wherein the width W of the flow path groove is equal to the width of the flow path groove. The width L of the protrusion in the width direction of the flow path groove is constant in the depth direction, and the width L of the protrusion is constant in the height direction of the protrusion. The width and the width L of the protrusion are substantially equal.
An eleventh aspect of the present invention is a microchip manufacturing method according to any one of the first to third aspects, wherein the width W of the flow path groove is equal to the width of the flow path groove. It is constant in the depth direction, and the width L of the protrusion in the width direction of the flow path groove is gradually narrowed toward the tip of the protrusion, and the width W of the flow path groove and the width The maximum width of the protrusion is substantially equal.
A twelfth aspect of the present invention is a microchip manufacturing method according to any one of the first to third aspects, wherein the width W of the flow path groove is equal to the width of the flow path groove. The width L of the protrusion in the width direction of the channel groove is gradually narrowed toward the depth direction, and the width L of the protrusion is gradually decreased toward the tip of the protrusion.
A thirteenth aspect of the present invention is a microchip manufacturing method according to any one of the first to third aspects, wherein the width W of the flow path groove is equal to the width of the flow path groove. It is constant in the depth direction, the protrusion has a curved side surface, and the width L of the protrusion in the width direction of the channel groove gradually decreases toward the tip of the protrusion. And the width W of the channel groove is equal to the maximum width of the protrusion.
A fourteenth aspect of the present invention is a microchip manufacturing method according to any one of the first to third aspects, wherein the width W of the channel groove is equal to the width of the channel groove. The protrusion is gradually narrowed in the depth direction, the protrusion has a curved side surface, and the width L of the protrusion in the width direction of the flow path groove is toward the tip of the protrusion. The width is gradually narrowed, and the maximum width of the channel groove and the maximum width of the protrusion are substantially equal.
In the present invention, when “the width of the protrusion and the width of the channel groove are substantially equal”, “approximately equal” in terms of the size relationship between the width of the protrusion and the channel groove means that the protrusion It can be inserted into the groove for use, and the width of both is within a predetermined size range and includes a difference in size. The term “within a predetermined size range” means that the width of the protrusion and the channel groove is within the range of the dimensional difference of 0.001 mm to 0.1 mm, for example.

  According to this invention, by fitting the protrusions to the flow path grooves, the side surfaces of the flow path grooves and the protrusions come into contact with each other, and the contact portions between the resin substrates increase. As a result, the number of portions used for bonding the resin substrates increases, and in this state, the resin substrates can be bonded firmly by melting the bonding surfaces of the resin substrates by laser irradiation. . Even in the case of joining by ultrasonic welding, it is possible to achieve particularly strong joining at the channel portion by directly contacting the side surface of the channel groove and the protrusion.

  Furthermore, because the resin substrates are in point contact or line contact by the combination of the channel groove and the protrusion, by applying ultrasonic waves in that state, the melting is concentrated only on the contact portion, Resin substrates can be strongly bonded to each other.

  In addition, the gap between the channel groove and the resin substrate is filled by fitting the protrusion into the channel groove and melting the joint surface of the resin substrate in that state. It becomes possible to improve the sealing performance of the flow path formed by the above.

[First Embodiment]
A microchip manufacturing method according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a cross-sectional view of a microchip substrate for explaining a microchip manufacturing method according to a first embodiment of the present invention.

  As shown in FIG. 1A, a channel groove 2 extending along the surface is formed on the surface of the resin microchip substrate 1. In addition, a protrusion 4 extending along the surface is formed on the surface of the resin microchip substrate 3. The channel groove 2 is a groove-like shape extending along the substrate surface, and the protrusion 4 is a convex shape extending along the substrate surface. For the microchip substrate 1, the surface on which the channel groove 2 is formed is on the inside, and for the microchip substrate 3, the surface on which the protrusion 4 is formed is on the inside, and the microchip substrate 1 and the microchip substrate 3 are disposed. The protrusions 4 are fitted into the channel grooves 2 by overlapping. In this state, the surfaces of the microchip substrate 1 and the microchip substrate 3 to be joined are melted to join the microchip substrate 1 and the microchip substrate 3. Thereby, the microchip in which the fine channel is formed is manufactured. The microchip substrate 1 corresponds to an example of the “first resin substrate” of the present invention, and the microchip substrate 3 corresponds to an example of the “second resin substrate” of the present invention.

  The microchip substrate 1 has a through hole formed through the substrate. This through hole is formed in contact with the flow channel groove 2, and becomes an opening connecting the outside and the flow channel groove 2 by joining the microchip substrate 1 and the microchip substrate 3. This opening is a hole for introducing, storing, and discharging the gel, sample, and buffer solution. The shape of the opening may be various shapes other than a circular shape and a rectangular shape. A tube or nozzle provided in the analyzer is connected to the opening, and a gel, sample, or buffer solution is introduced into the channel groove 2 through the tube or nozzle, or the channel groove. Eject from 2. Note that through holes may be formed in the microchip substrate 3 to form openings.

  The shape of the microchip substrates 1 and 3 may be any shape as long as it is easy to handle and analyze. For example, a size of about 10 mm square to 200 mm square is preferable, and 10 mm square to 100 mm square is more preferable. The shape of the microchip substrates 1 and 3 may be matched to the analysis method and the analysis device, and a shape such as a square, a rectangle, or a circle is preferable.

  Further, the thickness of the microchip substrates 1 and 3 is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability. Further, a film-like material may be used for the microchip substrate 3 in which the channel groove is not formed. In that case, the thickness of the microchip substrate 3 is 0.01 to 0.05 mm. It is preferable.

  The channel groove 2 has a rectangular cross section, and the width W of the channel groove 2 is constant in the depth direction of the groove. Both the width and depth of the channel groove 2 are values in the range of 1 μm to 1000 μm. Further, the shape of the channel groove 2 is 10 μm to 200 μm in both width and depth in consideration of the fact that the amount of analysis sample and reagent used can be reduced, the production accuracy of the molding die, transferability, releasability, etc. Although it is preferable that it is a value within the range, it is not particularly limited. Further, the width and depth of the fine channel 11 may be determined according to the use of the microchip.

  The protrusion 4 has a rectangular cross section, and the width L of the protrusion 4 in the width direction of the channel groove 2 is constant in the height direction of the protrusion 4. Further, the depth D of the flow path groove 2 and the height H of the protrusion 4 satisfy the relationship of depth D> height H. Since the depth D of the channel groove 2 is greater than the height H of the projection 4, when the projection 4 is fitted into the channel groove 2, the channel groove is formed by the projection 4. 2 is not completely buried, and a fine channel can be formed by the channel groove 2. In the first embodiment, the width L of the protrusion 4 and the width W of the flow path groove 2 are equal to each other, or 0.001 mm to 0.001 so that the protrusion 4 fits into the flow path groove 2. The width L is narrower than the width W within a range of 1 mm.

  Resin is used for the microchip substrates 1 and 3. Examples of the resin include good moldability (transferability and releasability), high transparency, and low autofluorescence with respect to ultraviolet rays and visible light, but are not particularly limited. Absent. For example, polycarbonate, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, polyethylene terephthalate, nylon 6, nylon 66, polyvinyl acetate, polyvinylidene chloride, polypropylene, polyisoprene, polyethylene, polydimethylsiloxane, cyclic polyolefin, etc. preferable. In particular, polymethyl methacrylate and cyclic polyolefin are preferable. The microchip substrate 1 and the microchip substrate 3 may use the same material or different materials.

(Ultrasonic welding)
Then, as shown in FIG. 1B, the surface on which the channel groove 2 is formed for the microchip substrate 1 is on the inside, and the surface on which the protrusion 4 is formed on the microchip substrate 3 is on the inside. The microchip substrate 1 and the microchip substrate 3 are overlapped with each other by aligning the positions of the channel groove 2 and the protrusion 4. Thereby, the protrusion 4 is fitted into the channel groove 2.

  In a state where the microchip substrate 1 and the microchip substrate 3 are overlapped, the ultrasonic wave is applied to the microchip substrates 1 and 3 to melt the resin on the bonding surface of the microchip substrates 1 and 3. By pressing the microchip substrates 1 and 3, both substrates are bonded. For ultrasonic welding, a known method can be adopted, for example, a method described in JP-A-2005-77239 can be adopted. As an example, the microchip substrates 1 and 3 are joined by applying a pressure of 0.1 N to 5 N while applying a frequency of 10 kHz to 50 kHz.

  In the first embodiment, the projection 4 is fitted into the channel groove 2 so that the side surface of the channel groove 2 and the projection 4 come into contact with each other, and the contact portion between the microchip substrate 1 and the microchip substrate 3. Will increase. As a result, the portion to be used for bonding between the microchip substrate 1 and the microchip substrate 3 is increased. By irradiating ultrasonic waves in this state, the bonding surface between the microchip substrate 1 and the microchip substrate 3 is melted. The microchip substrate 1 and the microchip substrate 3 can be firmly bonded.

  Further, by irradiating the ultrasonic wave in a state where the protrusion 4 is fitted in the channel groove 2, the protrusion 4 generates heat and the protrusion 4 is melted. Thereby, it becomes possible to fill the gap between the channel groove 2 and the microchip substrate 3 and improve the sealing performance of the microchannel formed by the channel groove 2.

  In particular, since the side surface of the protrusion 4 and the side surface of the channel groove 2 are in surface contact, in ultrasonic welding, heat generation at the contacted portion concentrates and the welding proceeds smoothly. As a result, the microchip substrates can be firmly bonded to each other, and the sealing performance of the fine channel can be improved.

  By joining the microchip substrates 1 and 3 as described above, a microchip in which a fine channel is formed by the channel groove 2 as shown in FIG. 1C is manufactured.

  When the microchip substrates 1 and 3 are bonded by ultrasonic welding, the microchip substrates 1 and 3 may be made of a resin that is transmissive to laser light, and may be impermeable to laser light. A resin may be used.

(Laser welding)
Alternatively, the microchip substrate 1 and the microchip substrate 3 may be joined by irradiating the microchip substrate 1 and the microchip substrate 3 with laser instead of ultrasonic irradiation. In the case of joining by laser irradiation, a light absorbent is applied to the surface of the microchip substrate 1 or the microchip substrate 3. For example, a light absorber is applied to the bonding surface of the microchip substrate 1 or the microchip substrate 3 by a dispenser or a stamp method.

  As the light absorber, an infrared absorber or an ultraviolet absorber is used depending on the wavelength of the laser beam.

  After applying the light absorbing agent, as shown in FIG. 1 (b), the microchip substrate 1 has the surface on which the channel groove 2 is formed facing inside, and the microchip substrate 3 is formed with the protrusions 4. The microchip substrate 1 and the microchip substrate 3 are overlapped with the grooved surface 2 being aligned with the positions of the channel grooves 2 and the protrusions 4. Thereby, the protrusion 4 is fitted into the channel groove 2.

  Then, by irradiating the microchip substrate 1 and the microchip substrate 3 with a laser, the laser is absorbed by the light absorber and generates heat at that portion, thereby melting the resin on the bonding surface. In this state, the microchip substrate 1 and the microchip substrate 3 are pressed to join both substrates. Thereby, as shown in FIG.1 (c), the microchip in which the microchannel by the channel | channel groove | channel 2 was formed is manufactured. Laser welding can employ a known method, for example, a method described in JP-A-2005-74796. As an example, the microchip substrates 1 and 3 are joined by scanning the microchip substrates 1 and 3 with an infrared laser having an output of 0.1 to 20 W.

  As described above, the protrusions 4 are fitted into the flow path grooves 2 to increase the number of portions used for joining the microchip substrate 1 and the microchip substrate 3, so that the microchip substrate 1 and the microchip substrate 3 are firmly attached. It becomes possible to join to. Further, the projection 4 generates heat by the laser irradiation, and the projection 4 is melted. Thereby, it becomes possible to fill the gap between the channel groove 2 and the microchip substrate 3 and improve the sealing performance of the microchannel formed by the channel groove 2.

  When the microchip substrates 1 and 3 are bonded by laser welding, a resin that is transparent to laser light is used for the microchip substrates 1 and 3. For example, polymethyl methacrylate, cyclic polyolefin, and the like have transparency to laser light having a wavelength of about 800 nm, and therefore these resins are used for the microchip substrates 1 and 3.

  Further, when the microchip substrate 1 is manufactured with a mold, the flow path groove 2 and the positioning portion (mark) are processed at the same time, and when the microchip substrate 3 is manufactured with a mold, the protruding portion 4 and the positioning portion (mark) are processed and manufactured at the same time, so that the alignment at the time of joining becomes simple.

[Second Embodiment]
Next, a microchip manufacturing method according to a second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a cross-sectional view of a microchip substrate for explaining a microchip manufacturing method according to a second embodiment of the present invention.

  In the second embodiment, the side surface of the flow channel groove is tapered, so that the width of the flow channel groove is gradually narrowed in the depth direction of the groove. The microchip substrate 3 described in the first embodiment was used as the microchip substrate on which the protrusions were formed.

  As shown in FIG. 2A, a channel groove 11 extending along the surface is formed on the surface of the resin microchip substrate 10. The channel groove 11 has a groove shape extending along the substrate surface. The side surface of the channel groove 11 is tapered. Thereby, the width of the channel groove 11 becomes the maximum width W1 on the outermost surface of the microchip substrate 10, gradually becomes narrower in the depth direction of the groove, and becomes the minimum width W2 on the bottom surface of the groove. ing. For convenience of explanation, in FIG. 2, the side surface of the channel groove 11 is linear, but it may be curved.

  As in the first embodiment, the depth D of the flow path groove 11 and the height H of the protrusion 4 satisfy the relationship of depth D> height H. Further, the width L of the protrusion 4 and the width W1 on the outermost surface of the flow path groove 11 are equal to each other or 0.001 mm to 0.1 mm so that the protrusion 4 fits into the flow path groove 11. Within the range, the width L is narrower than the width W1. That is, when the width of the channel groove 11 at the position of the depth H (= height H) is the width WH, the relationship of width WH <width L ≦ width W1 is established.

  Furthermore, in the second embodiment, the width L of the protrusion 4 is wider than the width W2 on the bottom surface of the channel groove 11. As a result, the protrusion 4 is fitted into the flow path groove 11, so that the protrusion 4, the flow path groove 11, and the corner of the protrusion 4 are in contact with the side surface of the flow path groove 11. Will be fitted.

  That is, as shown in FIG. 2B, for the microchip substrate 10, the surface on which the channel groove 11 is formed is on the inside, and for the microchip substrate 3, the surface on which the protrusion 4 is formed is on the inside, The microchip substrate 10 and the microchip substrate 3 are overlapped with the groove 11 for flow path and the position of the protrusion 4 aligned. As a result, the protrusion 4 is fitted into the channel groove 11, the corner of the tip of the projection 4 is in contact with the side surface of the channel groove 11, and the protrusion 4 and the channel groove 11 are in this state. Will be mated. The microchip substrate 10 corresponds to an example of the “first resin substrate” of the present invention, and the microchip substrate 3 corresponds to an example of the “second resin substrate” of the present invention.

(Ultrasonic welding)
Then, in the same manner as in the first embodiment, the ultrasonic wave is applied to the microchip substrates 3 and 10 in a state where the microchip substrate 10 and the microchip substrate 3 are overlapped, thereby joining the microchip substrates 3 and 10. The melting is concentrated on the surface, the resin is easily melted, and the microchip substrates 3 and 10 are further pressurized to join both substrates. Thereby, as shown in FIG.2 (c), the microchip in which the microchannel by the channel | channel groove | channel 11 was formed is manufactured.

(Laser welding)
Further, instead of ultrasonic irradiation, the microchip substrate 10 and the microchip substrate 3 may be joined by irradiating the microchip substrate 10 and the microchip substrate 3 with laser as in the first embodiment. In this case, as in the first embodiment, after applying a light absorbent on the surface of the microchip substrate 10 or the microchip substrate 3, the microchip substrates 3 and 10 are stacked, and then laser irradiation is performed to bond the substrates together. Join.

  As described above, by fitting the protrusion 4 to the channel groove 11, the contact portion between the microchip substrate 10 and the microchip substrate 3 becomes a groove end portion. It becomes possible to join firmly. Further, the protrusion 4 generates heat by application of ultrasonic waves or laser irradiation, and the protrusion 4 is melted. As a result, the gap between the channel groove 11 and the microchip substrate 3 can be filled to improve the sealing performance of the microchannel formed by the channel groove 11.

  In particular, since the corner of the tip of the protrusion 4 and the side surface of the channel groove 11 are in point contact, in ultrasonic welding, heat generation at the contacted portion is concentrated and the welding proceeds smoothly. . As a result, the microchip substrates can be firmly bonded to each other, and the sealing performance of the fine channel can be improved.

  Joining flat substrates having a large contact area by ultrasonic welding disperses the energy of ultrasonic application, and it is difficult to achieve strong welding. On the other hand, in 2nd Embodiment, since both board | substrates contact only in the part by which the projection part 4 and the groove | channel 11 for flow paths fit, and energy fits. Concentrate on the part that is. And since welding advances from the part where energy concentrates, smooth and strong welding can be performed.

  In addition, by fitting the protrusion 4 to the channel groove 11, the bonding strength at the end of the groove where sealing performance is required increases, so that the sealing performance can be improved. Also in laser welding, since welding advances from the contact part, the same effect as ultrasonic welding can be produced.

  The shape, size and thickness of the microchip substrate 10 are the same as those of the microchip substrate 1 according to the first embodiment. Furthermore, the microchip substrate 10 is formed with a through hole for connecting the outside and the channel groove 11 similarly to the microchip substrate 1 according to the first embodiment.

[Third Embodiment]
Next, a microchip manufacturing method according to a third embodiment of the invention will be described with reference to FIG. FIG. 3 is a cross-sectional view of a microchip substrate for explaining a microchip manufacturing method according to a third embodiment of the present invention.

  In the third embodiment, the side surface of the protrusion is tapered, so that the width of the protrusion is gradually narrowed in the height direction of the protrusion. The microchip substrate 1 described in the first embodiment was used as the microchip substrate on which the channel grooves were formed.

  As shown in FIG. 3A, a protrusion 21 extending along the surface is formed on the surface of the resin microchip substrate 20. The protrusion 21 is a convex shape extending along the substrate surface. The side surface of the protrusion 21 is tapered. As a result, the width of the protrusion 21 in the width direction of the channel groove 2 becomes the maximum width L1 at the bottom surface of the protrusion 21, gradually becomes narrower toward the tip, and becomes the minimum width L2 at the tip. Yes.

  As in the first embodiment, the depth D of the channel groove 2 and the height H of the protrusion 21 satisfy the relationship of depth D> height H. Further, the width L1 of the protrusion 21 and the width W of the flow path groove 2 are equal to each other or within the range of 0.001 mm to 0.1 mm so that the protrusion 21 fits into the flow path groove 2. The width L1 is wider than the width W. That is, the relationship of width L2 <width W ≦ width L1 is established. The microchip substrate 1 corresponds to an example of the “first resin substrate” of the present invention, and the microchip substrate 20 corresponds to an example of the “second resin substrate” of the present invention.

(Ultrasonic welding)
Then, as shown in FIG. 3B, the surface on which the channel groove 2 is formed for the microchip substrate 1 is on the inside, and the surface on which the protrusion 21 is formed on the microchip substrate 20 is on the inside. The microchip substrate 1 and the microchip substrate 20 are overlapped with each other by aligning the positions of the channel groove 2 and the protrusion 21. Thereby, the protrusion 21 is fitted into the channel groove 2.

  As in the first embodiment, the microchip substrates 1 and 20 are bonded to each other by applying ultrasonic waves to the microchip substrates 1 and 20 with the microchip substrate 1 and the microchip substrate 20 overlapped. The two substrates are joined by melting the resin on the surface and further pressurizing the microchip substrates 1 and 20. Thereby, as shown in FIG.3 (c), the microchip in which the microchannel by the channel | channel groove | channel 2 was formed is manufactured.

(Laser welding)
Further, instead of ultrasonic irradiation, the microchip substrate 1 and the microchip substrate 20 may be bonded by irradiating the microchip substrate 1 and the microchip substrate 20 with laser as in the first embodiment. In this case, as in the first embodiment, after applying a light absorbent to the surface of the microchip substrate 1 or 20, the microchip substrates 1 and 20 are stacked, and then laser irradiation is performed to bond the substrates together. Join.

  As described above, the projecting portion 21 is fitted in the channel groove 2 so that the contact portion between the microchip substrate 1 and the microchip substrate 20 becomes the groove end portion. It becomes possible to join firmly. Further, the gap between the channel groove 2 and the microchip substrate 20 can be filled by the protruding portion 21 to improve the sealing performance of the fine channel formed by the channel groove 2.

  In particular, since the side surface of the protruding portion 21 and the corner portion of the channel groove 2 are in point contact, in ultrasonic welding, heat generation at the contacted portion concentrates and the welding proceeds smoothly. As a result, the microchip substrates can be firmly bonded to each other, and the sealing performance of the fine channel can be improved.

[Fourth Embodiment]
Next, a microchip manufacturing method according to the fourth embodiment of the present invention will be described with reference to FIG. FIG. 4 is a cross-sectional view of a microchip substrate for explaining a microchip manufacturing method according to a fourth embodiment of the present invention.

  In the fourth embodiment, by partially tapering the side surface of a part of the channel groove, the width of the channel groove is gradually reduced to a predetermined depth in the depth direction of the groove, and more The width was constant at the depth of. In addition, by making the side surface of the protruding portion tapered, the width of the protruding portion is gradually narrowed in the height direction (tip) of the protruding portion.

  As shown in FIG. 4A, a flow path groove 31 extending along the surface is formed on the surface of the resin microchip substrate 30. The channel groove 31 has a groove shape extending along the substrate surface. A side surface of a part of the channel groove 31 is tapered. As a result, the width of the channel groove 31 becomes the maximum width W3 on the outermost surface of the microchip substrate 30, gradually decreases to the depth D1 in the depth direction of the groove, and becomes the minimum width W4. The above depth is constant at the width W4. In the fourth embodiment, the side surface of a part of the channel groove 31 is tapered, but all the side surfaces may be tapered as in the second embodiment.

  Further, a projection 41 extending along the surface is formed on the surface of the resin microchip substrate 40. The protrusion 41 has a convex shape extending along the substrate surface. The side surface of the protrusion 41 is tapered. Thereby, the width of the protrusion 41 in the width direction of the flow channel groove 31 becomes the maximum width L3 at the bottom surface of the protrusion 41, gradually decreases toward the tip, and becomes the minimum width L4 at the tip. Yes.

  Further, the depth D of the channel groove 31 and the height H of the protrusion 41 satisfy the relationship of depth D> height H, as in the first embodiment.

  In the fourth embodiment, as an example, the width W4 of the flow path groove 31 is equal to the width L4 of the tip of the protrusion 41, or the width W4 <the width L4 (<width W3), and the flow path groove. The width W3 of 31 and the width L3 of the protrusion 41 are made equal. Furthermore, the height H of the protrusion 41 and the depth D1 of the tapered portion of the channel groove 31 are made equal. As a result, the protrusion 41 is fitted into the tapered portion of the channel groove 31, and the side surface of the projection 41 is the side surface of the channel groove 31 that is tapered. Will come into contact. The microchip substrate 30 corresponds to an example of the “first resin substrate” of the present invention, and the microchip substrate 40 corresponds to an example of the “second resin substrate” of the present invention.

(Ultrasonic welding)
And as shown in FIG.4 (b), about the microchip board | substrate 30, the surface in which the groove | channel 31 for flow paths was formed turned inside, and about the microchip board | substrate 40, the surface in which the projection part 41 was formed turned inside, The microchip substrate 30 and the microchip substrate 40 are overlapped with each other by aligning the positions of the channel groove 31 and the protrusion 41. As a result, the protrusion 41 is fitted into the channel groove 31.

  Then, as in the first embodiment, the microchip substrates 30 and 40 are joined by applying ultrasonic waves to the microchip substrates 30 and 40 in a state where the microchip substrate 30 and the microchip substrate 40 are stacked. The two substrates are joined by melting the resin on the surface and further pressurizing the microchip substrates 30 and 40. Thereby, as shown in FIG.4 (c), the microchip in which the microchannel by the channel | channel groove | channel 31 was formed is manufactured.

(Laser welding)
Further, instead of ultrasonic irradiation, the microchip substrate 30 and the microchip substrate 40 may be joined by irradiating the microchip substrate 30 and the microchip substrate 40 with a laser similarly to the first embodiment. In this case, as in the first embodiment, after applying a light absorbent on the surface of the microchip substrate 30 or the microchip substrate 40, the microchip substrates 30 and 40 are stacked, and then laser irradiation is performed to bond the substrates together. Join.

  As described above, by fitting the protrusion 41 to the flow path groove 31, the tapered side surface of the protrusion 41 comes into contact with the tapered side surface of the flow path groove 31. The contact portion between the microchip substrate 30 and the microchip substrate 40 is a groove end portion. Thereby, the microchip substrate 30 and the microchip substrate 40 can be firmly bonded. Further, the gap between the channel groove 31 and the microchip substrate 40 can be filled by the protrusion 41 to improve the sealing performance of the fine channel formed by the channel groove 31.

  In particular, since the side surface of the protrusion 41 and the tapered side surface of the channel groove 31 are in line contact, heat generation at the contacted portion is concentrated in ultrasonic welding, and the welding proceeds smoothly. . As a result, the microchip substrates can be firmly bonded to each other, and the sealing performance of the fine channel can be improved.

[Fifth Embodiment]
Next, a microchip manufacturing method according to a fifth embodiment of the invention will be described with reference to FIG. FIG. 5 is a cross-sectional view of a microchip substrate for explaining a microchip manufacturing method according to a fifth embodiment of the present invention.

  In the fifth embodiment, the side surface of the protrusion is a curved surface, and the width of the protrusion is gradually narrowed in the height direction (tip) of the protrusion. The microchip substrate 1 described in the first embodiment was used as the microchip substrate on which the channel grooves were formed.

  As shown in FIG. 5A, a protrusion 51 extending along the surface is formed on the surface of the resin microchip substrate 50. The protrusion 51 has a convex shape extending along the substrate surface. The side surface of the protrusion 51 is a curved surface. The width of the protrusion 51 in the width direction of the flow channel groove 2 is the maximum width L5 at the bottom surface of the protrusion 51, and gradually decreases toward the tip.

  As in the first embodiment, the depth D of the channel groove 2 and the height H of the protrusion 51 satisfy the relationship of depth D> height H. Further, the width L5 of the bottom surface of the projection 51 and the width W of the channel groove 2 are equal to each other or within the range of 0.001 mm to 0.1 mm so that the projection 51 fits into the channel groove 2. Thus, the width L5 is wider than the width W. The microchip substrate 1 corresponds to an example of the “first resin substrate” of the present invention, and the microchip substrate 50 corresponds to an example of the “second resin substrate” of the present invention.

(Ultrasonic welding)
And as shown in FIG.5 (b), about the microchip board | substrate 1, let the surface in which the groove | channel 2 for flow paths was formed inside, and about the microchip board | substrate 50, let the surface in which the protrusion part 51 was formed inside. The microchip substrate 1 and the microchip substrate 50 are overlapped with each other by aligning the positions of the channel groove 2 and the protrusion 51. Thereby, the protrusion 51 is fitted into the channel groove 2.

  As in the first embodiment, the microchip substrates 1 and 50 are bonded to each other by applying ultrasonic waves to the microchip substrates 1 and 50 in a state where the microchip substrate 1 and the microchip substrate 50 are overlapped. The two substrates are joined by melting the resin on the surface and further pressurizing the microchip substrates 1 and 50. Thereby, as shown in FIG.5 (c), the microchip in which the microchannel by the channel | channel groove | channel 2 was formed is manufactured.

(Laser welding)
Further, instead of ultrasonic irradiation, the microchip substrate 1 and the microchip substrate 50 may be joined by irradiating the microchip substrate 1 and the microchip substrate 50 with laser as in the first embodiment. In this case, as in the first embodiment, after applying a light absorbent on the surface of the microchip substrate 1 or the microchip substrate 50, the microchip substrates 1 and 50 are stacked, and then laser irradiation is performed to bond the substrates together. Join.

  As described above, the protrusion 51 is fitted into the flow channel groove 2, so that the curved side surface of the protrusion 51 is in contact with the side surface of the flow channel groove 2. The contact portion of the chip substrate 50 becomes the groove end. As a result, the microchip substrate 1 and the microchip substrate 50 can be firmly bonded. Further, the gap between the channel groove 2 and the microchip substrate 50 can be filled by the protruding portion 51, and the sealing performance of the fine channel formed by the channel groove 2 can be improved.

  In particular, since the side surface of the projection 51 is curved, the side surface of the projection 51 and the corner of the channel groove 2 are in line contact. Therefore, in ultrasonic welding, heat generation at the contacted portion concentrates and melting proceeds smoothly. As a result, the microchip substrates can be firmly bonded to each other, and the sealing performance of the fine channel can be improved.

[Sixth Embodiment]
Next, a microchip manufacturing method according to a sixth embodiment of the invention will be described with reference to FIG. FIG. 6 is a cross-sectional view of a microchip substrate for explaining a microchip manufacturing method according to a sixth embodiment of the present invention.

  In the sixth embodiment, the side surface of the protrusion is a curved surface, and the width of the protrusion is gradually narrowed in the height direction (tip) of the protrusion. Moreover, by making the side surface of a part of the groove for the flow path into a tapered shape, the width of the groove for the flow path is gradually narrowed to a predetermined depth in the depth direction of the groove, and at a depth greater than that, The width was made constant.

  As shown in FIG. 6A, a channel groove 61 extending along the surface is formed on the surface of the resin microchip substrate 60. The channel groove 61 has a groove shape extending along the substrate surface. A side surface of a part of the channel groove 61 is tapered. As a result, the width of the channel groove 61 becomes the maximum width W5 on the outermost surface of the microchip substrate 60, gradually becomes narrower to the depth D2 in the depth direction of the groove, and becomes the minimum width W6. At a depth greater than that, the width W6 is constant. In the sixth embodiment, a part of the side surface of the channel groove 61 is tapered, but all the side surfaces may be tapered as in the second embodiment.

  In the sixth embodiment, a microchip is manufactured by joining a microchip substrate 60 and a microchip substrate 50 on which a protruding portion 51 having a curved side surface is formed.

  As in the first embodiment, the depth D of the channel groove 61 and the height H of the protrusion 51 satisfy the relationship of depth D> height H. In the sixth embodiment, as an example, the width W5 of the channel groove 61 and the width L5 of the protrusion 51 are made equal. As a result, the protrusion 51 is fitted into the tapered portion of the channel groove 61 so that the side surface of the projection 51 contacts the tapered side surface of the channel groove 61. Will do. The microchip substrate 60 corresponds to an example of the “first resin substrate” of the present invention, and the microchip substrate 50 corresponds to an example of the “second resin substrate” of the present invention.

(Ultrasonic welding)
Then, as shown in FIG. 6B, the surface on which the channel groove 61 is formed for the microchip substrate 60 is on the inside, and the surface on which the protrusion 51 is formed on the microchip substrate 50 is on the inside. The microchip substrate 50 and the microchip substrate 60 are overlapped with each other by aligning the positions of the channel groove 61 and the protrusion 51. Thereby, the protrusion 51 is fitted into the channel groove 61.

  Then, as in the first embodiment, the ultrasonic wave is applied to the microchip substrates 50 and 60 in a state where the microchip substrate 50 and the microchip substrate 60 are overlapped, thereby joining the microchip substrates 50 and 60. The resin on the surface is melted, and the microchip substrates 50 and 60 are further pressurized to bond both substrates. Thereby, as shown in FIG.6 (c), the microchip in which the microchannel by the channel | channel groove | channel 61 was formed is manufactured.

(Laser welding)
Further, instead of ultrasonic irradiation, the microchip substrate 50 and the microchip substrate 60 may be joined by irradiating the microchip substrate 50 and the microchip substrate 60 with laser as in the first embodiment. In this case, as in the first embodiment, after applying a light absorbent on the surface of the microchip substrate 50 or the microchip substrate 60, the microchip substrates 50 and 60 are stacked, and then laser irradiation is performed to bond the substrates together. Join.

  As described above, by fitting the projection 51 to the channel groove 61, the curved side surface of the projection 51 contacts the tapered side surface of the channel groove 61. A contact portion between the microchip substrate 50 and the microchip substrate 60 is a groove end portion. Thereby, the microchip substrate 50 and the microchip substrate 60 can be firmly bonded. Further, the gap between the channel groove 61 and the microchip substrate 50 can be filled by the protrusion 51, and the sealing performance of the fine channel formed by the channel groove 61 can be improved.

  In particular, since the side surface of the projection 51 is curved, the side surface of the projection 51 and the corner of the channel groove 61 are in line contact. Therefore, in ultrasonic welding, heat generation at the contacted portion concentrates and melting proceeds smoothly. As a result, the microchip substrates can be firmly bonded to each other, and the sealing performance of the fine channel can be improved.

[Seventh Embodiment]
Next, a microchip manufacturing method according to a seventh embodiment of the invention will be described with reference to FIGS. 7 to 9 are cross-sectional views of a microchip substrate for explaining a microchip manufacturing method according to a seventh embodiment of the present invention.

  In a microchip in which a microchannel is formed, fluid must not ooze out of the microchannel, and ensuring the sealing performance of the microchannel is an important joining requirement. In addition, since it is necessary to transfer the fine channel grooves to the microchip substrate with high accuracy, it is difficult to ensure the flatness of the microchip substrate at the same time. When microchip substrates having poor planarity are joined together, it is difficult to ensure adhesion at the joining surface, and sealing performance and adhesion strength at joining are not sufficient.

  Therefore, in the seventh embodiment, the microchip substrates are intentionally warped in a predetermined direction to limit the pressure positions of the substrates at the time of joining the microchip substrates. Improve adhesion.

  For example, as shown in FIG. 7A, a microchip substrate 70 having a channel groove 71 formed on the surface and a microchip substrate 80 having a projection 81 formed on the surface are bonded. The channel groove 71 has a groove shape extending along the substrate surface, and the protrusion 81 has a convex shape extending along the substrate surface.

  The entire microchip substrate 70 is warped so that the surface on which the channel groove 71 is formed is a convex surface. Similarly, the entire microchip substrate 80 is warped so that the surface on which the protrusions 81 are formed is a convex surface. In this way, the microchip substrates 70 and 80 in which the entire substrate is intentionally warped so that the bonding surface becomes a convex surface are manufactured. The warp of the microchip substrates 70 and 80 may be 1 to 10 μm, for example. That is, the height difference between the center of the substrate and the end of the substrate may be 1 to 10 μm.

  Then, as shown in FIG. 7A, the surface on which the channel groove 71 is formed for the microchip substrate 70 is on the inside, and the surface on which the protrusion 81 is formed on the microchip substrate 80 is on the inside. The microchannel substrate 70 and the microchip substrate 80 are joined by aligning the flow path grooves 71 and the protrusions 81. At this time, as shown in FIG. 7A, the microchip substrate 70 is placed on a flat table 90 and the peripheral portions of the microchip substrates 70 and 80 are pressurized, whereby the microchip substrates 70 and 80 are pressed. Join. As a result, as shown in FIG. 7B, it is possible to manufacture a microchip in which the protrusion 81 is fitted into the channel groove 71 and a fine channel is formed by the channel groove 71. .

  By joining in this way, both substrates become compatible and it becomes possible to ensure adhesion over the entire joining surface of the microchip substrate. In other words, by deliberately warping the microchip substrates 70 and 80 so that the bonding surfaces are convex, the pressing position of the substrates when the microchip substrates 70 and 80 are bonded to each other is limited. By applying pressure, the adhesion between the microchip substrates can be improved, and the substrates can be easily joined together. As a result, it becomes possible to improve the sealing performance of the flow path.

  Further, as shown in FIG. 8A, a microchip substrate 100 having a channel groove 101 formed on the surface and a microchip substrate 110 having a projection 111 formed on the surface are bonded. The channel groove 101 has a groove shape extending along the substrate surface, and the protrusion 111 has a convex shape extending along the substrate surface.

  The entire substrate of the microchip substrate 100 is warped so that the surface on which the channel groove 101 is formed is concave. Similarly, the entire microchip substrate 110 is warped so that the surface on which the protrusions 111 are formed is concave. In this way, the microchip substrates 100 and 110 in which the entire substrate is intentionally warped so that the bonding surface is concave are produced.

  Then, as shown in FIG. 8A, the surface on which the channel groove 101 is formed for the microchip substrate 100 is on the inside, and the surface on which the protrusion 111 is formed on the microchip substrate 110 is on the inside. The microchip substrate 100 and the microchip substrate 110 are joined by aligning the channel groove 101 and the protrusion 111. At this time, as shown in FIG. 8A, the microchip substrate 100 is placed on the table 90, and the central portions of the microchip substrates 100 and 110 are pressurized to join the microchip substrates 100 and 110 together. . As a result, as shown in FIG. 8B, it is possible to manufacture a microchip in which the protrusion 111 is fitted in the flow channel groove 101 and a fine flow channel is formed by the flow channel groove 101. .

  By bonding in this way, it becomes possible to ensure adhesion over the entire bonding surface of the microchip substrate. That is, by deliberately warping the microchip substrates 100 and 110 so that the bonding surfaces are concave, the pressing position of the substrates at the time of bonding the microchip substrates 100 and 110 is limited, By applying pressure, the adhesion between the microchip substrates can be improved, and the substrates can be easily joined together. As a result, it becomes possible to improve the sealing performance of the flow path.

  The bonding between the microchip substrates is performed by ultrasonic welding, laser welding, or bonding with an adhesive.

  In the case of ultrasonic welding, the microchip substrates are pressed by a horn that emits ultrasonic waves, and the microchip substrates are bonded to each other by applying ultrasonic waves to the microchip substrates while pressing the microchip substrates with the horn. For example, as shown in FIG. 7, when joining microchip substrates having convex surfaces, the entire surface of the microchip substrate 80 is pressed by a horn that emits ultrasonic waves, and the peripheral portion of the microchip substrate 80 is moved by the horn. The microchip substrates 70 and 80 are joined by irradiating the microchip substrates 70 and 80 with ultrasonic waves while applying pressure. Also, as shown in FIG. 8, when bonding microchip substrates having concave bonding surfaces, the entire surface of the microchip substrate 100 is pressed by a horn that emits ultrasonic waves, and the central portion of the microchip substrate 100 is pressed by the horn. The microchip substrates 100 and 110 are joined by irradiating the microchip substrates 100 and 110 with ultrasonic waves while applying pressure.

  In the case of laser fusion, for example, as shown in FIG. 9A, the microchip substrate 110 is pressed by a flat substrate 120 that transmits a laser having a wavelength used for fusion, and the substrate 120 As shown in FIG. 9B, the microchip substrates are bonded to each other by irradiating the laser while applying pressure to the central portion of the microchip substrates. For example, a glass substrate is used as the substrate 120. In the example shown in FIG. 9, the case where the microchip substrate 100 and the microchip substrate 110 having a concave bonding surface are bonded is described. However, the microchip substrate 70 and the microchip substrate having a convex bonding surface are described. Also when the chip substrate 80 is bonded, the microchip substrates may be bonded to each other by pressing the microchip substrates with the substrate 120 and irradiating the laser.

  As the microchip substrates 70 and 100 in which the channel grooves are formed, the microchip substrate in which the channel grooves described in the first to sixth embodiments are formed can be used. In addition, the microchip substrates 80 and 110 on which the protrusions are formed can be the microchip substrates on which the protrusions described in the first to sixth embodiments are formed.

(Example)
Next, specific examples will be described.

(Example 1)
In Example 1, a specific example of the microchip manufacturing method according to the first embodiment will be described.

(Microchip substrate)
A transparent polyolefin resin cyclic polyolefin resin (Zeonor, manufactured by Nippon Zeon Co., Ltd.) is molded by an injection molding machine, and a plurality of flow channel grooves having a width of 50 μm and a depth of 50 μm are formed on a plate member having an outer dimension of 50 mm × 50 mm × 1 mm. A flow path side microchip substrate constituted by a plurality of through holes having an inner diameter of 2 mm was produced. This flow path side microchip substrate corresponds to the microchip substrate 1 in which the flow path grooves 2 in the first embodiment are formed.
Similarly, a cover-side microchip substrate was produced in which a plurality of protrusions having a width of 50 μm and a height of 10 μm were formed on a plate-like member having an outer dimension of 50 mm × 50 mm × 1 mm.
The plurality of channel grooves formed on the channel side microchip substrate and the plurality of protrusions formed on the cover side microchip substrate have the same pattern.
This cover side microchip substrate corresponds to the microchip substrate 3 on which the protrusions 4 in the first embodiment are formed.

(Join by laser welding)
And the flow path side microchip board | substrate and the cover side microchip board | substrate were joined by laser welding. First, a light absorbent was applied to the surface of the flow path side microchip substrate by a stamp method. As the light absorber, Clearweld manufactured by GENTEX was used as an infrared absorber. Then, the flow path side microchip substrate has the flow path groove on the inside, the cover side microchip substrate has the protrusion on the inner side, and the flow path groove and the protrusion are aligned with each other. A side microchip substrate was stacked. Thereby, the protrusion was fitted into the channel groove.

And both substrates were joined by pressing a substrate, irradiating a laser with respect to both substrates. Laser irradiation conditions and pressurizing conditions are shown below.
Scanning speed while irradiating at an output of 5 W using an infrared laser having a wavelength of 808 nm and a spot diameter of φ0.6 mm in a state where the flow path side microchip substrate and the cover side microchip substrate are pressurized with a pressure of 100 N. : Both substrates were joined by scanning the entire surface at 10 mm / sec.

(Evaluation)
As described above, by performing ultrasonic welding in a state where the protrusion is fitted in the channel groove, the channel-side microchip substrate and the cover-side microchip substrate can be firmly bonded. Moreover, the sealing performance of the fine channel formed by the channel groove was improved.

  As a method for evaluating the sealing performance of the fine channel, for example, a colored liquid (for example, water) was injected into the fine channel at a pressure of 150 kPa, and leakage and bleeding were observed with a microscope. The sealing performance of the fine flow path was evaluated based on the presence or absence of leakage or bleeding. In the microchip produced by the method according to Example 1, no leakage or bleeding was observed, and it was confirmed that the sealing property was good.

  When a plurality of independent microchannels are formed close to each other, each microchannel is filled with a conductive fluid, and a voltage of several thousand to several tens of thousands of volts is applied to provide insulation. An alternative evaluation was performed as an index. The microchip manufactured by the method according to Example 1 showed good insulation. Thereby, it was confirmed that sealing performance is favorable.

  In the first embodiment, the flow path side microchip substrate and the cover side microchip substrate are joined by laser welding, but both substrates may be joined by ultrasonic welding.

(Example 2)
In Example 2, a specific example of the microchip manufacturing method according to the second embodiment will be described.

(Microchip substrate)
A transparent polyolefin resin cyclic polyolefin resin (manufactured by Nippon Zeon Co., Ltd., ZEONOR) is molded by an injection molding machine, a plate-like member having an outer dimension of 50 mm × 50 mm × 1 mm, a plurality of flow path grooves with tapered sides, A flow path side microchip substrate composed of a plurality of through holes having an inner diameter of 2 mm was produced. The width of the channel groove is 60 μm at the maximum on the substrate surface, gradually narrows in the depth direction of the groove, and 50 μm at the bottom of the groove. Further, the depth of the channel groove is 50 μm.
This flow path side microchip substrate corresponds to the microchip substrate 10 in which the flow path grooves 11 in the second embodiment are formed.
Further, a cover-side microchip substrate was produced in which a plurality of protrusions having a width of 58 μm and a height of 15 μm were formed on a plate-like member having an outer dimension of 50 mm × 50 mm × 1 mm.
The plurality of channel grooves formed on the channel side microchip substrate and the plurality of protrusions formed on the cover side microchip substrate have the same pattern.
This cover-side microchip substrate corresponds to the microchip substrate 3 on which the protrusions 4 are formed in the second embodiment.

(Joining by ultrasonic welding)
And the flow path side microchip board | substrate and the cover side microchip board | substrate were joined by ultrasonic welding. First, the flow path side microchip substrate has the flow path groove on the inside, the cover side microchip substrate has the protrusion on the inner side, and the flow path groove and the protrusion are aligned to match the flow path side microchip substrate and the cover. A side microchip substrate was stacked. Thereby, the protrusion was fitted into the channel groove.

And both substrates were joined by pressing a substrate, applying an ultrasonic wave with respect to both substrates. The ultrasonic irradiation conditions and pressurizing conditions are shown below.
In a state where the flow path side microchip substrate and the cover side microchip substrate were pressurized with a pressing force of 0.5 N, both substrates were bonded by applying an ultrasonic wave having a frequency of 15 kHz for 1 second.

(Evaluation)
As described above, by performing ultrasonic welding in a state where the protrusion is fitted in the channel groove, the channel-side microchip substrate and the cover-side microchip substrate can be firmly bonded. Moreover, the sealing performance of the fine channel formed by the channel groove was improved. Also, in the evaluation of the sealing performance due to liquid leakage and bleeding, no leakage or bleeding was observed, and it was confirmed that the sealing performance was good.

  In Example 2, the flow path side microchip substrate and the cover side microchip substrate are bonded by ultrasonic welding, but both substrates may be bonded by laser welding.

(Example 3)
In Example 3, a specific example of the microchip manufacturing method according to the third embodiment will be described.

(Microchip substrate)
A transparent polyolefin resin cyclic polyolefin resin (Zeonor, manufactured by Nippon Zeon Co., Ltd.) is molded by an injection molding machine, and a plurality of flow channel grooves having a width of 50 μm and a depth of 50 μm are formed on a plate member having an outer dimension of 50 mm × 50 mm × 1 mm. A flow path side microchip substrate constituted by a plurality of through holes having an inner diameter of 2 mm was produced. This flow path side microchip substrate corresponds to the microchip substrate 1 in which the flow path grooves 2 in the third embodiment are formed.
Further, a cover-side microchip substrate was produced in which a plurality of protrusions with tapered side surfaces were formed on a plate-like member having an outer dimension of 50 mm × 50 mm × 1 mm. The width of the projection is 49 μm at the maximum at the bottom of the projection, gradually narrows toward the tip, and is at least 48 μm at the tip. The height of the protrusion is 15 μm.
The plurality of channel grooves formed on the channel side microchip substrate and the plurality of protrusions formed on the cover side microchip substrate have the same pattern.
This cover-side microchip substrate corresponds to the microchip substrate 20 on which the protrusions 21 are formed in the third embodiment.

(Joining)
Then, in the same manner as in Example 1 or Example 2, the flow path side microchip substrate and the cover side microchip substrate were joined by ultrasonic welding or laser welding. The conditions for ultrasonic welding and laser welding are the same as those in Example 1.

(Evaluation)
As described above, by performing ultrasonic welding in a state where the protrusion is fitted in the channel groove, the channel-side microchip substrate and the cover-side microchip substrate can be firmly bonded. Moreover, the sealing performance of the fine channel formed by the channel groove was improved. Also, in the evaluation of the sealing performance due to liquid leakage and bleeding, no leakage or bleeding was observed, and it was confirmed that the sealing performance was good.

Example 4
In Example 4, a specific example of the microchip manufacturing method according to the fourth embodiment will be described.

(Microchip substrate)
A transparent polyolefin resin cyclic polyolefin resin (Zeonor, manufactured by Nippon Zeon Co., Ltd.) is molded by an injection molding machine, and a plate-like member having an outer dimension of 50 mm × 50 mm × 1 mm, a part of which is tapered with a plurality of channel grooves A flow path side microchip substrate constituted by a plurality of through holes having an inner diameter of 2 mm was produced. The width of the channel groove is 60 μm at the maximum on the substrate surface, gradually narrows to a depth of 20 μm in the depth direction of the groove to a minimum width of 50 μm, and constant at a width of 50 μm at a depth greater than that. It has become. The depth of the channel groove is 50 μm.
This flow path side microchip substrate corresponds to the microchip substrate 30 in which the flow path grooves 31 in the fourth embodiment are formed.
Further, a cover-side microchip substrate was produced in which a plurality of protrusions with tapered side surfaces were formed on a plate-like member having an outer dimension of 50 mm × 50 mm × 1 mm. The width of the projection is 58 μm at the maximum at the bottom of the projection, gradually narrows toward the tip, and 55 μm at the tip. Further, the height of the protrusion is 15 μm.
The plurality of channel grooves formed on the channel side microchip substrate and the plurality of protrusions formed on the cover side microchip substrate have the same pattern.
This cover-side microchip substrate corresponds to the microchip substrate 40 on which the protrusion 41 in the fourth embodiment is formed.

(Joining)
Then, in the same manner as in Example 1 or Example 2, the flow path side microchip substrate and the cover side microchip substrate were joined by ultrasonic welding or laser welding. The conditions for ultrasonic welding and laser welding are the same as those in Example 1.

(Evaluation)
As described above, by performing ultrasonic welding in a state where the protrusion is fitted in the channel groove, the channel-side microchip substrate and the cover-side microchip substrate can be firmly bonded. Moreover, the sealing performance of the fine channel formed by the channel groove was improved. Also, in the evaluation of the sealing performance due to liquid leakage and bleeding, no leakage or bleeding was observed, and it was confirmed that the sealing performance was good.

(Example 5)
In Example 5, a specific example of the microchip manufacturing method according to the fifth embodiment will be described.

(Microchip substrate)
A transparent polyolefin resin cyclic polyolefin resin (Zeonor, manufactured by Nippon Zeon Co., Ltd.) is molded by an injection molding machine, and a plurality of flow channel grooves having a width of 50 μm and a depth of 50 μm are formed on a plate member having an outer dimension of 50 mm × 50 mm × 1 mm. A flow path side microchip substrate constituted by a plurality of through holes having an inner diameter of 2 mm was produced. This flow path side microchip substrate corresponds to the microchip substrate 1 in which the flow path grooves 2 in the fifth embodiment are formed.
Further, a cover-side microchip substrate in which a plurality of protrusions having curved side surfaces was formed on a plate-like member having an outer dimension of 50 mm × 50 mm × 1 mm was produced. The width of the protrusion is 55 μm at the maximum at the bottom of the protrusion, and gradually decreases toward the tip. The height of the protrusion is 15 μm.
The plurality of channel grooves formed on the channel side microchip substrate and the plurality of protrusions formed on the cover side microchip substrate have the same pattern.
This cover-side microchip substrate corresponds to the microchip substrate 50 on which the protrusions 51 are formed in the fifth embodiment.

(Joining)
Then, in the same manner as in Example 1 or Example 2, the flow path side microchip substrate and the cover side microchip substrate were joined by ultrasonic welding or laser welding. The conditions for ultrasonic welding and laser welding are the same as those in Example 1.

(Evaluation)
As described above, by performing ultrasonic welding in a state where the protrusion is fitted in the channel groove, the channel-side microchip substrate and the cover-side microchip substrate can be firmly bonded. Moreover, the sealing performance of the fine channel formed by the channel groove was improved. Also, in the evaluation of the sealing performance due to liquid leakage and bleeding, no leakage or bleeding was observed, and it was confirmed that the sealing performance was good.

(Example 6)
In Example 6, a specific example of the microchip manufacturing method according to the sixth embodiment will be described.

(Microchip substrate)
A transparent polyolefin resin cyclic polyolefin resin (Zeonor, manufactured by Nippon Zeon Co., Ltd.) is molded by an injection molding machine, and a plate-like member having an outer dimension of 50 mm × 50 mm × 1 mm, a part of which is tapered with a plurality of channel grooves A flow path side microchip substrate constituted by a plurality of through holes having an inner diameter of 2 mm was produced. The width of the channel groove is 60 μm at the maximum on the substrate surface, gradually narrows to a depth of 20 μm in the depth direction of the groove to a minimum width of 50 μm, and constant at a width of 50 μm at a depth greater than that. It has become. The depth of the channel groove is 50 μm.
This flow path side microchip substrate corresponds to the microchip substrate 60 in which the flow path groove 61 in the sixth embodiment is formed.
Further, a cover-side microchip substrate in which a plurality of protrusions having curved side surfaces was formed on a plate-like member having an outer dimension of 50 mm × 50 mm × 1 mm was produced. The width of the protrusion is 60 μm at the maximum at the bottom of the protrusion and gradually decreases toward the tip. The height of the protrusion is 15 μm.
The plurality of channel grooves formed on the channel side microchip substrate and the plurality of protrusions formed on the cover side microchip substrate have the same pattern.
This cover-side microchip substrate corresponds to the microchip substrate 50 on which the protrusions 51 are formed in the sixth embodiment.

(Joining)
Then, in the same manner as in Example 1 or Example 2, the flow path side microchip substrate and the cover side microchip substrate were joined by ultrasonic welding or laser welding. The conditions for ultrasonic welding and laser welding are the same as those in Example 1.

(Evaluation)
As described above, by performing ultrasonic welding in a state where the protrusion is fitted in the channel groove, the channel-side microchip substrate and the cover-side microchip substrate can be firmly bonded. Moreover, the sealing performance of the fine channel formed by the channel groove was improved. Also, in the evaluation of the sealing performance due to liquid leakage and bleeding, no leakage or bleeding was observed, and it was confirmed that the sealing performance was good.

(Comparative example)
Next, a comparative example for the above embodiment will be described.

(Microchip substrate)
A transparent polyolefin resin cyclic polyolefin resin (Zeonor, manufactured by Nippon Zeon Co., Ltd.) is molded by an injection molding machine, and a plurality of flow channel grooves having a width of 50 μm and a depth of 50 μm are formed on a plate member having an outer dimension of 50 mm × 50 mm × 1 mm. A flow path side microchip substrate constituted by a plurality of through holes having an inner diameter of 2 mm was produced. Further, a flat cover-side microchip substrate having an outer dimension of 50 mm × 50 mm × 1 mm was produced.

(Joining)
Then, in the same manner as in Example 1 or Example 2, the flow path side microchip substrate and the cover side microchip substrate were joined by ultrasonic welding or laser welding. The conditions for ultrasonic welding and laser welding are the same as those in Example 1.

(Evaluation)
In the same manner as in Example 1, a colored liquid was injected into the fine flow path at a pressure of 150 kPa, and leakage and bleeding were observed with a microscope. In the microchip manufactured by the method according to the comparative example, leakage and bleeding of the colored fluid were partially observed as a result of microscopic observation.

  As described above, according to the example of the present invention, compared to the comparative example, the microchip substrates can be firmly bonded to each other, and the sealing performance of the fine channel can be improved. In addition, the material of the microchip substrate, the dimension of the groove for the flow path, the dimension of the protrusion, the condition for ultrasonic welding, and the condition for laser welding described in Examples 1 to 6 are only one example. It is not limited to these conditions.

It is sectional drawing of the microchip board | substrate for demonstrating the manufacturing method of the microchip which concerns on 1st Embodiment of this invention. It is sectional drawing of the microchip board | substrate for demonstrating the manufacturing method of the microchip which concerns on 2nd Embodiment of this invention. It is sectional drawing of the microchip board | substrate for demonstrating the manufacturing method of the microchip which concerns on 3rd Embodiment of this invention. It is sectional drawing of the microchip board | substrate for demonstrating the manufacturing method of the microchip which concerns on 4th Embodiment of this invention. It is sectional drawing of the microchip board | substrate for demonstrating the manufacturing method of the microchip which concerns on 5th Embodiment of this invention. It is sectional drawing of the microchip board | substrate for demonstrating the manufacturing method of the microchip which concerns on 6th Embodiment of this invention. It is sectional drawing of the microchip board | substrate for demonstrating the manufacturing method of the microchip which concerns on 7th Embodiment of this invention. It is sectional drawing of the microchip board | substrate for demonstrating the manufacturing method of the microchip which concerns on 7th Embodiment of this invention. It is sectional drawing of the microchip board | substrate for demonstrating the manufacturing method of the microchip which concerns on 7th Embodiment of this invention.

Explanation of symbols

1, 3, 10, 20, 30, 40, 50, 60, 70, 80, 100, 110 Microchip substrate 2, 11, 31, 61, 71, 101 Channel groove 4, 21, 41, 51, 81 111 Protrusions 90 units 120 Substrate

Claims (14)

  A first resin substrate having a channel groove formed on the surface and a second resin substrate having a projection formed on the surface, the surface having the channel groove formed and the projection With the formed surface facing inward, the channel groove and the projection are aligned, and the first resin substrate and the second resin substrate are overlapped, whereby the projection is connected to the channel. The first resin substrate and the second resin substrate are fitted in the groove, and an ultrasonic wave is applied to the first resin substrate and the second resin substrate in this state. The first resin substrate and the second resin substrate are bonded by melting the surfaces to be bonded and pressurizing the first resin substrate and the second resin substrate. A manufacturing method of a microchip.   The flow path groove is formed of a light transmissive first resin substrate having a flow path groove formed on the surface and a light transmissive second resin substrate having a protrusion formed on the surface. The surface on which the protrusion is formed and the surface on which the protrusion is formed are aligned, the channel groove and the protrusion are aligned, and the first resin substrate and the second through the light absorbent By overlapping the resin substrate, the protrusion is fitted into the channel groove, and in this state, the first resin substrate and the second resin substrate are irradiated with laser. The first resin substrate is obtained by melting a surface of the first resin substrate and the second resin substrate to be joined and pressurizing the first resin substrate and the second resin substrate. And a method of manufacturing a microchip, comprising bonding the second resin substrate.   3. The micro of claim 1, wherein a relationship of depth D> height H is established between the depth D of the channel groove and the height H of the protrusion. Chip manufacturing method.   4. The microchip manufacturing method according to claim 1, wherein a width W of the channel groove is constant in a depth direction of the channel groove. 5.   4. The microchip according to claim 1, wherein a width of at least a part of the channel groove is gradually narrowed in a depth direction of the channel groove. 5. Manufacturing method.   6. The microchip manufacturing method according to claim 1, wherein a width L of the protrusion in the width direction of the flow path groove is constant in a height direction of the protrusion. Method.   6. The micro of any one of claims 1 to 5, wherein a width L of the protrusion in the width direction of the channel groove is gradually narrowed toward the tip of the protrusion. Chip manufacturing method.   The method of manufacturing a microchip according to claim 7, wherein the protrusion has a flat side surface, and the width L gradually decreases toward the tip.   The method of manufacturing a microchip according to claim 7, wherein the protrusion has a curved side surface, and the width L gradually decreases toward the tip.   The width W of the channel groove is gradually narrowed in the depth direction of the channel groove, and the width L of the protrusion in the width direction of the channel groove is the width of the protrusion. 4. The microchip according to claim 1, wherein the microchip is constant in a height direction, and a maximum width of the flow path groove is substantially equal to a width L of the protrusion. 5. Production method.   The width W of the flow path groove is constant in the depth direction of the flow path groove, and the width L of the protrusion in the width direction of the flow path groove gradually increases toward the tip of the protrusion. 4. The method of manufacturing a microchip according to claim 1, wherein a width W of the channel groove is substantially equal to a maximum width of the protrusion. 5.   The width W of the channel groove is gradually narrowed in the depth direction of the channel groove, and the width L of the protrusion in the width direction of the channel groove is the width of the protrusion. 4. The method of manufacturing a microchip according to claim 1, wherein the microchip is gradually narrowed toward the tip.   The width W of the channel groove is constant in the depth direction of the channel groove, the projection has a curved side surface, and the width of the projection in the width direction of the channel groove L is gradually narrowed toward the tip of the protruding portion, and the width W of the channel groove and the maximum width of the protruding portion are substantially equal. 4. The method for producing a microchip according to any one of 3 above.   The width W of the channel groove is gradually narrowed in the depth direction of the channel groove, the protrusion has a curved side surface, and the width direction of the channel groove is The width L of the protruding portion is gradually narrowed toward the tip of the protruding portion, and the maximum width of the channel groove and the maximum width of the protruding portion are substantially equal. The method for manufacturing a microchip according to any one of claims 1 to 3.

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