JPS6489393A - Multilayer interconnection board - Google Patents

Multilayer interconnection board

Info

Publication number
JPS6489393A
JPS6489393A JP62247408A JP24740887A JPS6489393A JP S6489393 A JPS6489393 A JP S6489393A JP 62247408 A JP62247408 A JP 62247408A JP 24740887 A JP24740887 A JP 24740887A JP S6489393 A JPS6489393 A JP S6489393A
Authority
JP
Japan
Prior art keywords
multilayer interconnection
board
interconnection board
film
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62247408A
Other languages
Japanese (ja)
Other versions
JP2566793B2 (en
Inventor
Yasutoshi Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP62247408A priority Critical patent/JP2566793B2/en
Publication of JPS6489393A publication Critical patent/JPS6489393A/en
Application granted granted Critical
Publication of JP2566793B2 publication Critical patent/JP2566793B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Non-Adjustable Resistors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To improve characteristic impedance matching between a semiconduc tor IC element and a multilayer interconnection board by forming a thin film electric resistor close to a main conductor, in the multilayer interconnection board wherein an interlayer insulator made of high molecular material and a main conductor are sequentially formed on the surface of an insulating board. CONSTITUTION:A multilayer interconnection board is so formed that on an interlayer insulating film 2 made of a high molecular material formed on the surface of an insulating board 1, an interlayer insulating film 6, similar to the film 2, is formed. Major conductors 3, 5 are embedded in the film 6, and a thin electric resistor 4 is formed in contact therewith. An impedance between a semiconductor IC element and a multilayer interconnection board mounted on the board is matched by the resistor 4, thereby reducing crosstalk and trans mitting distortion free high-frequency electric signals. As a result, a multilayer interconnection board with high degree of density and integration suitable for high speed signal transmission applications can be prepared.
JP62247408A 1987-09-29 1987-09-29 Multilayer wiring board Expired - Fee Related JP2566793B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62247408A JP2566793B2 (en) 1987-09-29 1987-09-29 Multilayer wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62247408A JP2566793B2 (en) 1987-09-29 1987-09-29 Multilayer wiring board

Publications (2)

Publication Number Publication Date
JPS6489393A true JPS6489393A (en) 1989-04-03
JP2566793B2 JP2566793B2 (en) 1996-12-25

Family

ID=17162990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62247408A Expired - Fee Related JP2566793B2 (en) 1987-09-29 1987-09-29 Multilayer wiring board

Country Status (1)

Country Link
JP (1) JP2566793B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206646A (en) * 1992-01-29 1993-08-13 Nec Corp Printed wiring board with low resistance included in internal layer
WO1996022008A1 (en) * 1995-01-10 1996-07-18 Hitachi, Ltd. Low-emi electronic apparatus, low-emi circuit board, and method of manufacturing the low-emi circuit board
WO2012133567A1 (en) * 2011-03-31 2012-10-04 Jx日鉱日石金属株式会社 Method for manufacturing metal foil provided with electrical resistance layer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62171197A (en) * 1986-01-23 1987-07-28 ニチコン株式会社 High density hybrid integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62171197A (en) * 1986-01-23 1987-07-28 ニチコン株式会社 High density hybrid integrated circuit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206646A (en) * 1992-01-29 1993-08-13 Nec Corp Printed wiring board with low resistance included in internal layer
WO1996022008A1 (en) * 1995-01-10 1996-07-18 Hitachi, Ltd. Low-emi electronic apparatus, low-emi circuit board, and method of manufacturing the low-emi circuit board
US6353540B1 (en) 1995-01-10 2002-03-05 Hitachi, Ltd. Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board.
US6707682B2 (en) 1995-01-10 2004-03-16 Hitachi, Ltd. Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board
WO2012133567A1 (en) * 2011-03-31 2012-10-04 Jx日鉱日石金属株式会社 Method for manufacturing metal foil provided with electrical resistance layer

Also Published As

Publication number Publication date
JP2566793B2 (en) 1996-12-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees