JPS649691A - Manufacture of ceramic substrate - Google Patents
Manufacture of ceramic substrateInfo
- Publication number
- JPS649691A JPS649691A JP16581187A JP16581187A JPS649691A JP S649691 A JPS649691 A JP S649691A JP 16581187 A JP16581187 A JP 16581187A JP 16581187 A JP16581187 A JP 16581187A JP S649691 A JPS649691 A JP S649691A
- Authority
- JP
- Japan
- Prior art keywords
- throughholes
- throughhole
- green sheet
- circuit patterns
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
PURPOSE:To reduce the conductor resistance by removing the upper-layer part of the Mylar film and green sheet in the shape of a circuit pattern, opening throughholes, and thereafter simultaneously performing the filling of a conductor part and circuit pattern printing, to form the throughhole conductors and circuit patterns, thereby aligning the throughhole conductors and the circuit patterns with high accuracy. CONSTITUTION:By the information for throughholes opening from a CPU 6, a laser generating section 4 is moved through a driving section 5 to the positions where throughholes are to be opened, and the laser radiation outputted from the laser generating section 4 is condensed through a lens 10 to open throughholes 3-1-3-n. Then, the filling of a paste 8 in the throughholes 3-1-3-n and the printing of circuit patterns 9 in bores 11 are simultaneously performed. Further, after removing a Mylar film 2 laminated to a green sheet 1, the green sheet is stacked and calcined to form a ceramic substrate. With this, a throughhole conductor is formed in the center position of a land, so that a highly accurate alignment of the land and the throughhole can be done.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16581187A JPS649691A (en) | 1987-07-01 | 1987-07-01 | Manufacture of ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16581187A JPS649691A (en) | 1987-07-01 | 1987-07-01 | Manufacture of ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS649691A true JPS649691A (en) | 1989-01-12 |
Family
ID=15819444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16581187A Pending JPS649691A (en) | 1987-07-01 | 1987-07-01 | Manufacture of ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS649691A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0415991A (en) * | 1990-05-09 | 1992-01-21 | Matsushita Electric Ind Co Ltd | Manufacture of ceramic wiring substrate |
| US7102097B2 (en) | 2002-10-22 | 2006-09-05 | Matsushita Electric Industrial Co., Ltd. | Method of making hole in ceramic green sheet |
| JP2008103482A (en) * | 2006-10-18 | 2008-05-01 | Murata Mfg Co Ltd | Method for forming electrode pattern, manufacturing method for laminated electronic part, and laminated electronic part |
-
1987
- 1987-07-01 JP JP16581187A patent/JPS649691A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0415991A (en) * | 1990-05-09 | 1992-01-21 | Matsushita Electric Ind Co Ltd | Manufacture of ceramic wiring substrate |
| US7102097B2 (en) | 2002-10-22 | 2006-09-05 | Matsushita Electric Industrial Co., Ltd. | Method of making hole in ceramic green sheet |
| JP2008103482A (en) * | 2006-10-18 | 2008-05-01 | Murata Mfg Co Ltd | Method for forming electrode pattern, manufacturing method for laminated electronic part, and laminated electronic part |
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