JP2009166416A - Method for manufacturing microchip, and microchip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a microchip capable of enhancing the bonding strength of a substrate made of a resin prepared by an injection molding method. <P>SOLUTION: The microchip is equipped with the resin-made substrate 10 on the surface of which a channel for a flow path is formed, and a flat plate-like resin-made substrate 20. A projecting part 11 is provided on the outer peripheral part of the resin-made substrate 10. The projecting part 11 is a molded body left in a gate used during injection molding. The dimension of the resin-made substrate 20 is smaller than the dimension of the resin-made substrate 10. In addition, the resin-made substrate 20 is overlapped on the resin-made substrate 10 so that the surface on which the channel for the flow path is formed is made inside, and the surface included within a range within a distance d from a position where the projecting part 11 is formed, is not covered, and by pressing it while it is heated, the microchip is prepared. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a microchip by bonding a resin substrate on which a channel groove is formed, and a microchip manufactured by the bonding.

  A micro-analysis chip that uses microfabrication technology to form fine channels and circuits on silicon and glass substrates, and to perform chemical reactions, separation, and analysis of liquid samples such as nucleic acids, proteins, and blood in a minute space Alternatively, an apparatus called μTAS (Micro Total Analysis Systems) has been put into practical use. As an advantage of such a microchip, it is conceivable to realize an inexpensive system that can be carried in a small space because the amount of sample or reagent used or the amount of discharged waste liquid is reduced.

  A microchip is manufactured by laminating two members having at least one member subjected to fine processing. Conventionally, a glass substrate is used for the microchip, and various fine processing methods have been proposed. However, since glass substrates are not suitable for mass production and are extremely expensive, development of inexpensive and disposable resin microchips is desired.

  As a method of manufacturing a resin microchip, there is a method of joining a resin substrate on which a channel groove is formed and a resin substrate that covers the channel groove. For bonding between resin substrates, a welding method for heating and bonding resin substrates using hot plates, hot air, hot rolls, ultrasonic waves, vibration, laser, etc., and bonding resin substrates using adhesives and solvents Examples include a bonding method for bonding, a method for bonding using the adhesiveness of the resin substrate itself, and a method for bonding substrates by performing a surface treatment such as plasma treatment on the resin substrate.

  However, in the bonding method, there is a problem that an adhesive or a solvent used for bonding oozes out into the flow path and contaminates the flow path. Therefore, in the past, in order to prevent the adhesive or solvent from seeping out into the flow path, a relief portion for allowing the adhesive to escape is formed on the substrate and the cover member in which the flow path groove is formed, The vicinity of the flow path and the other bonding surfaces are divided to bond the resin substrates together (for example, Patent Document 1 and Patent Document 2).

  In addition, when bonding resin substrates by thermocompression bonding using a hot plate or heat laminating using a heat roll, a bonding positioning hole is formed in the resin substrate with a channel groove formed. In addition, the cover member is formed with a predetermined dimension smaller than the resin substrate on which the channel groove is formed so as not to cover the positioning hole (for example, Patent Document 3). .

JP 2004-106508 A JP 2004-136737 A JP 2004-151041 A

  By the way, the joint surface of the resin substrate may be peeled off, and peeling of the joint surface near the flow path causes the analysis sample to leak from the flow path. Even if the separation is a small separation that cannot be confirmed without observation with a microscope, the flow and movement of the analysis sample in the flow path may change. Therefore, strong bonding strength is required for the microchip.

  On the other hand, there are methods such as an injection molding method, a press molding method, and a machining method as a method of molding a resin substrate on which a channel groove is formed. In particular, the injection molding method is excellent in mass productivity. However, according to the injection molding method, the planar accuracy of the surface of the resin substrate including the bonding surface is likely to deteriorate, and the surface accuracy of the molding die is transferred, so that the molding die is also required to have high surface accuracy. In the injection molding method, a resin substrate having a channel groove formed on the surface is manufactured by injecting resin into a cavity space formed by a molding die through an injection molding gate. In the resin substrate produced by this injection molding, the vicinity of the gate portion of the injection molding is particularly easily deformed, and it is difficult to maintain high planar accuracy on the surface in the vicinity of the gate portion.

  Furthermore, among resin substrates, resin substrates with flow channel grooves are not simple plate-shaped resin substrates, so the flow of resin is particularly complicated when molding, and the vicinity of the gate It was more difficult to maintain high plane accuracy on the surface of

  In addition, in order to efficiently inject the resin into the cavity space, a certain length of the width of the gate portion is required, but after injection molding, when the gate portion having such a width is cut. In addition, there is a problem that the plane accuracy is further lowered on the surface in the vicinity of the gate portion due to the cutting stress. As a result, since the planar accuracy in the vicinity of the gate portion is lowered, a gap is generated when two resin substrates are overlapped, the bonding strength between the resin substrates is reduced, and the bonding surface is peeled off. There was a problem that it became easier.

  In the methods described in Patent Document 1 and Patent Document 2 described above, the problem that the planar accuracy of the substrate surface in the vicinity of the injection molding gate portion deteriorates is not solved, and there is also a problem in the variation in bonding strength. Further, since the escape portion for releasing the adhesive is provided, there is a possibility that the planar accuracy of the substrate surface may deteriorate due to the escape portion, and there is a problem that the size of the microchip is increased. Further, even in the method described in Patent Document 3 described above, there is no mention of the problem of reduction in planar accuracy near the gate portion, and the problem that the planar accuracy of the substrate surface near the gate portion in injection molding deteriorates. It has not been solved.

  Further, even when a resin substrate having a channel groove formed thereon is manufactured by an injection molding method, the planar accuracy of the surface can be improved by using heat cycle molding. However, there is a problem that the manufacturing cost of the resin substrate increases due to the introduction of equipment used for heat cycle molding and the prolonged molding cycle. Even if the surface accuracy can be improved, there is a problem that the planar accuracy of the substrate surface in the vicinity of the gate portion deteriorates in the step of separating the molded resin substrate and the injection molded gate portion.

  As described above, there is a problem in that the planarity of the resin substrate deteriorates, so that the adhesion of the bonding surfaces of the two resin substrates decreases, and as a result, the bonding strength of the resin substrates decreases. .

  The present invention solves the above problem, and a method of manufacturing a microchip capable of increasing the bonding strength of a resin substrate manufactured by an injection molding method, and a micro chip having an increased bonding strength of a resin substrate. The purpose is to provide a chip.

In the first aspect of the present invention, a channel groove is formed on the surface of at least one of the two resin substrates, and at least one of the two resin substrates has A microchip manufacturing method in which a through hole is formed and the two resin substrates are joined with the surface on which the channel groove is formed facing inside, and injected into a cavity space formed by a mold By injecting resin through a molding gate part and cutting the gate part, a substrate manufacturing process for producing a resin substrate having the channel groove formed on the surface, and the channel groove are formed. A joining step of joining the two resin substrates with the surface on which the channel groove is formed facing inward so that the surface in the vicinity of the gate portion of the resin substrate is not covered with another resin substrate. And including and being cut The width of the gate portion is 15% or more and 90% or less of the width of the resin substrate on which the channel groove is formed, and the through hole and the channel groove are connected to each other. This is a method for manufacturing a microchip.
According to a second aspect of the present invention, there is provided a microchip manufacturing method according to the first aspect, wherein the resin substrate on which the through hole is formed surrounds the through hole. Protrusions protruding in the thickness direction are provided.
According to a third aspect of the present invention, there is provided a microchip manufacturing method according to the first aspect or the second aspect. In the substrate manufacturing step, a resin is injected through the gate portion. The flow path groove is formed on the surface, and the gate portion is cut, so that the molded body left in the gate portion used at the time of injection molding is left protruding on the outer peripheral portion. A resin substrate is produced, and in the bonding step, the two resin substrates are bonded with the surface on which the flow channel groove is formed inside avoiding the surface in the vicinity of the molded body. And
According to a fourth aspect of the present invention, there is provided a microchip manufacturing method according to any one of the first to third aspects, wherein in the joining step, the surface in the vicinity of the gate portion is avoided and the two The two resin substrates are bonded to each other while avoiding a surface within a range of 1 mm from the corner of one of the resin substrates.
According to a fifth aspect of the present invention, there is provided a microchip manufacturing method according to any one of the first to fourth aspects, wherein in the joining step, one of the two resin substrates is made of resin. The two resin substrates are bonded to each other while avoiding a surface included in a range within 1 mm from all end portions of the substrate.
According to a sixth aspect of the present invention, there is provided a microchip manufacturing method according to any one of the first to fifth aspects, wherein one of the two resin substrates has a surface on one resin substrate. The flow channel groove is formed, and the other resin substrate is a substrate having a shape along the flow channel groove formed in the one resin substrate, and in the bonding step, in the vicinity of the gate portion. The two resin substrates are overlapped on the one resin substrate in accordance with the position of the channel groove formed in the one resin substrate. It is characterized by joining.
According to a seventh aspect of the present invention, there is provided a microchip manufacturing method according to the sixth aspect, wherein all end portions of the other resin substrate are connected to the other resin substrate. Included within the range of 2 mm or less from the channel groove formed on the one resin substrate when the channel is overlapped with the one resin substrate according to the position of the channel groove formed on the substrate. It is characterized by that.
According to an eighth aspect of the present invention, there is provided a microchip manufacturing method according to any one of the first to seventh aspects, wherein the flow path groove includes a plurality of independent grooves that are not connected to each other. The channel groove is formed on the surface of one of the two resin substrates, and the other resin substrate includes a plurality of individual substrates corresponding to the number of the plurality of grooves. In the bonding step, each of the plurality of individual substrates is aligned with each of the plurality of grooves formed on the one resin substrate, and the individual substrate and the one resin substrate are provided for each independent groove. The substrate is bonded to the substrate.
According to a ninth aspect of the present invention, there is provided a microchip manufacturing method according to the eighth aspect, wherein the plurality of individual substrates are formed on the one resin substrate at all ends of the individual substrates. When overlapped with the one resin substrate in accordance with the position of the groove formed, it is included in a range within 2 mm from the groove formed on the one resin substrate.
According to a tenth aspect of the present invention, there is provided a microchip manufacturing method according to any one of the first to ninth aspects, wherein the two resin substrates are made of a thermoplastic resin. And
According to an eleventh aspect of the present invention, there is provided a microchip manufacturing method according to any one of the first to tenth aspects, wherein in the joining step, the two resin substrates are overlapped with each other. The bonding is performed by welding two resin substrates.
A twelfth aspect of the present invention is a method of manufacturing a microchip according to any one of the first to eleventh aspects, wherein a microchip used for electrophoretic analysis is manufactured by the bonding. To do.
According to a thirteenth aspect of the present invention, a channel groove is formed on the surface of at least one resin substrate out of two resin substrates, and at least one resin substrate out of the two resin substrates. Is a microchip in which the two resin substrates are joined with the surface on which the channel groove is formed inside, the through hole and the channel groove The resin substrate on which the channel groove is formed is formed by injecting resin through a gate part of injection molding into a cavity space formed by a molding die and cutting the gate part. A part of the cut gate portion protrudes from the outer peripheral portion of the resin substrate, and the width of the gate portion is 15% of the width of the resin substrate on which the channel groove is formed. Above, 90% or less, the two trees Manufactured substrate, the gate portion surface in the vicinity of the flow the resin substrate road groove is formed, a microchip which is characterized in that it is joined so as not to cover other resin substrate.
A fourteenth aspect of the present invention is the microchip according to the thirteenth aspect, wherein the resin substrate on which the through hole is formed has a thickness direction of the resin substrate around the through hole. A protruding portion that protrudes from the surface is provided.
According to a fifteenth aspect of the present invention, there is provided a microchip according to any one of the thirteenth and fourteenth aspects, wherein a surface in the vicinity of the gate portion is avoided, and one of the two resin substrates. The two resin substrates are bonded to each other while avoiding a surface included in a range within 1 mm from a corner of one resin substrate.
According to a sixteenth aspect of the present invention, there is provided a microchip according to any one of the thirteenth to fifteenth aspects, wherein 1 mm from all ends of one of the two resin substrates. The two resin substrates are bonded to each other while avoiding the surface included in the range.
According to a seventeenth aspect of the present invention, there is provided a microchip according to any one of the thirteenth to sixteenth aspects, wherein the flow path is formed on a surface of one of the two resin substrates. And the other resin substrate is a substrate having a shape along the flow path groove formed in the one resin substrate, and the other resin substrate is in the vicinity of the gate portion. And is bonded to the one resin substrate according to the position of the channel groove formed in the one resin substrate.
An eighteenth aspect of the present invention is the microchip according to the seventeenth aspect, wherein all end portions of the other resin substrate are formed on the one resin substrate. It is included in the range within 2 mm from the groove.
A nineteenth aspect of the present invention is the microchip according to any one of the thirteenth to eighteenth aspects, wherein the flow path groove includes a plurality of independent grooves that are not connected to each other. Of the two resin substrates, the flow path groove is formed on the surface of one resin substrate, and the other resin substrate includes a plurality of individual substrates corresponding to the number of the plurality of grooves. Each of the individual substrates is bonded to the one resin substrate for each independent groove in accordance with the position of each of the plurality of grooves formed in the one resin substrate.
A twentieth aspect of the present invention is the microchip according to the nineteenth aspect, wherein all end portions of the individual substrate are within a range of 2 mm from the groove formed in the one resin substrate. It is included in.
A twenty-first aspect of the present invention is a microchip according to any one of the thirteenth to twentieth aspects, wherein the two resin substrates are made of a thermoplastic resin.
According to a twenty-second aspect of the present invention, there is provided a microchip according to any one of the thirteenth to twenty-first aspects, wherein the two resin substrates are joined by welding.
According to a twenty-third aspect of the present invention, there is provided a microchip according to any one of the thirteenth to twenty-second aspects, wherein the microchip is used for electrophoretic analysis.

  According to the present invention, even if a microchip is manufactured by injection molding in which a portion having poor planar accuracy is likely to occur by joining the resin substrates while avoiding the surface in the vicinity of the gate portion, the surface having relatively poor planar accuracy. This makes it possible to bond the resin substrates together. As a result, the two resin substrates can be bonded using a surface having relatively good planar accuracy as a bonding surface, so that the bonding strength of the microchip can be increased.

[First Embodiment]
A microchip manufacturing method according to a first embodiment of the present invention and a microchip manufactured by the manufacturing method will be described with reference to FIGS. FIG. 1 is a top view of a resin substrate according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view of the resin substrate according to the first embodiment of the present invention, which is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is a top view of the microchip according to the first embodiment of the present invention. 4 is a cross-sectional view of the microchip according to the first embodiment of the present invention, and is a cross-sectional view taken along the line IV-IV in FIG.

  As shown in FIG. 1, a linear channel groove 12 and a linear channel groove 13 are formed on one surface of the resin substrate 10. In this embodiment, as an example, the channel groove 12 and the channel groove 13 are formed on the surface of the resin substrate 10 orthogonally. The channel groove 12 and the channel groove 13 may be formed on the resin substrate 10 without being orthogonal to each other. As shown in FIGS. 1 and 2, through holes 14 are formed in both ends of the flow channel groove 12 and the flow channel groove 13 so as to penetrate in the thickness direction of the resin substrate 10. The through hole 14 is connected to both ends of the channel groove 12 and the channel groove 13.

  Further, a protrusion 11 is provided on a part of the outer peripheral portion of the resin substrate 10. The protrusion 11 is a molded body left in the gate portion used at the time of injection molding. The resin substrate 10 is produced by injection molding. When the resin substrate 10 is manufactured by injection molding, the molding die is provided with a gate portion (injection port) for guiding the resin to the cavity space in the molding die. And when resin hardens | cures and a molded article is formed and cut | disconnected by a gate part, the resin which entered the gate part will also be taken out in the form connected with a part of molded article. The molded body left in the gate portion is provided as a protrusion 11 on the outer peripheral portion of the resin substrate 10. In order to efficiently inject the resin into the cavity space, the length A of the protrusion 11 which is the remnant of the gate portion is 15% or more and 90% or less of the width X of the resin substrate 10. It is more preferable that it is 30% or more and 80% or less.

  As shown in FIGS. 3 and 4, the resin substrate 20 that is the counterpart to which the resin substrate 10 is joined is a flat substrate. A microchip is manufactured by bonding the resin substrate 10 and the resin substrate 20 with the surface on which the channel grooves 12 and 13 are formed facing inward. By this bonding, the resin substrate 20 functions as a lid (cover) for the flow channel grooves 12 and 13, and the flow channel groove 12 formed in the resin substrate 10 becomes a fine flow channel 15. Reference numeral 13 denotes a fine channel 16. Further, through holes 14 are formed in both ends of the flow path groove 12 and the flow path groove 13 in the resin substrate 10, and by joining the resin substrate 10 and the resin substrate 20, Openings 17 are formed in the microchip. As described above, the microchip according to the first embodiment includes the resin substrate 10 and the resin substrate 20. Inside the microchip, a linear microchannel 15 and a microchannel 16 are formed orthogonal to each other, and openings 17 are provided at both ends of the microchannel 15 and the microchannel 16. Is formed.

  In the first embodiment, the resin substrate 10 and the resin substrate 20 are joined while the protrusion 11 remains on the resin substrate 10. This is an example of bonding, and the protrusion 11 may be removed from the resin substrate 10 by cutting or polishing, and then the resin substrate 10 and the resin substrate 20 may be bonded.

  Since the through hole 14 of the resin substrate 10 is connected to the flow path grooves 12 and 13, the opening 17 by the through hole 14 is connected to the fine flow paths 15 and 16. The opening 17 is a hole for introducing, storing, and discharging the gel, sample, and buffer solution. The shape of the opening 17 (through hole 14) may be various shapes other than a circular shape and a rectangular shape. A tube or a nozzle provided in the analyzer is connected to the opening 17, and a gel, a sample, a buffer solution, or the like is introduced into the microchannels 15 and 16 through the tube or nozzle, or the microchannel Samples 15 and 16 are discharged.

  The shapes of the resin substrates 10 and 20 may be any shapes as long as they are easy to handle and analyze. For example, a size of about 10 mm square to 200 mm square is preferable, and 10 mm square to 100 mm square is more preferable. The shapes of the resin substrates 10 and 20 may be matched to the analysis method and the analysis apparatus, and shapes such as a square, a rectangle, and a circle are preferable. Moreover, what is necessary is just to match | combine the internal diameter of the through-hole 14 with an analysis method or an analyzer, for example, it is preferable that it is about 2 mm.

  In the first embodiment, the microchip is formed by joining the resin substrate 10 and the resin substrate 20 while avoiding the surface of the resin substrate 10 in the vicinity of the gate portion used for injection molding. Make it. Specifically, the size of the resin substrate 20 is made smaller than that of the resin substrate 10 on which the flow path grooves 12 and 13 are formed, and the resin substrate 10 and the resin substrate 20 are avoided by avoiding the surface near the gate portion. Join. For example, the resin substrate 10 and the resin substrate 20 are bonded to each other on the bonding surface of the resin substrate 10 while avoiding a range of a predetermined distance d from the outer peripheral portion where the gate portion is provided.

  For example, in the case where the protrusion 11 is bonded to the resin substrate 10 while being left, as shown in FIGS. 3 and 4, the vicinity of the protrusion 11 formed on the resin substrate 10 is avoided, and the resin substrate 10 The resin substrate 20 is bonded. For example, the resin substrate 10 and the resin substrate 20 are bonded to each other on the bonding surface of the resin substrate 10 while avoiding a range of a predetermined distance d from the outer peripheral portion where the protrusions 11 are provided.

  When the resin substrate 10 is manufactured by injection molding, the surface in the vicinity of the gate portion (the surface in the vicinity of the protruding portion 11) is easily deformed, and it is difficult to maintain high planar accuracy. In particular, when a resin substrate that is not a simple flat plate, in which a channel groove is formed, the difficulty is further increased. Further, when cutting at the gate portion, the planar accuracy of the surface near the gate portion is further lowered. For example, on the surface in the vicinity of the gate portion (the surface in the vicinity of the protruding portion 11), the difference between the maximum height and the minimum height of the waviness, that is, the PV (peak to valley) value is larger than the other surfaces. End up. For example, in the vicinity of the gate portion, the PV value may be 3 μm or more, and may be 10 μm or more. For this reason, when two resin substrates are bonded together including the surface in the vicinity of the gate portion (the surface in the vicinity of the protruding portion 11), the bonding strength is lowered. For example, when the surface flatness within the distance d from the position where the gate portion is provided (the position where the protruding portion 11 is provided) is low, the resin substrate 10 and the resin substrate 20 including the portion are connected. If it joins, joint strength will become low. Therefore, in this embodiment, by joining the resin substrate 10 and the resin substrate 20 while avoiding the range of the distance d from the outer peripheral portion, the resin substrate 10 is joined while avoiding the surface with relatively low planar accuracy. It becomes possible. As a result, the resin substrate 10 and the resin substrate 20 can be bonded to each other with the surface having relatively high planar accuracy as the bonding surface, so that the bonding strength of the microchip can be increased. That is, in other words, on the surface of the resin substrate having the channel groove, the other resin substrate is bonded to avoid the place where the PV value is 10 μm or more (preferably, the place where it is 3 μm or more). Is preferred.

  In 1st Embodiment, the dimension of the resin-made board | substrate 20 is made smaller than the dimension of the resin-made board | substrate 10 by using the resin-made board | substrate 20 whose side length is shorter than the length of the side of the resin-made board | substrate 10, The resin substrate 10 and the resin substrate 20 are joined to avoid the surface in the vicinity of the gate portion (the surface in the vicinity of the protruding portion 11). For example, the resin substrate 10 having a square shape and the resin substrate 20 having a rectangular shape are joined. By making the length of the short side of the resin substrate 20 shorter than the length of the side of the resin substrate 10, the dimension of the resin substrate 20 is made smaller than that of the resin substrate 10. In this way, by using the rectangular resin substrate 20 whose short side is shorter than the length of the side of the resin substrate 10, the surface near the gate portion (the surface near the protrusion 11) is avoided and made of resin. The substrate 10 and the resin substrate 20 are joined.

  For example, the length of the side of the resin substrate 10 is length X, the length of the long side of the resin substrate 20 is length X, and the length of the short side of the resin substrate 20 is length Y ( Length Y <length X). Then, the length Y of the short side of the resin substrate 20 is made shorter than the length X of the side of the resin substrate 10 by a distance d or more. That is, the length X of the side of the resin substrate 10 and the length Y of the short side of the resin substrate 20 are defined so that the relationship of length X−length Y ≧ distance d is established. In addition, it is the length of the projection part 11 provided in the resin board | substrate 10, Comprising: Let the length along the edge | side of the resin board | substrate 10 be length A. Thus, by shortening the length Y of the short side of the resin substrate 20 by a distance d or more than the length X of the side of the resin substrate 10, the surface near the gate portion (the surface near the protrusion 11). ), The resin substrate 10 and the resin substrate 20 can be joined. As a result, the resin substrate 10 and the resin substrate 20 can be bonded to each other with the surface having relatively high planar accuracy as the bonding surface, so that the bonding strength of the microchip can be increased.

  In the first embodiment, as an example, the length Y of the short side of the resin substrate 20 is shorter than the length X of the side of the resin substrate 10 by a distance d. In other words, the length obtained by adding the short side length Y of the resin substrate 20 and the distance d is the side length X of the resin substrate 10. This example is an example, and if the length Y of the short side of the resin substrate 20 is shorter than the length X of the side of the resin substrate 10 by the distance d, the effect according to this embodiment is achieved. be able to.

  As an example, the distance d from the outer periphery where the protrusions 11 are provided is 1 [mm]. In order to join the resin substrate 10 and the resin substrate 20 while avoiding the range within the distance d, the length X of one side of the resin substrate 10 is set to 50 [mm], and the length of the long side of the resin substrate 20 is determined. The length X is 50 [mm], and the short side length Y is 49 [mm]. By bonding the resin substrate 10 and the resin substrate 20 having such dimensions, it is possible to avoid the range within the distance d (= 1 [mm]) in which the plane accuracy is relatively low, and to bond them. It becomes. Further, the width of the protrusion 11 is preferably 7.5 [mm] or more and 45 [mm] or less, and more preferably 15 [mm] or more and 40 [mm] or less.

  Resin is used for the resin substrates 10 and 20. Examples of the resin include good moldability (transferability and releasability), high transparency, and low autofluorescence with respect to ultraviolet rays and visible light. For example, a thermoplastic resin is used for the resin substrates 10 and 20.

  Examples of the thermoplastic resin include polycarbonate, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, polyethylene terephthalate, nylon 6, nylon 66, polyvinyl acetate, polyvinylidene chloride, polypropylene, polyisoprene, polyethylene, polydimethyl. It is preferable to use siloxane, cyclic polyolefin or the like. It is particularly preferable to use polymethyl methacrylate and cyclic polyolefin. The resin substrate 10 and the resin substrate 20 may be made of the same material or different materials.

  In addition to the thermoplastic resin, a thermosetting resin, an ultraviolet curable resin, or the like may be used for the resin substrate 20 in which the channel groove is not formed. As the thermosetting resin, polydimethylsiloxane is preferably used.

  Further, the resin substrate 20 functioning as a lid (cover) may be produced by a method other than an injection molding method such as an extrusion molding method, a T-die molding method, an inflation molding method, or a calendar molding method, It may be produced by a molding method. Since the resin substrate 20 in which the channel groove is not formed has a simple shape, the planar accuracy is relatively better than that of the resin substrate in which the channel groove is formed. The surface in the vicinity of the gate part of the substrate may be covered with a resin substrate on which a channel groove is formed.

  Note that the shape of the microchannels 15 and 16 is 10 μm or more in both width and depth in consideration of the fact that the amount of analysis sample and reagent used can be reduced, the fabrication accuracy of molds, transferability, and releasability. The value is preferably in the range of 200 μm, but is not particularly limited. Further, the width and depth of the fine channels 15 and 16 may be determined according to the use of the microchip. In order to simplify the description, the cross-sectional shape of the microchannels 15 and 16 is a rectangular shape, but this shape is an example and may be a curved surface. Further, the width and height of the groove may be the same or different in the fine channel 15 and the fine channel 16.

  In addition, the plate thickness of the resin substrate 10 on which the channel grooves 12 and 13 are formed is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability. The thickness of the resin substrate 20 that functions as a lid (cover) for covering the flow path grooves 12 and 13 is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability. preferable. Moreover, when not forming the groove | channel for flow paths in the resin-made board | substrates 20 which function as a lid | cover (cover), you may use a film (sheet-like member) instead of a plate-like member. In this case, the thickness of the film is preferably 30 μm to 300 μm, and more preferably 50 μm to 150 μm.

(Joining)
The resin substrate 10 and the resin substrate 20 are joined by heat welding such as thermocompression bonding or heat lamination. By applying thermocompression bonding or thermal lamination to the resin substrates 10 and 20, the resin on the bonding surface of the resin substrates 10 and 20 is melted, and the resin substrate 10 and the resin substrate 20 are bonded.

  For example, in the case of thermocompression bonding, the resin substrate 10 and the resin substrate 20 are overlapped with the surface on which the channel grooves 12 and 13 are formed facing inward. In this state, the bonding surface is melted by heating the resin substrate 10 and the resin substrate 20, and further bonded by pressing the resin substrate 10 and the resin substrate 20. For example, the resin substrates 10 and 20 are heated in a range of 70 ° C. to 200 ° C., and the substrates are bonded together by pressurizing the resin substrates 10 and 20 in this state. In the case of thermal lamination, the substrates are bonded together by pressing the resin substrates 10 and 20 with a roll while the resin substrates 10 and 20 are heated.

  Further, the resin substrate 10 and the resin substrate 20 may be joined by laser welding or ultrasonic welding in addition to thermocompression bonding and thermal lamination.

  In the case of laser welding, the resin substrate 10 and the resin substrate 20 are overlapped with the surface on which the channel grooves 12 and 13 are formed facing inward. In this state, the bonding surface is melted by irradiating the resin substrate 10 and the resin substrate 20 with a laser, and further, the resin substrate 10 and the resin substrate 20 are pressed to be bonded. For example, the substrates are bonded together by scanning the resin substrates with a laser intensity of 0.1 W to 20 W.

  In the case of ultrasonic welding, the resin substrate 10 and the resin substrate 20 are overlapped with the surface on which the flow path grooves 12 and 13 are formed facing inward. In this state, the bonding surface is melted by irradiating the resin substrate 10 and the resin substrate 20 with ultrasonic waves, and further, the resin substrate 10 and the resin substrate 20 are pressed to be bonded. For example, the substrates are bonded together by applying pressure to the resin substrates while applying ultrasonic waves of 10 kHz to 50 kHz.

  As described above, when joining by welding, two resin substrates are not directly joined via an adhesive as in the case of adhesion, but two resin substrates are directly contacted and joined. The planar accuracy of the substrate surface greatly affects the bonding state. As in this embodiment, by joining two resin substrates while avoiding the vicinity of the gate portion, even when two resin substrates are directly contacted as in welding, a strong bonding strength is obtained. Is possible.

  Moreover, the microchip in which the fine flow path 15 and the fine flow path 16 are formed orthogonally is used for, for example, electrophoresis. For example, a sample or a buffer solution is injected under pressure from the opening 17 into the microchannel 15, and electrodes are inserted into two locations of the opening 17 of the microchip, and electrophoresis is performed by applying a high voltage. As an example, a buffer solution containing a polymer is pressurized and injected into the inside of the fine channel 15 from the opening 17, and then a fluorescently labeled DNA sample is injected. Further, electrodes are inserted into two locations of the opening 17 and electrophoresis is performed by applying a high voltage, and a DNA sample is detected by a fluorescence detector.

  In the first embodiment, the through hole 14 is formed in the resin substrate 10, but an opening connected to the fine flow path may be formed by forming the through hole in the resin substrate 20.

[Second Embodiment]
Next, a microchip according to a second embodiment of the present invention will be described with reference to FIG. FIG. 5 is a top view of a resin substrate and a microchip according to a second embodiment of the present invention. FIG. 5A is a top view of the resin substrate on the cover side, and FIG. 5B is a top view of the microchip.

  In the second embodiment, instead of the resin substrate 20 according to the first embodiment, the resin substrate 10 and the resin substrate 30 shown in FIG. 5A are used as the cover side substrate. And join. The resin substrate 30 on the cover side is a flat substrate, and a cutout portion 31 having a shape recessed from the outer periphery of the substrate to the inside of the substrate is formed on a part of one side of the resin substrate 30. . The notch 31 is not formed over the entire side of the resin substrate 30 but is formed in a part of the side.

  In order to avoid contact between the surface in the vicinity of the gate portion (the surface in the vicinity of the protrusion 11) and the surface of the resin substrate 30 when the notch 31 is bonded to the resin substrate 10 and the resin substrate 30. Is formed. Therefore, the width of the recess of the notch 31 is not less than the distance d inward from the outer periphery of the resin substrate 30. In the example shown in FIG. 5, the width of the recess of the notch 31 is the distance d, but this is only an example, and the width of the recess only needs to be greater than the distance d. Further, the length B along the side of the resin substrate 30 that is the length of the notch 31 is longer than the length A along the side of the resin substrate 10 that is the length of the protrusion 11. (Length A <length B).

  Then, the resin substrate 10 and the resin substrate are aligned by matching the position of the side where the notch 31 of the resin substrate 30 is formed and the position of the side where the protrusion 11 of the resin substrate 10 is formed. The microchip is manufactured by bonding 30. FIG. 5B shows a microchip in which the resin substrate 10 and the resin substrate 30 are joined. As shown in FIG. 5B, the notch 31 formed in the resin substrate 30 avoids the surface in the vicinity of the gate portion (the surface in the vicinity of the protrusion 11), and the resin substrate 10 and the resin substrate. 30 can be joined. That is, since the notch 31 is recessed inward from the outer periphery of the resin substrate 30, the recess brings the surface near the gate (the surface near the protrusion 11) and the surface of the resin substrate 30 into contact. The resin substrate 10 and the resin substrate 30 can be bonded to each other.

  Since the width of the recess of the cutout 31 is equal to or greater than the distance d, the surface of the resin substrate 10 and the resin are made within a distance d from the position where the gate is provided (the position where the protrusion 11 is provided). There is no contact with the surface of the substrate 30. By doing so, the resin substrate 10 and the resin substrate 30 are bonded to each other by avoiding surfaces having relatively low planar accuracy, that is, surfaces having a PV value of 3 μm or more, and using surfaces having relatively high planar accuracy as bonding surfaces. Can be joined. As a result, the bonding strength of the microchip can be increased.

  As an example, the distance d is 1 [mm], the length X of one side of the resin substrate 10 is 50 [mm], and the length X of one side of the resin substrate 30 is 50 [mm]. Further, the length A of the protrusion 11 is set to 25 [mm], and the length B of the notch 31 is set to be longer than 25 [mm]. By forming the cutout portion 30 having such a dimension in the resin substrate 31, the resin substrate 10 and the resin substrate 30 are bonded to each other while avoiding the range within the distance d (= 1 [mm]). Is possible.

  The material of the resin substrate 30 is the same material as that of the resin substrate 20 in the first embodiment. Moreover, the method of joining the resin substrate 10 and the resin substrate 30 is the same as the method according to the first embodiment. Further, the size of the protrusion 11 of the resin substrate is the same as that of the first embodiment.

[Third Embodiment]
Next, a microchip according to a third embodiment of the present invention will be described with reference to FIGS. FIG. 6 is a top view of a resin substrate according to the third embodiment of the present invention. FIG. 7 is a cross-sectional view of a resin substrate according to the third embodiment of the present invention, and is a VII-VII cross-sectional view of FIG. FIG. 8 is a top view of a microchip according to a third embodiment of the present invention. FIG. 9 is a cross-sectional view of a microchip according to a third embodiment of the present invention, and is a cross-sectional view taken along the line IX-IX in FIG.

  As shown in FIG. 6, flow path grooves 12 and 13 are formed on one surface of the resin substrate 40 in the same manner as the resin substrate 10 according to the first embodiment. Further, through holes 14 are formed in both end portions of the flow path grooves 12 and 13 so as to penetrate in the thickness direction of the resin substrate 40. Furthermore, a molded body left in the gate portion used at the time of injection molding is provided as a protruding portion 11 on a part of the outer peripheral portion of the resin substrate 40. As in the first embodiment, the protrusions 11 may be joined while remaining on the resin substrate 40, or may be joined after the protrusions 11 are removed from the resin substrate 40. The size of the protrusion 11 is the same as in the first embodiment.

  Further, as shown in FIGS. 6 and 7, the resin substrate 40 has a cylindrical shape around the through hole 14 on the surface opposite to the surface on which the flow path grooves 12 and 13 are formed. The protrusion 41 is provided. The protrusion 41 surrounds the through hole 14 and protrudes in the thickness direction of the resin substrate 40. A tube or nozzle is fitted to the protrusion 41 to introduce or discharge a sample or the like. 6 has a cylindrical shape, this is only an example and may have a polygonal shape.

  As described above, the resin substrate 40 has the same configuration as the resin substrate 10 according to the first embodiment except for the protrusion 41.

  Further, as shown in FIGS. 8 and 9, the resin substrate 20 that is the counterpart of the bonding of the resin substrate 40 is a flat substrate, as in the first embodiment. Then, the microchip is manufactured by bonding the resin substrate 40 and the resin substrate 40 with the surface on which the flow path grooves 13 and 14 are formed inside. As a result of this joining, linear microchannels 15 and microchannels 16 are formed orthogonal to each other inside the microchip, and openings are formed at both ends of the microchannels 15 and 16. 17 is formed. Then, a tube or nozzle is fitted to the protrusion 41, and a gel, sample, buffer solution, or the like is introduced into the fine channel through the tube or nozzle, or a sample or the like is introduced from the fine channels 15 and 16. Discharge.

  Then, as shown in FIGS. 8 and 9, the resin substrate 40 and the resin substrate 20 are joined to avoid the vicinity of the protrusion 11 formed on the resin substrate 40 as in the first embodiment. . Specifically, the size of the resin substrate 20 is made smaller than that of the resin substrate 40 on which the channel grooves 12 and 13 are formed to avoid the surface in the vicinity of the gate portion (the surface in the vicinity of the protruding portion 11). The resin substrate 40 and the resin substrate 20 are joined together. For example, by shortening the length Y of the short side of the resin substrate 20 by a distance d or more than the length X of the side of the resin substrate 40, the surface in the vicinity of the gate portion (surface in the vicinity of the protruding portion 11) is made. Avoiding this, the resin substrate 40 and the resin substrate 20 are joined. This makes it possible to bond the resin substrate 40 and the resin substrate 20 with the surface having relatively high planar accuracy as the bonding surface, and as a result, the bonding strength of the microchip can be increased.

  Furthermore, when the protrusion 41 is formed around the through hole 14 of the resin substrate 40 by injection molding, the resin substrate 40 is unevenly thickened, so that the planar accuracy of the joint surface of the resin substrate 40 is further lowered. More specifically, the thickness of the resin substrate 40 is partially different by forming the protrusion 41. When the thickness is partially different, the cooling process in each portion of the resin substrate 40 is changed during molding, and as a result, the surface of the resin substrate 40 is easily distorted. As a result, when the protrusion 41 is formed, the planar accuracy of the joint surface in the resin substrate 40 is further lowered. In addition, since the deterioration of the planar accuracy due to the provision of the projection extends to the entire substrate of the resin substrate, the planar accuracy is further degraded near the gate portion as compared with the case where the projection is not provided. Therefore, when the resin substrate 40 provided with the protrusions 41 is bonded, the bonding strength may be lowered.

  On the other hand, by joining the resin substrate 40 and the resin substrate 20 while avoiding the surface in the vicinity of the protruding portion 11, the bonding surface becomes narrower, so that it is less likely to be affected by planar accuracy in the bonding. Is possible. As a result, it is possible to increase the bonding strength of the microchip even when the protrusion 41 that can have a lower bonding strength is formed. In addition, the effect of increasing the bonding strength becomes more remarkable by performing the bonding while avoiding the vicinity of the gate portion.

  In the third embodiment, the example in which the protrusion 41 for connecting to the analyzer is provided around the through hole 14 is described. However, the uneven member provided on the surface of the resin substrate 40 is the protrusion 41. It is not limited to. For example, a switch for controlling the flow of the sample flowing in the fine flow path, a lens for condensing light from the analyzer, and the like may be formed on the surface of the resin substrate 40. Even when such a concavo-convex member is formed on the resin substrate 40 by injection molding, the planar accuracy of the surface of the resin substrate 40 becomes low, as in the case where the protrusions 41 are formed. Even in such a case, according to the third embodiment, it is possible to increase the bonding strength of the microchip by making the bonding less susceptible to the influence of plane accuracy.

  Further, even if the resin substrate 40 provided with the protrusion 41 (uneven member) and the cover-side resin substrate 30 according to the second embodiment are joined to produce a microchip, the microchip is obtained. There is an effect.

  The material of the resin substrate 40 is the same material as that of the resin substrate 10 in the first embodiment. Moreover, the method of joining the resin substrate 40 and the resin substrate 20 is the same as the method according to the first embodiment.

[Fourth Embodiment]
Next, a microchip according to a fourth embodiment of the present invention will be described with reference to FIGS. FIG. 10 is a top view of a resin substrate according to the fourth embodiment of the present invention. FIG. 11 is a top view of a microchip according to a fourth embodiment of the present invention. 12 is a cross-sectional view of a microchip according to a fourth embodiment of the present invention, and is a cross-sectional view taken along the line XII-XII of FIG.

  In the fourth embodiment, instead of the resin substrate 20 according to the first embodiment, a resin substrate 50 shown in FIG. 10 is used as a cover-side substrate, and the resin substrate 10 and the resin substrate 50 are joined. To do. The resin substrate 50 is used for joining the resin substrate 10 while avoiding the surface in the vicinity of the protrusion 11 provided on the resin substrate 10 and further avoiding the vicinity of the corner of the resin substrate 10. The resin substrate 50 is a flat substrate and has a substantially trapezoidal shape. Specifically, the resin substrate 50 has a constant width from the lower side 51 toward the upper side 52 for a predetermined distance, and two inclined portions 53 are formed between the predetermined distance and the upper side 52. As it is formed, the width gradually decreases. In other words, the resin substrate 50 has a shape in which two corners of the resin substrate 20 according to the first embodiment are cut obliquely. In addition, although the inclination part 53 is linear, this is an example and may be curvilinear. The two inclined portions 53 are formed corresponding to the corner positions of the resin substrate 10. When the resin substrate 10 and the resin substrate 50 are joined, the vicinity of the corner of the resin substrate 10 and the resin are formed. It is formed to avoid contact with the surface of the substrate 50. The length Y from the lower side 51 to the upper side 52 of the resin substrate 50 having a trapezoidal shape is shorter than the length X of one side of the resin substrate 10 by a distance d or more. The length of the lower side 51 is the length X.

  Then, the microchip is manufactured by bonding the resin substrate 10 and the resin substrate 50 together. 11 and 12 show a microchip in which the resin substrate 10 and the resin substrate 50 are bonded. Similarly to the first embodiment, the resin substrate 10 and the resin substrate 50 are bonded to each other while avoiding the surface near the gate portion (the surface near the protrusion 11). Specifically, the lower side 51 side of the resin substrate 50 is directed toward the protrusion 11 of the resin substrate 10, and the resin substrate 50 is overlapped with the resin substrate 10 at a distance d from the protrusion 11. Thus, the resin substrate 10 and the resin substrate 50 are bonded to each other with the surface having a relatively high planar accuracy as a bonding surface while avoiding the surface in the vicinity of the gate portion having a relatively low planar accuracy (the surface in the vicinity of the protrusion 11). It becomes possible to do. As in the first embodiment, the protrusions 11 may be bonded while remaining on the resin substrate 10, or may be bonded after the protrusions 11 are removed from the resin substrate 10. Further, the size and the like of the protrusion 11 are the same as those in the first embodiment.

  Furthermore, by forming the inclined portion 53 on the resin substrate 50, the resin substrate 10 and the resin substrate 50 can be joined while avoiding the corners of the resin substrate 10. When the resin substrate 10 is produced by injection molding, there is a possibility that the end portion and corners of the resin substrate 10 are raised. As a result, the plane accuracy is relatively low at the edges and corners, and the bonding strength between the substrates is low. In particular, the plane accuracy tends to decrease at corners. For example, in the range of 1 mm from the corner of the resin substrate 10, the planar accuracy may be relatively low.

  Therefore, the resin substrate 10 and the resin substrate 50 are joined to avoid the corner of the resin substrate 10 by forming the inclined portion 53 corresponding to the corner position of the resin substrate 10 on the resin substrate 50. Is possible. Accordingly, it is possible to bond the resin substrate 10 and the resin substrate 50 while avoiding the surface having a relatively low planar accuracy, and it is possible to further increase the bonding strength of the microchip. For example, by forming the inclined portion 53 on the resin substrate 50 so as to avoid a range within 1 mm from the corner of the resin substrate 10, the resin substrate 10 and the resin substrate are avoided while avoiding a surface with relatively low planar accuracy. It becomes possible to join the substrate 50.

  In addition, since the microchip is easily peeled off from the corner of the substrate, the microchip that is difficult to peel off from the corner can be manufactured by joining the resin substrate 10 and the resin substrate 50 while avoiding the corner of the resin substrate 10. .

  Further, a microchip is manufactured by joining the resin substrate 50 on the cover side where the inclined portion 53 is formed and the resin substrate 40 provided with the protrusion 41 (concave / convex member) according to the third embodiment. Also, the effects according to this embodiment can be achieved.

  The material of the resin substrate 50 is the same material as that of the resin substrate 20 in the first embodiment. Moreover, the method of joining the resin substrate 10 and the resin substrate 50 is the same as the method according to the first embodiment.

[Fifth Embodiment]
Next, a microchip according to a fifth embodiment of the invention is described with reference to FIGS. FIG. 13 is a top view of a microchip according to a fifth embodiment of the present invention. 14 is a cross-sectional view of a microchip according to a fifth embodiment of the present invention, and is a cross-sectional view taken along the line XIV-XIV in FIG.

  In the fifth embodiment, instead of the resin substrate 20 according to the first embodiment, the resin substrate 60 and the resin substrate 60 shown in FIGS. 13 and 14 are used as the cover side substrate. And join. The resin substrate 60 avoids the surface in the vicinity of the gate portion (the surface in the vicinity of the protrusion 11), and further avoids the surface within a predetermined distance from all the end portions of the resin substrate 10, and Used to join. The resin substrate 60 is a flat substrate and is smaller than the dimensions of the resin substrate 10. For example, the size of the resin substrate 60 is a size that does not cover the surface included in a range within 1 mm from all the end portions of the resin substrate 10 when the resin substrate 60 is stacked on the resin substrate 10. ing.

  As described above, when the resin substrate 10 is manufactured by injection molding, the end portions and corners of the resin substrate 10 are raised, and the planar accuracy may be lowered. Therefore, in the sixth embodiment, the end portion of the resin substrate 10 is used by using the resin substrate 60 having a size that does not cover the surface included within a predetermined distance (within 1 mm) from the end portion of the resin substrate 10. It is possible to join the resin substrate 10 and the resin substrate 60 while avoiding the periphery of the substrate. As a result, it is possible to bond the resin substrate 10 and the resin substrate 60 while avoiding the surface with relatively low planar accuracy, and it is possible to further increase the bonding strength of the microchip.

  Further, since the microchip is easily peeled off from the end portion (peripheral portion) of the substrate, the end portions of the resin substrate 10 and the resin substrate 60 are joined by avoiding the periphery of all the end portions of the resin substrate 10. A microchip that does not easily peel off from the portion can be manufactured.

  Further, by using the resin substrate 60 having a size that does not cover the surface within a predetermined distance (within 1 mm) from the end portion of the resin substrate 10, the surface in the vicinity of the gate portion (the surface in the vicinity of the protrusion 11). ) And the resin substrate 10 and the resin substrate 60 can be joined. Thus, the resin substrate 10 and the resin substrate 60 are bonded to each other by using a surface having a relatively high plane accuracy as a bonding surface while avoiding a surface in the vicinity of the gate portion having a relatively low plane accuracy (a surface in the vicinity of the protruding portion 11). It becomes possible to do. As a result, the bonding strength of the microchip can be increased. As in the first embodiment, the protrusions 11 may be bonded while remaining on the resin substrate 10, or may be bonded after the protrusions 11 are removed from the resin substrate 10. Further, the size and the like of the protrusion 11 are the same as those in the first embodiment.

  The shape of the resin substrate 60 shown in FIG. 13 is an example. In the example shown in FIG. 13, the end portion of the resin substrate 60 has a curved shape, but is not limited thereto, and may have a linear shape. That is, the shape of the resin substrate 60 may be circular or rectangular as long as it does not cover the surface within a predetermined distance from the end of the resin substrate 10.

  Moreover, even if the resin substrate 60 and the resin substrate 40 provided with the protrusions 41 (uneven members) according to the third embodiment are joined to produce a microchip, the effect according to this embodiment is obtained. be able to.

  The material of the resin substrate 60 is the same material as that of the resin substrate 20 in the first embodiment. Moreover, the method of joining the resin substrate 10 and the resin substrate 60 is the same as the method according to the first embodiment.

[Sixth Embodiment]
Next, a microchip according to a sixth embodiment of the present invention is described with reference to FIGS. FIG. 15 is a top view of a microchip according to a sixth embodiment of the present invention. 16 is a cross-sectional view of a microchip according to a sixth embodiment of the present invention, and is a cross-sectional view taken along the line XVI-XVI of FIG.

  In the sixth embodiment, instead of the resin substrate 20 according to the first embodiment, the resin substrate 10 shown in FIGS. 15 and 16 is used as the cover-side substrate, and the resin substrate 10 and the resin substrate 70 are used. And join. The resin substrate 70 is a flat substrate. The shape of the resin substrate 70 depends on the shape of the flow path grooves 12 and 13 formed on the surface of the resin substrate 10 and the position where the through hole 14 is formed. For example, the resin substrate 70 has a shape along the flow path grooves 12 and 13 and the through hole 14. Specifically, all the end portions of the resin substrate 70 are included within a predetermined distance from the position where the flow path grooves 12 and 13 are formed and the position where the through holes 14 are formed. It has a shape. Accordingly, when the resin substrate 70 is overlapped and joined to the resin substrate 10 in accordance with the positions of the flow path grooves 12 and 13 formed on the surface of the resin substrate 10, all the ends of the resin substrate 70 are obtained. The portion is included in a range within a predetermined distance from the microchannels 15 and 16 and the opening 17. As an example, it is preferable that all end portions of the resin substrate 70 are included in a range of 2 mm or less from the fine flow paths 15 and 16 and the opening 17, and included in a range of 0.2 mm to 2 mm. More preferably.

  For example, a linear flow path groove 12 and a straight flow path groove 13 are formed in the resin substrate 10 so as to be orthogonal to each other, and through holes are provided at both ends of the flow path grooves 12 and 13. 14 is formed. Therefore, the resin substrate 70 on the cover side includes a linear member along the channel groove 12 and a linear member along the channel groove 13. The shape of the resin substrate 70 shown in FIG. 15 is an example, and the shape of the resin substrate on the cover side may be changed according to the position where the channel groove and the through hole are formed.

  As described above, by forming all the end portions of the resin substrate 70 on the cover side within a predetermined distance from the flow path grooves 12 and 13 and the through hole 14, the resin substrate is obtained. The surface where 10 and the resin substrate 70 are joined can be made narrower. By narrowing the joining surface in this way, the range affected by the plane accuracy in joining becomes narrower. As a result, even if there is a surface with relatively low planar accuracy, the resin substrate 10 and the resin substrate 70 can be joined without being affected by the surface. As a result, the bonding strength between the resin substrate 10 and the resin substrate 70 can be further increased.

  Moreover, by making all the edge parts of the resin substrate 70 on the cover side into a shape included in a predetermined distance (0.2 mm to 2 mm) from the flow path grooves 12 and 13 and the through hole 14, The resin substrate 10 and the resin substrate 70 can be bonded to each other while avoiding the surface in the vicinity of the protrusion 11 formed on the resin substrate 10 (the surface in the vicinity of the gate portion). Thus, the resin substrate 10 and the resin substrate 70 are bonded to each other with the surface having a relatively high plane accuracy as the bonding surface while avoiding the surface in the vicinity of the gate portion having a relatively low plane accuracy (the surface in the vicinity of the protrusion 11). It becomes possible to do. As a result, the bonding strength of the microchip can be increased.

  Moreover, even if the resin substrate 70 and the resin substrate 40 provided with the protrusions 41 (uneven members) according to the third embodiment are joined to produce a microchip, the effect according to this embodiment is obtained. be able to.

  The material of the resin substrate 70 is the same material as that of the resin substrate 20 in the first embodiment. Moreover, the method of joining the resin substrate 10 and the resin substrate 70 is the same as the method according to the first embodiment. Further, the size of the protrusion 11 of the resin substrate is the same as that of the first embodiment.

[Seventh Embodiment]
Next, a microchip according to a seventh embodiment of the invention is described with reference to FIGS. FIG. 17 is a top view of a resin substrate according to a seventh embodiment of the present invention. FIG. 18 is a top view of a microchip according to a seventh embodiment of the present invention. FIG. 19 is a cross-sectional view of a microchip according to a seventh embodiment of the present invention, and is a cross-sectional view of XIX-XIX in FIG.

  As shown in FIG. 17, a channel groove 81 and a channel groove 84 are formed on one surface of the resin substrate 80. As an example, the channel grooves 81 and 84 are configured to include a linear groove and two grooves intersecting the linear groove. The channel groove 81 and the channel groove 84 are not connected to each other and are independent grooves. In addition, a through hole 82 that penetrates in the thickness direction of the resin substrate 80 is formed at the end of the channel groove 81. Similarly, a through hole 85 penetrating in the thickness direction of the resin substrate 80 is formed at the end of the channel groove 84. Furthermore, as shown in FIG. 17, the resinous substrate 80 is provided with cylindrical protrusions 83 and 86 on the surface opposite to the surface where the flow channel grooves 81 and 84 are formed. . The protrusion 83 is provided around the through hole 82, and the protrusion 86 is provided around the through hole 85. A tube or nozzle is fitted to the projections 83 and 86 to introduce or discharge a sample or the like. Further, a molded body left in the gate portion used at the time of injection molding is provided as a protruding portion 11 on a part of the outer peripheral portion of the resin substrate 80. In this embodiment, an example in which the protrusions 83 and 86 are provided will be described. However, even if the protrusions 83 and 86 are not provided, the same effect as this embodiment can be obtained.

  In the seventh embodiment, two resin substrates are used as the cover-side substrate. For example, as shown in FIGS. 19 and 20, a resin substrate 90 and a resin substrate 100 are used as the cover-side substrate. The resin substrates 90 and 100 correspond to an example of “individual substrates” of the present invention. Each of the resin substrates 90 and 100 is a flat substrate. The resin substrate 90 is a substrate that covers the flow path groove 81 formed on the surface of the resin substrate 80. On the other hand, the resin substrate 100 is a substrate that covers the channel groove 84 formed on the surface of the resin substrate 80. In this way, a separate substrate is bonded to each channel groove.

  The shape of the resin substrate 90 depends on the shape of the channel groove 81 formed on the surface of the resin substrate 80 and the position where the through hole 82 is formed. For example, the resin substrate 90 has a shape along the flow path groove 81 and the through hole 82. Specifically, all the end portions of the resin substrate 90 are included in a range within a predetermined distance from the position where the flow channel groove 81 is formed and the position where the through hole 82 is formed. It has become. Thus, when the resin substrate 90 is overlapped and joined to the resin substrate 80 in accordance with the position of the flow channel groove 81 formed on the surface of the resin substrate 80, all the end portions of the resin substrate 90 are In other words, it is included in a range within a predetermined distance from the fine channel 201 and the opening 202. As an example, it is preferable that all end portions of the resin substrate 90 are included within a range of 2 mm or less from the fine channel 201 and the opening 202, and included within a range of 0.2 mm to 2 mm. More preferred.

  Similarly, the shape of the resin substrate 100 depends on the shape of the flow channel groove 84 and the position where the through hole 85 is formed, and has a shape along the flow channel groove 84 and the through hole 85. Yes. Specifically, all the end portions of the resin substrate 100 are included in a range within a predetermined distance from the position where the channel groove 84 is formed and the position where the through hole 85 is formed. It has become. Thus, when the resin substrate 100 is overlapped and joined to the resin substrate 80 in accordance with the position of the flow path groove 84 formed on the surface of the resin substrate 80, all the end portions of the resin substrate 100 are In other words, it is included in a range within a predetermined distance from the fine channel 211 and the opening 212. As an example, it is preferable that all end portions of the resin substrate 100 are included within a range of 2 mm or less from the fine channel 211 and the opening 212, and included within a range of 0.2 mm to 2 mm. More preferred.

  As described above, all the end portions of the resin substrate 90 on the cover side have a shape within a predetermined distance from the channel groove 81 and the through hole 82, so that the resin substrate 80 It is possible to further narrow the surface where the resin substrate 90 is bonded. By narrowing the joining surface in this way, the range affected by the plane accuracy in joining becomes narrower. As a result, even if there is a surface with relatively low planar accuracy, the resin substrate 80 and the resin substrate 90 can be joined without being affected by the surface. As a result, the bonding strength between the resin substrate 80 and the resin substrate 90 can be further increased. Also for the resin substrate 100, the bonding strength between the resin substrate 80 and the resin substrate 100 is further increased by adopting a shape within a predetermined distance from the channel groove 84 and the through hole 85. It becomes possible.

  Further, all the end portions of the resin substrate 90 on the cover side are formed in a shape within a predetermined distance (0.2 mm to 2 mm) from the flow channel groove 81 and the through hole 82, thereby making the resin It is possible to bond the resin substrate 80 and the resin substrate 90 while avoiding the surface near the protrusion 11 formed on the substrate 80 (the surface near the gate portion). Thus, the resin substrate 80 and the resin substrate 90 are bonded to each other by using a surface having a relatively high plane accuracy as a bonding surface while avoiding a surface in the vicinity of the gate portion having a relatively low plane accuracy (a surface in the vicinity of the protrusion 11). It becomes possible to do. As a result, the bonding strength of the microchip can be increased. Since the resin substrate 100 can also be bonded to the resin substrate 80 while avoiding the surface in the vicinity of the protruding portion 11, the bonding strength can be increased. As in the first embodiment, the protrusions 11 may be bonded while remaining on the resin substrate 80, or may be bonded after the protrusions 11 are removed from the resin substrate 80. Further, the size and the like of the protrusion 11 are the same as those in the first embodiment.

  The resin substrate 80 is made of the same material as the resin substrate 10 according to the first embodiment, and the resin substrates 90 and 100 are made of the same material as the resin substrate 20 according to the first embodiment. It is done. Further, the method of joining the resin substrate 80 and the resin substrates 90 and 100 is the same as the method according to the first embodiment.

  In this embodiment, the plurality of cover-side resin substrates are formed along the flow path grooves, but the present invention is not limited to this shape. For example, each channel groove may be covered with a plurality of resin substrates on the cover side, instead of having a shape along the channel groove. Even in this case, the bonding area can be reduced as compared with the case where a plurality of flow path grooves are covered with a single resin substrate on the cover side. Can be increased.

[Eighth Embodiment]
Next, a microchip according to an eighth embodiment of the invention is described with reference to FIGS. FIG. 20 is a top view of a microchip according to an eighth embodiment of the present invention. 21 is a cross-sectional view of a microchip according to an eighth embodiment of the present invention, and is a cross-sectional view of XXI-XXI in FIG.

  In the eighth embodiment, a case where two resin substrates produced by injection molding are joined will be described. The microchip according to the eighth embodiment includes a resin substrate 10 having flow path grooves 12 and 13 formed on the surface thereof, and a flat resin substrate 110. Since the resin substrate 10 has the same configuration as the substrate according to the first embodiment, the description thereof is omitted. The resin substrate 110 is a flat substrate and is produced by injection molding in the same manner as the resin substrate 10. Therefore, a part of the outer peripheral portion of the resin substrate 110 is provided with a protruding portion 111 that is a molded body remaining in the gate portion.

  As described above, even when the resin substrate 10 and the resin substrate 110 manufactured by injection molding are joined, the resin substrate 110 is within the range of the distance d from the protrusion 11 of the resin substrate 10. Similarly, the resin substrate 10 and the resin substrate 110 are overlapped and bonded so that the resin substrate 10 does not cover the area within the distance d from the protrusion 111 of the resin substrate 110. . For example, as shown in FIGS. 20 and 21, the resin substrates 10 and the resin substrates 110 are alternately stacked. This makes it possible to bond the resin substrate 10 and the resin substrate 110 while avoiding the vicinity of each of the protrusion 11 and the protrusion 111, that is, the surface in the vicinity of each gate portion. As a result, it is possible to bond the resin substrate 10 and the resin substrate 110 while avoiding a surface with relatively low planar accuracy, and it is possible to manufacture a microchip with high bonding strength. As in the first embodiment, the protrusion 11 may be left on the resin substrate 10 and the protrusion 111 may be joined with the resin substrate 110 left, or the protrusion 11 may be removed from the resin substrate 10. The protrusion 111 may be bonded after being removed from the resin substrate 110.

  In this embodiment, the example in which the channel groove and the through hole are not formed in the resin substrate 110 has been described, but the substrate to which the resin substrate 10 is bonded is not limited thereto. For example, a channel groove may be formed on the surface of the resin substrate 110 by injection molding, or a through hole penetrating in the thickness direction of the substrate may be formed. Thus, even when the resinous substrate 110 and the resinous substrate 10 formed with the channel grooves and the through holes are joined, avoid the surfaces in the vicinity of the protrusions 11 and 111. By bonding, a microchip with high bonding strength can be manufactured. Further, the protruding portion 41 (uneven member) according to the third embodiment may be provided on the resin substrate 110.

  In the first to eighth embodiments described above, the channel groove is formed only on one resin substrate, but the channel groove may be formed on both resin substrates. Even when the flow path grooves are formed on both resin substrates, the resin substrate of the mating partner does not cover the area within the distance d from the protrusions that are the molded bodies left in the gate portion. Thus, what is necessary is just to join two resin-made substrates. Thereby, it becomes possible to produce the same effect as the above-described embodiment.

  Further, the number of flow path grooves formed on the surface of the resin substrate is not limited. Three or more channel grooves independent of each other may be formed on the surface of the resin substrate.

  Furthermore, in the first to eighth embodiments, two resin substrates are bonded, but three or more resin substrates may be stacked and bonded. Even when three or more resin substrates are bonded, the bonding resin resin substrate is not covered within the range within the distance d from the protrusion which is the molded body left in the gate portion. What is necessary is just to join a resin-made board | substrate. Thereby, it becomes possible to produce the same effect as the above-described embodiment.

  Moreover, the protrusion part which is the molded object left in the gate part may be provided in several places. In this case, the resin substrate may be bonded so that the cover-side resin substrate does not cover the range within the distance d from each protrusion.

[Ninth Embodiment]
Next, a microchip according to a ninth embodiment of the invention is described with reference to FIGS. FIG. 22 is a top view of a microchip according to a ninth embodiment of the present invention. FIG. 23 is a cross-sectional view of the microchip according to the ninth embodiment of the present invention, which is a cross-sectional view taken along the line XXIII-XXIII of FIG.

  In the ninth embodiment, the substrate on the cover side has the same shape as the resin substrate 70 according to the sixth embodiment, except that a resin substrate 120 in which a through hole 121 is formed is used. Further, like the resin substrate 10, the resin substrate 10 </ b> A is provided with flow channel grooves 12 and 13 and is provided with the protrusions 11, but no through hole is formed. In the ninth embodiment, a resin substrate 120 shown in FIGS. 22 and 23 is used instead of the resin substrate 70 according to the sixth embodiment, and a resin substrate 10A is used instead of the resin substrate 10. The resin substrate 10A and the resin substrate 120 are joined. The resin substrate 120 is a flat substrate having a through hole 121. The shape of the resin substrate 120 depends on the shape of the flow path grooves 12 and 13 formed on the surface of the resin substrate 10 </ b> A, similarly to the resin substrate 70. For example, the shape of the resin substrate 120 is a shape along the flow path grooves 12 and 13. Specifically, all the end portions of the resin substrate 120 have a shape included in a range within a predetermined distance from the position where the flow path grooves 12 and 13 are formed. Accordingly, when the resin substrate 120 is overlapped and joined to the resin substrate 10A in accordance with the positions of the flow path grooves 12 and 13 formed on the surface of the resin substrate 10A, all ends of the resin substrate 120 are obtained. The portion is included in a range within a predetermined distance from the fine flow paths 15 and 16. As an example, all the end portions of the resin substrate 120 are preferably included within a range of 2 mm or less from the fine flow paths 15 and 16, and more preferably included within a range of 0.2 mm to 2 mm.

  For example, a linear flow path groove 12 and a straight flow path groove 13 are formed orthogonally on the resin substrate 10A. Therefore, the resin substrate 120 on the cover side includes a linear member along the flow path groove 12 and a linear member along the flow path groove 13. The shape of the resin substrate 120 shown in FIG. 22 is an example, and the shape of the resin substrate on the cover side may be changed according to the position where the channel groove is formed.

  As described above, the resin substrate 10 </ b> A and the resin substrate are formed by forming all the end portions of the resin substrate 120 on the cover side within a predetermined distance from the flow path grooves 12 and 13. It becomes possible to make the surface where 120 joins narrower. By narrowing the joining surface in this way, the range affected by the plane accuracy in joining becomes narrower. As a result, even if there is a surface with relatively low planar accuracy, the resin substrate 10A and the resin substrate 120 can be joined without being affected by the surface. As a result, the bonding strength between the resin substrate 10A and the resin substrate 120 can be further increased.

  Further, by forming all the end portions of the resin substrate 120 on the cover side within a predetermined distance (0.2 mm to 2 mm) from the flow path grooves 12 and 13, the resin substrate 10 </ b> A is formed. It is possible to bond the resin substrate 10A and the resin substrate 120 while avoiding the surface in the vicinity of the formed protrusion 11 (surface in the vicinity of the gate portion). Thus, the resin substrate 10A and the resin substrate 120 are bonded to each other with the surface having a relatively high plane accuracy as a bonding surface while avoiding the surface in the vicinity of the gate portion having a relatively low plane accuracy (the surface in the vicinity of the protrusion 11) It becomes possible to do. As a result, the bonding strength of the microchip can be increased.

  The resin substrate 120 is made of the same material as the resin substrate 20 in the first embodiment. Further, the method of joining the resin substrate 10A and the resin substrate 120 is the same as the method according to the first embodiment. Further, the size of the protrusion 11 of the resin substrate is the same as that of the first embodiment.

[Example]
Next, specific examples will be described. In this example, a specific example of the first embodiment will be described.

(Resin substrate)
A transparent resin material acrylic (Delpet manufactured by Asahi Kasei Co., Ltd.) was molded by an injection molding machine to produce a resin substrate on the flow path side in which a plurality of flow grooves and a plurality of through holes were formed. This flow path side resin substrate corresponds to an example of the resin substrate 10 in which the flow path grooves 12 and 13 and the through holes 14 in the first embodiment described above are formed. In the resin substrate on the flow path side, a molded body left in the gate portion used at the time of injection molding is formed on a part of the outer peripheral portion of the substrate. This molded body corresponds to an example of the protruding portion 11 in the first embodiment.
The dimensions of the resin substrate on the flow path side are shown below.
Width X = 50mm
Gate width = 15mm
Thickness = 1mm
Length of protrusion 11 A = 25 mm
The width and depth of the channel groove = 50 μm
Inside diameter of the through hole = 2mm

Moreover, the acrylic resin was used as the transparent resin material, and a resin substrate on the cover side was produced by an extrusion method. The resin substrate on the cover side corresponds to the resin substrate 20 functioning as a lid (cover) according to the first embodiment.
The dimensions of the resin substrate on the cover side are shown below.
Width X (long side) = 50mm
Width Y (short side) = 49mm
Thickness = 1mm

(Joining)
Next, the resin substrate on the channel side and the resin substrate on the cover side were overlapped with the surface on which the channel groove was formed facing inside. At this time, the two resin substrates were overlapped while avoiding the surface included in the range within 1 mm from the position where the protrusion 11 was formed. In that state, a microchip was produced by sandwiching two resin substrates with a hot plate heated to 90 ° C. using a heating press, applying a pressure of 1 kgf / cm ² and holding for 1 minute.

(Evaluation)
When the bonding surface of the microchip produced by the method described above was observed with a microscope, the two resin substrates were welded to the entire surface in this example.

(Comparative example)
Next, a comparative example for the above-described embodiment will be described.

(Resin substrate)
A transparent resin material acrylic (Delpet manufactured by Asahi Kasei Co., Ltd.) is molded by an injection molding machine, and a plurality of fine channels having a width of 50 μm and a depth of 50 μm are formed on a plate-like member having an outer dimension of 50 mm width × 50 mm width × 1 mm thickness. Then, a resin substrate on the flow path side constituted by a plurality of through holes having an inner diameter of 2 mm was produced. Similarly, a resin substrate on the cover side having an outer dimension of width 50 mm × width 50 mm × thickness 1 mm was produced. The resin substrate on the cover side functions as a lid (cover) for the channel groove.

(Joining)
Next, the resin substrate on the channel side and the resin substrate on the cover side were overlapped with the surface on which the channel groove was formed facing inside. In this state, a microchip was manufactured by sandwiching two resin substrates with a hot plate heated to 90 ° C. using a heating press, applying a pressure of 1 kgf / cm 2 and holding for 1 minute.

(Evaluation)
When the bonding surface of the microchip according to the comparative example was observed with a microscope, an unwelded range was observed from the vicinity of the gate portion to the opening portion near the gate portion.

  As described above, according to the example of the present invention, it was confirmed that the bonding strength between the resin substrates was higher than that of the comparative example.

  The material and dimensions of the resin substrate shown in the above-described embodiments are only examples, and the present invention is not limited to these. For example, even when the resins mentioned in the above-described embodiments are used, it is possible to increase the bonding strength between the resin substrates compared to the comparative example. In the above-described embodiment, the example in which the resin substrate is used with the protruding portion remaining on the outer peripheral portion has been described. However, the bonding may be performed after removing the protruding portion. Even if bonding is performed by avoiding the surface in the vicinity of the gate portion using the resin substrate after removing the protruding portion, the same effect as the above-described embodiment can be obtained.

1 is a top view of a resin substrate according to a first embodiment of the present invention. It is sectional drawing of the resin-made board | substrates concerning 1st Embodiment of this invention, and is II-II sectional drawing of FIG. 1 is a top view of a microchip according to a first embodiment of the present invention. It is sectional drawing of the microchip which concerns on 1st Embodiment of this invention, and is IV-IV sectional drawing of FIG. It is a top view of a resin substrate and a microchip according to a second embodiment of the present invention. FIG. 5A is a top view of the resin substrate on the cover side, and FIG. 5B is a top view of the microchip. It is a top view of the resin-made board | substrate which concerns on 3rd Embodiment of this invention. It is sectional drawing of the resin-made board | substrates concerning 3rd Embodiment of this invention, and is VII-VII sectional drawing of FIG. It is a top view of the microchip which concerns on 3rd Embodiment of this invention. It is sectional drawing of the microchip which concerns on 3rd Embodiment of this invention, and is IX-IX sectional drawing of FIG. It is a top view of the resin-made board | substrate which concerns on 4th Embodiment of this invention. It is a top view of the microchip which concerns on 4th Embodiment of this invention. It is sectional drawing of the microchip which concerns on 4th Embodiment of this invention, and is XII-XII sectional drawing of FIG. It is a top view of the microchip which concerns on 5th Embodiment of this invention. It is sectional drawing of the microchip which concerns on 5th Embodiment of this invention, and is XIV-XIV sectional drawing of FIG. It is a top view of the microchip which concerns on 6th Embodiment of this invention. It is sectional drawing of the microchip which concerns on 6th Embodiment of this invention, and is XVI-XVI sectional drawing of FIG. It is a top view of the resin-made board | substrate which concerns on 7th Embodiment of this invention. It is a top view of the microchip which concerns on 7th Embodiment of this invention. It is sectional drawing of the microchip which concerns on 7th Embodiment of this invention, and is XIX-XIX sectional drawing of FIG. It is a top view of the microchip which concerns on 8th Embodiment of this invention. It is sectional drawing of the microchip which concerns on 8th Embodiment of this invention, and is XXI-XXI sectional drawing of FIG. It is a top view of the microchip which concerns on 9th Embodiment of this invention. It is sectional drawing of the microchip which concerns on 9th Embodiment of this invention, and is XXIII-XXIII sectional drawing of FIG.

Explanation of symbols

10, 20, 30, 40, 50, 60, 70, 80, 90 Resin substrate 11, 41, 83, 86 Protrusion 12, 13, 81, 84 Channel groove 14, 82, 85 Through hole 15, 16 , 201, 211 Fine channel 17, 202, 212 Opening 31 Notch 53 Inclined part

Claims (23)

A channel groove is formed on the surface of at least one of the two resin substrates, and a through hole is formed in at least one of the two resin substrates. A method of manufacturing a microchip for joining a resin substrate with a surface on which the channel groove is formed facing inside,
A substrate manufacturing step of manufacturing a resin substrate in which the channel groove is formed on the surface by injecting resin through a gate portion of injection molding into a cavity space formed by a molding die and cutting the gate portion. When,
The two channels are formed with the surface on which the channel groove is formed inward so that the surface of the resin substrate on which the channel groove is formed is not covered with another resin substrate. A bonding step of bonding a resin substrate;
Including
The width of the gate part to be cut is 15% or more and 90% or less of the width of the resin substrate on which the channel groove is formed,
The microchip manufacturing method, wherein the through hole and the channel groove are connected to each other.   2. The microchip according to claim 1, wherein the resin substrate on which the through hole is formed is provided with a protruding portion that surrounds the through hole and protrudes in a thickness direction of the resin substrate. Manufacturing method. In the substrate manufacturing step, the flow path groove is formed on the surface by injecting resin through the gate portion, and the gate portion is cut to form the gate portion used at the time of injection molding. The molded body left inside is made to protrude from the outer peripheral part and a resin substrate is left,
2. The joining step includes joining the two resin substrates with a surface on which the flow channel groove is formed inside avoiding a surface in the vicinity of the molded body. Item 3. A method for producing a microchip according to Item 2.   In the joining step, the two resin substrates are avoided by avoiding a surface in the vicinity of the gate portion and avoiding a surface within a range of 1 mm from a corner of one of the two resin substrates. The method for manufacturing a microchip according to claim 1, wherein the two are joined.   In the joining step, the two resin substrates are joined while avoiding a surface included in a range within 1 mm from all ends of one of the two resin substrates. The method for manufacturing a microchip according to any one of claims 1 to 4. Of the two resin substrates, the channel groove is formed on the surface of one resin substrate, and the other resin substrate is formed in the channel groove formed on the one resin substrate. A substrate having a shape along
In the joining step, the surface near the gate portion is avoided, and the other resin substrate is aligned with the position of the channel groove formed on the one resin substrate to the one resin substrate. 6. The method of manufacturing a microchip according to claim 1, wherein the two resin substrates are bonded to each other.   When all the end portions of the other resin substrate are overlapped with the one resin substrate so that the other resin substrate is aligned with the position of the channel groove formed on the one resin substrate 7. The method of manufacturing a microchip according to claim 6, wherein the microchip is included in a range within 2 mm from the channel groove formed on the one resin substrate. The channel groove includes a plurality of independent grooves that are not connected to each other, and the channel groove is formed on the surface of one of the two resin substrates, and the other resin substrate. The substrate includes a plurality of individual substrates according to the number of the plurality of grooves,
In the joining step, each of the plurality of individual substrates is aligned with each position of the plurality of grooves formed on the one resin substrate, and the individual substrate and the one resin substrate are provided for each independent groove. The method for manufacturing a microchip according to any one of claims 1 to 7, wherein:   All the end portions of the individual substrates are formed of the one resin substrate when the plurality of individual substrates are overlaid on the one resin substrate in accordance with the position of the groove formed on the one resin substrate. 9. The method of manufacturing a microchip according to claim 8, wherein the microchip is included in a range within 2 mm from the groove formed in the substrate.   The microchip manufacturing method according to claim 1, wherein the two resin substrates are made of a thermoplastic resin.   11. The micro according to claim 1, wherein in the joining step, the joining is performed by welding the two resin substrates in a state where the two resin substrates are overlapped. Chip manufacturing method.   The microchip manufacturing method according to claim 1, wherein a microchip used for electrophoretic analysis is manufactured by the bonding. A channel groove is formed on the surface of at least one of the two resin substrates, and a through hole is formed in at least one of the two resin substrates. A resin chip is a microchip joined with the surface on which the channel groove is formed inside,
The through hole and the channel groove are connected,
The resin substrate in which the channel groove is formed is a substrate formed by injecting resin through a gate part of injection molding into a cavity space formed by a molding die and cutting the gate part.
A part of the cut gate portion protrudes from the outer peripheral portion of the resin substrate,
The width of the gate portion is 15% or more and 90% or less of the width of the resin substrate on which the channel groove is formed,
The two resin substrates are bonded so that the surface in the vicinity of the gate portion of the resin substrate on which the flow path grooves are formed is not covered with another resin substrate. Chip.   14. The microchip according to claim 13, wherein the resin substrate on which the through hole is formed is provided with a protrusion that protrudes in a thickness direction of the resin substrate around the through hole. .   The two resin substrates are bonded to each other while avoiding the surface in the vicinity of the gate portion and avoiding the surface within a range of 1 mm from the corner of one of the two resin substrates. 15. The microchip according to claim 13, wherein the microchip is characterized in that:   The two resin substrates are bonded to each other so as to avoid a surface included in a range within 1 mm from all ends of one of the two resin substrates. The microchip according to any one of claims 13 to 15.   Of the two resin substrates, the channel groove is formed on the surface of one resin substrate, and the other resin substrate is formed in the channel groove formed on the one resin substrate. The other resin substrate avoids the surface in the vicinity of the gate portion, and matches the position of the channel groove formed in the one resin substrate. The microchip according to any one of claims 13 to 16, wherein the microchip is bonded to a resin substrate.   18. The micro of claim 17, wherein all end portions of the other resin substrate are included in a range within 2 mm from the channel groove formed on the one resin substrate. Chip.   The channel groove includes a plurality of independent grooves that are not connected to each other, and the channel groove is formed on the surface of one of the two resin substrates, and the other resin substrate. The substrate includes a plurality of individual substrates corresponding to the number of the plurality of grooves, and each of the plurality of individual substrates is independently adapted to each position of the plurality of grooves formed on the one resin substrate. The microchip according to any one of claims 13 to 18, wherein each of the grooves is joined to the one resin substrate.   20. The microchip according to claim 19, wherein all end portions of the individual substrate are included within a range of 2 mm or less from the groove formed in the one resin substrate.   21. The microchip according to claim 13, wherein the two resin substrates are made of a thermoplastic resin.   The microchip according to any one of claims 13 to 21, wherein the two resin substrates are bonded together by welding.   The microchip according to any one of claims 13 to 22, wherein the microchip is used for electrophoretic analysis.

Images