JPS6489393A - Multilayer interconnection board - Google Patents
Multilayer interconnection boardInfo
- Publication number
- JPS6489393A JPS6489393A JP62247408A JP24740887A JPS6489393A JP S6489393 A JPS6489393 A JP S6489393A JP 62247408 A JP62247408 A JP 62247408A JP 24740887 A JP24740887 A JP 24740887A JP S6489393 A JPS6489393 A JP S6489393A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer interconnection
- board
- interconnection board
- film
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Non-Adjustable Resistors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To improve characteristic impedance matching between a semiconduc tor IC element and a multilayer interconnection board by forming a thin film electric resistor close to a main conductor, in the multilayer interconnection board wherein an interlayer insulator made of high molecular material and a main conductor are sequentially formed on the surface of an insulating board. CONSTITUTION:A multilayer interconnection board is so formed that on an interlayer insulating film 2 made of a high molecular material formed on the surface of an insulating board 1, an interlayer insulating film 6, similar to the film 2, is formed. Major conductors 3, 5 are embedded in the film 6, and a thin electric resistor 4 is formed in contact therewith. An impedance between a semiconductor IC element and a multilayer interconnection board mounted on the board is matched by the resistor 4, thereby reducing crosstalk and trans mitting distortion free high-frequency electric signals. As a result, a multilayer interconnection board with high degree of density and integration suitable for high speed signal transmission applications can be prepared.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62247408A JP2566793B2 (en) | 1987-09-29 | 1987-09-29 | Multilayer wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62247408A JP2566793B2 (en) | 1987-09-29 | 1987-09-29 | Multilayer wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6489393A true JPS6489393A (en) | 1989-04-03 |
JP2566793B2 JP2566793B2 (en) | 1996-12-25 |
Family
ID=17162990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62247408A Expired - Fee Related JP2566793B2 (en) | 1987-09-29 | 1987-09-29 | Multilayer wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2566793B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05206646A (en) * | 1992-01-29 | 1993-08-13 | Nec Corp | Printed wiring board with low resistance included in internal layer |
WO1996022008A1 (en) * | 1995-01-10 | 1996-07-18 | Hitachi, Ltd. | Low-emi electronic apparatus, low-emi circuit board, and method of manufacturing the low-emi circuit board |
WO2012133567A1 (en) * | 2011-03-31 | 2012-10-04 | Jx日鉱日石金属株式会社 | Method for manufacturing metal foil provided with electrical resistance layer |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62171197A (en) * | 1986-01-23 | 1987-07-28 | ニチコン株式会社 | High density hybrid integrated circuit |
-
1987
- 1987-09-29 JP JP62247408A patent/JP2566793B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62171197A (en) * | 1986-01-23 | 1987-07-28 | ニチコン株式会社 | High density hybrid integrated circuit |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05206646A (en) * | 1992-01-29 | 1993-08-13 | Nec Corp | Printed wiring board with low resistance included in internal layer |
WO1996022008A1 (en) * | 1995-01-10 | 1996-07-18 | Hitachi, Ltd. | Low-emi electronic apparatus, low-emi circuit board, and method of manufacturing the low-emi circuit board |
US6353540B1 (en) | 1995-01-10 | 2002-03-05 | Hitachi, Ltd. | Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board. |
US6707682B2 (en) | 1995-01-10 | 2004-03-16 | Hitachi, Ltd. | Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board |
WO2012133567A1 (en) * | 2011-03-31 | 2012-10-04 | Jx日鉱日石金属株式会社 | Method for manufacturing metal foil provided with electrical resistance layer |
Also Published As
Publication number | Publication date |
---|---|
JP2566793B2 (en) | 1996-12-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2531464B2 (en) | Semiconductor package | |
TW331619B (en) | Electric circuit board, driver circuit components and the LCD device and produce to operate the component | |
SE9101834D0 (en) | DEVICES WITH FLEXIBLE, ORIENTATED STRIPLINE PIPES AND PROCEDURES FOR PREPARING SUCH A DEVICE | |
EP0489177A4 (en) | Semiconductor device and method of manufacturing the same | |
EP0218437A3 (en) | A microelectronics apparatus and method of interconnecting wiring planes | |
JPS6489393A (en) | Multilayer interconnection board | |
EP0171010A3 (en) | Thermal head | |
EP0371861A3 (en) | High density semiconductor structure and method of making the same | |
EP0234269A3 (en) | High voltage semiconductor integrated circuit | |
US4991665A (en) | Flexible circuit conductor run | |
JPS6484625A (en) | Semiconductor integrated circuit device using film carrier | |
JPH0685099A (en) | Signal circuit of high frequency circuit board | |
EP0818946A3 (en) | A printed-wiring board and a production method thereof | |
JPS5691406A (en) | Thin film coil | |
EP0130462A3 (en) | Printed circuits | |
JPS61131585A (en) | Wiring board | |
JPS6417446A (en) | Semiconductor device and manufacture thereof | |
JPS6469034A (en) | Semiconductor integrated circuit with decoupled d.c. wiring | |
JPS5286782A (en) | Production of semiconductor integrated circuit | |
JPS6319896A (en) | Multilayer interconnection board | |
JPS6432655A (en) | Substrate for loading semiconductor element | |
JPS5732662A (en) | Ceramic multilayer wiring board | |
WO1992011743A3 (en) | An interconnect structure for connecting electronic devices | |
JPS54127260A (en) | Planar type branch line | |
JPS6455289A (en) | Integrated circuit device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |