JPWO2010016399A1 - Microchip, microchip manufacturing method, and microchip manufacturing apparatus - Google Patents

Abstract

The present invention provides a manufacturing method, a manufacturing apparatus, and a microchip manufactured by the manufacturing method for manufacturing a microchip having protrusions on the surface thereof with uniform and strong bonding strength. The microchip manufacturing apparatus 5 that heat-bonds the stomach surfaces of the two resin substrates 10 and 20 that are laminated and have the fine flow passages 15 and 16 formed inside has the resin substrates 10 and 20 facing each other. Two pressing means 6 and 7 are provided which are sandwiched and heated. As for the resin-made board | substrates 10, the protrusion part 41 is provided in the back surface 10B. The pressing means 6 and 7 press the distal end 411 and the base end face 410 of the protrusion 41 on the resin substrate 10 to the resin substrate 20 side by the pressing means 6, and the rear surface 20 </ b> B of the resin substrate 20 by the pressing means 7. The resin substrates 10 and 20 are heat bonded by pressing toward the resin substrate 10 side.

Description

  The present invention relates to a microchip, a microchip manufacturing method, and a microchip manufacturing apparatus.

  2. Description of the Related Art Conventionally, in a technical field that performs chemical reaction, separation, analysis, and the like of a liquid sample such as nucleic acid, protein, and blood in a minute space, a microchip having a minute channel or circuit formed therein has been put into practical use.

  Such a microchip has two substrates formed of resin or the like, and after fine processing is performed on at least one substrate, the two substrates are sandwiched between hot plates and bonded together. It is manufactured.

  By the way, as said microchip, there exists what was provided in the surface by the projection part which is fitted by the tube etc. and introduces or discharge | releases a sample (for example, refer patent document 1).

JP 2006-234600 A

  However, since Patent Document 1 does not disclose a specific method for pressing the substrates provided with the protrusions from the side of the protrusions to join the substrates together, simply manufacturing such a microchip. Then, the bonding strength between the substrates decreases or varies within the bonding surface.

  An object of the present invention is to provide a microchip, a microchip manufacturing method, and a microchip manufacturing apparatus capable of manufacturing a microchip having protrusions on the surface thereof with uniform and strong bonding strength.

According to the first aspect of the present invention, there is provided a microchip for sandwiching two substrates, which are laminated to form a flow path on the inside, between two pressing means facing each other, and heat-bonding the stomach surfaces of these substrates. In the manufacturing method,
Of the two substrates, one having at least one protrusion on the back is used as one substrate.
Of the two pressing means, one pressing means presses at least one of the tip end and the base end face of the one substrate toward the other substrate side, and the other pressing means presses the other substrate. A bonding step is performed in which the back surface is pressed against the one substrate side and the substrates are heated and bonded.

In the manufacturing method of the microchip of the present invention,
As the one pressing means,
A hole that is disposed so as to face the back surface of the one substrate and accommodates the protrusion in a position facing the protrusion is formed through the thickness direction, and is thicker than the length of each protrusion. A large plate-shaped member,
A columnar member accommodated in the hole in a state of being relatively movable with respect to each hole,
Use what has
In the joining step,
The plate-shaped member and each columnar member are moved independently in the contact / separation direction with respect to the one substrate,
While pressing the base end surface of the projection to the other substrate side by the plate-like member,
It is preferable that the tip of the protrusion located inside the hole is pressed to the other substrate side by the columnar member.

Further, in the microchip manufacturing method of the present invention,
As the one pressing means,
A hole that is disposed so as to face the back surface of the one substrate and accommodates the protrusion in a position facing the protrusion is formed through the thickness direction, and is thicker than the length of each protrusion. A first plate-like member having a small
A second plate-shaped member disposed opposite to the surface on the opposite side of the surface on the one substrate side of the first plate-shaped member;
Use what has
In the joining step,
Moving the first plate-like member and the second plate-like member independently in the contact / separation direction with respect to the one substrate;
While pressing the base end surface of the protrusion to the other substrate side by the first plate-like member,
It is preferable that the tip of the protrusion protruding from the hole is pressed toward the other substrate by the second plate member.

Further, in the microchip manufacturing method of the present invention,
As the one pressing means,
A plate having a plate-like member that is disposed so as to face the back surface of the one substrate and has a hole that accommodates the protrusion at a position opposed to each protrusion in the thickness direction is used.
In the joining step,
Moving the plate-like member in the contacting / separating direction with respect to the one substrate;
It is preferable that the base end surface of the protrusion is pressed against the other substrate side by the plate member.

Further, in the microchip manufacturing method of the present invention,
As the one pressing means,
Using one having a plate-like member disposed so as to face the back surface of the one substrate and facing each protrusion,
In the joining step,
Moving the plate-like member in the contacting / separating direction with respect to the one substrate;
It is preferable that the tip of the protrusion is pressed toward the other substrate by the plate-like member.

Further, in the microchip manufacturing method of the present invention,
As the one pressing means,
The one substrate is disposed so as to face the back surface, accommodates the protrusion at a position facing each protrusion, and has a hole having a depth corresponding to the length of the protrusion in the thickness direction. Use what has a plate-like member,
In the joining step,
Moving the plate-like member in the contacting / separating direction with respect to the one substrate;
While pressing the base end surface of the protrusion to the other substrate side by the surface of the plate-like member,
It is preferable that the tip of the protrusion located inside the hole is pressed toward the other substrate by the bottom surface of the hole.

According to the second aspect of the present invention, in the microchip,
It is manufactured by the method for manufacturing a microchip of the present invention.

Moreover, according to the third aspect of the present invention, in the microchip manufacturing apparatus for heating and bonding the abdominal surfaces of the two substrates that are laminated to form the flow path inside,
Two pressing means for heating and bonding with the two substrates sandwiched between each other,
Of the two substrates, one substrate has at least one protrusion provided on the back surface,
The two pressing means are:
While pressing at least one of the tip end and the base end face of the one substrate on the other substrate side by one pressing means,
Pressing the back surface of the other substrate to the one substrate side by the other pressing means;
These substrates are heat-bonded.

In the microchip manufacturing apparatus of the present invention,
The one pressing means is
A hole that is disposed so as to face the back surface of the one substrate and accommodates the protrusion in a position facing the protrusion is formed through the thickness direction, and is thicker than the length of each protrusion. A large plate-shaped member,
A columnar member accommodated in the hole in a state of being relatively movable with respect to each hole,
Moving means for independently moving the plate-like member and each columnar member in the contact / separation direction with respect to the one substrate;
Have
While pressing the base end surface of the projection to the other substrate side by the plate-like member,
It is preferable that the tip of the protrusion located inside the hole is pressed to the other substrate side by the columnar member.

In the microchip manufacturing apparatus of the present invention,
The one pressing means is
A hole that is disposed so as to face the back surface of the one substrate and accommodates the protrusion in a position facing the protrusion is formed through the thickness direction, and is thicker than the length of each protrusion. A first plate-like member having a small
A second plate-shaped member disposed opposite to the surface on the opposite side of the surface on the one substrate side of the first plate-shaped member;
Moving means for independently moving the first plate-like member and the second plate-like member in the contact / separation direction with respect to the one substrate;
Have
While pressing the base end surface of the protrusion to the other substrate side by the first plate-like member,
It is preferable that the tip of the protrusion protruding from the hole is pressed toward the other substrate by the second plate member.

In the microchip manufacturing apparatus of the present invention,
The one pressing means is
A plate-like member which is disposed so as to face the back surface of the one substrate, and has a hole formed therein penetrating in the thickness direction at a position opposed to each projection;
A moving means for moving the plate-like member in the contact / separation direction with respect to the one substrate;
Have
It is preferable that the base end surface of the protrusion is pressed against the other substrate side by the plate member.

In the microchip manufacturing apparatus of the present invention,
The one pressing means is
A plate-like member disposed to face the back surface of the one substrate and facing each protrusion;
A moving means for moving the plate-like member in the contact / separation direction with respect to the one substrate;
Have
It is preferable that the tip of the protrusion is pressed toward the other substrate by the plate-like member.

In the microchip manufacturing apparatus of the present invention,
The one pressing means is
The one substrate is disposed so as to face the back surface, accommodates the protrusion at a position facing each protrusion, and has a hole having a depth corresponding to the length of the protrusion in the thickness direction. A plate-like member;
A moving means for moving the plate-like member in the contact / separation direction with respect to the one substrate;
Have
While pressing the base end surface of the protrusion to the other substrate side by the surface of the plate-like member,
It is preferable that the tip of the protrusion located inside the hole is pressed toward the other substrate by the bottom surface of the hole.

  According to the present invention, one of the two substrates having at least one protrusion provided on the back surface is used as one substrate, and the protrusion on one substrate is pressed by one of the two pressing means. Since at least one of the front end surface and the base end surface is pressed to the other substrate side, and the back surface of the other substrate is pressed to the one substrate side by the other pressing means, and these substrates are heated and bonded. It is possible to prevent the bonding strength from being lowered or scattered in the bonding surface. Therefore, a microchip having a protrusion on the surface can be manufactured with uniform and strong bonding strength.

It is a top view of the microchip concerning the present invention. 4 is a cross-sectional view of the microchip according to the present invention, and is a cross-sectional view taken along the line IV-IV in FIG. It is a top view of the resin-made board | substrates in which the groove | channel for flow paths was formed. It is a conceptual diagram which shows schematic structure of the manufacturing apparatus of the microchip which concerns on this invention. 3 is a conceptual diagram showing an outline of a gap 73 formed between a surface of a columnar member 71 facing the resin substrate 20 and a tip 411 of a protrusion 41. FIG. It is a conceptual diagram which shows schematic structure of the modification of the manufacturing apparatus of the microchip which concerns on this invention. It is a conceptual diagram which shows schematic structure of the modification of the manufacturing apparatus of the microchip which concerns on this invention. It is a conceptual diagram which shows schematic structure of the modification of the manufacturing apparatus of the microchip which concerns on this invention. It is a conceptual diagram which shows schematic structure of the modification of the manufacturing apparatus of the microchip which concerns on this invention.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a top view of a microchip 1 according to the present invention, and FIG. 2 is a sectional view taken along line IV-IV in FIG.

  As shown in these drawings, the microchip 1 includes two rectangular plate-like resin substrates 10 and 20 which are laminated and bonded to each other on the inner stomach surfaces 10A and 20A.

  Among these, linear flow path grooves 12 and 13 are formed on the abdominal surface 10A of the resin substrate 10 as shown in FIGS. Further, as shown in FIG. 3, through-holes 14 penetrating in the thickness direction of the resin substrate 10 are respectively formed at both ends of the flow path grooves 12 and 13. In addition, although the channel groove 12 and the channel groove 13 in the present embodiment are formed orthogonal to each other, they may be formed without being orthogonal to each other.

  A cylindrical protrusion 41 is provided around each through-hole 14 in the back surface 10 </ b> B of the resin substrate 10. These protrusions 41 surround the through-holes 14 and protrude in the thickness direction of the resin substrate 10 and are fitted into tubes and nozzles of an analyzer (not shown) to introduce and discharge samples and the like. To do. In addition, such a protrusion 41 may have a cylindrical shape, or may have another shape such as a polygonal shape. Moreover, the dimension of the protrusion part 41 is arbitrarily set according to the dimension of a tube or a nozzle.

  On the other hand, as shown in FIG. 2, the resin substrate 20 is a member having a smooth surface, and is joined to the abdominal surface 10 </ b> A (formation surface of the flow path grooves 12 and 13) in the resin substrate 10. By this bonding, the resin substrate 20 functions as a cover (cover) for the flow path grooves 12 and 13 and the through hole 14, and the fine flow path 15 is formed between the flow path grooves 12 of the resin substrate 10 and the flow path. A fine channel 16 is formed between the groove 13 and the through hole 14 to form an opening 17.

  Here, the shape of the microchannels 15 and 16 (channel grooves 12 and 13) takes into consideration the fact that the amount of analysis sample and reagent used can be reduced, the fabrication accuracy of molds, transferability, and mold release properties. The width and the depth are preferably in the range of 10 μm to 200 μm, but are not particularly limited, and may be determined according to the use of the microchip. And may be the same or different. In the present embodiment, the cross-sectional shape of the microchannels 15 and 16 is a rectangular shape, but this shape is an example, and other shapes such as a circular shape may be used.

  Since the through hole 14 of the resin substrate 10 is connected to the flow path grooves 12 and 13 as described above, the opening 17 formed by the through hole 14 is connected to the fine flow paths 15 and 16. . The opening 17 is a hole for introducing, storing, and discharging a gel, a sample, and a buffer solution, and is connected to a tube or nozzle provided in an analyzer (not shown). Thus, a gel, a sample, a buffer solution, or the like is introduced into or discharged from the fine channels 15 and 16. Note that the shape of the opening 17 (through hole 14) is not limited to a circular shape, and may be various other shapes such as a rectangular shape. Further, the inner diameter of the opening 17 (through hole 14) may be adjusted to the analysis method or the analysis apparatus, and is preferably about 2 mm, for example.

  The shape of the resin substrates 10 and 20 may be any shape as long as it is easy to handle and analyze. For example, a shape such as a square, a rectangle, or a circle is preferable. Further, the size of the resin substrates 10 and 20 is preferably about 10 mm square to 200 mm square, and more preferably 10 mm square to 100 mm square. In addition, the plate thickness of the resin substrate 10 on which the channel grooves 12 and 13 are formed is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability. The thickness of the resin substrate 20 functioning as a lid (cover) is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability. However, when the channel groove is not formed in the resin substrate 20 as in the present embodiment, a film (sheet member) may be used as the resin substrate 20 instead of a plate member. . In this case, the thickness of the film is preferably 30 μm to 300 μm, and more preferably 50 μm to 150 μm.

  Resin is used for the material of the resin substrates 10 and 20. As this resin, those having good moldability (transferability, releasability), high transparency, and low autofluorescence with respect to ultraviolet rays and visible light are preferable. For example, thermoplastic resins are used.

  Examples of the thermoplastic resin include polycarbonate, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, polyethylene terephthalate, nylon 6, nylon 66, polyvinyl acetate, polyvinylidene chloride, polypropylene, polyisoprene, polyethylene, polydimethyl. It is preferable to use siloxane, cyclic polyolefin or the like. It is particularly preferable to use polymethyl methacrylate and cyclic polyolefin. The resin substrate 10 and the resin substrate 20 may be made of the same material or different materials.

  In addition to the thermoplastic resin, a thermosetting resin, an ultraviolet curable resin, or the like may be used for the resin substrate 20 in which the channel groove is not formed. As the thermosetting resin, polydimethylsiloxane is preferably used.

  The resin substrate 10 on which the flow path grooves 12 and 13 are formed is preferably formed by an injection molding method or a press molding method, and the resin substrate 20 on which the flow path grooves are not formed is formed by an extrusion molding method. It may be produced by a method other than an injection molding method such as a T-die molding method, an inflation molding method, or a calendar molding method, or by an injection molding method.

  Then, the manufacturing apparatus of said microchip 1 is demonstrated.

  FIG. 4 is a conceptual diagram showing a schematic configuration of a microchip manufacturing apparatus (hereinafter referred to as a manufacturing apparatus) 5. In this figure, the microchip 1 is shown in a simplified manner.

  As shown in this figure, the manufacturing apparatus 5 includes two pressing means 6 and 7 that are heat-bonded with the resin substrates 10 and 20 interposed therebetween. In the following description, the resin substrate 20 is disposed between the pressing means 6 and 7 so that the resin substrate 20 is on the upper side and the resin substrate 10 is on the lower side. This will be explained.

  Among these, the pressing means 6 that presses the resin substrate 20 toward the resin substrate 10 includes a plate-like hot plate 60 facing the back surface 20 </ b> B of the resin substrate 20, and the hot plate 60 against the resin substrate 20. And moving means 62 for moving in the contact / separation direction (vertical direction in the figure). Here, the heat plate 60 is configured to be able to heat the resin substrate 20 in a state of being in contact with the resin substrate 20, and has a size larger than the back surface 20 </ b> B of the resin substrate 20. As such a hot plate 60 and moving means 62, conventionally known ones can be used.

  The above pressing means 6 is configured to press the back surface 20 </ b> B of the resin substrate 20 toward the resin substrate 10 by the hot plate 60.

  On the other hand, the pressing means 7 that presses the resin substrate 10 toward the resin substrate 20 faces the back surface 10B of the resin substrate 10 and has a hole 700 penetrating in the thickness direction at a position facing each protrusion 41. The formed plate-shaped heat plate 70, the columnar member 71 accommodated in each hole 700 in a state of being relatively movable with respect to the hole 700, and the heat plate 70 and each columnar member 71 are attached to the resin substrate 10. And a moving means 72 that moves independently in the contact / separation direction (vertical direction in the drawing).

  Here, the heat plate 70 is configured to be able to heat the resin substrate 10 in contact with the resin substrate 10, and is larger than the back surface 10 </ b> B of the resin substrate 10, and the length of each protrusion 41. It is formed in a dimension having a thickness larger than the thickness dimension. Further, on the upper surface (surface on the resin substrate 10 side) of the hot plate 70 in the present embodiment, an annular protrusion 701 that fits with the side peripheral surface of the resin substrate 10 is formed. Although the movement of 10 in the lateral direction is restricted, the protrusion 701 may not be formed. Further, the hole 700 of the hot plate 70 is formed to have a size capable of accommodating the protrusion 41. In the present embodiment, the protrusion 41 is loosely fitted. It is also possible to combine them. In addition, the columnar member 71 is formed to have a size that fits into the hole 700, but may be formed to have a size that fits loosely into the hole 700 as long as it can move relative to the hole 700. The columnar member 71 may be configured to heat the resin substrate 10.

  When the resin substrates 10, 20 are stacked one above the other and disposed between the hot plates 60, 70, the surface of each columnar member 71 that faces the resin substrate 20 contacts the tip 411 of the protrusion 41. However, a gap 73 may occur as shown in FIG. 5 due to a manufacturing error of the resin substrate 20 or the like. When the gap 73 is generated, when the columnar member 71 is moved in the direction of the resin substrate 20 by using the moving means 72, an imbalance occurs between the forces applied to the protrusions 41, and the resin substrates 10 and 20 are connected to each other. May be difficult to bond with sufficient bonding strength. Therefore, when the gap 73 is generated, it is preferable to fill the gap 73 by inserting a spacer (not shown) corresponding to the thickness of the gap 73. By filling the gap 73 and equalizing the force that each columnar member 71 applies to the tip 411 of each protrusion 41, the resin substrates 10 and 20 can be bonded with sufficient bonding strength.

  The above pressing means 7 presses the base end face 410 of the protrusion 41, that is, the back surface 10 </ b> B of the resin substrate 10, toward the resin substrate 20 by the hot plate 70, and also the protrusion 41 located inside the hole 700. The tip 411 is pressed against the resin substrate 20 side by the columnar member 71.

  Then, the manufacturing method of the microchip 1 is demonstrated.

  First, a release agent (not shown) for preventing the resin substrates 10 and 20 from sticking is applied to the inner side surfaces of the two hot plates 60 and 70 (the lower surface of the hot plate 60 and the upper surface of the hot plate 70). (Application process). A conventionally known release agent can be used as such a release agent.

  Next, the resin substrates 10 and 20 are stacked one above the other with the formation surface (abdominal surface 10A) of the flow path grooves 12 and 13 in the resin substrate 10 facing inward (upper side), and between the hot plates 60 and 70. It arranges in. At this time, the protrusion 41 of the resin substrate 10 is opposed to the hole 700 of the hot plate 70.

  Next, the hot plate 60 and the columnar members 70 and 70 are formed by bringing the hot plate 60 close to the hot plate 70 by the moving unit 62 and making the hot plate 70 and each columnar member 71 close to the hot plate 60 independently by the moving unit 72. The resin substrates 10 and 20 are sandwiched between the members 71. When the gap 73 is generated, a spacer (not shown) is inserted to fill the gap 73. At this time, the pressing means 6 presses the back surface 20 </ b> B of the resin substrate 20 toward the resin substrate 10 by the hot plate 60. Further, the pressing means 7 presses the base end surface 410 (the back surface 10B of the resin substrate 10) of the protrusion 41 to the resin substrate 20 side by the hot plate 70, and the protrusion 41 located inside each hole 700. The tip 411 is pressed against the resin substrate 20 side by each columnar member 71 (see the arrow in FIG. 4).

  In this state, the resin substrates 10 and 20 are heated and bonded while being pressed (bonding step), and then the hot plates 60 and 70 are separated from each other by the moving means 62 and 72, whereby the microchip 1 is manufactured.

  Here, the resin substrate 10 and the resin substrate 20 are joined by heat welding such as thermocompression bonding or heat lamination. By applying thermocompression bonding or heat laminating to the resin substrates 10 and 20, the resin on the bonding surfaces (abdominal surfaces 10A and 20A) of the resin substrates 10 and 20 is melted, and the resin substrate 10 and the resin substrate 20 are melted. Are joined together to form the microchip 1. In addition, as heating temperature, the temperature of 70 to 200 degreeC can be used, for example. Further, the resin substrate 10 and the resin substrate 20 may be joined by laser welding or ultrasonic welding instead of thermocompression bonding or thermal lamination. In the case of laser welding, in a state where the resin substrates 10 and 20 are overlapped, the bonding surfaces are melted by irradiating the resin substrates 10 and 20 with laser, and the resin substrate 10 and the resin substrate are further melted. 20 and pressurizing to join. For example, the substrates are bonded together by scanning the resin substrates with a laser intensity of 0.1 W to 20 W. Further, in the case of ultrasonic welding, the bonding surfaces are melted by irradiating the resin substrates 10 and 20 with ultrasonic waves in a state where the resin substrates 10 and 20 are stacked, and further, the resin substrate 10 And the resin substrate 20 are pressed together. For example, the substrates are bonded together by applying pressure to the resin substrates while applying ultrasonic waves of 10 kHz to 50 kHz. When the resin substrates 10 and 20 are joined by laser welding or ultrasonic welding, pressure is applied by the pressing means 6 and 7.

  According to the microchip manufacturing apparatus 5 described above, the resin substrate 10 having the protrusions 41 provided on the back surface 10B is used, and the back surface 20B of the resin substrate 20 is fixed to the resin substrate by the hot plate 60 of the pressing means 6. 10, and the base plate 410 and the tip 411 of the protrusion 41 of the resin substrate 10 are pressed against the resin substrate 20 side by the hot plate 70 and the columnar member 71 of the pressing means 7, and these resin products are used. Since the substrates 10 and 20 are heat-bonded, it is possible to prevent the bonding strength between the resin substrates 10 and 20 from being lowered or from being varied in the bonding surface. Therefore, the microchip 1 provided with the protrusions 41 on the surface can be manufactured with a uniform and strong bonding strength.

  In addition, since the base plate 410 and the tip 411 of the protrusion 41 of the resin substrate 10 are pressed against the resin substrate 20 side by the hot plate 70 and the columnar member 71, respectively, compared with a case where only one of them is pressed. It is possible to press on a wide surface. Accordingly, the microchip 1 can be manufactured with more uniform and strong bonding strength.

  In addition, since the tip 411 of each projection 41 is independently pressed by each columnar member 71, the tip 411 of each projection 41 can be reliably pressed even when the length of the projection 41 varies. Can do. Accordingly, the microchip 1 can be manufactured with more uniform and strong bonding strength.

This is particularly effective when the variation in the height dimension of the protrusion 41 is as large as 30 μm or more.
[Modification (1)]
Next, a modification (1) of the microchip manufacturing apparatus according to the present invention will be described. In addition, the same code | symbol is attached | subjected to the component similar to said embodiment, and the description is abbreviate | omitted.

  As shown in FIG. 6, the microchip manufacturing apparatus 5 </ b> A according to the modification (1) includes a pressing unit 7 </ b> A instead of the pressing unit 7.

  This pressing means 7A has two hot plates 70A and 70B and a moving means 72A.

  Among these, the hot plate 70 </ b> A is a plate-like member facing the back surface 10 </ b> B of the resin substrate 10, and is configured to be able to heat the resin substrate 10 in a state of being in contact with the resin substrate 10. The hot plate 70 </ b> A is larger than the back surface 10 </ b> B of the resin substrate 10 and has a thickness smaller than the length of each protrusion 41. A hole 700A that accommodates the protrusion 41 is formed in the hot plate 70A so as to penetrate each protrusion 41 in the thickness direction. In the modification (1), the hole 700A is formed to have a size for loosely fitting the protrusion 41.

  The hot plate 70B is a plate-like member that faces the surface opposite to the surface on the resin substrate 10 side (the lower surface in the drawing) of the hot plate 70A, and contacts the protrusion 41 on the resin substrate 10. The resin substrate 10 is configured to be able to be heated while in contact. In the present modification (1), the hot plate 70B is formed in the same dimension as the opposite surface. The hot plate 70B may be a plate-shaped member that does not heat the resin substrate 10.

  The moving means 72 </ b> A moves the hot plates 70 </ b> A and 70 </ b> B independently in the contact / separation direction with respect to the resin substrate 10.

  In such a manufacturing apparatus 5A, the resin substrate 10, 20 is disposed between the hot plates 60, 70A with the protrusion 41 of the resin substrate 10 facing the hole 700A of the hot plate 70A, and then moved. By making the hot plate 60 close to the hot plate 70A by means 62 and making the hot plates 70A and 70B close to the hot plate 60 independently by moving means 72A, the hot plate 60 and the hot plates 70A and 70B are made of resin. The substrates 10 and 20 are sandwiched. At this time, the base end surface 410 of the protrusion 41 is pressed against the resin substrate 20 by the hot plate 70A, and the tip 411 of the protrusion 41 protruding from the hole 700A is moved toward the resin substrate 20 by the hot plate 70B. Press (see arrow in the figure). And a joining process is performed in this state.

  According to the manufacturing apparatus 5A described above, the resin substrate 10 having the protrusions 41 provided on the back surface 10B is used, and the back surface 20B of the resin substrate 20 is moved to the resin substrate 10 side by the hot plate 60 of the pressing means 6. And the base plate 410 and the tip 411 of the projection 41 of the resin substrate 10 are pressed against the resin substrate 20 side by the hot plates 70A and 70B of the pressing means 7A. Since the heat-bonding is performed, it is possible to prevent the bonding strength between the resin substrates 10 and 20 from being lowered or varying in the bonding surface. Therefore, the microchip 1 provided with the protrusions 41 on the surface can be manufactured with a uniform and strong bonding strength.

  In addition, since the base plate 410 and the tip 411 of the protrusion 41 of the resin substrate 10 are pressed against the resin substrate 20 side by the hot plates 70A and 70B, respectively, it is wider than when only one of them is pressed. Pressing on the surface can be performed. Accordingly, the microchip 1 can be manufactured with more uniform and strong bonding strength.

This is effective when the variation in the height dimension of the protrusion 41 is about 5 to 30 μm, unlike the embodiment described above.
[Modification (2)]
Next, a modification (2) of the microchip manufacturing apparatus according to the present invention will be described. In addition, the same code | symbol is attached | subjected to the component similar to said embodiment, and the description is abbreviate | omitted.

  As shown in FIG. 7, the microchip manufacturing apparatus 5 </ b> C according to the modification (2) includes a pressing unit 7 </ b> C instead of the pressing unit 7.

  The pressing unit 7C includes a hot plate 70C and a moving unit 72C.

  Among these, the hot plate 70 </ b> C is a plate-like member that faces the back surface 10 </ b> B of the resin substrate 10, and is configured to be able to heat the resin substrate 10 in a state of being in contact with the resin substrate 10. The hot plate 70 </ b> C is formed with a size larger than the back surface 10 </ b> B of the resin substrate 10. A hole 700 </ b> C that accommodates the protrusion 41 is formed through the heat plate 70 </ b> C at a position facing each protrusion 41 in the thickness direction. In the modification (2), the hot plate 70C is formed to have a thickness larger than the length dimension of each protrusion 41, and the hole 700C is formed to have a dimension for loosely fitting the protrusion 41.

  The moving means 72 </ b> C moves the hot plate 70 </ b> C in the contact / separation direction with respect to the resin substrate 10.

  In such a manufacturing apparatus 5C, the protrusion 41 of the resin substrate 10 is opposed to the hole 700C of the hot plate 70C and the resin substrates 10 and 20 are disposed between the hot plates 60 and 70C, and then moved. The hot plate 60 is brought close to the hot plate 70C by the means 62, and the hot plate 70C is brought close to the hot plate 60 by the moving means 72C, thereby sandwiching the resin substrates 10 and 20 between the hot plate 60 and the hot plate 70C. At this time, the base end surface 410 of the protrusion 41 is pressed against the resin substrate 20 side by the hot plate 70C (see the arrow in the figure). And a joining process is performed in this state.

  According to the manufacturing apparatus 5C described above, the resin substrate 10 having the protrusions 41 provided on the back surface 10B is used, and the back surface 20B of the resin substrate 20 is moved to the resin substrate 10 side by the hot plate 60 of the pressing means 6. And pressing the base end surface 410 of the protrusion 41 of the resin substrate 10 to the resin substrate 20 side by the hot plate 70C of the pressing means 7C, and these resin substrates 10 and 20 are heat-bonded. It is possible to prevent the bonding strength between the resin substrates 10 and 20 from being lowered or varying in the bonding surface. Therefore, the microchip 1 provided with the protrusions 41 on the surface can be manufactured with a uniform and strong bonding strength.

  This is particularly effective when the hole 700C of the hot plate 70C is penetrated or when the depth is sufficient to create a sufficient gap with the tip 411 of the protrusion 41. This is because the pressing force acts on the base end face 410 of the protrusion 41 even when each protrusion 41 has a dimensional error or when the height is originally different.

In addition, this modified example (2) is compared with other modified examples when the inner diameter of the hole 700C is as small as 5 mm or less, or when the area of the base end face 410 is larger than the area of the tip 411 of the protrusion 41. Thus, it is effective in that strong bonding strength can be obtained.
[Modification (3)]
Next, a modification (3) of the microchip manufacturing apparatus according to the present invention will be described. In addition, the same code | symbol is attached | subjected to the component similar to said embodiment, and the description is abbreviate | omitted.

  As shown in FIG. 8, the microchip manufacturing apparatus 5 </ b> D in the modification (3) includes a pressing unit 7 </ b> D instead of the pressing unit 7.

  The pressing means 7D has a hot plate 70D and a moving means 72D.

  Among these, the hot plate 70 </ b> D is a plate-like member that opposes the back surface 10 </ b> B of the resin substrate 10, and is configured to be able to heat the resin substrate 10 while being in contact with the resin substrate 10. The hot plate 70 </ b> D is formed to have a size larger than the back surface 10 </ b> B of the resin substrate 10. A bottomed hole 700D that accommodates the protrusion 41 is formed in the thickness direction at a position facing each protrusion 41 in the hot plate 70D. In this modification (3), the hot plate 70D is formed to have a thickness larger than the length dimension of each projection 41, and the hole 700D allows the projection 41 to be loosely fitted, and the projection 41 on the bottom surface. It is formed in a size that abuts on the tip 411. Further, on the upper surface of the hot plate 70D in the present embodiment, an annular protrusion 701D that is loosely fitted to the side peripheral surface of the resin substrate 10 is formed, and restrains the movement of the resin substrate 10 in the lateral direction. However, the protruding portion 701D may not be formed.

  The moving means 72 </ b> D moves the hot plate 70 </ b> D in the contact / separation direction with respect to the resin substrate 10.

  In such a manufacturing apparatus 5D, the protrusion 41 of the resin substrate 10 is opposed to the hole 700D of the hot plate 70D so that the resin substrates 10 and 20 are disposed between the hot plates 60 and 70D, and then moved. The hot plate 60 is brought close to the hot plate 70D by the means 62, and the hot plate 70D is brought close to the hot plate 60 by the moving means 72D, thereby sandwiching the resin substrates 10 and 20 between the hot plate 60 and the hot plate 70D. At this time, the tip 411 of the protrusion 41 is pressed against the resin substrate 20 side with the bottom surface of the hole 700D in the hot plate 70D (see the arrow in the figure). And a joining process is performed in this state.

  According to the manufacturing apparatus 5D described above, the resin substrate 10 having the protrusions 41 provided on the back surface 10B is used, and the back surface 20B of the resin substrate 20 is moved to the resin substrate 10 side by the hot plate 60 of the pressing means 6. And the tip 411 of the protrusion 41 of the resin substrate 10 is pressed against the resin substrate 20 by the hot plate 70D of the pressing means 7D, and the resin substrates 10 and 20 are heat-bonded. It is possible to prevent the bonding strength between the substrates 10 and 20 from being lowered or from being varied in the bonding surface. Therefore, the microchip 1 provided with the protrusions 41 on the surface can be manufactured with a uniform and strong bonding strength.

  In the modification (3), the heating plate 70D has the hole 700D, and the bottom surface of the hole 700D is described as pressing the tip 411 of the protrusion 41. However, the tip 411 of the protrusion 41 is described. As long as it is pressed, it may be formed in a flat plate shape and press the tip 411 of the protrusion 41 on the surface.

In the configuration of the modification (3), although the base end surface 410 of the protrusion 41 cannot be pressed, the inner diameter of the hole 700D is relatively large (for example, 5 mm or more), or the base end surface 410 of the protrusion 41 is When the area of the tip 411 of the protrusion 41 is larger than the area, it is effective to obtain a stronger bonding strength than other modified examples.
[Modification (4)]
Next, a modification (4) of the microchip manufacturing apparatus according to the present invention will be described. In addition, the same code | symbol is attached | subjected to the component similar to said embodiment, and the description is abbreviate | omitted.

  As shown in FIGS. 1, 3, and 9, the microchip 1E in the modification (4) has a resin substrate 10E instead of the resin substrate 10, and the resin substrate 10E has a protrusion. Instead of 41, a protrusion 41E is provided.

  The protrusion 41E is different from the protrusion 41 in that the diameter is reduced from the proximal end side toward the distal end side.

  As shown in FIG. 9, the microchip manufacturing apparatus 5 </ b> E according to the modification (4) includes a pressing unit 7 </ b> E instead of the pressing unit 7.

  The pressing means 7E has a hot plate 70E and a moving means 72E.

  Among these, the hot plate 70E is a plate-like member facing the back surface 10B of the resin substrate 10E, and is configured to be able to heat the resin substrate 10E in a state of being in contact with the resin substrate 10E. The hot plate 70E is formed in a size larger than the back surface 10B of the resin substrate 10E. In the position opposite to each protrusion 41E on the heat plate 70E, the protrusion 41E is accommodated, and a hole 700E having a depth corresponding to the length of the protrusion 41E is formed in the thickness direction. In this modification (4), the hot plate 70E is formed to have a thickness larger than the length dimension of each projection 41E, and the hole 700E fits the projection 41E and the projection 41E on the bottom surface. It is formed in a size that abuts on the tip 411.

  The moving means 72E moves the hot plate 70E in the contact / separation direction with respect to the resin substrate 10E.

  In such a manufacturing apparatus 5E, the protrusion 41E of the resin substrate 10E is opposed to the hole 700E of the hot plate 70E, and the resin substrates 10E and 20 are disposed between the hot plates 60 and 70E, and then moved. The hot plate 60 is brought close to the hot plate 70E by the means 62, and the hot plate 70E is brought close to the hot plate 60 by the moving means 72E, whereby the resin boards 10E and 20 are sandwiched between the hot plate 60 and the hot plate 70E. At this time, the base end surface 410 of the protrusion 41E is pressed against the resin substrate 20 side by the surface of the hot plate 70E, and the tip 411 and the side peripheral surface of the protrusion 41E located inside the hole 700E are connected to the hole. It is pressed to the resin substrate 20 side by the bottom surface or inner wall surface of 700E (see the arrow in the figure). And a joining process is performed in this state.

  According to the manufacturing apparatus 5E described above, the resin substrate 10E having the protrusion 41E provided on the back surface 10B is used, and the back surface 20B of the resin substrate 20 is moved to the resin substrate 10E side by the hot plate 60 of the pressing means 6. And the base end surface 410 and the tip 411 of the protrusion 41E of the resin substrate 10E are pressed against the resin substrate 20 side by the surface of the hot plate 70E and the bottom surface of the hole 700E in the pressing means 7E. Since the substrates 10E and 20 are heat-bonded, it is possible to prevent the bonding strength between the resin substrates 10E and 20 from being lowered or varying within the bonding surface. Therefore, the microchip 1 provided with the protrusions 41E on the surface can be manufactured with uniform and strong bonding strength.

  Moreover, since the base end surface 410 and the front end 411 of the protrusion 41E in the resin substrate 10E are pressed against the resin substrate 20 side by the surface of the hot plate 70E and the bottom surface of the hole 700E, respectively, only one of them is pressed. Compared with, it can press on a wide surface. Accordingly, the microchip 1E can be manufactured with more uniform and strong bonding strength.

  Moreover, since the side peripheral surface of the protrusion 41E is pressed against the resin substrate 20 side by the inner peripheral surface of the hole 700E, it is possible to press on a wider surface. Accordingly, the microchip 1E can be manufactured with more uniform and strong bonding strength.

  It should be noted that the present invention should not be construed as being limited to the above-described embodiments and modifications, and of course can be modified or improved as appropriate.

  For example, in the embodiment and the modification described above, the through hole 14 and the protrusions 41 and 41E have been described as being formed on the resin substrate 10, but by forming the resin substrate 20 on the resin substrate 20, an opening connected to the fine flow path. May be formed.

  Further, the uneven member provided on the back surface 10B of the resin substrates 10 and 10E is not limited to the protrusion 41 described above, and for example, from a switch or an analyzer for controlling the flow of the sample flowing in the fine channel. It may be a lens for condensing the light.

  In addition, although it has been described that the manufacturing apparatuses 5 and 5A are provided with two moving means, that is, the moving means 62 of the pressing means 6 and the moving means 72 and 72A of the pressing means 7 and 7A, the pressing means 7 and 7A. Only the moving means 72, 72A may be provided. On the other hand, the manufacturing apparatuses 5C to 5E have been described as being provided with two moving means, that is, the moving means 62 of the pressing means 6 and the moving means 72C to 72E of the pressing means 7C to 7E, but only one of them is provided. It may be provided.

1,1E Microchip 5,5A-5E Manufacturing equipment (Microchip manufacturing equipment)
6 Pressing means (the other pressing means)
7, 7A-7E pressing means (one pressing means)
10, 10E Resin substrate (one substrate)
10A Abdominal surface of resin substrate (abdominal surface of one substrate)
10B The back of the resin substrate (the back of one substrate)
15, 16 Fine channel (channel)
20 Resin substrate (the other substrate)
20A Abdominal surface of resin substrate (abdominal surface of the other substrate)
20B The back of the resin substrate (the back of the other substrate)
41, 41E Projection part 70A Hot plate (first plate-like member)
70B hot plate (second plate-like member)
71 Columnar member 72, 72A-72E Moving means 70, 70C-70E Hot plate (plate-shaped member)
410 Proximal end face 411 Protrusion tip 700, 700A-700E Hole

Claims (13)

In the method of manufacturing a microchip in which two substrates that are laminated and have a flow path formed inside are sandwiched between two pressing means facing each other, and the abdominal surfaces of these substrates are heated and bonded together.
Of the two substrates, one having at least one protrusion on the back is used as one substrate.
Of the two pressing means, one pressing means presses at least one of the tip end and the base end face of the one substrate toward the other substrate side, and the other pressing means presses the other substrate. A method of manufacturing a microchip, comprising performing a bonding step in which a back surface is pressed against the one substrate side to heat-bond these substrates. In the manufacturing method of the microchip of Claim 1,
As the one pressing means,
A hole that is disposed so as to face the back surface of the one substrate and accommodates the protrusion in a position facing the protrusion is formed through the thickness direction, and is thicker than the length of each protrusion. A large plate-shaped member,
A columnar member accommodated in the hole in a state of being relatively movable with respect to each hole,
Use what has
In the joining step,
The plate-shaped member and each columnar member are moved independently in the contact / separation direction with respect to the one substrate,
While pressing the base end surface of the projection to the other substrate side by the plate-like member,
A method of manufacturing a microchip, wherein the tip of the protrusion located inside the hole is pressed against the other substrate by the columnar member. In the manufacturing method of the microchip of Claim 1,
As the one pressing means,
A hole that is disposed so as to face the back surface of the one substrate and accommodates the protrusion in a position facing the protrusion is formed through the thickness direction, and is thicker than the length of each protrusion. A first plate-like member having a small
A second plate-shaped member disposed opposite to the surface on the opposite side of the surface on the one substrate side of the first plate-shaped member;
Use what has
In the joining step,
Moving the first plate-like member and the second plate-like member independently in the contact / separation direction with respect to the one substrate;
While pressing the base end surface of the protrusion to the other substrate side by the first plate-like member,
A method of manufacturing a microchip, wherein the tip of the protrusion protruding from the hole is pressed against the other substrate by the second plate-like member. In the manufacturing method of the microchip of Claim 1,
As the one pressing means,
A plate having a plate-like member that is disposed so as to face the back surface of the one substrate and has a hole that accommodates the protrusion at a position opposed to each protrusion in the thickness direction is used.
In the joining step,
Moving the plate-like member in the contacting / separating direction with respect to the one substrate;
A method of manufacturing a microchip, wherein the base end surface of the protrusion is pressed against the other substrate by the plate-like member. In the manufacturing method of the microchip of Claim 1,
As the one pressing means,
Using one having a plate-like member disposed so as to face the back surface of the one substrate and facing each protrusion,
In the joining step,
Moving the plate-like member in the contacting / separating direction with respect to the one substrate;
A method of manufacturing a microchip, wherein the tip of the protrusion is pressed against the other substrate by the plate-like member. In the manufacturing method of the microchip of Claim 1,
As the one pressing means,
The one substrate is disposed so as to face the back surface, accommodates the protrusion at a position facing each protrusion, and has a hole having a depth corresponding to the length of the protrusion in the thickness direction. Use what has a plate-like member,
In the joining step,
Moving the plate-like member in the contacting / separating direction with respect to the one substrate;
While pressing the base end surface of the protrusion to the other substrate side by the surface of the plate-like member,
A method of manufacturing a microchip, wherein the tip of the projection located inside the hole is pressed against the other substrate side by the bottom surface of the hole.   A microchip manufactured by the method for manufacturing a microchip according to claim 1. In a microchip manufacturing apparatus that heat-bonds the abdominal surfaces of two substrates that are laminated to form a flow path inside,
Two pressing means for heating and bonding with the two substrates sandwiched between each other,
Of the two substrates, one substrate has at least one protrusion provided on the back surface,
The two pressing means are:
While pressing at least one of the tip end and the base end face of the one substrate on the other substrate side by one pressing means,
Pressing the back surface of the other substrate to the one substrate side by the other pressing means;
A microchip manufacturing apparatus characterized in that these substrates are bonded by heating. The microchip manufacturing apparatus according to claim 8,
The one pressing means is
A hole that is disposed so as to face the back surface of the one substrate and accommodates the protrusion in a position facing the protrusion is formed through the thickness direction, and is thicker than the length of each protrusion. A large plate-shaped member,
A columnar member accommodated in the hole in a state of being relatively movable with respect to each hole,
Moving means for independently moving the plate-like member and each columnar member in the contact / separation direction with respect to the one substrate;
Have
While pressing the base end surface of the projection to the other substrate side by the plate-like member,
An apparatus for manufacturing a microchip, wherein a tip of the protrusion located inside the hole is pressed against the other substrate by the columnar member. The microchip manufacturing apparatus according to claim 8,
The one pressing means is
A hole that is disposed so as to face the back surface of the one substrate and accommodates the protrusion in a position facing the protrusion is formed through the thickness direction, and is thicker than the length of each protrusion. A first plate-like member having a small
A second plate-shaped member disposed opposite to the surface on the opposite side of the surface on the one substrate side of the first plate-shaped member;
Moving means for independently moving the first plate-like member and the second plate-like member in the contact / separation direction with respect to the one substrate;
Have
While pressing the base end surface of the protrusion to the other substrate side by the first plate-like member,
The microchip manufacturing apparatus, wherein the tip of the protruding portion protruding from the hole is pressed against the other substrate by the second plate-like member. The microchip manufacturing apparatus according to claim 8,
The one pressing means is
A plate-like member which is disposed so as to face the back surface of the one substrate, and has a hole formed therein penetrating in the thickness direction at a position opposed to each projection;
A moving means for moving the plate-like member in the contact / separation direction with respect to the one substrate;
Have
The microchip manufacturing apparatus, wherein the base end surface of the protrusion is pressed against the other substrate by the plate-like member. The microchip manufacturing apparatus according to claim 8,
The one pressing means is
A plate-like member disposed to face the back surface of the one substrate and facing each protrusion;
A moving means for moving the plate-like member in the contact / separation direction with respect to the one substrate;
Have
The microchip manufacturing apparatus, wherein the tip of the protrusion is pressed toward the other substrate by the plate-like member. The microchip manufacturing apparatus according to claim 8,
The one pressing means is
The one substrate is disposed so as to face the back surface, accommodates the protrusion at a position facing each protrusion, and has a hole having a depth corresponding to the length of the protrusion in the thickness direction. A plate-like member;
A moving means for moving the plate-like member in the contact / separation direction with respect to the one substrate;
Have
While pressing the base end surface of the protrusion to the other substrate side by the surface of the plate-like member,
An apparatus for manufacturing a microchip, wherein a tip of the protrusion located inside the hole is pressed against the other substrate side by a bottom surface of the hole.