JPWO2009044469A1 - Tape bonding method and electronic component manufacturing method - Google Patents

Abstract

To increase production efficiency and prevent air bubbles between the workpiece and the tape member. Also, even if bubbles are generated, they should be removable. In this tape bonding method, the tape member is bonded to the work (11) disposed on the upper surface side of the stretchable sheet member (126). First, vacuum suction of the first vacuum chamber (V) located on the upper surface side of the elastic sheet member (126) is started by the first valve member (114), and then the lower surface side of the elastic sheet member (126). A vacuum step of starting vacuum suction of the second vacuum chamber located at the second valve member (115) and the like, and vacuum suction of both vacuum chambers; and an air introduction step of introducing air into the second vacuum chamber; An adhesion step of expanding the elastic sheet member (126) and lifting the work (11) toward the tape member so that the tape member does not adhere to the outer edge of the work (11) first; An air release step for introducing air into the vacuum chamber.

Description

  The present invention relates to a tape bonding method and an electronic component manufacturing method for bonding a tape member to a workpiece.

  In a semiconductor manufacturing process, in order to prevent contamination of the wafer surface and generation of scratches on the wafer surface, an adhesive protective tape may be attached to the wafer surface. As a tape bonding method for applying such a protective tape, a method of applying a roller by driving a roller is generally used.

  However, in addition to the roller method, for example, as shown in Patent Document 1, there is also a vacuum tape bonding method. In the tape bonding method disclosed in Patent Document 1, both the main body-side room and the upper lid-side room are evacuated, and the upper lid-side room is switched to atmospheric pressure from this state. Thereby, a differential pressure is generated between the chamber on the upper lid side and the room on the main body side, and the rubber sheet swells in the chamber on the main body side due to the differential pressure. And by this swelling, a rubber sheet presses a tape member, and the tape member used as a protective tape is adhere | attached with respect to a workpiece | work.

  Further, as another tape bonding method of the vacuum method, there is one disclosed in Patent Document 2. This Patent Document 2 discloses a technique for deflecting the central portion of the base with high smoothness toward the protective tape side by utilizing the differential pressure between the first vacuum chamber and the second vacuum chamber. Has been. At the same time, the wafer is lifted by driving the lifting device while pressing a base having a bent central portion against a protective tape affixed to the wafer. By doing in this way, the protective tape used as a tape member is adhere | attached with respect to a wafer, pushing out air toward the outward from the center side of a protective tape.

  In the configuration described in Patent Document 1, since the rubber sheet is located at the upper part, it is necessary to considerably increase the tension when the rubber sheet is stretched in order to remove the slackness of the rubber sheet. For this reason, it has the subject that attachment of a rubber sheet becomes difficult. Here, in order to efficiently perform the bonding operation, the gap between the protective tape in contact with the rubber sheet and the wafer is often reduced. If the rubber sheet is slack with such a small gap, there may be a problem that the protective tape adheres to the wafer and bubbles enter the adhesion surface from the stage before vacuum suction. In the configuration described in Patent Document 1, a plurality of push screws are provided, and it is necessary to rotate all of these push screws at the same time.

  Further, in the configuration described in Patent Document 2, a protective tape to which a wafer is attached by bending a base such as a glass plate using a differential pressure between the first vacuum chamber and the second vacuum chamber. The base is adhered to the substrate, and the protective tape and the base to which the wafer is further attached are lifted from the adhered state. For this reason, it has a two-step bonding process, which takes time and is not preferable in terms of cost. Further, since a separate lifting device is required to lift the wafer or the like, the configuration becomes complicated, and the cost increases accordingly.

  Here, the present applicant has applied for Patent Document 3 to improve these conventional tape bonding apparatuses. According to these, the malfunction with which the structure currently disclosed by the above-mentioned patent document 1 and patent document 2 grade | etc., Is removed.

Japanese Patent Laid-Open No. 2003-7808 (see paragraph number 0007, FIGS. 2 to 4) Japanese Unexamined Patent Publication No. 2000-349047 (summary, see FIGS. 1 to 5) Japanese Patent Laying-Open No. 2005-93987 (see abstract)

  However, in the tape bonding method described in Patent Document 3, although it is very useful in terms of preventing bubbles from entering the bonding surface, it is necessary to increase the degree of vacuum in order to completely eliminate the bubbles. Yes, manufacturing efficiency tends to deteriorate. Further, in the case of the technique described in Patent Document 3, when an attempt is made to increase the manufacturing efficiency by narrowing the gap between the tape member and the workpiece, sometimes bubbles remain on the bonding surface, resulting in poor bonding.

  The present invention has been made on the basis of the above circumstances, and the object of the present invention is to increase the production efficiency and to prevent the generation of bubbles between the workpiece and the tape member. And an electronic component manufacturing method. Another object of the present invention is to provide a tape bonding method and an electronic component manufacturing method that can be removed even if bubbles are generated.

  In order to solve the above-described problems, the tape bonding method of the present invention expands the stretchable sheet member toward the inside of the first vacuum chamber after a predetermined step such as a step of sucking the tape member side early, and the like. An adhesion step of lifting the work toward the tape member by the expansion of the elastic sheet member and bonding the tape member so as not to cause a state in which the tape member is bonded to the outer edge of the work and then bonded to the center of the work; After performing this bonding step, there is an air release step of operating the first air introduction means to introduce air into the first vacuum chamber.

  When such a method is adopted, since the tape member side is sucked early, the tape member does not lean on the workpiece side. For this reason, the space | interval of a tape member and a workpiece | work can be narrowed and manufacturing efficiency can be raised. Moreover, generation | occurrence | production of a bubble can also be prevented. Furthermore, since the tape member is adhered to the outer edge of the work so as not to adhere first, even if air bubbles are generated, the air bubbles can be discharged out of the work in the air release step. In addition, as a workpiece | work, as long as tape members, such as a wafer for semiconductor integrated circuits, a liquid crystal display body, and a glass substrate for a display, are adhered, all members are adopted.

  According to another aspect of the invention, there is provided a tape bonding method including a bonding step in which a tape member is bonded so as not to cause a state in which the tape member is bonded to the outer edge of the workpiece and then bonded to the center of the workpiece. As described above, since the tape member is adhered to the outer edge of the work so as not to be adhered first, even if air bubbles are generated, the air bubbles can be discharged out of the work in the air release step.

  According to another aspect of the invention, the tape bonding method further includes expanding the elastic sheet member toward the inside of the first vacuum chamber after a predetermined step such as a step of sucking the tape member side early, and expanding the elastic sheet member. The workpiece is lifted toward the tape member to bond the workpiece to the tape member, and after performing the bonding step, the first air introduction means is operated to introduce air into the first vacuum chamber. And an air release step for discharging air bubbles generated between the tape member and the workpiece to the outside of the workpiece.

  When such a method is adopted, the tape member side is sucked early, so that the tape member does not lean on the workpiece side. For this reason, the space | interval of a tape member and a workpiece | work can be narrowed and manufacturing efficiency can be raised. Further, the generation of bubbles can be prevented. Furthermore, even if bubbles are generated, the bubbles can be discharged out of the workpiece in the air release step.

  Further, the tape bonding method of another invention includes an air release step of introducing air into a space in which the work is arranged after the bonding step and discharging air bubbles generated between the tape member and the work to the outside of the work. It is what you have. Thus, in the present invention, even if bubbles are generated, the bubbles can be discharged out of the workpiece in the air release step.

  Further, in the tape bonding method of another invention, after the suction step, the workpiece is lifted toward the tape member, and the tape member is bonded to the outer edge of the workpiece first and then bonded to the center of the workpiece. An adhesion step for adhering so that air does not flow, and after performing the adhesion step, air is introduced into the space in which the workpiece is placed, and an air release step for discharging air bubbles generated between the tape member and the workpiece to the outside of the workpiece, It is what you have. As described above, in the present invention, the tape member is bonded to the outer edge of the work so as not to be bonded first and has an air release step. Even if it occurs, the bubbles can be discharged out of the work in the air release step.

  According to another aspect of the invention, the tape bonding method uses the one having a structure in which the first vacuum chamber is made small, and after performing the suction step for vacuum suction and the air introduction step, 1 is expanded toward the inside of the vacuum chamber, and the workpiece is lifted toward the tape member by the expansion of the stretchable sheet member, and the tape member is bonded to the outer edge of the workpiece and then bonded to the center of the workpiece. After performing the adhesion step to prevent the occurrence of the state, and the adhesion step, the first air introduction means was operated to introduce air into the first vacuum chamber, and this occurred between the tape member and the workpiece. And an air release step for discharging the bubbles out of the workpiece.

  When such a method is adopted, since the first vacuum chamber is small, the tape member side is sucked early, and the tape member does not lean on the workpiece side. For this reason, the space | interval of a tape member and a workpiece | work can be narrowed and manufacturing efficiency can be raised. Further, since the tape member is adhered so as not to adhere to the outer edge of the workpiece first, bubbles can be prevented from being generated at the center portion. Furthermore, even if bubbles are generated, the outer edge of the workpiece is not adhered, so that the bubbles can be discharged out of the workpiece in the air release step.

  Furthermore, the tape bonding method of another invention is such that the second vacuum chamber is subjected to a vacuum suction with a suction force smaller than that of the first vacuum chamber at least at the beginning, and other steps, and then the stretchable sheet member Is expanded toward the inside of the first vacuum chamber, and the workpiece is lifted toward the tape member by the expansion of the elastic sheet member, and the tape member is first bonded to the outer edge of the workpiece and then bonded to the center of the workpiece. After performing the bonding step so as not to occur, and the bonding step, the first air introducing means is operated to introduce air into the first vacuum chamber, which is generated between the tape member and the workpiece. And an air release step for discharging the bubbles out of the workpiece.

  When such a method is adopted, since the second vacuum chamber is vacuum-sucked with a suction force smaller than the first vacuum chamber at least at the beginning of suction, the tape member side is sucked earlier, The tape member does not lean on the workpiece side. For this reason, the space | interval of a tape member and a workpiece | work can be narrowed and manufacturing efficiency can be raised. Further, since the tape member is adhered so as not to adhere to the outer edge of the workpiece first, bubbles can be prevented from being generated at the center portion. Furthermore, even if bubbles are generated, the outer edge of the workpiece is not adhered, so that the bubbles can be discharged out of the workpiece in the air release step.

  Further, in the tape bonding method of another invention, after the suction step, the work is lifted toward the tape member, and a bubble dispersion bonding step is performed in which the air bubbles are dispersed between the tape member and the work and are adhered to the tape member. After performing the bubble dispersion bonding step, there is a bubble discharge step for introducing air into a space where the workpiece is placed and discharging the bubbles out of the workpiece. As described above, in the present invention, the tape member can be adhered to the workpiece in a state where bubbles remain, so that it is not necessary to increase the degree of vacuum, and the remaining bubbles are removed from the workpiece in the bubble discharging step. Since it is discharged, the bubbles generated between the workpiece and the tape member are finally reliably removed.

  Furthermore, the tape bonding method according to another aspect of the invention includes a suction step for vacuum suction, an air introduction step, and then an expansion sheet member is expanded toward the inside of the first vacuum chamber, and the expansion sheet member is expanded. A bubble dispersion bonding step of lifting the workpiece toward the tape member and bonding the bubble member to the tape member in a state where bubbles are dispersed between the tape member and the workpiece; and after performing the bubble dispersion bonding step, the first air introduction means A bubble discharging step of operating and introducing air into the first vacuum chamber and discharging the bubbles out of the workpiece.

  When such a method is adopted, the tape member can be adhered to the work with air bubbles remaining, so there is no need to increase the degree of vacuum and the distance between the tape member and the work is narrowed. can do. For this reason, it becomes possible to shorten the time required for the adhesion of the tape. Further, since the remaining bubbles are discharged out of the workpiece in the bubble discharging step, the bubbles generated between the workpiece and the tape member are finally surely removed. In addition, as a workpiece | work, as long as tape members, such as a wafer for semiconductor integrated circuits, a liquid crystal display body, and a glass substrate for a display, are adhered, all members are adopted.

  Furthermore, in the tape bonding method of another invention, when the predetermined step is performed, the side on which the tape member is disposed is sucked or strongly sucked earlier than the lower surface side of the stretchable sheet member, and the tape member is moved toward the work side. Prevents drooping.

  When such a method is adopted, the tape member side is sucked early and the tape member does not lean against the work side. Therefore, the interval between the tape member and the work can be narrowed, and the production efficiency can be increased. Moreover, generation | occurrence | production of a bubble can be prevented.

  Further, in the tape bonding method of another invention, when performing the predetermined step, the state in which the tape member is bonded to the outer edge of the workpiece and then bonded to the center of the workpiece does not occur in the bonding step. In the air release step, air bubbles generated between the tape member and the work are discharged out of the work.

  When such a method is employed, since the tape member is bonded to the outer edge of the workpiece so as not to be bonded first, bubbles can be prevented from being generated at the center portion. Furthermore, even if bubbles are generated, the outer edge of the workpiece is not adhered, so that the bubbles can be reliably discharged out of the workpiece in the air release step.

  In order to solve the above-described problems, an electronic component manufacturing method according to the present invention includes a suction step in which the tape member side is sucked early, a predetermined air introduction step, and then, the telescopic sheet member is placed inside the first vacuum chamber. The expansion of the elastic sheet member does not cause a state in which the workpiece is lifted toward the tape member and the tape member adheres to the outer edge of the workpiece and then adheres to the center of the workpiece. A bonding step for bonding the tape member, an air release step for operating the first air introduction means to introduce air into the first vacuum chamber after performing the bonding step, and moving or processing the workpiece to which the tape member is bonded. A workpiece processing step, and a tape peeling step for peeling the workpiece from the tape member.

  When this electronic component manufacturing method is employed, the tape member is not attracted to the workpiece side because the tape member side is sucked early. For this reason, the space | interval of a tape member and a workpiece | work can be narrowed and manufacturing efficiency can be raised. Further, the generation of bubbles can be prevented. Furthermore, since the tape member is adhered to the outer edge of the work so as not to adhere first, even if air bubbles are generated, the air bubbles can be discharged out of the work in the air release step. As a result, the work processing step and the tape peeling step can be executed reliably and stably, and the electronic parts can be stably produced.

  An electronic component manufacturing method according to another invention includes an adhesion step in which the tape member is adhered so as not to cause a state in which the tape member is first adhered to the outer edge of the workpiece and then adhered to the center of the workpiece. As described above, since the tape member is adhered to the outer edge of the work so as not to be adhered first, even if air bubbles are generated, the air bubbles can be discharged out of the work in the air release step.

  According to another aspect of the invention, there is provided an electronic component manufacturing method comprising: a sucking step in which the tape member side is sucked early; a predetermined air introducing step; and then expanding the expandable sheet member toward the inside of the first vacuum chamber. The expansion of the elastic sheet member lifts the workpiece toward the tape member, and performs the bonding step for bonding the workpiece to the tape member, and after performing the bonding step, the first air introduction means is operated to operate the first air introduction means. An air release step for introducing air into the vacuum chamber and discharging air bubbles generated between the tape member and the workpiece to the outside of the workpiece, a workpiece processing step for moving or processing the workpiece to which the tape member is bonded, and the workpiece for the tape member. And a tape peeling step for peeling from the tape.

  When such an electronic component manufacturing method is employed, the tape member is not attracted to the work side because the tape member side is sucked early. For this reason, the space | interval of a tape member and a workpiece | work can be narrowed and manufacturing efficiency can be raised. Further, the generation of bubbles can be prevented. Furthermore, even if bubbles are generated, the bubbles can be discharged out of the workpiece in the air release step. As a result, the work processing step and the tape peeling step can be executed reliably and stably, and the electronic parts can be stably produced.

  Further, in the electronic component manufacturing method according to another aspect of the invention, after performing the bonding step, air is introduced into a space in which the work is disposed, and an air release step for discharging air bubbles generated between the tape member and the work to the outside of the work. It is what has. Thus, in the present invention, even if bubbles are generated, the bubbles can be discharged out of the workpiece in the air release step.

  Further, in the electronic component manufacturing method of another invention, after the suction step, the workpiece is lifted toward the tape member, and the tape member is bonded to the outer edge of the workpiece and then bonded to the center of the workpiece. An adhesion step for adhering so as not to occur, an air release step for introducing air into a space in which the workpiece is placed after discharging the air, and discharging bubbles generated between the tape member and the workpiece to the outside of the workpiece; It is what has. As described above, in the present invention, the tape member is bonded to the outer edge of the work so as not to be bonded first and has an air release step. Even if it occurs, the bubbles can be discharged out of the work in the air release step.

  According to another aspect of the invention, there is provided a method of manufacturing an electronic component using a structure in which the first vacuum chamber is small, and a suction step in which the tape member side is sucked early, an air introduction step, and then an expandable sheet member. 1 is expanded toward the inside of the vacuum chamber, and the workpiece is lifted toward the tape member by the expansion of the stretchable sheet member, and the tape member is bonded to the outer edge of the workpiece and then bonded to the center of the workpiece. After performing the adhesion step to prevent the occurrence of the state, and the adhesion step, the first air introduction means was operated to introduce air into the first vacuum chamber, and this occurred between the tape member and the workpiece. And an air release step for discharging the bubbles out of the workpiece.

  When this electronic component manufacturing method is adopted, since the first vacuum chamber is small, the tape member side is sucked early, and the tape member does not lean on the workpiece side. For this reason, the space | interval of a tape member and a workpiece | work can be narrowed and manufacturing efficiency can be raised. Further, since the tape member is adhered so as not to adhere to the outer edge of the workpiece first, bubbles can be prevented from being generated at the center portion. Furthermore, even if bubbles are generated, the outer edge of the workpiece is not adhered, so that the bubbles can be discharged out of the workpiece in the air release step. As a result, the work processing step and the tape peeling step can be executed reliably and stably, and the electronic parts can be stably produced.

  In addition, in the electronic component manufacturing method according to another invention, the second vacuum chamber is at least initially sucked with a suction force smaller than that of the first vacuum chamber, an air introduction step, and then, The expandable sheet member is expanded toward the inside of the first vacuum chamber, and the workpiece is lifted toward the tape member by the expansion of the expandable sheet member. After the tape member is first bonded to the outer edge of the work, After performing the bonding step so that the state of bonding to the center does not occur, and after performing the bonding step, the first air introduction means is operated to introduce air into the first vacuum chamber, and the tape member and the workpiece An air release step for discharging air bubbles generated between the workpiece, a workpiece processing step for moving or processing the workpiece to which the tape member is bonded, and the workpiece from the tape member. Gas has a tape peeling step.

  When such an electronic component manufacturing method is adopted, the second vacuum chamber is sucked with a suction force smaller than that of the first vacuum chamber at least at the beginning of suction, so that the tape member side is sucked early. As a result, the tape member does not lean on the workpiece side. For this reason, the space | interval of a tape member and a workpiece | work can be narrowed and manufacturing efficiency can be raised. Further, since the tape member is adhered so as not to adhere to the outer edge of the workpiece first, bubbles can be prevented from being generated at the center portion. Furthermore, even if bubbles are generated, the outer edge of the workpiece is not adhered, so that the bubbles can be discharged out of the workpiece in the air release step. As a result, the work processing step and the tape peeling step can be executed reliably and stably, and the electronic parts can be stably produced.

  According to another aspect of the present invention, there is provided an electronic component manufacturing method comprising: a suction step; an air introduction step; and then an expansion sheet member is expanded toward the inside of the first vacuum chamber, and the expansion sheet member is expanded to expand a workpiece. The air bubble is dispersed toward the tape member in a state where air bubbles are dispersed between the tape member and the work, and air is introduced into the space where the work is placed, and the air bubbles are discharged outside the work. And a bubble discharging step. In this invention, since the tape member can be adhered to the work with air bubbles remaining, there is no need to increase the degree of vacuum. Further, since the remaining bubbles are discharged out of the workpiece in the bubble discharging step, the bubbles generated between the workpiece and the tape member are finally surely removed. As a result, the work processing step and the tape peeling step can be executed reliably and stably, and stable production of electronic components is possible.

  According to another aspect of the present invention, there is provided an electronic component manufacturing method comprising: a suction step; an air introduction step; and then an expansion sheet member is expanded toward the inside of the first vacuum chamber, and the expansion sheet member is expanded to expand a workpiece. A bubble dispersion bonding step in which the air bubbles are lifted toward the tape member and adhered to the tape member in a state in which bubbles are dispersed between the tape member and the workpiece, and after the bubble dispersion bonding step, the first air introduction means is operated. A bubble discharging step for introducing air into the first vacuum chamber and discharging bubbles to the outside of the workpiece, a workpiece processing step for moving or processing the workpiece to which the tape member is bonded, and a tape peeling step for peeling the workpiece from the tape member And.

  When such a method is adopted, the tape member can be adhered to the work with air bubbles remaining, so there is no need to increase the degree of vacuum and the distance between the tape member and the work is narrowed. can do. For this reason, it becomes possible to shorten the time required for the adhesion of the tape. Further, since the remaining bubbles are discharged out of the workpiece in the bubble discharging step, the bubbles generated between the workpiece and the tape member are finally surely removed. As a result, the work processing step and the tape peeling step can be executed reliably and stably, and the electronic parts can be stably produced.

  In addition, the electronic component manufacturing method according to another invention includes a suction step in which the tape member side is sucked early, an air introduction step, an adhesion step, and an air release step, and is disposed on the upper surface side of the stretchable sheet member. In an electronic component manufacturing method for bonding a tape member to a workpiece to be processed, and then processing the workpiece to manufacture an electronic component, the side on which the tape member is disposed is sucked earlier than the lower surface side of the stretchable sheet member Alternatively, the tape member is strongly sucked to prevent the tape member from hanging down to the workpiece side.

  When such a method is adopted, the tape member side is sucked early and the tape member does not lean against the work side. Therefore, the interval between the tape member and the work can be narrowed, and the production efficiency can be increased. Moreover, generation | occurrence | production of a bubble can be prevented. As a result, the work processing step and the tape peeling step can be executed reliably and stably, and the electronic parts can be stably produced.

  Furthermore, an electronic component manufacturing method according to another invention has a suction step, an air introduction step, an adhesion step, and an air release step, and is a tape member for a workpiece disposed on the upper surface side of the stretchable sheet member. In the electronic component manufacturing method in which the workpiece is processed and the electronic component is manufactured, in the bonding step, the tape member is first bonded to the outer edge of the workpiece and then bonded to the center of the workpiece. In the air release step, air bubbles generated between the tape member and the work are discharged out of the work.

  When such an electronic component manufacturing method is adopted, since the tape member is bonded to the outer edge of the workpiece so as not to be bonded first, bubbles can be prevented from being generated at the center portion. Furthermore, even if bubbles are generated, the outer edge of the workpiece is not adhered, so that the bubbles can be reliably discharged out of the workpiece in the air release step. As a result, the work processing step and the tape peeling step can be executed reliably and stably, and the electronic parts can be stably produced.

  In each of the above-described inventions, the number of drive sources for forming a vacuum can be one or two. For example, as the first suction unit and the second suction unit, the same vacuum pump can be adopted as a drive source. In this case, the cost is reduced.

  According to the present invention, it is possible to increase the production efficiency and prevent the generation of bubbles between the workpiece and the tape member. According to another invention, even if bubbles are generated, they can be removed.

It is a perspective view which shows the structure of the tape bonding apparatus used in order to implement the tape bonding method which concerns on one embodiment of this invention, and is a figure which shows the state in which the upper cover unit is located in the chamber unit side. FIG. 2 is a perspective view showing a state in which the upper lid unit is located on the standby unit side in the tape bonding apparatus of FIG. 1. In the tape bonding apparatus of FIG. 1, it is a figure which shows a side surface shape. It is a figure which shows a planar shape in the tape bonding apparatus of FIG. In the tape bonding apparatus of FIG. 1, it is a figure which shows a front shape. In the tape bonding apparatus of FIG. 1, it is a figure which shows a back surface shape. FIG. 2 is a schematic diagram showing a main configuration centering on a chamber unit and an upper lid unit in the tape bonding apparatus of FIG. 1. It is a partial sectional side view which expands and shows the vacuum chamber and air introduction part vicinity among the tape bonding apparatuses of FIG. In the tape bonding apparatus of FIG. 1, it is a perspective view which shows the outline of the tape member supplied from a 1st tape supply mechanism. In the tape bonding apparatus of FIG. 1, it is a perspective view which shows the outline of the tape member supplied from a 2nd tape supply mechanism. It is a block diagram which shows the control relationship of the tape bonding apparatus of FIG. In the tape bonding apparatus of FIG. 1, it is the schematic which shows the relationship between the tape member withdraw | derived from the 1st tape supply mechanism, a guide roller, and a front-end | tip sticking bar. It is a top view which shows the attachment relationship of the jig | tool used with the tape bonding apparatus of FIG. It is a top view which shows the structure of a ring member among the jig | tools of FIG. It is a top view which shows the structure of a tape holding ring among the jig | tools of FIG. It is a figure which shows the flowchart which adhere | attaches a tape member on the wafer used as a workpiece | work using the tape bonding apparatus of FIG. It is a figure which shows the dispersion | distribution state of the bubble generated when bonding a tape member to the wafer used as a workpiece | work using the tape bonding apparatus of FIG. 1, and discharge | emission of the bubble out of the wafer. FIG. 2 is a diagram illustrating a state in which when the tape member is bonded to a wafer as a workpiece using the tape bonding apparatus of FIG. 1, the outer edge of the wafer is bonded first and air bubbles cannot be discharged out of the wafer.

10 ... Tape bonding device 11 ... Wafer (corresponding to workpiece)
DESCRIPTION OF SYMBOLS 100 ... Chamber unit 110 ... Base part 111 ... Vacuum pump (It corresponds to a part of 1st suction means, a part of 2nd suction means, and a part of adsorption means)
112... Suction conduit (part of first suction means, part of first air introduction means)
113 ... Suction conduit (part of second suction means, part of second air introduction means)
114... First valve member (part of first suction means, part of first air introduction means)
115 ... 2nd valve member (a part of 2nd suction means, a part of 2nd air introduction means)
116 ... third valve member (corresponding to a part of the suction means)
117 ... Protruding pipe (a part of the first and second air introducing means)
118 ... Tube member (corresponds to a part of the suction means)
119 ... Hose (corresponds to a part of adsorption means)
120 ... Chamber plate (corresponding to the first lid member)
126 ... rubber sheet (corresponding to the elastic sheet member)
127 ... Air introduction part (corresponding to the second vacuum chamber)
200 ... Upper lid unit (corresponding to tape transport means)
210 ... Upper lid plate (corresponding to the second lid member)
213 ... Adsorption member (corresponds to a part of the adsorption means)
214 ... insertion hole (corresponds to a part of the suction means)
220... First tape supply mechanism (corresponding to first tape supply means)
300 ... Standby unit 310 ... Base 320 ... Second tape supply mechanism (corresponding to second tape supply means)
400 ... Control device V ... Vacuum chamber (corresponding to the first vacuum chamber)
P ... Bubble S ... Adhesion zone T1, T2 ... Tape member TA1 ... Protective tape (tape member, corresponding to the first protective tape)
TA2 ... protective tape (corresponding to tape member, second protective tape)

  Hereinafter, a tape bonding method according to an embodiment of the present invention will be described. In the description of the tape bonding method, the configuration, operation, and electronic component manufacturing method of the tape bonding apparatus 10 used when implementing this method will be described together with the tape bonding method.

  The tape device 10 will be described with reference to FIGS. FIG. 1 is a perspective view showing an overall configuration of the tape bonding apparatus 10 and a state in which the upper lid unit 200 is positioned on the chamber unit 100 side. FIG. 2 is a perspective view showing an overall configuration of the tape bonding apparatus 10 and a state where the upper lid unit 200 is located on the standby unit 300 side. 3 is a side view showing the overall configuration of the tape bonding apparatus 10, FIG. 4 is a plan view, FIG. 5 is a front view, and FIG. 6 is a rear view. FIG. 7 is a schematic view showing the main part of the tape bonding apparatus 10 centering on the chamber unit 100 and the upper lid unit 200.

  In the following description, in the tape bonding apparatus 10, the side on which the chamber plate 120 exists when viewed from the base 110 (see FIG. 5) is the upper side, and the base 110 is viewed from the chamber plate 120. The existing side is the lower side. In the following description, the sliding direction refers to the direction in which the upper lid unit 200 slides (direction indicated by XX in FIG. 1). The front end side refers to the side from the standby unit 300 toward the chamber unit 100 in the sliding direction, and the rear end side refers to the side from the chamber unit 100 toward the standby unit 300 in the sliding direction.

  As shown in FIGS. 1 to 6, the tape bonding apparatus 10 is adjacent to the chamber unit 100, the upper lid unit 200 that forms a vacuum chamber V (see FIG. 7 and the like) together with the chamber unit 100, and the chamber unit 100. The standby unit 300 is a main component. Among these, the chamber unit 100 includes a base part 110. The base part 110 is a part located on the lowermost side of the tape bonding apparatus 10 and incorporates components such as a vacuum pump 111 in an internal space. A chamber plate 120 described later is attached above the base 110.

  Here, in FIG. 7, only one vacuum pump 111 is used. However, the number of vacuum pumps 111 used in the present embodiment is not limited to one, and may be separately provided according to the number (three) of the first to third valve members 114 to 116. good.

  As shown in FIG. 7 and the like, the base portion 110 includes a suction conduit 112, a suction conduit 113, a first valve member 114, a second valve member 115, and a third valve member 116. In addition, a protruding pipe line 117 and a pipe member 118 are provided. Among these, the suction pipe 112 is branched into a plurality toward the through hole 124. Hereinafter, a branch portion on the through-hole 124 side in the suction pipe 112 is referred to as a branch pipe 112a. In addition, 2-4 etc. are mentioned as the number of the branch pipe lines 112a.

  Further, the above-described through hole 125 is connected to the suction pipe 113. Unlike the above-described suction conduit 112, only one suction conduit 113 is provided without branching. However, when there are a plurality of through holes 125, a plurality of branch pipes may be provided in accordance with the number of the through holes 125.

  A first valve member 114 is provided in the middle part of the suction pipe line 112, and a second valve member 115 is provided in the middle part of the suction pipe line 113. The first valve member 114 and the second valve member 115 are used for vacuum suction of the inside of the vacuum chamber V serving as the first vacuum chamber or the air introduction portion 127 (see FIG. 8) serving as the second vacuum chamber. It is possible to switch so as to communicate with the vacuum pump 111 side (hereinafter, this switching is referred to as switching to the suction side) and to switch to open to the atmosphere introduction side (in FIG. 7, the protruding pipe line 117). In the following, this switching is also referred to as switching to the atmosphere introduction side).

  Further, a pipe member 118 similar to the above-described suction pipes 112 and 113 is provided inside the base part 110. For example, the pipe member 118 faces the outer wall of the base part 110, and one end side thereof protrudes from the side surface of the base part 110. One end side of a hose 119 that can be bent flexibly is connected to one end side of the pipe member 118. The hose 119 extends from the base portion 110 toward the upper lid unit 200 side. The other end side of the hose 119 is connected to one end side of the insertion hole 214 via a pipe joint 215 at a substantially central portion of the upper surface of the upper lid plate 210 in the radial direction. The hose 119 has a length that allows the upper lid unit 200 to slide. Thus, since the hose 119 having an appropriate length is provided between the pipe member 118 and the pipe joint 215, the upper cover plate 210 can be opened and closed (slid). .

  A third valve member 116 is provided in the middle of the pipe member 118. The third valve member 116 can also be switched so as to communicate with the vacuum pump 111 side (switch to the suction side), and can be switched to open to the atmosphere introduction side via the protruding pipe 117. It is. Further, in the third valve member 116, the tube member 118 can be hermetically closed so that neither vacuum suction nor release to the atmosphere is performed. When the tube member 118 is opened to the atmosphere introduction side, the atmosphere is introduced to the back surface side of the protective tape TA (the upper surface side of the protection tape TA in FIG. 8) through the tube member 118. Thereby, the holding state of the protective tape TA is released.

  In addition, as the first valve member 114, the second valve member 115, and the third valve member 116, for example, an electromagnetic valve that can be opened and closed by a solenoid can be used. A system that opens and closes using a source may be used. The vacuum pump 111, the suction pipe 112, the first valve member 114, etc. constitute a first suction means. The vacuum pump 111, the suction conduit 113, and the second valve member 115 constitute a second suction means. The suction pipe 113, the second valve member 115, the protruding pipe 117 and the like constitute an air introduction means.

  Further, a chamber plate 120 (corresponding to the first lid member) capable of approaching and facing the upper lid plate 210 is provided above the chamber unit 100. The chamber plate 120 is configured to have an appropriate strength in order to receive pressure applied during vacuum suction (particularly, vertical load applied from the upper lid plate 210 side). Note that the side wall and the bottom wall which support the chamber unit 100 and are part of the chamber unit 100 have a strength that can sufficiently resist the pressure applied during vacuum suction.

  As shown in FIG. 7 and the like, the chamber plate 120 is provided with an upper surface portion 121 and a recessed portion 122. Among these, the upper surface portion 121 is located on the outer diameter side with respect to the recessed portion 122 and is provided with a height position higher than that of the recessed portion 122. An annular groove 121a is provided in a portion of the upper surface 121 that is separated from the edge of the recessed portion 122 by a predetermined distance. A seal ring 123 (O-ring; corresponding to the first seal member) serving as a packing for hermetically sealing the vacuum chamber V is fitted into the groove 121a. The seal ring 123 is made of, for example, nitrile rubber (NBR). However, the seal ring 123 may be made of a highly flexible material (flexible member) such as silicon.

  Here, the vacuum chamber V serving as the first vacuum chamber refers to the seal ring 123, 216, the upper surface side of the chamber plate 120, and the lower surface side of the upper lid plate 210 when the two seal rings 123, 216 contact each other. The part surrounded by the upper surface side of the rubber sheet 126 refers to a space part that is shielded from the external atmosphere. This space is the space where the work is placed.

  Further, as shown in FIG. 7, an opening 124 a is provided in a portion of the upper surface portion 121 on the inner diameter side of the seal ring 123. The opening 124 a is an exposed portion of the through hole 124 that penetrates the chamber plate 120. That is, the upper end side of the through hole 124 is an opening 124 a exposed to the upper surface portion 121. Further, the lower end side of the through hole 124 is connected to one end side of the above-described suction conduit 112.

  In addition, a recessed portion 122 is provided in a portion of the chamber plate 120 on the inner diameter side of the upper surface portion 121. The recessed portion 122 is a portion that is recessed downward from the upper surface portion 121. The concave portion 122 has a circular planar shape. In addition, an opening 125 a similar to the above-described opening 124 a is provided in the center of the recessed portion 122. The opening 125 a is an exposed portion of the through hole 125 that penetrates the chamber plate 120. The lower end side of the through hole 125 is connected to one end side of the suction pipe 113.

  The through-hole 125 is desirably present in the central portion of the recessed portion 122 in order to suck the rubber sheet 126 evenly. However, the through holes 125 may be configured to be arranged at predetermined intervals in predetermined portions of the recessed portions 122. Further, the portion surrounded by the opening 125a, the rubber sheet 126, and the bottom surface of the recessed portion 122 corresponds to the air introducing portion 127 (see FIG. 8) serving as the second vacuum chamber. Air is introduced into the air introduction section 127 by opening the suction pipe 113 to the atmosphere, and the rubber sheet 126 is provided so as to bulge upward.

  Further, a rubber sheet 126 corresponding to the elastic sheet member is installed on the bottom surface of the recessed portion 122 so as to cover the opening 125a. The rubber sheet 126 has a wafer 11 as a work mounted on the upper surface thereof. As will be described later, when air is introduced into the air introduction portion 127 in a state where the wafer 11 is mounted on the rubber sheet 126, the rubber sheet 126 swells upward. Thereby, it becomes possible to raise the wafer 11 toward the protective tape TA described later.

  The rubber sheet 126 is made of a material that can reduce the generation of bubbles, such as EPT rubber (Ethylene-Propylene Terpolymer Rubber) or chloroprene. However, the material of the rubber sheet 126 is not limited to such EPT rubber and chloroprene, and normal natural rubber or synthetic rubber may be used. A preferable material for the rubber sheet 126 is a material that can prevent the generation of bubbles, such as the above-mentioned EPT rubber and chloroprene.

  Further, in the present embodiment, there is a wafer 11 having a diameter of 12 inches as the workpiece 11 to be mounted on the upper surface of the rubber sheet 126. However, the size of the wafer 11 is not particularly limited, and may be other sizes such as an 8-inch wafer and a 6-inch wafer. When the size of the wafer 11 is changed, the sizes of other members (rubber sheet 126, a pressing ring 130 described later) and the like are also changed accordingly. However, for bonding to a small-sized wafer 11 such as an 8-inch wafer, for example, a tape bonding apparatus 10 that supports bonding of a 12-inch wafer 11 may be used. In this case, it is preferable to use a jig J as will be described later.

  Further, the tape member T used in the present embodiment will be described with reference to FIGS. The tape member T has a protective tape TA and a release sheet TB. The protective tape TA has an adhesive layer TC coated with an adhesive material on one surface (adhesive surface), and the adhesive tape TC is adhered to the wafer 11 so that the protective tape TA is attached to the wafer 11. The Further, the release sheet TB is a part attached to the adhesive layer TC, and is peeled off when the protective tape TA is attached to the wafer 11. Then, the peeled release sheet TB is taken up by a take-up reel 226 described later.

  Here, in the present embodiment, two tape members T (hereinafter, the tape member shown in FIG. 9 is T1 and the tape member shown in FIG. 10 is T2) are used. Of these tape members T1, T2, the tape member T1 shown in FIG. 9 is set in the first tape supply mechanism 220 described later. The protective tape TA of the tape member T1 is not previously punched. That is, when the tape member T1 wound in a roll shape is pulled out and the release sheet TB is peeled off, a flat protective tape TA is obtained.

  Further, the tape member T2 shown in FIG. 10 is set in the second tape supply mechanism 320. The protective tape TA of the tape member T2 is punched corresponding to the shape and size of the wafer 11. That is, when the tape member T2 wound in a roll shape is pulled out and the release sheet TB is peeled off, the protective tape TA corresponding to the shape of the wafer 11 (substantially circular in the present embodiment) and the other surroundings The protective tape TA is obtained.

  In the following description, the protective tape TA generated by peeling the tape member T1 is referred to as protective tape TA1, and the protective tape TA generated by peeling the tape member T2 is referred to as protective tape TA2. However, if it is not necessary to distinguish between the two, these are simply referred to as the protective tape TA. The protective tape TA1 corresponds to the first protective tape, and the protective tape TA2 corresponds to the second protective tape. The tape member T2 corresponds to a tape member that generates the second protective tape.

  As shown in FIG. 2 and the like, a pressing ring 130 whose outer appearance is substantially ring-shaped is attached to the outer peripheral edge of the rubber sheet 126. The pressing ring 130 is for pressing the rubber sheet 126. By this pressing, the space between the air introduction part 127 (see FIG. 8) and the vacuum chamber V is sealed in a substantially airtight manner. The pressing ring 130 is attached and fixed from the upper side to the upper surface of the recessed portion 122 by, for example, a screw. In this case, the pressing ring 130 is fixed at appropriate intervals by screws along the circumferential direction.

  The pressing ring 130 is provided with a positioning portion 131. The positioning portions 131 are portions that are recessed by a predetermined amount from the inner diameter side toward the outer diameter side, and are arranged at intervals of 180 degrees, for example. A protrusion J11 of a jig (ring member J1) as shown in FIG.

  Moreover, as shown in FIG. 11, the tape bonding apparatus 10 is provided with a vacuum gauge 132 for measuring pressure (atmospheric pressure). The vacuum gauge 132 is preferably provided in correspondence with the total number of three pipes such as the suction pipe lines 112 and 113 and the pipe member 118. However, it is only necessary to measure the pressure in the vacuum chamber V and the air introduction unit 127. In this case, only two vacuum gauges 132 are provided.

  The upper lid unit 200 can move smoothly along the slide direction along the guide rail by rotation of a guide wheel (not shown) that is a part of the slide mechanism. In the present embodiment, the lower guide wheel is provided in a substantially pulley shape. Such pulley-shaped wheels are fitted into point-shaped guide rails (not shown) to prevent the upper cover unit 200 from being detached from the guide rails.

  In addition, the base part 110 is provided with an upper lid sealing mechanism (not shown) so as to correspond to the slide mechanism. An actuator 143 (see FIG. 11) is coupled to the upper lid sealing mechanism. The actuator 143 is a driving unit such as an electric cylinder or a hydraulic cylinder, and functions when the upper lid plate 210 is pushed down. As the actuator 143, a motor and a gear mechanism may be used in addition to the electric cylinder and hydraulic cylinder described above.

  As shown in FIG. 11, a sensor 164 is provided between the chamber unit 100 and the upper lid unit 200. This sensor 164 is a detecting means for detecting the state when the upper lid unit 200 slides toward the front end side and reaches a prescribed stop position, for example, a position where the upper cover unit 200 hits. That is, when the sensor 164 detects the arrival of the upper lid unit 200, a detection signal corresponding to this detection is generated. The sensor 164 is electrically connected to the control device 400. The control device 400 controls the operation of the actuator 143 based on the detection by the sensor 164.

  The chamber unit 100 is provided with an annular cutting mechanism 170 as shown in FIGS. When the annular cutting mechanism 170 is not used, the annular cutting mechanism 170 is disposed so as to protrude from the one end side in the width direction with respect to the chamber unit 100. The annular cutting mechanism 170 is provided with a linear pull-out rail 171 that guides the slide along the width direction.

  The annular cutting mechanism 170 has a rotary cutter portion 174 (see FIG. 4) attached rotatably. Here, the rotary cutter unit 174 has a pair of support columns 175 having a predetermined width and provided in parallel. The pair of support columns 175 are provided so as to be parallel to each other. Bogies (not shown) are attached to both ends of the column 175, respectively. A plurality (two in this embodiment) of wheels are rotatably attached to each carriage. In the present embodiment, the wheel is provided in a pulley shape, and the annular rail 173 has a pointed shape with a gentle inclination angle. As the rotary cutter portion 174 rotates along the annular rail 173, the circular protective tape TA1 is formed.

  As shown in FIG. 2, the chamber unit 100 is provided with a transverse cutting mechanism 180. The transverse cutting mechanism 180 is provided at the front end of the chamber unit 100 as shown in FIG. This transverse cutting mechanism 180 is also a means for cutting the protective tape TA1 in the same manner as the above-described annular cutting mechanism 170.

  Next, the upper lid unit 200 will be described. As shown in FIGS. 1 and 2, the upper lid unit 200 is slidably provided between the chamber unit 100 and the standby unit 300. The upper lid unit 200 corresponds to a tape transport unit.

  As shown in FIG. 1 and the like, the upper lid unit 200 is provided with a handle 201 on the side thereof for the operator to hold. Further, as shown in FIG. 7 and the like, the upper lid unit 200 includes an upper lid plate 210 that is located above the chamber plate 120 and forms the vacuum chamber V. The upper lid plate 210 corresponds to the second lid member. Further, the upper lid plate 210 has a planar dimension substantially equal to that of the chamber plate 120. On the lower surface side of the upper lid plate 210, a lower surface portion 211 that faces the above-described upper surface portion 121 when the vacuum chamber V is formed is provided. Further, a concave portion 212 is provided in a portion on the inner diameter side of the lower surface portion 211. The concave portion 212 is a portion that is recessed from the lower surface portion 211 toward the upper side of the upper lid plate 210 by a predetermined dimension.

  In this recess 212, an adsorption member 213 made of a porous material such as porous ceramics is fitted. The suction member 213 constitutes suction means together with the vacuum pump 111, the insertion hole 214, the third valve member 116, the pipe member 118, and the hose 119. The suction member 213 also functions to suck and hold the tape member T2 (protective tape TA2).

  Here, the lower surface of the adsorption member 213 is provided so as to be positioned above the lower surface of the seal ring 216. When the rubber sheet 126 swells upward, the protective tape TA1 is pushed upward by the wafer 11 and the protective tape TA1 is attached to the upper surface of the wafer 11. In this case, the protective tape TA1 comes into contact with the lower surface of the adsorption member 213, and the upward movement of the protective tape TA1 (elongation of the protective tape TA1 going upward) is restricted. Therefore, the lower surface of the suction member 213 is not so much higher than the lower surface of the plate member J2, and when the rubber sheet 126 lifts the wafer 11 upward, the protective tape TA is in contact with the lower surface of the suction member 213 in a stretched state. It is provided at a height that allows contact.

  As shown in FIGS. 7 and 8, an opening 214 a is provided in the central portion of the bottom surface of the recess 212. The opening 214 a is an exposed portion of the insertion hole 214 that penetrates the upper lid plate 210. That is, the lower end side of the insertion hole 214 is an opening 214 a that is exposed on the bottom surface of the recess 212. Further, one end side of the pipe joint 215 is attached to the upper end side of the insertion hole 214. The other end of the pipe joint 215 is connected to the hose 119 described above. Thereby, the suction force of the vacuum pump 111 can be exerted on the suction member 213.

  Note that a suction recess 212 a that is slightly recessed from the bottom surface is provided on the bottom surface of the recess 212. The suction recess 212a is provided, for example, in a groove shape and a mesh shape, and is provided so as to apply a suction force to the entire bottom surface of the recess 212. Thereby, a suction force is exerted on the entire suction member 213. The suction recess 212a is not limited to a groove shape and a mesh shape. For example, the suction recess 212a may be provided in a planar shape, and a large number of protrusions may be formed protruding from the suction recess 212a, and the suction member 213 may be received by the protrusions.

  In addition, an annular groove 211 a is provided on the lower surface portion 211 on the outer diameter side of the recess 212 in the upper lid plate 210. A seal ring 216 (O-ring; corresponding to the second seal member and the flexible member) serving as a packing for hermetically sealing the vacuum chamber V is fitted in the groove 211a. Unlike the above-described seal ring 123, the seal ring 216 is formed of a material having high flexibility such as silicon rubber. However, when the above-described seal ring 123 is formed from a material having high flexibility, the seal ring 216 may be formed from a slightly hard rubber such as nitrile rubber (NBR). Further, both the seal ring 123 and the seal ring 216 may be formed of a material having high flexibility such as silicon rubber.

  The seal ring 216 has the same diameter as the above-described seal ring 123. Further, after the upper lid unit 200 moves to the chamber unit 100 side and stops at a predetermined position, when the upper lid sealing mechanism (not shown) operates and the upper lid plate 210 moves downward, the lower end of the seal ring 216 is moved. The side is in contact with the upper end side of the seal ring 123 so as to hermetically seal the vacuum chamber V.

  As shown in FIGS. 1 to 6 and the like, a first tape supply mechanism 220 corresponding to the first tape supply means is provided on the upper side of the upper lid plate 210 and away from the standby unit 300. It has been. The first tape supply mechanism 220 is a portion for winding the tape member T1 wound in a roll shape and winding the release sheet TB generated (unnecessary) after the tape member T1 is peeled off. .

  As shown in FIG. 12, the first tape supply mechanism 220 includes a support plate 221, a supply reel 222, a motor (not shown), a first pulley (not shown), a belt (not shown), and a winding. A take-up reel 226, a second pulley (not shown), a first guide roller 228, a second guide roller 229, a third guide roller 230, and a fourth guide roller 231 are provided. Moreover, as shown in FIG. 1 etc., the 1st tape supply mechanism 220 is equipped with the housing 220a which can be opened and closed, and has covered these each component.

  Among these, the support plate 221 is a part that supports the above-described members. The support plate 221 pivotally supports the supply reel 222, the take-up reel 226, the first to fourth guide rollers 228 to 231 and the like, and a bearing or the like (not shown) is interposed therebetween. To do. The supply reel 222 is a part that supplies the tape member T1, and is a part that holds the tape member T1 wound in a roll shape.

  The supply reel 222 has a pair of roller members, and the interval between them is variable according to the width dimension of the tape member T1. That is, when the diameter of the wafer 11 is small, since the tape member T1 having a small width is used, the distance between the pair of roller members is small. On the other hand, when the diameter of the wafer 11 is large, since the tape member T1 having a large width is used, the distance between the pair of roller members becomes large.

  As shown in FIG. 12, the first guide roller 228, the second guide roller 229, the third guide roller 230, and the fourth guide roller 231 are attached to the support plate 221 via unillustrated bearings. Yes. Of these, the first guide roller 228 is located on the uppermost side. In the first guide roller 228, the tape member T1 is peeled off from the protective tape TA1 and the release sheet TB. The second guide roller 229 and the third guide roller 230 are provided to face each other. Then, the peeled protective tape TA1 is sandwiched between the second guide roller 229 and the third guide roller 230 to prevent loosening of the protective tape TA1 when no tension is applied. The fourth guide roller 231 is located on the lowermost side. The fourth guide roller 231 is a portion that guides drawing of the protective tape TA1 while applying tension to the protective tape TA1.

  As shown in FIG. 12, when the protective tape TA1 is pulled out from the fourth guide roller 231, the tip portion of the protective tape TA1 is stuck on a tip sticking bar 331 described later. When the top cover unit 200 slides from the standby unit 300 side to the chamber unit 100 side with the protective tape TA1 attached to the tip sticking bar 331, the protective tape TA1 is pulled out and tension is applied. Is attached to the seal ring 123. As a result, the protective tape TA1 is positioned above the recessed portion 122 (the seal ring 123).

  Next, the configuration of the standby unit 300 will be described. As shown in FIGS. 3, 6, and 7, the standby unit 300 includes a base portion 310. The base portion 310 is provided with an opening / closing door 311 that can be opened in a double door (see FIG. 6). By opening the opening / closing door 311, it is possible to perform maintenance of components existing in the internal space and to store tools and tape members T <b> 1 and T <b> 2 necessary for work in the internal space.

  An opening 312 is provided on the upper surface of the base portion 310 (see FIG. 7). The protective tape TA2 peeled off by a seal peeling mechanism (not shown) can be sucked and held by the suction member 213 through the opening 312.

  As shown in FIG. 1 and others, a second tape supply mechanism 320 corresponding to the second tape supply means is provided at the rear end portion of the opening 312. The second tape supply mechanism 320 is a part for supplying the tape member T2 wound in a roll shape, and is a part for sequentially supplying the tape member T2.

  Here, in the tape member T2 wound around the second tape supply mechanism 320, the protective tape TA2 is punched in advance so as to correspond to the size and shape of the wafer 11. (See FIG. 10). Therefore, when the protective tape TA2 is peeled off from the tape member T2 using the seal peeling mechanism, the peeled protective tape TA2 has a shape (substantially circular) corresponding to the shape of the wafer 11. Note that the release sheet TB is not punched in advance.

  The seal peeling mechanism is provided with a sensor 360 for detecting the position of a moving body (not shown) for peeling off the protective tape TA2. This sensor 360 is provided on each of the front end side and the rear end side in the sliding direction of the moving body.

  Further, as shown in FIG. 11, the tape bonding apparatus 10 is provided with a control device 400 as a control means. The control device 400 includes, for example, a CPU, a ROM in which a predetermined control program is stored, a RAM that performs primary storage of data, an interface for inputting signals from various sensors and the like and outputting control signals. is doing. A suitable controller 400 is, for example, a one-chip microcomputer equipped with an A / D converter, a D / A converter, and the like.

  As described above, the control device 400 includes the vacuum pump 111, the first to third valve members 114, 115, 116, the actuators 143, 335, 342, the motor 223 of the first tape supply mechanism 220, and the seal peeling mechanism. The motor 357, the brake mechanism 327 of the second tape supply mechanism 320, the vacuum gauge 132, the sensors 164, 360 and the like are electrically connected. This is shown in FIG. The control device 400 is connected to an operation button 401 for performing an on operation. Therefore, when the operator presses the operation button 401, the vacuum pump 111 is activated.

  An example of the predetermined degree of vacuum in the vacuum chamber V is about 20 Pa. However, the predetermined degree of vacuum is not limited to this, and may be any degree of vacuum as long as it is lower than atmospheric pressure. The control of the control device 400 will be described later.

  Next, the jig J used for attaching the protective tape TA1 to the wafer 11 will be described. As shown in FIGS. 13 to 15, the jig J includes a ring-shaped ring member J1, a circular plate member J2, and a ring-shaped tape holding ring J3. Among these, as shown in FIG. 14, the outer appearance of the ring member J1 is provided in a substantially ring shape. The ring member J1 is provided in correspondence with the inner diameter of the pressing ring 130. Protrusions J11 are provided on the outer peripheral portion of the ring member J1 at intervals of approximately 180 degrees. The protrusion J11 is fitted into the positioning part 131. Thereby, the ring member J1 is positioned in the radial direction. A positioning portion J12 similar to the positioning portion 131 is also provided on the inner peripheral side of the ring member J1. The positioning portions J12 are also provided at an interval of about 180 degrees. A pin hole J14 is provided on the inner peripheral side of the ring member J1 adjacent to the ring hole J13. A pin member J15 is inserted into the pin hole J14, and a tape holding ring J3 described later is held from below by the pin member J15.

  The plate member J2 is set in the circular hole J13 of the ring member J1 described above. The plate member J2 is disposed on the inner peripheral side of the ring member J1. The plate member J2 is a substantially disk-shaped member, and is a member for placing the wafer 11 serving as a workpiece. The plate member J2 is provided corresponding to the inner diameter of the ring hole J13. Moreover, the protrusion part J21 is provided in the outer peripheral part of this plate member J2 at the space | interval of about 180 degree | times. The protrusion J21 is fitted into the positioning part J12. Thereby, the radial positioning of the plate member J2 is performed.

  Further, a pin insertion hole J22 is provided on the outer peripheral side of the plate member J2. The positioning pin J23 is inserted into the pin insertion hole J22. The pin insertion hole J <b> 22 is provided so as to follow the outer peripheral edge portion of the wafer 11. When the positioning pins J23 are inserted into the pin insertion holes J22, the outer peripheral edge of the wafer 11 is locked, and the wafer 11 is prevented from being displaced. In order to position the wafer 11 in the radial direction on the basis of the orientation flat portion 11a of the wafer 11, a pin insertion hole J22 is provided in the orientation flat portion 11a so that the two positioning pins J23 are in contact with each other. ing.

  Moreover, the tape holding ring J3 is attached to the upper part of the pin member J15 having a low height among the above-described pin members J15. The tape holding ring J3 is a member that comes into contact with the protective tape TA before the wafer 11. When the tape holding ring J3 comes into contact with the protective tape TA1 before the wafer 11, the slack of the protective tape TA1 is removed, and the tape 11 is attached in a state where the upper surface of the wafer 11 and the protective tape TA1 are substantially parallel. It becomes possible to execute. The tape holding ring J3 has a plurality of notches J31 on the outer peripheral side thereof. Then, the tape holding ring J3 is positioned in the radial direction by inserting a predetermined pin member J15 into the notch J31. Further, the tape holding ring J3 is provided with a ring hole J32 having a diameter equivalent to that of the above-described ring hole J13.

  The operation (operation) of the tape bonding apparatus 10 having the above configuration will be described below with reference to the flowchart of FIG. First, the case where the tape member T1 shown in FIG.

  First, the operator places the upper lid unit 200 on the standby unit 300 side so that the upper surface side of the chamber plate 120 is open. In this state, the operator sets a ring member J1, a plate member J2, and a tape holding ring J3 as shown in FIG. Then, after this setting is completed, the wafer 11 serving as a workpiece is placed on the upper part of the plate member J2 with reference to the positioning pins J23 (step S11).

  In addition to the placement of the wafer 11 described above, the operator prepares for installation of the tape member T1 (step S12). That is, the operator pulls out the tape member T1 from the supply reel 222 and peels off the tip portion of the tape member T1. Of the peeled tape member T1, the protective tape TA1 is passed through the first to fourth guide rollers 228 to 231 and pasted to the upper surface side of the tip pasting bar 331 as shown in FIG. At this time, the actuator 335 is operated to position the tip sticking bar 331 upward. At this time, the tip sticking bar 331 is lifted to a height that does not interfere with the slide of the upper lid unit 200. Further, the actuator 335 is lifted with a pressure that allows the tip sticking bar 331 to be retracted downward when an external force acts on the tip sticking bar 331.

  Of the peeled tape member T1, the release sheet TB is held by the holding portion on the take-up reel 226 side. Further, the tip portion of the protective tape TA1 is stuck on the tip sticking bar 331. At this time, the tip of the protective tape TA1 is stuck on the upper surface of the tip sticking bar 331 so as to go from the rear end side to the front end side.

  When the application of the front end of the protective tape TA1 is completed, the operator holds the handle 201 and slides the upper lid unit 200 toward the front end side. At this time, for example, when the sensor 164 for detecting a separate slide or the user's operation button 401 is pressed, the motor 223 is driven and the release sheet TB is taken up by the take-up reel 226.

  When the upper lid unit 200 is slid to the front end side, the tip portion of the protective tape TA1 is held by the tip sticking bar 331 and does not move. Therefore, when the upper lid unit 200 is slid toward the front end side in a state where the supply reel 222 is freely rotatable, the protective tape TA1 is sequentially supplied from the supply reel 222 according to the sliding amount. In this case, the protective tape TA1 is stretched between the lower surface of the fourth guide roller 231 and the upper surface of the tip sticking bar 331. Since the driving force is transmitted to the take-up reel 226 via the belt, the release sheet TB is sequentially taken up as the upper lid unit 200 slides.

  Then, when the upper lid unit 200 slides to a predetermined stop position, for example, by hitting, and the slide of the upper lid unit 200 is stopped, this stop is detected by the sensor 164. Then, the control device 400 receives the detection signal output from the sensor 164 and operates the actuator 143 based on the detection signal. This operation results in the upper lid plate 210 being pushed down.

  When the upper lid plate 210 is moved downward, the seal ring 123 and the seal ring 216 collide with each other, and the seal rings 123 and 216 are elastically deformed. As a result, the protective tape TA1 is sandwiched between the seal rings 123 and 216. This completes the installation and tensioning of the protective tape TA1 as the tape member in step S13. In addition, the width dimension of the tape member T1 is provided smaller than the diameter of the seal rings 123 and 216. Therefore, the seal rings 123 and 216 are in a state where there is a boundary portion between a portion that holds the protective tape TA1 and a portion that does not hold the protective tape TA1.

  Here, in the present embodiment, the seal ring 216 is formed of a flexible material such as silicon. Therefore, at the boundary portion, the seal ring 216 is elastically deformed so that no gap is generated at the boundary portion, and it is possible to prevent the outside air from leaking toward the vacuum chamber V.

  Subsequently, the control device 400 operates the vacuum pump 111 and the first to third valve members 114 to 116 to start vacuum suction of the vacuum chamber V and the air introduction unit 127 and starts a suction step. At this time, first, the first and third valve members 114 and 116 are switched so as to be on the suction side. However, the third valve member 116 may be switched so as to airtightly close the tube member 118 without performing vacuum suction or releasing the atmosphere. Thus, the control device 400 operates the vacuum pump 111 after switching the valve members 114 and 116.

  When the vacuum pump 111 is operated, the vacuum chamber V is vacuumed (step S14). After starting the vacuum suction, the control device 400 switches the second valve member 115 so as to be on the suction side. Thereby, step S15 is started. That is, the air introduction part 127 is also vacuumed. Thus, first, suction of the vacuum chamber V is started, so that the outer periphery of the protective tape TA1, that is, the portion not facing the wafer 11, can be prevented from being pulled toward the wafer 11, and the protective tape TA1 It is possible to prevent the outer periphery from sagging. As a result, the protective tape TA1 can be kept in contact with the upper surface of the wafer 11 in a parallel state, and bubbles can be prevented from being generated. Even if bubbles are generated, the bubbles can be discharged to the outside of the wafer 11 later.

  Then, the vacuum suction is performed for a predetermined time, and when the predetermined vacuum degree is detected by the vacuum gauge 132 (step S16), the control device 400 determines the second valve member based on the detection signal from the vacuum gauge 132. 115 is switched to the atmosphere open side. Thereby, an air introduction step is started, and the atmosphere is introduced into the air introduction portion 127 via the protruding pipe line 117 (step S17). In step S16, the second valve member 115 may be switched to the atmosphere release side after a predetermined time has elapsed without detecting the degree of vacuum. Here, when the atmosphere is introduced into the air introduction portion 127, the rubber sheet 126 expands toward the vacuum chamber V due to the pressure difference existing between the air introduction portion 127 and the vacuum chamber V, and the bonding step starts. .

  In this case, the wafer 11 and the tape holding ring J3 are lifted by the expansion of the rubber sheet 126. Then, since the height position of the tape holding ring J3 is higher than that of the wafer 11, first, the protective tape TA1 comes into contact with the tape holding ring J3. Thus, since the protective tape TA1 contacts the tape holding ring J3, the slack generated in the protective tape TA1 is removed, and the protective tape TA1 is stretched (step S18). This state is a so-called taiko state in which the protective tape TA1 is tensioned.

  Further, when the rubber sheet 126 expands, the center side of the rubber sheet 126 approaches the height position of the tape holding ring J3 due to, for example, the tension of the protective tape TA1 and the contact with the lower surface of the upper lid plate 210. Thereby, the protective tape TA1 is adhered to the upper surface of the wafer 11. At this time, considering the production efficiency, the degree of vacuum in the vacuum chamber V is not strengthened, and the initial distance between the protective tape TA1 and the wafer 11 is narrowed, so both come into contact with each other promptly. At this time, the protective tape TA1 and the wafer 11 are bonded to each other so that the bubbles P are dispersed and generated as shown in FIG. 17 (step S19). The bubbles P are preferably distributed and arranged on the adhesive surface as described above, but the bubbles P may be arranged in a biased manner. As described above, the protective tape TA1 is bonded to the front surface of the upper surface of the wafer 11, and the bonding step is completed.

  In this bonding step, the protective tape TA1 is bonded to the outer edge of the wafer 11 so as not to be bonded first. For this reason, even if the bubble P as shown in FIG. 17 is generated, the bubble P can be discharged out of the wafer 11 in the air release step. As shown in FIG. 18, when the protective tape TA <b> 1 is adhered to the outer edge of the wafer 11 and an annular bonding area S is generated, the bubbles P generated at the center of the wafer 11 can be discharged out of the wafer 11. However, it will remain. The adhesion area S is not completely annular, and even when a part of the outer edge does not become the adhesion area S, the bubbles P are not discharged and the probability of remaining is high. The protective tape TA1 is cut by using a horizontal cutting mechanism before and after the adhesion of the wafer 11 to the protective tape TA1.

  The control device 400 monitors whether or not a predetermined time has elapsed (step S20). When the predetermined time has elapsed, the control device 400 switches the first valve member 114 and the third valve member 116 to the atmosphere release side, and the pressure in the vacuum chamber V The bubble P is discharged out of the wafer 11 (step S21). In this air release step S21, as indicated by the arrow in FIG. 17, the bubbles P move linearly from the center side of the wafer 11 serving as a workpiece toward the outer peripheral side and are discharged. Thereafter, the pressure difference between the vacuum chamber V and the air introduction part 127 is eliminated, and the rubber sheet 126 is not expanded. Note that the third valve member 116 may stop the vacuum suction before step S21. Then, for example, after a predetermined time has elapsed or when it is confirmed by the vacuum gauge 132 that the inside of the vacuum chamber V has become atmospheric pressure, the control device 400 operates the actuator 143 again.

  The operation of the actuator 143 results in the upper lid plate 210 being lifted upward. Thereby, the contact between the seal rings 123 and 216 is released. In addition, the upper lid unit 200 can be moved to the standby unit 300 side.

  In this state, the operator holds the handle 201 and moves the upper lid unit 200 to the standby unit 300 side. Then, although the recessed part 122 is exposed, it appears in a state where the wafer 11 is adhered to the protective tape TA1. Next, using the annular cutting mechanism 170, the protective tape TA1 is cut on the inner peripheral side of the tape holding ring J3. In this case, by rotating the rotary cutter part 174 along the annular rail 173 while pushing, the protective tape TA1 is cut into a circular shape with a size corresponding to the wafer 11 (step S22).

  By sequentially performing the above procedure, the protective tape TA1 can be satisfactorily applied to the wafer 11. Thereafter, a work processing step is performed in which the worker or robot takes out the wafer 11 with the protective tape TA1 (step S23). The above operation is repeated, and the wafer 11 with the protective tape TA1 can be manufactured from the next to the next. The removed wafer 11 with the protective tape TA1 is moved to another place and processed (part of the workpiece processing step). The wafer 11 with the protective tape TA1 may be processed on the spot without moving. The wafer 11 is finely cut with the protective tape TA1, and then the cut wafer 11 is peeled off from the protective tape TA1 (tape removing step). Each small wafer that is separated into a large number by being peeled off is used as an electronic component. Note that the wafer 11 may be cut after the protective tape TA1 is peeled off.

  Next, a case where the tape member T2 as shown in FIG. 10 is attached to the wafer 11 will be described with reference to the flowchart of FIG.

  In this case, first, the wafer 11 is installed in step S11, and the operator prepares for installation of the tape member T2 (step S12). That is, the operator holds the leading end of the release sheet TB on the take-up reel in the second tape supply mechanism 320 in advance. In this case, first, the third valve member 116 is switched to the vacuum suction side before step S13. Then, the vacuum pump 111 is actuated to exert a vacuum suction force on the adsorption member 213. In this state, the seal peeling mechanism is operated. At this time, the supply reel is allowed to freely rotate and the take-up reel is prevented from rotating due to the brake action of the motor 357 or the like. Then, the actuator 342 is operated to move the moving body (not shown) from the rear end side toward the front end side. Then, the tape member T2 is pulled out as the moving body advances.

  Here, when the moving body moves, the tape member T2 is pulled out. Then, since the suction member 213 comes close to the punched portion of the tape member T2, the tape member T2 is sucked and held by the suction member 213. Then, when the moving body advances to the specified position on the front end side, the operation of the actuator 342 is stopped by the control command of the control device 400.

  Next, the control device 400 gives a control command to the motor 357 to drive it in the direction of winding the release sheet TB. Further, a control command is also given to the brake mechanism 327, and the brake mechanism 327 is operated so as to prevent the supply reel from rotating. Then, as the motor 357 rotates and winds the release sheet TB, the moving body moves toward the rear end side. Moreover, tension is given to release sheet TB by this winding. On the other hand, a vacuum suction force is exerted on the tape member T2 from above. For this reason, the protective tape TA2 that has been punched is gradually peeled off from the end of the punched portion where vacuum suction is being performed.

  When the movable body reaches the specified rear end position, the suction member 213 is in a state of sucking and holding the protective tape TA2 that has been punched. In this state, the operator holds the handle 201 and slides the upper lid unit 200 to the chamber unit 100 side. Thereby, step S13 is completed.

  The operation after step S14 is the same as that described for the tape member T1 described above. However, the difference from the case of the tape member T1 is that the first valve member 114 is used to vacuum the main body portion of the vacuum chamber V. Before starting the suction, as described above, the third valve member 116 is operated to start the vacuum suction of the space between the suction member 213 and the upper lid plate 210 and the suction member 213. The vacuum suction by the third valve member 116 continues during step S14. However, in step S14, that is, after the upper lid plate 210 is lowered and the seal rings 123 and 216 are in contact with each other, the vacuum suction of the protective tape TA2 by the suction member 213 may be stopped. By stopping the vacuum suction, the suction holding force with respect to the protective tape TA2 is weakened as the vacuum chamber V is vacuum sucked. Therefore, when the wafer 11 is lifted and the protective tape TA2 comes into contact with the upper surface of the wafer 11, the protective tape TA2 may be favorably bonded to the upper surface of the wafer 11.

  According to the tape bonding apparatus 10 having such a configuration, when the wafer 11 is set above the rubber sheet 126 and both are abutted with each other while the protective tapes TA1 and TA2 are interposed between the seal rings 123 and 216, The protective tapes TA1 and TA2 are sandwiched between the seal rings 123 and 216. In this state, vacuum suction of the vacuum chamber V is started (step S14), and then vacuum evacuation with the air introduction unit 127 is started (step S15), and then air is introduced into the air introduction unit 127. By doing (step S17), the rubber sheet 126 expands toward the upper side of the vacuum chamber V. Thereby, the rubber sheet 126 lifts the wafer 11 and adheres the protective tapes TA1 and TA2 to the upper surface of the wafer 11 in a bubble dispersed state via step S18 (step S19). In this case, the wafer 11 is lifted after the vacuum suction of the vacuum chamber V is performed. For this reason, it is possible to adhere the protective tapes TA1 and TA2 to the wafer 11 in a state where the bubbles P are appropriately dispersed while preventing the bubbles P from entering too much. After that, the control device 400 monitors whether or not a predetermined time has passed (step S20), and when the predetermined time has passed, at least the first valve member 114 is switched to the atmosphere release side, and the vacuum chamber V and its upper part are switched. Is increased, and the bubbles P are discharged out of the wafer 11 (step S21). For this reason, both can be made to adhere completely in the state where bubble P does not intervene.

  In the case of the method implemented by the tape bonding apparatus 10, the protective tapes TA1 and TA2 serving as the tape members can be bonded to the wafer 11 serving as the workpiece with the bubbles P remaining, so that the degree of vacuum is reduced. It is not necessary to increase the strength, and the interval between the tape member and the workpiece can be reduced. For this reason, it becomes possible to shorten the time required for adhesion of the tape member. Further, since the remaining bubbles P are discharged out of the workpiece in the air release step, the bubbles P between the workpiece and the tape member can be reliably removed. Further, in the air release step, the bubble P moves linearly from the center side to the outer peripheral side of the workpiece and is discharged, so that the discharge time is shortened and the manufacturing efficiency is further improved. Further, in the suction step, the side opposite to the bonding surface of the tape member is vacuum-sucked through the porous suction member 213, so that the tensioned state of the tape member is maintained and a defect in the bonding state occurs. Risk is reduced.

  Further, in the present embodiment, the sheet-like protective tape TA1 can be supplied from the first tape supply mechanism 220, and the protective tape TA2 that has been previously punched from the second tape supply mechanism 320. Can be supplied. For this reason, it becomes possible to supply different protective tapes TA1 and TA2 to the vacuum chamber V, and it becomes possible to meet various needs for applying the protective tape to the wafer 11.

  In the present embodiment, the sheet-like protective tape TA1 is supplied from the first tape supply mechanism 220 while being stretched. Further, the protective tape TA <b> 2 is supplied from the second tape supply mechanism 320 to the vacuum chamber V using the upper lid unit 200. For this reason, the protective tapes TA1 and TA2 are supplied in a state of being attached to the wafer 11, and workability can be improved.

  Furthermore, since the protective tape TA1 can be sandwiched between the seal rings 123 and 216, it is possible to easily hold the protective tape TA1 by using the abutting operation between the chamber plate 120 and the upper lid plate 210. Become. Further, in this holding state, the protective tape TA1 can be positioned above the upper surface of the wafer 11. Thereby, if the rubber sheet 126 is expanded upward, the wafer 11 can be brought into good contact with the protective tape TA1.

  In the present embodiment, the seal ring 216 is formed of a flexible member having flexibility, such as silicon rubber. For this reason, when the seal ring 123 and the seal ring 216 are brought into contact with each other, the flexible member is elastically deformed flexibly. Accordingly, even when the protective tape TA1 is interposed between the seal ring 123 and the seal ring 216, it is possible to prevent a gap from being formed at a boundary portion that sandwiches the protective tape TA1. Further, during vacuum suction, the pressing force between the seal rings 123 and 216 is further increased, and the seal ring 216 more reliably prevents a gap from being formed at the boundary portion described above. Thereby, the vacuum chamber V can be hermetically sealed from the outside.

  In particular, since the material of the seal ring 216 is silicon rubber, when the seal rings 123 and 216 are abutted against each other in a state of sandwiching the protective tape TA1, a gap is generated at the end of the sandwich. It can be surely prevented.

  In the present embodiment, the standby unit 300 is provided adjacent to the chamber unit 100, and the upper lid unit 200 is provided to be slidable between the chamber unit 100 and the standby unit 300. . Therefore, if the slide of the upper lid unit 200 is used, the protective tapes TA1 and TA2 can be easily pulled out / conveyed. Further, when the wafer 11 is placed on the upper surface of the rubber sheet 126, the upper lid unit 200 can be retracted from the state of covering the chamber unit 100, and the recessed portion 122 can be opened. Thereby, it is possible to improve workability when the wafer 11 is set.

  In particular, since the upper lid unit 200 is provided with the first tape supply mechanism 220, if the upper lid unit 200 is slid from the standby unit 300 toward the chamber unit 100 using the slide of the upper lid unit 200. The protective tape TA1 can be easily pulled out. Thereby, it is possible to further improve the working efficiency when supplying the protective tape TA1.

  In addition, a first tape supply mechanism 220 is provided on the front end side of the upper lid unit 200, and a tape pressing mechanism (not shown) including a tip sticking bar 331 and the like is further provided on the rear end side of the chamber unit 100. Is provided. Therefore, the protective tape TA1 is attached to the front end sticking bar 331, and the upper cover unit 200 is simply slid toward the front end in that state. It is possible to bridge between 216. That is, if the tip of the drawer of the protective tape TA1 is attached to the tip sticking bar 331 and then the upper lid unit 200 is slid, the drawing operation of the protective tape TA1 is completed. It can be simplified, and the working efficiency can be further improved.

  In this embodiment, standby unit 300 is provided with a seal peeling mechanism. For this reason, the protective tape TA2 can be satisfactorily peeled off from the tape member T2 by the seal peeling mechanism. Further, the upper lid unit 200 is provided with a suction member 213. For this reason, if the upper lid unit 200 is slid toward the upper side of the chamber plate 210, the peeled protective tape TA2 can be conveyed toward the vacuum chamber V. As a result, the operation of installing the protective tape TA2 with respect to the inside of the vacuum chamber V can be greatly simplified, and the working efficiency can be further improved.

  In this embodiment, since the rubber sheet 126 is used to lift the wafer 11, the rubber sheet 126 is moved to the vacuum chamber V side by variously changing the pressure of the vacuum chamber V and the air introduction unit 127. The operation of inflating or returning from the state of inflating to the vacuum chamber V side can be easily performed. Thereby, the wafer 11 can be easily bonded to the protective tape TA.

  The adsorbing member 213 is made of porous ceramics. For this reason, it is possible to reliably and uniformly hold the entire surface of the protective tape TA by suction. Thereby, it is possible to prevent the protective tape TA from becoming slack. Furthermore, the control device 400 is connected to the vacuum pump 111, the first to third valve members 114 to 116, the vacuum gauge 132, and the sensor 164, and can control these operations satisfactorily.

  Although one embodiment of the present invention has been described above, the present invention can be variously modified in addition to this. This will be described below.

  In the above-described embodiment, the case where the wafer 11 is used as a workpiece has been described. However, as a workpiece, a substrate for forming a device used for various micro electro mechanical systems (MEMS) such as a glass substrate such as a liquid crystal, a special glass material, and a glass substrate for organic EL can be adopted as a workpiece. good. In the above-described embodiment, the atmosphere (air) is introduced after evacuation, but a state other than air, such as argon gas, may be introduced and pressurized. Further, the tape member T is not limited to that of the above-described embodiment, and various types can be used as long as they can be adhered to the surface of a workpiece such as a UV curable (ultraviolet curable) tape, a polarizing film, a protective sheet, a transparent electrode, and the like. Can be used.

  In the above-described embodiment, the bubbles P are once dispersedly arranged. However, as an example in which the bubbles are not dispersedly arranged, the outer peripheral portion of the wafer 11 is securely bonded to the tape member, and the bubbles P are adhered to the outer periphery of the wafer 11. The situation (see FIG. 18) that is not placed in the part is raised. Here, the dispersed bubbles are those in which the bubbles P located at the center diffuse in the outer peripheral direction of the wafer 11 and are discharged from the wafer 11 as a result.

  In the above-described embodiment, each step is included. However, a suction step that vacuum-sucks a space (= vacuum chamber V) in which a work on the upper surface side of the rubber sheet 126 serving as an elastic sheet member is disposed, and a suction step After that, the workpiece is lifted toward the tape member, and the bonding step is performed so that the state in which the tape member is bonded to the outer edge of the workpiece and then bonded to the center of the workpiece does not occur. After that, a few steps including an air release step for introducing air into a space (= vacuum chamber V) in which the workpiece is arranged may be adopted. Further, a suction step for vacuum-sucking a space (= vacuum chamber V) in which the work on the upper surface side of the rubber sheet 126 is vacuumed, and after the suction step, the work is lifted toward the tape member to bond the tape member to the work Few steps having an adhesion step to be performed and an air release step for introducing air into the space in which the workpiece is placed and discharging the bubbles P generated between the tape member and the workpiece to the outside of the workpiece after performing the adhesion step. It is good.

  Furthermore, a vacuum step for vacuum-sucking a space (= vacuum chamber V) in which a work on the upper surface side of the rubber sheet 126 serving as an elastic sheet member is vacuumed, and after the suction step, the work is lifted toward the tape member to The bonding step is performed so that the state where the member is bonded to the outer edge of the workpiece first and then bonded to the center of the workpiece does not occur, and air is introduced into the space where the workpiece is placed after the bonding step is executed. A few steps including an air release step for discharging the air bubbles P generated between the tape member and the workpiece to the outside of the workpiece may be employed. Further, a vacuum step of vacuuming a space (= vacuum chamber V) in which a workpiece such as the wafer 11 on the upper surface side of the rubber sheet 126 serving as the elastic sheet member is vacuumed, and after the suction step, the workpiece is used as a tape member. Air bubbles are introduced into the space in which the work is placed after performing the bubble dispersion bonding step of lifting and moving toward the tape member in a state where the bubbles P are dispersed between the tape member and the work, and the bubble dispersion bonding step. A few steps including a bubble discharging step for discharging the bubbles P out of the workpiece may be employed. Even in the case of these few steps, an electronic component is manufactured by performing the next step thereafter. That is, stable production of electronic components is possible by performing the above-described work processing step and tape peeling step.

  As a method of lifting the wafer 11 toward the tape member, in addition to the method of inflating the rubber sheet 126, by rotating a nut engaged with the ball screw, the wafer 11 placed above the nut is moved up and down, Various other vertical movement methods such as moving the member supporting the wafer 11 up and down using a pressure pump can be employed.

  Further, in the above-described embodiment, as a method of sucking or strongly sucking the side where the protective tape TA is disposed earlier than the lower surface side of the rubber sheet 126 serving as the elastic sheet member, the vacuum serving as the first vacuum chamber is used. Although the vacuum suction of the chamber V is started prior to the air introduction unit 127 serving as the second vacuum chamber, the volume of the vacuum chamber V is made smaller than the volume of the air introduction unit 127 or from the vacuum pump 111. The distance of the vacuum chamber V may be shortened. Two vacuum pumps may be prepared, and the suction force of the vacuum pump that sucks the vacuum chamber V may be larger than the suction force of the vacuum pump that sucks the air introduction unit 127.

  In the above-described embodiment, the protective tape TA bonded to the surface of the wafer 11 as a workpiece may be peeled off inside the tape bonding apparatus 10 using a seal peeling mechanism. In this case, the protective tape TA can be peeled off inside the tape bonding apparatus 10 that is vacuum-sucked. Therefore, dust can be prevented from adhering to the surface of the wafer 11 when the tape is peeled off. In particular, at present, even if the protective tape TA is peeled off in a clean room, it is difficult to prevent dust from adhering to the surface of the wafer 11, but when the tape bonding apparatus 10 according to the present embodiment is used. Since the protective tape TA is peeled off inside the vacuum, it is possible to more reliably prevent the wafer 11 from getting dust.

  Further, when the tape member T is peeled off from the wafer 11 in the vacuum chamber V described above, it is possible to prevent dust from adhering to the surface of the wafer 11 due to static electricity generated when the protective tape TA is peeled off. That is, when the protective tape TA is peeled off inside the vacuum chamber V, even if static electricity is generated at the time of peeling, it is possible to prevent dust scattered in the external atmosphere from adhering to the surface of the wafer 11. it can.

  Moreover, you may comprise so that the above-mentioned tape bonding apparatus 10 may be provided with an ionizer. When an ionizer is provided, the ionized air is blown onto the wafer 11 or the tape members T1 and T2 by the ionizer. Then, the dust adhering to the wafer 11 or the tape members T1 and T2 can be removed. Further, the wafer 11 or the tape members T1 and T2 are neutralized, so that charged dust or the like does not adhere to the wafer 11 or the tape members T1 and T2. Further, the wafer 11 or the tape members T1 and T2 can be sterilized with ionized air.

  Note that heat is applied to the cutter of the rotary cutter unit 174 by a heater. However, as a means for cutting the protective tape TA, a configuration including a laser light irradiation device for irradiating laser light in addition to the above-described heater may be employed. In the case of irradiating with laser light, similarly to the heater, it is possible to cut the protective tape TA while melting it with heat.

  Further, the above-described upper lid unit 200 may be configured to automatically slide using an actuator such as a cylinder or a motor without adopting a configuration in which an operator grips and slides the handle 201. In particular, when the weight of the upper lid unit 200 is heavy, it is possible to improve work efficiency by automatically sliding the upper lid unit 200 using an actuator.

  Further, a transfer robot for transferring the wafer 11 to the tape bonding apparatus 10 may be installed. In this case, the adhesion of the protective tape TA to the wafer 11 can be further automated. In the above-described embodiment, the wafers 11 are installed one by one in the tape bonding apparatus 10. However, a cassette capable of storing a plurality of wafers 11 may be installed inside the tape bonding apparatus 10 and the wafers 11 may be sequentially taken out from the cassette.

  Furthermore, in the above-described embodiment, the case where the chamber plate 120 is used as the first lid member and the upper lid unit 200 is used as the second lid member has been described. However, the first lid member and the second lid member are not limited to these. For example, as the first lid member, a member that does not have the recessed portion 122 may be used as the first lid member. Further, as the second lid member, for example, a member that does not have the adsorbing member 213 and the recess 212 into which the adsorbing member 213 is fitted may be used as the second lid member.

  In the present embodiment, the seal ring 123 is a first seal member, and the seal ring 216 is a second seal member. However, the first seal member and the second seal member may be made of other members as long as the sealability of the vacuum chamber V is good. For example, the seal ring is made of silicon rubber, and the seal ring is made of a metal ring having a flat portion with high smoothness, or vice versa.

  In the present embodiment, the adsorption member 213 made of porous ceramics is used as the adsorption means for adsorbing and holding the protective tape TA. However, the adsorption member may be any porous material. It may be a material. Another example of the porous body is a sponge body. Further, a mechanism for separately heating the porous ceramics serving as the adsorbing member 213 may be provided so that the adsorbing member 213 has a heating function such as a ceramic heater. In this case, since the protective tape TA is heated, the adhesiveness (adhesiveness) of the protective tape TA to the wafer 11 is improved. For this reason, it becomes possible to adhere the protective tape TA to the wafer 11 more firmly.

  Further, the control device 400 may have a control condition set in advance, or may have a configuration in which the control condition can be arbitrarily set on the operator side. Moreover, the tape bonding apparatus 10 in the above-described embodiment is a type that does not apply pressure. However, the tape bonding apparatus 10 may be configured to pressurize inside the vacuum chamber V.

  The tape bonding method and electronic component manufacturing method of the present invention can be used in all fields in which a tape member is bonded to a workpiece such as a wafer. For example, it can be used in the manufacturing process of a semiconductor integrated circuit and the manufacturing process of a liquid crystal display device using a liquid crystal. That is, it can be used in the semiconductor manufacturing industry. It can also be used in the display manufacturing industry using a glass substrate.

Claims (22)

In the tape bonding method for bonding the tape member to the workpiece arranged on the upper surface side of the stretchable sheet member,
First, vacuum suction of the first vacuum chamber located on the upper surface side of the stretchable sheet member is started by the first suction means, and then the second vacuum chamber located on the lower surface side of the stretchable sheet member is set to the second. A suction step of starting vacuum suction with the suction means and vacuum suction of both vacuum chambers;
After the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second vacuum means is stopped by stopping the operation of the second suction means. An air introduction step of stopping the vacuum suction of the chamber and operating the second air introduction means to introduce air into the second vacuum chamber;
After the air introduction step, the expandable sheet member is expanded toward the inside of the first vacuum chamber, and the expansion of the expandable sheet member lifts the workpiece toward the tape member so that the tape member An adhesion step for adhering so that the state of adhering to the outer edge of the workpiece first and then adhering to the center of the workpiece does not occur;
An air release step of operating the first air introducing means to introduce air into the first vacuum chamber after performing the bonding step;
A tape bonding method characterized by comprising: In the tape bonding method for bonding the tape member to the workpiece arranged on the upper surface side of the stretchable sheet member,
A suction step for vacuum suction of a space in which the work on the upper surface side of the elastic sheet member is disposed;
After the suction step, the workpiece is lifted toward the tape member, and the tape member is bonded so as not to be bonded to the outer edge of the workpiece and then bonded to the center of the workpiece. Bonding step,
After performing the bonding step, an air release step for introducing air into the space in which the workpiece is disposed;
A tape bonding method characterized by comprising: In the tape bonding method for bonding the tape member to the workpiece arranged on the upper surface side of the stretchable sheet member,
First, vacuum suction of the first vacuum chamber located on the upper surface side of the stretchable sheet member is started by the first suction means, and then the second vacuum chamber located on the lower surface side of the stretchable sheet member is set to the second. A suction step of starting vacuum suction with the suction means and vacuum suction of both vacuum chambers;
After the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second vacuum means is stopped by stopping the operation of the second suction means. An air introduction step of stopping the vacuum suction of the chamber and operating the second air introduction means to introduce air into the second vacuum chamber;
After the air introduction step, the expandable sheet member is expanded toward the inside of the first vacuum chamber, and the work is lifted toward the tape member by the expansion of the expandable sheet member, and the work is An adhesion step for adhering to the tape member;
After performing the bonding step, the first air introduction means is operated to introduce air into the first vacuum chamber, and air generated between the tape member and the workpiece is discharged outside the workpiece. An opening step;
A tape bonding method characterized by comprising: In the tape bonding method for bonding the tape member to the workpiece arranged on the upper surface side of the stretchable sheet member,
A suction step for vacuum suction of a space in which the work on the upper surface side of the elastic sheet member is disposed;
After the suction step, the bonding step of lifting the workpiece toward the tape member and bonding the tape member to the workpiece;
After performing the bonding step, air is introduced into a space in which the work is disposed, and an air release step for discharging bubbles generated between the tape member and the work to the outside of the work;
A tape bonding method characterized by comprising: In the tape bonding method for bonding the tape member to the workpiece arranged on the upper surface side of the stretchable sheet member,
A suction step for vacuum suction of a space in which the work on the upper surface side of the elastic sheet member is disposed;
After the suction step, the workpiece is lifted toward the tape member, and the tape member is bonded so as not to be bonded to the outer edge of the workpiece and then bonded to the center of the workpiece. Bonding step,
After performing the bonding step, air is introduced into a space in which the work is disposed, and an air release step for discharging bubbles generated between the tape member and the work to the outside of the work;
A tape bonding method characterized by comprising: In the tape bonding method for bonding the tape member to the workpiece arranged on the upper surface side of the stretchable sheet member,
The first vacuum chamber located on the upper surface side of the stretchable sheet member is evacuated by the first suction means, and the first vacuum chamber is located on the lower surface side of the stretchable sheet member and forms a larger space than the first vacuum chamber. A suction step for vacuum suction of the two vacuum chambers by a second suction means;
After the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second vacuum means is stopped by stopping the operation of the second suction means. An air introduction step of stopping the vacuum suction of the chamber and operating the second air introduction means to introduce air into the second vacuum chamber;
After the air introduction step, the expandable sheet member is expanded toward the inside of the first vacuum chamber, and the expansion of the expandable sheet member lifts the workpiece toward the tape member so that the tape member An adhesion step for adhering so that the state of adhering to the outer edge of the workpiece first and then adhering to the center of the workpiece does not occur;
After performing the bonding step, the first air introduction means is operated to introduce air into the first vacuum chamber, and air generated between the tape member and the workpiece is discharged outside the workpiece. An opening step;
A tape bonding method characterized by comprising: In the tape bonding method for bonding the tape member to the workpiece arranged on the upper surface side of the stretchable sheet member,
The first vacuum chamber located on the upper surface side of the stretchable sheet member is vacuum-sucked by the first suction means, and the second vacuum chamber located on the lower surface side of the stretchable sheet member is the second suction means, At least at the beginning of the suction, a suction step for vacuum suction with a suction force smaller than the first vacuum chamber;
After the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second vacuum means is stopped by stopping the operation of the second suction means. An air introduction step of stopping the vacuum suction of the chamber and operating the second air introduction means to introduce air into the second vacuum chamber;
After the air introduction step, the expandable sheet member is expanded toward the inside of the first vacuum chamber, and the expansion of the expandable sheet member lifts the workpiece toward the tape member so that the tape member An adhesion step for adhering so that the state of adhering to the center of the workpiece after the first adhesion to the outer edge of the workpiece does not occur
After performing the bonding step, the first air introduction means is operated to introduce air into the first vacuum chamber, and air generated between the tape member and the workpiece is discharged outside the workpiece. An opening step;
A tape bonding method characterized by comprising: In the tape bonding method for bonding the tape member to the workpiece arranged on the upper surface side of the stretchable sheet member,
A suction step for vacuum suction of a space in which the work on the upper surface side of the elastic sheet member is disposed;
After the suction step, the work piece is lifted toward the tape member, and a bubble dispersion bonding step for adhering to the tape member in a state where air bubbles are dispersed between the tape member and the work,
After performing the bubble dispersion bonding step, air is introduced into the space where the workpiece is placed, and the bubble discharging step for discharging the bubbles out of the workpiece;
A tape bonding method characterized by comprising: In the tape bonding method for bonding the tape member to the workpiece arranged on the upper surface side of the stretchable sheet member,
The first vacuum chamber located on the upper surface side of the stretchable sheet member is vacuumed by the first suction means, and the second vacuum chamber located on the lower surface side of the stretchable sheet member is vacuumed by the second suction means. A suction step for suction;
After the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second vacuum means is stopped by stopping the operation of the second suction means. An air introduction step of stopping the vacuum suction of the chamber and operating the second air introduction means to introduce air into the second vacuum chamber;
After the air introduction step, the expandable sheet member is expanded toward the inside of the first vacuum chamber, and the expansion of the expandable sheet member lifts the workpiece toward the tape member, and the tape member and the above A bubble dispersion bonding step for bonding to the tape member in a state where bubbles are dispersed between the workpieces;
After performing the bubble dispersion bonding step, the first air introduction means is operated to introduce air into the first vacuum chamber, and the bubble discharge step of discharging the bubbles out of the workpiece;
A tape bonding method characterized by comprising: The first vacuum chamber located on the upper surface side of the elastic sheet member is vacuum-sucked by the first suction means, and the second vacuum chamber located on the lower surface side of the elastic sheet member is vacuum-suctioned by the second suction means. And after the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second suction means is deactivated. An air introduction step of stopping the vacuum suction of the second vacuum chamber and operating the second air introduction means to introduce air into the second vacuum chamber, and the expandable sheet after the air introduction step A member is expanded toward the inside of the first vacuum chamber, and the expansion of the elastic sheet member lifts the workpiece toward the tape member to bond the workpiece to the tape member. And an air release step for operating the first air introduction means to introduce air into the first vacuum chamber after performing the bonding step, and disposed on the upper surface side of the stretchable sheet member In the tape adhering method for adhering the tape member to the work to be performed,
A tape adhering method comprising: sucking or strongly sucking a side on which the tape member is disposed earlier than the lower surface side of the stretchable sheet member to prevent the tape member from hanging down to the work side. The first vacuum chamber located on the upper surface side of the elastic sheet member is vacuum-sucked by the first suction means, and the second vacuum chamber located on the lower surface side of the elastic sheet member is vacuum-suctioned by the second suction means. And after the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second suction means is deactivated. An air introduction step of stopping the vacuum suction of the second vacuum chamber and operating the second air introduction means to introduce air into the second vacuum chamber, and the expandable sheet after the air introduction step A member is expanded toward the inside of the first vacuum chamber, and the expansion of the elastic sheet member lifts the workpiece toward the tape member to bond the workpiece to the tape member. And an air release step for operating the first air introduction means to introduce air into the first vacuum chamber after performing the bonding step, and disposed on the upper surface side of the stretchable sheet member In the tape adhering method for adhering the tape member to the work to be performed,
In the adhering step, the tape member is adhered to the outer edge of the work so as not to adhere to the center of the work, and in the air releasing step, the tape member and the work are adhered. A method for adhering a tape, characterized in that air bubbles generated during the period are discharged out of the workpiece. In the electronic component manufacturing method for manufacturing the electronic component by bonding the tape member to the workpiece disposed on the upper surface side of the elastic sheet member, and then processing the workpiece.
First, vacuum suction of the first vacuum chamber located on the upper surface side of the stretchable sheet member is started by the first suction means, and then the second vacuum chamber located on the lower surface side of the stretchable sheet member is set to the second. A suction step of starting vacuum suction with the suction means and vacuum suction of both vacuum chambers;
After the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second vacuum means is stopped by stopping the operation of the second suction means. An air introduction step of stopping the vacuum suction of the chamber and operating the second air introduction means to introduce air into the second vacuum chamber;
After the air introduction step, the expandable sheet member is expanded toward the inside of the first vacuum chamber, and the expansion of the expandable sheet member lifts the workpiece toward the tape member so that the tape member An adhesion step for adhering so that the state of adhering to the outer edge of the workpiece first and then adhering to the center of the workpiece does not occur;
An air release step of operating the first air introducing means to introduce air into the first vacuum chamber after performing the bonding step;
A workpiece processing step for moving or processing the workpiece to which the tape member is bonded;
A tape peeling step for peeling the workpiece from the tape member;
An electronic component manufacturing method characterized by comprising: In the electronic component manufacturing method for manufacturing the electronic component by bonding the tape member to the workpiece disposed on the upper surface side of the elastic sheet member, and then processing the workpiece.
A suction step for vacuum suction of a space in which the work on the upper surface side of the elastic sheet member is disposed;
After the suction step, the workpiece is lifted toward the tape member, and the tape member is bonded so as not to be bonded to the outer edge of the workpiece and then bonded to the center of the workpiece. Bonding step,
After performing the bonding step, an air release step for introducing air into the space in which the workpiece is disposed;
A workpiece processing step for moving or processing the workpiece to which the tape member is bonded;
A tape peeling step for peeling the workpiece from the tape member;
An electronic component manufacturing method characterized by comprising: In the electronic component manufacturing method for manufacturing the electronic component by bonding the tape member to the workpiece disposed on the upper surface side of the elastic sheet member, and then processing the workpiece.
First, vacuum suction of the first vacuum chamber located on the upper surface side of the stretchable sheet member is started by the first suction means, and then the second vacuum chamber located on the lower surface side of the stretchable sheet member is set to the second. A suction step of starting vacuum suction with the suction means and vacuum suction of both vacuum chambers;
After the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second vacuum means is stopped by stopping the operation of the second suction means. An air introduction step of stopping the vacuum suction of the chamber and operating the second air introduction means to introduce air into the second vacuum chamber;
After the air introduction step, the expandable sheet member is expanded toward the inside of the first vacuum chamber, and the work is lifted toward the tape member by the expansion of the expandable sheet member, and the work is An adhesion step for adhering to the tape member;
After performing the bonding step, the first air introduction means is operated to introduce air into the first vacuum chamber, and air generated between the tape member and the workpiece is discharged outside the workpiece. An opening step;
A workpiece processing step for moving or processing the workpiece to which the tape member is bonded;
A tape peeling step for peeling the workpiece from the tape member;
An electronic component manufacturing method characterized by comprising: In the electronic component manufacturing method for manufacturing the electronic component by bonding the tape member to the workpiece disposed on the upper surface side of the elastic sheet member, and then processing the workpiece.
A suction step for vacuum suction of a space in which the work on the upper surface side of the elastic sheet member is disposed;
After the suction step, the bonding step of lifting the workpiece toward the tape member and bonding the tape member to the workpiece;
After performing the bonding step, air is introduced into a space in which the work is disposed, and an air release step for discharging bubbles generated between the tape member and the work to the outside of the work;
A workpiece processing step for moving or processing the workpiece to which the tape member is bonded;
A tape peeling step for peeling the workpiece from the tape member;
An electronic component manufacturing method characterized by comprising: In the electronic component manufacturing method for manufacturing the electronic component by bonding the tape member to the workpiece disposed on the upper surface side of the elastic sheet member, and then processing the workpiece.
A suction step for vacuum suction of a space in which the work on the upper surface side of the elastic sheet member is disposed;
After the suction step, the workpiece is lifted toward the tape member, and the tape member is bonded so as not to be bonded to the outer edge of the workpiece and then bonded to the center of the workpiece. Bonding step,
After performing the bonding step, air is introduced into a space in which the work is disposed, and an air release step for discharging bubbles generated between the tape member and the work to the outside of the work;
A workpiece processing step for moving or processing the workpiece to which the tape member is bonded;
A tape peeling step for peeling the workpiece from the tape member;
An electronic component manufacturing method characterized by comprising: In the electronic component manufacturing method for manufacturing the electronic component by bonding the tape member to the workpiece disposed on the upper surface side of the elastic sheet member, and then processing the workpiece.
The first vacuum chamber located on the upper surface side of the stretchable sheet member is evacuated by the first suction means, and the first vacuum chamber is located on the lower surface side of the stretchable sheet member and forms a larger space than the first vacuum chamber. A suction step for vacuum suction of the two vacuum chambers by a second suction means;
After the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second vacuum means is stopped by stopping the operation of the second suction means. An air introduction step of stopping the vacuum suction of the chamber and operating the second air introduction means to introduce air into the second vacuum chamber;
After the air introduction step, the expandable sheet member is expanded toward the inside of the first vacuum chamber, and the expansion of the expandable sheet member lifts the workpiece toward the tape member so that the tape member An adhesion step for adhering so that the state of adhering to the center of the workpiece after the first adhesion to the outer edge of the workpiece does not occur
After performing the bonding step, the first air introduction means is operated to introduce air into the first vacuum chamber, and air generated between the tape member and the workpiece is discharged outside the workpiece. An opening step;
A workpiece processing step for moving or processing the workpiece to which the tape member is bonded;
A tape peeling step for peeling the workpiece from the tape member;
An electronic component manufacturing method characterized by comprising: In the electronic component manufacturing method for manufacturing the electronic component by bonding the tape member to the workpiece disposed on the upper surface side of the elastic sheet member, and then processing the workpiece.
The first vacuum chamber located on the upper surface side of the stretchable sheet member is vacuum-sucked by the first suction means, and the second vacuum chamber located on the lower surface side of the stretchable sheet member is the second suction means, At least at the beginning of the suction, a suction step for vacuum suction with a suction force smaller than the first vacuum chamber;
After the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second vacuum means is stopped by stopping the operation of the second suction means. An air introduction step of stopping the vacuum suction of the chamber and operating the second air introduction means to introduce air into the second vacuum chamber;
After the air introduction step, the expandable sheet member is expanded toward the inside of the first vacuum chamber, and the expansion of the expandable sheet member lifts the workpiece toward the tape member so that the tape member An adhesion step for adhering so that the state of adhering to the outer edge of the workpiece first and then adhering to the center of the workpiece does not occur;
After performing the bonding step, the first air introduction means is operated to introduce air into the first vacuum chamber, and air generated between the tape member and the workpiece is discharged outside the workpiece. An opening step;
A workpiece processing step for moving or processing the workpiece to which the tape member is bonded;
A tape peeling step for peeling the workpiece from the tape member;
An electronic component manufacturing method characterized by comprising: In the electronic component manufacturing method for manufacturing the electronic component by bonding the tape member to the workpiece disposed on the upper surface side of the elastic sheet member, and then processing the workpiece.
A suction step for vacuum suction of a space in which the work on the upper surface side of the elastic sheet member is disposed;
After the suction step, the work piece is lifted toward the tape member, and a bubble dispersion adhesion step for adhering to the tape member in a state where air bubbles are dispersed between the tape member and the work, and
After performing the bubble dispersion bonding step, air is introduced into the space where the workpiece is placed, and the bubble discharging step for discharging the bubbles out of the workpiece;
A workpiece processing step for moving or processing the workpiece to which the tape member is bonded;
A tape peeling step for peeling the workpiece from the tape member;
An electronic component manufacturing method characterized by comprising: In the electronic component manufacturing method for manufacturing the electronic component by bonding the tape member to the workpiece disposed on the upper surface side of the elastic sheet member, and then processing the workpiece.
The first vacuum chamber located on the upper surface side of the stretchable sheet member is vacuumed by the first suction means, and the second vacuum chamber located on the lower surface side of the stretchable sheet member is vacuumed by the second suction means. A suction step for suction;
After the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second vacuum means is stopped by stopping the operation of the second suction means. An air introduction step of stopping the vacuum suction of the chamber and operating the second air introduction means to introduce air into the second vacuum chamber;
After the air introduction step, the expandable sheet member is expanded toward the inside of the first vacuum chamber, and the expansion of the expandable sheet member lifts the workpiece toward the tape member, and the tape member and the above A bubble dispersion bonding step for bonding to the tape member in a state where bubbles are dispersed between the workpieces;
After performing the bubble dispersion bonding step, the first air introduction means is operated to introduce air into the first vacuum chamber, and the bubble discharge step of discharging the bubbles out of the workpiece;
A workpiece processing step for moving or processing the workpiece to which the tape member is bonded;
A tape peeling step for peeling the workpiece from the tape member;
An electronic component manufacturing method characterized by comprising: The first vacuum chamber located on the upper surface side of the elastic sheet member is vacuum-sucked by the first suction means, and the second vacuum chamber located on the lower surface side of the elastic sheet member is vacuum-suctioned by the second suction means. And after the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second suction means is deactivated. An air introduction step of stopping the vacuum suction of the second vacuum chamber and operating the second air introduction means to introduce air into the second vacuum chamber, and the expandable sheet after the air introduction step A member is expanded toward the inside of the first vacuum chamber, and the expansion of the elastic sheet member lifts the workpiece toward the tape member to bond the workpiece to the tape member. And an air release step for operating the first air introduction means to introduce air into the first vacuum chamber after performing the bonding step, and disposed on the upper surface side of the stretchable sheet member In the electronic component manufacturing method of bonding the tape member to the workpiece to be processed, then processing the workpiece, and manufacturing an electronic component,
A method of manufacturing an electronic component, wherein the side on which the tape member is disposed is sucked or strongly sucked earlier than the lower surface side of the stretchable sheet member to prevent the tape member from hanging down to the work side. The first vacuum chamber located on the upper surface side of the elastic sheet member is vacuum-sucked by the first suction means, and the second vacuum chamber located on the lower surface side of the elastic sheet member is vacuum-suctioned by the second suction means. And after the suction step is executed for a predetermined time or after the first vacuum chamber and the second vacuum chamber have reached a set vacuum level, the second suction means is deactivated. An air introduction step of stopping the vacuum suction of the second vacuum chamber and operating the second air introduction means to introduce air into the second vacuum chamber, and the expandable sheet after the air introduction step A member is expanded toward the inside of the first vacuum chamber, and the expansion of the elastic sheet member lifts the workpiece toward the tape member to bond the workpiece to the tape member. And an air release step for operating the first air introduction means to introduce air into the first vacuum chamber after performing the bonding step, and disposed on the upper surface side of the stretchable sheet member In the electronic component manufacturing method of bonding the tape member to the workpiece to be processed, then processing the workpiece, and manufacturing an electronic component,
In the bonding step, the tape member is bonded to the outer edge of the workpiece first and then bonded to the center of the workpiece so as not to occur. In the air release step, the tape member and the workpiece are bonded. A method for producing an electronic component, characterized in that air bubbles generated during the period are discharged out of the workpiece.

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