JPS6489345A - Metal bump and manufacture thereof - Google Patents

Metal bump and manufacture thereof

Info

Publication number
JPS6489345A
JPS6489345A JP62247613A JP24761387A JPS6489345A JP S6489345 A JPS6489345 A JP S6489345A JP 62247613 A JP62247613 A JP 62247613A JP 24761387 A JP24761387 A JP 24761387A JP S6489345 A JPS6489345 A JP S6489345A
Authority
JP
Japan
Prior art keywords
bump
bumps
metal
bonded
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62247613A
Other languages
English (en)
Inventor
Nobuyuki Kajiwara
Hajime Sudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62247613A priority Critical patent/JPS6489345A/ja
Publication of JPS6489345A publication Critical patent/JPS6489345A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Wire Bonding (AREA)
JP62247613A 1987-09-29 1987-09-29 Metal bump and manufacture thereof Pending JPS6489345A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62247613A JPS6489345A (en) 1987-09-29 1987-09-29 Metal bump and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62247613A JPS6489345A (en) 1987-09-29 1987-09-29 Metal bump and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6489345A true JPS6489345A (en) 1989-04-03

Family

ID=17166112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62247613A Pending JPS6489345A (en) 1987-09-29 1987-09-29 Metal bump and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6489345A (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03133137A (ja) * 1989-10-19 1991-06-06 Ibiden Co Ltd 電子部品実装用バンプ
JPH04340240A (ja) * 1991-05-16 1992-11-26 Nec Corp Ｉｃチップ接続構造の製造方法
JPH08148495A (ja) * 1994-11-25 1996-06-07 Fujitsu Ltd 半導体装置及びその製造方法、半導体装置におけるバンプ密着性評価方法
JP2008021751A (ja) * 2006-07-11 2008-01-31 National Institute Of Advanced Industrial & Technology 電極、半導体チップ、基板、半導体チップの電極接続構造、半導体モジュールおよびその製造方法
JP2011100892A (ja) * 2009-11-06 2011-05-19 Sumitomo Electric Ind Ltd 電子機器、複合型電子機器、検出装置、受光素子アレイ、および、これらの製造方法
CN102623465A (zh) * 2011-01-25 2012-08-01 索尼公司 固态成像元件、固态成像元件的制造方法和电子装置
WO2018220998A1 (ja) * 2017-05-30 2018-12-06 シャープ株式会社 半導体装置および半導体装置の製造方法
CN110690131A (zh) * 2019-09-24 2020-01-14 浙江集迈科微电子有限公司 一种具有大键合力的三维异构焊接方法
CN110690130A (zh) * 2019-09-24 2020-01-14 浙江集迈科微电子有限公司 一种三维异构堆叠方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03133137A (ja) * 1989-10-19 1991-06-06 Ibiden Co Ltd 電子部品実装用バンプ
JPH04340240A (ja) * 1991-05-16 1992-11-26 Nec Corp Ｉｃチップ接続構造の製造方法
JPH08148495A (ja) * 1994-11-25 1996-06-07 Fujitsu Ltd 半導体装置及びその製造方法、半導体装置におけるバンプ密着性評価方法
JP2008021751A (ja) * 2006-07-11 2008-01-31 National Institute Of Advanced Industrial & Technology 電極、半導体チップ、基板、半導体チップの電極接続構造、半導体モジュールおよびその製造方法
JP2011100892A (ja) * 2009-11-06 2011-05-19 Sumitomo Electric Ind Ltd 電子機器、複合型電子機器、検出装置、受光素子アレイ、および、これらの製造方法
CN102623465A (zh) * 2011-01-25 2012-08-01 索尼公司 固态成像元件、固态成像元件的制造方法和电子装置
JP2012156231A (ja) * 2011-01-25 2012-08-16 Sony Corp 固体撮像素子、固体撮像素子の製造方法、及び電子機器
WO2018220998A1 (ja) * 2017-05-30 2018-12-06 シャープ株式会社 半導体装置および半導体装置の製造方法
US11342308B2 (en) 2017-05-30 2022-05-24 Sharp Kabushiki Kaisha Semiconductor device and manufacturing method for semiconductor device
CN110690131A (zh) * 2019-09-24 2020-01-14 浙江集迈科微电子有限公司 一种具有大键合力的三维异构焊接方法
CN110690130A (zh) * 2019-09-24 2020-01-14 浙江集迈科微电子有限公司 一种三维异构堆叠方法

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